JP2000234060A - Adhesive silicone elastomer film - Google Patents
Adhesive silicone elastomer filmInfo
- Publication number
- JP2000234060A JP2000234060A JP11359311A JP35931199A JP2000234060A JP 2000234060 A JP2000234060 A JP 2000234060A JP 11359311 A JP11359311 A JP 11359311A JP 35931199 A JP35931199 A JP 35931199A JP 2000234060 A JP2000234060 A JP 2000234060A
- Authority
- JP
- Japan
- Prior art keywords
- group
- film
- silicone elastomer
- formula
- elastomer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 44
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 239000000853 adhesive Substances 0.000 title claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 239000002534 radiation-sensitizing agent Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 21
- 150000001875 compounds Chemical group 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 239000004651 Radiation Curable Silicone Substances 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 abstract description 12
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 abstract description 6
- 239000002313 adhesive film Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 125000000962 organic group Chemical group 0.000 abstract description 3
- 125000004430 oxygen atom Chemical group O* 0.000 abstract description 2
- 238000003847 radiation curing Methods 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 40
- -1 2-ethylhexyl group Chemical group 0.000 description 16
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- ZODNDDPVCIAZIQ-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C=C ZODNDDPVCIAZIQ-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- BWZAUXRKSMJLMH-UHFFFAOYSA-N 1,1-diethoxyethylbenzene Chemical compound CCOC(C)(OCC)C1=CC=CC=C1 BWZAUXRKSMJLMH-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- WVRHNZGZWMKMNE-UHFFFAOYSA-N 2-hydroxy-1-[2-(2-methylpropyl)phenyl]-2-phenylethanone Chemical compound CC(C)CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 WVRHNZGZWMKMNE-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の接着性
フィルムとして有用な接着性シリコーンエラストマーフ
ィルム、それを用いたシリコーンエラストマーフィルム
被覆体及び構造体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive silicone elastomer film useful as an adhesive film for electronic parts, and a silicone elastomer film covering and a structure using the same.
【０００２】[0002]
【従来の技術】従来、半導体デバイスのダイボンディン
グ用やＴＡＢテープの接着用途にエポキシ系の接着性フ
ィルムが使用されている。しかし、これらの接着性フィ
ルムは、耐熱性が不十分であり、また低弾性化が不可能
であるという問題を有する（高弾性体では、例えば２つ
の異種の基板間に接着層として貼り合わせて使用した場
合、熱的及び機械的応力を緩和し難く、製品の信頼性を
低下させる）。一方、シリコーン系の接着性フィルムは
一般に高耐熱性で低弾性であるが、十分な接着性と作業
性を有し、容易に製造できるものは知られていない。2. Description of the Related Art Conventionally, epoxy adhesive films have been used for die bonding of semiconductor devices and for bonding TAB tapes. However, these adhesive films have a problem that their heat resistance is insufficient and their elasticity cannot be reduced (in the case of a highly elastic body, for example, they are bonded as an adhesive layer between two different substrates. When used, thermal and mechanical stresses are less likely to be relieved, lowering product reliability). On the other hand, silicone-based adhesive films generally have high heat resistance and low elasticity, but there is no known adhesive film having sufficient adhesiveness and workability, which can be easily manufactured.
【０００３】[0003]
【発明が解決しようとする課題】本発明の課題は、取扱
いが簡単で、均一な形状のクリーンなフィルムとして短
時間に製造でき、使用時の工程を合理化でき、しかも低
弾性で十分な耐熱性、接着性及び加工性を有する接着性
シリコーンエラストマーフィルム、それを用いたシリコ
ーンエラストマーフィルム被覆体及び構造体を提供する
ことである。SUMMARY OF THE INVENTION An object of the present invention is to provide a clean film having a uniform shape, which is easy to handle, can be manufactured in a short time, can streamline the process of use, and has low elasticity and sufficient heat resistance. Another object of the present invention is to provide an adhesive silicone elastomer film having adhesiveness and processability, and a silicone elastomer film coating and a structure using the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）一般式
(I)：According to the present invention, there is provided (A) a compound represented by the following general formula:
(I):
【０００５】[0005]
【化２】 で示されるオルガノポリシロキサン、（Ｂ）放射線増感
剤、及び（Ｃ）一般式(III)： Si(OR6)4 (III) （式中、R6 は非置換又は置換の低級アルキル基であ
る。）で示されるアルコキシシラン及びその部分加水分
解縮合物よりなる群から選ばれる少なくとも１種の化合
物、を含有する放射線硬化性シリコーンゴム組成物をフ
ィルム状に成形し、得られたフィルムを放射線硬化させ
ることにより得られる接着性シリコーンエラストマーフ
ィルムを提供する。Embedded image (B) a radiation sensitizer, and (C) a general formula (III): Si (OR 6 ) 4 (III) wherein R 6 is an unsubstituted or substituted lower alkyl group The radiation curable silicone rubber composition containing at least one compound selected from the group consisting of an alkoxysilane represented by the formula (1) and a partially hydrolyzed condensate thereof is formed into a film, and the obtained film is irradiated with radiation. An adhesive silicone elastomer film obtained by curing is provided.
【０００６】また本発明は、上記シリコーンエラストマ
ーフィルムで基体の一部又は全部を覆い、次いで加熱し
て該フィルムを硬化させることにより得られるシリコー
ンエラストマーフィルム被覆体を提供する。更に本発明
は、上記シリコーンエラストマーフィルムを二つの基体
間に挟み、次いで加熱して該フィルムを硬化させて両基
体を相互に結合させることにより得られる構造体を提供
する。更に本発明は、上記接着性シリコーンエラストマ
ーフィルムをダイと該ダイを装着すべき基体の所定箇所
との間に挟んで配置し、該フィルムを該ダイと基体との
間で加熱して硬化させる、ことを特徴とするダイボンデ
ィング方法を提供する。[0006] The present invention also provides a silicone elastomer film coating obtained by covering a part or the whole of a substrate with the above-mentioned silicone elastomer film and then curing the film by heating. The present invention further provides a structure obtained by sandwiching the above-mentioned silicone elastomer film between two substrates and then heating the film to cure the films and bond the two substrates to each other. Further, according to the present invention, the adhesive silicone elastomer film is disposed between a die and a predetermined portion of a substrate on which the die is to be mounted, and the film is cured by heating between the die and the substrate. A die bonding method is provided.
【０００７】[0007]
【発明の実施の形態】＜接着性シリコーンエラストマー
フィルム＞本発明の接着性シリコーンエラストマーフィ
ルムに使用される放射線硬化性シリコーンゴム組成物
は、下記（Ａ）〜（Ｃ）成分を含有してなる。なお、本
発明で云う接着性シリコーンエラストマーフィルムは、
シートを含むものである。 （Ａ）オルガノポリシロキサン：（Ａ）成分のオルガノ
ポリシロキサンはベースポリマーとして使用される成分
であって、上記一般式(I)で表される。DESCRIPTION OF THE PREFERRED EMBODIMENTS <Adhesive Silicone Elastomer Film> The radiation-curable silicone rubber composition used for the adhesive silicone elastomer film of the present invention contains the following components (A) to (C). Incidentally, the adhesive silicone elastomer film referred to in the present invention,
It includes a sheet. (A) Organopolysiloxane: The organopolysiloxane of the component (A) is a component used as a base polymer and is represented by the general formula (I).
【０００８】一般式(I)において、Ｒ1は同一でも異なっ
てもよく、炭素原子数１〜９、好ましくは炭素原子数１
〜６の非置換又は置換の１価炭化水素基である。この１
価炭化水素基の具体例としては、メチル基、エチル基、
プロピル基、イソプロピル基、ブチル基、イソブチル
基、ｔｅｒｔ−ブチル基、ペンチル基、ヘキシル基、ヘ
プチル基、２−エチルヘキシル基、オクチル基、ノニル
基等のアルキル基；シクロヘキシル基、シクロヘプチル
基等のシクロアルキル基；ビニル基、アリル基、プロペ
ニル基、イソプロペニル基、ブテニル基、ヘキセニル基
等のアルケニル基；フェニル基、トリル基等のアリール
基；ベンジル基、フェニルエチル基、フェニルプロピル
基等のアラルキル基；又はこれらの基の炭素原子に結合
した水素原子の少なくとも一部をハロゲン原子、シアノ
基等の置換基で置換した、クロロメチル基、シアノエチ
ル基、トリフルオロプロピル基などの基等が挙げられる
が、Ｒ1の５０モル％以上がメチル基で、且つ２５モル
％以下がフェニル基であるものが好ましい。In the general formula (I), R 1 may be the same or different and has 1 to 9 carbon atoms, preferably 1 carbon atom.
To 6 unsubstituted or substituted monovalent hydrocarbon groups. This one
Specific examples of the monovalent hydrocarbon group include a methyl group, an ethyl group,
Alkyl groups such as propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, hexyl group, heptyl group, 2-ethylhexyl group, octyl group and nonyl group; cycloalkyl groups such as cyclohexyl group and cycloheptyl group; Alkyl group; alkenyl group such as vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, and hexenyl group; aryl group such as phenyl group and tolyl group; aralkyl group such as benzyl group, phenylethyl group, and phenylpropyl group. Or a group such as a chloromethyl group, a cyanoethyl group, a trifluoropropyl group, or the like, in which at least a part of a hydrogen atom bonded to a carbon atom of these groups is substituted with a substituent such as a halogen atom or a cyano group. , more than 50 mol% of R 1 is a methyl group, and 25 mol% phenyl group There are preferred.
【０００９】一般式(I)において、Ｘは上記一般式(II)
で表される基である。一般式(II)におけるＲ2は炭素原
子数２〜４の２価炭化水素基又は酸素原子であるが、耐
水性の点から好ましくは２価炭化水素基である。この２
価炭化水素基の具体例としては、エチレン基、プロピレ
ン基、メチルエチレン基、テトラメチレン基等の炭素原
子数２〜４のアルキレン基が挙げられるが、好ましくは
エチレン基である。In the general formula (I), X represents the above-mentioned general formula (II)
Is a group represented by R 2 in the general formula (II) is a divalent hydrocarbon group having 2 to 4 carbon atoms or an oxygen atom, and is preferably a divalent hydrocarbon group from the viewpoint of water resistance. This 2
Specific examples of the valent hydrocarbon group include an alkylene group having 2 to 4 carbon atoms such as an ethylene group, a propylene group, a methylethylene group, and a tetramethylene group, and an ethylene group is preferable.
【００１０】一般式(II)におけるＲ3は１〜３個、好ま
しくは２〜３個、更に好ましくは３個の（メタ）アクリ
ロイル基〔特に（メタ）アクリロイロキシ基〕を有する
炭素原子数４〜２５の１価有機基である。Ｒ3における
（メタ）アクリロイル基の具体例としてはCH2＝CHCOO
−、CH2＝C(CH3)COO−、CH2＝CHCO−、CH2＝C(CH3)CO−
等のアクリル官能性基、メタクリル官能性基などが挙げ
られる。このような（メタ）アクリロイル基を含むＲ3
の１価有機基の具体例としては、CH2＝CHCOOCH2CH 2−、
[CH2＝C(CH3)COOCH2]3C−CH2−、(CH2＝CHCOOCH2)3C−C
H2−、(CH2＝CHCOOCH2)2C(C2H5)CH2−等の、１〜３個の
アクリロイロキシ基又はメタクリロイロキシ基で置換さ
れた炭素原子数１〜１０、好ましくは炭素原子数２〜６
のアルキル基などが挙げられるが、好ましくはCH2＝CHC
OOCH2CH2−、[CH2＝C(CH3)COOCH2]3C−CH2−、(CH2＝CH
COOCH2)3C−CH2−、(CH2＝CHCOOCH2)2C(C2H5)CH2−、CH
2＝C(CH3)COOCH2CH2−、[CH2＝C(CH3)COOCH2]2C(C2H5)
−CH2−)及び(CH2＝CHCOOCH2)[CH2＝C(CH3)COOCH2]CH
−、更に好ましくは[CH2＝C(CH3)COOCH2]3C−CH2−、(C
H 2＝CHCOOCH2)3C−CH2−、(CH2＝CHCOOCH2)2C(C2H5)CH2
−、(CH2＝CHCOOCH2)[CH2＝C(CH3)COOCH2]CH−である。
一般式(II)におけるＲ4は同一でも異なってもよく、炭
素原子数１〜９、好ましくは炭素原子数１〜６の非置換
又は置換の１価炭化水素基である。Ｒ4の１価炭化水素
基の具体例としては、一般式(I)におけるＲ1として例示
したものと同じものが挙げられるが、 Ｒ1の場合と同様
に、Ｒ4の５０モル％以上がメチル基で、且つ２５モル
％以下がフェニル基であるものが好ましい。一般式(II)
におけるＲ5は炭素原子数１〜１８、好ましくは炭素原
子数１〜８の１価炭化水素基である。Ｒ5の１価炭化水
素基の具体例としては、メチル基、エチル基、プロピル
基、ブチル基、ペンチル基、ネオペンチル基等のアルキ
ル基；シクロヘキシル基等のシクロアルキル基；フェニ
ル基等のアリール基；アリル基、プロペニル基、ブテニ
ル基等のアルケニル基等が挙げられるが、好ましくはア
ルケニル基等の脂肪族不飽和基を除くものが使用され
る。また一般式(II)において、ｎは１〜３の整数、ｍは
０〜２の整数で、且つｎ及びｍは１≦ｎ＋ｍ≦３を満足
するが、ｎ＝１の時Ｒ3は複数個（即ち、２個又は３
個）の（メタ）アクリロイル基を有する。In the general formula (II), RThreeIs 1 to 3
Or two, more preferably three (meth) acrylic
Having a royl group (especially a (meth) acryloyloxy group)
It is a monovalent organic group having 4 to 25 carbon atoms. RThreeIn
Specific examples of the (meth) acryloyl group include CHTwo= CHCOO
−, CHTwo= C (CHThree) COO−, CHTwo= CHCO-, CHTwo= C (CHThree) CO−
Such as acrylic functional groups, methacrylic functional groups, etc.
Can be R containing such a (meth) acryloyl groupThree
Specific examples of the monovalent organic group ofTwo= CHCOOCHTwoCH Two−,
[CHTwo= C (CHThree) COOCHTwo]ThreeC-CHTwo−, (CHTwo= CHCOOCHTwo)ThreeC-C
HTwo−, (CHTwo= CHCOOCHTwo)TwoC (CTwoHFive) CHTwo-1 to 3
Substituted with an acryloyloxy group or a methacryloyloxy group
1 to 10 carbon atoms, preferably 2 to 6 carbon atoms
And the like, but preferably CHTwo= CHC
OOCHTwoCHTwo−, [CHTwo= C (CHThree) COOCHTwo]ThreeC-CHTwo−, (CHTwo= CH
COOCHTwo)ThreeC-CHTwo−, (CHTwo= CHCOOCHTwo)TwoC (CTwoHFive) CHTwo−, CH
Two= C (CHThree) COOCHTwoCHTwo−, [CHTwo= C (CHThree) COOCHTwo]TwoC (CTwoHFive)
−CHTwo−) And (CHTwo= CHCOOCHTwo) [CHTwo= C (CHThree) COOCHTwo] CH
-, More preferably [CHTwo= C (CHThree) COOCHTwo]ThreeC-CHTwo−, (C
H Two= CHCOOCHTwo)ThreeC-CHTwo−, (CHTwo= CHCOOCHTwo)TwoC (CTwoHFive) CHTwo
−, (CHTwo= CHCOOCHTwo) [CHTwo= C (CHThree) COOCHTwo] CH-.
R in the general formula (II)FourMay be the same or different,
Unsubstituted with 1 to 9 prime atoms, preferably 1 to 6 carbon atoms
Or a substituted monovalent hydrocarbon group. RFourMonovalent hydrocarbons
Specific examples of the group include R in general formula (I).1Illustrated as
The same as those described above,1As in
And RFourIs at least 50 mol% of methyl groups, and 25 mol
% Or less is preferably a phenyl group. General formula (II)
R inFiveRepresents 1 to 18 carbon atoms, preferably a carbon atom
It is a monovalent hydrocarbon group having 1 to 8 children. RFiveMonovalent hydrocarbon
Specific examples of the amino group include a methyl group, an ethyl group, and a propyl
Groups, butyl, pentyl, neopentyl, etc.
A cycloalkyl group such as a cyclohexyl group; phenyl
Aryl groups such as aryl group; allyl group, propenyl group, butenyl
And an alkenyl group such as an alkyl group.
Those excluding aliphatic unsaturated groups such as alkenyl groups are used.
You. In the general formula (II), n is an integer of 1 to 3, and m is
An integer of 0 to 2 and n and m satisfy 1 ≦ n + m ≦ 3
However, when n = 1, RThreeAre plural (ie, two or three
(Meth) acryloyl groups.
【００１１】一般式(I)において、Ｌは８〜１０，００
０、好ましくは４８〜１，０００の整数である。一般式
（Ｉ）で示されるオルガノポリシロキサンとしては、具
体的に下記のものを例示することができる。In the general formula (I), L is from 8 to 10,000.
0, preferably an integer of 48 to 1,000. Specific examples of the organopolysiloxane represented by the general formula (I) include the following.
【００１２】[0012]
【化３】 Embedded image
【００１３】[0013]
【化４】 Embedded image
【００１４】[0014]
【化５】 Embedded image
【００１５】[0015]
【化６】 Embedded image
【００１６】[0016]
【化７】 Embedded image
【００１７】[0017]
【化８】 Embedded image
【００１８】[0018]
【化９】 Embedded image
【００１９】[0019]
【化１０】 Embedded image
【００２０】[0020]
【化１１】 Embedded image
【００２１】[0021]
【化１２】 Embedded image
【００２２】[0022]
【化１３】 Embedded image
【００２３】[0023]
【化１４】 Embedded image
【００２４】[0024]
【化１５】 Embedded image
【００２５】[0025]
【化１６】 Embedded image
【００２６】[0026]
【化１７】 Embedded image
【００２７】[0027]
【化１８】 Embedded image
【００２８】[0028]
【化１９】 Embedded image
【００２９】[0029]
【化２０】 Embedded image
【００３０】[0030]
【化２１】 Embedded image
【００３１】[0031]
【化２２】 Embedded image
【００３２】[0032]
【化２３】 Embedded image
【００３３】[0033]
【化２４】 及びEmbedded image as well as
【００３４】[0034]
【化２５】 〔上記式（１−１）〜（１−２３）において、Ｒ’はメ
チル基、フェニル基又は３，３，３−トリフルオロプロ
ピル基を示し、Ｌは８〜１０，０００、好ましくは４８
〜１，０００の整数を示す。〕Embedded image [In the above formulas (1-1) to (1-23), R ′ represents a methyl group, a phenyl group or a 3,3,3-trifluoropropyl group, and L represents 8 to 10,000, preferably 48.
Shows an integer of ~ 1,000. ]
【００３５】（Ａ）成分のオルガノポリシロキサンは感
放射線性基として−ＯＲ3基を有している〔即ち、分子
鎖両末端の各々に複数個（即ち、２〜９個）の（メタ）
アクリロイル基を有している〕ので、紫外線等の放射線
照射により容易に硬化するという特徴を持っている。こ
のオルガノポリシロキサンは単独で、又は２種以上組み
合わせて使用することができる。The organopolysiloxane of the component (A) has an —OR 3 group as a radiation-sensitive group [that is, a plurality (ie, 2 to 9) of (meth) at each terminal of the molecular chain.
Having an acryloyl group], so that it is easily cured by irradiation with radiation such as ultraviolet rays. These organopolysiloxanes can be used alone or in combination of two or more.
【００３６】上記一般式(I)のオルガノポリシロキサン
は、例えば、対応するクロロシロキサンと活性水酸基を
有する（メタ）アクリロイル官能性化合物との脱塩化水
素反応等により製造することができる。ここでクロロシ
ロキサンとしては下記式で表されるものが例示される。The organopolysiloxane of the general formula (I) can be produced, for example, by a dehydrochlorination reaction of the corresponding chlorosiloxane with a (meth) acryloyl functional compound having an active hydroxyl group. Here, as the chlorosiloxane, those represented by the following formula are exemplified.
【００３７】[0037]
【化２６】 Embedded image
【００３８】活性水酸基を有する（メタ）アクリロイル
官能性化合物としては、２−ヒドロキシエチル（メタ）
アクリレート、メチロールプロパンジ（メタ）アクリレ
ート、ペンタエリスリトールトリ（メタ）アクリレー
ト、２−ヒドロキシ−１−アクリロキシ−３−メタクリ
ロキシプロパン等が例示されるが、目的とするオルガノ
ポリシロキサンが１つのケイ素原子に複数個（２〜９
個）の（メタ）アクリロイル基を有することが好ましい
ことから、メチロールプロパンジ（メタ）アクリレー
ト、ペンタエリスリトールトリ（メタ）アクリレート及
び２−ヒドロキシ−１−アクリロキシ−３−メタクリロ
キシプロパンが好ましく、ペンタエリスリトールトリ
（メタ）アクリレートが更に好ましい。As the (meth) acryloyl-functional compound having an active hydroxyl group, 2-hydroxyethyl (meth)
Examples include acrylate, methylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, 2-hydroxy-1-acryloxy-3-methacryloxypropane, and the like, in which the target organopolysiloxane is bonded to one silicon atom. Plurality (2-9
), It is preferable to have methylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate and 2-hydroxy-1-acryloxy-3-methacryloxypropane, and pentaerythritol Tri (meth) acrylate is more preferred.
【００３９】（Ｂ）放射線増感剤：（Ｂ）成分の放射線
増感剤としては、特に限定されないが、好ましくはベン
ゾフェノン、１−ヒドロキシシクロヘキシル−フェニル
ケトン、２−ヒドロキシ−２−メチル−１−フェニルプ
ロパン−１−オン、１−（４−イソプロピルフェニル）
−２−ヒドロキシ−２−メチルプロパン−１−オンなど
のベンゾイル化合物（又はフェニルケトン化合物）、好
ましくはカルボニル基のα−位の炭素原子上にヒドロキ
シ基を有するベンゾイル化合物（又はフェニルケトン化
合物）；２，４，６−トリメチルベンゾイルジフェニル
フォスフィンオキサイド、ビスアシルモノオルガノフォ
スフィンオキサイド、ビス（２，６−ジメトキシベンゾ
イル）−２，４，４−トリメチルペンチルフォスフィン
オキサイド等のオルガノホスフィンオキサイド化合物；
更にイソブチルベンゾインエーテル等のベンゾインエー
テル化合物；アセトフェノンジエチルケタール等のケタ
ール化合物；チオキサントン系化合物；アセトフェノン
系化合物等が例示される。これらは単独で又は２種以上
組み合わせて使用することができる。（Ｂ）成分の配合
量は、（Ａ）成分１００重量部に対して、通常０．５〜
１０重量部、好ましくは１．０〜５．０重量部である。(B) Radiation sensitizer: The radiation sensitizer of the component (B) is not particularly limited, but is preferably benzophenone, 1-hydroxycyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-methyl. Phenylpropan-1-one, 1- (4-isopropylphenyl)
Benzoyl compounds (or phenyl ketone compounds) such as -2-hydroxy-2-methylpropan-1-one, preferably benzoyl compounds (or phenyl ketone compounds) having a hydroxy group on the carbon atom at the α-position of the carbonyl group; Organophosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bisacylmonoorganophosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide;
Further examples include benzoin ether compounds such as isobutyl benzoin ether; ketal compounds such as acetophenone diethyl ketal; thioxanthone compounds; acetophenone compounds. These can be used alone or in combination of two or more. The amount of component (B) is usually 0.5 to 100 parts by weight of component (A).
10 parts by weight, preferably 1.0 to 5.0 parts by weight.
【００４０】（Ｃ）アルコキシシラン及び／又はその部
分加水分解縮合物：（Ｃ）成分のアルコキシシランは前
記一般式(III)で表され、接着助剤として各種基体に対
し良好な接着性を付与する成分である。一般式(III)に
おいて、Ｒ6は炭素原子数１〜６程度の、好ましくは１
〜４の低級アルキル基、又は炭素原子数１〜３個のアル
コキシ基で置換された炭素原子数１〜３個の低級アルキ
ル基である。該低級アルキル基の具体例としてはメチル
基、エチル基、プロピル基、イソプロピル基、ブチル
基、イソブチル基、ｔｅｒｔ−ブチル基等が挙げられ、
また上記アルコキシ置換低級アルキル基としては、メト
キシメチル基、メトキシエチル基、エトキシメチル基、
エトキシエチル基等が挙げられる。(C) Alkoxysilane and / or partially hydrolyzed condensate thereof: The alkoxysilane of the component (C) is represented by the general formula (III) and imparts good adhesion to various substrates as an adhesion aid. It is a component that does. In the general formula (III), R 6 has about 1 to 6 carbon atoms, preferably 1 to 6 carbon atoms.
A lower alkyl group having 1 to 4 carbon atoms or a lower alkyl group having 1 to 3 carbon atoms substituted with an alkoxy group having 1 to 3 carbon atoms. Specific examples of the lower alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group.
The alkoxy-substituted lower alkyl group includes a methoxymethyl group, a methoxyethyl group, an ethoxymethyl group,
An ethoxyethyl group is exemplified.
【００４１】なお、アルコキシシランの部分加水分解縮
合物とは、該アルコキシ基の加水分解縮合反応によって
生成する、分子中に少なくとも１個、好ましくは２個以
上のアルコキシ基が残存するシロキサン化合物（特に、
ケイ素原子数が２〜１００個、好ましくは２〜３０個程
度のシロキサンオリゴマー）を意味する。一般式(III)
のアルコキシシランもその部分加水分解縮合物も各々単
独で又は２種以上組み合わせて使用することができ、ま
た一般式(III)のアルコキシシランとその部分加水分解
縮合物とを混合して使用することもできる。（Ｃ）成分
の配合量は、（Ｂ）成分の場合と同様、（Ａ）成分１０
０重量部に対して、通常０．５〜１０重量部、好ましく
は１．０〜５．０重量部である。The partially hydrolyzed condensate of alkoxysilane refers to a siloxane compound (at least one, preferably two or more) remaining in the molecule formed by the hydrolytic condensation reaction of the alkoxy group. ,
Siloxane oligomer having 2 to 100, preferably about 2 to 30 silicon atoms). General formula (III)
Can be used singly or in combination of two or more thereof.Also, a mixture of the alkoxysilane of the general formula (III) and the partially hydrolyzed condensate may be used. Can also. The amount of the component (C) is the same as that of the component (B).
The amount is usually 0.5 to 10 parts by weight, preferably 1.0 to 5.0 parts by weight with respect to 0 parts by weight.
【００４２】その他の任意成分：本発明で使用される放
射線硬化性シリコーンゴム組成物には、硬化時の収縮
率、得られる硬化物の熱膨張係数、機械的強度、耐熱
性、耐薬品性、難燃性、熱膨張係数、ガス透過率等を適
宜調整するために、必要に応じて各種添加剤を配合する
ことができる。添加剤としては、例えば、煙霧質シリ
カ、沈降性シリカ、溶融シリカ、粉砕シリカ、結晶シリ
カ、シリカエアロゲル、石英粉末、ガラス繊維、酸化
鉄、酸化チタン、炭酸カルシウム、炭酸マグネシウム等
の無機質充填剤；ヒドロキノン、メトキシヒドロキノン
等の重合禁止剤（ポットライフ延長剤）等が挙げられ
る。また、各種基材に対する接着性をより速やかに発現
させるために、チタン酸エステル、チタンキレート化合
物等の有機チタン化合物を配合することもできる。Other optional components: The radiation-curable silicone rubber composition used in the present invention has a shrinkage ratio upon curing, a thermal expansion coefficient of the obtained cured product, mechanical strength, heat resistance, chemical resistance, In order to appropriately adjust the flame retardancy, the coefficient of thermal expansion, the gas permeability and the like, various additives can be blended as required. Examples of the additives include inorganic fillers such as fumed silica, precipitated silica, fused silica, pulverized silica, crystalline silica, silica aerogel, quartz powder, glass fiber, iron oxide, titanium oxide, calcium carbonate, and magnesium carbonate; Polymerization inhibitors (pot life extenders) such as hydroquinone and methoxyhydroquinone. Further, in order to more quickly develop the adhesiveness to various substrates, an organic titanium compound such as a titanate ester or a titanium chelate compound can be blended.
【００４３】組成物の調製：本発明で使用される放射線
硬化性シリコーンゴム組成物は上記（Ａ）〜（Ｃ）成分
及び必要に応じてその他の添加剤を混合することにより
調製される。こうして得られる放射線硬化性シリコーン
ゴム組成物は、用途に応じ低粘度（液状）からペースト
状又はコンパンド状が可能で、フィルム等の成形物への
加工が容易であり、また紫外線等の放射線により短時間
で硬化し、接着性のあるシリコーンエラストマー成型品
（硬化物）を与えるという特徴を持っている。Preparation of composition: The radiation-curable silicone rubber composition used in the present invention is prepared by mixing the above components (A) to (C) and, if necessary, other additives. The radiation-curable silicone rubber composition thus obtained can be in the form of a paste or a compound from a low viscosity (liquid) depending on the application, and can be easily processed into a molded product such as a film. It has the characteristic that it cures in time and gives an adhesive silicone elastomer molded product (cured product).
【００４４】接着性シリコーンエラストマーフィルムの
製造：接着性シリコーンエラストマーフィルムは、上記
で得られたシリコーンゴム組成物が低粘度ならば、例え
ばフィルム又はシート状の金型へ流し込む等の方法でフ
ィルム又はシートに成形し、またシリコーンゴム組成物
が高粘度やコンパウンド状であれば、カレンダーロール
やインジェクション成形機等でフィルム又はシート状に
成形し、得られたフィルム状成型品に紫外線等の放射線
を短時間照射することにより製造される。なお、本発明
では上記組成物はフィルム状又はシート状に成形する
が、組成物自体は他のいかなる形状に成形することも可
能である。こうして得られる本発明の接着性シリコーン
エラストマーフィルムは、通常、必要に応じて、０．０
１〜２．００ｍｍの範囲の厚さにされる。Production of Adhesive Silicone Elastomer Film: If the silicone rubber composition obtained above has a low viscosity, the film or sheet may be cast, for example, by casting it into a film or sheet mold. If the silicone rubber composition has a high viscosity or a compound shape, it is formed into a film or sheet by a calender roll, an injection molding machine, or the like, and the resulting film-shaped molded product is exposed to radiation such as ultraviolet rays for a short time. Manufactured by irradiation. In the present invention, the composition is formed into a film or a sheet, but the composition itself can be formed into any other shape. The adhesive silicone elastomer film of the present invention obtained in this manner is usually used as required,
The thickness is in the range of 1 to 2.00 mm.
【００４５】放射線としては、紫外線、遠赤外線、電子
線、Ｘ線、γ線などが挙げられるが、装置の手軽さ、扱
いの容易性などから、紫外線を使用することが好まし
い。紫外線を発する光源としては、例えば高圧水銀灯、
超高圧水銀灯、メタルハライドランプ、カーボンアーク
ランプ及びキセノンランプ等が挙げられる。放射線の照
射量は、組成物の厚さによって異なり、例えば厚み２ｍ
ｍに対して紫外線（ピーク：320〜390nm）を200〜2,400
mJ/cm2、好ましくは400〜1,600 mJ/cm2である。Examples of the radiation include ultraviolet rays, far infrared rays, electron beams, X-rays, and γ-rays. However, it is preferable to use ultraviolet rays because of the simplicity of the apparatus and the ease of handling. As a light source that emits ultraviolet light, for example, a high-pressure mercury lamp,
Ultra-high pressure mercury lamps, metal halide lamps, carbon arc lamps, xenon lamps and the like can be mentioned. The irradiation amount of the radiation varies depending on the thickness of the composition, for example, a thickness of 2 m.
UV (peak: 320 to 390 nm) to 200 to 2,400
mJ / cm 2 , preferably 400 to 1,600 mJ / cm 2 .
【００４６】用途：本発明の接着性シリコーンエラスト
マーフィルムは、各種電子部品の被覆剤、接着剤等、特
に接着剤、例えば半導体素子のダイボンディング剤とし
て有用である。Use: The adhesive silicone elastomer film of the present invention is useful as a coating or adhesive for various electronic parts, particularly as an adhesive, for example, a die bonding agent for semiconductor devices.
【００４７】＜シリコーンエラストマー被覆体及び構造
体＞本発明のシリコーンエラストマー被覆体は、以上の
ようにして得られるシリコーンエラストマーフィルムで
基体の一部又は全部を覆い、次いで加熱して該フィルム
を硬化させることにより製造される。また本発明の構造
体は、シリコーンエラストマーフィルムを二つの基体
（例えば、物品の二つの部分）間に挟み、次いで通常圧
着下で、加熱して該フィルムを硬化させて両部分を相互
に結合させることにより製造される。シリコーンエラス
トマーフィルムは接着性を有するので、上記被覆体又は
構造体の接着層として有効に働く。ダイボンディングの
場合を例に説明すると、本発明の接着性シリコーンエラ
ストマーフィルムをダイと該ダイを装着すべき基体（リ
ードフレームやパッケージ）の所定箇所との間に挟んで
配置し、該フィルムを該ダイと基体との間で加熱して硬
化させる。こうしてダイボンディングが完了する。<Silicone Elastomer Coated Body and Structure> The silicone elastomer coated body of the present invention covers a part or all of the substrate with the silicone elastomer film obtained as described above, and then heats to cure the film. It is manufactured by The structures of the present invention also include a silicone elastomer film sandwiched between two substrates (eg, two parts of an article) and then heated, usually under pressure, to cure the film and bond the two parts together. It is manufactured by Since the silicone elastomer film has an adhesive property, it works effectively as an adhesive layer of the above-mentioned coated body or structure. In the case of die bonding, for example, the adhesive silicone elastomer film of the present invention is disposed between a die and a predetermined portion of a substrate (lead frame or package) to which the die is to be mounted, and the film is placed on the die. Heat and cure between the die and the substrate. Thus, die bonding is completed.
【００４８】これらの被覆体及び構造体の製造に使用さ
れる基体としては、特に限定されないが、シリコン、ガ
ラス、アルミニウム、ポリカーボネート、ポリイミド、
ガラスエポキシ等が例示できる。加熱温度は、通常６０
〜２００℃、好ましくは１００〜１８０℃である。加熱
時間は通常１分〜２時間である。The substrate used for producing these coatings and structures is not particularly limited, but may be silicon, glass, aluminum, polycarbonate, polyimide,
Glass epoxy etc. can be illustrated. The heating temperature is usually 60
To 200 ° C, preferably 100 to 180 ° C. The heating time is usually 1 minute to 2 hours.
【００４９】[0049]
【実施例】以下に本発明を実施例によって説明する。な
お、例中、部は重量部、式中のＭｅはメチル基、Ｐｈは
フェニル基、Ｅｔはエチル基を表す。The present invention will be described below with reference to examples. In the examples, parts are parts by weight, Me in the formula represents a methyl group, Ph represents a phenyl group, and Et represents an ethyl group.
【００５０】〔実施例１〕攪拌装置、還流冷却器、滴下
ロート、乾燥空気導入器を取り付けた１，０００ｍｌの
反応装置に、下記平均式：Example 1 A 1,000 ml reactor equipped with a stirrer, a reflux condenser, a dropping funnel, and a dry air inlet was charged with the following average formula:
【００５１】[0051]
【化２７】 で示されるクロロオルガノポリシロキサン５７１ｇ、２
−ヒドロキシ−１−アクリロキシ−３−メタクリロキシ
プロパン（商品名：ＮＫエステル７０１−Ａ、新中村化
学工業（株）製）４７ｇ、トルエン２００ｍｌ、トリエ
チルアミン２６ｇ、及び重合禁止剤としてジブチルヒド
ロキシトルエン２０００ｐｐｍを入れ、攪拌しながら、
７０℃に昇温して７時間加熱、反応させた。反応液を放
冷後、濾過し、プロピレンオキサイド４ｇを添加し、室
温で１時間攪拌し、次いで１００℃／３０ｍｍＨｇでス
トリップを行って下記式で示される透明なオイル状のオ
ルガノポリシロキサンを得た。Embedded image 571 g of a chloroorganopolysiloxane represented by
47 g of -hydroxy-1-acryloxy-3-methacryloxypropane (trade name: NK ester 701-A, manufactured by Shin-Nakamura Chemical Co., Ltd.), 200 ml of toluene, 26 g of triethylamine, and 2,000 ppm of dibutylhydroxytoluene as a polymerization inhibitor were added. While stirring,
The temperature was raised to 70 ° C., and the mixture was heated and reacted for 7 hours. The reaction solution was left to cool, filtered, added with 4 g of propylene oxide, stirred at room temperature for 1 hour, and then stripped at 100 ° C./30 mmHg to obtain a transparent oily organopolysiloxane represented by the following formula. .
【００５２】[0052]
【化２８】 Embedded image
【００５３】次にこのオルガノポリシロキサン１００部
に２−ヒドロキシ−２−メチル−１−フェニルプロパン
−１−オン２部、２，４，６−トリメチルベンゾイルジ
フェニルフォスフィンオキサイド１部、テトラメトキシ
シラン３部を混合し、放射線硬化性オルガノポリシロキ
サン組成物を得た。Next, 2 parts of 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1 part of 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 1 part of tetramethoxysilane 3 Were mixed to obtain a radiation-curable organopolysiloxane composition.
【００５４】この組成物をＮｉメッキ金型（縦１００ｍ
ｍ×横１００ｍｍ、深さ１ｍｍ）に流し込み、８０Ｗ／
ｃｍ2のメタルハライド水銀灯２灯を備えたコンベア炉
内で２秒間、紫外線を照射し（照射量８００ｍＪ／ｃｍ
2）、放射線硬化させた。得られた接着性シリコーンエ
ラストマーフィルムの硬さをＪＩＳ Ｋ６３０１に従っ
て測定した。なお、硬さはスプリング式Ａ型試験機で測
定した。その結果を表１に示す。This composition was applied to a Ni plating mold (100 m long)
mx 100 mm wide, 1 mm deep), 80W /
UV irradiation for 2 seconds in a conveyor furnace equipped with 2 cm 2 metal halide mercury lamps (irradiation dose 800 mJ / cm
2 ), radiation cured. The hardness of the obtained adhesive silicone elastomer film was measured according to JIS K6301. The hardness was measured with a spring type A tester. Table 1 shows the results.
【００５５】次に、上記シリコーンエラストマーフィル
ムを縦２５ｍｍ×横１０ｍｍに切り、基体（基板）とし
てアルミニウム、シリコンウエハ、ポリイミドフィル
ム、ガラス又はポリカーボネートの各２枚のテストピー
ス間に挟み、これを１００ｇｆ／ｃｍ2で圧着し、１５
０℃で６０分間加熱硬化させて構造体を製造し、せん断
接着力を測定した。その結果を表２に示す。Next, the silicone elastomer film was cut into a length of 25 mm and a width of 10 mm, and was sandwiched between two test pieces of aluminum, silicon wafer, polyimide film, glass or polycarbonate as a substrate (substrate). crimp in cm 2, 15
The structure was manufactured by heating and curing at 0 ° C. for 60 minutes, and the shear adhesive strength was measured. Table 2 shows the results.
【００５６】〔実施例２〕テトラメトキシシランの代わ
りに下記式：Example 2 Instead of tetramethoxysilane, the following formula:
【００５７】[0057]
【化２９】 で示されるテトラメトキシシランの部分加水分解縮合物
（メトキシシロキサンオリゴマー）を用いた他は実施例
１と同様にして組成物を調製し、この組成物を用いて接
着性シリコーンエラストマーフィルム及び構造体を製造
し、実施例１と同様の試験を行った。その結果を表１及
び表２に示す。Embedded image A composition was prepared in the same manner as in Example 1 except that a partially hydrolyzed condensate of tetramethoxysilane (methoxysiloxane oligomer) represented by the following formula was used. Using this composition, an adhesive silicone elastomer film and a structure were prepared. It was manufactured and subjected to the same test as in Example 1. The results are shown in Tables 1 and 2.
【００５８】〔実施例３〕テトラメトキシシランの代わ
りに下記式：Example 3 Instead of tetramethoxysilane, the following formula:
【００５９】[0059]
【化３０】 で示されるテトラエトキシシランの部分加水分解縮合物
（エトキシシロキサンオリゴマー）を用いた他は実施例
１と同様にして組成物を調製し、この組成物を用いて接
着性シリコーンエラストマーフィルム及び構造体を製造
し、実施例１と同様の試験を行った。その結果を表１及
び表２に示す。Embedded image A composition was prepared in the same manner as in Example 1 except that a partially hydrolyzed condensate (ethoxysiloxane oligomer) of tetraethoxysilane represented by the following formula was used. Using this composition, an adhesive silicone elastomer film and a structure were prepared. It was manufactured and subjected to the same test as in Example 1. The results are shown in Tables 1 and 2.
【００６０】〔比較例１〕テトラメトキシシランを添加
しなかった他は実施例１と同様にして組成物を調製し、
この組成物を用いて接着性シリコーンエラストマーフィ
ルム及び構造体を製造し、実施例１と同様の試験を行っ
た。その結果を表１及び表２に示す。 〔比較例２〕テトラメトキシシランの代わりにアクリロ
キシプロピルトリメトキシシランを用いた他は実施例１
と同様にして組成物を調製し、この組成物を用いて接着
性シリコーンエラストマーフィルム及び構造体を製造
し、実施例１と同様の試験を行った。その結果を表１及
び表２に示す。 〔比較例３〕テトラメトキシシランの代わりに下記式：Comparative Example 1 A composition was prepared in the same manner as in Example 1 except that tetramethoxysilane was not added.
Using this composition, an adhesive silicone elastomer film and a structure were manufactured, and the same test as in Example 1 was performed. The results are shown in Tables 1 and 2. Comparative Example 2 Example 1 was repeated except that acryloxypropyltrimethoxysilane was used instead of tetramethoxysilane.
A composition was prepared in the same manner as described above, and an adhesive silicone elastomer film and a structure were produced using this composition. The same test as in Example 1 was performed. The results are shown in Tables 1 and 2. [Comparative Example 3] Instead of tetramethoxysilane, the following formula:
【００６１】[0061]
【化３１】 で示されるメチルトリメトキシシランの加水分解縮合物
（メチル基含有メトキシシロキサンオリゴマー）を用い
た他は実施例１と同様にして組成物を調製し、この組成
物を用いて接着性シリコーンエラストマーフィルム及び
構造体を製造し、実施例１と同様の試験を行った。その
結果を表１及び表２に示す。Embedded image A composition was prepared in the same manner as in Example 1 except that a hydrolyzed condensate of methyltrimethoxysilane (a methyl group-containing methoxysiloxane oligomer) represented by the following formula (1) was used. A structure was manufactured, and the same test as in Example 1 was performed. The results are shown in Tables 1 and 2.
【００６２】[0062]
【表１】 （注）ＪＩＳ Ｋ６３０１に規定されるスプリング式Ａ
型試験機で測定[Table 1] (Note) Spring type A specified in JIS K6301
Measured by die tester
【００６３】[0063]
【表２】 （注）単位：ｋｇ／ｃｍ2 [Table 2] (Note) Unit: kg / cm 2
【００６４】[0064]
【発明の効果】本発明の接着性シリコーンエラストマー
フィルムは、下記のような利点を有する。 （１）短時間で放射線硬化して得られるので、製造時間
が短縮できる上、均一な形状で得られるので、接着した
製品の品質を安定化でき、しかもクリーンなフィルムと
して得られる。 （２）加工性が良いので、カットにより定型の接着層を
形成することができる。 （３）低弾性であるため、２つの異なる基板の貼り合わ
せにおける熱的及び機械的応力を緩和し、接着した製品
の信頼性を向上できる。 （４）硬化物であるため、取扱いが簡単である。 （５）フィルム状成形品として供給されるため、使用時
の工程（接着した製品を製造する工程）が合理化でき
る。The adhesive silicone elastomer film of the present invention has the following advantages. (1) Since it can be obtained by radiation curing in a short time, the production time can be shortened, and since it can be obtained in a uniform shape, the quality of the bonded product can be stabilized and a clean film can be obtained. (2) Since the workability is good, a fixed adhesive layer can be formed by cutting. (3) Due to low elasticity, thermal and mechanical stress in bonding two different substrates can be reduced, and the reliability of the bonded product can be improved. (4) Since it is a cured product, handling is easy. (5) Since it is supplied as a film-shaped molded product, the process at the time of use (the process of manufacturing a bonded product) can be rationalized.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｊ 183/05 Ｃ０９Ｊ 183/05 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) C09J 183/05 C09J 183/05
Claims (4)
剤、及び（Ｃ）一般式(III)： Si(OR6)4 (III) （式中、R6 は非置換又は置換の低級アルキル基であ
る。）で示されるアルコキシシラン及びその部分加水分
解縮合物よりなる群から選ばれる少なくとも１種の化合
物、を含有する放射線硬化性シリコーンゴム組成物をフ
ィルム状に成形し、得られたフィルムを放射線硬化させ
ることにより得られる接着性シリコーンエラストマーフ
ィルム。(A) General formula (I): (B) a radiation sensitizer, and (C) a general formula (III): Si (OR 6 ) 4 (III) wherein R 6 is an unsubstituted or substituted lower alkyl group The radiation curable silicone rubber composition containing at least one compound selected from the group consisting of an alkoxysilane represented by the formula (1) and a partially hydrolyzed condensate thereof is formed into a film, and the obtained film is irradiated with radiation. An adhesive silicone elastomer film obtained by curing.
ストマーフィルムで基体の一部又は全部を覆い、次いで
加熱して該フィルムを硬化させることにより得られるシ
リコーンエラストマーフィルム被覆体。2. A silicone elastomer film coating obtained by covering a part or the whole of a substrate with the adhesive silicone elastomer film according to claim 1, and then heating and curing the film.
ストマーフィルムを二つの基体間に挟み、次いで加熱し
て該フィルムを硬化させて両基体を相互に結合させるこ
とにより得られる構造体。3. A structure obtained by sandwiching the adhesive silicone elastomer film of claim 1 between two substrates, and then heating to cure the film and bond the two substrates to each other.
ストマーフィルムをダイと該ダイを装着すべき基体の所
定箇所との間に挟んで配置し、該フィルムを該ダイと基
体との間で加熱して硬化させる、ことを特徴とするダイ
ボンディング方法。4. The adhesive silicone elastomer film according to claim 1, which is sandwiched between a die and a predetermined portion of a substrate on which the die is to be mounted, and the film is heated between the die and the substrate. And curing.
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| Application Number | Priority Date | Filing Date | Title |
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| JP35931199A JP3609971B2 (en) | 1998-12-18 | 1999-12-17 | Adhesive silicone elastomer film |
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| Application Number | Priority Date | Filing Date | Title |
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| JP36093898 | 1998-12-18 | ||
| JP10-360938 | 1998-12-18 | ||
| JP35931199A JP3609971B2 (en) | 1998-12-18 | 1999-12-17 | Adhesive silicone elastomer film |
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| Publication Number | Publication Date |
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| JP2000234060A true JP2000234060A (en) | 2000-08-29 |
| JP3609971B2 JP3609971B2 (en) | 2005-01-12 |
Family
ID=26580947
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| Application Number | Title | Priority Date | Filing Date |
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| JP35931199A Expired - Fee Related JP3609971B2 (en) | 1998-12-18 | 1999-12-17 | Adhesive silicone elastomer film |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003238809A (en) * | 2002-02-15 | 2003-08-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition and adherent silicone elastomer film |
| JP2003238808A (en) * | 2002-02-15 | 2003-08-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition and adherent silicone elastomer film |
| JP2005023291A (en) * | 2002-12-11 | 2005-01-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition, adhesive silicone elastomer film composed of the composition, and structure using the composition and manufacturing method for the structure |
| JP2008024944A (en) * | 2007-08-27 | 2008-02-07 | Shin Etsu Chem Co Ltd | Electronic component sealed or coated with radiation-curable silicone rubber composition |
| JP2021147439A (en) * | 2020-03-17 | 2021-09-27 | 東洋紡株式会社 | Method for producing polyimide film laminate |
| KR20210125426A (en) | 2020-04-08 | 2021-10-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone composition for die-bonding, cured product thereof, and optical semiconductor device |
-
1999
- 1999-12-17 JP JP35931199A patent/JP3609971B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003238809A (en) * | 2002-02-15 | 2003-08-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition and adherent silicone elastomer film |
| JP2003238808A (en) * | 2002-02-15 | 2003-08-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition and adherent silicone elastomer film |
| JP2005023291A (en) * | 2002-12-11 | 2005-01-27 | Shin Etsu Chem Co Ltd | Radiation-curable silicone rubber composition, adhesive silicone elastomer film composed of the composition, and structure using the composition and manufacturing method for the structure |
| JP2008024944A (en) * | 2007-08-27 | 2008-02-07 | Shin Etsu Chem Co Ltd | Electronic component sealed or coated with radiation-curable silicone rubber composition |
| JP2021147439A (en) * | 2020-03-17 | 2021-09-27 | 東洋紡株式会社 | Method for producing polyimide film laminate |
| JP7452135B2 (en) | 2020-03-17 | 2024-03-19 | 東洋紡株式会社 | Method for manufacturing polyimide film laminate |
| KR20210125426A (en) | 2020-04-08 | 2021-10-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone composition for die-bonding, cured product thereof, and optical semiconductor device |
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| Publication number | Publication date |
|---|---|
| JP3609971B2 (en) | 2005-01-12 |
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