JP2000251707A - Spacer for electron beam device, its manufacture, and electron beam device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a good display image by adhering a film onto the surface of a substrate for forming a spacer, and forming the spacer having projections and recesses on the surface. SOLUTION: A substrate 1011 on which row-direction wiring 1013, column- direction wiring 1014, an inter-electrode insulating layer, an element electrode of a surface-conductive emission element and a conductive thin film are formed is fixed to a rear plate 1015. Structure supports 1020 are fixed onto the row- direction wirings 1013 on the substrate 1011, at equal intervals and in parallel with the row-direction wirings 1013. A face plate 1017 having a fluorescent film 1018 and a metal back 1019 on the inner surface is placed at 5 mm over the substrate 1011 via a side wall 1016, respective joint portions of the rear plate 1015, the face plate 1017, the side wall 1016, and the structure supports 1020 are fixed. A joint portion between the substrate 1011 and the rear plate 1015, a joint portion between the rear plate 1015 and the side wall 1016, and a joint portion between the face plate 1017 and the side wall 1016 are coated with flit glass, and are baked and sealed in atmosphere, at 400 deg.C or 500 deg.C, for 10 minutes or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an unevenness on a spacer and a method for forming the same, and an image display device using the spacer having the unevenness.

[0002]

2. Description of the Related Art Conventionally, two types of electron emitting devices, a hot cathode device and a cold cathode device, are known.

[0003] Among them, a cold cathode device is, for example, a surface conduction type emission device or a field emission type device (hereinafter referred to as FE type).
And a metal / insulating layer / metal type emission element (hereinafter referred to as MIM type).

As a surface conduction type emission element, for example,
M. I. Elinson, Radio Eng. El
electron Phys. , 10, 1290, (19
65) and other examples described later.

[0005] The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows in a small-area thin film formed on a substrate in parallel with the film surface. As this surface conduction type emission element, Sn described by Elinson et al.
In addition to those using the O ₂ thin film, those using the Au thin film [G. Dittmer: "Thin Solid Fi
lms ", 9,317 (1972)] and In ₂ O ₃ / S
nO ₂ thin film [M. Hartwell and
C. G. FIG. Fonstad: "IEEE Trans.
ED Conf. , 519 (1975)] and those using carbon thin films [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1
No. 22 (1983)].

[0006] Among the image forming apparatuses using the above-mentioned electron-emitting devices, a flat display device having a small depth has attracted attention as a replacement for a cathode ray tube display device because of its space saving and light weight. .

FIG. 1 is a perspective view showing an example of a display panel portion forming a flat-panel image display device, in which a part of the panel is cut away to show the internal structure. In the figure, 311
5 is a rear plate, 3116 is a side wall, 3117 is a face plate, and a rear plate 3115, a side wall 311
6 and the face plate 3117 form an envelope (airtight container) for maintaining the inside of the display panel at a vacuum.

A substrate 3111 is fixed to the rear plate 3115. On this substrate 3111, N × M cold cathode elements 3112 are formed. (N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels.) Further, the N × M cold cathode elements 31 are used.
12 are M row-direction wirings 3113 as shown in FIG.
And N column direction wirings 3114. These substrate 3111, cold cathode element 3112, row direction wiring 3
The portion constituted by the 113 and the column direction wiring 3114 is called a multi-electron beam source. Also, the row direction wiring 31
An insulating layer (not shown) is formed between at least the portion where the column 13 and the column-directional wiring 3114 intersect, so that electrical insulation is maintained.

On the lower surface of the face plate 3117, a phosphor film 3118 made of a phosphor is formed, and phosphors of three primary colors of red (R), green (G), and blue (B) (not shown) are applied. Divided. A black body (not shown) is provided between the phosphors of the respective colors constituting the fluorescent film 3118, and a metal back 3119 made of Al or the like is formed on the surface of the fluorescent film 3118 on the rear plate 3115 side. ing.

Dx1 to Dxm and Dy1 to Dyn and Hv are electric connection terminals having an airtight structure provided for electrically connecting the display panel to an electric circuit (not shown). Dx1 to Dxm are electrically connected to the row direction wiring 3113 of the multi-electron beam source, Dy1 to Dyn are electrically connected to the column direction wiring 3114 of the multi-electron beam source, and Hv is electrically connected to the metal back 3119.

The interior of the hermetic container is maintained at a vacuum of about 10 −6 Torr, and as the display area of the image display device increases, the rear plate 3115 due to a pressure difference between the inside and the outside of the hermetic container. Further, means for preventing deformation or destruction of the face plate 3117 is required. The method of increasing the thickness of the rear plate 3115 and the face plate 3116 not only increases the weight of the image display device, but also causes image distortion and parallax when viewed from an oblique direction. On the other hand, in FIG. 1, a structural support (referred to as a spacer or a rib, hereinafter referred to as a spacer in the present application) 3120 made of a relatively thin glass plate and supporting the atmospheric pressure is provided. In this way, the distance between the substrate 3111 on which the multi-beam electron source is formed and the face plate 3116 on which the fluorescent film 3118 is formed is usually kept at a sub-millimeter to several millimeters, and the inside of the airtight container is kept at a high vacuum as described above. ing.

In the image display apparatus using the above-described display panel, when a voltage is applied to each cold cathode element 3112 through terminals Dx1 to Dxm and Dy1 to Dyn outside the container, electrons are emitted from each cold cathode element 3112. At the same time, a high voltage of several hundred [V] to several [kV] is applied to the metal back 3119 through the external terminal Hv to accelerate the emitted electrons and cause them to collide with the inner surface of the face plate 3117. As a result, the phosphors of each color forming the fluorescent film 3118 are excited and emit light, and an image is displayed.

[0013]

The display panel of the image display device described above has the following problems.

First, there is a possibility that spacer charging may be caused by a part of the electrons emitted from the vicinity of the spacer 3120 hitting the spacer 3120 or by ionization of the ions by the action of the emitted electrons to adhere to the spacer. is there. The electrons emitted from the cold cathode element 3112 due to the charging of the spacer are bent in their trajectories, reach a position different from the normal position on the phosphor, and the image near the spacer is distorted and displayed.

Second, in order to accelerate electrons emitted from the cold cathode device 3112, a high voltage of several hundred V or more (ie, 1 kV) is applied between the multi-beam electron source and the face plate 3117.
V / mm or more), the spacer 3
There is a concern about creeping discharge on the surface of the H.120. In particular, when the spacer is charged as described above, discharge may be induced.

In order to solve this problem, it has been proposed to remove a charge by causing a small current to flow through the spacer (Japanese Patent Laid-Open Nos. 57-118355 and 61-124031). Here, a high-resistance thin film having appropriate conductivity is formed on the surface of the insulating spacer so that a minute current flows on the surface of the spacer. The high resistance film used here is tin oxide or a mixed crystal thin film of tin oxide and indium oxide or a metal film. However, with only this high resistance film, the antistatic ability may be insufficient when the electron emission amount is large.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the conventional spacer, and a spacer capable of obtaining a good display image without discharge during image display without charge is provided simply and at low cost. It is an object of the present invention to provide a manufacturing method.

[0018]

According to the present invention, there is provided a rear plate provided with an electron source having a plurality of electron-emitting devices, a face plate provided opposite to the rear plate,
What is claimed is: 1. A method of manufacturing a spacer for use in an electron beam apparatus, comprising: a spacer disposed between the rear plate and the face plate to maintain a space between the two plates. The present invention relates to a method for producing a spacer, characterized in that a spacer having irregularities on the surface is formed by a step of attaching a film to the surface of the spacer.

According to the study of the present inventor, the effective secondary electron emission coefficient of the uneven surface is smaller than that of the smooth surface. By forming irregularities on the spacer surface, for example, in addition to an antistatic effect by a high-resistance thin film or the like, it is possible to further suppress the charging of the spacer surface.

In the present invention, the use of the film has the advantage that the design width is wide, such as the shape of the unevenness, the density of the unevenness, the anisotropy of the unevenness, and the change in the unevenness shape depending on the spacer portion.

When a conductive material is mixed with the film material, the surface of the concavo-convex surface can be made conductive, so that it is not necessary to separately form a high-resistance film on the surface to prevent charging. Therefore, the manufacturing cost can be reduced.

Further, even when the conductive material is not mixed,
The film is formed not on the spacer substrate but directly on the surface of the film (when the base material of the film remains) or other material (when the base material of the film does not remain) after the unevenness is formed. The width of the material of the high-resistance film layer can be increased.

The spacer manufactured by the present invention is suitably used for a flat display device (electron beam device).
As shown in FIG. 1 (which will be described in detail later), a spacer 1020 formed of a substrate 1011 on which a plurality of cold cathode elements 1012 are formed and a transparent face plate 1017 on which a fluorescent film 1018 as a light emitting material is formed by the present invention. Can be configured to face each other.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION
For example, as shown by reference numeral 1020 in FIG. 2, the shape is a flat plate type, a cylindrical type, or the like, and at least the side surface of the spacer, that is, the surface not in contact with the rear plate or the face plate is provided with irregularities. At this time, the electrode may be provided only in a portion having a high probability of being hit by electrons, or may be provided on the entire side surface.

The film used in the present invention is not limited as long as it has flexibility and is suitable for the following purposes, but is generally a polymer resin as a base material. Hereinafter, the case of a polymer resin will be described, but the film used in the present invention is formed of a polymer resin as a base material alone, or an organic or inorganic particle as described below as necessary for the polymer resin. Is formed.

Before the film is pasted, a spacer substrate which has been processed into a predetermined spacer shape may be prepared in advance and a film may be pasted, or a large spacer substrate may be prepared and the film may be pasted. The spacer may be cut into a spacer shape at an appropriate time after the alignment.

In the present invention, the irregularities on the spacer surface are
When the surface roughness Ra is set to 100 ° to 100 μm, charging can be effectively prevented.

The film used in the present invention, its material,
Table 1 summarizes the characteristics of each of the manufacturing methods.

[0029]

[Table 1] The film used in the present invention is, for example, when a polymer resin is used as a base material, (i) when a film is formed of a polymer resin alone as a base material (polymer resin film), (ii) When additives such as fine particles as described later are mixed in the polymer resin as the base material, (ii)
i) When an adhering substance such as fine particles as described below is adhered to the surface of the polymer resin as the base material, (iv)
A composite form of (ii) and (iii) can be taken.

Depending on the type of the base material used, when the spacer is used, the base material of the film is divided into those that finally remain and those that do not remain. Hereinafter, each case will be described separately.

1. When the base material of the pasted film finally remains (1-1) Regarding the film If the base material of the pasted film remains, heat is applied during subsequent processes and use in an electron beam device. In addition, the base material is preferably a heat-resistant material (for example, a heat-resistant resin), and more preferably a material having high dimensional stability at high temperatures.
Examples of such a polymer resin include a polyimide resin (especially an aromatic polyimide resin), a polyamide resin (especially an aromatic polyamide resin), a cross-linked polyethylene resin, and a silicone rubber-based resin. it can. In particular, when the heat resistance temperature is 400 ° C. or higher, the coefficient of thermal expansion
Those having a value of not more than [10 ⁻⁷ / ° C.] (particularly not more than 85 [10 ⁻⁷ / ° C.]) are preferable.

Of these, polyimide resins (particularly aromatic polyamide resins) are preferred in view of heat resistance and dimensional stability. The method for producing the polyimide resin film is not particularly limited. For example, the film is obtained by applying a polyamic acid to the inner peripheral surface of a cylinder and then heating the applied polyamic acid to imidize it. Heating in this imidization can be performed by first heating at 80 to 180 ° C for 20 to 60 minutes to remove the solvent, and then heating at 250 to 400 ° C for 20 to 60 minutes. This evaporates the ring-closing water and the like generated during the imidation and completes the imidization.

The method of applying the polyamic acid is not particularly limited. In addition to the usual coating method using a doctor blade, a spinner, or the like, for example, (i) the cylinder is dipped in a polyamic acid solution and then pulled up. And (ii) a method in which a polyamic acid solution is supplied near one end of a cylinder and a bullet-shaped or spherical traveling body is caused to travel along the inner peripheral surface of the cylinder. The bullet-shaped or spherical traveling body is made of metal,
Hard plastic, those made of hard glass,
As a method of traveling, the traveling body is biased by using compressed air pressure or gas explosive force, the traveling body is pulled by using a pulling wire, etc. For example, by running the body under its own weight). In the above method (i), after applying the polyamic acid solution to the inner peripheral surface of the cylinder, a bullet-shaped or spherical traveling body may be caused to travel along the inner peripheral surface of the cylinder, if necessary.

As the polyimide resin, other than those using the above-mentioned polyamic acid as a precursor, a polyimide resin solution of a solvent-soluble type may be used to form a film by the same method as described above. .

As described above, a polyimide resin film is obtained, and the polyimide resin film is taken out of the cylinder. In this case, the polyimide resin film is preferably formed to have a thickness in the range of 10 to 100 μm.

(1-2) Regarding the method of forming unevenness The unevenness of the film surface is prepared by forming the unevenness before attaching the film by the processing method, or by forming the unevenness by processing after attaching the film. There are, for example, the following methods.

Method for forming irregularities by roughening the surface of the film by means of physical removal: For example, irregularities are formed by roughening the surface of the film using sandblasting, a file or the like. This method can be performed either before or after the film is attached. However, in general, it is more convenient to form irregularities before attaching the film and attach the film having the irregularities to the spacer substrate.

Method for forming irregularities on the film surface by physical pressing means: For example, it can be formed using a stamp roller or the like. In this case, it is easy to form stripe-shaped irregularities, and the irregularities can be formed efficiently. This method is preferably applied to a film before pasting.

A method of forming irregularities on a surface by chemically removing a specific material from a film: a polymer which is a base material is mixed in advance with fine particles which can be removed after the film is formed. The film can be made porous by dissolving (including corrosion) the fine particles and the like after the film is formed. For example, a method of mixing silica particles in a film and selectively removing a silica component with a hydrofluoric acid aqueous solution can be applied. In this method, the time of removing the material such as silica can be applied before or after the film bonding.

A method of forming a film by giving a concavo-convex shape to the surface of the film: For example, a film in which concavities and convexities are formed on the surface of a film made of a polymer resin by a printing means such as a dispenser or screen printing is used. In this method, it is generally simpler to provide unevenness before bonding.

Of the above methods, the method can easily change the shape of the unevenness depending on the location, so that more efficient unevenness can be formed. Further, it is also possible to perform a composite process such as performing the process after the process of the above.

Further, by stretching the film thus produced before laminating,
It is possible to add anisotropy to the shape and arrangement of the unevenness.
The angle of incidence of electrons incident on the spacer can be efficiently defined, and the antistatic ability can be improved. For example, when anisotropy parallel to the rear plate / face plate is introduced, the antistatic effect is improved.

(1-3) Adhesion of Film and Spacer When the base material of the film remains in the final spacer form, the adhesive also needs to have heat resistance, for example, silicone rubber, fluorine rubber, polyimide Adhesive such as can be applied. These are about 180 degrees for silicone rubber,
Polyimide-based materials can withstand long-term use up to 300 degrees.

Depending on the type of the base material, it is also possible to apply the film directly to the spacer substrate. In the present invention, the method of "applying a film" includes the case where a film is formed by applying in this manner. And

(1-4) Improvement of antistatic property By forming irregularities, it is possible to reduce the secondary electron emission coefficient. As will be described again in the section of the spacer, it is preferable to remove the charge by causing a minute current to flow on the surface of the spacer, and the following method can be applied.

Method for imparting conductivity to the film itself:
If the base material of the form has a certain degree of conductivity (high resistance) as described later, it may be left as it is, but since the polymer resin is generally insulative, a conductive material is applied to the film together with the polymer resin base material. Add and mix in For example, when polyimide is used, a conductive material such as carbon black or graphite such as furnace black, thermal black, and Ketjen black, or a conductive material such as titanium oxide and chromium 235 is dispersed and mixed with the polyamic acid in the film raw material. In addition, the film itself can be made conductive.

Method for forming a conductive substance (high resistance substance) on the outer surface of the film: As will be described again in the section of spacers in the outline of the image display apparatus, an appropriate conductive substance is vapor-deposited on the surface, sputtering, etc. Can be performed.

2. When the base material of the pasted film does not finally remain (2-1) Regarding the film: In this method, the film is simply used as a medium or a carrier, and at least the base material remains as it is by post-processing such as firing. It does not remain in form. Therefore, it is preferable that the film base material be scattered by burning, decomposition, evaporation or the like by firing or the like.

As such, as a polymer resin used as a base material of the film, polyolefin resins such as polyethylene and polypropylene, acrylic resins such as polymethyl acrylate and polymethyl methacrylate,
Other vinyl resins such as vinyl acetate and vinyl alcohol, and cellulose resins such as ethyl cellulose can be exemplified.

(2-2) Method for Producing Concavities and convexities A method for mixing a material for forming concavities and convexities together with a base material such as a polymer resin into a film: In this method, the film is simply used as a carrier, and a process such as firing is performed. This is a method in which a material that can be formed while leaving irregularities on the surface of the spacer is mixed in the polymer resin. For example, when forming a film, using an acrylic resin such as polymethyl methacrylate as a base material, dissolving a metal carboxylate such as chromium octylate and yttrium octylate in xylene, and applying it on an appropriate substrate And dried as appropriate to form a film.
When this film is attached to the spacer substrate and then fired, the acrylic resin as a binder and xylene evaporate, leaving a metal such as Cr or Y to form an uneven surface on the spacer. In this case, conductivity is further provided. In this method, a film may be formed by directly applying the film on the spacer substrate.

A method in which the adhered film serves as a base film, on which unevenness is formed: In this method, the film simply functions as a carrier, and the unevenness provided on the surface is formed of a different material. This is a method that remains on the substrate.

In this method, for example, a film such as polyethylene is used as it is, or a base film is formed from a suitable base material such as a polymer resin. After that, for example, silica, Ti, Cr, S
Irregularities are formed by applying a solution in which metal oxide fine particles such as n and Y are dispersed in another solid matter (after firing) such as a binder matrix. When a spacer is attached to this film and baked, only the base film evaporates, leaving only the uneven surface of ruthenium oxide.

Among the above methods, it is easy to change the shape of the unevenness depending on the location in the method described above, so that more efficient unevenness can be formed. Also,
After the processing of (1), a composite processing of performing the processing of (2) is also possible.

Further, by stretching the film thus produced before laminating,
It is possible to add anisotropy to the shape and arrangement of the unevenness.

(2-3) Adhesion of Film and Spacer If the base material of such a film remains in the final spacer form, if an adhesive is used, it may burn, evaporate, or scatter by firing or the like. Used. In the case of directly applying to the spacer substrate as described above, an adhesive is not particularly required.

(2-4) Improvement of antistatic property In the same manner as described in (1-4), by forming irregularities, the secondary electron emission coefficient can be reduced.
In order to further enhance the antistatic effect, as will be described again in the section of the spacer in the outline of the image display apparatus, it is preferable to remove the electrification so that a minute current flows on the spacer surface.

As this method, it is possible to select a material having a certain degree of conductivity, which will be described later, when the additive remains on the surface of the spacer substrate as unevenness. When the carboxylate of Cr described in the above (2-2) is used, or when ruthenium oxide is used, a high-resistance film having irregularities on the surface is formed, and thus has an antistatic function as it is.

When the film having irregularities formed on the surface of the spacer substrate is insulative, the same as described in the above (1-4), it will be described again later in the section of the spacer of the image display device. In addition, an antistatic function can be further improved by forming a film having an appropriate resistance on the surface by vapor deposition, sputtering, or the like.

[Outline of Image Display Apparatus] Next, the structure and manufacturing method of a display panel of an image display apparatus to which the spacer manufactured by the present invention can be applied will be described with reference to specific examples.

FIG. 2 is a perspective view of the display panel used in the embodiment, in which a part of the panel is cut away to show the internal structure.

In the figure, 1015 is a rear plate, 1016
Is a side wall, 1017 is a face plate, and 1015
An airtight container for maintaining the inside of the display panel at a vacuum is formed by 1017 to 1017. When assembling an airtight container, it is necessary to seal the joints of each member to maintain sufficient strength and airtightness.For example, apply frit glass to the joints, and in air or nitrogen atmosphere, Sealing was achieved by baking at 400 to 500 degrees for 10 minutes or more. A method of evacuating the inside of the airtight container to a vacuum will be described later. The inside of the airtight container is 1
Since the vacuum is maintained at a vacuum of about 0 to the sixth power [Torr], the spacer 10 is used as an anti-atmospheric structure for the purpose of preventing the hermetic container from being destroyed by the atmospheric pressure or an unexpected impact.
20 are provided.

The rear plate 1015 has a substrate 1011
Is fixed, but the cold cathode element 1012 is provided on the substrate.
Are formed N × M. (N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels, and N and M are the same numbers as n and m in FIG. 2. For example, high-definition television It is desirable to set the number to be equal to or more than N = 3000 and M = 1000 in the display device for displaying the image of the above.) The N × M cold cathode elements are:
M row direction wirings 1013 and N column direction wirings 1014
For simple matrix wiring. The 1011
The portion constituted by -1014 is called a multi-electron beam source.

The multi-electron beam source used in the image display device of the present invention is not limited as long as the cold cathode element is a simple matrix wiring electron source, and the material, shape and manufacturing method of the cold cathode element are not limited. Therefore, for example, a cold cathode device such as a surface conduction type emission device, an FE type, or an MIM type can be used.

Next, the structure of a multi-electron beam source in which surface conduction emission devices are arranged as cold cathode devices on a substrate and arranged in a simple matrix will be described.

FIG. 3 is a plan view of the multi-electron beam source used for the display panel of FIG. On the substrate 1011, surface conduction electron-emitting devices are arranged, and these devices are wired in a simple matrix by row-direction wiring electrodes 1013 and column-direction wiring electrodes 1014. An insulating layer (not shown) is formed between the row-directional wiring electrodes 1013 and the column-directional wiring electrodes 1014 at the intersections of the electrodes to maintain electrical insulation.

The multi-electron source having the above-described structure has a structure in which a row-directional wiring electrode 1013, a column-directional wiring electrode 1014, an interelectrode insulating layer (not shown), a device electrode of a surface conduction electron-emitting device, and a conductive material. After the conductive thin film is formed, power is supplied to each element via the row-direction wiring electrodes 1013 and the column-direction wiring electrodes 1014 to perform the energization forming process and the energization activation process.

In this embodiment, the substrate 1011 of the multi-electron beam source is fixed to the rear plate 1015 of the airtight container.
When the substrate 1 has a sufficient strength, the substrate 101 of the multi-electron beam source is used as a rear plate of the hermetic container.
1 itself may be used.

On the lower surface of the face plate 1017, a fluorescent film 1018 is formed. Since the present embodiment is a color display device, a CRT is
The phosphors of the three primary colors of red, green, and blue used in the field are separately applied. The phosphor of each color is, for example, as shown in FIG.
As shown in (a), a black conductor 1010 is provided between the stripes of the phosphor, which are separately applied in stripes. The purpose of providing the black conductor 1010 is to prevent the display color from being shifted even if there is a slight shift in the electron beam irradiation position, and to prevent the reflection of external light to prevent a decrease in display contrast. And preventing charge-up of the fluorescent film by the electron beam. Although graphite is used as a main component for the black conductor 1010, any other material may be used as long as it is suitable for the above purpose.

The method of applying the phosphors of the three primary colors is not limited to the stripe arrangement shown in FIG. 4A, but may be, for example, a delta arrangement as shown in FIG. Other arrangements may be used.

When a monochrome display panel is formed, a monochromatic phosphor material may be used for the phosphor film 1018, and a black conductive material may not necessarily be used. Also, the surface of the fluorescent film 1018 on the rear plate side
A metal back 1019 known in the field of CRT is provided. The purpose of providing the metal back 1019 is to
In order to improve the light utilization rate by mirror-reflecting a part of the light emitted from the light emitting element 018, to protect the fluorescent film 1018 from the collision of negative ions, to act as an electrode for applying an electron beam accelerating voltage, And making the fluorescent film 1018 act as a conductive path for the excited electrons. The metal back 1019 was formed by forming the fluorescent film 1018 on the face plate substrate 1017, smoothing the surface of the fluorescent film, and vacuum-depositing Al thereon.
Note that when a fluorescent material for low voltage is used for the fluorescent film 1018, the metal back 1019 is not used.

Although not used in the present embodiment, for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film, a gap between the face plate substrate 1017 and the fluorescent film
For example, a transparent electrode made of ITO may be provided.

[Spacer] Next, a case where the spacer formed as described above is specifically applied to an image forming apparatus will be described. FIG. 5 is a schematic cross-sectional view taken along line AA ′ of FIG. 2, and the numbers of the respective parts correspond to FIG. 2.

The spacers 1020 are arranged by a necessary number and at necessary intervals, and are fixed to the inside of the face plate and the surface of the substrate 1011 by the bonding material 1040. In the embodiment described here, the spacer 1
020 has a thin plate shape, is arranged in parallel with the row direction wiring 1013, and is electrically connected to the row direction wiring 1013.

As the spacer 1020, the substrate 1011
Has insulating properties enough to withstand high voltage applied between the upper row direction wiring 1013 and column direction wiring 1014 and the metal back 1019 on the inner surface of the face plate 1017;
In addition, it is necessary to have conductivity enough to prevent the surface of the spacer 1020 from being charged. This is as described above.

The insulating member 1020a of the spacer 1020
Examples thereof include quartz glass, glass having a reduced content of impurities such as Na, soda lime glass, and ceramic members such as alumina. The insulating member 102
It is preferable that Oa has a coefficient of thermal expansion close to that of the member forming the airtight container and the substrate 1011.

Conductive uneven surface layer 10 constituting spacer
20b, the high resistance film 1020c, or both,
The acceleration voltage Va applied to the face plate (metal back or the like) on the high potential side is divided by the resistance value Rs of the high resistance film (the conductive uneven surface layer 1020b and the separately provided high resistance film 1020c) functioning as an antistatic film. Current flows. Therefore, the resistance value Rs of the spacer is set to a desirable range from the viewpoint of antistatic and power consumption. From the viewpoint of preventing static charge, the sheet resistance R / □ of the spacer is preferably 10 12 Ω or less. To obtain a sufficient antistatic effect,
It is even more preferable that the value be 0 to the power of 11 or less. The lower limit of the sheet resistance depends on the spacer shape and the voltage applied between the spacers, but is preferably 10 5 Ω or more.

A high-resistance film formed on an insulating material (the sum of a high-resistance film provided separately when the surface unevenness layer is conductive, and a high-resistance film provided separately when the surface unevenness layer is not conductive) The same applies to the following.) The thickness t is preferably in the range of 10 nm to 1 μm. Although it depends on the surface energy of the material, the adhesion to the substrate, and the substrate temperature, generally, a thin film of 10 nm or less is formed in an island shape, has an unstable resistance and poor reproducibility.
On the other hand, when the film thickness t is 1 μm or more, the film stress increases, the risk of film peeling increases, and the film formation time becomes longer, resulting in poor productivity. Therefore, the film thickness is desirably 50 to 500 nm.

The sheet resistance R / □ is ρ / t, and from the preferred range of R / □ and t described above, the specific resistance ρ of the high resistance film for antistatic is 0.1 to 10 8 [Ωcm Is preferred.
In order to realize more preferable ranges of the surface resistance and the film thickness, ρ is preferably set to 10 2 to 10 6 [Ωcm].

As described above, the temperature of the spacer rises when current flows through the antistatic film formed thereon or when the entire display generates heat during operation. If the resistance temperature coefficient of the high resistance film is a large negative value, the resistance value decreases when the temperature rises, the current flowing through the spacer increases, and the temperature further rises. And the current continues to increase until the power supply limit is exceeded. The value of the temperature coefficient of resistance at which such a runaway of current occurs is empirically a negative value and the absolute value is 1% or more. That is, it is desirable that the temperature coefficient of resistance of the antistatic film is greater than -1% (when negative, the absolute value is less than 1%).

As a material having an antistatic film property, a metal oxide is excellent. Among metal oxides, oxides of chromium, nickel, and copper are preferred materials. The reason is considered to be that these oxides have a relatively low secondary electron emission efficiency and are difficult to be charged even when electrons emitted from the electron-emitting device hit the spacer. In addition to metal oxides, carbon is a preferable material having a low secondary electron emission efficiency. In particular, since amorphous carbon has high resistance,
It is easy to control the spacer resistance to a desired value.

However, it is difficult to adjust the resistance value of the above-mentioned metal oxide or carbon to a range of a specific resistance which is desirable as an antistatic film, and the resistance easily changes depending on the atmosphere. Poor controllability. By adjusting the composition of the transition metal, the resistance of the nitride of aluminum and the transition metal alloy can be controlled in a wide range from a good conductor to an insulator. Further, it is a stable material that has a small change in resistance value in a display device manufacturing process described later. In addition, the material has a temperature coefficient of resistance greater than -1% (the absolute value is less than 1% when negative) and is practically easy to use. Examples of the transition metal element include Ti, Cr, and Ta.

The alloy nitride film is formed on the insulating member by thin film forming means such as sputtering, reactive sputtering in a nitrogen gas atmosphere, electron beam evaporation, ion plating, and ion assisted evaporation. The metal oxide film can be formed by the same thin film formation method, but in this case, oxygen gas is used instead of nitrogen gas. In addition, a metal oxide film can be formed by a CVD method or an alkoxide coating method. The carbon film is formed by a vapor deposition method, a sputtering method, a CVD method, or a plasma CVD method. In particular, when forming amorphous carbon, make sure that the atmosphere during the film formation contains hydrogen or the film formation gas is used. Use hydrocarbon gas.

The high resistance film having such an antistatic function can be used as an antistatic film not only for the spacer but also for other uses.

The bonding material 1041 needs to have conductivity so that the spacer 1020 is electrically connected to the row wiring 1013 and the metal back 1019. That is, frit glass to which a conductive adhesive, metal particles, or a conductive filler is added is preferable.

In the present invention, a low resistance film can be further provided as shown in FIG. Here, the low resistance film means that the high resistance film 1020c is a face plate 101 on the high potential side.
7 (metal back 1019 etc.) and substrate 1 on the low potential side
011 (wirings 1013, 1014, etc.) are provided for electrical connection, and hereinafter, the name of an intermediate electrode layer (intermediate layer) is also used. Intermediate electrode layer (intermediate layer)
Can have multiple functions listed below.

The high resistance film 1020c is electrically connected to the face plate 1017 and the substrate 1011.

As described above, the high-resistance film 1020c
Is provided for the purpose of preventing charging on the surface of the spacer 1020. The high-resistance film 1020c is directly or in contact with the face plate 1017 (metal back 1019, etc.) and the substrate 1011 (wirings 1013, 1014, etc.). When the connection is made via the connection 1041, a large contact resistance is generated at the interface of the connection portion, and there is a possibility that the charge generated on the spacer surface cannot be quickly removed. In order to avoid this, a low resistance intermediate layer is provided on the contact surface of the spacer 1020 which comes into contact with the face plate 1017, the substrate 1011 and the contact material 1041, or on the side surface near the contact portion together with the contact surface.

The potential distribution of the high resistance film 1020c is made uniform.

Electrons emitted from the cold cathode element 1012 form electron orbits in accordance with the potential distribution formed between the face plate 1017 and the substrate 1011. Spacer 1
In order to prevent the electron orbit from being disturbed near 020, it is necessary to control the potential distribution of the high-resistance film 1020c over the entire region. When the high-resistance film 1020c is connected to the face plate 1017 (metal back 1019 or the like) and the substrate 1011 (wirings 1013 or 1014 or the like) directly or via the contact material 1041, the connection state is increased due to the contact resistance at the connection interface. And the potential distribution of the high resistance film 1020c may deviate from a desired value. In order to avoid this, a low-resistance intermediate layer is provided over the entire length region of the spacer end (contact surface or side surface) where the spacer 1020 contacts the face plate 1017 and the substrate 1011, and a desired potential is applied to the intermediate layer. By applying, the potential of the entire high resistance film 1020c can be controlled.

The trajectory of the emitted electrons is controlled.

Electrons emitted from the cold cathode device 1012 form electron orbits in accordance with the potential distribution formed between the face plate 1017 and the substrate 1011. Regarding the electrons emitted from the cold cathode devices near the spacers, there may be restrictions (such as changes in wiring and device positions) associated with the installation of the spacers. In such a case, in order to form an image without distortion or unevenness, it is necessary to control the trajectory of the emitted electrons to irradiate a desired position on the face plate 1017 with the electrons. By providing a low-resistance intermediate layer on the side surface portion 5 of the surface in contact with the face plate 1017 and the substrate 1011, the potential distribution near the spacer 1020 can have desired characteristics and the trajectory of emitted electrons can be controlled. I can do it.

The low-resistance film 1020 d is a high-resistance film 1020.
It suffices to select a material having a resistance value sufficiently lower than that of Ni, Cr, Au, Mo, W, Pt, Ti, Al,
Metals or alloys such as Cu and Pd, and Pd and A
g, Au, RuO ₂ , Pd—Ag or other metal or metal oxide and a printed conductor made of glass or the like, or In ₂ O ₃
-SnO ₂ semiconductor material such as transparent conductors and polysilicon or the like is appropriately selected from. The spacer is connected to the metal back on the X-direction wiring and the face plate using conductive frit glass. As the conductive frit glass, a mixture of frit glass and conductive fine particles whose surface is coated with gold is used, and is electrically connected to the high resistance film on the spacer surface and the X-directional wiring or face plate.

[Other Configurations of Image Display Apparatus]
x1 to Dxm, Dy1 to Dyn, and Hv are electric connection terminals having an airtight structure provided for electrically connecting the display panel to an electric circuit (not shown). Dx1 to Dxm are electrically connected to the row wiring 1013 of the multi-electron beam source, Dy1 to Dyn are electrically connected to the column wiring 1014 of the multi-electron beam source, and Hv is electrically connected to the metal back 1019 of the face plate.

In order to evacuate the inside of the hermetic container, after the hermetic container is assembled, an exhaust pipe (not shown) and a vacuum pump are connected, and the inside of the hermetic container is raised to the power of 10 −7 [T
orr]. Thereafter, the exhaust pipe is sealed, but a getter film (not shown) is formed at a predetermined position in the airtight container immediately before or after the sealing in order to maintain the degree of vacuum in the airtight container. The getter film is, for example, a film formed by heating and depositing a getter material containing Ba as a main component by a heater or high-frequency heating,
Due to the adsorption action of the getter film, the inside of the airtight container is 1 × 10−5 or 1 × 10−7 [Torr].
Is maintained at a vacuum degree.

In the image display apparatus using the display panel described above, when a voltage is applied to each cold cathode element 1012 through the external terminals Dx1 to Dxm and Dy1 to Dyn, electrons are emitted from each cold cathode element 1012. At the same time, a high voltage of several hundred [V] to several [kV] is applied to the metal back 1019 through the external terminal Hv to accelerate the emitted electrons and collide with the inner surface of the face plate 1017. As a result, the phosphor of each color forming the fluorescent film 1018 is excited and emits light, and an image is displayed.

Normally, the voltage applied to the surface conduction electron-emitting device 1012 of the present invention, which is a cold cathode device, is about 12 to 16 [V], and the distance d between the metal back 1019 and the cold cathode device 1012 is 0.1 [mm]. ] To about 8 [mm], and a voltage of 0.1 [k] between the metal back 1019 and the cold cathode element 1012.
V] to about 10 [kV].

[0097]

The present invention will be described in more detail with reference to the following examples.

In each of the embodiments described below, as the multi-electron beam source, N × M (N = 307) of the above-described type having an electron emission portion in the conductive fine particle film between the electrodes is used.
A multi-electron beam source was used in which the surface conduction electron-emitting devices (2, M = 1024) were matrix-wired (see FIGS. 2 and 3) by M row-directional wirings and N column-directional wirings.

[Example 1] As a film, a commercially available polyimide film with an adhesive (Kapton: trademark) having a film thickness of 70 µm was used. After forming irregularities on the film surface by sandblasting, the film has an aspect ratio of 1.
A 5-fold stretching process was performed. Next, a silicon nitride film was formed on the surface of insulating glass of the same quality as the rear plate by a 0.5 μm sputtering method and then cut to obtain a spacer substrate having a length of 20 mm, a width of 5 mm and a thickness of 0.2 mm. A film is stuck on this to form irregularities on the surface.
As c, a 50-nm-thick chromium oxide film was laminated. Next, as a low resistance film 1020d, 0.1 μm is formed in a 30 μm band shape in parallel with the connection portion between the face plate and the rear plate.
An Au film having a thickness of μm was formed, and a spacer as shown in FIG. 6 was formed.

In this embodiment, the spacer 102 shown in FIG.
A display panel in which 0 was arranged was produced. Hereinafter, this will be described in detail with reference to FIGS. First, a substrate 1011 on which a row direction wiring electrode 1013, a column direction wiring electrode 1014, an interelectrode insulating layer (not shown), an element electrode of a surface conduction electron-emitting device, and a conductive thin film have been formed on a substrate in advance is placed on a rear plate 1015. Fixed to. Next, the above-described spacer is
On the row direction wiring 1013 of No. 011, it was fixed at equal intervals in parallel with the row direction wiring 1013. Then, 5m of the substrate 1011
m, a fluorescent film 1018 and a metal back 101 on the inner surface.
9 is attached to the side wall 101.
6 and the joints of the rear plate 1015, the face plate 1017, the side wall 1016, and the spacer 1020 were fixed. Substrate 1011 and rear plate 10
15, the joint between the rear plate 1015 and the side wall 1016, and the face plate 1017 and the side wall 1
The joint of No. 016 was sealed by applying frit glass (not shown) and firing at 400 ° C. to 500 ° C. for 10 minutes or more in the air.

The spacer 1020 is formed on the substrate 1011.
A conductive frit glass (not shown) in which a conductive material such as a conductive filler or metal is mixed on the row direction wiring 1013 (line width 300 [μm]) on the side and on the metal back 1019 surface on the face plate 1017 side. And by baking at 400 ° C. to 500 ° C. for 10 minutes or more in air at the same time as the sealing of the airtight container, adhesion and electrical connection were also performed.

In this embodiment, the fluorescent film 101 is used.
8, as shown in FIG. 4C, each color phosphor 21 a adopts a stripe shape extending in the column direction (Y direction), and the black conductor 21 b is formed between the color phosphors (R, G, B) 21 a. In addition, a fluorescent film arranged so as to separate each pixel in the Y direction is used, and the spacer 1020 is provided in the black conductor 21b region (line width 300 [μm) parallel to the row direction (X direction). ])
It was arranged via a metal back 1019 inside. In addition,
When performing the above-described sealing, each color phosphor 21a and the substrate 101
1, the rear plate 1015 and the face plate 101 must correspond to each other.
7 and the spacer 1020 were sufficiently aligned.

The inside of the hermetically sealed container completed as described above is evacuated by a vacuum pump through an exhaust pipe (not shown), and after reaching a sufficient degree of vacuum, the container is closed through terminals Dx1 to Dxm and Dy1 to Dyn. Direction wiring electrode 1013 and column direction wiring electrode 10
A multi-electron beam source was manufactured by supplying power to each element via the device 14 and performing the above-described energization forming process and energization activation process.

Next, the exhaust pipe (not shown) was welded by heating with a gas burner at a degree of vacuum of about 10 −6 [Torr] to seal the envelope (airtight container).

Finally, a getter process was performed to maintain the degree of vacuum after sealing.

In the image display device using the display panel as shown in FIGS. 2 and 6 completed as described above, each cold cathode element (surface conduction type emission element) 1012 has external terminals Dx1 to Dx1. A scanning signal and a modulation signal are applied from Dxm and Dy1 to Dyn from signal generation means (not shown) to emit electrons, and the metal back 1019
By applying a high voltage through the high voltage terminal Hv, the emitted electron beam is accelerated, the electrons collide with the fluorescent film 1018, and the color phosphors 21a (R, G, B in FIG. 24) are excited and emitted. Image displayed. The applied voltage Va to the high voltage terminal Hv is 3 [kV] to 10 [kV], and the applied voltage Vf between the wirings 1013 and 1014 is 14 [V].
And

At this time, a two-dimensional array of light-emitting spots including light-emitting spots generated by electrons emitted from the cold cathode elements 1012 located near the spacer 1020 is formed at two-dimensional intervals, and is a clear color image with good color reproducibility. Display was completed.
This indicates that even when the spacer 1020 was provided, no electric field disturbance affecting the electron trajectory occurred.

Example 2 Using the same polyimide film (Kapton) as that used in Example 1, fine irregularities were formed on the surface by sandblasting, and then a stamp roller (for example, a metal having a groove formed therein) was formed. Was pressed to form irregularities. In this case, the width of 30μm, depth 3
A spacer having stripe-shaped irregularities of 0 μm and a width of 20 μm and a depth of 20 μm formed on the face plate half was manufactured. The spacer manufactured in this manner was installed in an image display device as shown in FIG.

Also in this embodiment, a two-dimensional array of light emitting spots including light emitting spots generated by electrons emitted from the cold cathode elements 1012 located close to the spacer 1020 is formed at two-dimensional intervals, resulting in clear color reproducibility. A good color image could be displayed.

Further, in the present embodiment, it is easier to control the form of the unevenness than in the first embodiment, and the shape of the unevenness could be changed depending on the location.

Example 3 In order to manufacture a spacer,
First, as a film, a small amount of titanium oxide was mixed in a polyamic acid solution to secure conductivity, and a 70 μm-thick polyimide film was formed as described above. Thereafter, irregularities were formed on the film surface by sandblasting. Next, a silicon nitride film was formed on the glass surface in the same manner as in Example 1, and a film was attached to the glass nitride film to form a spacer having an uneven surface. Finally, as a low resistance film, a 0.1 μm thick Au film was formed in a 30 μm band shape in parallel with the connection portion between the face plate and the rear plate. The spacer manufactured as described above was installed as shown in FIG. 8 to manufacture an image display device.

Also in this embodiment, a two-dimensional array of light-emitting spots including light-emitting spots generated by electrons emitted from the cold cathode elements 1012 near the spacer 1020 is formed at two-dimensional intervals, thereby providing clear color reproducibility. A good color image could be displayed.

Further, in the present embodiment, the first embodiment is different from the first embodiment in that
Since a process of forming a high-resistance film is not required, cost reduction can be achieved.

Example 4 A silica film was mixed with a polyamic acid solution during the preparation of the polyimide film in Example 3, and a film was formed in the same manner as in Example 3. After forming the film, the silica component was selectively removed with a hydrofluoric acid aqueous solution to produce a spacer having irregularities (porous shape). The spacer manufactured as described above was installed as shown in FIG. 8 to manufacture an image display device.

Also in this embodiment, a two-dimensional array of light emitting spots including light emitting spots due to electrons emitted from the cold cathode element 1012 located near the spacer 1020 is formed at two-dimensional intervals, and the color reproducibility is clear. A good color image could be displayed.

Further, in this embodiment, the use of a film having a very large thickness makes it possible to further reduce the secondary electron emission count by forming a porous state in addition to the unevenness on the surface. It is possible.

Example 5 In order to manufacture a spacer,
First, a film-shaped film-forming material is prepared. The procedure is as follows.

First, chromium octylate and an acrylic resin (for example, polymethyl methacrylate) as a film base material (binder) are dissolved in xylene, and this solution is spin-coated on a Teflon substrate, and the solution is heated at 120 ° C. in an oven. And dried from the Teflon substrate for 10 minutes.

As described above, Cr in the binder (acrylic resin)
A carboxylate is dispersed to complete a film-like film-forming material. The mixing ratio between the Cr carboxylate and the acrylic resin was 1: 1 by weight, and the mixing ratio between the mixture of chromium octylate and the acrylic resin and xylene was 3: 7 by weight.

This film is attached to a spacer substrate,
After baking in an oven at 400 ° C. for 2 hours, all except for Cr was evaporated to produce a spacer substrate on which a Cr conductive uneven film was formed. Cut this into a spacer,
The image display device was manufactured by installing as shown in FIG.

Also in this embodiment, a two-dimensional array of light-emitting spots including light-emitting spots generated by electrons emitted from the cold cathode elements 1012 located close to the spacer 1020 is formed at two-dimensional intervals, and the color reproducibility is clear. A good color image could be displayed.

Furthermore, in the present embodiment, dripping and swelling at the edge of the spacer can be prevented as compared with the method of coating the spacer at the solution stage without forming a film. Further, mass production is very easy and cost reduction can be achieved.

[Embodiment 6] In order to manufacture a spacer,
First, a silicon methoxide solution containing silica particles having an average particle diameter of 500 ° dispersed therein was applied to the surface of a polyethylene film using a dispenser, and dried to form irregularities. Paste it on the spacer, 300 in the oven
When baked at 2 ° C. for 2 hours, only the polyethylene film evaporates, and a spacer substrate having an uneven film formed on the surface can be manufactured. This was cut to produce a spacer, which was installed as shown in FIG. 9 to produce an image display device.

Also in the present embodiment, a row of light emitting spots are formed two-dimensionally at equal intervals, including light emitting spots generated by electrons emitted from the cold cathode element 1012 located near the spacer 1020, so that clear and color reproducibility can be obtained. A good color image could be displayed.

Further, in this embodiment, since the unevenness is formed using a dispenser, the shape of the unevenness can be easily controlled.

[0126]

According to the present invention, by forming an uneven surface on a spacer surface using a film, the shape of the uneven surface can be freely designed without being limited to the size of the spacer to be uneven. It is possible to perform a stable and uniform asperity (rough surface) forming process, thereby improving the antistatic effect of the spacer at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view of a general image display device with a part of a display panel cut away.

FIG. 2 is a perspective view of the image display device according to the embodiment of the present invention, in which a part of a display panel is cut away.

FIG. 3 is a plan view of a multi-electron beam source of the image display device according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a phosphor array of a face plate of a display panel.

FIG. 5 is a cross-sectional view of a display panel according to an embodiment of the present invention.

FIG. 6 is a sectional view of a display panel of the image forming apparatus manufactured in the first embodiment.

FIG. 7 is a sectional view of a display panel of the image forming apparatus manufactured in the second embodiment.

FIG. 8 is a cross-sectional view of a display panel of an image forming apparatus manufactured in Examples 3 to 5.

FIG. 9 is a sectional view of a display panel of an image forming apparatus manufactured in Example 6.

[Explanation of symbols]

3111, 1011 substrate 3112, 1012 cold cathode element 3113, 1013 row direction wiring 3114, 1014 column direction wiring 3115, 1015 rear plate 3116, 1016 side wall 3117, 1017 face plate 3118, 1018 fluorescent film 3119, 1019 metal back 3120, 1020 1020a Insulating member of spacer 1020 1020b Irregular layer of spacer 1020 1020c High-resistance film of spacer 1020 1020d Low-resistance film of spacer 1020 21a R, G, B phosphor 21b 1010, black conductor

Claims (44)

[Claims] A rear plate provided with an electron source having a plurality of electron-emitting devices; a face plate provided to face the rear plate; and two rear plates provided between the rear plate and the face plate. A method for manufacturing a spacer used in an electron beam apparatus including a spacer for maintaining a distance between plates, wherein a film is attached to a surface of a substrate for forming a spacer (hereinafter, simply referred to as a spacer substrate). A method for manufacturing a spacer, comprising forming a spacer having irregularities. 2. The spacer according to claim 1, wherein the region where the irregularities are formed is at least a part of a surface of the spacer that is not in contact with the rear plate or the face plate. Production method. 3. The method according to claim 1, wherein the base material of the film is a polymer resin. 4. The substrate according to claim 1, wherein the base material constituting the film remains on the surface of the spacer substrate when a final spacer form is completed. Manufacturing method of spacer. 5. The method according to claim 4, wherein the base material forming the film is a polyimide resin, a polyamide resin, a crosslinked polyethylene resin, or a silicone rubber resin. 6. The method according to claim 4, wherein the film has irregularities on its surface before the film attaching step. 7. The method for manufacturing a spacer according to claim 4, wherein the film has irregularities formed on its surface after the film attaching step. 8. The method for manufacturing a spacer according to claim 4, wherein the formation of the irregularities is performed by roughening the film surface by a physical removing unit. 9. The method for manufacturing a spacer according to claim 8, wherein the formation of the unevenness is performed by using sandblasting or a file. 10. The method for manufacturing a spacer according to claim 4, wherein the formation of the irregularities is performed by roughening the film surface by a physical pressing means. 11. The method for manufacturing a spacer according to claim 10, wherein the formation of the unevenness is performed using a stamp roller. 12. The method according to claim 4, wherein the formation of the unevenness is performed by adding a material that can be removed later to the base material to form a film, and removing the material that can be removed after the film is formed. 8. The method for producing a spacer according to any one of items 7 to 7. 13. The method for manufacturing a spacer according to claim 12, wherein the formation of the irregularities is performed by using silica particles as a material that can be removed later, and dissolving and removing silica with hydrofluoric acid after forming the film. . 14. The method for manufacturing a spacer according to claim 4, wherein the formation of the irregularities is performed by attaching irregular projections to the film surface. 15. The method for manufacturing a spacer according to claim 14, wherein the formation of the unevenness is performed by attaching a projection having an uneven shape to a film surface by a printing means. 16. The method for manufacturing a spacer according to claim 15, wherein said printing means is printing by a dispenser or screen printing. 17. The method according to claim 4, wherein the film has conductivity. 18. The spacer according to claim 1, wherein the base material constituting the film does not remain on the surface of the spacer substrate when a final spacer form is completed. Manufacturing method. 19. The method for manufacturing a spacer according to claim 18, wherein the base material constituting the film is a polyolefin resin, an acrylic resin, vinyl acetate, vinyl alcohol, or a cellulose resin. 20. A material for forming concavities and convexities is mixed into the film together with the base material, and after sticking the film to the spacer substrate, the base material is scattered to leave irregularities on the surface of the spacer substrate. A method for manufacturing a spacer according to claim 18. 21. The film has irregularities formed by a material for forming irregularities on a film made of a matrix, and the film is attached to a spacer substrate, and the matrix is scattered to reduce irregularities. The method for manufacturing a spacer according to claim 18, wherein the spacer is left on the surface. 22. The method for manufacturing a spacer according to claim 21, wherein the formation of the unevenness on the film by the material for forming unevenness is performed by giving an uneven shape to the film surface by a printing means. . 23. The method according to claim 22, wherein the printing means is printing by a dispenser or screen printing. 24. The method for manufacturing a spacer according to claim 18, wherein the material for forming unevenness has conductivity after a process of scattering a base material. 25. The method for manufacturing a spacer according to claim 20, wherein the method of scattering the base material is firing. 26. The method for manufacturing a spacer according to claim 1, wherein the shape of the unevenness differs depending on the position of the surface of the spacer. 27. The method for manufacturing a spacer according to claim 26, wherein the shape of the unevenness is different from the direction from the face plate side to the rear plate side of the surface of the spacer. 28. The method according to claim 1, wherein the irregularities have anisotropy on the surface of the spacer. 29. The method for manufacturing a spacer according to claim 28, wherein the anisotropy of the unevenness is formed by stretching the film in at least one direction. 30. The method according to claim 29, wherein the stretching of the film is performed before the film is attached to a spacer substrate. 31. The method of manufacturing a spacer according to claim 1, further comprising a step of forming a conductive film on the surface after forming irregularities on the surface of the spacer substrate. 32. The sheet resistance of the spacer is 1 × 10
The method for manufacturing a spacer according to any one of claims 1 to 31, wherein the spacer is formed to have a power of 7 to 1 x 10 14 Ω / □. 33. The method of manufacturing a spacer according to claim 31, further comprising a step of forming a low-resistance film having a resistance lower than a sheet resistance of the spacer on at least one of the contact surfaces of the rear plate and the face plate. . 34. The method for manufacturing a spacer according to claim 34, wherein the low resistance film has a resistance value which is one digit smaller than a sheet resistance of the spacer. 35. A spacer manufactured by the manufacturing method according to claim 1. 36. A rear plate provided with an electron source having a plurality of electron-emitting devices, a face plate provided opposite to the rear plate, and two rear plates provided between the rear plate and the face plate. A spacer for use in an electron beam apparatus having a spacer for maintaining a distance between plates, wherein a film having a heat-resistant polymer as a base material is attached to a surface of a spacer substrate, and a surface roughness is 100 mm in Ra. ~
A spacer having a surface having irregularities of 100 μm. 37. The spacer according to claim 36, wherein the film has anisotropy. 38. The spacer of claim 36, wherein said film is stretched. 39. An electron beam device comprising the spacer according to claim 35. 40. The electron beam according to claim 39, wherein the electron source has a plurality of electron-emitting devices connected by wiring, and the spacer is electrically connected to the wiring. apparatus. 41. The electron beam apparatus according to claim 39, wherein said face plate has an acceleration electrode for accelerating electrons emitted from said electron source. 42. The electron beam emitting device according to claim 39, wherein said electron emitting device is a surface conduction type emitting device. 43. The image forming apparatus according to claim 43, wherein the electron beam device has an electron beam target on a side surface of the face plate, and an image is formed by irradiating an electron emitted from the electron emitting element in response to an input signal. 43. The electron beam device according to any one of 39 to 42, which is a device. 44. The electron beam apparatus according to claim 43, wherein said electron beam target is a phosphor.