JP2000227671A - Organic photoreceptor and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the lowering of image quality by the enlargement of the exposure diameter of a record image due to moire and multiple reflection. SOLUTION: Regular surface roughness wave-forms are formed on the surface 21 of a substrate 2, fine ruggedness of 0.1-1.5 μm height is provided to each of the wave-forms and excess laser light which reaches the surface of the substrate 2 is diffused and scattered in an undercoat layer 3 by the fine ruggedness of 0.1-1.5 μm height in every regular surface roughness wave-form of the surface 21 of the substrate 2 to prevent multiple reflection due to the excess laser light which reaches the surface of the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic photoreceptor used for an image forming apparatus such as an electrophotographic copying machine or a printer, and more particularly to a method for forming a high quality image.

[0002]

2. Description of the Related Art In an electrophotographic copying machine or the like, when a photosensitive member is irradiated with a laser beam to form an electrostatic latent image, multiple reflections of the laser beam occur in the photosensitive layer, and the surface of the photosensitive member is reflected. Interference occurs with light, and a pattern of interference fringes appears in the formed image, which may degrade image quality. A photosensitive member for preventing interference between multiple reflections in the photosensitive layer and reflection on the surface of the photosensitive member is disclosed in, for example, Japanese Patent Application Laid-Open No.
-26191 and JP-A-60-186850.

The photoreceptor disclosed in Japanese Patent Application Laid-Open No. 6-28089 has a width of 10 μm or less on a photosensitive layer surface of a cylindrical substrate.
Grooves of 500 μm and 0.3 μm to 30 μm having a depth of λ / 2 or more of the wavelength of the incident light at the time of exposure are formed in parallel to form a tapered reflecting surface regularly, and to apply a laser beam to the photoconductor The interference of light generated when irradiating and writing is prevented.

In the photoreceptor disclosed in Japanese Patent Publication No. 5-26191, a photoreceptor having a photoconductive layer on a base has fine irregularities of about 0.1 μm to 1.0 μm formed on the base surface by cutting or grinding. After forming, the base surface has a wavelength of 700 n.
The light diffusing surface is in a state close to the uniformly diffuse reflecting surface for the laser beam of m or more, thereby preventing the occurrence of multiple reflection inside the photoconductor.

The photoreceptor disclosed in Japanese Patent Application Laid-Open No. 60-186850 has a light diffusion / reflection surface having an average surface roughness of at least half a wavelength of laser light between a conductive support and a photosensitive layer. An undercoat layer is provided, and 50% or 65% of the intensity of the laser beam.
%, The light diffuse reflection is caused to suppress the interference of light. In addition, the intensity of the laser beam is 50
% Or 65% or more, the surface roughness of the undercoat layer is 0.5 μm or more, which is １ ／ or more of the wavelength of the laser light. Further, a coating film is formed on the conductive support with two types of compatible liquids, and one of the resins is dissolved and removed to form a rough surface with the remaining resin, and the undercoat has a surface irregularity of an arbitrary size and density. A layer is formed.

[0006]

Problems to be Solved by the Invention Japanese Patent Laid-Open No. 6-28208
In the photoreceptor shown in No. 9, the tapered reflection surface becomes a regular reflection surface. Therefore, when the undercoat layer is formed of a transparent film for uniform coating wetness when forming the photosensitive layer, reflected light is reduced. Multiple reflections with shorter absorption and reflection distances are likely to occur again from the back side of the photosensitive layer without being absorbed in the layer. Also, if the photosensitive layer is formed as a single layer,
When the light absorptance in the photosensitive layer is low, the specular reflection component on the tapered reflective surface increases, and the refractive index is as large as 1.5 to 1.6 because polycarbonate or the like is used as the main component of the binder for the photosensitive layer. Light tends to undergo multiple reflections. In order to prevent this, a pigment for light dispersion such as Ti oxide and a film thickness of 5 to 15 μm for making light dispersion effective are secured in the undercoat layer and Sn oxide or the like is used as a conductive agent for controlling an increase in resistance of the film. Must be dispersed at the same time, leading to an increase in manufacturing costs. Also, when the conductive agent is dispersed and formed into a film, the conductive agent particles are likely to be exposed on the surface on which the coating film is formed, and if the insulating layer is not provided again before the formation of the photosensitive layer, minute image defects due to charge leakage are likely to occur. Yes, further increasing the manufacturing cost.

On the other hand, if the tapered reflecting surface is a specular reflecting surface, the wettability of the liquid at the time of forming the coating film is poor, and the holding power of the film is reduced, so that the liquid accumulates or sinks on the linear projections of the tapered reflecting surface. Disadvantages occur, and it is difficult to reduce the thickness of the undercoat layer to an insulating layer.

The photoreceptor disclosed in Japanese Patent Publication No. 5-26191 forms a light diffusing surface close to an evenly diffusing surface with respect to a laser beam for preventing multiple reflections. Although fine irregularities are formed by grinding,
In the cutting method, a surface having a continuous roughness is formed, and in the grinding method, a surface having an intermittent length of roughness due to a difference in rotation speed between an object to be ground and a grindstone is formed. In order to obtain a light diffusing surface in a state close to the uniform diffusion reflecting surface by this cutting method, it is necessary to combine another method such as, for example, dry ice pellet spraying and flattening method during the cutting process.

Further, as disclosed in JP-A-60-186850, an undercoat layer having a light-diffuse reflection surface between a conductive support and a photosensitive layer, the light-diffusion surface having a wavelength equal to or longer than half a wavelength of laser light. Is provided, the photosensitive layer is applied to a single-layer photoreceptor, is to re-absorb the reflected light diffused inside the photosensitive layer, the image formed is larger than the beam diameter of the laser light, The formed toner image has a disadvantage that it lacks sharpness.

According to the present invention, the disadvantages are improved, and the unabsorbed and transmitted light of the laser beam for optical writing is diffused and reflected more effectively on the surface of the cylindrical photoreceptor substrate. It is an object of the present invention to provide a method for manufacturing an organic photoreceptor capable of preventing a deterioration in image quality due to an increase in an exposure diameter of a recorded image due to multiple reflection.

[0011]

In the organic photoreceptor according to the present invention, an undercoat layer in which a light scattering agent is dispersed is formed on the surface of a cylindrical aluminum or aluminum alloy substrate, and the surface of the undercoat layer is formed on the surface of the undercoat layer. An organic photoreceptor having a charge generation layer and a charge transfer layer formed thereon, wherein the surface of the substrate is formed with a regular surface roughness waveform, and the height is included in each of the regular surface roughness waveforms. It is characterized by having fine irregularities of 0.1 μm to 1.5 μm.

The method for producing an organic photoreceptor according to the present invention comprises:
A method for producing an organic photoreceptor in which an undercoat layer in which a light scattering agent is dispersed is formed on the surface of a cylindrical aluminum or aluminum alloy substrate, and a charge generation layer and a charge transfer layer are formed on the surface of the undercoat layer Where r is the radius of the cutting edge of the cutting tool for turning the surface of the substrate, and S is the feed amount, the regular surface roughness is expressed by the geometric surface roughness Rmax = S ² / 8r. It is characterized in that fine irregularities having a height of 0.1 μm to 1.5 μm are formed in each of the regular surface roughness waveforms.

The surface of the above-mentioned base is made to have a cutting edge radius r = 1.
It is better to turn with a cutting tool of size ~ ∞.

The cutting tool for turning the surface of the substrate is made of sintered diamond, and the flank of the cutting edge is made of a diamond grindstone having an average grain size of 10 to 40 μm.
1 to 1.5 μm, or the flank of the cutting edge is finished to a roughness of 0.1 to 1.5 μm by electric discharge machining, and a height of 0 in each of the regular surface roughness waveforms of the substrate surface. .1 μm
It is preferable to transfer fine irregularities of about 1.5 μm.

Further, the cutting rake face of the cutting tool is finished by grinding with a diamond grindstone having an average grain diameter of 5 to 12 μm, and the rake angle of the cutting tool is -5 to -15 degrees and the clearance angle is 5 to 15 degrees. It is desirable to be in the range of degrees.

It is preferable that a cylindrical vibration isolator is press-fitted into the base and the surface of the base is turned.

Further, after turning the surface of the substrate, the substrate is washed with an alkaline cleaning liquid having a pH of 10 to 11 to a temperature of 40 to 40 ° C.
After washing at 50 ° C. for 3 to 5 minutes, it is preferable to wash again with an alkaline washing solution having a pH of 12 to 13 at a liquid temperature of 40 to 50 ° C. for 3 to 5 minutes and then with water.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The photoreceptor of the present invention has an undercoat layer in which a light scattering agent is dispersed formed on the surface of a cylindrical aluminum or aluminum alloy substrate. A photosensitive layer as a charge transfer layer is formed. When manufacturing this photoconductor, the surface of the substrate is turned using an R bite. When the surface of the substrate is cut using the R bite, the geometric surface roughness R
max is mainly determined by the macroscopic transfer of the cutting edge shape of the R tool, and the cutting edge radius (the cutting edge nose radius) is r,
Assuming that the feed amount is S, a regular surface roughness waveform represented by Rmax = S ² / 8r is formed. In this regular surface roughness waveform, fine irregularities are generated for each waveform by microscopic transfer of the blade edge. The surface of the substrate is turned by processing the cutting edge of the R bit so that the height of the fine irregularities in each of the surface roughness waveforms is 0.1 μm to 1.5 μm, and the surface of the substrate is regularly arranged. 0.1μm height in each waveform
1.5 μm fine irregularities are transferred.

When a laser beam for optical writing is irradiated to form a toner image on a photoreceptor formed by using the substrate, when the irradiated laser beam reaches the charge generation layer from the charge transfer layer, the optical carrier Is generated to form an electrostatic latent image.
When the photosensitive member is irradiated with laser light to perform optical writing, excess light not absorbed by the charge generation layer enters the undercoat layer in which the light scattering agent is dispersed. Excess laser light that enters the undercoat layer and is not scattered in the undercoat layer reaches the surface of the base. Excess laser light that reaches the surface of the substrate has a height of 0.1 μm or more for each regular surface roughness waveform on the surface of the substrate.
It is diffused by 1.5 μm fine unevenness to prevent multiple reflection. In this way, the undercoat layer can be made thinner to prevent light interference on the photoreceptor surface.

[0020]

FIG. 1 is a partial sectional view of a photoreceptor for forming a toner image in an image forming apparatus such as an electrophotographic copying machine. As shown in the figure, the photoreceptor 1 has an undercoat layer 3 in which a light scattering agent is dispersed formed on a surface 21 of a cylindrical aluminum or aluminum alloy substrate 2, and a charge generation layer 4 on the surface of the undercoat layer 3. And the photosensitive layer 6 of the charge transfer layer 5 is formed. When manufacturing the photoconductor 1, the surface 21 of the base 2 is turned using an R bite. When cutting the surface 21 of the base 2 using the R bite, the surface 2
As shown in the roughness cross-sectional curve diagram of FIG. 2A, the geometric surface roughness Rmax of No. 1 is mainly determined by the macroscopic transfer of the cutting edge shape of the R bit 7 and the cutting edge radius (the cutting edge nose radius). ) and r, the feed amount when the S, Rmax = S ^2/8
It is formed with a regular surface roughness waveform 22 represented by r. In this regular surface roughness waveform 22, as shown in the partial enlarged roughness cross-sectional curve diagram of FIG. 2B, fine irregularities 23 are generated for each waveform by microscopic transfer of the blade edge. The height of the fine irregularities 23 in each of the surface roughness waveforms 22 is from 0.1 μm to
The edge of the R bite 7 is machined so as to have a thickness of 1.5 μm.

When an image is written to form a toner image on the photoconductor 1, scanning of an image formed by the semiconductor laser device 8 on the photoconductor 1 having a charged surface is performed as shown in the perspective view of FIG. Is irradiated with a laser beam 9 in accordance with. When the irradiated laser beam 9 reaches the charge generation layer 4 from the charge transfer layer 5 of the photoreceptor 1, it generates an optical carrier to form an electrostatic latent image. The electrostatic latent image formed on the photoreceptor 1 is visualized by the toner attached by the developing device 10. When the photoreceptor 1 is irradiated with laser light 9 for optical writing, the charge generation layer 4
Excess light that has not been absorbed by the substrate enters the undercoat layer 3 in which the light scattering agent is dispersed. At this time, the undercoat layer 3 is, for example, 5 to 2
When the thickness is 0 μm, the laser light 9 scatters without reaching the surface 21 of the base 2. However, when the thickness is large, it is difficult to reduce the electric resistance, and the conductive agent And it is necessary to adjust the electric resistance to 10 ¹² Ωcm or less and to form an insulating layer of a thin film such as a polyamide resin between the undercoat layer 3 and the charge generation layer 4.

On the other hand, when the thickness of the undercoat layer 3 is small, as shown in FIG. 2B, excess laser light 91 not scattered by the undercoat layer 3 reaches the surface 21 of the base 2. I do. The surplus laser light 91 reaching the surface 21 of the base 2 has a height of 0.1 for each regular surface roughness waveform of the surface 21 of the base 2.
The light is scattered by the fine irregularities 23 of μm to 1.5 μm to prevent multiple reflection. Thus, the undercoat layer 3 can be made thinner to prevent light interference on the surface of the photoreceptor 1.

The surface 21 of the base 2 is cut, for example, with an R bit 7 having fine irregularities of 0.1 to 1.5 μm at the cutting edge and a feed amount of S = 0.19 mm. FIG. 4 shows the result of measuring No. 21 with a surface roughness meter. As shown in FIG. 4, a regular surface roughness waveform 22 is formed on the surface 21 of the base 2 at a pitch of 0.19 mm, and fine irregularities 2 having a height of 0.1 μm to 1.5 μm are formed for each waveform.
3 is formed by transfer. A photoreceptor 1 is manufactured using the substrate 2, and a writing aperture D =
As a result of irradiating a laser beam 9 of 70 to 90 μm,
No interference fringes were generated on the surface, and it was confirmed that the excess laser beam 91 reaching the surface 21 of the base 2 was diffused on the surface 21 and scattered on the undercoat layer 3.

The cutting edge radius r of the cutting edge of the R bit 7 for cutting the surface 21 of the base 2 is an arbitrary value, for example, r.
= 1 to ∞, and fine irregularities 23 having a height of 0.1 to 1.5 μm for each feed amount S may be periodically formed on the surface 21 of the base 2. For example, assuming that the edge radius is r = ∞, fine irregularities 23 having a height of 0.1 to 1.5 μm are periodically formed on the surface 21 of the base 2 at every feed amount S = 0.33, FIG. 5 shows the results obtained by measuring the surface 21 with a surface roughness meter. The photoreceptor 1 was manufactured from the substrate 2 and irradiated with a laser beam 9 having a writing aperture D = 70 to 90 μm. As a result, no interference fringes were generated on the surface of the photoreceptor 1 and the surface 21 of the substrate 2
It has been confirmed that the surplus laser light 91 arriving at the surface 21 is diffused on the surface 21.

As shown in FIG. 6, the R tool 7 when the surface 21 of the base 2 is turned by a lathe has a cutting edge 72 made of a sintered diamond tip at the tip of a shank 71 as shown in FIG. Since the sintered diamond tip of the cutting edge 72 is formed by sintering diamond particles at a high temperature and a high pressure using WC-Co fine powder as a binder, it has conductivity and can be subjected to electric discharge machining. The rake face 73 of the cutting edge 72 has a rake angle α = −5 to −15 degrees, which is larger than that of a normal diamond cutting tool, so that chips can be easily discharged. Here, when the cutting margin is set to 60 μm or more, the rake angle α is set to be as large as −10 to −15 degrees. In addition, the clearance angle β of the flank 74 of the cutting edge 72 is set to be larger than 1 to 3 degrees of a normal diamond tool, and the clearance angle β is set to 5 to 10 degrees to reduce the cutting resistance. Furthermore, rake face 7
The surface roughness of No. 3 is obtained by grinding with a diamond grindstone having an average grain diameter of 5 to 12 μm and mirror finishing to facilitate the discharge of chips. The flank 74 of the r portion 75 of the cutting edge 72 is ground with a diamond grindstone having an average grain diameter of 10 to 40 μm, or is subjected to electric discharge machining to have a surface roughness of 0.1 to 1.5 μm. And a surface 21 of the substrate 2
The fine irregularities 23 having a height of 0.1 to 1.5 [mu] m are transferred. By performing precision turning on the surface of the base 2 using the R bit 7, the rough surface of the flank 74 of the R bit 7 is transferred to the surface 21 of the base 2, and fine irregularities 23 can be formed. . Surface 21 of base 2
When turning, the shank part 7 of the R bite 7
When the chip guide surface angle γ provided in 1 is γ = 40 to 45 degrees, the chips 24 can be stably discharged as shown in the perspective view of FIG. 7. Note that FIG. 7 shows a state in which the actual turning operation is reversed by 180 degrees, and in the case where the actual turning operation is performed, the cutting edge 72 of the R bit 7 is directed downward.

When the base body 2 is turned in this way, as shown in the perspective view of FIG. 8A and the side view of FIG. 8B, the nozzle 2 is made of a mixture of kerosene having a petroleum hydrocarbon diameter and light oil from the nozzle 11. The base 2 is turned with the R-bit 7 while supplying the cutting oil, and the generated chips 24 are provided at the lower portion of the R-bit 7 and collected by suctioning with the chip discharge hood 12 connected to the chip suction device. I do. When the substrate 2 is being turned, the airflow of the chip discharge hood 12 is set to 1.2 to 1.5 times the cutting speed, so that the chips 24
The rough surface of the flank surface 74 of the R bite 7 can be transferred to the surface 21 of the base 2 to prevent the unevenness 23 from being formed.

When turning the base 2, FIG.
The cylindrical anti-vibration member 13 shown in the front sectional view of (a) and the side sectional view of (b) is press-fitted into the inner diameter of the base 2 to increase the rigidity of the base 2 and absorb the vibration, and R on the surface 21
The rough surface of the flank 74 of the cutting tool 7 can be accurately transferred. As shown in FIG. 9, the cylindrical vibration-isolating member 13 is formed such that an oil-resistant rubber having a rubber hardness of 40 to 60 degrees, for example, an oil-resistant polysulfide rubber, a fluorine rubber, a urethane rubber, an acrylic rubber , A plurality of disc-shaped vibration insulators 132 made of nitrile rubber or the like are inserted through spacers 133, and the disc-shaped vibration insulators 132 are covered with a polyamide resin cloth or a woven cloth obtained by laminating or coating a fluororesin. Covered with material 134, and holding plates 135 at both ends
It is fixed with. The core metal 131 has a center hole 136 at the center so that the surface of the disk-shaped vibration isolator 132 can be ground after the disk-shaped vibration isolator 132 is inserted and fixed. When the cylindrical anti-vibration member 13 is inserted into the base 2,
The pressing amount of the covering member 134 of the cylindrical vibration isolator 13 is
, For example, in the range of 1/3 of the total length of
5 to 0.25 mm, 0.05 to 0.15 m on both sides
m, the disk-shaped vibration isolator 132 and the spacer 133 are fixed to the cored bar 131, the surface of the disk-shaped vibration isolator 132 is ground, and the cylindrical vibration isolator 13 is inserted into the base 2. In order to prevent the diameter of the base 2 from being expanded when it is made, the cylindrical vibration isolator 13 can be easily inserted into the base 2 and the rigidity of the base 2 can be increased to absorb vibration during processing. it can. The polyamide resin cloth used as the coating material 134 has a coefficient of friction of 0.1, which is slightly larger than that of the fluororesin, but is durable, inexpensive and has good workability to cutting oil. Further, the woven fabric laminated or coated with a fluororesin has a friction coefficient of 0.05 and is easily slippery, and can be easily inserted into the base 2 to effectively exhibit a vibration-proof effect of increasing the pressing force.

As shown in FIG. 10, the cylindrical anti-vibration member 13 is formed by inserting the center hole 136 of the metal core 131 into the shaft of the tail-side taper fitting jig 14 of the precision lathe and tightening the tightening plate 15.
And fixed to the tapered fitting jig 14. The base 2 is attached to the vibration isolating member 13, centered by an open collet chuck 16 of a precision lathe, and the tail shaft 17 is advanced to clamp the base 2. The pressing load for pressing the tail shaft 17 when clamping the base 2 is 10 to 50K.
g, which is adjusted according to the diameter, plate thickness, and length of the base 2. When the clamped substrate 2 is turned, the cutting conditions are, for example, a rotation speed of 4000 to 5000 rpm, a cutting feed amount S of 0.1 to 0.2 mm, and a finishing allowance for obtaining the surface 21 of the substrate 2 at 20 to 60 μm. , Cutting edge radius r
Using an R bite 7 in the range of 1 to 30 mm, while injecting cutting oil at an injection amount of 0.2 to 0.5 cc / sec,
The outer diameter is 30 to 100 mm, the length is 360 mm, and the thickness is 0.3 mm.
As a result of processing each of the bases 2 having a size of 5 to 1.5 mm, a stable cut surface could be obtained without scratching, formation of minute projections, or welding of cutting chips on the cut surface.

After turning the surface 21 of the substrate 2 as described above, the substrate 2 is washed with an alkaline cleaning liquid having a pH of 10 to 11 at a liquid temperature of 40 to 50 ° C. for a processing time of 3 to 5 minutes to remove cutting oil. Then, it is washed again with an alkaline washing solution having a pH of 12 to 13 at a liquid temperature of 40 to 50 ° C. for a treatment time of 3 to 5 minutes, and then washed with water. By performing the treatment with the alkaline cleaning solution having a pH of 12 to 13 as described above, the surface 21 of the substrate 2 is etched by a minute amount of 0.1 μm or less, and the surface 2 is etched.
1 Loss of gloss and cloudiness. The photoreceptor 1 is manufactured using the substrate 2 having the surface 21 that has become cloudy in this way,
As a result of performing optical writing by irradiating the manufactured photoconductor 1 with a laser beam, it was possible to more reliably prevent light interference on the surface of the photoconductor 1. Here, the composition of the alkaline cleaning solution having a pH of 10 to 11 is 20 to 40% of sodium silicate, 50 to 70% of sodium phosphate and 5 to 10% of a surfactant, and the concentration of the alkaline detergent is 2 to 5%. Is 20 to 40% of sodium silicate, 50 to 70% of sodium phosphate, 5 to 10% of surfactant, and 3 to 10% of alkaline detergent.
The cutting oil adhering to the substrate 2 can be reliably removed, and the surface 21 of the base 2 can be uniformly clouded.

[0030]

As described above, according to the present invention, if the radius of the cutting edge of a cutting tool for turning the surface of the base is r and the feed amount is S, the surface of the base is geometrical surface roughness Rmax =
It is formed with a regular surface roughness waveform represented by S ² / 8r, and the height of each regular surface roughness waveform is 0.1 μm to 1 μm.
Since the fine irregularities of 5 μm are provided, the excess laser light reaching the surface of the substrate is subjected to fine irregularities having a height of 0.1 μm to 1.5 μm for each regular surface roughness waveform of the surface of the substrate. Diffuse in the undercoat layer and scattered by the undercoat layer, preventing multiple reflections due to excess laser light reaching the surface of the substrate, and causing light interference on the photoreceptor surface even if the undercoat layer is thinned Can be prevented, and a high-quality image can be stably formed.

The surface of the substrate is formed by cutting the edge radius r = 1 to 1
By turning with a cutting tool of size ∞ and periodically forming fine irregularities having a height of 0.1 μm to 1.5 μm on the surface of the base for each feed amount S, the excess reaching the surface of the base Can be surely diffused.

The cutting tool for turning the surface of the substrate is made of sintered diamond, and the flank of the cutting edge is made of a diamond grindstone having an average grain size of 10 to 40 μm.
By finishing the flank surface of the cutting edge to a roughness of 0.1 to 1.5 μm by electric discharge machining, the height of each of the regular surface roughness waveforms of the substrate is increased. 0.1
Fine irregularities of μm to 1.5 μm can be accurately transferred.

Further, the rake face of the cutting tool is finished by grinding with a diamond grindstone having an average grain diameter of 5 to 12 μm, and the rake angle of the cutting tool is -5 to -15 degrees and the clearance angle is 5 to 15 degrees. By setting the range, the cutting resistance when turning the surface of the base is reduced, and the discharge of the chips is facilitated. Can be prevented.

Further, the rigidity of the base is increased by press-fitting a cylindrical vibration isolator into the base and turning the surface of the base.
In addition, the flank of the cutting tool can be accurately transferred to the surface of the base by absorbing vibration.

Further, after turning the surface of the substrate, the substrate is washed with an alkaline cleaning solution having a pH of 10 to 11 to a temperature of 40 to 40.
Cutting oil adhering to the surface of the substrate by washing at 50 ° C. for 3 to 5 minutes, washing again with an alkaline washing solution of pH 12 to 13 at a liquid temperature of 40 to 50 ° C. for 3 to 5 minutes, and then washing with water. Can be reliably removed, and the surface of the substrate can be uniformly clouded, and the diffusion efficiency of laser light incident on the surface of the substrate can be further increased to form a stable image.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of a photosensitive member according to an embodiment of the present invention.

FIG. 2 is a diagram showing a roughness cross-sectional curve of a substrate surface of the embodiment.

FIG. 3 is a perspective view showing a photoconductor and a semiconductor laser device.

FIG. 4 is a waveform diagram showing the surface roughness of the surface of the base.

FIG. 5 is a waveform diagram showing another surface roughness of the surface of the base.

FIG. 6 is a perspective view showing an R tool for turning a surface of a base.

FIG. 7 is a perspective view showing a cutting state using an R bite.

FIG. 8 is a turning diagram showing a state when cutting the surface of the base.

FIG. 9 is a cross-sectional view illustrating a configuration of a vibration isolation member.

FIG. 10 is a cross-sectional view showing a clamped state when turning the base.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Photoreceptor 2 Substrate 3 Undercoat layer 4 Charge generation layer 5 Charge transfer layer 6 Photosensitive layer 7 R byte 9 Laser beam

Continued on the front page (72) Inventor Hiroyuki Goto 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Company (72) Inventor Shuji Kasai 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Company (72) Inventor Toshio Mochizuki 1-3-6 Nakamagome, Ota-ku, Tokyo Ricoh Co., Ltd. (72) Inventor Yoshiaki Ishiura 1-3-6 Nakamagome, Ota-ku, Tokyo Ricoh F-term ( Reference) 2H068 AA44 AA52 AA54 AA59 CA32 EA05 EA07 3C043 AA11 CC02 CC13

Claims (9)

[Claims] 1. An organic material comprising a cylindrical aluminum or aluminum alloy substrate, an undercoat layer in which a light-scattering agent is dispersed, and a charge generation layer and a charge transfer layer formed on the surface of the undercoat layer. A photosensitive member, wherein the surface of the substrate is formed with a regular surface roughness waveform, and the height of each of the regular surface roughness waveforms is 0.1 μm to 1.5 μm.
An organic photoreceptor having fine irregularities. 2. An organic material comprising a cylindrical aluminum or aluminum alloy substrate, an undercoat layer in which a light scattering agent is dispersed, and a charge generation layer and a charge transfer layer formed on the surface of the undercoat layer. A method of manufacturing a photoreceptor, wherein a cutting edge radius of a cutting tool for turning a surface of a base is r,
Assuming that the feed amount is S, the surface of the substrate is changed to a geometric surface roughness Rm.
ax = S ² / 8r, a regular surface roughness waveform is formed, and the height of each regular surface roughness waveform is 0.1 μm.
A method for producing an organic photoreceptor, comprising forming fine irregularities of m to 1.5 μm. 3. The surface of the above-mentioned base is formed by cutting the edge corner radius r =
3. The method according to claim 2, wherein the turning is performed with a cutting tool having a size of 1 to ∞. 4. The cutting tool for turning the surface of the substrate is made of sintered diamond, and the flank of the cutting edge is made of a diamond grindstone having an average grain size of 10 to 40 μm.
The organic photosensitive material according to claim 2 or 3, wherein the substrate is finished to a thickness of 1 to 1.5 µm, and fine irregularities having a height of 0.1 µm to 1.5 µm are transferred into each of the regular surface roughness waveforms of the surface of the substrate. How to make the body. 5. The cutting tool for turning the surface of the base is made of sintered diamond, and the flank of the cutting edge is finished to a roughness of 0.1 to 1.5 μm by electric discharge machining to form a regular surface of the base. The height in each of the surface roughness waveforms is 0.1 μm to 1.
4. The method for producing an organic photoreceptor according to claim 2, wherein fine irregularities of 5 [mu] m are transferred. 6. The method according to claim 4, wherein the rake face of the cutting tool is finished by grinding with a diamond grindstone having an average grain diameter of 5 to 12 μm. 7. The rake angle of the cutting tool is -5 to -15.
7. The method for producing an organic photoreceptor according to claim 6, wherein the clearance and the clearance angle are in the range of 5 to 15 degrees. 8. The method according to claim 2, wherein the surface of the substrate is turned by press-fitting a cylindrical vibration isolator into the substrate. 9. After turning the surface of the substrate, the substrate is washed with an alkaline cleaning liquid having a pH of 10-11 at a temperature of 40-5.
The method for producing an organic photoreceptor according to claim 9, wherein the organic photoreceptor is washed at 0 ° C for 3 to 5 minutes and then washed again with an alkaline washing solution having a pH of 12 to 13 at a liquid temperature of 40 to 50 ° C for 3 to 5 minutes.