JP2000252401A - Methods and apparatuses for cooling heat sink, electronic equipment, and power supply equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the cooling efficiency of the heat sink of a heat generating member. SOLUTION: The cooling apparatus 1 of a heat sink is provided with a forcedly air-cooling section 3 which forcedly cools the whole body of a heat sink member 2 with air and forcedly air-cooling sections 6 and 7 which forcedly cool part of the heat sink with air. Since the sections 6 and 7 suppress the formation of a boundary layer which prevents the heat absorbing action of a cooling wind flowing along the heat radiating fin sections 2B and 2C of the heat sink 2 when the heat sink 2 is forcedly cooled by means of the air-cooling section 3, the cooling efficiency of the heat sink 2 is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cooling method for a heat sink, a cooling method for an electronic device, a cooling method for a power supply device, a cooling device for a heat sink, a cooling device for an electronic device, and a cooling device for a power supply device.

[0002]

2. Description of the Related Art Conventionally, CPUs incorporated in electronic equipment
(Central processing unit) In order to radiate heat from a heat generating member such as a power transistor element incorporated in a package or a power supply device, a heat sink is attached to the heat generating member, and the heat sink is forcibly cooled by air.

[0003]

However, in the conventional forced air cooling method, forced air cooling is performed by blowing air only from a specific direction to a heat sink to which the heat generating member is attached. Therefore, a boundary layer is formed between the radiating fin portion and the cooling air flowing along the radiating fin portion, which hinders the action of absorbing heat from the radiating fin portion, because the temperature of the blowing increases due to the heat generated by the heat sink. However, there is a problem in that the cooling effect of the cooling air on the heat radiation fins is reduced.

[0004] The present invention has been made in view of such a point,
It is an object of the present invention to suppress the generation of the boundary layer which hinders the action of absorbing heat from the heat radiation fins, and to improve the cooling efficiency of the heat generating member by the heat sink.

[0005]

SUMMARY OF THE INVENTION A heat sink cooling method according to the present invention is directed to a heat sink cooling method in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink. The main forced air cooling is performed by using the main forced air cooling means for performing forced air cooling of the whole and the sub-forced cooling means for partially performing forced air cooling on the heat sink. The forced air cooling state of the entire heat sink by the means is corrected by the sub-forced air cooling means to improve the cooling efficiency of the heat sink by the heat sink.

Further, a method for cooling an electronic device according to the present invention comprises:
In a cooling method for an electronic device in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, a main forced air cooling means for forcibly cooling the entire heat sink and the heat sink are provided. By making this heat sink forcedly cooled by the sub-forced air cooling means that partially performs forced air cooling, the forced air cooling state of the entire heat sink by the main forced air cooling means is changed by the sub-forced air cooling means. This correction is intended to improve the cooling efficiency of the heat sink of the electronic device with respect to the heat generating member.

[0007] Further, a cooling method for a power supply device according to the present invention comprises:
In a cooling method for a power supply device in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, a main forced air cooling means for forcibly cooling the entire heat sink and the heat sink are provided. By making this heat sink forcedly cooled by the sub-forced air cooling means that partially performs forced air cooling, the forced air cooling state of the entire heat sink by the main forced air cooling means is changed by the sub-forced air cooling means. In other words, the cooling efficiency of the heat generating member by the heat sink in the power supply device is improved.

Further, according to the method for cooling a heat sink according to the present invention, in a method for cooling an electronic device in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, A main forced air cooling means for performing cooling and a secondary forced air cooling means for partially performing forced air cooling on the heat sink are integrated with the heat sink so that the heat sink is forcibly air cooled. The entire forced air cooling state is corrected by the auxiliary forced air cooling means to improve the cooling efficiency of the heat sink with respect to the heat generating member.

Further, according to the heat sink cooling device of the present invention, in a heat sink cooling device provided with a forced air cooling means for a heat sink on which a heat generating member is mounted to cool the heat sink, the forced heat cooling of the entire heat sink is performed. And a sub-forced air cooling means for partially forcibly cooling the heat sink, and the heat sink is forcibly air-cooled by the main forced air cooling means and the sub-forced air cooling means. The forced air cooling state of the entire heat sink by the main forced air cooling means is corrected by the sub forced air cooling means to improve the cooling efficiency of the heat sink by the heat sink.

Further, a cooling device for an electronic device according to the present invention comprises:
In a cooling device for an electronic device in which a heat sink on which a heat generating member is mounted is forcibly cooled, a main forced air cooling unit for forcibly cooling the entire heat sink and a sub-forced unit for partially cooling the heat sink. The main forced air cooling means and the auxiliary forced air cooling means are used to forcibly air-cool the heat sink, and the forced air cooling state of the entire heat sink by the main forced air cooling means is changed to the sub-forced air cooling means. This is corrected by means to improve the cooling efficiency of the heat sink by the heat sink.

Further, a cooling device for a power supply device according to the present invention comprises:
In a cooling device for a power supply device in which a heat sink on which a heat generating member is mounted is forcibly cooled, a main forced air cooling means for forcibly cooling the entire heat sink and a sub-forced for partially forcibly cooling the heat sink. The main forced air cooling means and the auxiliary forced air cooling means are used to forcibly air-cool the heat sink, and the forced air cooling state of the entire heat sink by the main forced air cooling means is changed to the sub-forced air cooling means. This is corrected by means to improve the cooling efficiency of the heat sink by the heat sink.

A cooling device for a heat sink according to the present invention is a cooling device for electronic equipment in which a heat sink on which a heat-generating member is mounted is forcibly air-cooled. A sub-forced air cooling means for partially performing forced air cooling on the heat sink and a means for integrating the main forced air cooling means and the sub-forced air cooling means with the heat sink are provided. The heat sink is forcibly cooled by the forced air cooling means, and the forced air cooling state of the entire heat sink by the main forced air cooling means is corrected by the sub forced air cooling means to reduce the cooling efficiency of the heat sink to the heat generating member. It is an improvement.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a main part of the configuration of a heat sink cooling device according to the present invention in which forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink. .

In FIG. 1, reference numeral 1 denotes a main part of a heat sink cooling device, and the heat sink cooling device 1 includes a heat sink member 2 and a forced air cooling member 3. Reference numeral 4 denotes a heat generating member which is cooled by the heat sink cooling device 1.

The heat sink member 2 is made of a material having good thermal conductivity, such as aluminum metal, and is provided with a heat-generating member mounting surface 2A, a plurality of radiating fins 2B,.
, 2C, a support portion 2D, and a mounting substrate 2E.

A plurality of radiating fin portions 2B,.
, 2B and 2C,..., 2C, the mounting surface 2A of the heat generating member and the radiating fins 2B, 2C.
C, and between the radiating fins 2B and 2C and the mounting board 2E.
, 1F, and a plurality of radiating fins 2B,..., 2B and 2C,.
.., 2C, with the notch 2G provided between each of the radiating fins 2B,.
B, 2C,..., 2C, mounting surface portion 2 of heat generating member
A and the substrate 2E are integrated with the support 2D to constitute the heat sink member 2.

The plurality of radiating fins are arranged as shown in FIG.
As shown in (1), the support portion 2D is integrated in such a manner that it is disposed on both sides.

The forced air cooling member 3 includes a main blower unit 5,
It is composed of a blower duct 6 and a sub-blower 7.

The main blower unit 5 includes a housing 5A and the housing 5A.
Fan, a motor for driving the fan, and a mounting stay 5 provided in the housing 5A.
B, 5C.

When the fan is driven by the driving motor to be in a blowing state, the plurality of radiating fins 2B,..., 2B, 2C,.
Cooling air based on this air blowing along with C is on the 1st floor of the play space, ...
The housing 5A is mounted to the mounting surface 2A of the heat-generating member of the heat sink by stays 5B and 5C at positions where the cooling fins can be forcedly cooled by flowing through the fins 1F.

Reference numeral 6 denotes a blower duct. The blower duct 6A has an opening 6A, a sub-blower mounting plate 6B, and a cooling air introducing chamber 6.
C, tip 6D, ventilation duct 6E, and air outlet 6
F.

The opening 6A is an opening for taking in the cooling air blown from the sub-blower unit 7, and the sub-blower mounting plate 6B.
Is a sub-blower mounting plate in which the opening 6A is formed,
The cooling air introduction chamber 6C is a hollow cubic cooling air introduction chamber provided on the side of the sub-blower mounting plate 6B opposite to the side where the sub-blower is mounted for correcting the bias of the flow of cooling air.

The ventilation duct 6E has one end opening to the cooling air introduction chamber 6C, the other end extending to the vicinity of the notch 2G, and a tip 6D formed at the free end at the other end. The blower outlet 6F is a blower outlet provided at the front end portion 6D so as to face the notch 2G.

The cooling air introduction chamber 6C and the ventilation duct 6
In a state where E is disposed with respect to the heat sink member 2 in the positional relationship shown in FIG.
Is attached to the heat sink member 2 to integrate the heat sink member 2 and the air duct portion 6.

The sub-blower unit 7 is composed of a housing 7A, mounting stays 7B and 7C, a fan for blowing air installed at a predetermined position inside the housing 7A, and a motor for driving the fan. , 7C are attached to a predetermined position on the outer peripheral side of the housing 7A, and the housing 7A is attached to the sub-blower mounting plate 6B in such a manner that the side of the cooling air blown by the fan is aligned with the opening 6A. With the 7A mounted, the housing 7A is fixed to the sub-blower mounting plate 6B by the mounting stays 7B and 7C.

Next, the internal structure of the ventilation duct 6E is shown in FIG. 2, and the same parts as those in FIG. 1 are denoted by the same reference numerals and will not be described in detail.

A portion of the ventilation duct 6E is cut in a direction indicated by arrows A and A in FIG. 1, and as shown in FIG.
Inside E, a plurality of guide plates 6G,..., 6G for air conditioning are arranged along the flow of the cooling air inside this duct, and the cooling air introduction chamber 6C is connected to the ventilation duct 6E. The flow of the cooling air is adjusted so that the flow of the cooling air that flows in and blows out from the blowing outlet 6F is not biased to a part of the blowing outlet 6F.

Next, the flow of cooling air in the cooling device 1 for a heat sink according to the present invention will be described with reference to FIGS.

A blower fan installed inside a housing 5A provided on the main blower section 5 side is driven by a motor for driving the fan, and cooling air sucked by the fan is directed toward the heat sink member 2. When the air is blown, the plurality of radiation fin portions 2B,..., 2B, 2C,.
The cooling air based on this airflow flows through the idle spaces 1F,..., 1F along with 2C, and the radiation fins are forcedly cooled.

Then, the heat generated by the heat generating member 4 is transmitted to the heat sink member 2, and the plurality of heat radiating fins 2 are formed.
, 2B, 2C,..., 2C, the cooling air flowing through the idle time 1F,.

Therefore, the fan for air blowing installed inside the housing 5A is driven by the motor for driving the fan,
By sending the cooling air toward the heat sink member 2, the heat generated by the heat generating member 4 is reduced by the plurality of radiating fins 2.
C,..., 2C, and the cooling air whose temperature has been increased by the amount of the absorbed air flows into the plurality of radiating fins 2.
, 2B, the boundary layer can be generated on the side of the plurality of radiating fins 2B,..., 2B.

However, in this embodiment, in a state where these radiating fins are forcibly cooled in this manner, the fan for air blowing installed in the housing 7A provided on the sub-blower unit 7 side is used as the fan. Driven by a drive motor
The cooling air sucked by the fan is blown to the cutout portion 2G from an air blowing outlet 6F provided at a distal end portion 6D of the ventilation duct 6E.

As a result, the cooling air blown from the blowing outlet 6F to the notch 2G causes the cooling fins 2B,... This boundary layer generated between them can be suppressed, and the plurality of radiation fins 2B,
... The cooling efficiency of 2B can be increased.

Further, the cooling air is blown from the blowing outlet 6F to the notch 2G, so that the temperature of the cooling air flowing along the plurality of radiating fins 2B,. The temperature can be reduced, and the cooling efficiency of the radiation fin portions 2B,..., 2B can be further increased.

Thus, according to the present embodiment, the efficiency of cooling the heat generating member by the heat sink can be improved.

According to an experiment conducted by the present applicant, in this example, when the amount of cooling air blown from the blowing outlet 6F to the cutout portion 2G is 1, the plurality of radiating fins are sent from the main blower unit 5 side. Part 2B,..., 2
B, 2C,..., It was found that the suppression effect of the boundary layer can be maximized when the air flow rate of the cooling air blown to 2C is set to an air flow ratio of 5-10. .

In order to set such an air volume ratio, the sub-blower unit 7 having a blowing capacity such that the blowing capacity of the sub-blower unit 7 with respect to the blowing capacity of the main blower unit 5 becomes such a ratio. Select

In the embodiment shown in FIG. 1,
Although the example in which the blower outlet 6F is provided on one side of the heat sink member 2 has been described, in the present invention, the blower outlet 6F is provided on both sides of the heat sink member 2 and notches are formed on both sides of the heat sink member 2. 2G may be provided, and cooling air may be blown to each of these cutouts 2G from the respective blowing outlets 6F.

The present invention is not limited to being applied to the purpose of forcibly cooling a heat sink, but may be applied to an electronic device in which a heat sink on which a CPU is mounted is forcibly cooled. Further, the present invention can also be applied to a power supply device in which a heat sink equipped with a power element such as a power switching element is forcibly air-cooled, and the heat sink further mounted with a power element is forcibly air-cooled. The present invention can also be applied to various types of devices.

[0041]

According to the present invention, the formation of a boundary layer between the radiating fins of the heat sink and the cooling air flowing along the fins, which hinders the action of absorbing heat from the radiating fins, is surely suppressed. Therefore, the cooling efficiency of the heat generating member by the heat sink can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a cooling device of the present invention.

FIG. 2 is a sectional view showing an internal structure of a ventilation duct of the cooling device according to the present invention.

[Explanation of symbols]

1} Heat sink cooling device, 2} Heat sink member, 2B,..., 2B... Radiating fins, 3 ‥‥ forced air cooling member, 4 ‥‥ heat generating member, 5 ... Main blower unit, 6 ‥‥ blower duct unit, 6F ‥‥ blower outlet, 7 ... Department

Claims (8)

[Claims] 1. A method for cooling a heat sink in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, wherein a main forced air cooling means for forcibly cooling the entire heat sink is provided. A cooling method for cooling the heat sink, wherein the heat sink is forcibly air-cooled by sub-forced air cooling means for partially forcibly cooling the heat sink. 2. A method for cooling an electronic device, wherein a forced air cooling means is provided to a heat sink on which a heat generating member is mounted to cool the heat sink, wherein the main forced air cooling means performs forced air cooling of the entire heat sink. And a sub-forced air cooling means for partially forcibly cooling the heat sink so as to forcibly cool the heat sink. 3. A method of cooling a power supply device in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, wherein the main forced air cooling means performs forced air cooling of the entire heat sink. And a sub-forced air cooling means for partially cooling the heat sink by forced air cooling, so that the heat sink is forcibly air-cooled. 4. A forced cooling method for an electronic device, wherein a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink. Means for forcibly cooling the heat sink by integrating means and auxiliary forced air cooling means for partially forcibly cooling the heat sink with the heat sink. . 5. A heat sink cooling apparatus in which a forced air cooling means is provided for a heat sink on which a heat generating member is mounted to cool the heat sink, wherein a main forced air cooling means for forcibly cooling the entire heat sink is provided. A sub-forced air cooling means for partially performing forced air cooling on the heat sink, and the heat sink is forcibly air-cooled by the main forced air cooling means and the sub-forced air cooling means. Heat sink cooling device. 6. A cooling device for an electronic device in which a heat sink on which a heat-generating member is mounted is forcibly air-cooled, wherein a main forced air-cooling means for forcibly air-cooling the entire heat sink; A cooling device for an electronic device, comprising: a sub-forced air cooling means for performing cooling, wherein the heat sink is forcibly air-cooled. 7. A cooling device for a power supply device in which a heat sink on which a heat-generating member is mounted is forcibly air-cooled. A cooling device for a power supply device, comprising: a sub-forced cooling means for performing cooling, wherein the heat sink is forcibly cooled. 8. A cooling device for a power supply device in which a heat sink on which a heat generating member is mounted is forcibly air-cooled. Sub-forced air cooling means for performing cooling, and means for integrating the main forced air cooling means and the sub-forced air cooling means to the heat sink,
A cooling device for electronic equipment, wherein the heat sink is forcibly cooled by air.