JP2000241673A - Optically coupling device and its assembling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform stable adhesion and fixing for a long time, by fixing an optical fiber in a V groove via an adhesive with sandwiching a rectangular groove, and adhering and fixing the surface of the optical fiber via an adhesive at a position away from the rectangular groove. SOLUTION: An optical fiber 5 is placed in a V groove 4 coated with an ultraviolet hardening adhesive 8, and the optical fiber 5 is pressed from above to abut it to the V groove 4. In the state that the optical fiber 5 is pressed, ultraviolet rays are radiated to harden the adhesive 8. Then, it is left in a heating furnace to bake the adhesive 8. After the adhesive 8 is completely hardened and reacted by baking, the thermosetting adhesive 9 is put on the upper part of the optical fiber 5. A position to be coated is between a part where the ultraviolet hardening adhesive 8 is charged into the V groove 4 and an uncharged part. Then, it is baked in the heating furnace to completely harden and react the adhesive 9 to adhere and fix the optical fiber 5 to the V groove 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device used as a light source for optical communication, and more particularly to an optical coupling device having improved optical coupling for optically coupling a semiconductor device and an optical fiber.

[0002]

2. Description of the Related Art Conventionally, an optical module is disclosed in
No. 61,674 discloses that in an optical module in which an optical element and an elongated optical waveguide (optical fiber) are mounted on a substrate, a metal coating is formed on each of the joints between the substrate and the optical module. There is disclosed an optical waveguide body fixed to a substrate by mutually diffusing and joining metal atoms.

The optical fiber mounting structure of the optical coupling device disclosed in Japanese Patent Application Laid-Open No. 10-268168 is to fix an optical fiber in a V-groove on a silicon substrate at two places, a temporary fixing portion and a main fixing portion. is there.

[0004]

Problems to be Solved by the Invention Japanese Patent Application Laid-Open No. 9-61674
The optical fiber mounting structure of the optical coupling device described in Japanese Patent Application Laid-Open Publication No. H11-129572 is a structure in which an optical fiber provided with a metallized film is bonded to a V-groove. In some cases, the center of the optical fiber does not coincide with the center of the optical fiber. As a result, the coupling efficiency between the semiconductor laser and the optical fiber decreases, and the level of output light from the optical fiber decreases. In addition, a filler is applied so as to surround the optical fiber, thereby reinforcing the bonding of the optical fiber. Therefore, in the case of a filler having a high curing shrinkage, a force for lifting the optical fiber acts. As a result, the optical fiber may be separated from the V-groove, resulting in a displacement of optical coupling between the semiconductor laser and the optical fiber.

In the optical fiber mounting structure of the optical coupling device described in Japanese Patent Application Laid-Open No. 10-268168, the optical fiber is securely fixed to the V-groove of the silicon substrate at two places, the temporary fixing part and the main fixing part. I have. The silicon substrate is installed inside a package case body made of ceramics to obtain a high reliability. In this case, there is no significant difference between the coefficient of thermal expansion of the ceramic and the coefficient of thermal expansion of the silicon substrate. Therefore, even if a temperature cycle test is performed to confirm the long-term reliability of the optical coupling device, the silicon substrate is unlikely to undergo thermal deformation, and there is no displacement of the optical coupling between the semiconductor laser and the optical fiber. . However, when the package case body is made of plastic, since the coefficient of thermal expansion is larger than that of ceramics, the silicon substrate is easily deformed by heat. As a result, the optical fiber may be separated from the V-groove, resulting in a displacement of optical coupling between the semiconductor laser and the optical fiber.

SUMMARY OF THE INVENTION An object of the present invention is to realize stable bonding and fixing and optical coupling between a semiconductor element and an optical fiber for a long period of time even when plastic is used as a material of a package case constituting an optical coupling device. An object of the present invention is to provide an optical fiber mounting structure and an optical coupling device to which the mounting structure is applied.

[0007]

In order to achieve the above-mentioned object, according to the present invention, a rectangular groove is formed in the middle of a V-groove provided in a substrate member in a direction perpendicular to the V-groove, and the optical fiber is formed in the rectangular shape. A first adhesive is fixed in the V-groove with the groove interposed therebetween, and the surface of the optical fiber is adhered with a second adhesive at a position opposite to the rectangular groove on the side opposite to the semiconductor element installation side. It is characterized by being fixed.

The length of the optical fiber bonded and fixed to the substrate member is in the range of 1/10 to 2/10 of the length of the box-shaped portion of the case.

Further, the first adhesive is an ultraviolet curing adhesive, and the second adhesive is a thermosetting adhesive.

[0010] First, an ultraviolet curing adhesive is applied to the V groove opposite to the side on which the semiconductor element is mounted with the rectangular groove interposed therebetween, and an optical fiber is placed in the V groove to which the ultraviolet curing adhesive is applied. Then, the optical fiber is pressed from above so as to contact the V groove near the rectangular groove opposite to the side on which the semiconductor element is mounted with the rectangular groove interposed therebetween. The optical fiber is adhered and fixed by curing the agent, and then a thermosetting adhesive is applied to the upper surface of the optical fiber separated from the rectangular groove and bonded with the ultraviolet curing adhesive, and baked in a heating furnace. To cure the adhesive and bond and fix the optical fiber.

[0011] Even when a plastic material is used as a package case material constituting the optical coupling device, the optical fiber is bonded and fixed with two types of adhesives, an ultraviolet curing adhesive and a thermosetting adhesive, and the length of the substrate member is reduced. By optimizing the bonding length of the sheath, it is possible to prevent peeling of the optical fiber from the V-groove portion due to thermal deformation of the case. Regarding the use of two types of adhesives, the optical fiber can be bonded and fixed in a short time without applying heat by pressing and fixing the optical fiber with a V-groove with an ultraviolet curing adhesive. For this reason, it is possible to reliably bond the optical fiber in a state where the optical fiber is in contact with the V groove. Furthermore, by applying a thermosetting adhesive from the upper surface of the optical fiber and bonding and fixing the optical fiber to the substrate member, the bonding strength of the optical fiber can be increased.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In each of the drawings, some of the metallized wiring, wire bonding, adhesives, and the like are omitted as appropriate to avoid complication.

FIG. 5 shows the overall structure of an optical coupling device according to an embodiment to which the present invention is applied.

In FIG. 5, an optical coupling device comprises a laser diode 1 as a semiconductor light emitting element, a photodiode 2 as a semiconductor light receiving element, a substrate member 3 on which these semiconductor light receiving and emitting elements are mounted, and a laser diode. 1 and an optical fiber 5 which is optically coupled to the photodiode 2 and internally transmits laser light. The substrate member 3 has a V-groove 4 for installing an optical fiber 5, adhesives 8 and 9 for bonding and fixing the optical fiber 5 to the V-groove 4, a laser diode 1 and a photo diode 2. A metallized pattern film (not shown) for electrically connecting the external device to the outside of the device is formed, and an electrode terminal 15 for external connection is connected to a terminal of the metallized pattern film. Further, it has a case 12 provided with a frame 11 for mounting and housing the substrate member 3, and a cap 14 for protecting the inside of the case 12 from the outside, so that the laser diode 1, the photo diode 2 and the light Optical coupling with the fiber 5 is performed directly.

The case 12 is made of a box-shaped plastic material, and has eight electrode terminals 15 on each side, eight in total (however, the number of terminals is not limited to this embodiment). Absent). The frame 12 made of a metal material for mounting the board member 3 is provided inside the case 12. A cap 14 for shielding the inside of the case 12 from the outside is joined to the upper surface. From the box-shaped portion of the case 12, a projection (right side of the paper surface in FIG. 5) serving as an optical fiber holding portion 13 is provided.
The optical fiber 5 and the optical fiber coating 16 are installed on the substrate and held and fixed with an adhesive (not shown).

In this embodiment, the size of the box-shaped case 12 is, for example, 2.6 m in height (vertical direction on the paper of FIG. 5).
m, the width (vertical direction to the paper surface in FIG. 5) is 7.6 mm, and the length (horizontal direction to the paper surface in FIG. 5) is 21.0 mm.
The electrode terminals 15 are provided at intervals of 2.54 mm.

The optical fiber 5 has a V
The case 12 is bonded and fixed to the groove 4 with adhesives 8 and 9.
The optical fiber holding part 13 protruding from the optical fiber is also fixed by an adhesive (not shown). The height position of the optical fiber 5 attached to the substrate member 3 is different from the height position of the optical fiber 5 attached to the optical fiber holding portion 13 of the case 12, and the optical fiber 5 is attached in a bent state. ing. That is, the optical fiber 5 attached to the substrate member 3 gradually separates from the substrate member 3 so as to draw a curve,
It is installed on the optical fiber holding unit 13.

The difference between the height positions is in the range of 0.1 to 0.2 mm, and the optical fiber 5 is deflected within this range. By making the optical fiber 5 bend, the case 1
The structure absorbs the axial force due to the tensile and compressive deformation of the optical fiber 5 accompanying the thermal deformation of the frame 2 and the frame 11 and does not apply an external force to the bonding portion of the substrate member 3 to the optical fiber 5.

FIG. 1 shows an embodiment of an optical fiber mounting structure. FIG. 2 shows a horizontal sectional view of FIG. FIG.
Are longitudinal sectional views taken along the line AA ′ to DD ′.
FIG. 4 is a graph showing the relationship between the length of the substrate member and the amount of warpage.

1 and 2, laser diode 1 and photodiode 2 are markers (not shown) on metallized pattern film 7 formed on the upper surface of silicon substrate 3.
Are positioned at predetermined positions and mounted. Further, a laser diode 1 and a photodiode 2
Are electrically connected to the metallized pattern film 7 on the upper surface of the silicon substrate 3 via wire bonding (not shown).

In the silicon substrate 3, a V-shaped groove 4 having a substantially V-shaped cross section with a bottom is formed by anisotropic etching, and the V-shaped groove 4 is constituted by slopes on both sides and a bottom surface. . The V-groove 4 has its axis aligned with the laser diode 1.
The direction is substantially parallel to the optical axis direction of the laser light between the photodiode 2 and the optical fiber 5. Furthermore, V
As shown in FIG. 2, the vertical height of the bottom surface of the groove 4 is constant in the axial direction (that is, the bottom surface is a horizontal plane).

On the other hand, the substrate member 3 is formed by cutting a rectangular groove 6 having a concave sectional shape with a bottom cross section. The axis of the rectangular groove 6 is substantially perpendicular to the optical axis direction of the laser light between the laser diode 1 and the photodiode 2 and the optical fiber 5. The position where the rectangular groove 6 is formed depends on the V formed by anisotropic etching.
The side opposite to the side on which the laser diode 1 is mounted with respect to the slope at the end of the groove 4 (the surface facing the optical fiber tip 10), for example, 0.3 ± 0.1 mm away from the slope at the end of the V-groove 4 Position. The rectangular groove 6 serves as a dam so that the adhesive 8 applied when the optical fiber 5 is bonded and fixed to the V groove 4 does not flow along the V groove 4 to the optical fiber tip 10 or the laser diode 1. have. In addition,
The substrate member 3 has a thickness (vertical direction in FIG. 2) of 0.4 mm, a width (vertical direction in FIG. 1) of 1.5 mm, and a length (horizontal direction in FIG. 1) of 4.5 mm. I have.

The optical fiber 5 is a single mode optical fiber having a core diameter of 10 μm, which is an optical transmission region, and an outer diameter of φ0.125 mm. The optical fiber 5 is attached to the V-groove 4 formed in the substrate member 3 by anisotropic etching,
If the V-groove 4 is accurately formed at a predetermined position with a predetermined depth and width by directly bonding and fixing at 9, the laser emitting part of the laser diode 1 and the laser incident part of the photodiode 2 and the optical fiber 5 The height of the optical axis (center axis) can be adjusted without adjustment.

The optical fiber 5 and the V-groove 4 are fixed with two kinds of adhesives. One is an ultraviolet curing adhesive 8 and the other is a thermosetting adhesive 9. UV curing adhesive 8
It is applied in advance to the V-groove 4, and the optical fiber 5 is set in the V-groove 4 and irradiated with ultraviolet rays to be cured. The thermosetting adhesive 9 is applied to the upper part of the optical fiber 5 bonded and fixed with the ultraviolet curing adhesive 8, and is baked and cured in a heating furnace. The length of adhesively fixing the optical fiber 5 with the ultraviolet curing adhesive 8 is about half the length of the V groove 4. For example, when the length of the substrate member 3 is, for example, 4.5 mm, the length at which the V groove 4 is formed is about 3.0 mm (because the laser diode 1 and the photodiode 2 are mounted on the substrate member 3). .

The position where the optical fiber 5 is fixed by the thermosetting adhesive 9 is determined by applying the adhesive 9 between a portion where the ultraviolet curing adhesive 8 is filled in the V-groove 4 and a portion where the ultraviolet curing adhesive 8 is not filled. Is being done.

FIG. 3 shows the state of adhesion between the optical fiber 5 and the V-groove 4.
(1) to (4) are shown. FIG. 3A is a vertical cross-sectional view between the laser diode 1 and the rectangular groove 6, where no adhesive 8 is provided, and the optical fiber 5 is installed in contact with both slopes of the V groove 4. ing. FIG. 3 (2) shows a portion where the ultraviolet curing adhesive 8 is applied to the V-groove 4 and the optical fiber 5 is installed. At this portion, the optical fiber 5 is pressed and brought into contact with the V-groove 4. Thereby, the optical fiber 5
Are in contact with both slopes of the V-groove 4, and the ultraviolet-curing adhesive 8
Is filled between the V-groove 4 and the optical fiber 5, and the optical fiber 5
The extra adhesive protrudes on both sides of the optical fiber 5 and the optical fiber 5 is bonded and fixed. FIG. 3 (3) shows a portion to which the thermosetting adhesive 9 is applied, and the optical fiber 5 is bonded and fixed so as to cover the ultraviolet curing adhesive 8 and the upper part of the optical fiber 5. From this portion, the separation of the optical fiber 5 from the V-groove 4 due to the deflection starts gradually. FIG. 3D shows a portion where the adhesive is not applied, and the optical fiber 5 is bent without being in contact with the V-groove 4 because the optical fiber 5 is bent.

Next, a method for bonding and fixing the optical fiber 5 to the substrate member 3 will be described. First, the V of the substrate member 3 on which the laser diode 1 and the photodiode 2 are mounted
An ultraviolet curing adhesive 8 is applied to the groove 4. The application position is near the rectangular groove 6 opposite to the side on which the laser diode 1 is mounted with the rectangular groove 6 interposed therebetween.

The optical fiber 5 is placed in the V-groove 4 to which the ultraviolet curing adhesive 8 has been applied, and the optical fiber 5 is pressed from above to bring the optical fiber 5 into contact with the V-groove 4. The pressing position is near the rectangular groove 6 to which the ultraviolet curing adhesive 8 is applied. Ultraviolet rays are irradiated while the optical fiber 5 is kept pressed to cure the adhesive 8. After curing the adhesive 8 with ultraviolet rays, the adhesive 8 is baked by being left in a heating furnace. After the adhesive 8 is completely cured by baking,
A thermosetting adhesive 9 is applied on the optical fiber 5. The application position is between a portion where the ultraviolet curing adhesive 8 is filled in the V groove 4 and an unfilled portion.

Adhesive 9 applied on top of optical fiber 5
Is applied so as not to flow into the V-groove 4 and the upper part of the optical fiber 5 bonded and fixed with the ultraviolet curing adhesive 8. After the adhesive 9 is applied, baking is performed in a heating furnace, and the adhesive 9 is completely cured, whereby the optical fiber 5 is bonded and fixed to the V groove 4 of the substrate member 3.

Next, the operation and effect of the above configuration will be described.

Even when a plastic material is used as the material of the case 12 of the optical coupling device, the optical fiber 5 is bonded and fixed by using two types of adhesives, namely, an ultraviolet curing adhesive 8 and a thermosetting adhesive 9. By optimizing the length of the optical fiber 5 and the bonding length of the optical fiber 5, it is possible to prevent the optical fiber 5 from peeling from the V-groove 4 due to the thermal deformation of the case 12. First, the optical fiber 5 can be bonded and fixed using an ultraviolet curing adhesive 8 without applying heat. For this reason, it is possible to reliably bond the optical fiber 5 in a state where the optical fiber 5 is in contact with the V groove 4. Next, a thermosetting adhesive 9 is applied from the upper surface of the optical fiber 5 and the optical fiber 5 is adhered and fixed to the substrate member 3 so that the adhesive fixing strength of the optical fiber 5 can be increased.

In the case 12 in which four electrode terminals 15 are provided on each side of the box-shaped portion at intervals of 2.54 mm, the length of the box-shaped portion of the case 12 is, for example, about 10 mm. For this reason, the length of the substrate member 3 housed in the case 12 is set in the range of 1 to 1.8 times the distance between adjacent terminals of the electrode terminal 15, and the bonding length of the optical fiber 5 is set to the box-shaped portion of the case 12. Within the range of one tenth to two tenths of the length.

Thus, even if the case 12 is thermally deformed and the substrate member 3 is deformed, buckling deformation of the optical fiber 5 bonded and fixed to the substrate member 3 can be prevented. For this reason,
Separation of the optical fiber 5 from the V groove 4 can be prevented. When the optical fiber 5 is bonded and fixed to the V-groove 4 of the substrate member 3 over a long distance, the optical fiber 5 buckles and peels because the difference in thermal expansion coefficient between the substrate member 3 and the optical fiber 5 is large.

The present inventors have confirmed that when the optical fiber 5 is bonded and fixed to the substrate member 3 over 3.0 mm or more, the optical fiber 5 is buckled and peeled. The peeling is related to the length of the substrate member 3 and the amount of warpage of the surface of the substrate member 3. FIG. 4 shows the relationship.

When the length of the substrate member 3 is 5.0 mm, the amount of warpage on the surface of the substrate member 3 is about 4.0 μm. When the optical fiber 5 is bonded and fixed to the substrate member 3 over the entire length of the V-groove 4, the optical fiber 5 undergoes buckling deformation, and peeling occurs near the center of the substrate member 3. The length of the substrate member 3 is 3.5
mm, the amount of warpage can be reduced to about 1.7 μm,
Even if the optical fiber 5 is bonded and fixed to the substrate 3 over the entire length of the V-groove 4, the buckling deformation of the optical fiber 5 does not occur and no separation occurs.

Therefore, the length of the substrate member 3 is set to 3.0 to 4.0.
5 mm, and the bonding length of the optical fiber 5 is 1.0 to 2.5.
By setting mm, the amount of warpage of the substrate member 3 can be reduced, and buckling deformation of the optical fiber 5 does not occur. As a result, it is possible to prevent the optical fiber 5 from separating from the V-groove 4.

Further, since the optical fiber 5 is directly bonded and fixed to the V-groove 4 formed on the substrate member 3 by anisotropic etching with the adhesives 8 and 9, the V-groove 4 is accurately positioned in advance at a predetermined position. By forming the optical fiber 5 at a predetermined depth and width, the height of the laser emission part of the laser diode 1 and the laser incidence part of the photodiode 2 and the optical axis (center axis) of the optical fiber 5 can be adjusted without adjustment. .

Further, the upper part of the optical fiber 5 is pressed at a position near the rectangular groove 6 so that the optical fiber 5 is securely brought into contact with the V groove 4 on the side where the laser diode 1 is mounted with the rectangular groove 6 interposed therebetween. The optical fiber 5 is installed so as to gradually separate from the V-groove 4 on the side opposite to the side on which the laser diode 1 is mounted with the pressing position interposed therebetween. Thereby, the optical fiber 5 on the side opposite to the side where the laser diode 1 is mounted with the pressing position interposed therebetween can be bonded and fixed in a state where the optical fiber 5 is naturally bent, and the optical fiber 5 and the bonded portions 8 and 9 have residual strain or peeling. Can be adhered and fixed without causing the problem.

As a result, when the optical fiber 5 is bonded and fixed, the deformation of the substrate member 3 due to the deformation of the case 12 that causes the bonded portion of the optical fiber 5 to peel off, the buckling deformation of the optical fiber 5, and the like. The problem can be eliminated, and the separation of the optical fiber 5 from the V groove 4 can be prevented. Therefore, even if a plastic material having a high coefficient of thermal expansion and undergoing large thermal deformation is used as the material of the package case 12 constituting the optical coupling device, the optical fiber 5 does not peel off, and is stably bonded and fixed for a long time. Further, optical coupling between the laser diode 1 and the optical fiber 5 can be realized. Further, the optical fiber 5 is directly bonded and fixed to the V groove 4 with the adhesives 8 and 9 without applying a metallized film to the surface of the V groove 4 of the substrate member 3 or the surface of the optical fiber 5 as in the conventional structure.
The effect of reducing the cost of parts and the number of working steps can be achieved.

In the above embodiment, an optical coupling device having both a laser diode 1 and a photodiode 2 as semiconductor elements has been described as an example. However, the present invention is not limited to this, and only one of them is provided. The same effect can be obtained by applying the present invention to an optical coupling device.

[0041]

According to the present invention, in bonding and fixing an optical fiber, problems such as deformation of a substrate member and deformation of a buckling of the optical fiber due to deformation of a case that causes peeling of the bonded portion of the optical fiber. And the optical fiber is V
Separation from the groove can be prevented. Therefore, even if a plastic material that has a high coefficient of thermal expansion and undergoes large thermal deformation is used as the package case material that composes the optical coupling device, stable adhesive fixation and optical coupling between the semiconductor element and the optical fiber are realized over a long period of time. can do.

[Brief description of the drawings]

FIG. 1 is a top view illustrating an optical fiber mounting structure according to an embodiment of the present invention.

FIG. 2 is a horizontal sectional view of the optical fiber mounting structure diagram shown in FIG.

FIG. 3 is a sectional view of the optical fiber mounting structure shown in FIG.
It is a longitudinal cross-sectional view of the part from 'to DD'.

FIG. 4 is a graph showing the length of the substrate member and the amount of warpage of the surface of the substrate member.

FIG. 5 is a horizontal sectional view illustrating the entire structure of the optical coupling device according to the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laser diode, 2 ... Photodiode, 3 ... Substrate member, 4 ... V groove, 5 ... Optical fiber, 6 ... Rectangular groove, 7 ...
Metallized pattern film, 8: UV curing adhesive, 9: Thermosetting adhesive, 10: Optical fiber end face, 11: Metal frame, 12: Package case, 13: Optical fiber holding part, 14: Cap, 15: Electrode terminal, 16 ... Optical fiber coating.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Shoichi Takahashi Inventor Semiconductor Company, Hitachi Ltd. 5-2-1, Kamizuhoncho, Kodaira-shi, Tokyo (72) Inventor Hiroshi Nakami Kamishimihoncho, Kodaira-shi, Tokyo 5-20-1, Hitachi, Ltd. Semiconductor Division, Hitachi, Ltd. (72) Inventor Toshimasa Miura 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture F-term in Hitachi, Ltd. Production Technology Research Laboratory F-term (reference) 2H037 AA01 BA02 BA11 DA04 DA12 DA17 5F073 AB21 BA01 EA15 FA02 FA07 FA12 FA22 5F088 BA11 BB01 CB20 EA09 GA07 JA14

Claims (4)

[Claims] 1. A semiconductor device comprising: a substrate member; a semiconductor element comprising at least one of a semiconductor light emitting element and a semiconductor light receiving element provided on the substrate member; and a semiconductor element fixed to a V-groove provided on the substrate member. An optical coupling device comprising an optical fiber optically coupled to internally transmit a laser beam and a box-shaped case accommodating the substrate member, wherein the V-groove provided in the substrate member is orthogonal to the V-groove. A rectangular groove is formed in the direction, and the optical fiber is bonded and fixed with a first adhesive in a V-groove with the rectangular groove interposed therebetween, and a position farther than the rectangular groove on a side opposite to the semiconductor element installation side. Wherein the surface of the optical fiber is bonded and fixed with a second adhesive. 2. The optical coupling device according to claim 1, wherein the length of the optical fiber bonded and fixed to the substrate member is one tenth to two tenths of the length of the box-shaped portion of the case.
The optical coupling device is within the range of. 3. An optical coupling device according to claim 1, wherein said first adhesive is an ultraviolet curing adhesive, and said second adhesive is a thermosetting adhesive. apparatus. 4. An assembling method of an optical coupling device having an optical element and an optical fiber mounted thereon, wherein the method of bonding the optical fiber includes first applying an ultraviolet curing adhesive to the optical element with a rectangular groove formed on a substrate interposed therebetween. Apply to the V groove on the side opposite to the side where it is mounted,
The optical fiber is installed in a V-groove coated with an ultraviolet-curing adhesive, and the optical fiber is contacted with a V-groove near a rectangular groove opposite to the side on which the semiconductor element is mounted with the rectangular groove interposed therebetween. Is pressed from the top, and in this state, the optical fiber is adhesively fixed by irradiating ultraviolet rays to cure the ultraviolet curing adhesive, and then the thermosetting adhesive is separated from the rectangular groove,
An optical coupling device assembling method, wherein the method is applied to an upper surface of the optical fiber bonded with the ultraviolet curing adhesive, baked in a heating furnace, and the adhesive is cured to bond and fix the optical fiber.