JP2000251653A - Airtight vessel, manufacture thereof, and image forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent peeling of a connecting member without using beam welding by providing a deformation absorption part either between the first base-side connection part of a first base-side connecting member and the connection part of the connecting member or between the second base-side connection part of a second base-side connecting member and the connection part of the connecting member. SOLUTION: Deformation absorbing parts 8 are provided both between the first base-side connection part 41 of a first base-side metallic member 4 and a metallic connection part 7 and between the second base-side connection part 51 of a second base-side metallic member 5 and the metallic connection part 7. The deformation absorbing parts 8 are the elastically deformable bent parts of the first and second base-side metallic members 4 and 5. According to this, thermal stresses generated in the metallic connection part 7 by the uneven temperature distribution in welding or baking is converted into the elastically deforming energy of a bending work sectional form, such as V-shape or U-shape and absorbed, whereby the thermal stresses conducted to the connecting materials 6 of the first and second base-side metallic members 4, 5 is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display and a plasma display, particularly to a field emission device,
TECHNICAL FIELD The present invention relates to an image forming apparatus using an electron beam that emits and displays an image forming member such as a phosphor by arranging a plurality of electron emitting elements such as a surface conduction electron emitting element, and particularly relates to an airtight container used for a vacuum container thereof and its manufacture. The present invention relates to a method and an image forming apparatus using the airtight container.

[0002]

2. Description of the Related Art In recent years, active matrix type liquid crystals have been used as image forming apparatuses instead of CRTs. In addition, since the active matrix type liquid crystal is not a self-luminous type, display is performed using a backlight. However, since the light use efficiency is low, a brighter image forming apparatus has been desired. Therefore, electrons emitted from a cathode electron-emitting device such as a plasma display, a field electron-emitting device, and a surface conduction electron-emitting device (for example, see Japanese Patent Application Laid-Open No. 7-235255) are accelerated and collided to cause a phosphor to emit light. The development of a self-luminous image forming apparatus that performs display by using a liquid crystal display is being put to practical use. These self-luminous image forming apparatuses have been increasing in area to several tens of inches, and a structure that is reliable and easy to manufacture is desired.

An image forming apparatus such as a plasma display or a fluorescent display tube includes a first base and a second base opposed to each other, and an electron-emitting device on the first base and an image forming member on the second base are formed by: 1 to form pixels of several tens μ to several hundreds μ. At this time, if the alignment between the electron-emitting device and the image forming member is insufficient, the brightness of pixels may vary,
In the case of color, each color of RGB is mixed and the image quality is deteriorated. For this reason, it is necessary that the alignment between the element on the first base side and the image forming member on the second base side be highly accurate.

In a conventional image forming apparatus, it is necessary to form a vacuum vessel with a first base and a second base. Therefore, a bonding surface of the first base and the second base is formed by using a bonding material such as low melting point glass. It was sealed. That is, the first base and the second base are heated at a high temperature, and a pressure is applied while softening a bonding material such as a low-melting glass disposed between the bonding surfaces of the first base and the second base. After aligning the first base and the second base in this state, the joining material is solidified to seal the first base and the second base.

For this reason, due to a difference in thermal expansion coefficient between the first base and the second base, uneven temperature distribution, etc., the first base and the second base are misaligned, and the first base and the second base are cracked. There is a problem that warpage occurs and the alignment between the element on the first base and the image forming member on the second base cannot be performed with high accuracy.

Further, the alignment apparatus for performing the alignment is a complicated process which requires accuracy in a high temperature specification, and causes a problem such as a decrease in productivity.

In order to solve such a problem, a metal member as a joining member is bonded to each of the first and second substrates instead of directly sealing the first and second substrates. An image forming apparatus has been proposed in which members are hermetically sealed by beam welding (see Japanese Patent Publication No. 3-28773).

FIG. 9 shows a structural example of an image forming apparatus used for a plasma display or a fluorescent display tube disclosed in Japanese Patent Publication No. 3-28773, and FIG. 9A is used for the image forming apparatus. Sectional view of the airtight container, FIG. 9 (b)
FIG. 10 is an enlarged view of a portion A in FIG.

In the drawing, reference numeral 91 denotes a front container of an image forming apparatus provided with an image forming member (not shown) such as a phosphor, 92 denotes a metal plate as a joining member adhered to the front container 91 by a joining material 97, 93 Is a frame body, 94 is a metal plate as a bonding member bonded to the frame body 93 by a bonding material 97, 95 is a back plate bonded to the frame body 93 by the bonding material 97, and 96 is an electrode assembly (not shown) in the container. ) Is extracted from the electrode and the bonding material 9
7 is a lead wire sealed by a metal plate 98;
4 is a welded portion sealed by beam welding. The bonding material 97 is made of powdered glass for sealing.

This image forming apparatus is assembled as follows.

First, a bonding material 97 is applied between the front container 91 and the metal plate 92, and then the metal plate 92 is bonded to the front container 91 by firing. Similarly, the metal plate 9 is attached to the back plate 95.
4. The frame body 93 and the lead wire 96 are adhered with a bonding material 97 to produce a back container 99. After that, an electrode assembly (not shown) of the electron-emitting device is installed in the back container 99, and the electrode assembly (not shown) and the lead wire 96 are connected. The periphery of the plate 92 and the metal plate 94 are beam-welded to produce an airtight container of the image forming apparatus. Finally, the produced airtight container was connected to an exhaust device to exhaust air, and was baked and sealed.

[0012]

According to this conventional image forming apparatus, the amount of heat applied to the metal plates 92 and 94 during beam welding is smaller than that of ordinary joining means (electric welding, soldering, brazing, etc.). It is described that since the number of cracks is small, cracking of the container due to thermal stress, peeling of the bonding material 97 between the metal plates 92 and 94, and the like are reduced, and the yield can be improved.

As pointed out in the same publication, the front container 91
To seal the lower container 99 with the lower container 99 at a low temperature.
The metal plates 92 and 94 are joined to the back container 99 using a joining material 97 such as low-melting glass, respectively, and the metal plate 92 of the front container 91 and the metal plate 94 of the back container 99 are welded (electric welding, soldering, In the method of sealing the front container 91 and the back container 99 by brazing or the like, the difference in the thermal expansion coefficient between the metal plates 92 and 94 and the temperature distribution irregularity during a heat process such as welding or a baking process. Due to uniformity or the like, thermal stress is generated between the metal plates 92 and 94, and the bonding material 97 of the low-melting glass and the metal plates 92 and 94 having low adhesive strength is peeled off, which causes problems such as vacuum leakage.

In this publication, as a measure against vacuum leakage, heat stress is hardly generated between the front and rear containers 91 and 99 and the metal plates 92 and 94 by using beam welding in which heat acts locally during welding. Thus, the reliability of the vacuum vessel was improved.

However, beam welding still cannot completely eliminate the influence of heat, and the joining means is restricted to beam welding.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a means for joining other than beam welding by absorbing thermal deformation at the time of joining between joining members. An object of the present invention is to provide an airtight container which can prevent peeling of a bonding material even when used, has high reliability and high productivity, a method of manufacturing the same, and an image forming apparatus.

[0017]

In order to achieve the above object, the invention according to the first aspect of the present invention relates to a method of connecting a first base and a second base via a first base member and a second base member. In the joined hermetic container, the joint between the first base and the second base is a first base-side joint where the first base-side joining member is joined to the first base, and the second base is joined to the second base. The first base-side bonding member includes a second base-side bonding portion in which the base-side bonding member is bonded, and a bonding member bonding portion in which the first base-side bonding member and the second base-side bonding member are bonded. At least one of a portion between the base-side joint and the joining member joint and between the second base-side joint and the joining member joint of the second base-side joining member has a deformation absorbing portion.

[0018] The thermal stress at the time of joining such as welding of the joining portion of the joining member or at the time of the baking step is absorbed as elastic deformation energy by the deformation absorbing portion, and the first base side joining portion or the second joining portion is absorbed.
Since no thermal stress is exerted on the base-side joint, a highly reliable hermetic container is obtained in which the first base-side joint or the second base-side joint peels off and problems such as vacuum leakage hardly occur.

In addition, since the positioning and sealing between the first base and the second base are performed in an atmosphere near room temperature,
There is no need to use expensive alignment equipment.

The invention according to claim 2 is characterized in that the deformation absorbing portion has a bent portion.

In this case, the thermal stress can be absorbed by the deformation of the bent portion in the bending direction. The invention according to claim 3 is characterized in that the deformation absorbing portion has a portion where the first or second base member is joined in parallel.

The invention according to claim 4 is characterized in that the deformation absorbing portion has a portion in which the space between the first base member and the second base member is narrowed toward the opposite side of the bonding member. I do.

According to a fifth aspect of the present invention, the sectional shape of the deformation absorbing portion along a straight line connecting the first or second base-side joining portion and the joining member joining portion has a U-shaped or V-shaped shape. It is characterized by having.

According to this configuration, the deformation absorbing portion can manufacture the first base member and the second base member by high-productivity processing such as press working, so that an airtight container with high productivity can be obtained. .

The invention according to claim 6 is characterized in that the deformation absorbing section has a convex shape in cross section along a straight line connecting the first or second base-side joining section and the joining member joining section. .

In this way, the deformation absorbing portion can produce the first base member and the second base member by high-productivity processing such as press working, so that an airtight container with high productivity can be obtained. .

According to a seventh aspect of the present invention, the deformation absorbing portion is provided with the first
It is characterized in that both the base member and the second base member have both.

According to this configuration, the thermal stress during the joining such as welding of the joining member joining portion or during the baking step is further absorbed by the deformation absorbing portion as elastic deformation energy. It is difficult for thermal stress to be applied to the second substrate-side joint, and the first substrate-side joint or the second substrate-side joint is less likely to be peeled off and problems such as vacuum leakage are less likely to occur.

The invention according to claim 8 is characterized in that the bonding agent for the first base bonding part and the second base bonding part is a low melting point glass.

Since the joining material has high heat resistance and vacuum holding properties, a highly reliable airtight container can be obtained.

The ninth aspect of the present invention is characterized in that the first and second joining members are metal members, and joining by welding or the like near a normal temperature atmosphere is possible.

According to a tenth aspect, the first base member or the second base member is made of Ni—Cr.
Alloy (42% by weight-6% residual Fe).

The heat of the first substrate side joining member or the second substrate side joining member and the second substrate such as a low melting point glass or glass which is a joining material of the first substrate side joining portion or the second substrate side joining portion. Since the difference between the coefficients of expansion is small, the thermal stress at the time of joining such as welding of the joining parts of the joining members or at the time of the baking step can be reduced, and a more reliable airtight container can be obtained.

The invention according to claim 11 uses the above-mentioned airtight container, wherein the first base is provided with an electron-emitting device, and the second base is provided with an electron-emitting device.
An image forming unit on which an image is displayed by an electron beam emitted from the electron-emitting device is provided on the base.

According to the image forming apparatus of the present invention, a highly reliable image forming apparatus in which problems such as vacuum leakage hardly occur can be obtained.

In addition, since the positioning and sealing between the first base and the second base are performed in an atmosphere near room temperature,
Positioning between the electron-emitting device and the image forming unit can be performed without using an expensive alignment device.

According to a twelfth aspect of the present invention, the image forming member is a phosphor.

This is suitable for a large-area flat image forming apparatus.

The invention according to claim 13 is characterized in that the electron-emitting device is a cold cathode electron-emitting device. It is suitable for a flat-type image forming apparatus having a simple structure and a large area.

According to a fourteenth aspect of the present invention, the first base member and the second base member to be bonded to each other are connected to each other by the first base member and the first base member. The first base member is composed of a second base member joined to the second base member joined to the two base members, and a joint member joined portion joined to the first base member and the second base member. At least one of a portion between the first base-side joining portion and the joining member joining portion of the side joining member and a portion between the second base-side joining portion and the joining member joining portion of the second base-side joining member have a deformation absorbing portion. A method for manufacturing an airtight container, wherein a deformation-absorbable portion is formed in advance on at least one of a first and second base member, and the first and second base members are attached to the first and second base members. Bonding, aligning the first and second substrates,
The base member and the second base member are hermetically welded to each other.

In this way, the first and second substrates can be positioned at room temperature, and the joining members can be joined in an airtight manner. In particular, by forming the deformation absorbing portion, when performing metal joining, thermal stress is absorbed by the deformation absorbing portion, and peeling of the bonding material from the first and second bases can be prevented. Instead, other welding means such as arc welding and electric welding, and other various metal joining means under normal temperature atmosphere such as soldering and brazing can be used, and productivity can be improved.

[0042]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments.

The image forming apparatus according to the present embodiment employs a liquid crystal display or a plasma display, in particular, a plurality of electron emitting devices such as a field electron emitting device and a surface conduction type electron emitting device. The present invention is applied to an image forming apparatus using an electron beam for displaying a member by emitting light.

FIG. 1 shows an image forming apparatus according to an embodiment of the present invention. FIG. 1 (a) is a schematic perspective view, and FIG. 1 (b) is an enlarged sectional view of a peripheral portion along line AA. It is.

That is, the hermetic container constituting the image forming apparatus is formed by joining the first base 1 and the second base 2, and the joint between the first base 1 and the second base 2 is the first base 1. Base 1
A first base-side metal member 4 as a first base-side bonding member, and a second base-side metal as a second base-side bonding member to the second base 2; Second base-side joining portion 5 in which member 5 is joined by joining material 6
1 and a metal bonding portion 7 as a bonding material bonding portion in which the first base metal member 4 and the second base metal member 5 are bonded.

Then, the first base-side metal member 4
In the present embodiment, at least any one of between the base-side joint 41 and the metal joint 7 and between the second base-side joint 51 and the metal joint 7 of the second base-side metal member 5 is deformed to both. This is a configuration having an absorbing portion 8.

The first base 1 is composed of a rear plate 1a made of glass or the like and a support frame 3 arranged around the rear plate 1a. A pattern such as wiring is formed. In an image forming apparatus using an electron-emitting device, an electron-emitting device is provided. In a plasma display, a partition for limiting a plasma region is provided, and in a reflection type, a phosphor or the like is provided.

The support frame 3 includes electrodes on the rear plate 1a,
It is a frame-shaped member disposed on a peripheral portion on a surface on which a pattern such as wiring is formed, and has a function of complementing a gap between the rear plate 1a and the second base 2 as a face plate.
Note that the support frame 3 may use a printed partition wall or the like, and is not necessarily required to be a separate member from the first base 1. Further, although provided here on the first base 1, it may be provided on a peripheral portion of the surface of the second base 2 on which patterns such as electrodes and wirings are formed.

The second base 2 is the face plate itself made of glass or the like, on which patterns such as electrodes and wirings are formed. Further, in an image forming apparatus using an electron-emitting device, a phosphor that emits light upon collision with an electron beam is arranged. In the plasma display, wiring and the like are provided.

The first base member 4 and the second base member 5 are frame-shaped metal plates. The first base-side metal member 4 is joined to the support frame 3 around the first base 1 by a joining material 6, and the second base-side metal member 5 is joined to the periphery of the second base 2 by a joining material 6. ing.

The metal material of the first base-side metal member 4 and the second base-side metal member 5 is a Ni—Cr alloy (of which the thermal expansion coefficient is close to that of glass or the like as a base material of the first base 1 and the second base 2). % By weight 42% -6% remaining Fe).

The joining material 6 is a joining material for joining the first base 1, the support frame 3, and the first base metal member 4, and the second base 2 and the second base metal member 5. The bonding material 6 is a bonding material capable of forming a vacuum vessel, and here uses a low melting point glass or the like.

The metal joining portion 7 is a portion for joining the first base metal member 4 and the second base metal member 5 by welding when forming an airtight container of the image forming apparatus. In order to prevent thermal stress due to non-uniform temperature distribution during welding or baking, the metal joint 7 is provided with a first base-side joint 41 of the first base-side metal member 4 and a second base-side metal member. The portion farthest from the second base-side metal bonding portion 51 is welded.
That is, the frames of the first and second base-side metal members 4 and 5 are plate members extending in the horizontal direction, and the inner end is located at the inner end of the support frame 3.
The outer end protrudes horizontally from the outer periphery of the support frame 3 and the outer periphery of the second base 2 by a predetermined width, and a metal joint 7 is formed at the position of the outer end protruding.

The metal joint 7 is preferably formed by beam welding in which heat energy is locally concentrated and acts. However, other welding means such as arc welding and electric welding, as well as soldering and brazing other than welding. For example, various metal bonding means for bonding under an atmosphere near normal temperature can be used.

The deformation-absorbing portion 8 is provided between the joining material 6 and the welding portion 7 of the first base-side metal member 4 or the second base-side metal member 5 by press working or the like in advance. This is a bent portion of the fourth or second base-side metal member 5 that can be elastically deformed. The first base metal member 4 or the second base is converted by converting thermal stress generated in the welded portion 7 due to non-uniform temperature distribution at the time of welding or baking into elastic deformation energy of a bent cross-sectional shape and absorbing the same. The thermal stress transmitted to the joining material 6 of the side metal member 5 is reduced.

The cross-sectional shape of the deformation absorbing portion 8 includes one or more elastically deformable bending processes from the welding portion 7 to the joining material 6 of the first base metal member 4 or the second base metal member 5. Then, the first or second base body side joint 41,
The cross-sectional shape along a straight line connecting the metal joint 51 and the metal joint 7 has a V-shaped shape as shown in FIG. 1B, and FIGS. 1C and 1D.
A U-shaped shape including an arc shape as shown in FIG.

In these embodiments, the deformation absorbing portion 8 is provided on both the first base metal member 4 and the second base metal member 5, and converts the thermal stress into the deformation energy of the bending cross-sectional shape. The ability to convert and absorb is increased. Therefore, the first substrate side metal member 4 or the second substrate side metal member 5
Thermal stress transmitted to the bonding material 6 can be further reduced.

The deformation absorbing portions 8 in FIG.
The second base-side metal members 4 and 5 partially protrude symmetrically in a V-shape at the same position with a joint surface therebetween, and oppose each V-shape of the first and second base-side metal members 4 and 5. It is formed in a rhombus shape such that sides are parallel to each other. In other words, the interval between the first and second base-side metal members 4 and 5 has a portion that becomes narrower from the V-shaped apex of each of the deformation absorbing portions 8 and 8 toward the metal joining portion 7. It has a portion that becomes narrower even on the side opposite to the joint 7, that is, toward the first and second base-side joints 41 and 51, and both ends thereof are closed so that the interval is zero. Since there is a portion that becomes narrower toward the side opposite to the metal joint 7 as described above, the stress is concentrated on the bent deformation absorbing portions 8 and 8, and the stress can be efficiently absorbed. In this case, the deformation absorbing portions 8 are deformed such that the apex angle of the V-shape becomes wider or narrower, in other words, the interval between the vertices of the V-shape becomes wider or narrower.

The deformation absorbing section 8 shown in FIG.
The base-side metal members 4 and 5 are symmetrically protruded partially at the same positions with a joining surface therebetween in a U-shape, and are formed into a circular shape as a whole. In other words, the distance between the first and second base-side metal members 4 and 5 is determined by the U of each of the deformation absorbing portions 8 and 8.
It has a portion that narrows from the top of the character toward the metal joint 7 and has the opposite side to the metal joint 7, that is, the first and second portions.
It has a portion that becomes narrower toward the base-side joints 41 and 51, and both ends are closed so that the interval is zero. Also in this case, since there is a portion that becomes narrower toward the side opposite to the metal joint 7, the stress is concentrated on the bent deformation absorbing portions 8, 8, and the stress can be efficiently absorbed.

The deformation absorbing portions 8 in FIG.
The second base-side metal members 4 and 5 partially protrude at the same position in the same direction (in the illustrated example, on the first base-side metal member 4 side) in a U-shaped shape.

When low-melting glass is used as the bonding material 6, the bonding material 6 has high heat resistance and vacuum holding properties, so that a highly reliable image forming apparatus can be obtained.

Further, the material of the first base member 4 and the second base member 5 is made of a Ni—Cr alloy (42% by weight).
When -6% residual Fe) is used, the first base-side metal member 4,
Since the difference in the thermal expansion coefficient between the second base-side metal member 5 and the first base 1 and the second base 2 such as the low-melting glass of the bonding material 6 and the glass is small, the metal bonding portion 7 is welded or baked. Thermal stress generated in the weld 7 during the process can be reduced,
An image forming apparatus with higher reliability can be obtained.

In the flat image forming apparatus using the electron-emitting device, the inside of the container is evacuated from an exhaust pipe (not shown), and after the vacuum is formed, the exhaust pipe is sealed and the inside is evacuated. In a flat image forming apparatus using plasma, gas is sealed.

[0064]

Next, the present invention will be described based on more concrete embodiments. In the description of the embodiments, description will be made with reference to the drawings referred to in the above embodiments as appropriate.

Embodiment 1 The basic structure of Embodiment 1 of the present invention is an image forming apparatus using an airtight container having the structure shown in FIG. 1, as in the above embodiment.

In the first embodiment, a plurality of surface conduction electron-emitting devices, which are cold cathode electron-emitting devices, are formed on the first substrate 1 as electron-emitting devices, and the second substrate 2 is provided with a phosphor.
An aspect ratio of 3: 4 for an effective display area of 10 inches diagonally
Was produced.

First, the image forming apparatus of the present invention will be described with reference to FIG. Since the basic configuration is the same as that of the above-described embodiment, the same reference numerals are given and the detailed description is omitted, and the characteristic features of the first embodiment will be described.

The first base 1 has a rear plate 1a and a support frame 3 fixed around the rear plate 1a. The rear plate 1a is 350 mm x 300 mm
It is provided with a rear plate 1a on which a pattern of electrodes, wirings and the like is formed on a float glass surface having a thickness of 2.8 mm and further provided with a surface conduction electron-emitting device, and a support frame 3.

The support frame 3 is a frame-shaped member formed by processing float glass to an outer peripheral shape of 290 mm × 270 mm, width 10 mm, and thickness 1.8 mm. The surface of the first base 1 on which patterns such as electrodes and wiring are formed. In the surrounding area. further,
At the gap between the first base 1 and the second base 2 and inside the support frame 3, 50 mm × 1.8 m as an atmospheric pressure support member (not shown)
A large number of mx 25 mm float glass plates were provided. The support frame 3 and an atmospheric pressure support member (not shown) function as an anti-atmospheric pressure support structure when forming a vacuum vessel.

The second substrate 2 is a face plate on which a float glass having a size of 300 mm × 280 mm and a thickness of 2.8 mm, a phosphor which emits light by colliding with electrons on a glass surface, and a pattern such as electrodes are formed. .

The first base-side metal member 4 and the second base-side metal member 5 are frame-shaped metal plates having an outer peripheral shape of 310 mm × 290 mm, a width of 25 mm, and a thickness of 0.2 mm. The first base-side metal member 4 is mounted on the support frame 3 located at the peripheral portion of the first base 1,
The base-side metal member 5 was disposed around the second base 2.

The metal material of the first base-side metal member 4 and the second base-side metal member 5 is a Ni—Cr alloy (of which thermal expansion coefficient is close to that of the float glass as a base material of the first base 1 and the second base 2). % By weight 42% -6% residual Fe) was used.

The joining material 6 includes the first base 1 and the first base side metal member 4, the second base 2 and the support frame 3, and the support base 3 and the second
It is a bonding material for bonding the base-side metal member 5, and here, a low-melting glass (LS-0306, manufactured by NEC Corporation)
It was used.

When forming the container of the image forming apparatus, the metal bonding portion 7 laser-welds the first base-side metal member 4 and the second base-side metal member 5 (YAG laser continuous output 400 W).
This is the part to be sealed. In order to prevent thermal stress due to non-uniform temperature distribution during welding or baking, the metal joint 7 is formed from the joining material 6 joined to the first base metal member 4 and the second base metal member 5. The farthest part was welded.

The deformation absorbing portion 8 has a convex shape (height) whose cross section previously projects in a V-shape between the joining material 6 and the welded portion 7 of the first base metal member 4 or the second base metal member 5. (1 mm, width 1 mm) is a bent portion formed by pressing. By converting the thermal stress generated in the welded portion 7 due to the non-uniform temperature distribution at the time of welding and baking into elastic deformation energy of the convex cross-sectional shape and absorbing it, the first base-side metal member 4 Or the second base member 5
Has the function of reducing the thermal stress transmitted to the bonding material 6.

FIG. 2 is an enlarged view of the corner 9 of the image forming apparatus of FIG.

In the figure, reference numeral 21 denotes a corner deformation absorbing portion.
The corner deformation absorbing portion 21 is previously provided with the deformation absorbing portion 8.
At the same time, the first base-side metal member 4 or the second base-side metal member 5 has a convex (Ma) cross section in the diagonal direction of the image forming apparatus.
This is a corner bent portion obtained by pressing a portion of x height 1 mm and Max width 1 mm). Corner deformation absorber 21
The deformation absorbing portions 8 at the corners of the first base metal member 4 and the second base metal member 5 exhibit a deformation preventing effect on the deformation absorbing portions 8 on adjacent sides forming a right angle like a rib structure. This is means for preventing the rigidity from increasing to the adjacent side to prevent the rigidity from increasing. The convex-shaped bent cross-sectional shape was manufactured so as to gradually decrease from the deformation absorbing portion 8 toward the metal bonding portion 7, the first base 1 or the second base 2.

As described in the above embodiment, as shown in FIG. 1 (c), the deformation absorbing section 8 can obtain the same effect even when the tip of the convex bending process is in a semicircular shape. As shown in FIG. 1D, the same effect can be obtained by making the deformation absorbing portions 8 project in the same direction as the deformation absorbing portions 8 of the first base metal member 4 and the second base metal member 5. .

An image forming apparatus using the above-described electron-emitting device includes a first base 1, a second base 2, a support frame 3, a first base metal member 4, a second base metal member 5, a bonding material 6, It is composed of a metal joint 7 and a deformation absorbing part 8.

After the inside of the container is evacuated from an exhaust pipe (not shown) and a vacuum is formed, the exhaust pipe is sealed and the inside is evacuated.

Next, the internal structure of the image forming apparatus according to the first embodiment will be described with reference to FIG.

FIG. 5 is a perspective view of the image forming apparatus used in this embodiment, in which a part of the panel is cut away to show the internal structure.

On the first base 1, a surface conduction type emission element 5
N × M 2 are formed. (N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels. For example, in a display device for displaying high-definition television, N = 3000, M It is desirable to set the number to be equal to or greater than 1000. In this embodiment, N = 333 and M = 250.) The N × M surface-conduction-type emission elements are composed of M row-directional wirings 53 (upper wirings). ) And N column-directional wires 54 (sometimes referred to as lower wires).

FIG. 6 is a schematic view showing the structure of a surface conduction electron-emitting device to which the present invention can be applied. FIG. 6 (a) is a plan view and FIG. 6 (b) is a cross-sectional view.

In FIG. 6, reference numeral 61 denotes a substrate (which can also be used as the first base 1), 62 and 63 are device electrodes formed on the substrate 61 at predetermined intervals, and 64 is a device electrode formed on the substrate 61. A conductive thin film connecting 62 and 63;
Denotes an electron emitting portion formed partially on the conductive thin film 63.

By forming the conductive thin film 64 through the device electrodes 62 and 63, the conductive thin film 64 is formed.
Is locally destroyed, deformed or altered to form an electron emitting portion 65 in an electrically high-resistance state, and furthermore, an activation step for remarkably improving the emission current is carried out by the above-described conduction of the surface conduction type electron emitting device. When a voltage is applied to the conductive thin film 64 and a current flows through the element, electrons are emitted from the above-described electron emitting portion 65. This element configuration is the same as that of Japanese Patent Application Laid-Open No. Hei 7-235255 described in the related art.

The fluorescent film 58 is provided on the lower surface of the second base 2.
Are formed. Since the present embodiment is a color display device, phosphors R, G, and B of three primary colors of red, green, and blue used in the field of CRT are separately applied to a portion of the fluorescent film 58. The phosphors R, G, B of each color are, for example, as shown in FIG.
As shown in (a), the stripes are separately applied, and a black conductive material 71 is provided between the stripes of the phosphors R, G, and B. The purpose of providing the black conductive material 71 is to prevent the display color from being shifted even if the irradiation position of the electron beam is slightly shifted, and to prevent the reflection of external light to reduce the display contrast. To prevent the fluorescent film from being charged up by the electron beam. Black conductive material 7
Although graphite was used as a main component in 1, any other material may be used as long as it is suitable for the above purpose.

The method of applying the three primary color phosphors R, G, and B is not limited to the stripe arrangement shown in FIG. 7A, but may be, for example, as shown in FIG. 7B. It may be a delta arrangement or any other arrangement.

When a monochrome display panel is formed, a monochromatic phosphor material may be used for the phosphor film 58, and the black conductive material 71 may not be necessarily used.

A metal back 59 known in the field of CRTs is provided on the surface of the fluorescent film 58 on the first base 1 side. The purpose of providing the metal back 59 is to improve the light utilization rate by mirror-reflecting a part of the light emitted from the fluorescent film 58, to protect the fluorescent film 58 from the collision of negative ions, and to use an electron beam. The function may be to function as an electrode for applying an acceleration voltage, or to function as a conductive path for the excited electrons of the fluorescent film 58. The metal back 59 is a fluorescent film 58
Was formed on a face plate substrate 67, the surface of the fluorescent film was smoothed, and Al was formed thereon by vacuum evaporation. When a fluorescent material for low voltage is used for the fluorescent film 58, the metal back 59 is not used.

Although not used in the present embodiment, the second electrode was used for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film.
A transparent electrode made of, for example, ITO may be provided between the base 2 and the fluorescent film 58.

Also, Dx1 to Dxm and Dy1 to Dy
n and Hv are electric connection terminals having an airtight structure provided for electrically connecting the display panel and an electric circuit (not shown). Dx1 to Dxm are electrically connected to the row wiring 53 of the multi-electron beam source, Dy1 to Dyn are electrically connected to the column wiring 54 of the multi-electron beam source, and Hv is electrically connected to the metal back 59 of the faceplate. are doing.

The basic configuration of the image forming apparatus according to the present invention has been described.

In the image display apparatus of the present invention having the above-described structure, the scanning signal and the modulation signal are respectively transmitted to the respective electron-emitting devices through signal terminals (not shown) through the terminals Dx1 to Dxm and Dy1 to Dyn. , The electron is emitted by applying, through the high voltage terminal Hv,
Several k on metal back 59 or transparent electrode (not shown)
A high voltage of V or more is applied to accelerate the electron beam,
8 and the image was displayed by exciting and emitting light.

As a result, the thermal stress at the time of welding the metal joint 7 or during the baking step is absorbed by the deformation absorbing part 8 as elastic deformation energy, and the first base side joint 41 or the second base side joint 51 is absorbed. Is not affected by thermal stress.
The peeling of the bonding material 6 at the base or second base-side bonding portions 41 and 51 is prevented, and problems such as vacuum leakage hardly occur. Accordingly, an image forming apparatus having high reliability and high productivity can be obtained because positioning and sealing are performed in an atmosphere near room temperature without using an expensive alignment apparatus.

Embodiment 2 Next, Embodiment 2 of the present invention will be described.

The second embodiment is different from the first embodiment in that the deformation absorbing portion 8
Are different from each other in cross-sectional shape.
Is the same as

First, the image forming apparatus of the present invention will be described with reference to FIG. FIG. 3A is an overall view of the image forming apparatus according to the second embodiment, and FIG. 3B is an enlarged view of a part around the section AA in FIG.

Since the basic configuration is the same as that of the above-described embodiment, the same reference numerals are given and the detailed description is omitted, and the characteristic features of the first embodiment will be described.

The first base-side metal member 4 and the second base-side metal member 5 are frame-shaped metal plates having an outer peripheral shape of 310 mm × 290 mm, a width of 25 mm, and a thickness of 0.2 mm. The first base-side metal member 4 was arranged on the periphery of the first base 1, and the second base-side metal member 5 was arranged on the support frame 3 around the second base 2.

The metal material of the first base-side metal member 4 and the second base-side metal member 5 is a Ni—Cr alloy (of which thermal expansion coefficient is close to that of the float glass as a base material of the first base 1 and the second base 2). % By weight 42% -6% residual Fe) was used.

The joining material 6 includes the first base 1 and the first base-side metal member 4, the second base 2 and the support frame 3, and the support base 3 and the second base 2.
It is a bonding material for bonding the base-side metal member 5, and here, a low-melting glass (LS-0306, manufactured by NEC Corporation)
It was used.

The metal joint 7 is a portion for sealing the first base metal member 4 and the second base metal member 5 by electron beam welding when forming the container of the image forming apparatus. In order to prevent thermal stress due to non-uniform temperature distribution during welding or baking, the metal bonding portion 7 has a bonding material 6 bonded to the first base metal member 4 and the second base metal member 5.
The part farthest away from was welded.

The deformation absorbing portion 8 has a V-shaped cross section (1 mm in height and 2 m in width) between the bonding material 6 and the metal bonding portion 7 of the first base metal member 4 or the second base metal member 5.
This is a bent portion obtained by pressing the portion m).

The deformation absorbing parts 8 in FIG.
The second base-side metal members 4 and 5 are formed so as to approach the metal bonding portion 7 side, and are formed so as to partially project in a V-shape symmetrically with the bonding surface therebetween. The side of the V-shaped metal joint 7 side is at right angles to the joint surface, and the side opposite to the metal joint 7 is a hypotenuse. As a whole, an isosceles triangle with the metal joint 7 side as the base. Has become. In other words, the first,
The interval between the second base-side metal members 4 and 5 has a portion that becomes narrower on the side opposite to the metal joint 7, that is, toward the first and second base-side joints 41 and 51. The interval is zero.

In this way, the thermal stress generated in the welded portion 7 due to uneven temperature distribution during welding or baking is converted into the elastic deformation energy of the V-shaped bent cross-sectional shape and absorbed. A function of reducing thermal stress transmitted to the bonding material 6 of the first base metal member 4 or the second base metal member 5.

Further, at the time of welding, the first
By sandwiching the deformation absorbing portions 8 of the base-side metal member 4 and the second base-side metal member 5, welding can be performed more reliably.

The basic configuration of the image forming apparatus according to the present invention has been described.

In the image forming apparatus of the present invention, each of the electron-emitting devices 52 has an external terminal Dx1 to Dxm, Dy.
1 to Dyn, a scanning signal and a modulation signal are applied from signal generation means (not shown) to emit electrons, and the metal back 59 is applied through the high voltage terminal Hv.
Alternatively, an image was displayed by applying a high voltage of several kV or more to a transparent electrode (not shown), accelerating the electron beam, causing the electron beam to collide with the fluorescent film 58, and exciting and emitting light.

As a result, the thermal stress at the time of welding or baking the metal joint 7 is absorbed by the deformation absorbing portion 8 as elastic deformation energy, and the first base side joint 41 or the second base side joint 51 is absorbed. Is not affected by thermal stress.
The peeling of the substrate side or second substrate side joint 6 is prevented, and problems such as vacuum leakage hardly occur. Accordingly, an image forming apparatus having high reliability and high productivity can be obtained because positioning and sealing are performed in an atmosphere near room temperature without using an expensive alignment apparatus.

Third Embodiment Next, a third embodiment of the present invention will be described.

The third embodiment differs from the first and second embodiments in that a field emission device, which is a kind of a cold cathode electron emission device, is used as an electron emission device. Is an example in which

First, the field emission device will be described with reference to FIG. 8, and then the image forming apparatus will be described with reference to FIG.

In FIG. 8, reference numeral 81 denotes a rear plate constituting the first base 1, reference numeral 82 denotes a face plate constituting the second base 2, reference numeral 83 denotes a cathode, reference numeral 84 denotes a gate electrode, reference numeral 85 denotes a position between the cathode 83 and the gate electrode 84. The insulating layer 86 formed is a focusing electrode located on the gate electrode 84.

FIG. 4 is an enlarged view of the periphery of the image forming apparatus according to the third embodiment. The overall configuration is the same as in the first and second embodiments.

The first base 1 is provided with a pattern of electrodes and wirings on a float glass surface of 300 mm × 280 mm and 2.8 mm in thickness, and further includes a rear plate 1 a on which a surface conduction electron-emitting device is disposed. .

The second substrate 2 is a face plate having a float glass of 300 mm × 280 mm and a thickness of 2.8 mm, a fluorescent material which emits light upon collision with electrons on a glass surface, and further has a pattern of electrodes and the like formed thereon.

The support frame 3 constituting the first base 1 is made of a float glass having an outer peripheral shape of 290 mm × 270 mm and a width of 10 m.
It is a frame-shaped member processed to have a thickness of 1.8 mm, and is disposed on the periphery of the surface of the first base 1 on which patterns such as electrodes and wirings are formed. Further, a large number of float glass plates of 50 mm × 1.8 mm × 25 mm, which are atmospheric pressure support members (not shown), are arranged inside the gap between the first base 1 and the second base 2 and inside the support frame 3. The support frame 3 and an atmospheric pressure support member (not shown) function as an anti-atmospheric pressure support structure when forming a vacuum vessel.

The first base-side metal member 4 and the second base-side metal member 5 are frame-shaped metal plates having an outer peripheral shape of 310 mm × 290 mm, a width of 25 mm, and a height of 4 mm. First base member 4
Is the peripheral portion of the first base 1, and the second base side metal member 5 is the second
The base 2 was placed on the support frame 3 at the periphery with a thickness of 0.2 mm.

The metal material of the first base-side metal member 4 and the second base-side metal member 5 is a Ni—Cr alloy (of which the thermal expansion coefficient is close to that of the float glass as the base material of the first base 1 and the second base 2). % By weight 42% -6% residual Fe) was used.

The bonding material 6 is a bonding material for bonding the first base 1, the support frame 3, and the first base metal member 4, and the second base 2 and the second base metal member 5, and here, a low melting glass (LS-0306, manufactured by NEC Corporation) was used.

When forming the container of the image forming apparatus, the metal bonding portion 7 laser welds the first base metal member 4 and the second base metal member 5 (YAG laser continuous output 400 W).
This is the part to be sealed. In order to prevent thermal stress due to non-uniform temperature distribution during welding or baking, the metal bonding portion 7 is formed from the bonding material 6 bonded to the first base metal member 4 and the second base metal member 5. The farthest part was welded.

The deformation absorbing portion 8 has a cross section perpendicular to the intermediate portion between the first and second base-side joining portions 41 and 51 of the first base-side metal member 4 or the second base-side metal member 5 and the welded portion 7 in advance. This is a bent portion obtained by pressing a V-shaped (height: 4 mm) portion to be formed.

That is, the first and second base-side metal members 4,
Reference numeral 5 indicates that the side opposite to the metal joint 7 extends horizontally across the deformation absorbing portions 8, 8, and the protrusion on the metal joint 7 side is bent at a right angle toward the first base 1. In the third embodiment, the outer peripheral position of the first base 1 is set to be the same position as the outer peripheral position of the second base 2, and a portion bent at a right angle on the metal bonding portion 7 side with respect to the deformation absorbing portion 8 is defined as the outer periphery of the first base 1. And extends to the position facing.

By converting the thermal stress generated in the welded portion 7 due to the non-uniform temperature distribution at the time of welding and baking into elastic deformation energy of the V-shaped bent cross-sectional shape and absorbing it, the first base metal Member 4 or second substrate side metal member 5
Has the function of reducing the thermal stress transmitted to the bonding material 6.

By forming the deformation absorbing section 8 as in this embodiment, the size can be reduced without increasing the outer diameter of the first base 1 of the image forming apparatus.

The basic configuration of the image forming apparatus according to the present invention has been described.

In the image display device of the present invention having the above-described structure, the scanning signal and the modulation signal are respectively transmitted to the respective electron-emitting devices from the signal generating means (not shown) through the external terminals Dx1 to Dxm and Dy1 to Dyn. , The electron is emitted by applying, through the high voltage terminal Hv,
Several k on metal back 59 or transparent electrode (not shown)
A high voltage of V or more is applied to accelerate the electron beam,
8 and the image was displayed by exciting and emitting light.

As a result, the thermal stress at the time of welding the metal joint 7 or during the baking step is absorbed as elastic deformation energy by the deformation absorbing part 8, and the first base side or the second base side joint 6 is not separated. This prevents problems such as vacuum leakage. Therefore, an image forming apparatus having higher reliability and high productivity can be obtained because positioning and sealing are performed in an atmosphere near room temperature without using an expensive alignment apparatus.

[0130]

As described above, according to the present invention, the following effects can be obtained.

According to the first aspect of the present invention, the first base member is connected between the first base member and the second member, and the second base member is connected to the second base member. Since at least one of the joints has the deformation absorbing portion, the thermal stress at the time of joining such as welding of the joining member joint or during the baking step is absorbed by the deformation absorbing portion as elastic deformation energy, Since no thermal stress is exerted on the first substrate-side joint or the second substrate-side joint, peeling of the first substrate-side joint or the second substrate-side joint is prevented, and a problem such as vacuum leakage hardly occurs. Airtight container is obtained.

In addition, since the positioning and sealing between the first base and the second base are performed in an atmosphere near room temperature,
There is no need to use expensive alignment equipment.

According to the second aspect of the invention, the thermal stress can be effectively absorbed by the deformation of the bent portion in the bending direction.

According to the fifth and sixth aspects of the present invention, since the deformation absorbing portion can manufacture the first base-side metal member and the second base-side joining member by processing such as press working with high productivity, productivity can be improved. A high airtight container is obtained.

According to a seventh aspect of the present invention, the deformation absorbing portion is provided with the first
Since both the base-side joining member and the second base-side joining member have, the thermal stress at the time of joining such as welding of the joining member joining portion or at the time of the baking process is further increased as elastic deformation energy to the deformation absorbing portion. Due to the absorption, thermal stress is less likely to be applied to the first base-side joint or the second base-side joint, and peeling of the first base-side joint or the second base-side joint is prevented, and problems such as vacuum leakage occur. Difficult to do.

The invention according to claim 8 is characterized in that since the bonding agent for the first base bonding part and the second base bonding part is a glass having a low melting point, it has a high heat resistance and a vacuum holding property, and thus has a highly reliable hermetic seal. A container is obtained.

The ninth aspect of the present invention is characterized in that the first and second joining members are metal members, and can be joined by welding or the like near a normal temperature atmosphere.

According to a tenth aspect of the present invention, the material of the first base member or the second base member is Ni-Cr.
The alloy (wt% 42% -6% residual Fe) is a joining material for the first base member or the second base member and the first base joint or the second base joint. Since the difference in the coefficient of thermal expansion between the low melting point glass and the second substrate such as glass is small, the thermal stress at the time of joining such as welding of metal joints or at the time of the baking process can be reduced. can get.

An eleventh aspect of the present invention uses the above-mentioned airtight container, wherein the first base is provided with an electron-emitting device,
Since the base is provided with an image forming unit on which an image is displayed by an electron beam emitted from the electron-emitting device, a highly reliable image forming apparatus that does not easily cause problems such as vacuum leakage can be obtained. .

In addition, since the positioning and sealing between the first base and the second base are performed in an atmosphere near room temperature,
Positioning between the electron-emitting device and the image forming unit can be performed without using an expensive alignment device.

According to the twelfth aspect of the present invention, since the image forming member is made of a phosphor, it is suitable for a large area flat type image forming apparatus.

According to the thirteenth aspect of the present invention, since the electron-emitting device is a cold-cathode electron-emitting device, it is suitable for a large-area flat-type image forming apparatus having a simple structure.

According to the method for manufacturing an airtight container of the invention according to claim 14, the first and second substrates are aligned at room temperature,
The joining members can be joined in an airtight manner. In particular, by forming the deformation absorbing portion, when joining the first base member and the second base member such as metal to each other, the thermal stress is absorbed by the deformation absorbing portion and the first and second base members are joined. Use of other welding means such as arc welding, electric welding, and other various means of joining at room temperature, such as soldering and brazing, as well as beam welding, because peeling of the joining material from the material can be prevented. And productivity can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B show an image forming apparatus according to an embodiment and Example 1 of the present invention. FIG. 1A is a schematic overall perspective view, FIG. FIG. 13C is a peripheral enlarged cross-sectional view showing another configuration example of the deformation absorbing section, and FIG. 14D is a peripheral partial enlarged cross-sectional view showing still another configuration example.

FIG. 2 is a partially enlarged perspective view of a corner portion of the apparatus of FIG.

FIGS. 3A and 3B show an image forming apparatus according to a second embodiment of the present invention, wherein FIG. 3A is a schematic overall perspective view, and FIG.

FIG. 4 is a partial cross-sectional view of the periphery of an image forming apparatus according to a third embodiment of the present invention.

FIG. 5 is a partially cutaway perspective view showing the internal structure of the image forming apparatus of FIG. 1;

FIGS. 6A and 6B show a configuration of the surface conduction electron-emitting device of Examples 1 and 2, wherein FIG. 6A is a plan view and FIG. 6B is a cross-sectional view.

FIG. 7A is an enlarged view showing a stripe-shaped phosphor array, and FIG. 7B is an enlarged view of a delta-shaped phosphor array.

FIG. 8 is a cross-sectional view schematically illustrating a configuration of a field emission device according to a third embodiment.

9A is a sectional view of an airtight container of a conventional image forming apparatus, and FIG. 9B is an enlarged view of a portion A in FIG. 9A.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1; 1st base | substrate 2; 2nd base | substrate 3; support frame 4; 1st base | substrate side metal member 5; 2nd base | substrate side metal member 6; joining material 7; metal joint 8; Part 21; corner deformation absorbing part 52; electron-emitting device 58; fluorescent film

Continued on the front page F term (reference) 5C012 AA05 BC03 5C032 AA01 BB16 BB18 5C036 EE17 EF01 EF06 EF09 EG05 EH01 EH26 5C094 AA31 AA42 AA43 AA48 BA32 BA34 CA19 DA07 DA12 FA01 FA02 FB02 FB12 GB01

Claims (14)

[Claims] 1. An airtight container in which a first base and a second base are bonded via a first base-side bonding member and a second base-side bonding member, wherein the bonding portion between the first base and the second base is the second base. A first-substrate-side joining portion in which the first-substrate-side joining member is joined to one base;
A second base member joined to the second base member,
A first substrate-side joining member and a joining member joining portion in which the first substrate-side joining member and the second substrate-side joining member are joined; and a first substrate-side joining portion of the first substrate-side joining member and a joining member joining portion. An airtight container characterized in that at least one of the second sealing member and the second joining member of the second joining member has a deformation absorbing portion. 2. The airtight container according to claim 1, wherein the deformation absorbing portion has a bent portion. 3. The airtight container according to claim 1, wherein the deformation absorbing portion has a portion in which the distance between the first and second base member is parallel. 4. The deformation absorbing portion has a portion in which the distance between the first base member and the second base member is reduced toward the opposite side of the bonding member. The airtight container according to any one of the above items. 5. A sectional shape of the deformation absorbing portion along a straight line connecting the first or second base-side joining portion and the joining member joining portion has a U shape.
The hermetic container according to any one of claims 1 to 4, wherein the hermetic container has a V shape or a V shape. 6. The method according to claim 1, wherein a cross-sectional shape of the deformation absorbing portion along a straight line connecting the first or second base-side joining portion and the joining member joining portion has a convex shape. An airtight container according to any one of the above items. 7. The deformation absorbing portion is connected to the first base member and the second base member.
The airtight container according to any one of claims 1 to 6, wherein the airtight container has both of the base-side joining members. 8. The airtight container according to claim 1, wherein the bonding agent for the first base joint and the second base joint is a low-melting glass. 9. The airtight container according to claim 1, wherein the first and second joining members are metal members. 10. The first base member or the second base member is made of a Ni—Cr alloy (42% by weight).
The hermetic container according to claim 9, which is 6% residual Fe). 11. An airtight container according to claim 1, wherein an electron-emitting device is provided on a first base, and an image is displayed on a second base by an electron beam emitted from said electron-emitting device. An image forming apparatus, comprising an image forming unit to be provided. 12. An image forming apparatus according to claim 11, wherein said image forming member is a phosphor. 13. The image forming apparatus according to claim 11, wherein the electron-emitting device is a cold cathode electron-emitting device. 14. A bonding portion between a first base and a second base to be bonded to each other, a first base-side bonding portion in which a first base-side bonding member is bonded to a first base, and a second base in a second base. A first base-side joining member joined to the first base-side joining member, and a joining member joining portion joining the first base-side joining member and the second base-side joining member. A method for manufacturing an airtight container in which at least one of a portion between a base-side joint and a joining member joint and between a second base-side joint and a joining member joint of a second substrate-side joining member has a deformation absorbing portion. A deformation absorbing portion is formed in advance on at least one of the first and second base member, and the first and second base members are bonded to the first and second base members. The first base member and the second base member are hermetically bonded to each other. Manufacturing method of airtight container.