JP2000212736A - Heat transfer mechanism under vacuum, and vacuum treatment device provided with the heat transfer mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat transfer mechanism under vacuum, which is capable of sufficiently ensuring the heat transfer between a rotating body to be rotated under vacuum and a fixed part opposite to the rotating body, and a vacuum treatment device provided with the heat transfer mechanism. SOLUTION: A heat transfer mechanism transfer the heat between a rotating body 5 and a fixed part 10 under vacuum. A plurality of first concentric cylindrical members 8 around the axis O1 of rotation of the rotating body 5 are protruded from the rotating body 5. A plurality of second concentric cylindrical members 9 around the axis O1 of rotation of the rotating body 5 are protruded from the fixed part 10 so as to be inserted in annular gaps between the first concentric cylindrical members 8. The first concentric cylindrical members 8 and the second concentric cylindrical members 9 are combined with and opposite to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat transfer mechanism between a rotating body and a fixed portion under a vacuum and a vacuum processing apparatus provided with the heat transfer mechanism, and is particularly suitable for cooling a rotating substrate holder. The present invention relates to a heat transfer mechanism and a vacuum processing apparatus provided with the heat transfer mechanism.

[0002]

2. Description of the Related Art One of apparatuses for forming a film on a polycarbonate substrate such as a DVD-RAM is a sputtering apparatus, which holds the substrate as a mechanism for improving the film thickness distribution and increasing the film deposition efficiency. There is a type that rotates the holder. There is also a type in which a plurality of rotating holders are provided in one processing chamber to process a plurality of substrates simultaneously.

[0003] Here, it is necessary to suppress the temperature rise of the polycarbonate substrate during the film forming process. In particular, when forming a plurality of films, it is necessary to sufficiently cool the polycarbonate substrate.

In a conventional sputtering apparatus, for example,
A rotary coupler was provided on the atmosphere side, and a cooling medium was circulated through a double-shaft rotating shaft to cool the system. In the case of this method, since the rotating shaft penetrates the vacuum wall, a complicated cooling mechanism combined with a rotation introducing mechanism using an O-ring seal or a magnetic shaft seal is used.

When such a complicated cooling mechanism is used,
Problems arise such as an increase in manufacturing cost and a decrease in reliability. Of course, if the rotation of the substrate is not given, the cooling mechanism becomes relatively simple.However, in this case, there is a trade-off between ensuring uniformity of the film thickness distribution and improving the adhesion efficiency of the sputtered film, and is required in recent years. It is difficult to correspond to an apparatus having a high film forming efficiency corresponding to a thickness distribution of about ± 1%.

On the other hand, there has been proposed a configuration in which a motor for rotating a substrate is arranged in a vacuum. When the motor is placed in a vacuum, there is an advantage that the load on the shaft seal is eliminated and the polycarbonate substrate itself is light, so that the motor load is only the resistance of the bearing, and the motor can be rotated with small electric power.

[0007]

However, since a mechanism for circulating a cooling medium through a rotating object (substrate holder) in a vacuum becomes complicated, heat is efficiently transmitted from a rotating body to a fixed portion (non-rotating portion). If the mechanism can be simplified, the cost of the apparatus can be reduced and the reliability can be improved. If a motor is placed in a vacuum and heat transfer between the rotating substrate holder and the fixed part can be ensured while maintaining a light rotational load, it is possible to rotate and cool a plurality of substrates.

Accordingly, an object of the present invention is to provide a heat transfer mechanism in a vacuum and a heat transfer mechanism capable of sufficiently securing heat transfer between a rotating body rotating in a vacuum and a fixed portion facing the rotating body. An object of the present invention is to provide a vacuum processing apparatus having a mechanism.

[0009]

In order to solve the above-mentioned problems, the present invention relates to a heat transfer mechanism for transferring heat between a rotating body and a fixed portion under a vacuum, wherein the rotating shaft of the rotating body is provided. A plurality of first concentric cylindrical members centered on the center are protruded from the rotating body, and the rotation axis of the rotating body is centered so as to be inserted into an annular gap between the first concentric cylindrical members. A plurality of second concentric cylinder members projecting from the fixing portion, and the plurality of first concentric cylinder members and the plurality of second concentric cylinder members are inserted into each other and opposed to each other. I do. In addition, it is desirable to provide unevenness on the surface of the concentric cylindrical member to increase the surface area.

Preferably, the surface of the concentric cylindrical member is blackened.

Further, it is preferable that the temperature of the fixing portion is controlled by a Peltier element.

According to the present invention, there is provided a vacuum processing apparatus provided with the above-described heat transfer mechanism in a vacuum, wherein the rotating body is a substrate holder for holding a substrate to be processed, and a back surface of the substrate holder is opposed to the substrate holder. The heat transfer mechanism is provided between the heat transfer mechanism and a fixing part.

[0013] Further, there is provided a revolving body which rotatably supports the substrate holder and functions as a fixing portion with respect to the substrate holder, wherein a rotating shaft of the substrate holder is provided between the substrate holder and the revolving body. It is preferable that the heat transfer mechanism be provided around a core, and the heat transfer mechanism be provided between the revolving body and a fixing portion for the revolving body around a rotation axis of the revolving body.

It is desirable that a plurality of the substrate holders are provided.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment Hereinafter, a heat transfer mechanism in a vacuum and a vacuum processing apparatus having the heat transfer mechanism according to a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a main part of a sputtering apparatus which is a vacuum processing apparatus according to the present embodiment. As shown in FIG. 1, the sputtering apparatus includes a sputtering chamber (processing chamber) 1 capable of evacuating and a transfer chamber 2 capable of evacuating the same. Further, between the transfer chamber 2 and the sputtering chamber 1 A movable valve plate 3 capable of closing the formed opening is provided.

The movable valve plate 3 is provided with a plurality of rotation holding devices 4 for rotating and holding the substrate S. Each rotation holding device 4 includes a substrate holder (rotating body) 5 for holding the substrate S, Motor 6 for rotating the substrate holder 5
And

A target 7 is disposed on the side facing the substrate S, and particles sputtered from the target 7 adhere to the surface of the substrate S to form a film.

When transporting the substrate S, the movable valve plate 3
Is separated from the sputtering chamber 1 toward the transfer chamber 2, and the substrate S is transferred in the transfer chamber 2 together with the movable valve plate 3.

Further, in the sputtering apparatus according to the present embodiment, the plurality of first concentric cylindrical fins (concentric cylindrical members) 8 centered on the rotation axis (rotation axis) O1 of the substrate holder 5 are formed on the back surface of the substrate holder 5. It is projected. Also, a plurality of second concentric cylindrical fins (concentric cylindrical members) 9 centered on the rotation axis O1 of the substrate holder 5 are fixed so that they can be inserted into the annular gap between the first concentric cylindrical fins 8. 10 protrudes. The plurality of first concentric cylindrical fins 8 and the plurality of second concentric cylindrical fins 9 are inserted into each other so as to face each other.

Next, the heat transfer mechanism between the rotating substrate holder (rotating body) 5 and the fixed part 10 in a vacuum will be considered. When the polycarbonate substrate S held by the rotating substrate holder 5 is formed into a film, the temperature of the substrate S increases due to the heat of condensation of the film.

The substrate S is mounted on the rotating substrate holder 5, and the heat of the substrate S is transmitted to the substrate holder 5 by radiation. The heat transmitted to the substrate holder 5 is transmitted to the fixing portion 10 facing the rear surface of the substrate holder 5 by radiation from the rotation axis and the rear surface of the substrate holder 5.

Here, assuming that the substrate holder 5 and the fixing portion 10 are sufficiently close to each other with the same area, the substrate S
The incoming heat flow is released to the fixing portion 10 via the substrate holder 5. Therefore, as shown in FIG. 2, considering the heat flow Q in a unit area, the temperature of the substrate S is T3, the temperature of the substrate holder 5 is T2, and the temperature of the fixing portion 10 is T1.
If the emissivity is simply set to 1, the equilibrium temperature is given by the following equation. ^{Q = K (T3 4 -T2 4} ) = K (T2 4 -T1 4) K = A * e * σ A: area [cm ^2], e: emissivity, σ: 5.7e-12
[W / cm ² K ⁴ ] FIG. 3 shows the relationship between temperature and radiant energy per unit area, where emissivity is 1. As can be seen from FIG. 3, T1 is 25 ° C., and the heat flow rate is 0.05 [W / cm ² ].
Then, T2 is equilibrated at 86 ° C. and T3 is equilibrated at 126 ° C.

FIG. 4 shows the relationship between the temperature and the radiant energy per unit area as in FIG. 3, and the first and second concentric portions are provided between the substrate holder (rotating portion) 5 and the fixed portion 10. The case where cylindrical fins 8 and 9 are provided to make the facing area 10 times larger is shown.

As can be seen from FIG. 4, since the heat flow per unit area from the substrate holder 5 to the fixing part 10 is 1/10 of 0.005 [W / cm ² ], T2 is 33 ° C.
T3 becomes 91 ° C., and the temperature of the substrate S can be lowered.

Since the temperature of the rotating substrate holder 5 can be lowered, the substrate temperature can be lowered accordingly. FIG. 5 shows the equilibrium temperature when the temperature of the fixing unit 10 is 25 ° C. and the heat flow rate is changed. T2, T3
Indicates the case where the opposing area is 1, and T2L and T3L indicate the cases where the opposing area between the substrate holder 5 and the fixing portion 10 is increased ten times.

As can be seen from FIG. 5, the effect is obtained not only when the temperature is high, but also when the temperature is near the heat-resistant temperature (135 ° C.) of a plastic such as a polycarbonate substrate.

In the sputtering apparatus according to the present embodiment, the temperature of the fixed part 10 is maintained at 25 ° C.
The substrate holder 5 is maintained at a low temperature by the heat transfer mechanism of the concentric cylinder.

Since the substrate holder 5 is rotated by the motor 6 arranged in a vacuum, a plurality of substrate holders 5 can be easily provided.

As described above, according to the heat transfer mechanism in a vacuum according to the present embodiment and the sputtering apparatus having the heat transfer mechanism, the first concentric cylindrical fin 8 is provided on the substrate holder 5 and Since the second concentric cylindrical fins 9 are provided and the two concentric cylindrical fins are inserted into each other and opposed to each other, the facing area contributing to heat transfer by radiation increases, and the cooling efficiency of the substrate holder 5 can be improved. it can. Since the cooling efficiency of the substrate holder 5 can be improved by such a simple mechanism, the manufacturing cost of the apparatus can be reduced, and the design when arranging the plurality of substrate holders 5 becomes easy.

According to the sputtering apparatus of the present embodiment, the uniformity of the film thickness distribution is improved by the rotation of the substrate holder 5, the throughput is improved by simultaneous processing of a plurality of substrates, and a highly reliable apparatus can be manufactured at low cost. Can be manufactured.

Second Embodiment Next, a heat transfer mechanism in a vacuum according to a second embodiment of the present invention and a sputtering apparatus which is a vacuum processing apparatus provided with the heat transfer mechanism will be described with reference to FIG.

The sputtering apparatus according to the present embodiment
The configuration is partially added to the first embodiment shown in FIG. 1. Specifically, the temperature of the fixing unit 10 is controlled by a Peltier element 11.

The movable valve plate 3 is cooled at 25 ° C. by water cooling.
On the other hand, the temperature of the fixed part 10 is maintained at about 10 ° C. by the Peltier (electronic cooling) element 11.

FIG. 7 shows that the fixing part 10 is formed by a Peltier element.
It shows the case where the temperature is lowered to ° C. From FIG. 7, it can be seen that the cooling of the fixing unit 10 is effective in lowering the substrate temperature.

As described above, according to the sputtering apparatus of the present embodiment, the fixing portion 10 is
Is controlled, the temperature control range of the substrate holder 5 can be expanded.

Third Embodiment Next, a heat transfer mechanism in a vacuum according to a third embodiment of the present invention and a sputtering apparatus which is a vacuum processing apparatus provided with the heat transfer mechanism will be described with reference to FIG.

The sputtering apparatus according to the present embodiment
As shown in FIG. 8, there is provided a revolving plate (revolving body) 12 rotatably mounted on the water-cooled movable valve plate 3, and a plurality of substrate holders 5 are rotatably mounted on the revolving plate 12. Have been.

When the revolving plate 12 is rotated about the revolving axis O2 by the motor 13, the plurality of substrate holders 5 are simultaneously rotated about the revolving axis O1 via the gear mechanism 15 including the planetary gears 14. It is configured.

As described above, by causing the substrate holder 5 to revolve at the same time as the rotation, the variation in film formation between the substrates can be reduced.

Further, in the sputtering apparatus according to the present embodiment, the plurality of first concentric cylindrical fins 8 centered on the rotation axis O1 of the substrate holder 5 are provided.
And a plurality of second concentric cylindrical fins 9 centered on the rotation axis O1 of the substrate holder 5 so as to be inserted into the annular gap between the first concentric cylindrical fins 8.
Are protruded from the surface of the revolving plate 12.

A plurality of third concentric cylindrical fins (concentric cylindrical members) 16 centered on the revolving axis O 2 of the revolving plate 12.
Are provided on the back surface of the revolving plate 12. Further, a plurality of fourth concentric cylinder fins 16 having a plurality of fourth fins 16 centered on the revolving axis O2 of the revolving plate 12 can be inserted into the annular gap between the concentric cylindrical fins 16.
A concentric cylindrical fin (concentric cylindrical member) 17 protrudes from the surface of the movable valve plate 3.

In the sputtering apparatus of this embodiment having the above configuration, the heat of the substrate holder 5 is transmitted to the revolving plate 12 via the first and second concentric cylindrical fins 8 and 9, 4 concentric cylindrical fins 16, 1
The heat of the revolution plate 12 is transmitted to the movable valve plate 3 via 7.

Since the cooling mechanism has a simple structure, a highly reliable sputtering apparatus having the substrate holder 5 capable of rotating and revolving simultaneously can be manufactured at low cost.

Fourth Embodiment Next, a heat transfer mechanism in a vacuum according to a fourth embodiment of the present invention and a sputtering apparatus which is a vacuum processing apparatus provided with the heat transfer mechanism will be described.

In this embodiment, a part of the configuration is added to the above-described first to third embodiments. Specifically, concavities and convexities are provided on the surface of the concentric cylindrical fin to contribute to radiation. The surface area was increased and the surface of the concentric cylindrical fin was blackened so that the emissivity was close to 1.

As described above, in the present embodiment, the emissivity is improved, so that the cooling efficiency of the substrate holder 5 can be improved.

[0048]

As described above, according to the present invention, the first concentric cylindrical member is protruded on the rotating body side and the second concentric cylindrical member is protruded on the fixed portion side, so that the two concentric cylindrical members are connected to each other. Are inserted into each other so as to oppose each other, the opposing area contributing to heat transfer by radiation increases, and the cooling efficiency of the rotating body can be improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a main part of a sputtering apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining heat transfer by radiation between a substrate, a substrate holder, and a cooling surface.

FIG. 3 is a graph showing the relationship between temperature and radiant energy per unit area in the conventional example, where the emissivity is 1;

FIG. 4 is a graph showing the relationship between temperature and radiant energy per unit area in the first embodiment of the present invention, where the emissivity is 1;

FIG. 5 is a graph showing the equilibrium temperature when the heat flow rate is changed with the temperature of the fixed portion set to 25 ° C.

FIG. 6 is a longitudinal sectional view showing a main part of a sputtering apparatus according to a second embodiment of the present invention.

FIG. 7 is a graph showing the equilibrium temperature when the heat flow rate is changed with the temperature of the fixed part set to 10 ° C.

FIG. 8 is a longitudinal sectional view showing a main part of a sputtering apparatus according to a third embodiment of the present invention.

[Description of Signs] 1 sputtering chamber (processing chamber) 2 transfer chamber 3 movable valve plate 4 rotation holding device 5 substrate holder (rotary body) 6, 13 motor 7 target 8 first concentric cylindrical fin 9 second concentric cylindrical fin DESCRIPTION OF SYMBOLS 10 Fixed part 11 Peltier element 12 Revolution plate 14 Planetary gear 15 Gear mechanism 16 Third concentric cylindrical fin 17 Fourth concentric cylindrical fin S Substrate O1 Rotation axis of substrate holder (rotation axis) O2 Rotation axis of revolution plate (Revolution axis)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kimio Kogure 1000-1, Kasamacho, Sakae-ku, Yokohama-shi, Kanagawa Prefecture Inside Shibaura Mechatronics Co., Ltd. (72) Inventor Yoshiaki Inao 1000, Kasamacho, Sakae-ku, Yokohama-shi, Kanagawa 1 Shibaura Mechatronics Co., Ltd. (72) Inventor Akihiko Ito 1000 Kasama-cho, Sakae-ku, Yokohama, Kanagawa Prefecture 1 Shibaura Mechatronics Co., Ltd. (72) Inventor Yoshio Kawamata 1000 Kasama-cho, Sakae-ku, Yokohama, Kanagawa 1 Shibaura Mechatronics Co., Ltd. (72) Inventor Yuji Aoyama 1000-1 Kasama-cho, Sakae-ku, Yokohama City, Kanagawa Prefecture 1 Shibaura Mechatronics Co., Ltd. F term (reference) 4K029 AA11 CA05 EA08 JA03 KA01 KA09

Claims (7)

[Claims] 1. A heat transfer mechanism for transferring heat between a rotating body and a fixed part under a vacuum, wherein a plurality of first concentric cylindrical members centered on a rotation axis of the rotating body are rotated. A plurality of second concentric cylindrical members centering on the rotation axis of the rotating body are protruded from the fixed portion so as to protrude from the body and be inserted into an annular gap between the first concentric cylindrical members. Set up
A heat transfer mechanism in a vacuum, wherein a plurality of the first concentric cylindrical members and a plurality of the second concentric cylindrical members are inserted into each other and opposed to each other. 2. The heat transfer mechanism in a vacuum according to claim 1, wherein the surface of the concentric cylindrical member is provided with irregularities to increase the surface area. 3. The heat transfer mechanism in vacuum according to claim 1, wherein the surface of the concentric cylindrical member is blackened. 4. The heat transfer mechanism in a vacuum according to claim 1, wherein the temperature of the fixed portion is controlled by a Peltier device. 5. A vacuum processing apparatus provided with a heat transfer mechanism in a vacuum according to claim 1, wherein the rotating body is a substrate holder for holding a substrate to be processed. A vacuum processing apparatus, wherein the heat transfer mechanism is provided between a back surface of the substrate holder and a fixing portion facing the back surface. 6. A revolving body that rotatably supports the substrate holder and functions as a fixing portion with respect to the substrate holder, wherein a rotation axis of the substrate holder is provided between the substrate holder and the revolving body. The heat transfer mechanism is provided around a core, and the heat transfer mechanism is provided between the revolving body and a fixing portion for the revolving body about a rotation axis of the revolving body. 6. The vacuum processing apparatus according to 5. 7. The vacuum processing apparatus according to claim 5, wherein a plurality of said substrate holders are provided.