JP2000212520A - Tacky tape - Google Patents
Tacky tapeInfo
- Publication number
- JP2000212520A JP2000212520A JP11014283A JP1428399A JP2000212520A JP 2000212520 A JP2000212520 A JP 2000212520A JP 11014283 A JP11014283 A JP 11014283A JP 1428399 A JP1428399 A JP 1428399A JP 2000212520 A JP2000212520 A JP 2000212520A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vinyl acetate
- pressure
- sensitive adhesive
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フイルム状の基材
の一面に粘着剤層を設けた粘着テープに関し、特に、金
属缶等の蓋を有する容器の受け部と蓋の継ぎ目をシール
する際に用いられる粘着テープに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape provided with an adhesive layer on one surface of a film-like base material, and more particularly to a method for sealing a joint between a receiving portion of a container having a lid such as a metal can and a lid. The present invention relates to an adhesive tape used for:
【０００２】[0002]
【従来の技術】従来、金属製箱のような容器の蓋と受け
部をシールするために粘着テープが一般的に用いられて
いる。該粘着テープとしては、軟質塩化ビニルフイルム
からなる基材の片面にゴム系の粘着剤層を設けたものが
多用されている。軟質塩化ビニルフイルムは、引張変形
時に降伏点を持たないため、前記シールの際に加えられ
る引張力によりネッキングが生じ難く、また均一に伸び
るため好適に用いられている。2. Description of the Related Art Conventionally, an adhesive tape is generally used to seal a lid and a receiving portion of a container such as a metal box. As the pressure-sensitive adhesive tape, a tape in which a rubber-based pressure-sensitive adhesive layer is provided on one surface of a substrate made of a soft vinyl chloride film is often used. A soft vinyl chloride film does not have a yield point during tensile deformation, so that it is difficult to cause necking due to a tensile force applied at the time of sealing, and is also preferably used because it stretches uniformly.
【０００３】他方、近年、塩化ビニルフイルムについて
は、最終的な回収の問題、あるいは焼却に際し環境に悪
影響を与えるという問題等が存在するため、軟質塩化ビ
ニルフイルムに代えて他のポリオレフイン系の材料への
転換が求められている。On the other hand, in recent years, with respect to vinyl chloride film, since there is a problem of ultimate recovery or a problem of adversely affecting the environment upon incineration, other polyolefin-based materials have been used in place of soft vinyl chloride film. Conversion is required.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、現在の
ポリオレフイン系の粘着テープは、金属缶等の容器の蓋
をシールするという用途用には設計されておらず、巻き
付け作業で基材の硬さが適度でなく、十分な伸びがない
ためシール性も良くないという欠点があった。欲しい硬
さは引張弾性率（ＪＩＳ Ｋ ６７３２）で１０〜５０
Ｎ／ｍｍ2であり、欲しい伸び（ＪＩＳ Ｋ ６７３
２）は１００〜５００％である。However, the current polyolefin adhesive tape is not designed for use in sealing the lid of a container such as a metal can, and the hardness of the base material during the winding operation is reduced. There was a drawback that the sealing property was not good because it was not moderate and did not have sufficient elongation. The desired hardness is 10 to 50 in tensile modulus (JIS K 6732).
N / mm 2 and the desired elongation (JIS K 673
2) is 100 to 500%.
【０００５】本発明の目的は、軟質塩化ビニル以外の素
材で金属缶等の蓋を有する容器の受け部と蓋の継ぎ目を
シールする際に用いられる粘着テープであって、適度な
硬さと十分な伸びを有しすることにより容器の受け部と
蓋の継ぎ目を確実にシールできる粘着テープを提供する
ことである。An object of the present invention is to provide an adhesive tape used for sealing a joint between a receiving portion of a container having a lid such as a metal can or the like and a lid made of a material other than soft vinyl chloride. An object of the present invention is to provide an adhesive tape capable of securely sealing a joint between a receiving portion of a container and a lid by having elongation.
【０００６】[0006]
【課題を解決するための手段】本発明にかかる粘着テー
プは、フイルム状の基材と、該基材の片面に粘着剤層を
積層した粘着テープにおいて、前記基材がエチレン−酢
酸ビニル共重合体で形成され、該エチレン−酢酸ビニル
共重合体における酢酸ビニルの含有率が１〜１０重量％
であることを特徴とし、これにより該基材の引張弾性率
（ＪＩＳ Ｋ６７３２）を１０〜５０Ｎ／ｍｍ2、伸び
（ＪＩＳ Ｋ ６７３２）を１００〜５００％にするこ
とができる。The pressure-sensitive adhesive tape according to the present invention is a pressure-sensitive adhesive tape having a film-shaped substrate and a pressure-sensitive adhesive layer laminated on one surface of the substrate, wherein the substrate is an ethylene-vinyl acetate copolymer. And the content of vinyl acetate in the ethylene-vinyl acetate copolymer is 1 to 10% by weight.
The tensile elastic modulus (JIS K6732) of the substrate can be 10 to 50 N / mm 2 , and the elongation (JIS K 6732) can be 100 to 500%.
【０００７】[0007]
【発明の実施の形態】上記酢酸ビニルの含有率は、あま
りに少ないと容器への巻付作業の際にテープが十分に伸
びないだけでなく硬くてうまくシールできず、あまりに
多いと巻き付け作業の際テープが伸びすぎるのと軟らか
くなりすぎるので作業が困難になるため、１重量％〜１
０重量％が良い。DESCRIPTION OF THE PREFERRED EMBODIMENTS If the content of vinyl acetate is too small, not only does the tape not stretch sufficiently at the time of wrapping around a container, but it is too hard to seal well. Since the work is difficult because the tape is too stretched and too soft, the weight is 1% by weight to 1%.
0% by weight is good.
【０００８】本発明にかかる粘着テープでは、上記基材
の片面に粘着剤層が積層されている。粘着剤層を構成す
るための粘着剤としては、一般的に用いられている粘着
剤を適宜使用することができ、例えばゴム系粘着剤、ア
クリル系粘着剤等がある。[0008] In the pressure-sensitive adhesive tape according to the present invention, a pressure-sensitive adhesive layer is laminated on one surface of the base material. As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, a generally used pressure-sensitive adhesive can be appropriately used, and examples thereof include a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive.
【０００９】該粘着剤の上記基材への塗工は、粘着剤溶
液を基材の片面に塗布し、乾燥する方法が一般的であ
る。フイルム基材の厚さは８０μｍ、粘着剤層の厚みは
５〜３０μｍが適当である。The application of the pressure-sensitive adhesive to the substrate is generally carried out by applying a pressure-sensitive adhesive solution to one side of the substrate and drying. The thickness of the film substrate is suitably 80 μm, and the thickness of the pressure-sensitive adhesive layer is suitably 5 to 30 μm.
【００１０】本発明にかかる粘着テープでは、酢酸ビニ
ルの含有率１〜１０重量％のエチレン−酢酸ビニル共重
合体で形成されたフイルム状の基材を採用し、これによ
り該基材の引張弾性率（ＪＩＳ Ｋ ６７３２）を１０
〜５０Ｎ／ｍｍ2、伸び（ＪＩＳ Ｋ ６７３２）を１
００〜５００％にすることができ、金属缶等の蓋を有す
る容器の受け部と蓋の継ぎ目をシールする際に適度な硬
さと適度な伸びがあるため、この用途に向いた粘着テー
プが得られる。In the pressure-sensitive adhesive tape according to the present invention, a film-like substrate formed of an ethylene-vinyl acetate copolymer having a vinyl acetate content of 1 to 10% by weight is employed, whereby the tensile elasticity of the substrate is improved. Rate (JIS K 6732) is 10
５０50 N / mm 2 , elongation (JIS K 6732) is 1
Since it has a moderate hardness and a moderate elongation when sealing the joint between the lid and the lid of a container having a lid such as a metal can, an adhesive tape suitable for this application is obtained. Can be
【００１１】[0011]
【実施例】以下、表１を用いて実施例を比較例と対比し
つつ説明することにより、本発明をより詳細に説明す
る。表１における酢酸ビニル含有率は粘着テープのフイ
ルム状基材として採用されたエチレン酢酸ビニル共重合
体内での含有率（重量％）であり、特性値における引張
弾性率（Ｎ／ｍｍ2）は採用したフイルム状の基材の引
張弾性力（ＪＩＳ Ｋ ６７３２）であり、伸び（％）
は採用したフイルム状の基材の伸び（ＪＩＳ Ｋ ６７
３２）である。Hereinafter, the present invention will be described in more detail by describing Examples with reference to Table 1 in comparison with Comparative Examples. The vinyl acetate content in Table 1 is the content (% by weight) in the ethylene-vinyl acetate copolymer used as the film-shaped substrate of the adhesive tape, and the tensile modulus (N / mm 2 ) in the characteristic value is used. Is the tensile elasticity (JIS K 6732) of the film-shaped base material and the elongation (%)
Is the elongation of the film-shaped substrate used (JIS K67
32).
【００１２】[0012]
【表１】 [Table 1]
【００１３】実施例１にかかる粘着テープは、基材とし
てポリエチレン９９重量％、酢酸ビニル１重量％エチレ
ン酢酸ビニル共重合体をインフレーション法により厚み
８０μｍのフイルム状のものを採用した。該フイルムの
引張弾性率は５０Ｎ／ｍｍ2であり、伸びは１００％で
あった。該基材の片面にコロナ放電処理を施し、処理さ
れた面にゴム系粘着剤を固形分で１５μｍになるように
塗布し、１００℃で５分間乾燥し粘着テープを得た。こ
の粘着テープを封缶機（筒状の金属缶をシールする機
械）で試験したところ、弾性力と伸びが適度な値である
ため、巻付作業は良好であり、蓋と受け部との継ぎ目へ
のテープ密着度も良好であった。The pressure-sensitive adhesive tape according to Example 1 was a film-like material having a thickness of 80 μm and a base material of 99% by weight of polyethylene and 1% by weight of vinyl acetate ethylene-vinyl acetate copolymer as a base material by an inflation method. The tensile modulus of the film was 50 N / mm 2 and the elongation was 100%. One surface of the substrate was subjected to corona discharge treatment, and a rubber-based pressure-sensitive adhesive was applied to the treated surface so as to have a solid content of 15 μm, and dried at 100 ° C. for 5 minutes to obtain a pressure-sensitive adhesive tape. When this adhesive tape was tested with a sealing machine (a machine for sealing a cylindrical metal can), the elasticity and elongation were moderate, so that the winding operation was good and the seam between the lid and the receiving part was good. The degree of tape adhesion to the tape was also good.
【００１４】実施例２、実施例３にかかる粘着テープ
は、実施例１の酢酸ビニル含有率を５重量％、１０重量
％にした以外、同様に製作したものである。共粘着テー
プにあっても、上記封缶機で試験したところ、巻付作業
は良好であり、上記テープ密着度も良好であった。The pressure-sensitive adhesive tapes of Examples 2 and 3 were produced in the same manner as in Example 1, except that the vinyl acetate content was changed to 5% by weight and 10% by weight. When the co-adhesive tape was tested with the above-mentioned canning machine, the winding operation was good and the tape adhesion was also good.
【００１５】比較例１、比較例２にかかる粘着テープ
は、実施例１の酢酸ビニル含有率を０．１重量％、１５
重量％にした以外、同様に製作したものである。比較例
１の粘着テープでは硬すぎるため蓋と受け部の継ぎ目を
十分にシールできなかった。また、比較例２の粘着テー
プでは軟らかすぎるため、巻き付け作業時にテープが伸
び過ぎてうまくいかなかった。The pressure-sensitive adhesive tapes of Comparative Example 1 and Comparative Example 2 had the vinyl acetate content of Example 1 of 0.1% by weight,
It was produced in the same manner except that the weight% was used. The adhesive tape of Comparative Example 1 was too hard to seal the joint between the lid and the receiving portion sufficiently. In addition, since the pressure-sensitive adhesive tape of Comparative Example 2 was too soft, the tape was too stretched during the winding operation, which did not work.
【００１６】[0016]
【発明の効果】本発明にかかる粘着テープにあっては、
酢酸ビニルの含有率１〜１０重量％のエチレン−酢酸ビ
ニル共重合体で形成されたフイルム状の基材を採用し、
これにより該基材の引張弾性率（ＪＩＳ Ｋ ６７３
２）を１０〜５０Ｎ／ｍｍ2、伸び（ＪＩＳ Ｋ ６７
３２）を１００〜５００％にすることができ、金属缶等
の蓋を有する容器の受け部と蓋の継ぎ目をシールする際
に適度な硬さと適度な伸びがあるため、この用途に向い
た粘着テープが得られる。しかも、本発明にかかる粘着
テープは、エチレンと酢酸ビニルを主成分としているた
め、ポリ塩化ビニル製粘着テープのような回収の問題及
び焼却に際しての環境汚染の問題も生じ難い。According to the pressure-sensitive adhesive tape of the present invention,
Adopting a film-like substrate formed of an ethylene-vinyl acetate copolymer having a vinyl acetate content of 1 to 10% by weight,
Thereby, the tensile modulus of the substrate (JIS K 673)
2) 10 to 50 N / mm 2 , elongation (JIS K67)
32) can be adjusted to 100 to 500%, and has an appropriate hardness and an appropriate elongation when sealing the joint between the lid and a container having a lid such as a metal can. A tape is obtained. Moreover, since the pressure-sensitive adhesive tape according to the present invention contains ethylene and vinyl acetate as main components, it is unlikely to cause a problem of recovery and a problem of environmental pollution at the time of incineration as in the case of a pressure-sensitive adhesive tape made of polyvinyl chloride.
Claims (1)
着剤層を積層した粘着テープにおいて、前記基材がエチ
レン−酢酸ビニル共重合体で形成され、該エチレン−酢
酸ビニル共重合体における酢酸ビニルの含有率が１〜１
０重量％であることを特徴とする粘着テープ。1. An adhesive tape comprising a film-shaped substrate and an adhesive layer laminated on one surface of the substrate, wherein the substrate is formed of an ethylene-vinyl acetate copolymer, The content of vinyl acetate in the coalescence is 1 to 1
0% by weight of the adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11014283A JP2000212520A (en) | 1999-01-22 | 1999-01-22 | Tacky tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11014283A JP2000212520A (en) | 1999-01-22 | 1999-01-22 | Tacky tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000212520A true JP2000212520A (en) | 2000-08-02 |
Family
ID=11856776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11014283A Pending JP2000212520A (en) | 1999-01-22 | 1999-01-22 | Tacky tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000212520A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010140569A1 (en) * | 2009-06-05 | 2010-12-09 | 電気化学工業株式会社 | Adhesive sheet and method for grinding back surface of semiconductor wafer |
-
1999
- 1999-01-22 JP JP11014283A patent/JP2000212520A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010140569A1 (en) * | 2009-06-05 | 2010-12-09 | 電気化学工業株式会社 | Adhesive sheet and method for grinding back surface of semiconductor wafer |
| KR101333626B1 (en) * | 2009-06-05 | 2013-11-27 | 덴키 가가쿠 고교 가부시기가이샤 | Adhesive sheet and method for grinding back surface of semiconductor wafer |
| JP5622727B2 (en) * | 2009-06-05 | 2014-11-12 | 電気化学工業株式会社 | Adhesive sheet and method for grinding back surface of semiconductor wafer |
| US9267059B2 (en) | 2009-06-05 | 2016-02-23 | Denka Company Limited | Adhesive sheet and method of backgrinding semiconductor wafer |
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