JP2000223434A - Substrate-processing device and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device, where a substrate is heated by a lamp, where wirings laid for the lamp can be lessened in number, the substrate processing device can be lessened in manufacturing cost and enhanced in processing reliability. SOLUTION: Heating means 31a are connected to a power supply 32a, and four lamps 311 and a current detector 312 are provided to each of the heating means 31a. Power supply modules 32 constituted this way are provided to a substrate-processing device. With this setup, the number of wirings prepared with respect to eight lamps 311 can be set at four. When the lamp 311 is burned out, the heating means 31a where the lamp is burned out can be located by the current detector 312. As a result, wirings laid for the lamps 311 can be lessened in number, properly detecting the lamp that is burned out, so that a substrate-processing device can be lessened in manufacturing cost and improved in processing reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus and a substrate processing method for irradiating a substrate with heat by irradiating lamp light.

[0002]

2. Description of the Related Art Conventionally, substrates for precision pattern formation (hereinafter, referred to as "substrates") such as semiconductor substrates for manufacturing semiconductor devices, glass substrates for manufacturing various displays and photomasks, and the like.
There is an apparatus (a so-called lamp annealing apparatus) for irradiating the substrate with light from a lamp to heat the substrate in a predetermined atmosphere for processing.

FIG. 4 is a diagram showing one of a plurality of modules for supplying power to a lamp in such a substrate processing apparatus. That is, FIG.
Are provided, and lighting control of a large number of lamps is performed.

[0004] In the example shown in FIG.
1 supplies power to the power supply module 92, and one power supply module 92 supplies power to two lamps 93. In the power supply module 92, a pair of thyristors 921 reversely connected, a current detector 922 having a current transformer for detecting an AC current value flowing to two lamps 93, and a lamp 93 are provided. A voltage detector 923 having a transformer (potential transformer) for detecting an applied AC voltage value is provided.

[0005] The pair of thyristors 921 controls the power (or current or voltage) supplied to the two lamps 93 by adjusting the firing phase angle of the AC. This power control is performed by the current detector 922 and the voltage detector 923.
This is performed based on the current value and the voltage value detected by.

The two lamps 93 are supplied with electric power controlled by a pair of thyristors 921 in parallel. Each of the two lamps 93 is provided with a corresponding one of the lamps 93 to detect the value of the current supplied to the lamp 93. Then, a current detector 931 is provided in the power supply module 92.

[0007] The current value detected by the current detector 931 is used to detect whether or not a so-called lamp break (breakage of a filament or the like in the lamp 93) has occurred. Specifically, the output waveform from the voltage detector 923 is compared with the output waveform from the current detector 931 for detecting lamp burnout, and when the current value is extremely reduced with respect to the voltage value, the lamp burnout is detected. It is determined that it has occurred.

In the power supply module 92, a pair of thyristors 921 are connected to a current detector 922 and a voltage detector 92.
When the power feedback control is performed based on the output value from the lamp 3, there is a possibility that a large power is supplied to one normal lamp 93 due to the occurrence of the lamp burnout. A pair of thyristors 921
Is shut off, and the lamp 93 in which the lamp has not run out is protected.

[0009]

By the way, in the configuration shown in FIG. 4, in order to supply electric power from the plurality of power supply modules 92 to a large number of lamps 93, twice as many cables as the number of the lamps 93 are required. It is necessary to wire from the arrangement position of 92 to the attachment position of the lamp 93. as a result,
As the thickness of the entire cable increases, the number of connectors and terminals increases, which may lead to an increase in cost and reliability due to an increase in man-hours for manufacturing the device.

In particular, when the number of lamps 93 used in one substrate processing apparatus is increased, not only the number of wirings but also the current detectors 931 for detecting lamp expiration are mounted as many as the number of lamps 93. Therefore, a practical substrate processing apparatus cannot be constructed.

Of course, the current detector 931 is connected to the lamp 93
By arranging them closer to the side, the number of wires from the power supply module 92 to the lamp 93 can be reduced. However, also in this case, the current detector 931
Are required in the same number as the lamps 93, and it is necessary to secure a space near each of the lamps 93 for providing a circuit for detecting lamp burnout. Therefore, even if such a design change is made, there is a possibility that cost increases and reliability decreases due to an increase in man-hours for manufacturing the apparatus.

On the other hand, as shown in FIG. 4, when two lamps 93 are connected to one power supply module 92, if one of the lamps 93 is disconnected, power is supplied to the lamps to protect the other lamp 93. Stopped. As a result, the substrate that was in the middle of processing becomes a defective substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned various problems relating to lamp burnout, and reduces the number of wirings while appropriately detecting lamp burnout, thereby reducing device manufacturing costs and substrate manufacturing costs. A first object is to achieve reduction and improve the reliability of substrate processing. In addition, it prevents the occurrence of defective boards due to lamp burnout,
A second object is to reduce the cost of manufacturing a substrate.

[0014]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a process involving heating of a substrate, comprising: a power supply unit for generating power for heating the substrate; and the power supply unit. A plurality of heating means for irradiating the substrate with lamp light upon receiving power supply, each of the plurality of heating means, a plurality of lamps supplied in parallel, a current supplied to the plurality of lamps or Detecting means for detecting the value of the electric power.

According to a second aspect of the present invention, there is provided the substrate processing apparatus according to the first aspect, wherein the heating means in which the lamp is cut off based on the value of the current or the electric power detected in each of the plurality of heating means. The apparatus further includes a lamp expiration detecting means for detecting.

According to a third aspect of the present invention, there is provided the substrate processing apparatus according to the second aspect, wherein the processing of the substrate being processed is continued when the lamp burn-out detecting means detects the burn-out of the substrate. Operation control means for stopping the processing operation for the next substrate when the above processing is completed.

According to a fourth aspect of the present invention, there is provided a substrate processing method for irradiating a substrate with lamp light from a plurality of lamps to perform a process involving heating of the substrate, comprising: (a) receiving the substrate at a predetermined position; (B) irradiating the substrate with lamp light from the plurality of lamps to perform a process involving heating on the substrate, (c) discharging the substrate from the predetermined position, and (d) Repeating the steps (a) to (c), sequentially processing a plurality of substrates, and the step (b), (b-1)
Detecting the lamp burnout in the plurality of lamps, and (b-2) stopping the step (d) after the execution of the step (c) if the lamp burnout is detected in the step (b-1). And

[0018]

FIG. 1 is a longitudinal sectional view showing the entire structure of a substrate processing apparatus 1 according to one embodiment of the present invention. The substrate processing apparatus 1 is a so-called lamp annealing apparatus that irradiates light from a large number of lamps to perform predetermined processing on a substrate.

As shown in FIG. 1, a substrate processing apparatus 1 includes a holding section 12 for holding a substrate 9 during processing and a transfer robot 81 outside the apparatus in a processing chamber 11 forming a processing space for the substrate 9.
The processing unit 11 has a protrusion 13 for transferring the substrate 9 to and from the hand 811.
As shown by S, a gate valve 14 that opens and closes the carry-in / out entrance 111 by sliding is provided.

A gas supply pipe 15 for filling a predetermined processing gas at the time of processing is connected to the processing chamber 11, and a quartz window 21 for transmitting light is disposed above the processing chamber 11. Further, a lamp chamber 31 is provided above the quartz window 21, and a large number of lamps (for example, tungsten halogen lamps) 311 for generating light for heating the substrate 9 are attached. The lamps 311 are connected to a plurality of power supply modules 32 that receive power from an external AC power supply 82 and generate power for lighting the lamps. Each power supply module 32 supplies power to the plurality of lamps 311 to control the lighting of the lamps 311. I do.

Next, the processing operation of the substrate 9 by the substrate processing apparatus 1 will be briefly described. The unprocessed substrate 9 is firstly held by the hand 811 of the external transfer robot 81 and carried into the processing chamber 11. The hand 811 can move up and down as indicated by an arrow 811S. After the substrate 9 is loaded into the processing chamber 11, the hand 811 descends as indicated by a two-dot chain line in the figure.

At this time, the protrusion 13 is located at a position shown by a two-dot chain line in the figure, and the substrate 9 held by the hand 811 is placed on the plurality of pins 131 of the protrusion 13. Thereafter, the hand 811 retreats outside the processing chamber 11, and the gate valve 14 closes the loading / unloading port 111 of the processing chamber 11.

When the substrate 9 is placed on the pins 131, the protruding portion 13 that can be moved up and down is lowered as shown by an arrow 13 S, and the substrate 9 is placed on the holding portion 12. Further, a predetermined gas is supplied from the gas supply pipe 15 into the processing chamber 11,
The atmosphere around the substrate 9 is an atmosphere suitable for processing.

When the preparation for processing is completed, power is supplied from the power supply module 32 to the lamp 311 and the lamp 311 is turned on.
11 is turned on. As a result, the substrate 9 is irradiated with lamp light from a large number of lamps 311 to perform annealing or CVD (C
A process involving heating, such as chemical vapor deposition, is performed on the substrate 9. Further, the power supplied to the lamp 311 is controlled so as to be appropriately changed according to the content of the processing, and the atmosphere inside the processing chamber 11 is appropriately adjusted.

When the processing of the substrate 9 is completed, the gas in the processing chamber 11 is replaced with an inert gas.
The substrate 9 is carried out by the transfer robot 81 with the space 4 left. The unloading of the substrate 9 is performed by the operation reverse to the operation at the time of loading.

Next, the lamp 31 in the substrate processing apparatus 1
A configuration for controlling lighting of No. 1 will be described with reference to FIG. FIG. 2 is a diagram showing one power supply module 32 and eight lamps 311 connected thereto. In the substrate processing apparatus 1, a plurality of power supply modules 32 are provided to control the lighting of many lamps 311.

The power supply module 32 includes a pair of thyristors 321 connected in reverse to each other, a current detector 322 for detecting an AC current value output from the power supply module 32, and a voltage detector 323 for detecting an output AC voltage value. These convert the power from the AC power supply 82 to the lamp 311
A power supply unit 32a that generates power to be supplied to the power supply unit.

As shown in FIG. 2, the substrate processing apparatus 1
8 in which two power supply modules 32 are arranged in the lamp chamber 31
Power is supplied to the three lamps 311 in parallel, and eight lamps 311 are supplied.
11 is divided into two sets of four. And lamp 3
Each set of 11 is provided with a current detector 312 for detecting a current value in order to detect lamp burnout. That is, two (in parallel) heating means 31a having four lamps 311 are connected to the power supply unit 32a, and each of the heating means 31a is provided with a current detector 312 for detecting lamp expiration.

The outputs from the two current detectors 312 are input to a lamp burnout detection circuit 33, which detects lamp burnout by a method described later. In addition, the lamp burnout detection circuit 3
Reference numeral 3 is connected to the overall control unit 10 that controls the overall operation of the substrate processing apparatus 1, and when the lamp has run out, the fact is notified to the overall control unit 10.

On the other hand, the pair of thyristors 321 of the power supply unit 32a are connected to the power control circuit 34, and the power control circuit 34 adjusts the firing phase angle of the alternating current input to the pair of thyristors 321. Thus, the power output from the power supply unit 32a is controlled according to the progress of the processing of the substrate 9. The power control circuit 34 includes the current detector 32
2 and the current value and the voltage value from the voltage detector 323 are input, and the power output from the power control circuit 34 is feedback-controlled.

Further, the power control circuit 34 is
And the overall control unit 1
When the detection of the lamp out is notified to 0, the overall control unit 10
Sends a signal to the power control circuit 34 as necessary, and the power control circuit 34 turns off the lamp 311 by shutting off the gates of the pair of thyristors 321.

Next, a description will be given of a method of detecting the out-of-lamp in the substrate processing apparatus 1. In the configuration related to one power supply module 32 shown in FIG.
Are all lamps having the same rating (almost the same characteristics). In addition, since the two heating units 31a are supplied with power in parallel from the power supply unit 32a and are always supplied with the same voltage (effective value), the current value (effective value) flowing into the two heating units 31a is ( (Assuming the impedances of the circuits are equal).

Here, when one lamp 311 is disconnected in any one of the heating means 31a, the value of the current flowing through the heating means 31a in which the lamp has failed is approximately equal to the value of the current flowing in the heating means 31a in which the lamp has not failed. 3/4
Becomes Therefore, the lamp burnout detection circuit 33 can detect the burnout of the lamp by comparing the outputs from the two current detectors 312, and the automatic detection of the burnout of the lamp is realized. In this detection method, two heating means 3
Although it is not assumed that the same number of lamp burnouts will occur at the same time in 1a, there is almost no possibility that such a disconnection will occur in a normal use condition, and there is no practical problem.

As a specific example, one heating means 31a
(For convenience, the current value flowing through the heating means X) is Ix, and the current value flowing through the other heating means 31a (for convenience, the heating means Y) is Iy. Assuming that there is a variation of about ± 10%,

[0035]

(Equation 1)

When the relationship shown by the above is satisfied, the lamp has been cut out in the heating means X,

[0037]

(Equation 2)

When the relationship shown by the above expression is satisfied, it is determined that the lamp has run out in the heating means Y.

In order to prevent an inrush current at the start of lamp lighting or an erroneous detection in a transient state, the lamp 31 is prevented.
1 is detected only when a voltage of about 50% or more of the rated voltage is applied, and erroneous detection is appropriately prevented by using various filter circuits and software processing.

As described above, in the substrate processing apparatus 1, the four lamps 311 are set as one set, and each set is provided with a circuit for detecting lamp burnout. Therefore, there is no need to wire twice as many cables as the number of lamps between the power supply module and a large number of lamps as in the related art. It is only necessary to wire between the lamp chamber 31 and the lamp.

As a result, the number of man-hours required for wiring the lamp 311 can be reduced, and the number of current detectors 312 for detecting lamp burnout, the number of circuits, and the like can be reduced as compared with the related art. As a result, it is possible to reduce the device manufacturing cost and the substrate manufacturing cost, and to improve the reliability of the substrate processing.

In particular, when a large number of small and spherical lamps are used as the lamps 311 as shown in FIG. 1, it is necessary to provide more lamps than when the substrate 9 is heated using a straight tube type lamp. Even in such a case, a practical substrate processing apparatus can be manufactured by connecting a plurality of lamps 311 in parallel to form a group.

The number of lamps 311 provided in one heating means 31a is not limited to the above four, and the number of wirings can be reduced as compared with the conventional one if it is two or more. Needless to say, at the time of lamp out detection, only the heating unit 31a having the lamp 311 that has been cut out is specified. However, if the heating unit 31a is specified, the lamp that has been cut out can be easily specified.
There is no practical problem.

The substrate processing apparatus 1 has four lamps 31.
1 is a set, but this is a preferable number from the viewpoint that the operator does not feel troublesome in identifying the lamp 311 that has been cut off, and the current detector is used when the lamp is cut off. It is also a number that can easily detect a lamp burnout based on a change in current value from 312 or the like.

Next, the operation of the substrate processing apparatus 1 when the lamp burnout is detected during the processing of the substrate 9 in the substrate processing apparatus 1 will be described with reference to the flowchart shown in FIG.

As described above, in the processing operation of the substrate processing apparatus 1, first, the unprocessed substrate 9 is loaded into the processing chamber 11 (Step S11), and then the lamp 311 is turned on in the atmosphere of the processing gas. The process is turned on to start the process (step S1).
2). When the processing on the substrate 9 is completed, the substrate 9 is moved to the processing chamber 11.
(Step S13), and when there is a substrate 9 to be processed next, the above-described Steps S11 to S13 are repeated to receive the substrate 9 into the processing chamber 11, perform processing, and perform processing on the substrate 9 from the processing chamber 11. 9 is paid out (step S14). Thus, the processing is sequentially performed on the plurality of substrates 9.

Here, in the substrate processing apparatus 1, it is confirmed whether or not the lamp has run out during the processing of the substrate 9 (steps S22 and S23). If an out-of-lamp occurs, the out-of-lamp detection circuit 33 shown in FIG. 2 notifies the overall control unit 10 of the out-of-lamp and displays an error on the display to notify the operator (step S3).
0). Then, the overall control unit 10 determines whether or not to stop the processing of the substrate 9 being processed (step S24).

For example, for some reason, some lamps 3
If the lamp 11 has run out, or if a process that is susceptible to the running out of the lamp is being performed, the overall control unit 10 stops the process (step S25).

On the other hand, when a process that is less susceptible to the lamp burnout is being performed, the overall control unit 10 does not stop the process even if the lamp burnout occurs, and sets the variable flag that has been set to 0 in advance to the variable flag. 1 is set (steps S21 and S27).
As shown in FIG. 2, when eight lamps 311 are attached to one power supply module 32, even if one lamp 311 burns out, the influence on the other lamps 311 is small. This is because there is no need to protect the other lamps 311.

In other words, if the lamp burnout occurs during the feedback control so that the predetermined power is supplied to the plurality of lamps 311 by the power supply unit 32a, the other lamps 311 are supplied with more power. . However, originally 8
Even if the power supplied to the three lamps 311 is supplied to the seven lamps 311, these lamps 31
1 is unlikely to cause damage. Therefore, in the substrate processing apparatus 1, the processing of the substrate 9 and the processing of the substrate 9 are not stopped within a range that does not affect the lamp 311.

As described above, in the substrate processing apparatus 1, the processing is basically continued even if the lamp is cut out, and when the processing is completed, the substrate 9 is unloaded from the processing chamber 11 (step S1).
3). However, when the lamp has run out, the substrate processing apparatus 1 stops the processing operation for the next substrate 9 based on the fact that the variable flag is 1, and carries the next substrate 9 into the processing chamber 11. This is not the case (step S28). After that, the operator finds a lamp 311 to be replaced from the group of lamps 311 that have run out according to the error display, replaces the lamp 311 and restarts the substrate processing.

The operation performed when the lamp has run out in the substrate processing apparatus 1 has been described above. In the case where the lamp has run out in the substrate processing apparatus 1, it is determined whether or not the supply of power to the lamp 311 should be stopped. It is determined by software in the overall control unit 10, and if the power supply does not need to be stopped, the process is continued. Therefore, conventionally, when the lamp burns out during the heat treatment of the substrate, the power supply is stopped to protect the other lamps, and the substrate being processed is always a defective substrate. Then, after the heat treatment, the device is stopped and the lamp 3
Since the replacement of 11 is performed, occurrence of defective substrates can be reduced as much as possible. Thereby, the manufacturing cost of the substrate 9 can be reduced.

Although the substrate processing apparatus 1 according to one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible.

For example, in the above-described embodiment, eight lamps 311 are connected to one power supply module 32, and these lamps 311 are further divided into four sets (two sets) for detecting lamp expiration. However, the number of sets of lamps 311 connected to one power supply module 32 may be three or more. That is, three or more heating units 31a may be connected to the power supply unit 32a. If two or more lamps 311 are provided for one heating means 31a, the effect of reducing the number of wirings can be achieved.

In the above embodiment, the current detector 3
12 detects the value of the current supplied to each heating means 31a and detects the burnout of the lamp 311 connected in parallel. However, it is necessary to detect the value of the power supplied to each heating means 31a. It is also possible to detect that the lamp has run out.

In the above embodiment, the two heating means 31a are fed in parallel, but power may be supplied independently to each of the two heating means 31a. In this case, the value of the current or the power supplied to the heating means 31a in a normal state may be stored in advance, and the lamp burnout may be detected from a change in these values. In addition, when the lamp burnout is detected by such a method, the number of lamps 311 provided in each heating means 31a can be different.

Further, in the above embodiment, the supply power is controlled by adjusting the firing phase angle of the pair of thyristors 321 connected in reverse. However, any method of controlling the supply power may be used. For example, a triac equivalent to the pair of thyristors 321 may be used, or an equivalent circuit may be formed using transistors.

The above embodiments can be used for manufacturing various substrates such as a semiconductor substrate for manufacturing a semiconductor device, a glass substrate for manufacturing a flat panel display, and a glass substrate for manufacturing a photomask.

In the above embodiment, the lamp burnout is automatically detected. However, based on the display of the change in the current, the operator judges the lamp burnout or determines whether to stop or continue the process. You may.

[0060]

According to the first to third aspects of the present invention, it is possible to appropriately detect the expiration of the lamp while simplifying wiring for the lamp. As a result, it is possible to reduce the device manufacturing cost and the substrate manufacturing cost, and to improve the reliability of the substrate processing.

According to the second aspect of the present invention, it is possible to automatically detect that the lamp has run out.

Further, according to the third and fourth aspects of the present invention, the occurrence of unnecessary substrates can be minimized even when the lamp burns out. As a result, it is possible to reduce the substrate manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view schematically showing an overall configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of one power supply module in the substrate processing apparatus shown in FIG. 1 and a lamp connected thereto.

FIG. 3 is a flowchart showing a flow of an operation of the substrate processing apparatus shown in FIG. 1;

FIG. 4 is a diagram showing a configuration of one power supply module in a conventional substrate processing apparatus and a lamp connected thereto.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Substrate 10 Overall control part 31a Heating means 32a Power supply part 33 Lamp out detection circuit 311 Lamp 312 Current detector S11-S14, S21-S23, S27, S28 Step

Claims (4)

[Claims] 1. A substrate processing apparatus for performing a process involving heating on a substrate, comprising: a power supply unit for generating power for heating the substrate; and a lamp light receiving the power from the power supply unit. A plurality of heating means for irradiating the plurality of lamps, each of the plurality of heating means, a plurality of lamps supplied in parallel, a detection means for detecting the value of the current or power supplied to the plurality of lamps, A substrate processing apparatus comprising: 2. The substrate processing apparatus according to claim 1, wherein a lamp burnout detecting unit detects a heating unit in which a lamp burnout has occurred based on a current or electric power value detected in each of the plurality of heating units. Substrate processing apparatus, further comprising: 3. The substrate processing apparatus according to claim 2, wherein the processing of the substrate being processed is continued and the processing of the substrate is completed when the lamp-extinguish detecting means detects the lamp-extinguish. The substrate processing apparatus further comprising: operation control means for stopping a processing operation for a next substrate at a time. 4. A substrate processing method for irradiating a substrate with lamp light from a plurality of lamps and performing a process involving heating on the substrate, comprising: (a) receiving the substrate at a predetermined position; Irradiating the substrate with lamp light from the plurality of lamps and performing a process involving heating on the substrate; (c) discharging the substrate from the predetermined position; (d) the step (a) Repeating (c) and sequentially processing a plurality of substrates, wherein the step (b) comprises: (b-1) a step of detecting lamp burnout in the plurality of lamps; 2) a step of stopping the step (d) after the execution of the step (c) when the lamp burnout is detected in the step (b-1).