JP2000251655A - Wiring structure and image display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability of connection by constituting an electrode wiring part to be connected to an element electrode, formed on a substrate from a wiring located within a vacuum vessel and a wiring located out of the vacuum vessel, and differing the sectional forms of the wirings located within and out of the vacuum vessel. SOLUTION: The sectional form of an electrode wiring 2 to be arranged within a vacuum vessel is set not in a rectangle form but in a gentle circular form having no angle, whereby discharge is hardly caused in the vacuum vessel. Therefore, the voltage can be increased, and an image of high contrast can be consequently provided. Furthermore, the reliability of an image display device is improved, and the productivity is also improved. Since an external load-out wiring 3 can be set rectangular, a wide contact area with a FPC 6 can be ensured to increase the number of grains of ACF 20, and the allowable current value can be increased in addition to the improvement in reliability of connection. Furthermore, since printing is used in the wiring part, cost can be reduced, and productivity can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring structure and a flat type image display device, and more particularly to a highly reliable image display device.

[0002]

2. Description of the Related Art In recent years, a thin flat type image forming apparatus has attracted attention as an image forming apparatus replacing a large and heavy cathode ray tube. Although a liquid crystal display device has been actively researched and developed as a flat-type image forming device, problems such as a dark image and a narrow viewing angle still remain in the liquid crystal display device.

As a substitute for the liquid crystal display device, there is a self-luminous display, that is, a display using an electron-emitting device such as a plasma display, a fluorescent display tube, and a surface conduction electron-emitting device. A self-luminous display can obtain a brighter image and has a wider viewing angle than a liquid crystal display device.

On the other hand, recently, a cathode ray tube having a screen display section of 30 inches or more is also appearing, and further enlargement is desired. However, it is hard to say that a cathode ray tube is suitable for increasing the size because it takes up a large space. For such a large and bright display, a self-luminous flat display is suitable.

[0005] Further, the present applicant has previously disclosed in US Pat.
In 883, a surface conduction electron-emitting device in which fine particles for emitting electrons are dispersed between a pair of device electrodes was proposed. FIG. 10 shows a typical device configuration of this surface conduction electron-emitting device. FIG. 10A is a plan view of an element configuration,
FIG. 10B shows a cross-sectional view of the element configuration. In this surface conduction electron-emitting device, the interval L1 between the pair of electronic electrodes 8 is 0.01 μm to 100 μm.

The present inventors are studying an image forming apparatus in which many surface conduction electron-emitting devices are arranged on a substrate. There are various methods for manufacturing an electron source substrate in which an electron-emitting device and a wiring are arranged on a substrate. One of the methods is a method of manufacturing all device electrodes, wirings, and extraction electrodes by a photolithography method. . When producing this wiring by photolithography, first,
A metal film is formed as an element electrode, a resist is applied, and then exposed with a pattern mask, the exposed resist is removed, and the metal film on which no resist is applied is further etched to form a necessary pattern. It is usual to do.

On the other hand, a method is conceivable in which the surface conduction electron-emitting device and all the electron sources including the same are manufactured by a printing method by diverting a printing technique such as screen printing or offset printing. The printing method is suitable for forming large-area patterns, and it is possible to form a large number of surface-conduction electron-emitting devices on a substrate by manufacturing the device electrodes of the surface-conduction electron-emitting device by printing. Becomes In this method of manufacturing wiring and the like by printing, a mask is designed and manufactured in advance so that all wiring patterns can be formed,
Using the mask, wiring is printed on the glass substrate by using an Ag paste or the like.

Next, a method of manufacturing an image display device using a substrate on which electron-emitting devices, electrodes, and the like are manufactured as a rear plate will be described.

FIG. 8 is a front view of an example of the image display device. In FIG. 8, reference numeral 300 denotes an exhaust pipe for exhausting the inside of the display tube (FIG. 8 shows a state after the sealing is completed); 301, a rear plate made of blue sheet glass constituting an electron-emitting device; An electron emission portion 308 of the electron emission element, a face plate 308 made of blue plate glass having a metal back and a phosphor formed thereon, 311 an outer frame,
Reference numeral 315 denotes an external electrode, and 316 denotes a driving printed circuit board for driving the image display device.
Is placed behind the 317 is an external extraction electrode 3
FPC (Flexib) that connects the printed circuit board 15 and the printed circuit board 316
le Pribted Circuit) 318 is a connector connected to the FPC 317.

Here, a method of manufacturing the image display device will be briefly described with reference to FIG. First, the rear plate 301
An electron emitting portion 305 (see FIG. 9) is formed in advance.

Further, the face plate 3 of the image display device
A phosphor is applied in advance to the inner surface of the substrate 08, and a metal back is formed on the phosphor so that the surface has conductivity.

The face plate 308 and the outer frame 31
1. After applying low melting point glass to the rear plate 301, the exhaust pipe 300, etc., aligning the position of the face plate 308 with the rear plate 301, fixing them with a jig or the like, and then putting them in an electric furnace, It is heated to a temperature higher than the melting point of the low-melting glass and joined to complete an airtight container.

Next, the inside of the airtight container is evacuated through an exhaust pipe 300, and after performing a process necessary for forming an element,
Further, after degassing is performed by baking, a part of the exhaust pipe is heated and melted, and sealed (closed, cut).

The external extraction electrode 31 formed on the substrate
After connecting the driving printed circuit board 5 to the driving printed circuit board 316, an image or the like is displayed. In order to connect the external electrode 315 of the rear plate 301 to the driving printed circuit board 316, the connection is usually made via the FPC 317. As a method of connecting the external extraction electrode 315 of the rear plate 301 and the FPC 317, an anisotropic conductive film (hereinafter, referred to as an FPC 317) is used.
(ACF: Abbreviated as Anisotropic Conductive Film), and a method of connecting with a clip or the like.

FIG. 10 is an enlarged view of a part of FIG.
FIG. 12 is a diagram in which the FPC 317 is connected to the rear plate 301 using the ACF 322, and a joining method will be described with reference to FIG. In FIG. 10, an external extraction electrode 315 formed by printing is formed on a rear plate 301. 320 denotes an FPC wiring formed on the FPC 317, 322 denotes an ACF, and 323 denotes conductive particles contained in the ACF. FIG. 10A is a perspective view before the rear plate 301 and the FPC 317 are joined. FIG. 10B,
FIG. 10C shows the rear plate 301 and the FPC 317.
Are shown in a cross-sectional view in a state where they are joined via an ACF 322.

As shown in FIGS. 10A to 10C, the external extraction electrode 315 of the rear plate 301 is
Put on F322. After that, the FPC 317 is placed so that the external extraction electrode 315 and the FPC wiring 320 of the FPC 317 are aligned. When the alignment is completed, pressure and heat are applied from above by a thermocompression bonding machine (not shown) to complete the joining between the external extraction electrode 315 and the FPC wiring 320 via the conductive particles 323.

Thereafter, the FPC 317 bonded to the FPC 317
The connector 318 attached to the PC 317 is inserted into the driving printed board 316 to complete the flat panel display (see FIG. 9).

[0018]

However, the above-described configuration of the conventional device electrode and the external extraction electrode has the following problems.

The present applicant has already made many proposals regarding a surface conduction electron-emitting device and an image display device using the same. Since the electron-emitting device has a simple structure and can be formed in a large number in a large area, it can be used for an extremely thin image display device.

By the way, a voltage for accelerating electrons is applied between the electron source on which the above-mentioned electron-emitting devices are arranged and the image display forming member, and a normal phosphor is used as the image display forming member. In order to obtain light of a preferable color and high luminance, this voltage is preferably set as high as possible, and is desirably at least several kV.

In this case, if the cross-sectional wiring structure of the wiring inside the vacuum is rectangular, electric discharge is likely to occur even at a low voltage due to the concentration of the electric field at the corners of the rectangular. When a discharge occurs, a very large current flows instantaneously, but when a part of the current flows into the wiring of the electron source, a large voltage is applied to the electron-emitting device of the electron source. If this voltage exceeds the applied voltage in normal operation, the electron emission characteristics may be degraded, and the electron emission element may be destroyed. In this case, part of the image is not displayed, the quality of the image is reduced, and the image cannot be used as an image display device.

For this reason, if the driving can be performed only at a low voltage and a high voltage cannot be applied, the image is dark and the brightness is poor. For this reason, it is necessary that objects existing inside the vacuum have as few corners and irregularities as possible. The cross-sectional wiring structure inside the vacuum is desirably a gentle mountain shape with no corners than a rectangle, and compared to a rectangular cross-sectional wiring structure inside a vacuum, even if the voltage is high, it is generally difficult to cause discharge. Is well-known knowledge.

On the other hand, in the case of an image display device using a surface conduction electron-emitting device, a plasma display, and the like, the brightness is bright, but the amount of current required for the image display device is low.
In addition, more voltage is required as compared with liquid crystal and the like. These are the driving wires outside the vacuum necessary for the amount of current and voltage.
Normally, ACF is used, but since the particle diameter contained in ACF is small, it is necessary for the joint to be as flat as possible. Further, in order to withstand the large allowable current amount of the ACF, the allowable current amount is increased by increasing the contact area of the ACF as much as possible. Also, the joining reliability of the ACF is determined by the number of particles on the joint, and the connection failure is less likely to occur as the number of particles increases.

Further, as shown in FIG. 10C, the cross-sectional shape of the external extraction electrode 315 formed by printing has an arc shape, and when the FPC wiring 320 of the FPC 317 is joined, the conductive particles 322 of the ACF 322 are formed. It was observed that only a part of the external extraction wiring 315 was joined.
The bonding area was small and the number of particles on board was small.

Further, when the external extraction electrode is made of a thin film, a clean rectangular wiring can be formed, and the contact area for the ACF is widened, but the allowable current amount of the film is reduced because the film is thin. However, it cannot withstand a large current. In order to withstand a large current, a number of thin films must be formed in layers, and thus there is a problem in that the manufacturing time is increased and the cost is increased.

Considering the above, there are the following problems for forming a sectional wiring structure in a flat-panel image display device. (1) To obtain a sufficiently bright and well-colored image, a voltage as high as possible The structure of the cross-sectional wiring structure inside the vacuum for stable operation while applying voltage.

(2) In order to obtain a sufficiently bright and well-colored image, while applying the highest possible voltage and current,
The structure of the cross-sectional wiring structure of the external extraction electrode on the substrate for stable operation.

(3) In order to obtain a sufficiently bright and well-colored image, while applying the highest possible voltage and current,
Sufficient connection reliability between the external extraction electrode on the board and the external input wiring for stable operation.

(4) Configuration Considering Cost and Productivity Yield There are various issues. There has been a demand for providing a highly reliable flat-panel image display device suitable for a thin structure that solves the above problems.

According to the present invention, there is provided a structure of a cross-sectional wiring structure inside a vacuum for stable operation, a structure of a cross-sectional wiring structure of an external extraction electrode on a substrate for stable operation, and a structure of a substrate for stable operation. It is an object of the present invention to provide a configuration in which the connection reliability between the external extraction electrode and the external input wiring is sufficiently ensured, and the cost and the productivity are considered.

[0031]

According to the present invention, an electrode wiring portion connected to an element electrode formed on a substrate is composed of a wiring located in a vacuum and a wiring located outside the vacuum. And the wirings located outside the vacuum have different cross-sectional shapes, enabling stable supply of highly reliable image display devices, improving reliability, reducing costs, and improving productivity. This realizes a flat type image display device.

That is, (1) the electrode wiring portion connected to the device electrode formed on the substrate of the vacuum vessel is composed of a wiring located inside the vacuum and a wiring located outside the vacuum, and located outside the vacuum. The wiring becomes an external extraction electrode wiring, and in a substrate having a structure for supplying an external signal by joining electrodes facing the external extraction electrode wiring, the wiring cross-sectional shape positioned in the vacuum and the wiring cross-sectional shape positioned outside the vacuum Wiring structures with different wiring cross-sectional shapes.

(2) A wiring structure in which the electrode wiring portion is formed of a thick film.

(3) A rear plate provided with an electron emission source for generating an electron beam and a face plate provided with a phosphor which emits light when the electron beam generated by the electron source collides are disposed to face each other. An electrode frame formed on the rear plate is formed of a thick film, the electrode line has an external extraction electrode line, and the electrode corresponding to the external extraction electrode line is joined,
A flat-panel image display device to which an external signal is supplied, wherein the electrode wiring portion has a wiring in which a wiring cross-sectional shape located inside the vacuum and a wiring cross-sectional shape located outside the vacuum have different shapes.

(4) An electrode wiring formed on a substrate and having a different cross-sectional shape of a wiring positioned inside a vacuum and a different cross-sectional shape of a wiring positioned outside the vacuum is an arc having a circular cross-sectional shape positioned within the vacuum. A wiring structure, which is a mold and has a rectangular wiring cross-sectional shape located outside the vacuum.

(5) The electrode wiring formed on the substrate and having a shape different from the cross-sectional shape of the wiring located inside the vacuum and the shape of the cross-sectional shape of the wiring located outside the vacuum has a circular cross-sectional shape positioned within the vacuum. A flat-panel image display device having a wiring that is a mold and has a rectangular wiring cross section positioned outside the vacuum.

(6) The electrode wiring portion formed on the substrate is
A wiring structure in which the cross-sectional shape of a wiring located in a vacuum is an arc shape, and the cross-sectional shape of a wiring located outside a vacuum is a trapezoid.

(7) The electrode wiring portion formed on the substrate is
A flat-panel image display device having a wiring whose cross-sectional shape located in a vacuum is arc-shaped and whose wiring cross-sectional shape is located outside the vacuum is trapezoidal.

As described above, by employing the structure of the present invention, a highly reliable bonding can be performed, a high voltage can be applied, and a sufficiently bright and well-colored image can be obtained. Since the apparatus can be supplied stably, it is possible to provide an image display apparatus which can reduce defects, reduce costs and have high productivity.

[0040]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described.
This will be described in detail with reference to the drawings.

(Outline of the present embodiment) Although there are several methods for manufacturing an image display device and a wiring structure according to the present invention, the method is not limited to the method described below in the present embodiment, and is manufactured by another manufacturing method. If the shape of the electrode wiring is finally a desired shape, no problem occurs. Hereinafter, other methods and materials as a manufacturing method will be described.

In the present invention, the element electrode is formed by printing to form a film having an arc-shaped cross section. However, the element electrode can be formed to have a very small thickness. If an extremely thin film can be formed so as to have almost no influence, printing is not limited, and other electrode forming methods such as sputtering and vapor deposition may be used.

Although the electrode wiring and the external lead-out wiring used Ag this time, they are not limited to Ag, but may be Au, Pt,
Other printable materials such as Cu can also be used.

The method of etching the electrode wiring may be chemical etching or the like in addition to physical etching such as sand plasting. If the cross section of the external wiring is rectangular, the method may be any method. Not limited.

After forming the electrode wiring, if the surface of the electrode wiring or the external wiring is further polished or subjected to a surface treatment such as surface etching to further flatten the unevenness of the surface, a desired shape can be obtained.

[First Embodiment] A first embodiment of the present invention will be described below. Surface conduction electron-emitting devices,
A plurality of electron sources were formed on a rear plate also serving as a substrate and wired in a matrix to form an electron source, and an image forming apparatus was manufactured using the electron sources. Hereinafter, a manufacturing procedure will be described with reference to FIGS.

FIGS. 1A to 1E are sectional views showing the entire flow of a manufacturing method from wiring to a substrate of a flat display device to a flat image display device.

FIG. 1 (a) is a cross-sectional view in which device electrodes are formed on a substrate, and FIG. 1 (b) is a cross-sectional view in which X and Y electrode wires are further formed. FIG. 1D is a cross-sectional view in which a conductive thin film is formed. FIG. 1D shows a state in which electrodes, elements, and the like are formed on the rear plate 1 and then the face plate 1 is formed.
5 is a cross-sectional view in which a flat image display device is formed by the outer frame 11, and FIG. 1E is a cross-sectional view in which an FPC is joined to the flat image display device. These manufacturing methods will be described later in detail with reference to other drawings.

FIGS. 2A and 2B are perspective views showing the shape of the wiring on the substrate. In addition, FIG.
(D) is sectional drawing which shows the manufacturing method of the wiring of a flat panel display. FIGS. 4A and 4B are a top view and a sectional view showing the electron-emitting device. Further, FIG. 5 is a perspective view and a cross-sectional view showing a method of joining the external extraction wiring of the rear plate and the FPC. FIG. 6 is a top view after forming the X and Y electrode wirings and the electron source.

The reference numerals in FIGS. 1 to 5 are all the same. In the figure, 1 is a rear plate made of a glass substrate, 2 is an electrode wiring printed on the rear plate 1, 3 is a dashed line taken out, 6 is an FPC, 7 is an FPC electrode, 8 is an element electrode, 9 is a conductive thin film, 10 Is an electron emitting portion, 11 is an outer frame,
13 is a resist, 15 is a face plate, 16 is a metal back, 17 is a phosphor, 20 is an ACF, 21 is an ACF
Of conductive particles.

First, as shown in FIG.
The device electrode 8 of the surface conduction electron-emitting device is formed thereon by using a Pt resinate paste for offset printing. The interval between the device electrodes 8 was 20 μm.

Next, a print mask is prepared in both the X-axis direction and the Y-axis direction so that the electrode wiring 2 and the external extraction wiring 3 become a solid film when printed. FIG. 1B shows that after the element electrode 8 is formed, the electrode wiring 2X in the X-axis direction and Y
FIG. 3 shows a cross-sectional view in which an axial electrode wiring 2Y is formed. FIG. 6 shows a top view in which electrode wirings in the X and Y axis directions of the element electrodes are formed.

First, a solid film of the electrode wiring 2Y for the Y-axis direction and the external extraction wiring 3 is formed on the substrate (FIG. 2).
(A)). Next, using a printed glass paste, an insulating layer is formed on the electrode wiring 2Y for the Y-axis direction (not shown). Subsequently, a solid film of the electrode wiring 2X for the X-axis direction and the external extraction wiring 3 is formed. X formed as described above
Wiring is formed as shown in FIG. 2B by etching the solid film portion for the axial direction and the Y-axis direction.

FIG. 3 illustrates a method for specifically manufacturing the external extraction wiring 3 of FIG. 2B. FIG. 3 shows the rear plate 1
FIG. 4 is a cross-sectional view illustrating a step of manufacturing a wiring thereon.

As shown in FIG. 3A, a solid film of the external wiring 3 is printed on the rear plate 1. Next, as shown in FIG. 3B, a resist 13 is applied on the printed wiring on the rear plate 1 on which the printed wiring is printed. Next, as shown in FIG. 3C, the device electrode 2 is entirely covered, and the external lead-out wiring portion 3 is exposed so as to have necessary lines and spaces, and the extra resist 13 is removed.

Thereafter, a portion where the resist 13 is not applied is etched, and after the etching, the resist 13 is removed.
A predetermined external extraction wiring 3 is obtained. FIG. 2B is a perspective view, and FIG. 3D is a sectional view.

The width of the external lead-out wiring 3 for the Y-axis direction thus formed is 100 μm and the thickness is about 10 μm.
It is. Further, the width of the external extraction wiring 3 for the X-axis direction is 300 μm and the thickness is about 10 μm.

Next, an electron emitting portion made of PdO fine particles is formed. First, an organic Pd solution (ccp-42) is placed on the rear plate 1 on which the device electrode 8 and the external extraction wiring 3 are formed.
30: Okuno Pharmaceutical Co., Ltd.)
C. for 12 minutes to form a conductive thin film 9 of PdO fine particles. The conductive thin film 9 is patterned by patterning the PdO fine particles using a photolithography method.
To form This state is shown in FIG. 1 (c), and this enlarged view is shown in FIGS. 4 (a) and (b). According to FIG. 4A, an element electrode 8 is formed on the substrate 1 of the rear plate 1, a conductive thin film 9 is formed, and an electron emitting portion 10 is formed by an energization forming process. FIG. 4B is a cross-sectional view thereof. The conductive thin film 9 is formed on the device electrode 8 on the substrate 1, and the electron-emitting portion 10 is formed by a current forming process.

Rear plate 1 including the above-described electron-emitting device
After the production, an airtight container is produced. In FIG. 1 (d),
A rear plate 1 on which a plurality of surface conduction electron-emitting devices 4 are formed as an electron source for generating the above-mentioned electron beam;
A face plate 15 for displaying an image by acting on electrons emitted from the electron-emitting device 4 is arranged opposite to each other via an outer frame 11 and an exhaust pipe (not shown). Rear plate 1 and outer frame 11, face plate 15 and outer frame 11,
Each of the exhaust pipes is hermetically bonded with low-melting glass, and the rear plate 1, the outer frame 11, the exhaust pipe, and the face plate 15 constitute an airtight container.

The face plate 1 of the image display device
A phosphor 17 is applied on the inner surface of the phosphor 5 in advance, and a metal back 16 having the phosphor having conductivity on the surface.
Is formed.

Then, a low melting point glass (LS-3 manufactured by NEC Corporation) is attached to a part of the face plate 15, the rear plate 1, and the outer frame 11 to which a part of the exhaust pipe is to be attached.
081).

Next, an electric furnace (not shown) equipped with a container capable of heating the whole apparatus while fixing the rear plate 1 and the face plate 15 facing each other so as to sandwich the outer frame 11 and the exhaust pipe and fixing them with a jig or the like. ), Heat and seal. At this time, the relationship between the wiring on the rear plate 1 and the outer frame is such that only the wiring electrode 2 is disposed inside the outer frame 11 and the wiring electrode 2 and the external extraction wiring 3 are provided outside the outer frame 11.
Or it is desirable to arrange so that only the external extraction wiring 3 is located outside the outer frame. Thereafter, the temperature is slowly cooled to room temperature, and the image display device is taken out of the electric furnace.

As described above, the face plate 15
By fixing and bonding the rear plate 1, the outer frame 11, and the exhaust pipe with the low-melting glass, it is possible to obtain a strong joint without vacuum leakage.

Next, the inside of the airtight container is emptied by a vacuum pump from an exhaust pipe (not shown) attached to the image display device.
Evacuate to 0 ^-6 Torr or less.

After that, several V to
An electron emission portion 10 (FIG. 4) is formed by applying a voltage of more than ten volts and performing an energization process called the energization forming process described above.

Next, a process called an activation process is performed on the element on which the energization forming has been completed.

The electron-emitting device thus manufactured is preferably operated and driven in an atmosphere having a degree of vacuum higher than the degree of vacuum in the forming step and the activation step. Further, it is desirable to drive the device after heating at 80 ° C. to 150 ° C. in an atmosphere of a higher degree of vacuum.

Subsequently, the image display device is heated to about 130 ° C. by a hot plate to perform degassing. Then, the image display device is sealed by heating and welding the exhaust pipe of the image display device with a gas burner.

The image display device manufactured as described above is shown in FIG.
(E) As shown in FIG.
A method of connecting C6 will be specifically described.

FIG. 5 shows the external wiring 3 of the rear plate 1.
The method for joining the FPC 6 to the FPC 6 will be described. The ACF 20 is connected to the external extraction wiring 3 of the rear plate 1 by the FPC of the rear plate 1.
To the location where you want to connect. Next, the external wiring 3 of the rear plate 1 is set at a position where the FPC 6 necessary for connecting the wiring 3 to the printed circuit board is connected thereto, and the printed circuit boards are aligned at a predetermined position so that they match (FIG. 5B).

When the FPC electrode 7 of the flexible printed circuit (FPC) 6 and the external wiring 3 of the rear plate 1 match, the FPC 6 and the image display device are moved under the thermocompression bonding tool. Then remove the thermocompression seal and
The PC 6 and the external wiring 3 were thermocompressed with the ACF 20 to complete the joining of the FPC 6 and the external wiring 3.

As shown in FIG. 5C, the FP of the FPC 6
With the conductive particles 21 of the ACF of the C electrode 7 and the external extraction wiring 3, bonding could be performed between flat surfaces and bonding could be performed over a wide area. As described above, the bonding is performed for each bundle of the FPC 6 and the external extraction wiring 3 of the image display device, and after the end of one side, the bonding of the other side is performed.
(Joining to a flat-panel image display device is shown in FIG. 1).
(E)).

Then, the FP bonded to the rear plate 1
The connector (not shown) attached to C6 was inserted into the connector of the printed board (not shown), and the connection between the rear plate 1 and the printed board was completed. X of this image display device
An arbitrary voltage signal of, for example, 14 V is applied to the wiring, and a potential of, for example, 7 V is applied to the Y wiring, and an anode voltage of, for example, 5 kV is applied to the metal back 16 of the face plate 15. Could be displayed.

As described above, by making the cross-sectional wiring structure of the electrode wiring inside the vacuum not a rectangle but an arc-shaped shape without a gentle corner, it is difficult to generate a discharge inside the vacuum. This makes it possible to obtain a bright image and a high-contrast image. In addition, since the discharge is less likely to occur, the reliability of the image display device is improved, thereby improving the yield and the productivity. Also, since the external extraction wiring portion can be made rectangular, the connection area with the FPC can be increased,
The number of particles of the ACF could be increased, and the connection reliability was improved, and at the same time, the allowable current amount could be increased. In addition, since the wiring portion uses printing, the cost is low and the productivity can be improved.

[Second Embodiment] A second embodiment of the present invention will be described below.

A plurality of surface conduction electron-emitting devices were formed on a rear plate also serving as a substrate, wired in a matrix to form an electron source, and an image forming apparatus was manufactured using the electron source.

The method of manufacturing the image display device is almost the same as that of the first embodiment, and therefore the details are omitted, but the points different from the first embodiment will be described below.

This difference will be described with reference to FIG. In FIG. 7, reference numeral 1 denotes a rear plate made of a glass substrate, 3 denotes an external wiring, and 13 denotes a resist.

First, the device electrodes of the surface conduction electron-emitting device are formed on the rear plate 1 as in the first embodiment.

Subsequently, similarly to the first embodiment, the Y-axis direction electrode wiring and the Y-axis direction external lead-out wiring are formed.

Next, as in the first embodiment, an insulating layer is formed on the Y-axis direction electrode wiring using a printed glass paste. Subsequently, as in the first embodiment, the Y-axis direction electrode wiring and the X-axis direction external extraction wiring are provided.

FIG. 7 is a cross-sectional view showing a step of forming wiring on the rear plate. The solid film of the external extraction wiring 3 is printed on the rear plate 1 (FIG. 7A).

Next, a resist 13 is applied on the printed wiring on the rear plate 1 (FIG. 7B).

The device electrodes are all covered, and the external lead-out wiring portion 3 is exposed so as to have necessary lines and spaces to remove the excess resist 13 (FIG. 7).
(C)).

Thereafter, the portion where the resist 13 is not applied is etched. In this case, first, the particles are hit at an angle from the diagonally right side by sandblasting, or the rear plate is etched. This is done by setting at an angle (Fig. 7
(D)).

Next, the above operation is performed by changing the angle of the sandplast or by changing the setting angle of the rear plate 1 and hitting the particles of the sandplast (FIG. 7 (e)).

Thereafter, the resist 13 is removed to obtain a predetermined external extraction wiring 3 (FIG. 7F).

The width of the Y-axis direction external lead-out wiring 3 thus formed is 70 μm and the thickness is about 10 μm. The width of the X-axis direction external extraction wiring 3 is 300
μm, and the thickness is about 10 μm.

In the present invention, the sand blast method is used for the wiring etching method. However, the method is not particularly limited as long as the wiring has a trapezoidal cross-sectional shape.

Next, as in the first embodiment, an electron emitting portion made of PdO fine particles is formed. After manufacturing the rear plate 1 including the above-described electron-emitting device, an airtight container was manufactured in the same manner as in the first embodiment, and electrical processing, heat treatment, and the like were performed to manufacture an image display device.

Thereafter, the FP bonded to the rear plate 1
The connector (not shown) attached to C was inserted into the connector portion of the printed board (not shown), and the connection between the rear plate 1 and the printed board was completed. For example, an arbitrary voltage signal of 14 V is applied to the X wiring of the image display device, and 7 V is applied to the Y wiring.
5kV to the metal back of the face plate
When the anode voltage was applied, an arbitrary high-quality image without discharge could be displayed.

As described above, by making the cross-sectional wiring structure of the electrode wiring inside the vacuum not a rectangle but an arc-shaped shape without a gentle corner, it becomes difficult to generate a discharge inside the vacuum. This makes it possible to obtain a bright and high-contrast image. In addition, since discharge is less likely to occur, the reliability of the image display device is improved, so that the yield is improved and the productivity is also improved. Also, since the external wiring section can be trapezoidal, the connection area with the FPC can be increased,
The number of F particles could be increased, and the connection reliability was further improved, and at the same time, the allowable current amount could be increased. In addition, since the wiring portion uses printing, the cost is low and the productivity can be improved.

Further, since the external wiring portion of the present invention has a trapezoidal shape, the lower space portion of the cross section can be formed wider. Therefore, especially when the wiring pitch is narrow, adjacent lines are short-circuited as compared with the first embodiment. Yield improved.

In the above embodiment, the case where the surface conduction electron-emitting device is used as the electron-emitting device constituting the electron source has been described, but the configuration of the present invention is not limited to this. The same can be applied to a case where an electron source using a thermionic emission element, a field emission type electron emission element, a semiconductor electron emission element, or other various electron emission elements is used. Further, in the above-described embodiment, the display device including the vacuum container has been described. However, the display device may be an airtight container, and may be used in the present display device if the inside of the container is airtight.

In the embodiment, the rear plate also serves as the substrate of the electron source in the image forming apparatus. However, the rear plate and the substrate are separately provided, and after the electron source is manufactured, the substrate is fixed to the rear plate. Is also good.

In addition, within the technical idea of the present invention,
The manufacturing method and various members described in the embodiment may be appropriately changed.

[0097]

As described above, by adopting the structure of the present invention, the junction area of the wiring portion is increased, and a highly reliable junction can be performed. Further, since the wiring in the image display device has an arc shape, it is difficult for electric discharge to occur, so that a high voltage can be applied to the image display device and a large amount of current can flow. As described above, the high voltage and the high current can flow, so that the image display apparatus can obtain a sufficiently bright and well-colored image. Further, since a reliable image display device can be stably supplied, the cost is reduced and the productivity is improved.

[Brief description of the drawings]

FIG. 1 shows a manufacturing procedure of an image display device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a procedure for manufacturing wiring on the substrate according to the first embodiment of the present invention.

FIG. 3 shows a procedure for manufacturing a wiring according to the first embodiment of the present invention.

FIG. 4 shows an electron-emitting device according to the first embodiment of the present invention.

FIG. 5 is a diagram illustrating a wiring on a substrate and an FPC according to the first embodiment of the present invention.
The figure which connects a wiring is shown.

FIG. 6 shows a procedure for manufacturing a wiring according to a second embodiment of the present invention.

FIG. 7 is a view showing a procedure for manufacturing a wiring according to a second embodiment of the present invention.

FIG. 8 shows a diagram of a conventional image display device.

FIG. 9 shows a conventional surface conduction electron-emitting device.

FIG. 10 is a joining diagram of a conventional substrate wiring and FPC wiring.

[Explanation of symbols]

 1,301 Rear plate 2 Electrode wiring 3,315 External extraction wiring 6,317 FPC 7,320 FPC electrode 8 Element electrode 9 Conductive film 10,305 Electron emission element 11,311 Outer frame 14 Resist 15 Face plate 16 Metal back 17 Fluorescence Body 20,322 ACF 21,323 Conductive particles of ACF 300 Exhaust pipe

Continued on front page F-term (reference)

Claims (8)

[Claims] An electrode wiring portion comprises a wiring located inside an airtight container and a wiring located outside the airtight container, wherein the wiring located outside the airtight container serves as an external extraction electrode wiring. In a substrate having a structure for supplying an external signal by joining opposing electrodes, a wiring cross-sectional shape located in the hermetic container and a wiring cross-sectional shape located outside the hermetic container are different from each other. . 2. The wiring structure according to claim 1, wherein said electrode wiring portion is formed of a thick film. 3. An electrode wiring having a shape different from that of a wiring cross section located inside the hermetic container and a wiring cross section located outside the hermetic container, wherein the wiring cross section located inside the hermetic container has an arc shape. 3. The cross-sectional shape of a wiring located outside the hermetic container is rectangular.
The wiring structure described. 4. The wiring structure according to claim 1, wherein the cross-sectional shape of the wiring located inside the airtight container is an arc shape, and the cross-sectional shape of the wiring located outside the airtight container is trapezoidal. 5. A rear plate provided with an electron emission source for generating an electron beam, a face plate provided with a phosphor which emits light when the electron beam generated by the electron source collides with the rear plate, An electrode frame formed on the rear plate is made of a thick film, and the electrode wiring has an externally extracted electrode wiring, and is opposed to the externally extracted electrode wiring. In an image display device to which an external signal is supplied by joining electrodes, the electrode wiring portion has a wiring having a shape different from a wiring cross-sectional shape positioned inside the hermetic seal and a wiring cross-sectional shape positioned outside the hermetic seal. An image display device characterized by the above-mentioned. 6. An electrode wiring formed in a hermetic container, wherein an electrode wiring formed on a substrate and having a cross-sectional shape different from a wiring cross-sectional shape positioned inside the hermetic container and a wiring cross-sectional shape positioned outside the hermetic container is provided. 6. The image display device according to claim 5, wherein the cross-sectional shape is a circular arc shape, and the wiring is located outside the airtight container and has a rectangular cross-sectional shape. 7. An electrode wiring portion formed on a substrate has a wiring in which the wiring cross section located in the hermetic container has an arc shape and a wiring cross section located outside the hermetic container has a trapezoidal shape. The image display device according to claim 5, wherein: 8. A rear plate provided with an electron emission source for generating an electron beam, a face plate provided with a phosphor which emits light when the electron beam generated by the electron source collides, An image display device comprising: an outer frame in which a face plate is disposed to face; an electrode wiring connected to the electron emission source; and an external extraction electrode wiring outside the rear plate, wherein the external extraction electrode wiring Is joined by an anisotropic conductive film.