JP2000252234A - Method and device for dicing ceramic plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for dicing a ceramic plate which can be divided uniformly so that pattern electrodes may be allocated uniformly within cut members. SOLUTION: In this dicing method, a ceramic plate C that is formed by baking a green sheet with printed pattern electrodes at a specified pitch, is held on a rotary table, and it is cut along uniform dividing lines in a pitching direction and an orthogonal direction. A distance YA between a normal line and the rotary center of a side A on one end of the ceramic plate C in a pitching direction as well as a rotary angle θA is obtained, and then a distance YB between the normal line and the rotary center of a side B on the other end of the ceramic plate C as well as a rotary angle θB is obtained. Further, a distance Ym between the normal line and the rotary centers of each of cut positions of the ceramic plate C and a rotary angle θm are obtained according to the distances YA and YB and rotary angles θA and θB. Finally, the ceramic plate C is cut along the obtained line.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for dicing a ceramic plate, and more particularly, to a method for dicing a ceramic plate formed by firing a green sheet on which pattern electrodes are printed at a constant pitch, along an equal dividing line perpendicular to the pitch direction. The present invention relates to a method and an apparatus for cutting.

[0002]

2. Description of the Related Art As shown in FIG. 1, when a pattern electrode E is printed on a green sheet G in a grid pattern having a constant pitch P1 = P2 and fired, as shown in FIG.
≠ P2, and the mesh of the pattern electrode E of the fired ceramic plate C may be distorted. Therefore, if the ceramic plate C is cut in parallel at the pitch at the time of printing, there is a problem that a blade is obliquely inserted into the distorted mesh and the electrode pattern in the cut member becomes non-uniform. In order to cut the ceramic plate C in consideration of the firing strain, it is necessary to change the angle of each cut line.

[0003]

In the case of a conventional dicing apparatus, a table for holding a ceramic plate is provided with a rotating mechanism, and the angle of the cut line can be changed by the rotating mechanism. However, once the cutting is started, the cutting is performed in parallel with the first cut line, so that it is impossible to cope with the firing strain as shown in FIG.

There is also a dicing apparatus having an image processing apparatus and having a mechanism for detecting two marks formed on a work and cutting the mark along a line connecting the marks. In this case, the angle of each cut line can be changed, but it is necessary to form marks on the work surface in accordance with the positions of all pattern electrodes, which is complicated. In addition, if the ceramic plate is a kind of piezoelectric ceramic, it is necessary to wrap the surface or form electrodes for polarization before cutting to ensure uniformity of polarization. It is difficult to save. Also, when the ceramic plate is a multilayer substrate such as a multilayer ceramic capacitor, the mark cannot be identified from the outside because the pattern electrode is hidden inside.

Therefore, an object of the present invention is to change the angle of each cut line one by one in consideration of firing strain, and to divide the pattern electrodes equally so that the pattern electrodes are evenly distributed in the cut members. It is an object of the present invention to provide a method and apparatus for dicing a ceramic plate. Another object of the present invention is to provide a method and an apparatus for dicing a ceramic plate, which can accurately cut a ceramic plate without special processing only by grasping the outer shape even when the pattern electrode cannot be recognized from the outside. It is still another object of the present invention to provide a method and an apparatus for dicing a ceramic plate, which can be cut in advance without dropping ears and maintain the product dimensions after the cut with high accuracy.

[0006]

Means for Solving the Problems In order to achieve the above object, the invention according to claim 1 holds a ceramic plate formed by firing a green sheet on which pattern electrodes are printed at a constant pitch on a rotary table, a method of cutting along the equal division line in the pitch direction and the orthogonal direction, the step of determining the perpendicular distance Y _a and the rotation angle theta _a from the rotational center of the side a at one end of the pitch direction of the ceramic plate Determining a normal distance Y _B and a rotation angle θ _B from the rotation center of the side B on the other end side of the ceramic plate; and a normal distance Y m and a rotation from the rotation center of each cut position of the ceramic plate. Angle θm
Characterized preparative, having a step of determining from the sides perpendicular distance Y _A A and side B, Y _B and the rotation angle theta _A, theta _B, a step of cutting the ceramic plate along the cutting position, the Is provided.

[0007] The pattern electrode of the fired ceramic plate is deformed by firing strain as compared with that at the time of printing.
It is necessary to change the angle and position of one cut line. In the present invention, the angle and position of the cut line are determined from the normal distance and the rotation angle from the center of rotation of the sides A and B of the ceramic plate, and cutting is performed along the cut line. Therefore, even if firing distortion as shown in FIG. 2 occurs, the pattern electrodes can be equally divided so that the pattern electrodes are evenly distributed in the cut member. In the present invention, the pattern electrode is formed on the side A of the rectangular green sheet.
It is assumed that printing is performed in parallel with the side B.

According to a second aspect, during rotation of the ceramic plate
Read the center position and check the dicing blade cutting direction and
Rotate so that the side A on one side of the ceramic plate is parallel
When the table is rotated, from the center of rotation to side A on one end
Normal distance Y_A And rotation angle θ _A And read
Direction of cutting blade and other side of ceramic plate
When the rotary table is rotated so that B is parallel,
Normal distance Y from center of rotation to side B on the other end_B And rotation angle
Degree θ_B And the m-th line from side A of the ceramic plate
(M = 0, 1 ... n, n: pitch direction of pattern electrode)
Is the number of cut angles θm, θm = m × (θ_B −θ_A ) / N + θ_A (1), and the distance Ym in the pitch direction at that time is expressed as: Ym = m × (Y_B -Y_A ) / N + Y_A ・ ・ ・ (2) By calculating by (2), each cut line can be easily calculated.
Cutting work can be automated.

The above principle will be described with reference to FIG. First, the ceramic plate C is placed at an arbitrary position on the rotary table, and a coordinate system in which the cutting direction is the X axis and the direction perpendicular thereto is the Y axis on the rotary table is considered. ₀ , Y ₀ ). When the rotary table is rotated so that the side A on one end side of the two sides that are essentially parallel to the cutting direction from the rotation center is parallel to the X axis (FIG. 3).
(A)), Y coordinate (Y _A ) of side A and Y of rotation center
Absolute value of the difference between the coordinate _{(Y 0) (| Y A} -Y 0 |) is the length of drawn from the center of rotation to the side A normal. Further, when the rotary table is rotated from this state (side A is parallel to the X axis) so that side B on the other end side is parallel to the X axis (see FIG. 3B), the rotation angle θ Is equal to the angle (θ _B −θ _A ) between side A and side B, and the Y coordinate (Y
Absolute value of the difference between _B) with the center of rotation of the Y-coordinate (Y ₀₎ (| Y
_B− Y ₀ |) is the length of the normal drawn from the center of rotation to the side B. When the ceramic plate C is sequentially cut from the side A to the side B, when the side A is parallel to the X axis, the angle θ _A from the zero point of the θ axis and the number of divisions are n (in FIG. 3, n = If 6), the angle of the cut line to be equally divided is expressed by the following equation. The first angle θ ₁ = 1 × θ / n + θ _A The second angle θ ₂ = 2 × θ / n + θ _A Therefore, the m-th angle θm is given by equation (1). At this time, the sign of θ is positive (+) if the rotation direction when moving the side parallel to the X axis from side A to side B is the increment direction of the θ axis of the rotary table, and negative otherwise. (-). The Y-axis coordinate of the cut line when each cut line is parallel to the X axis from the rotation center can be approximated by the following equation. The first Y coordinate Y ₁ = 1 × ｛(Y _B −Y ₀ ) − (Y _A −
_{Y 0)} / n + Y} A = 1 × (Y B -Y A) / n + Y A 2 knots of Y coordinate Y ₂ = 2 × (hence _{Y B -Y A) / n +} Y A, Y coordinate Ym of the m-th ( Equation 2) is obtained.

As described above, by grasping the outer shape (side A, side B), the position (θm, Ym) of the internal pattern electrode contracted and deformed by firing can be estimated by a calculation formula. Unrecognizable multilayer board,
Even a ceramic plate on which a mark cannot be formed on the surface can be equally divided along the internal pattern electrode without applying any special processing to the ceramic plate itself.

As shown in FIG. 4A, the green sheet G
In some cases, a lug S having a width different from this pitch, for example, a width smaller than this pitch is formed on the outer peripheral portion of the pattern electrode printed at a constant pitch. When this green sheet G is fired, the fired ceramic plate C is as shown in FIG. In this case, since the firing strain of the ear portion S is considered to be smaller than the other portions, it can be approximated by the following equation. The first Y coordinate Y ₁ = 1 × ｛(Y _B −Y ₀ ) − (Y _A −
_{Y 0)} / n + Y} A = 1 × (Y B -Y A -2a ') / n
+ Y _A + a ′ Y coordinate of the _second Y ₂ = 2 × (Y _B −Y _A −2a ′) / n
+ Y _A + a ′ Therefore, the m-th Y coordinate Ym is given by the following equation. In _{Ym = m × (Y B -Y} A -2a ') / n + Y A + a' ··· (3) (3) Equation, a 'is multiplied by the firing shrinkage rate of the average pre-fired dimension a of the ear portion S Value. Cut line angle θ
Regarding m, since the change in the angle of the ear S due to the firing strain is small, the ear is not provided in claim 2 (1).
It is practically acceptable to use the formula as it is.

According to a fifth aspect of the present invention, when a dicing apparatus including a rotary table, a dicing blade, an XY driving device, a recognition device, a position reading device, and a control device is used,
By automatically calculating the cut position and the angle, complicated position calculation and operation of the XY drive device and the rotary table can be performed accurately without error.

[0013]

5 to 7 show an example of a dicing apparatus according to the present invention. The ceramic plate C to be processed is a fired ceramic plate having a pattern electrode as shown in FIG. 3 or FIG. 4, and the pattern electrode is in a state distorted by firing strain. Note that the ceramic plate C may be a multilayer substrate. The ceramic plate C is stably held on a holding sheet 1 such as an adhesive sheet, and the holding sheet 1 is fixed on the rotary table 2 by vacuum suction or the like. In this embodiment, three ceramic plates C are arranged on the holding sheet 1 in the Y-axis direction, but the number can be arbitrarily selected.

The rotary table 2 is arranged on the X-axis table 3 so as to be rotatable at an arbitrary rotation angle by an angle adjusting device (not shown). The X-axis table 3 is mounted on an X-axis driving device 4 and can be moved to any position in the X-axis direction.

The dicing blade 5 is mounted on the tip of a rotary drive 6, and the rotary drive 6 is mounted on a Z-axis drive 7. Therefore, the vertical height of the dicing blade 5 can be arbitrarily adjusted by the Z-axis driving device 7. The Z-axis driving device 7 is mounted on a Y-axis table 8, and the Y-axis table 8 can be moved to an arbitrary position in the Y-axis direction by a Y-axis driving device 9.

Further, on the Y-axis table 8, a microscope device (recognition device) 10 having a cross hairline 10a as a reference mark at the tip is mounted. By aligning the cross hairline 10a with a characteristic portion such as an edge of the ceramic plate C, the position of the ceramic plate C on the XY driving devices 4 and 9 can be recognized.

Each of the rotary table angle adjusting device, X-axis driving device 4, Z-axis driving device 7, Y-axis driving device 9, and microscope device 10 has a built-in sensor for detecting the position of each device. The detection signal of each sensor is sent to the control device 11, and each drive device is controlled by the control device 11. In addition, the dicing blade rotation driving device 6 is also controlled by the control device 11. The control device 11 includes a computer having a central processing unit, a storage device, various drivers, and the like. The average firing shrinkage rate of the ceramic plate C, the ear size a before firing, or the ear size a ′ multiplied by the firing shrinkage ratio. Is provided.

The control device 11 controls the cross hairline 10 of the microscope device 10 to a characteristic point such as an edge of the ceramic plate C.
The positions of the X-axis driving device 4 and the Y-axis driving device 9 and the angle of the rotary table 2 when a is adjusted are read, and the expressions (1) and (2) or the expressions (1) and (3) are obtained. Then, the cut position is calculated by substituting the read position coordinates of the ceramic plate C, and based on the result, the X-axis driving device 4, the Y-axis driving device 9, the rotary table 2, the dicing blade rotation driving device 6, the Z-axis driving By operating the apparatus 7, the ceramic plate C is automatically cut.

Next, the operation of the dicing apparatus according to the present invention will be described with reference to FIG. In advance, dicing blade 5
Is adjusted so that the cutting direction is parallel to the X-axis direction. First, the cross hairline 10a of the microscope device 10
The X-axis driving device 4 and the Y-axis driving device 9 are operated so that the position is aligned with the rotation center (zero point) of the turntable 2 (step S1). Then, the Y-axis coordinate Y ₀ and the angle θ _{0 of the} turntable 2 at that time are read (step S2). Next, the angle of one side (for example, side A) of the ceramic plate C is adjusted using the turntable 2 so as to be parallel to the cutting direction (step S3). Next, the X-axis driving device 4 and the Y-axis driving device 9 are operated such that the cross hairline 10a of the microscope device 10 matches the edge of the side A (step S).
4). Then, read the angle theta _A from the coordinate Y _A the zero point of the rotary table 2 in the Y-axis when the cross hair line 10a of the edge and the microscope device 10 of side A match (step S5). Similarly, the same operation is performed on the other side B of the ceramic plate C. That is, the other side B of the ceramic plate C is adjusted using the rotary table 2 so as to be parallel to the cutting direction (step S6), and the microscope device 10 is adjusted.
X so that the cross hairline 10a of
Operating the axial drive device 4 and the Y-axis drive unit 9 (step S7), and sides B edge and the Y-axis when the cross hair line 10a of the microscope apparatus 10 matches the coordinate Y _B and from zero point of the turntable 2 Read the angle θ _B (step S
8). The data Y _A , Y _B ,
θ _A and θ _B are substituted into the expressions (1) and (2) to calculate the cut angle θm and the cut position (distance in the pitch direction) Ym (step S9). When the ceramic plate C has a lug, the equations (1) and (3) may be used. Cutting is performed using the cut angle θm and the cut position Ym obtained as described above (step S10). By cutting in this manner, the pattern electrodes can be equally divided so that the pattern electrodes are evenly distributed in the cut member.

[0020]

As is apparent from the above description, according to the present invention, the ceramic plate is held on the rotary table, and the cut position of the ceramic plate is adjusted by the rotation angle of the normal line from the center of rotation to the cut line. Approximately calculated by the normal distance,
Since the ceramic plate is cut along the cut position, even if firing distortion occurs in the pattern electrode of the fired ceramic plate, the pattern electrode is equally divided within the cut member so that the pattern electrode is evenly distributed. can do.
Moreover, since the position of each of the fired and contracted pattern electrodes can be estimated by grasping the characteristic portions such as the sides of the ceramic plate, it is not necessary to perform special processing on the ceramic plate itself. Further, the present invention can be easily applied to a ceramic plate having a structure in which the pattern electrode is not exposed to the outside, such as a multilayer substrate.

[Brief description of the drawings]

FIG. 1 is a plan view of a green sheet on which pattern electrodes are printed in a grid pattern at a constant pitch.

FIG. 2 is a plan view of a ceramic plate after firing the green sheet of FIG. 1;

FIG. 3 is a principle view showing a method of cutting a ceramic plate having no ear.

FIG. 4 is a principle view showing a method of cutting a ceramic plate with ears.

FIG. 5 is a plan view of an example of a dicing apparatus according to the present invention.

FIG. 6 is a left side view of the dicing apparatus of FIG. 5;

FIG. 7 is a front view of the dicing apparatus of FIG. 5;

FIG. 8 is a flowchart illustrating the operation of the dicing apparatus.

[Explanation of symbols]

 C Ceramic plate 1 Holding sheet 2 Rotary table 3 X-axis table 4 X-axis drive device 5 Dicing blade 8 Y-axis table 9 Y-axis drive device 10 Microscope device (recognition device) 10a Crosshair line (reference mark) 11 Control device

Claims (8)

[Claims] 1. A method of holding a ceramic plate obtained by firing a green sheet on which a pattern electrode is printed at a constant pitch on a rotary table, and cutting the ceramic plate along an equal part line in a direction orthogonal to the pitch direction. a step of determining the a perpendicular distance Y _a from the rotational center of the side a in the pitch direction one end side of the ceramic plate and the rotational angle theta _a, perpendicular distance from the rotational center of the side B of the other end side of the ceramic plate a step of determining a Y _B and the rotation angle theta _B, and a perpendicular distance Ym and the rotation angle θm from the rotation center of each cutting position of the ceramic plate, the normal distance Y _a of the side a and side B, Y _B And rotation angles θ _A , θ
A dicing method comprising: a step of obtaining from _B; and a step of cutting a ceramic plate along the cut position. 2. The step of reading the position of the center of rotation of the ceramic plate, and the step of rotating the rotary table so that the cutting direction of the dicing blade and the side A on one end side of the ceramic plate are parallel to each other. a step of reading a perpendicular distance Y _a to side a side and a rotation angle theta _a, the other end of the cut direction and the ceramic plate of the dicing blade edge B
Reading the normal distance Y _B and the rotation angle θ _B from the rotation center to the side B on the other end when the rotary table is rotated so that the cut angle .theta.m of: (m = 0,1 ··· n, n pattern number in the pitch direction of the electrodes), determined by _{θm = m × (θ B -θ} a) / n + θ a ··· (1), the pitch direction of the distance Ym at that _{time, Ym = m × (Y B} -Y a) / n + Y a ··· dicing method according to claim 1, characterized in that and a step of obtaining (2). 3. A step of reading a rotational center position of the ceramic plate, the ear having a width different from the pitch on an outer peripheral portion of the pattern electrode printed at a constant pitch. when the side a at one end of the cutting direction and the ceramic plate of the dicing blade rotates the rotary table so as to be parallel, the perpendicular distance Y _a from the center of rotation to the side a of the one-side rotation angle theta _a And the normal line distance from the center of rotation to the side B on the other end when the rotary table is rotated so that the cutting direction of the dicing blade is parallel to the side B on the other end of the ceramic plate. a step of reading and Y _B and the rotation angle theta _B, m-th from the side a of the ceramic plate: cut angle .theta.m of (m = 0,1 ··· n, n pattern number in the pitch direction of the electrodes), .theta.m = _{m × (θ B -θ A)} / + Theta obtained in _A ··· (1), the pitch direction of the distance Ym at that time, using the value a 'multiplied by the firing shrinkage rate of the average pre-fired dimension a of the ear portion, Ym = m × (Y _{B -Y a -2a ') / n +} Y a + a' dicing method according to claim 1, characterized in that and a step of finding in (3). 4. The dicing method according to claim 1, wherein the ceramic plate is a multilayer substrate obtained by laminating and firing green sheets on which pattern electrodes are printed at a constant pitch. 5. A dicing machine for printing a pattern electrode on a green sheet at a constant pitch and cutting a fired ceramic plate in a direction orthogonal to the pitch direction, wherein the ceramic plate is held on an upper surface and the rotational position of the ceramic plate can be set at any position. A rotary table, a dicing blade for linearly cutting the ceramic plate, an XY drive device for relatively moving the rotary table and the dicing blade in a cutting direction and a pitch direction, and an XY drive for the ceramic plate. A recognition device having a reference mark for recognizing a position on the device, and a position reading device for reading a position on the XY drive device and an angle of the rotary table when the reference mark of the recognition device is aligned with a feature point of the ceramic plate. And the position coordinates of the ceramic plate read by the position reading device Position is calculated, and the results to the XY drive device based, dicing apparatus characterized by and a control device for automatically cutting the ceramic plate by operating a rotary table and the dicing blade. 6. The controller reads the rotational center position of the ceramic plate, and rotates the rotary table so that the cutting direction of the dicing blade and the side A on one end side of the ceramic plate are parallel. Side A on one side from center
The normal distance Y _A and the rotation angle θ _A are read, and when the rotary table is rotated so that the cutting direction of the dicing blade and the side B on the other end side of the ceramic plate are parallel to each other, from the rotation center, The normal distance Y _B and the rotation angle θ _B to the end side _B are read, and the m-th line from the side A of the ceramic plate (m = 0, 1... N, n: the number of pattern electrodes in the pitch direction) cut angle θm, θm = m × (θ B -θ a) / n + θ a obtained in (1), the pitch direction of the distance Ym at that _{time, Ym = m × (Y B} -Y a) / dicing apparatus according to claim 5, wherein the determination by the _{n + Y a ··· (2)} . 7. The ceramic plate has a lug having a width different from the pitch on the outer periphery of the pattern electrode printed at a constant pitch. Alternatively, an input means for inputting the ear dimension multiplied by the firing shrinkage is provided, the rotational center position of the ceramic plate is read, and the cutting direction of the dicing blade is parallel to the side A on one end side of the ceramic plate. when rotating the rotary table, it reads a perpendicular distance Y _a to side a of the one end side and the rotation angle theta _a from the center of rotation, parallel to the sides B of the other end of the cut direction and the ceramic plate of the dicing blade When you turn the turntable so that
The normal distance Y _B and the rotation angle θ _B from the center of rotation to the side B on the other end are read, and the m-th (m = 0, 1,..., N, n: pattern electrode pitch) from side A of the ceramic plate the cut angle .theta.m direction number of), .theta.m = determined with _{m × (θ B -θ a)} / n + θ a ··· (1), the pitch direction of the distance Ym at that time, before firing of the ear portion to dimension a _{'using, Ym = m × (Y B} -Y a -2a' value a multiplied by the firing shrinkage rate of the average claim and obtaining _{in) / n + Y a + a} '··· (3) 5 3. The dicing apparatus according to claim 1. 8. The dicing apparatus according to claim 5, wherein said ceramic plate is a multilayer substrate obtained by laminating and firing green sheets on which pattern electrodes are printed at a constant pitch.