JP2000241142A - Circuit part-inspecting device - Google Patents

Circuit part-inspecting device

Info

Publication number
JP2000241142A
JP2000241142A JP11049101A JP4910199A JP2000241142A JP 2000241142 A JP2000241142 A JP 2000241142A JP 11049101 A JP11049101 A JP 11049101A JP 4910199 A JP4910199 A JP 4910199A JP 2000241142 A JP2000241142 A JP 2000241142A
Authority
JP
Japan
Prior art keywords
voltage
light
light emitting
failure
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11049101A
Other languages
Japanese (ja)
Inventor
Koji Kitayama
綱次 北山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP11049101A priority Critical patent/JP2000241142A/en
Publication of JP2000241142A publication Critical patent/JP2000241142A/en
Pending legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To quickly detect failure such as the burnout of light-emitting equipment or the like for coping with the failure by providing a means for detecting the failure of the light-emitting equipment being included into a lighting means according to change in voltage in the conduction circuit of the light-emitting equipment. SOLUTION: Light emitting diodes 10A-10D are mutually connected in series, and are positioned between power supply transistors 91. The transistor 91 forms a current control circuit along with a differential amplifier 92 that is connected to the base, the collector is connected to the light-emitting diode 10D, and a current detection resistor 93 is connected between an emitter and the ground. When one of the light-emitting diodes 10A-10D is burned out, the collector current of the transistor 91 reaches 0. An output voltage Vo of the differential amplifier 92 is increased for returning a detection voltage Vr to an original state, and reaches a saturation voltage. When a reference voltage Vb is set to an appropriate value being smaller than the saturation voltage, a failure signal Sa is outputted from a voltage comparator 94 when the output voltage Vo exceeds the reference voltage Vb.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は回路部品の半田付け
状態等を検査する回路部品検査装置に関し、特に回路部
品を照明して得られる画像に基づいて回路部品の状態を
検査する回路部品検査装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component inspection apparatus for inspecting a soldering state of a circuit component, and more particularly to a circuit component inspection apparatus for inspecting the state of a circuit component based on an image obtained by illuminating the circuit component. About.

【0002】[0002]

【従来の技術】例えば特開平10−90191号には、
回路部品の半田付け状態を検査する半田付け検査装置が
開示されている。これは、回路基板上の回路部品のリー
ド部を含む領域を照明装置で照明して撮像装置でその画
像を得、得られた画像内で高輝度の連続領域の外周を追
跡して、追跡軌跡の長さより「半田ブリッジ」「半田欠
け」等の半田付け不良を検出するものである。このよう
な検査装置では回路部品を一定の照度で照明しないと検
査結果に誤差を生じる。そこで、光校正板等を使用して
回路基板上の照度が常に一定になるように照明装置の複
数の発光器の発光量を制御するものがある(例えば特開
平8-152311号)。
2. Description of the Related Art For example, Japanese Patent Application Laid-Open No. 10-90191 discloses that
A soldering inspection device for inspecting a soldering state of a circuit component is disclosed. This involves illuminating the area including the lead of the circuit component on the circuit board with an illuminating device, obtaining the image with an imaging device, and tracing the outer periphery of a high-luminance continuous area in the obtained image. It detects a soldering failure such as "solder bridge" or "solder chipping" from the length of the solder. In such an inspection apparatus, an error occurs in the inspection result unless the circuit components are illuminated with a constant illuminance. Therefore, there is a method of controlling the light emission amount of a plurality of light emitters of a lighting device using an optical calibration plate or the like so that the illuminance on the circuit board is always constant (for example, Japanese Patent Application Laid-Open No. Hei 8-152311).

【0003】[0003]

【発明が解決しようとする課題】しかし、発光器の一つ
が短絡や断線を生じると照明装置全体の発光量が大きく
低下するため、他の正常な発光器の発光量の調整ではも
はや回路基板を適正な照度で照明することはできず、検
査中止等の対応を採る必要がある。
However, if one of the light-emitting devices is short-circuited or disconnected, the light-emitting amount of the entire illuminating device is greatly reduced. It is not possible to illuminate with proper illuminance, and it is necessary to take measures such as stopping inspections.

【0004】そこで本発明はこのような課題を解決する
もので、照明装置の発光器の断線等の不具合を速やかに
検出することにより速やかな対応を可能とした回路部品
検査装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a circuit component inspection apparatus capable of promptly responding by quickly detecting a defect such as disconnection of a light emitting device of a lighting device. Aim.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に本発明では、回路部品(1)を照明する照明手段
(5)と、照明された回路部品(1)の画像を得る撮像
手段(8)と、得られた画像を処理して回路部品(1)
の状態を検査する画像処理手段(61)とを具備する回
路部品検査装置において、照明手段(5)に含まれる発
光器(10A〜10D)の不具合を、発光器(10A〜
10D)の通電回路(9)中の電圧変化より検出する発
光器不具合検出手段(94)を設けている。ここで、上
記電圧変化は、発光器(10A〜10D)の電流をフィ
ードバック制御する電流制御回路中の差動増幅器(9
2)の出力電圧の変化、あるいは直列接続された各発光
器(10A〜10D)の接続点(P1〜P4)電圧の変
化とすることができる。
In order to achieve the above object, according to the present invention, there is provided an illuminating means (5) for illuminating a circuit component (1), and an imaging means for obtaining an image of the illuminated circuit component (1). 8) and processing the obtained image to obtain a circuit component (1)
In the circuit component inspection apparatus including the image processing means (61) for inspecting the state of the light emitting devices (10A to 10D) included in the lighting means (5),
10D) A light emitting device failure detecting means (94) for detecting from a voltage change in the energizing circuit (9) is provided. Here, the voltage change is determined by a differential amplifier (9) in a current control circuit that feedback-controls the current of the light-emitting devices (10A to 10D).
The change in the output voltage in 2) or the change in the voltage at the connection points (P1 to P4) of the light-emitting devices (10A to 10D) connected in series can be obtained.

【0006】本発明において、発光器が断線あるいは短
絡すると通電回路中に電圧変化が生じる。したがって、
この電圧変化を検出することによって断線等の不具合を
即座に知ることができ、検査中止等の対応を速やかに採
ることができる。
In the present invention, when the light emitting device is disconnected or short-circuited, a voltage change occurs in the energizing circuit. Therefore,
By detecting this voltage change, a defect such as a disconnection can be immediately known, and a response such as an inspection stop can be taken promptly.

【0007】なお、上記カッコ内の符号は、後述する実
施形態に記載の具体的手段との対応関係を示すものであ
る。
[0007] The reference numerals in parentheses indicate the correspondence with specific means described in the embodiments described later.

【0008】[0008]

【発明の実施の形態】(第1実施形態)図1には回路部
品検査装置の一例としての半田付け検査装置の全体構成
を示す。図において、回路部品1はそのリード11がプ
リント基板2のスルーホール21内に挿入されて、半田
付け部3によってプリント基板2上の電極(図示略)に
接続固定されている。プリント基板2は移動テーブル4
上に載置されており、プリント基板2上に半田付けされ
た多数の回路部品1のうち検査対象となるものが、照明
装置5の直下に移動テーブル4によって移送され位置決
めされる。この移動テーブル4はX軸ステージ41とY
軸ステージ42で構成されて、プリント基板2を二次元
のX−Y平面上で位置決めすることができる。X軸ステ
ージ41とY軸ステージ42は位置決め回路72の出力
によりサーボ制御されている。
(First Embodiment) FIG. 1 shows the overall configuration of a soldering inspection device as an example of a circuit component inspection device. In the figure, a lead 11 of a circuit component 1 is inserted into a through hole 21 of a printed circuit board 2, and is connected and fixed to an electrode (not shown) on the printed circuit board 2 by a soldering portion 3. The printed board 2 is a moving table 4
Of the many circuit components 1 mounted on the printed circuit board 2 and soldered on the printed circuit board 2, an inspection target is transferred and positioned by the moving table 4 directly below the lighting device 5. The moving table 4 includes an X-axis stage 41 and a Y-axis
The printed board 2 can be positioned on a two-dimensional XY plane by being constituted by the axis stage 42. The X-axis stage 41 and the Y-axis stage 42 are servo-controlled by the output of the positioning circuit 72.

【0009】照明装置5は複数の円環状照明リング51
〜54(図1は4段で示すが、実際には7段設けられ
る)を有し、これら照明リング51〜54は上下方向へ
間隔をおいて同心状に配設されるとともに、上方へ向か
うにつれて小径となっている。各照明リング51〜54
は周方向へ4区画され、各区画毎に多数(例えば12
個)の発光ダイオードが設けられている。照明リング5
1〜54はそれぞれ詳細を後述する照明制御回路71へ
接続され、照明制御回路71は各照明リング51〜54
の各区画毎に、発光ダイオード群を通電発光させること
ができる。
The illumination device 5 includes a plurality of annular illumination rings 51.
The illumination rings 51 to 54 are arranged concentrically at intervals in the vertical direction, and are directed upward. As the diameter becomes smaller. Each lighting ring 51-54
Is divided into four sections in the circumferential direction, and a large number (eg, 12
) Light emitting diodes. Lighting ring 5
1 to 54 are respectively connected to an illumination control circuit 71 which will be described in detail later.
The light emitting diode group can be energized to emit light for each of the sections.

【0010】検査対象となる回路部品1はそのリード1
1(すなわちスルーホール21)が照明装置5の中心軸
上に位置決めされており、照明リング51〜54から発
する照明光L がリード11の半田付け部3へ入射す
る。照明装置5の上方にはその中心軸上にCCDカメラ
等の撮像装置8が設けてあり、撮像装置8は上記半田付
け部3の画像を得る。撮像装置8で得られた画像は、デ
ータ処理装置6の情報処理部62からの指令によりその
画像処理部61へ送られ、画像処理部61では例えば画
像中の高輝度連続領域の外周を追跡して、追跡軌跡の長
さより半田付けの良否が検査される。データ処理装置6
はパーソナルコンピュータ等で構成され、内部にCP
U、ビデオRAMを含む各種メモリ、およびI/Oイン
ターフェース等を有するとともに、モニタやプリンタ等
が接続されている。画像処理部61および情報処理部6
2はソフトウエアによって実現されており、情報処理部
62は既述の照明制御回路71や位置決め回路72の作
動を制御するとともに、画像処理部61における各半田
付け部3の検査結果をモニタ上へ表示し、あるいはプリ
ントアウトする。
The circuit component 1 to be inspected is the lead 1
1 (that is, through hole 21) is positioned on the central axis of lighting device 5, and illumination light L emitted from lighting rings 51 to 54 enters soldering portion 3 of lead 11. Above the illumination device 5, an imaging device 8 such as a CCD camera is provided on the center axis thereof, and the imaging device 8 obtains an image of the soldering section 3. The image obtained by the imaging device 8 is sent to the image processing unit 61 in response to a command from the information processing unit 62 of the data processing device 6, and the image processing unit 61 tracks, for example, the outer periphery of a high-luminance continuous area in the image. Then, the quality of the soldering is inspected from the length of the tracking locus. Data processing device 6
Is composed of a personal computer etc.
U, various memories including a video RAM, an I / O interface, and the like, and a monitor, a printer, and the like are connected. Image processing unit 61 and information processing unit 6
The information processing unit 62 controls the operations of the illumination control circuit 71 and the positioning circuit 72 described above, and the inspection result of each soldering unit 3 in the image processing unit 61 is displayed on a monitor. Display or print out.

【0011】図2には各照明リング51〜54のうちの
一区画について、これを構成する発光ダイオード群を通
電発光させる照明制御回路71中の通電回路9を示す。
照明制御回路71にはこのような通電回路が照明リング
51〜54の区画数(本実施形態では28区画)だけ設
けられる。各区画の発光ダイオードの数は既述のように
実際には12個であるが図2には4個のみを示してあ
る。
FIG. 2 shows an energizing circuit 9 in an illumination control circuit 71 for energizing a group of light emitting diodes constituting one section of each of the illumination rings 51 to 54 to emit light.
The lighting control circuit 71 is provided with such an energizing circuit as the number of sections of the illumination rings 51 to 54 (28 sections in the present embodiment). Although the number of light emitting diodes in each section is actually 12 as described above, FIG. 2 shows only 4 light emitting diodes.

【0012】図2において、発光ダイオード10A〜1
0Dは互いに直列に接続されて電源とトランジスタ91
の間に位置している。トランジスタ91はそのベースに
接続された差動増幅器92と共に電流制御回路を構成し
ており、そのコレクタに上記発光ダイオード10Dが接
続されるととともに、エミッタにはアースとの間に電流
検出抵抗93が接続されている。電流検出抵抗93には
発光ダイオード10A〜10Dに流れる電流Iに比例し
た検出電圧Vrが生じ、この検出電圧Vrは差動増幅器
92の「−」端子にフィードバックされている。差動増
幅器92の「+」端子には、プリント基板2(図1)上
の照度を適正に維持するための所定の電流指令値Cvが
入力している。さらに電圧比較器94が設けられてお
り、この電圧比較器94には差動増幅器92の出力電圧
Voが入力して、所定の基準電圧Vbと比較されてい
る。
In FIG. 2, light emitting diodes 10A-1A
0D are connected in series with each other to
It is located between. The transistor 91 constitutes a current control circuit together with a differential amplifier 92 connected to the base thereof. The light emitting diode 10D is connected to the collector of the transistor 91, and a current detecting resistor 93 is provided between the emitter and the ground. It is connected. A detection voltage Vr proportional to the current I flowing through the light emitting diodes 10A to 10D is generated in the current detection resistor 93, and the detection voltage Vr is fed back to the "-" terminal of the differential amplifier 92. A predetermined current command value Cv for properly maintaining the illuminance on the printed circuit board 2 (FIG. 1) is input to the “+” terminal of the differential amplifier 92. Further, a voltage comparator 94 is provided. The output voltage Vo of the differential amplifier 92 is input to the voltage comparator 94 and compared with a predetermined reference voltage Vb.

【0013】このような構成において、電流検出抵抗9
3の検出電圧Vrが常に電流指令値Cvに一致するよう
にトランジスタ91の導通が制御され、この結果、発光
ダイオード10A〜10Dに所望の電流Iが供給され
る。発光ダイオード10A〜10Dのいずれかで断線を
生じると、トランジスタ91のコレクタ電流は零にな
り、検出電圧Vrが低下する。このため、差動増幅器9
2の出力電圧Voは検出電圧Vrを元に戻すべく上昇
し、終には飽和電圧に至る。そこで、上記基準電圧Vb
を飽和電圧よりも低い適当な値に設定しておくと、出力
電圧Voが基準電圧Vbを越えた時に電圧比較器94か
ら異常信号Saが出力される。異常信号Saは情報処理
部62(図1)へ送られ、情報処理部62は検査を強制
終了するとともに警報を発する。
In such a configuration, the current detection resistor 9
The conduction of the transistor 91 is controlled such that the detected voltage Vr of the third circuit 3 always matches the current command value Cv. As a result, a desired current I is supplied to the light emitting diodes 10A to 10D. When a disconnection occurs in any of the light emitting diodes 10A to 10D, the collector current of the transistor 91 becomes zero, and the detection voltage Vr decreases. Therefore, the differential amplifier 9
The output voltage Vo of No. 2 rises to restore the detection voltage Vr, and eventually reaches a saturation voltage. Therefore, the reference voltage Vb
Is set to an appropriate value lower than the saturation voltage, an abnormal signal Sa is output from the voltage comparator 94 when the output voltage Vo exceeds the reference voltage Vb. The abnormal signal Sa is sent to the information processing section 62 (FIG. 1), and the information processing section 62 forcibly ends the inspection and issues an alarm.

【0014】(第2実施形態)図3には照明制御回路7
1中の通電回路9の他の例を示す。本実施形態では第1
実施形態の電圧比較器94に代えて、発光ダイオード1
0A〜10D同士の接続点P1〜P3、および発光ダイ
オード10Dとトランジスタ91の接続点P4の各電圧
がそれぞれ高入力インピーダンスの電圧検知器95A〜
95Dへ入力しており、各電圧検知器95A〜95Dの
後段にそれぞれ電圧比較器96A〜96Dが設けられて
いる。各電圧検知器95A〜95Dからは各接続点P1
〜P4の電圧に等しい電圧がそれぞれ電圧比較器96A
〜96Dへ出力されている。各電圧比較器96A〜96
Dにはそれぞれ上限基準電圧と下限基準電圧が設定され
ており、これら上限および下限の各基準電圧は、発光ダ
イオード10A〜10Dに所定の電流Iが流れている時
に各接続点P1〜P4の電圧が取り得る値の範囲をやや
上方ないし下方へ越えた電圧値に設定されている。その
他の構成は第1実施形態と同様である。
(Second Embodiment) FIG. 3 shows an illumination control circuit 7.
1 shows another example of the energizing circuit 9 in FIG. In the present embodiment, the first
Instead of the voltage comparator 94 of the embodiment, the light emitting diode 1
Voltages at connection points P1 to P3 between 0A to 10D and at connection point P4 between light emitting diode 10D and transistor 91 are high input impedance voltage detectors 95A to 95A, respectively.
95D, and voltage comparators 96A to 96D are provided at the subsequent stage of the voltage detectors 95A to 95D, respectively. From each of the voltage detectors 95A to 95D, each connection point P1
To P4 are respectively equal to the voltage comparator 96A.
To 96D. Each voltage comparator 96A-96
An upper limit reference voltage and a lower limit reference voltage are set for D, respectively. These upper and lower reference voltages are the voltages of the connection points P1 to P4 when a predetermined current I flows through the light emitting diodes 10A to 10D. Are set slightly above or below the range of possible values. Other configurations are the same as those of the first embodiment.

【0015】このような構成において、例えば発光ダイ
オード10Bで短絡を生じると、この部分での電圧降下
が無くなるために、ここよりトランジスタ91に近い側
の各接続点P2〜P4の電圧が上昇して各電圧比較器9
6B〜96Dにおいてその上限基準値を越え、この結
果、各電圧比較器96B〜96Dから異常信号Sa2〜
Sa4が情報処理部62(図1)へ出力される。一方、
発光ダイオード10Bで断線を生じると、接続点P2で
は電圧が電源供給が無くなって電圧が低下し、電圧比較
器96Bから異常信号Sa2が情報処理部62へ出力さ
れる。
In such a configuration, for example, if a short circuit occurs in the light emitting diode 10B, the voltage drop at this portion is eliminated, and the voltage at each of the connection points P2 to P4 closer to the transistor 91 is increased. Each voltage comparator 9
6B to 96D, the voltage exceeds the upper limit reference value. As a result, the abnormal signals Sa2 to Sa2 are output from the voltage comparators 96B to 96D.
Sa4 is output to information processing section 62 (FIG. 1). on the other hand,
When a disconnection occurs in the light emitting diode 10B, the power is not supplied at the connection point P2, the voltage drops, and the voltage comparator 96B outputs the abnormal signal Sa2 to the information processing unit 62.

【0016】[0016]

【発明の効果】以上のように、本発明の回路部品検査装
置によれば、照明装置の発光器の断線等の不具合を速や
かに検出することにより検査中止等の速やかな対応をす
ることが可能となる。
As described above, according to the circuit component inspection apparatus of the present invention, it is possible to promptly respond to the stop of the inspection or the like by quickly detecting a defect such as disconnection of the light emitting device of the lighting device. Becomes

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態における、半田付け検査
装置の全体構成を示す図である。
FIG. 1 is a diagram illustrating an overall configuration of a soldering inspection device according to a first embodiment of the present invention.

【図2】通電回路の回路図である。FIG. 2 is a circuit diagram of an energizing circuit.

【図3】本発明の第2実施形態における、通電回路の回
路図である。
FIG. 3 is a circuit diagram of an energizing circuit according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…回路部品、5…照明装置、6…データ処理装置、6
1…画像処理部、8…撮像装置、9…通電回路、92…
差動増幅器、94…電圧比較器、10A,10B,10
C,10D…発光ダイオード、P1,P2,P3,P4
…接続点。
DESCRIPTION OF SYMBOLS 1 ... Circuit components, 5 ... Lighting device, 6 ... Data processing device, 6
DESCRIPTION OF SYMBOLS 1 ... Image processing part, 8 ... Imaging device, 9 ... Electrification circuit, 92 ...
Differential amplifier, 94 ... voltage comparator, 10A, 10B, 10
C, 10D: light emitting diode, P1, P2, P3, P4
... connection points.

フロントページの続き Fターム(参考) 2F065 AA49 AA53 AA54 CC01 CC26 DD08 FF04 GG07 GG14 GG17 JJ03 JJ26 NN02 PP12 QQ25 QQ31 SS06 SS09 UU01 2G051 AA61 AA65 AB14 BA01 BA20 CA03 CA04 DA07 EA14 EB01 EB02 FA10 5E319 CD53 Continued on the front page F term (reference) 2F065 AA49 AA53 AA54 CC01 CC26 DD08 FF04 GG07 GG14 GG17 JJ03 JJ26 NN02 PP12 QQ25 QQ31 SS06 SS09 UU01 2G051 AA61 AA65 AB14 BA01 BA20 CA03 CA04 DA07 EA14 EB01 EB10

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 回路部品を照明する照明手段と、照明さ
れた回路部品の画像を得る撮像手段と、得られた画像を
処理して前記回路部品の状態を検査する画像処理手段と
を具備する回路部品検査装置において、前記照明手段に
含まれる発光器の不具合を、前記発光器の通電回路中の
電圧変化より検出する発光器不具合検出手段を設けたこ
とを特徴とする回路部品検査装置。
An illumination device for illuminating a circuit component, an imaging device for obtaining an image of the illuminated circuit component, and an image processing device for processing the obtained image to inspect the state of the circuit component. The circuit component inspection device according to claim 1, further comprising a light emitting device failure detecting unit configured to detect a failure of the light emitting device included in the lighting unit based on a voltage change in a current supply circuit of the light emitting unit.
JP11049101A 1999-02-25 1999-02-25 Circuit part-inspecting device Pending JP2000241142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11049101A JP2000241142A (en) 1999-02-25 1999-02-25 Circuit part-inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11049101A JP2000241142A (en) 1999-02-25 1999-02-25 Circuit part-inspecting device

Publications (1)

Publication Number Publication Date
JP2000241142A true JP2000241142A (en) 2000-09-08

Family

ID=12821713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11049101A Pending JP2000241142A (en) 1999-02-25 1999-02-25 Circuit part-inspecting device

Country Status (1)

Country Link
JP (1) JP2000241142A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007263904A (en) * 2006-03-30 2007-10-11 Anritsu Corp Device and method for measuring three-dimensional shape
JP2008020259A (en) * 2006-07-11 2008-01-31 Toshiba Teli Corp Self-propelled type pipe inside inspection camera system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007263904A (en) * 2006-03-30 2007-10-11 Anritsu Corp Device and method for measuring three-dimensional shape
JP2008020259A (en) * 2006-07-11 2008-01-31 Toshiba Teli Corp Self-propelled type pipe inside inspection camera system

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