JP2000215732A - Complex dielectric material and dielectric antenna using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide complex dielectric material and dielectric antenna having high thermal resistance, improved electric characteristic, improved workability, improved formability and small specific gravity. SOLUTION: A dielectric antenna 1 is composed of a rectangular parallelopiped shape antenna substance 2, an input electrode 4, a radiation electrode 5 and a ground electrode 6. Complex dielectric material comprising inorganic filler soluble to at least one of acid and alkali mixed into matrix resin mixed styrene polymer having syndiotactic structure and liquid crystal polyester resin is used for material for the antenna substance 2. The complex dielectric material whose the matrix resin is 35-99 volume%, the inorganic filler is 1-45 volume%, volume ratio of styrene polymer and liquid crystal polyester resin of the matrix resin is 0.25-4.0 is suitable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite dielectric material and a dielectric antenna using the composite dielectric material.

[0002]

2. Description of the Related Art Heretofore, as a surface mount type dielectric antenna used for mobile communication equipment such as a cellular phone and a wireless LAN, an antenna made of a dielectric ceramic alone or a resin alone has been proposed. For example, Japanese Patent Application Laid-Open No. 9-98015 discloses a surface-mounted dielectric antenna in which the antenna base is made of a ceramic or resin alone. Japanese Patent Application Laid-Open No. Hei 9-221573 discloses a molded product having plating properties made of a composite material comprising a styrene-based polymer having a syndiotactic structure, an inorganic filler, a rubber-like elastic material, and a thermoplastic resin. ing. Further, JP-A-9-266663 and JP-A-10-17739 disclose a molded article in which a styrene-based polymer having a syndiotactic structure is mixed with a styrene-based block polymer which is a rubber-like elastic body as a compatibilizer. Is disclosed. Furthermore, Japanese Patent Application Laid-Open No. 10-45936 discloses a method for producing a styrene-based polymer foam having a syndiotactic structure having plating properties.

[0003]

By the way, in recent years, with the reduction in weight and size of mobile communication devices such as mobile phones, there has been an increasing demand for reduction in weight and size of dielectric antennas. However, conventional antennas made of dielectric ceramics alone and antennas made of resin alone include:
Each had the following problems.

That is, in the case of an antenna made of a dielectric ceramic alone, not only does it take time to form and bake the antenna base, but also it is inferior in workability and moldability, making it difficult to produce an antenna having a complicated shape. Met. Also, by increasing the dielectric constant, the antenna can be downsized. However, the antenna has a size effect, and if it is too small, the antenna characteristics are extremely reduced, so there is a limit to the downsizing of the antenna. . Therefore, the specific gravity of the material of the antenna is important for reducing the weight of the antenna.
However, dielectric ceramics have a large specific gravity, and there is a problem that it is not possible to cope with a reduction in the weight of an antenna. On the other hand, an antenna made of a resin alone has a small specific gravity of the resin and is excellent in moldability and workability, but has a problem that it cannot cope with miniaturization of the antenna because of its small relative dielectric constant.

Further, since the circuit board for mounting the dielectric antenna is in a direction corresponding to high-density mounting and the use of lead-free solder is widespread, the number of times of reflow to which the dielectric antenna is exposed is large. The temperature also tends to be higher. Therefore, the need for a dielectric antenna having high heat resistance is increasing.

Accordingly, an object of the present invention is to provide a composite dielectric material having high heat resistance, good electrical characteristics, excellent workability and moldability, low specific gravity, and a dielectric antenna using the composite dielectric material. To provide.

[0007]

In order to achieve the above object, a composite dielectric material according to the present invention comprises a base resin obtained by mixing a styrene polymer having a syndiotactic structure and a liquid crystal polyester resin, or Characterized in that a base resin obtained by mixing a styrene polymer having a syndiotactic structure, a liquid crystal polyester resin, and a rubber-like elastic material is mixed with an inorganic filler that is soluble in at least one of an acid and an alkali. And

Further, the base resin is mixed with the inorganic filler which is soluble in at least one of an acid and an alkali, and is mixed with a ceramic which is insoluble in other acids and alkalis except hydrofluoric acid. It is characterized by.

The base resin is 35 to 99% by volume, the inorganic filler is 1 to 45% by volume, the ceramics is 0 to 35% by volume, and the volume ratio between the styrene polymer and the polyester resin of the base resin is 0.25%. The rubbery elastic body is 0 to 30% by volume with respect to the base resin.

[0010] With the above configuration, the styrenic polymer having a syndiotactic structure has a low tan δ and a small specific gravity, so that the composite dielectric material is lighter in weight than the dielectric material composed of ceramics alone. In addition, this composite dielectric material is more excellent in workability and moldability than a dielectric material composed of a single ceramic. The liquid crystal polyester resin has a large relative dielectric constant, excellent heat resistance, and exhibits high plating adhesion strength when used together with an inorganic filler soluble in acid or alkali.

Further, the rubber-like elastic body gives rubber elasticity to the composite dielectric material to improve the peel strength of the plating film and disperses the internal stress generated in the composite dielectric material. By adopting a material soluble in acid or alkali as the material of the inorganic filler, in the step of forming a plating film on the surface of the molded body of the composite dielectric material, roughening of the surface of the molded body is promoted. Thus, the anchor effect of the plating film is improved.

On the other hand, since ceramics have a large relative dielectric constant, a dielectric antenna using a composite dielectric material composed of a base resin and ceramics is smaller than a dielectric antenna using a dielectric material composed of a single resin. . In addition, by adopting ceramics that are insoluble in other acids and alkalis while leaving hydrofluoric acid, the ceramics do not dissolve even when the composite dielectric material is immersed in an acid or alkali other than hydrofluoric acid. The physical properties of the body material are stabilized.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a composite dielectric material and a dielectric antenna using the same according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 shows one embodiment of the dielectric antenna according to the present invention. The dielectric antenna 1 includes a rectangular parallelepiped antenna base 2, an input electrode 4, a radiation electrode 5, and a ground electrode 6.

The material of the antenna base 2 is as follows:
Different types of composite dielectric materials are used. The first composite dielectric material includes a base resin obtained by mixing a styrene-based polymer having a syndiotactic structure (hereinafter, referred to as SPS) and a liquid crystal polyester resin (hereinafter, referred to as LCP) with at least an acid and an alkali. It is a composite dielectric material obtained by mixing a soluble inorganic filler with any one of them. The second composite dielectric material is a composite dielectric material obtained by mixing a base resin obtained by mixing SPS, LCP, and a rubber-like elastic material with an inorganic filler soluble in at least one of an acid and an alkali. It is. The third composite dielectric material is made of a base resin in which SPS and LCP are mixed, an inorganic filler soluble in at least one of an acid and an alkali, and an insoluble in other acids and alkalis except hydrofluoric acid. It is a composite dielectric material obtained by mixing with various ceramics. The fourth composite dielectric material is composed of a base resin obtained by mixing SPS, LCP, and a rubber-like elastic body, an inorganic filler soluble in at least one of an acid and an alkali, and other components except hydrofluoric acid. This is a composite dielectric material obtained by mixing ceramics insoluble in acids and alkalis. Also,
The term "soluble in at least one of acid and alkali" as used herein means that 10% by volume of a powder having a particle size of 0.1 to 50 μm is added to an acid or alkali at 30 to 40 ° C. and stirred,
It refers to one that completely dissolves visually within 5 minutes.

Here, "acid" and "alkali" refer to an acid or an alkali for roughening the surface of the antenna substrate 2 in the step of forming a plating film on the surface of the antenna substrate 2 as described later. It is. SPS is used because it has excellent solvent resistance and heat resistance while maintaining good dielectric properties at high frequencies possessed by general-purpose atactic polystyrene (general-purpose PS). As those having low tan δ and heat resistance, PTFE-based resins and liquid crystal polymers are also available. However, PTFE resins are inferior to SPS in terms of moldability, cost and plating properties, and liquid crystal polymers have moldability, cost and dielectric properties. Inferior to SPS in point. LCP has a large relative permittivity,
It has excellent heat resistance and exhibits high plating adhesion strength when used together with an inorganic filler that is soluble in acid or alkali.

Ceramics insoluble in acids and alkalis other than hydrofluoric acid are added to increase the dielectric constant of the composite dielectric material. As insoluble ceramics,
CaTiO ₃ with low dielectric loss tangent (tan δ) at high frequency,
Perovskite oxide paraelectric such as SrTiO ₃ , B
Perovskite-based oxide ferroelectrics such as aTiO ₃ and mixtures thereof, and BaO—Nd ₂ O ₃ —TiO ₂ are used. Ceramics that are soluble in acids and alkalis cannot be used because the composite dielectric material is dissolved when the composite dielectric material is immersed in an oxidizing agent and the physical properties of the composite dielectric material vary.

The rubber-like elastic material is added to impart rubber elasticity to the composite dielectric material to improve the peel strength of the plating film and to disperse the internal stress generated in the composite dielectric material. Furthermore, if a rubber-like elastic body soluble in acid is employed, the anchor effect of the plating film can be promoted. As the rubber-like elastic body, a general-purpose diene rubber having a high rubber elasticity, a thermoplastic rubber, or the like is used. In the present embodiment, a thermoplastic rubber which does not need to be crosslinked and pulverized, particularly, a styrene-based block copolymer of styrene-ethylene-butylene-styrene (SEBS) having high heat resistance is employed.

An inorganic filler soluble in at least one of an acid and an alkali is added to improve the peel strength of the plating film and reduce the cost of the composite dielectric material. The use of an inorganic filler that is soluble in acids and alkalis is used to promote the anchor effect of the plating film, and further improves plating adhesion compared to inorganic fillers that are insoluble in acids and alkalis. be able to. The soluble inorganic filler can be selected from the group consisting of oxides, carbonates, sulfates, phosphates and silicates of Group IIa or IIb elements. Since all of these are soluble in acids, they have the effect of improving plating adhesion. Among them, calcium carbonate is suitable in terms of ease of pretreatment of plating film formation and production cost. .

In the composite dielectric material, the base resin is 3
5 to 99% by volume, 1 to 45% by volume of inorganic filler, 0 to 35% by volume of ceramics, volume ratio of SPS to LCP of the base resin is 0.25 to 4.0, rubber-like elastic body is base resin Is set in the range of 0 to 30% by volume.

The input electrode 4 is provided at the front end of the antenna base 2. The radiation electrode 5 is provided at the center of the upper surface of the antenna base 2 and extends linearly in the longitudinal direction of the antenna base 2. The length of the radiation electrode 5 is λ / 4 (λ:
Center wavelength in the antenna base 2). One end 5 a of the radiation electrode 5 faces the input electrode 4 at a predetermined interval 7. The other end 5 b of the radiation electrode 5 is electrically connected to a ground electrode 6 provided on substantially the entire lower surface of the antenna base 2 around the back end surface of the antenna base 2.

The dielectric antenna 1 having the above-described strip line configuration has a small specific gravity of SPS and LCP, so that the weight of the antenna base 2 can be reduced. Further, since LCP is excellent in heat resistance, it can withstand repetition of reflow and high temperature reflow using lead-free solder. Further, since the antenna base 2 is made of a composite dielectric material such as SPS having a low tan δ and a large relative permittivity such as LCP, the dielectric antenna 1 having stable antenna characteristics can be obtained.

Next, as shown in Tables 1 to 6, the composition ratio and composition of the composite dielectric material were variously changed, and the dielectric characteristics, plating peel strength, bending test, and variation in specific gravity were measured. SPS and LC weighed at the volume ratios shown in Tables 1 to 6
After roughly mixing P and the like, composite material pellets were produced using a twin-screw extruder. The cylinder temperature during twin-screw extrusion is 29
It was 0 ° C.

[0024]

[Table 1]

[0025]

[Table 2]

[0026]

[Table 3]

[0027]

[Table 4]

[0028]

[Table 5]

[0029]

[Table 6]

In Examples 1 to 15, 19 to 22 and Comparative Examples 1 to 7, CaTiO ₃ having an average particle diameter of 1.2 μm was used as the ceramic powder. Using SrTiO ₃ having a particle size of 1.3 μm,
In Examples 16 and 17, Ba having an average particle size of 2.0 μm was used.
TiO ₃ was used. Examples 1 to 4 as rubber-like elastic bodies
In the case of 18, 21 to 23 and Comparative Examples 1 to 7, a block copolymer of styrene-ethylene-butylene-styrene (Clayton G1650 manufactured by Shell Japan) was used.
In the case of Example 19, styrene-butadiene rubber (manufactured by Zeon Corporation, 2057S-styrene content: 60%) was used, and in the case of Example 20, maleic acid-modified SEBS (Clayton FG1901X manufactured by Shell Japan) was used. In Examples 1 to 20, 23 and Comparative Examples 1 to 7, CaCO ₃ having an average particle size of 2.6 μm was used as an inorganic filler. In Example 21, pyrocarbon having an average particle size of 0.5 μm was used. Calcium phosphate was used, and in the case of Example 22, barium sulfate having an average particle size of 1 μm was used.

Using the produced composite material pellets, a circular evaluation plate having a diameter of 50 mm and a thickness of 1.3 mm was formed by injection molding. This injection molding method can easily and quickly form a complicated shape such as a dielectric antenna. And during injection molding, SPS or LC
It is only necessary to apply heat to the extent that P is melted, and a temperature of 1000 ° C. or higher is not required as in ceramic firing. A plating film was formed on the surface of the formed evaluation plate by the following steps.

First, the surface of the evaluation plate was etched and roughened. When the volume ratio (SPS / LCP) of SPS and LCP of the base resin of the composite dielectric material was smaller than 1.0 and the amount of the inorganic filler was 20% by volume or more, the alkali etching method was used. Otherwise, a chromic acid etching method was employed.

In the alkaline etching method, the evaluation plate is immersed in a surfactant aqueous solution for 3 minutes, and the surface of the evaluation plate is degreased and washed. Next, the evaluation plate is immersed in a 40% by volume aqueous solution of potassium hydroxide for 5 minutes. Since the alkali-soluble inorganic filler exposed on the surface of the evaluation plate is etched by potassium hydroxide, and the surface of the evaluation plate is roughened,
The anchor effect of the plating film formed on the surface of the evaluation plate increases. Next, the evaluation plate is immersed in a dilute hydrochloric acid solution for 5 minutes to neutralize, and then sufficiently washed with water.

On the other hand, in the chromic acid etching method, the surface of the evaluation plate is degreased and washed by immersing the evaluation plate in a surfactant aqueous solution for 3 minutes. Next, the evaluation plate was added to a mixture of chromic anhydride (400 g / l aqueous solution): sulfuric acid (400 g / l aqueous solution) = 1: 1 as a chromic acid-based oxidizing agent.
Soak for a minute. The acid-soluble rubber-like elastic material and inorganic filler exposed on the surface of the evaluation plate are etched by the oxidizing agent, and the surface of the evaluation plate is roughened. The anchor effect of the membrane increases. Thereafter, the evaluation plate is sufficiently washed with water.

Next, the evaluation plate having a roughened surface is immersed in a cationic surfactant solution for 5 minutes (conditioner step), and then immersed in a hydrochloric acid aqueous solution of palladium chloride / tin chloride for 5 minutes. Palladium was adhered to the surface of the evaluation plate (catalyst step). Next, the evaluation plate was immersed in a hydrochloric acid aqueous solution for 5 minutes (accelerator step). Thereafter, the evaluation plate was immersed in an aqueous copper sulfate solution for 20 minutes to form an electroless copper plating film of 0.05 to 0.1 μm on the surface of the evaluation plate. Further, an electrolytic copper plating film was formed on the electroless copper plating film, and a plating film having a total thickness of 10 to 70 μm was formed.

Table 1 shows the results of measuring the dielectric properties and the peel strength of the plating film for each of the samples thus obtained.
To Table 6 below. For the measurement of the dielectric characteristics, a perturbation method for calculating the relative permittivity and the dielectric loss tangent from the resonance frequency and the no-load Q was used. The peel strength of the plating film is measured by etching the plating film to form a strip pattern having a width of 10 mm and a length of 45 mm, and then applying the strip pattern to the evaluation plate in the strip length direction and the pulling direction. The load when peeling off from the evaluation plate was measured in such a state as to be perpendicular to the above. The vertical peeling speed is 0.9 mm / s.

The bending tests and specific gravities described in Tables 1 to 6 were measured using a dielectric antenna 1 (see FIG. 1) manufactured under the following conditions. After roughly mixing SPS and LCP weighed at the volume ratios shown in Tables 1 to 6, composite pellets were produced using a twin-screw extruder. After the pellets were preliminarily dried at a temperature of 120 ° C. for 3 hours, a rectangular parallelepiped antenna base 2 was formed by an injection molding method. At this time, the molding temperature was set at 290 ° C., the injection speed was set at 50 mm / s, and the holding pressure was set at 500 kg / cm ² .

A plating film is formed on the surface of the formed antenna base 2 in the same step as the plating film forming step described above. However, the thickness of the electroless copper plating is 0.1 mm.
μm, electrolytic copper plating thickness 3-4 μm, electrolytic nickel plating thickness 1-2 μm, electrolytic gold plating thickness 0.1 μm
Are stacked in this order. At this time, when the electrolytic copper plating is formed, a resist is applied on the electrolytic copper plating film using a patterned metal mask, and is etched with ferric chloride to form an input electrode 4, a radiation electrode 5, and a ground electrode. 6 was performed.

The bending test was performed for the manufactured dielectric antenna 1
Is mounted on a 1.6 mm thick circuit board by reflow soldering, and the circuit board is subjected to a three-point bending test (beam 90 mm + push 1 mm). After that, the appearance of the dielectric antenna 1 was observed, and it was determined as ◎ when it was normal, × when the plating film was cracked or swollen, and XX when the plating film was missing. I do. The temperature condition of the reflow soldering is a peak temperature of 235 ° C. and 200 ° C. or higher (for 60 seconds). The temperature condition of the high temperature reflow soldering is that the peak temperature is 27
At 5 ° C., 240 ° C. or higher (60 seconds). The specific gravity was measured by an underwater displacement method. The water temperature was 23 ° C.

As can be seen from Tables 1 to 6, Examples 1 to
In the case of 23 dielectric antennas 1, that is, the base resin is 3
5 to 99% by volume, 1 to 45% by volume of inorganic filler, 0 to 35% by volume of ceramics, volume ratio of SPS to LCP of the base resin is 0.25 to 4.0, rubber-like elastic body is base resin Is in the range of 0 to 30% by volume, the relative dielectric constant ε
_r is in the range of about 3.0 to 20 at 3 GHz,
Has a value exceeding 200 at 3 GHz, the peel strength of the plating film exceeds 0.5 kg / cm, no abnormality is observed in the bending test, the specific gravity is smaller than 2.6, and the specific gravity of the ceramics alone is obtained. (Approximately 3.80).

On the other hand, the high frequency components such as dielectric antennas, one of the surface mount type that is surface mounted to the circuit board is required which has a relative dielectric constant epsilon _r of about 3.0 to 20. If the SPS content is too high, the relative permittivity ε _r
Is smaller than 3.0, and the size of the dielectric antenna cannot be reduced. Further, as shown in Comparative Example 2 of Table 2, when the matrix resin composed of SPS and LCP is less than 35% by volume, the mechanical strength of the composite dielectric material is reduced, and the plating adhesion strength is reduced. Or poor moldability.

Further, as shown in Comparative Example 6 of Table 4, when the volume ratio between SPS and LCP of the base resin is larger than 4.0, the composite dielectric material cannot withstand high-temperature reflow. Occurs. Conversely, SPS and LC of the base resin
As shown in Comparative Example 5 in Table 3, the volume ratio to P was 0.25
If it is smaller, the no-load Q decreases.

Further, since the SPS and LCP of the base resin are not etched by an acid or an alkali, as shown in Comparative Example 1 of Table 1, when a composite dielectric material is manufactured using only SPS and LCP, a sufficient amount is not obtained. Peel strength cannot be obtained. Therefore, it is necessary to add an inorganic filler that can be etched with an acid or an alkali. As shown in Comparative Example 4 in Table 3, when the inorganic filler exceeds 45% by volume, the inorganic filler is excessively etched by an acid or an alkali, and a large number of micropores are formed in the surface layer of the composite dielectric material. appear. As a result, the mechanical strength of the composite dielectric material decreases, and the plating adhesion strength also decreases.

The rubber-like elastic material serves as a compatibilizer between the SPS and the LCP, and makes the sea urchin structure fine and improves the plating adhesion strength. However, as shown in Comparative Example 7 of Table 4, when the rubber-like elastic body exceeds 30% by volume with respect to the base resin, the dielectric properties and heat resistance of the composite dielectric material deteriorate.
That is, even if the peel strength is high, the bending test after reflow fails. Also, as shown in Comparative Example 3 in Table 2, when the insoluble ceramic exceeds 35% by volume, the ceramic cannot be sufficiently applied to the resin in the kneading step, so that the composite dielectric material becomes brittle and the plating adhesion strength increases. Decrease.

The composite dielectric material according to the present invention and the dielectric antenna using the same are not limited to the above-described embodiments, but can be variously modified within the scope of the invention.

[0046]

As is clear from the above description, the composite dielectric material according to the present invention requires a molding temperature of SPS.
Or a temperature at which LCP is thermally melted, and a high temperature such as firing of ceramics is not required. Furthermore, injection molding is possible, it is possible to mold easily and efficiently into a complicated shape, and a plating electrode can be easily formed. It can be easily formed. In addition, since the SPS has excellent high-frequency characteristics, it is possible to obtain a high-frequency component having excellent electrical characteristics with a high relative dielectric constant and a low tan δ even in the gigahertz band. Therefore, SPS and LCP
The composite dielectric material made of the above material has a lighter weight than the dielectric material made of ceramics alone for the same relative dielectric constant.

Further, since LCP is excellent in high heat resistance, reflow is repeated three times or more (usually, chip components are mounted on the front and back surfaces of a circuit board, so reflow is limited to two times. The number of reflows tends to increase due to the re-mounting of chip components and the complicated shape of the circuit board), and high-temperature reflow using lead-free solder can be withstood. Further, since the rubber-like elastic body is added, the internal stress is relieved, and deformation defects during reflow soldering are less likely to occur.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a dielectric antenna according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 dielectric antenna 2 antenna base 4 input electrode 5 radiation electrode 6 ground electrode

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01B 3/44 H01B 3/44 K H01Q 13/26 H01Q 13/26 (72) Inventor Koji Kimura Nagaokakyo, Kyoto Prefecture 2-26-10 Ichi-Tenjin Murata Manufacturing Co., Ltd.F-term (reference) 4J002 BC02W BP013 CF16X CF18X DE067 DE187 DE236 DJ007 DM007 FD016 FD017 GQ00 5G303 AA10 AB05 AB20 BA12 CA01 CA09 CB03 CB06 CB22 CB32 ABA15A08 BA22 BA24 CA02 CA11 CA47 CC02 CD01 CD20 5J045 AA05 AB01 AB06 AB08 DA10 EA07 FA02 HA03 LA01 NA01

Claims (6)

[Claims] An inorganic filler soluble in at least one of an acid and an alkali is mixed with a base resin obtained by mixing a styrenic polymer having a syndiotactic structure and a liquid crystal polyester resin. Composite dielectric material. 2. An inorganic filler soluble in at least one of an acid and an alkali is mixed with a base resin obtained by mixing a styrenic polymer having a syndiotactic structure, a liquid crystal polyester resin, and a rubber-like elastic material. A composite dielectric material characterized in that: 3. An inorganic filler soluble in at least one of an acid and an alkali and a hydrofluoric acid remaining in a base resin obtained by mixing a styrenic polymer having a syndiotactic structure and a liquid crystal polyester resin. A composite dielectric material comprising a mixture of a ceramic which is insoluble in other acids and alkalis. 4. An inorganic filler soluble in at least one of an acid and an alkali in a base resin obtained by mixing a styrenic polymer having a syndiotactic structure, a liquid crystal polyester resin and a rubber-like elastic material, A composite dielectric material comprising a mixture of ceramics insoluble in other acids and alkalis except hydrofluoric acid. 5. The base resin is 35 to 99% by volume, the inorganic filler is 1 to 45% by volume, the ceramics is 0 to 35% by volume, and the styrenic polymer of the base resin is The volume ratio with the liquid crystal polyester resin is 0.
The composite dielectric material according to any one of claims 1 to 4, wherein the rubber-like elastic body is 0 to 30% by volume with respect to the base resin. 6. An antenna base comprising at least one of the composite dielectric materials according to claim 1; and a radiation electrode and a ground electrode provided on a surface of the antenna base. Dielectric antenna.