JP2000251997A - Insert mold terminal - Google Patents

Insert mold terminal

Info

Publication number
JP2000251997A
JP2000251997A JP11056585A JP5658599A JP2000251997A JP 2000251997 A JP2000251997 A JP 2000251997A JP 11056585 A JP11056585 A JP 11056585A JP 5658599 A JP5658599 A JP 5658599A JP 2000251997 A JP2000251997 A JP 2000251997A
Authority
JP
Japan
Prior art keywords
terminal
resin
connection plate
bonding wire
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11056585A
Other languages
Japanese (ja)
Inventor
Jun Uchida
純 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP11056585A priority Critical patent/JP2000251997A/en
Publication of JP2000251997A publication Critical patent/JP2000251997A/en
Withdrawn legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To prevent a terminal from floating up from a resin case after it is insert-molded. SOLUTION: This insert molding of a terminal 2 has a connection plate 6 to be connected by wire bonding to a bonding wire on an outer surface 3a of a resin case 3. The connection plate 6 is provided with a weld surface 4 for welding the bonding wire thereto, and a float-up preventing part for the connection plate 6 is formed around the weld surface. The float-up preventing means comprises a plurality of resin-filled holes 8 formed around the weld surface and resin 9 filled in the resin-filled holes 8. Each resin-filled hole 8 has the shape of an inverted truncate cone with the weld surface side up.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、自動車のエンジン
ルーム内に取り付けられるコネクタとして使用される端
子のインサート成形品に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal insert molded product used as a connector mounted in an engine room of an automobile.

【0002】[0002]

【従来の技術】従来、図10のような端子のインサート
成形品80が提案されている。図10に示すように、こ
のインサート成型品80は、端子81の上面を樹脂ケー
ス82の外面82aと同一面の状態、又は外面82aよ
り一段高い状態でインサート成形されて成る。
2. Description of the Related Art Conventionally, there has been proposed an insert molded product 80 having terminals as shown in FIG. As shown in FIG. 10, the insert molded product 80 is formed by insert molding with the upper surface of the terminal 81 being flush with the outer surface 82a of the resin case 82 or being one step higher than the outer surface 82a.

【0003】しかしながら、図11の如くに、インサー
ト成形時の樹脂圧や、インサート成形後の樹脂ケース8
2の収縮によって応力Pが端子81に作用するため、端
子81が樹脂ケース82の外面82aから浮き上がる恐
れがあった。また、図12のように、プレス加工時のス
プリングバック等によって屈曲状態の不完全な端子8
1′が形成される場合がある。その場合には、インサー
ト成形時、図13に示すように、端子81′の屈曲状態
が矯正されるため、樹脂ケース82からの応力Qが端子
81′に作用する。これにより、端子81′が樹脂ケー
ス82の外面82aから浮き上がる不具合があった。
However, as shown in FIG. 11, the resin pressure at the time of insert molding and the resin case 8 after insert molding are reduced.
Since the stress P acts on the terminal 81 due to the contraction of 2, the terminal 81 may be lifted from the outer surface 82a of the resin case 82. In addition, as shown in FIG. 12, the incompletely bent terminal 8 due to springback or the like during press working.
1 'may be formed. In this case, as shown in FIG. 13, the bent state of the terminal 81 'is corrected during insert molding, so that the stress Q from the resin case 82 acts on the terminal 81'. As a result, there was a problem that the terminal 81 ′ was lifted from the outer surface 82 a of the resin case 82.

【0004】そして、図11及び図13のような端子8
1(81′)の浮き上がりにより、ワイヤボンディング
(超音波溶接)時に、図10のボンディングワイヤ83
と端子81(81′)とが共振して接触不良を起こす恐
れがあった。符号84はプリント基板である。なお、ワ
イヤボンディングとは超音波を用いて端子81(8
1′)とボンディングワイヤ83とを溶着することであ
る。
[0004] Then, as shown in FIG. 11 and FIG.
1 (81 '), the bonding wire 83 shown in FIG.
And the terminal 81 (81 ') may resonate and cause poor contact. Reference numeral 84 denotes a printed circuit board. Note that wire bonding refers to the use of a terminal 81 (8
1 ') and the bonding wire 83.

【0005】[0005]

【発明が解決しようとする課題】本発明は上記した点に
鑑み、インサート成形後、樹脂ケースからの端子の浮き
上がりを防止する端子のインサート成形品を提供するこ
とを目的とする。
SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a terminal insert molded product which prevents the terminal from floating from a resin case after insert molding.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、ワイヤボンディングによりボンディング
ワイヤを接続する接続板部を、樹脂ケースの外面に有す
る端子のインサート成形品において、前記接続板部には
前記ボンディングワイヤを溶着する溶着面が設けられ、
該溶着面の回りには該接続板部の浮き上がり防止部が形
成されている端子のインサート成形品を特徴とする(請
求項1)。前記浮き上がり防止手段が、前記溶着面の周
囲に複数形成された樹脂充填孔と、該樹脂充填孔に充填
された間隙樹脂部とから成る端子のインサート成形品を
特徴とする(請求項2)。前記樹脂充填孔が、溶着面側
を上面として断面逆截頭錐体状である端子のインサート
成形品を特徴とする(請求項3)。
In order to achieve the above object, the present invention relates to an insert molded product of a terminal having a connecting plate portion for connecting a bonding wire by wire bonding on an outer surface of a resin case. The portion is provided with a welding surface for welding the bonding wire,
The present invention is characterized in that an insert molded product of the terminal is formed around the welded surface with a portion for preventing the connection plate from being lifted (claim 1). The lift prevention means is an insert molded product of a terminal including a plurality of resin filling holes formed around the welding surface and a gap resin portion filled in the resin filling hole (claim 2). An insert molded product of a terminal in which the resin filling hole has an inverted truncated pyramid shape with the welding surface side as the upper surface (claim 3).

【0007】[0007]

【発明の実施の形態】以下、本発明の実施の形態の具体
例を、図面を参照して説明する。図1〜図9は本発明に
係る端子のインサート成形品の一実施例を示すものであ
る。図1に示すように、このインサート成形品1は、端
子2と、内部に端子2を複数有する樹脂ケース3と、端
子2の溶着部4の回りに形成された浮き上がり防止手段
とから成る。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 9 show an embodiment of a terminal insert molded product according to the present invention. As shown in FIG. 1, the insert molded product 1 includes a terminal 2, a resin case 3 having a plurality of terminals 2 therein, and a lifting prevention means formed around a welded portion 4 of the terminal 2.

【0008】図2及び図3の如くに、端子2は、断面L
字状の本体5と、本体5の一端部に連成された接続板部
6と、接続板部6の自由端部に一体的に形成された埋設
板部7とから成る。端子2は帯状である。本体5と接続
板部6とは略直角に連結されている。接続板部6と埋設
板部7とは略直角に結合されている。そして、本体5と
埋設板部7とは接続板部6に対して同側に位置してい
る。接続板部6にはボンディングワイヤを溶着するため
の溶着面4が配置されている。
As shown in FIGS. 2 and 3, the terminal 2 has a cross section L
It comprises a V-shaped main body 5, a connecting plate 6 connected to one end of the main body 5, and a buried plate 7 integrally formed at a free end of the connecting plate 6. The terminal 2 has a band shape. The main body 5 and the connection plate 6 are connected at substantially right angles. The connection plate portion 6 and the buried plate portion 7 are joined at a substantially right angle. The main body 5 and the buried plate 7 are located on the same side with respect to the connection plate 6. The connecting plate 6 is provided with a welding surface 4 for welding a bonding wire.

【0009】浮き上がり防止手段は、図4及び図5のよ
うに、溶着面4の前後(又は左右)に位置する接続板部
6に形成された一対の樹脂充填孔8,8と、樹脂充填孔
8内に充填された間隙樹脂部9とから成る。一対の樹脂
充填孔8,8は溶着面4を挟み、接続板部6上で溶着面
4と一直線上に並んでいる。図5に示すように、樹脂充
填孔8の断面は略逆截頭錐体状である。つまり、樹脂充
填孔8の上部開口面8aが拡径、下部開口8面bが縮
径、及び内周面8cが傾斜している。樹脂充填孔8の上
部開口面8aは略溶着面4と同じ大きさ(サイズ)であ
る。なお、樹脂充填孔8の断面形状、開口面の大きさ
(サイズ)、配置場所、又は(及び)配置個数は任意で
ある。また、截頭錐体とは、錐体の頭部を底面と平行な
面で切り取った残りの部分がなす立体である。
As shown in FIGS. 4 and 5, the lifting prevention means includes a pair of resin filling holes 8, 8 formed in the connecting plate portion 6 located before and after (or left and right) of the welding surface 4. 8 and a gap resin portion 9 filled in the inside. The pair of resin-filled holes 8, 8 sandwich the welding surface 4 and are aligned with the welding surface 4 on the connection plate 6. As shown in FIG. 5, the cross section of the resin filling hole 8 has a substantially inverted truncated cone shape. That is, the upper opening surface 8a of the resin filling hole 8 has an enlarged diameter, the lower opening 8 surface b has a reduced diameter, and the inner peripheral surface 8c is inclined. The upper opening surface 8 a of the resin filling hole 8 has substantially the same size (size) as the welding surface 4. In addition, the cross-sectional shape of the resin filling hole 8, the size (size) of the opening surface, the arrangement place, and / or the number of arrangement are arbitrary. Further, the truncated cone is a solid formed by the remaining portion obtained by cutting the head of the cone by a plane parallel to the bottom surface.

【0010】そして、樹脂充填孔8に樹脂材が充填され
ると、樹脂充填孔8の下部開口面8bが楔状に樹脂ケー
ス3に食い込んだ状態になる。そのため、ワイヤボンデ
ィング作業時に、接続板部6、特に溶着面4の浮き上が
りを防止できる。即ち、樹脂充填孔8の内周面8cの付
近に位置する間隙樹脂部9には、ワイヤボンディング作
業時に、接続板部6の浮き上がりを防止する下向きの応
力Fが作用する。これにより、接続板部6の下面6aと
樹脂ケース3の外面3aとの間に隙間が生じない。その
結果、図1の如くに、ボンディングワイヤ32と接続板
部6との接続不良を防止できる。
When the resin filling hole 8 is filled with the resin material, the lower opening surface 8b of the resin filling hole 8 is cut into the resin case 3 in a wedge shape. Therefore, it is possible to prevent the connection plate 6, particularly the welding surface 4, from floating during the wire bonding operation. That is, a downward stress F acting on the gap resin portion 9 located in the vicinity of the inner peripheral surface 8c of the resin filling hole 8 to prevent the connection plate portion 6 from floating is applied during the wire bonding operation. Thus, no gap is formed between the lower surface 6a of the connection plate 6 and the outer surface 3a of the resin case 3. As a result, as shown in FIG. 1, poor connection between the bonding wire 32 and the connection plate 6 can be prevented.

【0011】次に、図1のインサート成形品1の製造方
法について説明する。図6の如くに、プレス加工によっ
て形成された第一端子体20と第二端子体21とを第一
係止具22の上面22aと下面22bとにそれぞれ係止
し、第一端子組立体23を形成する。同様に、図7のよ
うに、第三端子体24と第四端子体25とを第二係止具
26の上面26aと下面26bとに各々係止し、第二端
子組立体27を組み立てる。なお、図6の第一係止具2
2、及び図7の第二係止具26は、複数の係止溝22
c,26cと、係止溝22c,26cの両側に位置する
複数の係止突起22d,26dとをそれぞれ有する。
Next, a method of manufacturing the insert molded product 1 shown in FIG. 1 will be described. As shown in FIG. 6, the first terminal body 20 and the second terminal body 21 formed by press working are respectively locked on the upper surface 22a and the lower surface 22b of the first locking member 22, and the first terminal assembly 23 is formed. To form Similarly, as shown in FIG. 7, the third terminal body 24 and the fourth terminal body 25 are respectively locked on the upper surface 26a and the lower surface 26b of the second locking member 26, and the second terminal assembly 27 is assembled. In addition, the first stopper 2 of FIG.
2, and the second locking tool 26 of FIG.
c, 26c, and a plurality of locking projections 22d, 26d located on both sides of the locking grooves 22c, 26c, respectively.

【0012】図6及び図7に示すように、第一端子組立
体23を第二端子組立体27の収容空間27aに配置す
る。それと共に、第一係止具22の下面22bと第二係
止具26の上面26aとを組み付け、樹脂材でインサー
ト成形し、図8の予備成形品28を形成する(一次成
形)。インサート成形時には、第一係止具22(図6)
及び第二係止具26(図7)がそれぞれ保持されるよう
に、不図示の成形金型内に配置される。図8の予備成形
品28を樹脂材によりインサート成形することにより、
図1のようなインサート成形品1が形成される(二次成
形)。
As shown in FIGS. 6 and 7, the first terminal assembly 23 is disposed in the accommodation space 27a of the second terminal assembly 27. At the same time, the lower surface 22b of the first locking member 22 and the upper surface 26a of the second locking member 26 are assembled and insert-molded with a resin material to form a preformed product 28 in FIG. 8 (primary molding). At the time of insert molding, the first stopper 22 (FIG. 6)
And the second locking tool 26 (FIG. 7) are arranged in a molding die (not shown) so as to be respectively held. By insert-molding the preform 28 of FIG. 8 with a resin material,
An insert molded product 1 as shown in FIG. 1 is formed (secondary molding).

【0013】図1に示すように、インサート成形品1の
接続板部6とプリント基板30とのワイヤボンディング
は、次のようにして行われる。図9(A)の如くに、プ
リント基板30上に接続電極31を設ける。金属線(例
えばAu線又はAl線)から成るボンディングワイヤ3
2の中間部をクランプ33で挟持し、図9(B)のよう
に、ボンディングワイヤ32の端末部32aを接続電極
31上に接触させる。超音波ホーン34の先端部34a
を接続電極31に突き当てることにより、ボンディング
ワイヤ32の端末部32aを接続電極31に溶着する。
超音波ホーン34とクランプ33とは同期的に移動し、
クランプ33は開閉自在である。
As shown in FIG. 1, wire bonding between the connection plate 6 of the insert molded product 1 and the printed circuit board 30 is performed as follows. As shown in FIG. 9A, a connection electrode 31 is provided on a printed circuit board 30. Bonding wire 3 made of a metal wire (for example, Au wire or Al wire)
9 is clamped by the clamp 33, and the terminal portion 32a of the bonding wire 32 is brought into contact with the connection electrode 31 as shown in FIG. Tip portion 34a of ultrasonic horn 34
Of the bonding wire 32 is welded to the connection electrode 31.
The ultrasonic horn 34 and the clamp 33 move synchronously,
The clamp 33 can be opened and closed freely.

【0014】溶着後に、図9(C)に示すように、超音
波ホーン34を接続電極31から接続板部6の溶着面4
へ移動する。それに追随させて、クランプ33を一旦開
いてボンディングワイヤ32を引き出し、再度クランプ
33を閉じてボンディングワイヤ32を挟持する。図9
(D)の如くに、超音波ホーン34の先端部34aによ
ってクランプ33から引き出されたボンディングワイヤ
32の中間部を溶着面4に突き当て、それから、図9
(E)のように、ボンディングワイヤ32を溶着面4に
溶着する。図9(F)に示すように、超音波ホーン34
の先端部34aでボンディングワイヤ32を切断し、超
音波ホーン34とクランプ33とを溶着面4から遠ざけ
る。このようにして、ワイヤボンディングの作業が行わ
れる。
After the welding, as shown in FIG. 9C, the ultrasonic horn 34 is moved from the connecting electrode 31 to the welding surface 4 of the connecting plate 6.
Move to. Following this, the clamp 33 is once opened and the bonding wire 32 is pulled out, and the clamp 33 is closed again to clamp the bonding wire 32. FIG.
As shown in FIG. 9D, the intermediate portion of the bonding wire 32 pulled out from the clamp 33 by the tip portion 34a of the ultrasonic horn 34 abuts against the welding surface 4, and then, as shown in FIG.
As shown in (E), the bonding wire 32 is welded to the welding surface 4. As shown in FIG. 9 (F), the ultrasonic horn 34
Then, the bonding wire 32 is cut at the distal end portion 34a, and the ultrasonic horn 34 and the clamp 33 are separated from the welding surface 4. Thus, the operation of wire bonding is performed.

【0015】[0015]

【発明の効果】以上の如くに、請求項1の発明によれ
ば、溶着面がボンディングワイヤを接続する接続板部に
設けられている。浮き上がり防止手段が、溶着面の回り
に形成されている。そのため、インサート成形後に、接
続板部の浮き上がりが起きない。これにより、ワイヤボ
ンディング時に、ボンディングワイヤと溶着面との接続
不良を防止できる。
As described above, according to the first aspect of the present invention, the welding surface is provided on the connection plate for connecting the bonding wires. A lifting prevention means is formed around the welding surface. Therefore, after the insert molding, the connection plate does not rise. Thereby, it is possible to prevent poor connection between the bonding wire and the welding surface during wire bonding.

【0016】請求項2の発明によれば、浮き上がり防止
手段として樹脂充填孔が、溶着面の周囲に位置する接続
板部に形成されると共に、間隙樹脂部が樹脂充填孔に充
填されている。そのため、インサート成形後に、溶着面
を浮き上がらせる応力に対して作用・反作用の関係にあ
る応力が間隙樹脂部に作用する。これにより、接続板部
と樹脂ケースの外面との間に隙間が生じるのを防止でき
る。
According to the second aspect of the present invention, the resin filling hole is formed in the connection plate portion located around the welding surface as a means for preventing the resin from being lifted, and the gap resin portion is filled in the resin filling hole. For this reason, after the insert molding, a stress having an action / reaction relationship with the stress that causes the welding surface to float acts on the gap resin portion. Thereby, it is possible to prevent a gap from being generated between the connection plate portion and the outer surface of the resin case.

【0017】請求項3の発明によれば、溶着面側を上面
とした場合には、樹脂充填孔が断面逆截頭錐体状であ
る。そのため、樹脂充填孔の周縁が、上面側よりも上面
側と反対側の方で狭いから、樹脂ケースに楔状に食い込
む。これにより、インサート成形後に、溶着面の浮き上
がりを確実に防止できる。
According to the third aspect of the present invention, when the welding surface side is the upper surface, the resin filling hole has an inverted truncated cone shape in cross section. Therefore, the peripheral edge of the resin filling hole is narrower on the side opposite to the upper surface side than on the upper surface side, so that the resin filling hole bites into the resin case. This makes it possible to reliably prevent the welding surface from rising after insert molding.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る端子のインサート成形品の一実施
例を示す全体斜視図である。
FIG. 1 is an overall perspective view showing one embodiment of a terminal insert molded product according to the present invention.

【図2】図1における端子の断面図である。FIG. 2 is a sectional view of a terminal in FIG. 1;

【図3】図2の矢視X方向から見た図である。FIG. 3 is a view as seen from an arrow X direction in FIG. 2;

【図4】図1の矢視Y方向から見た図である。FIG. 4 is a view as seen from a direction indicated by an arrow Y in FIG. 1;

【図5】図4におけるZ−Z線の断面図である。FIG. 5 is a sectional view taken along line ZZ in FIG. 4;

【図6】第一端子体と第二端子体とを第一係止具に係止
して形成された第一端子組立体の斜視図である。
FIG. 6 is a perspective view of a first terminal assembly formed by locking a first terminal body and a second terminal body to a first locking member.

【図7】第三端子体と第四端子体とを第二係止具に係止
して形成された第二端子組立体の斜視図である。
FIG. 7 is a perspective view of a second terminal assembly formed by locking a third terminal body and a fourth terminal body to a second locking member.

【図8】第一端子組立体と第二端子組立体とを組付けて
インサート成形された予備成形品を示す斜視図である。
FIG. 8 is a perspective view showing a preformed product which is insert-molded by assembling a first terminal assembly and a second terminal assembly.

【図9】図1の溶着面にボンディングワイヤを接続する
ワイヤボンディングの作業手順を示す説明図であり、
(A)はプリント基板の接続電極にボンディングワイヤ
を溶着する前状態、(B)は溶着している状態、(C)
は溶着後にクランプを開いてボンディングワイヤを送り
出しながら超音波ホーンを移動している状態、(D)は
溶着面にボンディングワイヤを接触させた状態、(E)
は溶着面にボンディングワイヤを溶着した状態、(F)
は溶着後に、ボンディングワイヤを切断し、接続電極と
溶着面とをボンディングワイヤで電気的に接続した状態
である。
FIG. 9 is an explanatory view showing a work procedure of wire bonding for connecting a bonding wire to the welding surface of FIG. 1;
(A) is a state before the bonding wire is welded to the connection electrode of the printed circuit board, (B) is a state where the bonding wire is welded, (C)
Is a state in which the ultrasonic horn is moving while the clamp is opened and the bonding wire is sent out after welding, (D) is a state in which the bonding wire is in contact with the welding surface, (E)
Is a state where a bonding wire is welded to the welding surface, (F)
Is a state in which the bonding wire is cut after welding, and the connection electrode and the welding surface are electrically connected by the bonding wire.

【図10】従来の端子のインサート成形品を示す側面図
である。
FIG. 10 is a side view showing a conventional insert molded product of a terminal.

【図11】図10における樹脂ケースが収縮して端子が
浮き上がった状態を示す断面図である。
11 is a cross-sectional view showing a state in which the resin case in FIG. 10 has contracted and the terminal has been lifted.

【図12】図10における端子の屈曲が不完全である場
合を示す側面図である。
FIG. 12 is a side view showing a case where the bending of the terminal in FIG. 10 is incomplete.

【図13】図12の屈曲不完全な端子をインサート成形
したことにより、端子の屈曲部分が樹脂ケースによって
矯正されている状態を示す断面図である。
FIG. 13 is a cross-sectional view showing a state in which a bent portion of the terminal is corrected by a resin case by insert-molding the incompletely bent terminal of FIG.

【符号の説明】[Explanation of symbols]

1 端子のインサート成形品 2 端子 3 樹脂ケース 4 溶着面 6 接続板部 8 樹脂充填孔 9 間隙樹脂部 32 ボンディングワイヤ DESCRIPTION OF SYMBOLS 1 Insert molded product of terminal 2 Terminal 3 Resin case 4 Welding surface 6 Connection plate part 8 Resin filling hole 9 Gap resin part 32 Bonding wire

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ワイヤボンディングによりボンディング
ワイヤを接続する接続板部を、樹脂ケースの外面に有す
る端子のインサート成形品において、 前記接続板部には前記ボンディングワイヤを溶着する溶
着面が設けられ、該溶着面の回りには該接続板部の浮き
上がり防止部が形成されていることを特徴とする端子の
インサート成形品。
1. An insert molded product of a terminal having a connection plate portion for connecting a bonding wire by wire bonding on an outer surface of a resin case, wherein the connection plate portion is provided with a welding surface for welding the bonding wire. An insert molded product for a terminal, wherein a floating prevention portion of the connection plate portion is formed around a welding surface.
【請求項2】 前記浮き上がり防止手段が、前記溶着面
の周囲に複数形成された樹脂充填孔と、該樹脂充填孔に
充填された間隙樹脂部とから成ることを特徴とする請求
項1記載の端子のインサート成形品。
2. The apparatus according to claim 1, wherein said lifting prevention means comprises a plurality of resin filling holes formed around said welding surface, and a gap resin portion filled in said resin filling hole. Insert molded products for terminals.
【請求項3】 前記樹脂充填孔が、前記溶着面側を上面
として断面逆截頭錐体状であることを特徴とする請求項
2記載の端子のインサート成形品。
3. The terminal insert-molded product according to claim 2, wherein said resin-filled hole has an inverted truncated pyramid shape in cross section with said welding surface side as an upper surface.
JP11056585A 1999-03-04 1999-03-04 Insert mold terminal Withdrawn JP2000251997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11056585A JP2000251997A (en) 1999-03-04 1999-03-04 Insert mold terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11056585A JP2000251997A (en) 1999-03-04 1999-03-04 Insert mold terminal

Publications (1)

Publication Number Publication Date
JP2000251997A true JP2000251997A (en) 2000-09-14

Family

ID=13031267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11056585A Withdrawn JP2000251997A (en) 1999-03-04 1999-03-04 Insert mold terminal

Country Status (1)

Country Link
JP (1) JP2000251997A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234467A (en) * 2006-03-02 2007-09-13 Yazaki Corp Terminal press-fit support structure of connector
JP2017520091A (en) * 2014-06-24 2017-07-20 周賢 蔡 Electric connector
CN113381227A (en) * 2020-02-25 2021-09-10 群光电能科技股份有限公司 Connector with a locking member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234467A (en) * 2006-03-02 2007-09-13 Yazaki Corp Terminal press-fit support structure of connector
JP2017520091A (en) * 2014-06-24 2017-07-20 周賢 蔡 Electric connector
CN113381227A (en) * 2020-02-25 2021-09-10 群光电能科技股份有限公司 Connector with a locking member

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Effective date: 20060509