JP2000241641A - Optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase availability per one heater chip and reduce space and manufacturing cost, by providing planar optical chips on both sides of the heater chip. SOLUTION: Two planar optical chips 11 are mounted onto both sides of a flat heater chip 12 via a thermally conductive material layer 14 or the like, and a temperature sensor 13 such as a thermistor is mounted to the front surface side of at least one planar optical chip 11. As the planar optical chip 11, an AWG chip comprising a quartz-based optical wave guide chip, or an optical chip made of semiconductor is used. As the flat heater chip 12 whose both sides generate heat, a double-side ceramic flat heater whose both sides generate heat with conduction to an electrode 12a is used. In the case of the ceramic flat heater, its both sides have substantially equal temperature states since the conduction causes heat generation of the ceramic itself.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device having a flat optical chip requiring temperature control.

[0002]

2. Description of the Related Art For example, in the case of a thin plate-shaped AWG (arrayed waveguide diffraction grating) chip (quartz-based planar optical waveguide chip), there is a temperature characteristic. It is necessary to constantly heat to a predetermined temperature.

For this reason, conventionally, as shown in FIG. 3, for example, a flat AWG chip 1 is provided on one side with a heater chip 2 which is also flat, thereby heating the AWG chip 1 side to a predetermined temperature. Maintain temperature. The control temperature is controlled by a temperature sensor 3 provided on the AWG chip 1 side.
It is done in. As described above, as the flat heater chip 2, for example, a patterned heat generating portion is provided on a heat-resistant substrate, and the temperature is controlled by supplying electricity to the heat generating portion.

[0004]

However, in the case of such a device having a conventional structure, after all, one AW
Since one heater chip is required for the G chip, there is a problem that the cost increases depending on the application.

In other words, in a case where only one AWG chip is used in a certain place such as an optical device or device to be used,
The above-described conventional structure may be used. However, in a case where a plurality of AWG chips need to be integrated and used at the same place or a close place of an optical device or the like, if one AWG chip has one heater chip, a heater may be used. There is room for improvement such as a reduction in chip utilization efficiency, inability to save space, and complicated temperature control.

The present invention has been made in view of such a conventional problem, and focuses on a double-sided heating type heater chip. A flat optical chip such as an AWG chip is provided on both sides of the heater chip. Accordingly, it is an object of the present invention to provide an excellent optical device in which the utilization efficiency per heater chip is improved, and the space saving and the manufacturing cost are reduced.

[0007]

According to a first aspect of the present invention, there is provided a flat heater chip of a double-sided heating type, wherein a flat optical chip requiring temperature control is provided on both sides thereof. In the device.

According to a second aspect of the present invention, the flat optical chip is an optical waveguide chip.
The optical device described above.

[0009]

1 and 2 show an example of an optical device according to the present invention. In the drawings, 11 and 11 are planar optical chips, 12 is a flat heater chip of a double-sided heating type, and 13 Is a temperature sensor.

That is, in the optical device according to the present invention, two flat optical chips 11, 11 are attached to both sides of the flat heater chip 12 via the heat conductive material layers 14, 14, and at least one of them. It has a structure in which a temperature sensor 13 such as a thermistor is attached to the front side of the planar optical chip 11.

The planar optical chip 11 is not particularly limited as long as it is an optical element that needs to be maintained at a predetermined heating temperature, but is not limited to an AWG chip composed of the above-described quartz-based optical waveguide chip or a semiconductor. Optical chips.

As the flat heater chip 12 of the double-sided heating type, there is a ceramic flat heater of a type in which both sides generate heat by energizing the electrodes 12a, 12a. In the case of a ceramic flat heater, the ceramic itself generates heat when energized, so that both surfaces are at substantially the same temperature. Therefore, the temperature sensor 13
Is sufficient if it is mounted on the upper surface side of one of the planar optical chips 11 and the detected temperature of the other planar optical chip 11
The control temperature on the side can be regarded as substantially the same value. In addition, 13a is a sensor lead wire.

The heat conductive material layer 14 includes:
For example, grease having good heat conductivity may be used.

With such a structure, in the optical device of the present invention, when it is necessary to use a plurality of planar optical chips 11 at the same place or a close place such as an optical device, two optical chips must be used. Since one heater chip can handle it,
The heater chip cost per optical chip is reduced.
Further, even in the case of a temperature sensor, it is possible to sufficiently cope with the temperature sensor, so that the cost can be reduced in this regard.

Further, when a plurality of optical chips are used in the same place or a close place of an optical device or the like, a plurality of optical devices corresponding to this are required in the conventional structure. In the present invention, only half of the number of optical devices need be used, so that significant space saving can be achieved.

In the actual use of the optical device according to the present invention, the optical device is arranged in a closed space. When a temperature difference occurs between the upper and lower sides due to, for example, the flat surface may be installed vertically (vertically). Thereby, the left and right flat optical chips 11, 1
Since the temperature condition 1 is substantially uniform, proper operation of both can be obtained.

[0017]

As is apparent from the above description, according to the present invention, the excellent use efficiency of the heater chip and the use efficiency of the temperature sensor can be achieved, the space can be saved, and the manufacturing cost can be reduced. Optical device is obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an optical device according to the present invention.

FIG. 2 is a longitudinal sectional view showing the optical device of FIG.

FIG. 3 is a perspective view showing a conventional optical device.

[Explanation of symbols]

 Reference Signs List 11 flat optical chip 12 flat heater chip 13 temperature sensor 14 heat conductive material layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenichiro Asano 1440 Mutsuzaki, Sakura City, Chiba Prefecture Fujikura Co., Ltd. Sakura Plant F-term (reference) 2H047 KA04 TA47

Claims (2)

[Claims] 1. An optical device characterized in that a flat optical chip requiring temperature control is provided on both sides of a flat heater chip of a double-sided heating type. 2. The optical device according to claim 1, wherein said planar optical chip is an optical waveguide chip.