JP2000237959A5

JP2000237959A5 -

Info

Publication number: JP2000237959A5
Application number: JP1999012591A
Authority: JP
Filing date: 1999-01-21
Publication date: 2005-11-04

Claims

In a slurry circulation supply system for supplying a polishing slurry to a plurality of polishing units for polishing a predetermined target member, and circulating the used polishing slurry used in the polishing unit for reuse.
An unused slurry supply means for producing a new polishing slurry;
Regenerating means for filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Buffer means for storing the unused slurry supply means and polishing slurry supplied from the regeneration means;
A slurry circulation supply system comprising: a plurality of first pumps for independently feeding the polishing slurry stored in the buffer means to the plurality of polishing units.

The apparatus further comprises a supply means having a supply tank for storing the polishing slurry supplied from the unused slurry supply means and the regeneration means, and a second pump for feeding the stored polishing slurry into the buffer means. The slurry circulation supply system according to claim 1.

3. The slurry circulation supply system according to claim 2, wherein the supply unit further includes a filter for filtering the polishing slurry sent out by the second pump.

A plurality of recovery pipes that are connected to each of the plurality of polishing units and collect used slurry discharged from the polishing unit;
A discarding means for discarding the used slurry recovered by the recovery pipe;
The flow path switching means for switching whether the used slurry recovered by the recovery pipe is sent to the regeneration means or the waste means is further provided. Slurry supply system.

5. An overflow pipe connected between the buffer means and the regenerating means, and for guiding polishing slurry exceeding a reference capacity in the buffer means to the regenerating means. The slurry circulation supply system described in 1.

6. The slurry circulation supply system according to claim 1, further comprising a disposal pipe connected to the regeneration means for discarding polishing slurry exceeding a reference capacity in the regeneration means. .

In a slurry circulation supply system for supplying a polishing slurry to a plurality of polishing units for polishing the surface of a semiconductor wafer, and circulating the used polishing slurry used in the polishing unit for reuse.
An unused slurry supply unit for producing new abrasive slurry;
A plurality of collection pipes connected to each of the plurality of polishing units and independently collecting used slurry discharged from the polishing unit;
A regeneration unit for filtering and regenerating used polishing slurry recovered by the recovery pipe;
A supply unit having a supply tank for storing the polishing slurry supplied from the unused slurry supply unit and the regeneration unit, and a pump for feeding the stored polishing slurry toward the polishing unit;
A buffer tank for storing polishing slurry supplied from the supply unit and the regeneration unit;
A plurality of pumps for independently feeding the polishing slurry stored in the buffer tank to the plurality of polishing units;
An overflow pipe connected between the buffer tank and the regeneration unit and guiding polishing slurry exceeding a reference capacity in the buffer tank to the regeneration unit;
A disposal unit for discarding the used slurry recovered by the recovery pipe;
A slurry circulation supply system comprising: a flow path switching unit that switches whether the used slurry recovered by the recovery pipe is sent to the regeneration unit or the waste unit.

In a polishing system that polishes a member to be processed using polishing slurry and circulates and reuses used polishing slurry,
A plurality of polishing portions for polishing the member to be processed;
An unused slurry supply means for producing a new polishing slurry;
Regenerating means for filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Buffer means for storing the unused slurry supply means and polishing slurry supplied from the regeneration means;
A polishing system comprising: a plurality of first pumps for independently feeding the polishing slurry stored in the buffer means to the plurality of polishing units.

The apparatus further comprises a supply means having a supply tank for storing the polishing slurry supplied from the unused slurry supply means and the regeneration means, and a second pump for feeding the stored polishing slurry into the buffer means. The polishing system according to claim 8.

The polishing system according to claim 9, wherein the supply unit further includes a filter that filters the polishing slurry fed out by the second pump.

A plurality of recovery pipes that are connected to each of the plurality of polishing units and collect used slurry discharged from the polishing unit;
A discarding means for discarding the used slurry recovered by the recovery pipe;
The flow path switching means for switching whether the used slurry recovered by the recovery pipe is sent to the regeneration means or the waste means is further provided. Polishing system.

The overflow pipe connected between the said buffer means and the said reproduction | regeneration means and guide | inducing the polishing slurry exceeding a reference | standard capacity | capacitance in the said buffer means to the said reproduction | regeneration means is further provided. The polishing system described in 1.

The polishing system according to claim 8, 9, 10, 11, or 12, further comprising a disposal pipe connected to the regenerating means and discarding polishing slurry exceeding a reference capacity in the regenerating means.

In the polishing system that polishes the surface of the semiconductor wafer using the polishing slurry and circulates and reuses the used polishing slurry,
A plurality of polishing portions for polishing the semiconductor wafer;
An unused slurry supply unit for producing new abrasive slurry;
A plurality of collection pipes connected to each of the plurality of polishing units and independently collecting used slurry discharged from the polishing unit;
A regeneration unit for filtering and regenerating used polishing slurry recovered by the recovery pipe;
A supply unit having a supply tank for storing the polishing slurry supplied from the unused slurry supply unit and the regeneration unit, and a pump for sending out the stored polishing slurry;
A buffer tank for storing polishing slurry supplied from the supply unit and the regeneration unit;
A plurality of pumps for independently feeding the polishing slurry stored in the buffer tank to the plurality of polishing units;
An overflow pipe connected between the buffer tank and the regeneration unit and guiding polishing slurry exceeding a reference capacity in the buffer tank to the regeneration unit;
A disposal unit for discarding the used slurry recovered by the recovery pipe;
A polishing system, comprising: a flow path switching unit that switches whether the used slurry recovered by the recovery pipe is sent to the regeneration unit or the waste unit.

In a slurry circulation supply system for supplying a polishing slurry to a plurality of polishing units for polishing a predetermined target member, and circulating the used polishing slurry used in the polishing unit for reuse.
Producing a new polishing slurry;
Filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Storing the novel polishing slurry and the filtered and regenerated polishing slurry in a buffer means;
And a step of independently feeding the stored polishing slurry to the plurality of polishing units.

16. The slurry circulation supply system according to claim 15, further comprising a step of filtering the polishing slurry fed to the buffer means.

Collecting the used slurry discharged from each of the plurality of polishing sections;
Discarding the recovered used slurry;
The slurry circulation supply system according to claim 15 or 16, further comprising a step of selecting whether the recovered used slurry is regenerated or discarded.

18. The slurry circulation supply system according to claim 15, 16 or 17, further comprising a step of regenerating a polishing slurry exceeding a reference capacity among the polishing slurry stored in the buffer means.

The slurry circulation supply system according to claim 15, 16, 17 or 18, further comprising a step of discarding when the used polishing slurry exceeds a reference capacity during the regeneration.

In a slurry circulation supply system for supplying a polishing slurry to a plurality of polishing units for polishing the surface of a semiconductor wafer, and circulating the used polishing slurry used in the polishing unit for reuse.
Producing a new polishing slurry;
Independently collecting used slurry discharged from each of the plurality of polishing sections;
Filtering and reclaiming the recovered used polishing slurry;
Storing the unused slurry and the regenerated polishing slurry;
Sending the stored polishing slurry toward the polishing section;
Storing the stored polishing slurry and the regenerated polishing slurry in a buffer tank;
A step of independently feeding the polishing slurry stored in the buffer tank to the plurality of polishing portions;
Regenerating the polishing slurry exceeding a reference capacity in the buffer tank;
Discarding the recovered used slurry;
And a step of switching the recovered used slurry to be recycled or discarded.

In a polishing system that polishes a member to be processed using polishing slurry and circulates and reuses used polishing slurry,
Polishing the member to be processed in a plurality of polishing parts;
Producing a new polishing slurry;
Filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Storing the new polishing slurry and the regenerated polishing slurry in a buffer means;
And a step of independently feeding the stored polishing slurry to the plurality of polishing units.

The polishing system according to claim 21, further comprising a step of filtering the polishing slurry fed to the buffer means.

Collecting the used slurry discharged from each of the plurality of polishing sections;
Discarding the recovered used slurry;
The polishing system according to claim 21 or 22, further comprising a step of selecting whether the collected used slurry is regenerated or discarded.

The polishing system according to claim 21, 22 or 23, further comprising a step of regenerating a polishing slurry exceeding a reference capacity among the polishing slurry stored in the buffer means.

The polishing system according to claim 21, 22, 23, or 24, further comprising a step of discarding when the used polishing slurry exceeds a reference capacity during the regeneration.

In the polishing system that polishes the surface of the semiconductor wafer using the polishing slurry and circulates and reuses the used polishing slurry,
Polishing the semiconductor wafer in a plurality of polishing sections;
Producing a new polishing slurry;
Independently collecting used slurry discharged from each of the plurality of polishing sections;
Filtering and reclaiming the recovered used polishing slurry;
Storing the unused slurry and the regenerated polishing slurry;
Sending the stored polishing slurry toward the polishing section;
Storing the stored polishing slurry and the regenerated polishing slurry in a buffer tank;
A step of independently feeding the polishing slurry stored in the buffer tank to the plurality of polishing portions;
Regenerating the polishing slurry exceeding a reference capacity in the buffer tank;
Discarding the recovered used slurry;
And a step of switching between recycling and discarding the collected used slurry.

In a slurry circulating and supplying method for supplying a polishing slurry to a plurality of polishing parts for polishing a predetermined target member, and circulating the used polishing slurry used in the polishing part for reuse.
Producing a new polishing slurry;
Filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Storing the novel polishing slurry and the filtered and regenerated polishing slurry in a buffer means;
A method of circulating and supplying the slurry, comprising the step of independently feeding the stored polishing slurry to the plurality of polishing units.

In a polishing method of polishing a member to be processed using a polishing slurry and circulating and reusing a used polishing slurry,
Polishing the member to be processed in a plurality of polishing parts;
Producing a new polishing slurry;
Filtering and regenerating used polishing slurry used in the plurality of polishing sections;
Storing the new polishing slurry and the regenerated polishing slurry in a buffer means;
And a step of independently feeding the stored polishing slurry to the plurality of polishing portions.