JP2000251802A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize a length of the lead-out wiring part of a line direction or a row direction in an image display device, in which a plurality of surface conduction type emission elements are arranged so as to reduce the peripheral parts of the image display part as narrow as possible. SOLUTION: An image display device has an element substrate 1, in which m×n surface conduction type electron emission elements are connected by line direction wiring and row direction wiring to form a simple matrix structure, and a fluorescent screen, in which a phosphor and an anode electrode in a plane opposed to each the electron emission element are disposed at positions opposite to the element substrate 1. In the device, lead-out wiring lengths of a line direction wiring side and a row direction wiring side are obtained on the basis of an arranged position of a getter member 6 that is formed on a pixel area peripheral part, and a frame member width 12 used in vacuum sealing between the fluorescent screen and the element substrate 1, and a printing angle θ at the matrix printing wiring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an image display device using a surface conduction electron-emitting device as an electron beam source and arranging a plurality of these in a two-dimensional plane.

[0002]

2. Description of the Related Art Conventionally, two types of electron emitting devices, a hot cathode device and a cold cathode device, are known. Among them, cold cathode devices include, for example, a surface conduction electron-emitting device, a field emission device (hereinafter, referred to as “FE type”), and a metal / insulating layer / metal type emission device (hereinafter, “MIM type”). Write.)
Etc. are known.

As a surface conduction electron-emitting device, for example, M.S. I Elinson, Radio Eng. E
electron Phys. , 10, 1290, (19
65) and other examples described later.

The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows in a thin film having a small area formed on a substrate in parallel with the film surface. As the surface conduction electron-emitting device, in addition to the use of a thin film of SnO ₂ according to the Ellingson, etc., by an Au thin film [G. Dittmer: "Thin SolidF
ilms ", 9,317 (1972)] and In ₂ O ₃ /
According to SnO ₂ thin film [M. Hartwell an
d C.I. G. FIG. Fonstad: "IEEETrans.
ED Conf. , 519 (1975)] and those using carbon thin films [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1
No. 22 (1983)].

[0005] As a typical example of the device configuration of these surface conduction electron-emitting devices, FIG. Hartwe
11 shows a plan view of the device according to II. In FIG.
Reference numeral 01 denotes a substrate, and reference numeral 3004 denotes a conductive thin film made of a metal oxide formed by sputtering. The conductive thin film 3004 is formed in an H-shaped planar shape as shown. An electron emission portion 3005 is formed by performing an energization process called energization forming described later on the conductive thin film 3004. The distance L between the device electrodes in the figure is 0.5 to 1 mm,
W is set at 0.1 mm. In addition, for convenience of illustration, the electron emitting portion 3005 is shown in a rectangular shape at the center of the conductive thin film 3004, but this is a schematic one, and the position and shape of the actual electron emitting portion are faithfully represented. Not necessarily.

[0006] M. In the above-described surface conduction type electron-emitting device including the device by Hartwell et al., The conductive thin film 3004 is subjected to an energization process called energization forming before the electron emission, so that the electron emission portion 30 is formed.
05 was common. That is, the energization forming is to apply a constant DC voltage to both ends of the conductive thin film 3004, or to apply a DC voltage that increases at a very slow rate of, for example, about 1 V / min, and energize the conductive thin film 3004.
The electron emitting portion 30 in a state where the conductive thin film 3004 is locally destroyed, deformed or deteriorated, and is in an electrically high resistance state.
05 is formed.

[0007] A crack is generated in a part of the conductive thin film 3004 which has been locally broken, deformed or altered. When an appropriate voltage is applied to the conductive thin film 3004 after the energization forming, electron emission is performed in the vicinity of the crack.

An example of the FE type is disclosed in, for example, W.S. P.
Dyke & W. W. Dolan, "Field emi
session ", Advance in Electro
nPhysics, 8, 89 (1956) or C.I. A. Spindt, "Physical prop
artists of thin-film fiel
de emission cathodes with
molybdenium cones ", J. App.
l. Phys. , 47, 5248 (1976).

As a typical example of the FE type device configuration, FIG. A. 1 shows a cross-sectional view of an element according to Spindt or the like. In the figure, 3010 is a substrate, 3011 is an emitter wiring made of a conductive material, 3012 is an emitter cone, 3013 is an insulating layer, and 3014 is a gate electrode. This device comprises an emitter cone 3012 and a gate electrode 3
By applying an appropriate voltage during 014, field emission is caused from the tip of the emitter cone 3012.

FIG. 5 shows another element structure of the FE type.
There is also an example in which an emitter and a gate electrode are arranged on a substrate almost in parallel with the substrate plane instead of the laminated structure as described above.

As an example of the MIM type, for example,
C. A. Mead, “Operat-ion of
unnel-emission Devices, J. et al.
Appl Phys. , 32, 646 (1961).

FIG. 6 shows a typical example of the MIM type element configuration. The figure is a cross-sectional view, in which 3020 is a substrate, 3021 is a lower electrode made of metal, 3022 is a thin insulating layer having a thickness of about 100 °, and 3023 is a thickness of 80 to 30.
The upper electrode is made of a metal of about 0 °.

In the MIM type, electrons are emitted from the surface of the upper electrode 3023 by applying an appropriate voltage between the upper electrode 3023 and the lower electrode 3021.

The above-described cold cathode device can obtain electrons at a lower temperature than the hot cathode device, and thus does not require a heater for heating. Therefore, the structure is simpler than that of the hot cathode element, and a fine element can be produced. Further, even when a large number of elements are arranged on a substrate at a high density, problems such as thermal melting of the substrate hardly occur. Also, unlike the hot cathode element, which operates by heating the heater, the response speed is slow, and the cold cathode element has the advantage that the response speed is fast.

For this reason, research for applying the cold cathode device has been actively conducted. For example, a surface conduction electron-emitting device has the advantage that a large number of devices can be formed over a large area because it has a particularly simple structure and is easy to manufacture among cold cathode devices. Therefore, as disclosed in Japanese Patent Application Laid-Open No. 64-31332 by the present applicant, a method for arranging and driving a large number of elements has been studied.

As for applications of the surface conduction electron-emitting device, for example, image forming apparatuses such as image display apparatuses and image recording apparatuses, and charged beam sources have been studied.

Particularly, as an application to an image display device, for example, US Pat. No. 5,066,883, Japanese Patent Application Laid-Open No. 2-257551 and Japanese Patent Application Laid-Open No. 4-28137 by the present applicant.
As disclosed in Japanese Unexamined Patent Publication, an image display device using a combination of a surface conduction electron-emitting device and a phosphor that emits light by irradiation with an electron beam has been studied.

An image display device using a combination of a surface conduction electron-emitting device and a phosphor is expected to have better characteristics than other conventional image display devices. For example, compared to a liquid crystal display device that has become widespread in recent years, it can be said that it is superior in that it does not require a backlight because it is a self-luminous type and that it has a wide viewing angle.

A method of driving a large number of FE types is disclosed in US Pat. No. 4,904,8 by the present applicant.
No. 95. Further, as an example in which the FE type is applied to an image display device, for example, R.F. A flat panel display reported by Meyer et al. Is known.

[R. Meyer: "Recent De
development on Mic-rotics D
display at LETI ", Tech. Dige
stof 4th Int. Vacuum Micr
oeletronicsConf. , Nagaham
a, pp. 6-9 (1991)]

An example in which a number of MIM types are arranged and applied to an image display device is disclosed in, for example, Japanese Patent Application Laid-Open No.
No. 5,557,838.

Among the image forming apparatuses using the above-described electron-emitting devices, a flat display device having a small depth has been noticed as a replacement for a cathode ray tube display device because of its space saving and light weight. I have.

FIG. 7 is a perspective view showing an example of a display panel portion forming a flat-panel type image display device, in which a part of the panel is cut away to show the internal structure.

In the figure, 3115 is a rear plate, 3116
Denotes a side wall, 3117 denotes a face plate, and a rear plate 3115, a side wall 3116, and a face plate 3
117 forms an envelope (airtight container) for maintaining the inside of the display panel in a vacuum.

A substrate 3111 is fixed to the rear plate 3115. On this substrate 3111, n × m surface conduction electron-emitting devices 3112 are formed (n, m).
m is a positive integer of 2 or more, and is appropriately set according to the target number of display pixels. ).

The n × m surface conduction electron-emitting devices 3
Reference numeral 112 denotes m row-direction wirings 311 as shown in FIG.
3 and n column-directional wirings 3114.
The substrate 3111 and the surface conduction electron-emitting device 311
2. The part constituted by the row direction wiring 3113 and the column direction wiring 3114 is called a multi-electron beam source. An insulating layer (not shown) is formed at least at a portion where the row wiring 3113 and the column wiring 3114 intersect, so that electrical insulation is maintained.

On the lower surface of the face plate 3117, a phosphor film 3118 made of a phosphor is formed, and phosphors (not shown) of three primary colors of red (R), green (G), and blue (B) are applied. Divided. A black body (not shown) is provided between the respective color phosphors forming the fluorescent film 3118, and a metal back 3119 made of Al or the like is formed on the surface of the fluorescent film 3118 on the rear plate 3115 side. I have.

Dx1 to Dxm, Dy1 to Dyn and Hv are electric connection terminals having an airtight structure provided for electrically connecting the display panel to an electric circuit (not shown).

Dx1 to Dxm are the row wirings 3113 of the multiple electron beam source, Dy1 to Dyn are the column wirings 3114 of the multi electron beam source, and Hv is the metal back 311.
9 respectively.

The inside of the airtight container is 10 ^-6 Torr.
The vacuum is maintained at about r, and as the area of the image display device increases, means for preventing deformation or destruction of the rear plate 3115 and the face plate 3117 due to a pressure difference between the inside and the outside of the airtight container is required. The method of increasing the thickness of the rear plate 3115 and the face plate 3116 not only increases the weight of the image display device, but also causes image distortion and parallax when viewed from an oblique direction.

On the other hand, in FIG. 7, a structural support (called a spacer or a rib, not shown in FIG. 7) made of a relatively thin glass plate and supporting the atmospheric pressure is provided. The space between the substrate 3111 on which the multi-beam electron source is formed and the face plate 3116 on which the fluorescent film 3118 is formed is usually kept at a sub-millimeter to several millimeters. I have.

[0032]

In the image display apparatus described above, when an image is actually displayed, a scanning drive circuit for sequentially scanning Dx1 to Dxm of the row direction wiring 3113 and a scanning drive circuit of the column direction wiring side 3114 are provided. A modulation signal circuit that is a video signal is connected to Dy1 to Dyn.

However, in recent years, as image display has become larger and flatter, a technique of using a flexible cable to connect the display circuit to each of the wirings in the row direction and the column direction has become common. And mounted on the wiring on a flexible cable. These techniques have been used as techniques necessary for cost reduction and flattening due to a reduction in the number of circuit components with the progress of IC technology.

Therefore, in order to carry out the above-mentioned method using the flexible cable, it is necessary to provide lead-out wiring for pressure contact with the flexible cable in each of the row direction wiring and the column direction wiring. Further, as described above, with the increase in the size of the image display device, in the formation of the row direction wiring 3113 and the column direction wiring 3114, the wiring formation by the screen printing method occupies the mainstream.

Printed wiring is one of the techniques used in the formation of wiring by the usual photolithography technique because there is a limit to the enlargement of the substrate. Thus, the wiring line is formed simultaneously with the row direction wiring and the column direction wiring by printing.

Also in the image display method using the surface conduction electron-emitting device, the wiring is formed by the take-out wiring by the printed wiring as described above, and is connected to the display circuit system by mounting with a flexible cable.

When an image is displayed by the surface conduction electron-emitting device, a row current value flowing per one row-direction wiring 3113 in the case of driving by sequentially scanning Dx1 to Dxm on the row-direction wiring side 3113 is shown. When estimated, a current value corresponding to several A flows. This is because the number of the surface conduction electron-emitting devices 3112 connected on the row direction wiring 3113 is equal to the number of the column direction wirings, and thus, for example, the current value flowing into the one surface conduction electron-emitting device 3112 is 1 mA, Even when the number Dy1 to Dyn of all the wirings in the column direction is 1000, a calculation of a current of 1 A flows.

Considering that the above values tend to increase with the size of the panel in the future, the wiring resistance value of the lead-out wiring portion in the row and column directions is made as low as possible, and the voltage effect of the lead-out wiring portion is reduced. Must be minimized. If the voltage drop of the extraction wiring is large, it becomes impossible to apply a desired voltage value to the surface conduction type element 3112. Furthermore, in order to take the above measures, it is necessary to output a voltage value in consideration of the voltage drop of the extraction wiring on the display circuit side in order to secure a drive voltage value, as a drive voltage value. Power loss and downsizing of the driving circuit.

On the other hand, it is conceivable to reduce the length of the wiring to reduce the wiring resistance of the extraction wiring. However, the length of the wiring is limited to some extent by the printed wiring. The reason is that the angle at which printing can be performed normally with respect to the printing direction is restricted by the wiring pitch in the printed wiring, so in a wiring pattern having an angle of a certain degree or more, blurring of the printed wiring occurs and large currents are generated. If it flows, there is a risk of disconnection. Accordingly, in consideration of an increase in the current value, it is desirable that the row wiring 3113 is formed at an angle at which the wiring shape can be properly formed in the printed wiring. In addition, it is necessary to consider creeping discharge even for a high voltage applied to the face plate side.

In view of the above problems, it is an object of the present invention to optimize the length of a lead-out wiring portion in a row direction or a column direction in an image display device in which a large number of surface conduction emission devices are arranged, It is to provide what is as narrow as possible.

[0041]

In order to achieve the above object, an image display apparatus according to the present invention comprises a m × n surface conduction electron-emitting device having a simple matrix structure formed by row and column wirings. In an image display apparatus having a connected element substrate and a fluorescent plate in which phosphors and anode electrodes opposed to the respective electron-emitting devices are arranged in a position facing the element substrate in a row direction and a column direction, The length of the lead-out wiring on the side is determined by the arrangement position of the getter member formed in the periphery of the pixel region, the width of the frame member for vacuum sealing the fluorescent plate and the element substrate, and the maximum printing angle at the time of printed wiring. .

In the present invention, when determining the length of the extraction wiring when displaying an image on the image display device,
Lead wire that takes into account the distance to avoid creeping discharge from the fluorescent plate to which a high voltage is applied, the optimum value of the frame member width for performing vacuum sealing between the fluorescent plate and the element substrate, and the printing angle when performing the printed wiring Based on the length and the like, it is possible to calculate the length of the extraction wiring portion with an optimum value. Therefore, even if the size of the display panel is increased or the number of wirings is increased, a panel corresponding to a narrower frame can be realized.

[0043]

FIG. 1 is a plan view of a part of a panel before mounting a flexible cable in order to specifically explain the length of a lead-out wiring portion in an image display device of the present invention. FIG.

In FIG. 1, reference numeral 1 denotes an element substrate on which surface conduction electron-emitting devices of an image display device and wirings in the row and column directions are formed by printed wiring, and 2 denotes a position facing the element substrate 1. A face plate in which phosphors and anode electrodes are arranged on a plane, 3 is a pixel section in which surface conduction electron-emitting devices are arranged at intersections on matrix wiring, and 4 is a plurality of column-directional wirings Of the block in the column direction, which is printed and arranged to be pressed into contact with a flexible cable (not shown) by dividing the block into 5 blocks; (Not shown) is a block of lead-out wiring arranged for printing and contacting, 6 is a getter member for adsorbing gas released from the pixel portion when an image is displayed, and 7 is a face Shows a frame used the rate and the element substrate 1 to the vacuum sealing.

Next, L indicates the length of the lead-out wiring determined in the present embodiment, 11 indicates the distance from the pixel section 3 to the getter 6 arranged in consideration of the creeping discharge, and 12 indicates the vacuum sealing. The outer shape of the face plate 2 corresponds to the outer shape of the face plate 2 with the width of the frame configured to perform the stop.

Reference numeral 13 denotes a length of a flexible joint for press-fitting a flexible cable, 14 denotes a distance from an outer portion of the element substrate to printed wiring, and 15 denotes a distance when printed wiring is performed on the element substrate. This is a length determined from the printing angle, the length 17 in one block when the takeout wiring is divided into a plurality of blocks, and the clearance amount 16 between the blocks.

In optimizing the lead-out wiring length according to the present invention, in the present embodiment, the lead-out wiring lengths on the row direction wiring side and the column direction wiring side are made the same. The reason for this is that by making the width from the pixel portion 3 to the element substrate 1 the same, the panel assembly members and the like after mounting the flexible cable can be configured with the same specifications, leading to a reduction in cost and the like. Therefore, the description of the extraction wiring length will be made on the column wiring side.

The lengths of the lead-out wirings on the row-direction wiring side and the column-direction wiring side are not limited to the same length, but may be changed depending on the design of the panel.

Next, the determination of the length L of the lead-out line will be described in detail. The wiring length L is determined by 11 to 17. First, 11 is the distance from the pixel unit 3 to the getter 6 as described above. The getter 6 is a member for adsorbing a gas emitted from the pixel portion when an image is displayed. The getter 6 emits light from a surface conduction electron-emitting device to the phosphor of the face plate 2 when the display is driven. The gas generated when electrons collide is adsorbed, and a constant degree of vacuum (about 10E-5 Torr) is always maintained in the panel.

The getter member is generally made of a metal material or the like, and has, for example, a wire-like shape arranged on the lead-out wiring on the element substrate 1 and in the space of the face plate 2. As a problem with the arrangement of the metal member in the panel, there is a creeping discharge with a high voltage (anode voltage) applied to the face plate 2. The creeping discharge is more likely to occur as the getter member is closer to the pixel portion 3 and depends on the anode voltage value. Therefore, in order to avoid the creeping discharge at least, it is necessary to provide a certain distance from the pixel unit 3. In the present embodiment, 11 is a value experimentally confirmed, and it is assumed that the distance is at least 4 mm or more (anode voltage: 12 kV).

Next, the width of the frame is 12. First, the frame 7 used for vacuum-sealing the face plate and the element substrate 1 will be described. The frame 7 has a purpose of preventing a slow leak from the outside (in the air) with respect to the degree of vacuum in the panel, and a deformation due to thermal stress of the panel during heat treatment during baking or the like performed during the panel manufacturing process. This is to prevent it. As the frame member, an adhesive material is mainly used.

It is considered that the slow leak is caused by the interface between the face plate 2 and the adhesive, and the width of the frame portion for avoiding the slow leak is about 3 mm to 10 m.
It has been found necessary to have a width of the order of m. Therefore, in the present embodiment, the width 12 of the frame 7 is set to at least 5 mm in consideration of prevention of deformation due to thermal stress.

Next, the joint 13 with the flexible cable will be described. The contact resistance with the flexible cable becomes important for the flexible joint for connecting the display device to an external display circuit. In particular, a current value of several A flows on the row direction wiring side because a plurality of surface conduction electron-emitting devices are connected. Therefore, the contact position is deviated due to the misalignment between the take-out wiring and the flexible cable, and the contact resistance becomes unstable. Also, if the contact resistance becomes high, there is a problem of disconnection or voltage drop at the contact part. Otherwise, the image quality is degraded and line defects are exerted on the display drive. As a method of eliminating the above problems and improving reliability, in the present embodiment, contact with a flexible cable is performed using a technique such as ACF (anisotropic conductive film).

Further, in the present embodiment, a process using a probe or the like in the panel manufacturing process can be applied to the flexible joint 13. For example, at the time of completion of the manufacturing process in the form of FIG. 1, when checking for a short between adjacent wirings in a row and a column, a contact needle such as a probe is contacted to any position on the flexible joint. Measurement can be performed. As described above, the flexible joint portion 13 was set to 5 mm including the contact stability with the flexible cable and the contact portion for checking in other processes.

Reference numeral 14 denotes a clearance amount where the printed wiring is formed from the outer portion of the element substrate, which is determined by the printing apparatus, and is 2 mm in the present embodiment.

Next, as described above, 15 is determined by the length 17 in one block of the extraction wiring, the clearance 16 between the blocks, and the printing angle θ in the printing direction in the printing wiring. To explain these concretely, FIG.
Is used. FIG. 2A is an enlarged view of a part of the panel of FIG. 1 with respect to the column-direction wiring portion, and particularly shows a state in which the flexible cable is mounted at the extraction wiring 4 in the column direction. In addition, in order to make the description easy to understand, the mounting diagram of the flexible cable is omitted for the two blocks of the left outgoing wiring, and FIG. 2B shows an enlarged view of the clearance between the two blocks.

Further, a flexible joint in the case of 19> 18 is shown. Reference numerals 1 and 4 denote the lead wires of the element substrate and the column wiring described in FIG. 1, 8 denotes a flexible cable corresponding to one block of the lead wiring, 18 denotes the total length of the pixel portion in the column direction, and 19 denotes a flexible member in the column direction. Total joint length, 110
Is the length on one side when the 19 flexible junctions protrude from the length of the 18 pixel sections.

Reference numeral 111 denotes the amount of protrusion on one side when the flexible cable 8 is pressed against the lead-out wiring 4 after being positioned with respect to the lead-out wiring 4 by using the alignment mark 9, and in this embodiment, 111 = 2.5 mm.

Reference numeral 112 denotes a margin amount of the flexible cable pressed between the blocks. The margin amount is determined by a device when the flexible cable is mounted, and is required to be about several mm. 112 = 3mm
Set as above.

Normally, when wiring is connected by a flexible cable, the flexible connection generally has a wiring pitch smaller than a wiring pitch in a pixel to increase the mounting density. In addition, the total length 19 of the flexible joint is the clearance 1 of the flexible cable between the flexible joint and the block.
6 in a display device such as a high-definition XGA, and becomes 1> 18 when the number of pixels is relatively small.
In many cases, 9 <18.

Next, when a calculation for obtaining 19 is performed,
First, the pitch Bp between one block is obtained as Bp = X × P + 16 (1) when the number of wires in one block is X and the wiring pitch is P 2. The total number of blocks Bn at this time is obtained as follows: Bn = Dyn / X (2) From Expressions (1) and (2), 19 is obtained by 19 = Bn × Bp (the number of blocks × the pitch between blocks).

Next, the calculation for obtaining 18 is based on the pixel pitch Pn in the pixel portion 3 and the number Dyn of wirings in the column direction.
= Pn × Dyn.

Next, 110 is 1 by the above calculation.
10 = 19−18 / 2. When the value 110 is positive, both ends of the flexible junction protrude from the pixel unit 3, and when the value 110 is negative, both ends of the flexible junction are disposed in the pixel unit 3.

Normally, the wiring pitch P between the blocks is formed with higher definition than the pitch Pn within the pixel.
By increasing the length 17 of the flexible press-contact portion, it is possible to make the lengths 18 and 19 substantially the same or less. Actually, the pitch accuracy of the flexible cable, the alignment accuracy at the time of pressure welding of the flexible cable, the problem of the device that performs the pressure welding, and the limitation of the number of pins of the connector etc. used when connecting the flexible cable to the display circuit system Considering such factors, the length of 17 is actually limited to some extent.

From the above calculation, when the value of 110 is extremely plus or minus, that is, the wiring is performed under such a condition that the total length of the flexible press-contact portion greatly differs from the length of the pixel portion 3. If the pitch is set,
Change the value of clearance 16 or the number X in one block
It is desirable to calculate the optimum value of 15 by changing the value of, and to set the difference between 18 and 19 as close as possible.

Next, 15 can be obtained from the printing angle θ in the printing direction in the printed wiring and 110 described above. The printing angle θ is determined by the angle of the mesh used at the time of printing.For example, even if an attempt is made to print a wiring pattern having an angle larger than the mesh angle, due to poor discharge or interference of the paste from the mesh. Disconnection of wiring occurs. In the present embodiment, the printing angle θ is set to about 25 degrees from the above conditions. From the above, 15 can be obtained by the following calculation.

15 = 110 / tan θ (θ = 25 degrees) (3) In the above equations (1) to (3), the number of wirings X between one block of the flexible joint and the block in the equation (1) In the formula (2), the size and the number of pixels are dominant in the number and the clearance amount 16 between the blocks. Therefore, the specifications of each image display device and the specifications of the extraction wiring portion are shown in the following table. The optimal value of 15 when changing was obtained. Although the value of 15 is calculated on the column wiring side, the same calculation is also performed on the row wiring side.

Table 1 shows the image display specifications.

[0069]

[Table 1]

Table 2 shows a 30 ″ VGA specification, in which the number of wires Dyn2560 in the pixel and the pitch Pn0.2 in the pixel are shown.
9, flexible interval 16 = 8, wiring pitch P0.
2. The printing angle θ = 25.

[0071]

[Table 2]

Table 3 shows a 30 "VGA specification, and 16 = 15 between flex.

[0073]

[Table 3]

Table 4 shows the 42 "VGA specification, in which the number of wires Dyn 4068 in the pixel and the pitch Pn 0.2 in the pixel are shown.
3, flexible interval 16 = 8, wiring pitch P0.
2. The printing angle θ = 25.

[0075]

[Table 4]

Table 5 shows the 42 "VGA specification, and 16 = 15 between flex.

[0077]

[Table 5]

Table 6 shows the 60 ″ HD specification, in which the number of wires Dyn5760 in the pixel, the pitch Pn0.23 in the pixel,
Flexible interval 16 = 8, wiring pitch P0.2 in the block, and printing angle θ = 25.

[0079]

[Table 6]

Table 7 shows the 60 "HD specification, and the flexible interval is 16 = 15.

[0081]

[Table 7]

The above table shows that 30 inches, 42 inches, 6 inches
When the clearance 16 between the flexible joints is set to 8 mm or 15 mm with respect to the image display size at 0 inch, 1
5 was obtained.

When 15 is actually determined from the above table, for example, in view of the HD specification of 60 ″, the clearance 1
When 6 is set to 8 mm and the number of blocks between blocks is set to 320, 15 becomes 30 mm, which is the smallest. Conversely, in the case of 30 "VGA, the clearance 16
Is set to 15 mm, and when the number of blocks between blocks is set to 160, 15 becomes 11 mm, which is a minimum value.

As described above, it is possible to calculate the case where the number of blocks between blocks in the flexible hometown is changed for each image display size, and to set an optimum value of 15. In addition, 1
The number of wires between blocks is not limited to the above value, and may be changed as needed. Further, the reason why 15 indicates a negative value is that the total length of the flexible junction is shorter than the total length of the pixel portion 3, and there is no particular problem in determining 15.

Next, the sum of the creepage distance 11 and the frame 12 (11 = 4 mm, 11 + 12 = 9 m for 12 = 5 mm)
m) and the determined 15 are compared. That is, in the present embodiment, the creepage distance 11 for arranging the getter 6 and the frame 12 provided on the face plate are required at a minimum with respect to the optimum value 15 obtained from each of the above tables. Therefore, when the value of 15 is 9 mm or less, that is, 1
In the case of 1 + 12> 15, the value becomes 11 + 12 instead of 15, and in the case of 11 + 12 <15, 15 is a value for determining the take-out wiring length L value. Also, 11 + 12> l
When it becomes 5, twelve frames may be installed in the immediate vicinity of the creepage distance 11. Then, the value of 15 or 11 + 12 determined as described above is added to 13 and 14, and the extraction wiring length L is obtained.

As described above, in the first embodiment, the optimum value in the case where the distance L of the number of extraction wirings is constituted by the getter section 6 and the frame 7 of the face plate section is shown. As a result, it has become possible to realize a panel aiming at narrowing the frame of the image display panel.

FIG. 3 shows a second embodiment. The second embodiment is largely different from the first embodiment in that the getter 6 is eliminated and the getter is formed on the matrix wiring in the pixel portion 3. The getter in the matrix is
As in the first embodiment, a non-evaporable getter material is used as a member for adsorbing the gas released from the pixel portion when displaying an image. In FIG.
1, 2, 3, 4, 5, 7, and 12, 13, 14, 15
Is the same as in the first embodiment, and a description thereof will be omitted.

Numeral 11 denotes a distance from the pixel portion 3 when the face plate frame 7 is formed, similar to 11 in FIG. 1, and is a distance for avoiding creeping discharge with a high voltage (anode voltage). = 4 mm.

The length L of the extracted wiring is determined by how the value of the wiring length 15 is set in the same manner as in the first embodiment. As shown in the first embodiment, reference numeral 15 is determined by the flexible connection portion 17 of the lead-out wiring and the clearance 16 between one block and the like, and all the formulas for obtaining the lead-out wiring are the same as in the first embodiment In the second embodiment as well, the value of 15 may be determined based on the table shown in the first embodiment. The angle θ of the printed wiring may be the same as in the first embodiment.

Next, the sum of the creepage distance 11 and the frame 12 (11 = 4 mm, 12 + 5 mm and 11 + 12 = 9 m)
m) and the determined 15 are compared. That is, for the same reason as in the first embodiment, 11 + 12
In the case of> 15, a value of 11 + 12 is determined instead of 15, and in the case of 11 + 12 <15, 15 is a value that determines the take-out wiring length L value. Then, the value of 15 or 11 + 12 determined as described above is added to 13 and 14, and the extraction wiring length L is obtained. Also in the second embodiment, when determining the extraction wiring L, 11 + 1
A minimum value of 2 is required.

As described above, the optimum value when the distance L of the number of extracted wirings is constituted by the frame 7 of the face plate portion is shown. As a result, it has become possible to realize a panel aiming at narrowing the frame of the image display panel.

[0092]

As described above, according to the present invention, in determining the length of the lead-out wiring when displaying an image on the image display device, the length of the lead-out wiring part must be set according to some setting conditions. And it can be calculated as follows. Therefore, even when the size of the display panel is increased and the number of wirings is increased, a panel corresponding to a narrower frame of the image display device can be realized. In addition, the panel can be weighed by narrowing the frame.

[Brief description of the drawings]

FIG. 1 is a plan view showing an image display device for explaining a first embodiment.

FIG. 2 is a plan view showing a lead-out wiring section for explaining a second embodiment.

FIG. 3 is a plan view showing an image display device for explaining a third embodiment.

FIG. 4 is a schematic view showing one configuration example of a conventional surface conduction electron-emitting device.

FIG. 5 is a schematic view showing a configuration example of a conventional FE element.

FIG. 6 is a schematic view showing a configuration example of a conventional MIM element.

FIG. 7 is a schematic diagram showing a flat-panel image display device using a conventional surface conduction electron-emitting device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Element board 2 Face plate 3 Pixel part 4 Extraction wiring 5 Extraction wiring 6 Getter member 7 Frame 8 Flexible cable 9 Alignment mark 11 Creepage distance 12 Frame width 13 Flexible joint length 14 From element substrate outer part to printed wiring 15 The length determined from the print angle θ, the length 17 of the extracted wiring in the divided block, and the clearance 16 between the blocks 16 Clearance amount 17 The length of the extracted wiring in the divided block 18 The pixel portion Total length in column direction

Claims (5)

[Claims] 1. An element substrate in which m × n surface conduction electron-emitting devices are connected in a simple matrix structure by row-direction wiring and column-direction wiring, and oppose each electron-emitting device at a position opposing the element substrate. In an image display device including a phosphor and a phosphor plate in which anode electrodes are arranged in a plane, the length of the lead-out wiring on the row-direction wiring side and the column-direction wiring side is as follows:
An arrangement position of a getter member formed around the pixel area;
An image display device, which is determined by a frame member width provided for vacuum sealing of a fluorescent plate and an element substrate and a printing angle at the time of matrix printed wiring. 2. The device according to claim 1, wherein the length of the lead-out wiring is at least both a position where a getter member is arranged from a pixel portion and a width of a frame member provided in the vacuum sealing. The image display device as described in the above. 3. The image forming apparatus according to claim 1, wherein the position of the getter member formed around the image display area is at least 4 mm from the image display area. Image display device. 4. The image display device according to claim 1, wherein a width of a frame member for vacuum sealing the fluorescent plate and the element substrate is at least 5 mm or more. 5. The image display according to claim 1, wherein only a wiring having a printing angle of 25 degrees or less with respect to a printing wiring direction at the time of the matrix printing wiring can be printed. apparatus.