JP2000208943A - Multilayer wiring board with built-in passive component and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a multilayer wiring board with built-in passive component and a method for manufacturing it, wherein the board can be manufactured by unifying and backing simultaneously the passive component and the multilayer wiring board and the passive component has desired characteristics. SOLUTION: In this multilayer wiring board with a built-in passive component, the passive component including a dielectric layer 2 is built in the multilayer wiring board comprising board layers 1a-1d, which are insulators whose main component is inorganic material. An intermediate layer 3, including one oxide selected from magnesium oxide, zinc oxide, and calcium oxide, is interposed between the dielectric layer 2 and the board layers 1b, 1c, so that they are not in contact with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board with built-in passive components including passive components such as capacitors, inductors and resistors.

[0002]

2. Description of the Related Art In recent years, with the progress of miniaturization of electronic equipment, it has been required to mount semiconductor ICs and other components at high density on a multilayer wiring board. Correspondingly,
Various demands have been placed on the multilayer wiring board itself. Multilayer wiring boards are largely divided into organic substrates using a substrate layer made of an organic insulating material such as glass epoxy and inorganic substrates using a substrate layer made of an inorganic insulating material such as ceramics or glass such as alumina. being classified. Briefly describing the method for manufacturing an inorganic substrate, first, a plurality of sheet-like molded bodies containing an inorganic material constituting a substrate layer are prepared, and the molded bodies are laminated after forming a wiring layer and a via as appropriate. . Next, after performing the binder removal treatment, the laminate is fired by performing a heat treatment at a high temperature.

[0003] Passive components such as capacitors, inductors and resistors include a functional layer composed of a dielectric, a magnetic material, a resistor and the like, and a conductor. Various ceramics are used for the functional layer. ing. Passive components, like the inorganic multilayer wiring board, produce a molded body containing various inorganic materials constituting the functional layer, and if necessary, form a conductor on or inside this molded body, and then fire it. Can be made.

[0004] As described above, the steps of manufacturing the inorganic substrate and the passive component include a common operation of firing a compact containing an inorganic material. Therefore, a functional layer molded body and a conductor constituting a passive component are previously formed and integrated in a laminate of the substrate layer molded body and the wiring layer, and are integrated and fired at the same time, thereby forming a multilayer having the passive component embedded therein. A wiring substrate can be manufactured.

However, a substrate layer constituting the inorganic substrate,
Since the functional layer constituting the passive component has a different composition from each other, if the substrate layer and the functional layer are fired in contact with each other,
Since the components of each layer are interdiffused with the progress of sintering, there is a problem that the sinterability and electrical characteristics of each layer change, and it has been difficult to impart desired characteristics to passive components incorporated therein. To solve this problem, a method has been proposed in which a barrier layer serving as a barrier for preventing interdiffusion is interposed between the substrate layer and the functional layer. For example, Japanese Patent Application Laid-Open No. 9-929
No. 78 discloses a glass-ceramic substrate with a built-in capacitor using various refractory powders (alumina, magnesia, zirconia, titania or calcia) as a barrier layer.

[0006]

However, there is a need for a multilayer wiring board with built-in passive components that can more reliably impart desired characteristics to the built-in passive components than the above-mentioned conventional glass-ceramic substrates with built-in capacitors. ing.

The present invention provides a multilayer wiring board with built-in passive components and a method of manufacturing the same, in which the characteristics of the built-in passive components are improved by utilizing the interaction between the layers constituting the multilayer wiring board with built-in passive components. The purpose is to do.

[0008]

In order to achieve the above object, a multi-layer wiring board with a built-in passive component according to the present invention includes a multi-layer wiring board including at least one substrate layer which is an insulator mainly composed of a sintered body of an inorganic material. A passive component-embedded multilayer wiring board in which a passive component including a functional layer that is a dielectric, a magnetic material, or a resistor mainly including a sintered body of an inorganic material is embedded in the wiring board, wherein the functional layer and the At least one selected from magnesium oxide, zinc oxide and calcium oxide so that the functional layer and the substrate layer do not come into contact with the substrate layer.
It is characterized in that an intermediate layer containing a seed oxide is interposed.

According to such a configuration, since a specific intermediate layer is interposed between the substrate layer and the functional layer, when the passive component and the wiring substrate are integrated and fired at the same time, the substrate layer is formed. The diffusion of the component into the functional layer can be effectively suppressed. In addition, the intermediate layer containing the above components,
Diffuse diffusion of the intermediate layer component into the functional layer is unlikely to occur. Therefore, the multilayer wiring board with a built-in passive component of the present invention is a multilayer wiring board with a built-in passive component having good characteristics, and can be manufactured by simultaneously firing the passive component and the wiring board.

In the multilayer wiring board with built-in passive components, the intermediate layer preferably contains magnesium oxide and zinc oxide. This is because, in addition to suppressing the diffusion of the substrate layer component and the intermediate layer component into the functional layer, high mechanical strength can be imparted to the intermediate layer.

In the multilayer wiring board with built-in passive components, the intermediate layer preferably contains 50 to 95% by weight of at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide. If the content is less than 50% by weight, it may be difficult to reliably suppress the diffusion of the substrate layer component and the intermediate layer component into the functional layer.
If the content exceeds 5% by weight, it is difficult to impart sufficient mechanical strength to the intermediate layer.

In the multilayer wiring board with a built-in passive component, it is preferable that the intermediate layer contains a sintering aid for an inorganic material constituting the functional layer. This is because the sinterability of the functional layer can be improved, and as a result, the built-in passive component can more reliably have good characteristics.

[0013] The intermediate layer may contain the sintering aid in an amount of from 5 to 5.
It is preferred to contain 50% by weight. If it is less than 5% by weight, it is difficult to reliably improve the sinterability of the functional layer. If it exceeds 50% by weight, the diffusion of the substrate layer component and the intermediate layer component into the functional layer is surely suppressed. This is because it may be difficult.

In the multilayer wiring board with built-in passive components, it is preferable that the concentration of the sintering aid in the intermediate layer is higher on the functional layer side than on the substrate layer side.
This is because the sinterability of the functional layer can be more effectively improved.

[0015] As the sintering aid, the functional layer is composed of Pb.
When the layer is mainly composed of a perovskite compound, at least one oxide selected from lead oxide, copper oxide, vanadium oxide and bismuth oxide can be used.

In particular, when the functional layer is a layer mainly composed of a Pb-based perovskite compound, the intermediate layer is formed of at least one selected from magnesium oxide and zinc oxide.
50 to 95% by weight of a kind oxide and 5 to 50% by weight of at least one kind of oxide selected from lead oxide and copper oxide
And the content of lead oxide in the intermediate layer is preferably 40% by weight or less, and the content of copper oxide is preferably 30% by weight or less. According to this preferred example, the built-in passive component can be a capacitor having a high dielectric constant and a small dielectric loss and excellent characteristics.

In the case where the functional layer is a layer mainly composed of NiZn-based spinel ferrite or NiZnCu-based spinel ferrite, the sintering aid includes at least one selected from copper oxide, vanadium oxide and silver oxide. Oxides can be used.

In the multilayer wiring board with a built-in passive component, the intermediate layer preferably contains at least one oxide selected from silicon oxide, aluminum oxide and boron oxide. This is because the adhesive strength and mechanical strength of the intermediate layer can be improved, and the strength of the multilayer wiring board with a built-in passive component can be improved. Further, the intermediate layer,
It is preferable to contain 1 to 50% by weight of at least one oxide selected from silicon oxide, aluminum oxide and boron oxide.

In the multilayer wiring board with a built-in passive component, the intermediate layer preferably has a thickness of 5 to 30 μm. If it is less than 5 μm, it is difficult to reliably suppress the diffusion of the component of the substrate layer into the functional layer.
If it exceeds m, the strength of the multilayer wiring board with a built-in passive component may be reduced.

In order to achieve the above object, a method of manufacturing a multilayer wiring board with a built-in passive component according to the present invention is directed to a multilayer wiring board including at least one substrate layer which is an insulator mainly composed of a sintered body of an inorganic material. A method for manufacturing a passive component-embedded multilayer wiring board in which a passive component including a functional layer that is a dielectric, a magnetic material, or a resistor mainly composed of a sintered body of an inorganic material is incorporated, wherein the substrate layer is not fired. A step of forming a laminate including a green body and a green body of the functional layer, and a step of firing the laminate, wherein in the step of forming the laminate, the green body of the substrate layer and Between the green body of the functional layer,
Interposing an intermediate layer containing at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide so that the green body of the functional layer does not come into contact with the green body of the substrate layer. Features.

According to such a configuration, since firing is performed with a specific intermediate layer interposed between the substrate layer and the functional layer, it is possible to effectively prevent the components of the substrate layer from diffusing into the functional layer during firing. Can be suppressed. In the intermediate layer containing the above components, the diffusion of the intermediate layer components into the functional layer is unlikely to occur. Therefore, the built-in passive components can have good characteristics.

In the above-mentioned manufacturing method, before the step of firing the laminate, the shrinkage rate when performing the step of firing the laminate on at least one surface of the laminate is 5%.
It is preferable that the following step of laminating the outermost layer is performed, and after the step of firing the laminate, a step of removing at least a part of the outermost layer is performed. Here, the “shrinkage ratio” is a value that can be calculated by the following equation, where L _{1 is} the dimension of the outermost layer before firing and L ₂ is the dimension of the outermost layer after firing. In addition, each dimension is a dimension measured in the surface direction of the outermost layer.

According to this preferred example, shrinkage (%) = (L ₁ −L ₂ ) / L ₁ × 100 According to this preferred embodiment, shrinkage caused in the horizontal direction (the plane direction of the layers constituting the multilayer body) of the laminate by firing is reduced. It is possible to suppress occurrence of defects such as warpage, distortion, and cracks in the multilayer wiring board with built-in passive components.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer wiring board with a built-in passive component according to the present invention will be described by taking a multilayer wiring board with a built-in capacitor as an example. FIG. 1 is a sectional view showing the structure of a multilayer wiring board with a built-in capacitor according to the present embodiment.

The multilayer wiring board with a built-in capacitor according to this embodiment has a built-in capacitor composed of the dielectric layer 2 and the electrode layers 4a and 4b opposed to each other with the dielectric layer 2 interposed therebetween. Note that the capacitor may be a multilayer capacitor in which several dielectric layers and electrode layers are alternately stacked.

The dielectric layer 2 is a layer mainly composed of a sintered body of an inorganic material. The inorganic material constituting the dielectric layer is not particularly limited, and a material conventionally known as a dielectric for a capacitor can be used.
It can be appropriately selected according to the dielectric constant, dielectric loss tangent, temperature characteristics, and the like. For example, a composite perovskite compound-based material containing Pb, a barium titanate-based material, and the like can be given. In particular, since it has a large dielectric constant and a relatively low sintering temperature, it is preferable to use a composite perovskite compound material containing Pb. Pb-based composite perovskite compounds include Pb (B ₁ B ₂ ) O ₃ (where B ₁
Is Co, Mg, Mn or Ni, and B ₂ is Nb, T
a or W. )) And those obtained by combining these compounds, for example, Pb (Mg _1/3 Nb _2/3 ) O ₃ -Pb (Ni _1/2 W _1/2 )
O ₃ —PbTiO _{3 and the} like. Also, the dielectric layer 2
Is not particularly limited, but is usually 5 to 5
It is about 0 μm.

The electrode layers 4a and 4b are not particularly limited. For example, copper, silver, gold, palladium, platinum, nickel and alloys thereof can be used. Particularly, copper, silver, and alloys thereof are preferable because of their low resistance.

At least one substrate layer 1a to 1d is laminated on the capacitor so as to support or sandwich the capacitor. In the substrate layer, wiring layers 5a to 5d are formed between the layers or on the surface thereof, and vias 6a, 6b, 6e, 6c for electrically connecting the wiring layers or between the wiring layers and the electrode layers are formed. 6f is formed. Note that the number of layers in each layer is not particularly limited.

The substrate layers 1a to 1d are layers mainly composed of a sintered body of an inorganic material. The inorganic material constituting the substrate layer is not particularly limited. For example, a material conventionally used as a substrate layer of a multilayer wiring board, such as a ceramic material represented by alumina or a glass-ceramic composite material, is used. can do. In particular, it is preferable to use a glass-ceramic composite material because the sintering temperature is relatively low and a low melting point metal such as copper or silver can be used as the conductor. As glass components constituting the glass-ceramic composite material, lead oxide, zinc oxide, alkali metal oxides, crystalline glasses such as borosilicate glass and borosilicate glass containing alkaline earth metal oxides, and the like, An amorphous glass such as an aluminosilicate glass may be used. Also, as the ceramic component,
Examples include alumina, silica, mullite, and forsterite. Note that the composition ratio of each component in the glass-ceramic composite material can be appropriately adjusted in consideration of the sintering temperature, relative dielectric constant, mechanical strength, and the like of the composite material. The thickness of the substrate layers 1a to 1d is not particularly limited, but is usually about 30 to 300 μm.

For the wiring layers 5a to 5d, the same metal as the electrode layer can be used. Also, vias 6a, 6b, 6
The same metal as the electrode layer can be used as the conductive material to be filled in e and 6f.

In the multilayer wiring board with a built-in capacitor according to the present invention, between the dielectric layer 2 and the substrate layers 1b and 1c,
In order to prevent the dielectric layer 2 from contacting the substrate layers 1b and 1c,
Intermediate layers 3a and 3b are formed. Also, the middle layer 3
Vias 6c and 6d for electrically connecting the wiring layer and the electrode layer are formed in a and 3b. The vias 6c and 6d can be made of the same metal as the conductive material filled in the vias 6a, 6b, 6e and 6f.

The inorganic materials constituting the intermediate layers 3a and 3b are as follows:
It contains at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide. The oxide is 50 to 95% by weight of the intermediate layer, more preferably 60 to 95%
It preferably accounts for 90% by weight.

Further, the inorganic material constituting the intermediate layer preferably contains the following subcomponents. The addition of the auxiliary component is particularly effective when magnesium oxide or calcium oxide is used as the main component of the intermediate layer. If the intermediate layer is composed of only magnesium oxide or calcium oxide, the mechanical strength of the intermediate layer may be reduced. However, regardless of the type of inorganic component that is the main component of the intermediate layer, the addition of the following subcomponents to the intermediate layer is effective for obtaining a multilayer wiring board with built-in passive components having good characteristics.

The first subcomponent is a component that functions as a sintering aid for the inorganic material constituting the dielectric layer. Such components partially diffuse from the intermediate layer to the dielectric layer at the time of firing, so that the sinterability of the dielectric layer can be improved. As such a component, a component conventionally used as a sintering aid can be used depending on the composition of the dielectric layer. For example, when the dielectric layer is composed of a Pb-based composite perovskite compound, examples thereof include lead oxide, copper oxide, vanadium oxide, and bismuth oxide. Further, the addition amount of the component functioning as a sintering aid is preferably 5 to 50% by weight, more preferably 10 to 40% by weight of the intermediate layer. Further, it is preferable that this component is added so as to have a higher concentration on the dielectric layer side than on the substrate layer side of the intermediate layer.

The second subcomponent is a component for improving the adhesive strength and mechanical strength of the intermediate layer. Such components include silicon oxide, aluminum oxide, boron oxide, and the like. Further, the addition amount of this component is preferably 1 to 50% by weight, more preferably 5 to 30% by weight of the intermediate layer.

The thickness of the intermediate layer is preferably 5 to 30 μm, more preferably 10 to 30 μm.

Although FIG. 1 illustrates a structure in which a dielectric layer and an intermediate layer are laminated on the entire surface of a substrate layer, the structure of the multilayer wiring board with a built-in passive component according to the present invention includes a dielectric layer and a substrate. The structure is not limited to this as long as an intermediate layer is interposed between the two layers so that the layers do not come into contact with each other. For example, as shown in FIG. 2, the dielectric layer is laminated on a part of the substrate layer surface, and the intermediate layer is formed on a part of the substrate layer surface so as to surround the dielectric layer. Can be.

As described above, the multilayer wiring board with built-in passive components according to the present invention has been described by way of example in which the built-in passive components are capacitors, but the present invention is not limited to this. For example, the passive component to be built in may be an inductor or a resistor instead of the capacitor.

The multilayer wiring board with a built-in inductor according to the present invention has a structure similar to that of the multilayer wiring board with a built-in capacitor, except that the functional layer is a magnetic material and the positions and shapes of the electrodes are different. The magnetic material layer is not particularly limited, and any material conventionally known as a magnetic material for an inductor can be appropriately selected according to the sintering temperature, magnetic permeability, magnetic loss, temperature characteristics, and the like.
For example, NiZnCu, NiZn, MnZn, M
Examples thereof include gZn-based spinel ferrite and garnet ferrite. In particular, since the electric resistivity is large and the sintering temperature is relatively low, NiZn
Cu-based spinel ferrite is useful. The electrodes can be made of the same material as the electrode layers of the multilayer wiring board with a built-in capacitor, and the shape can be selected according to the intended use, such as a linear shape, a spiral shape, and a meander shape.

According to the multilayer wiring board with a built-in passive component of the present invention as described above, when the passive component and the wiring board are manufactured by simultaneous firing, the component of the substrate layer is a functional layer (dielectric layer, Diffusion into the magnetic layer or the resistor layer) can be suppressed, and the diffusion of the intermediate layer component into the functional layer hardly occurs. Therefore, a multilayer wiring board with built-in passive components having good characteristics can be obtained.

Next, an example of a method for manufacturing the multilayer wiring board with a built-in capacitor according to this embodiment will be described. The multilayer wiring board with a built-in capacitor according to the present invention comprises a substrate layer precursor, a dielectric layer precursor and an intermediate layer precursor, together with a wiring layer and an electrode layer (or a precursor thereof), having a predetermined layer structure. After lamination, the laminate can be manufactured by firing. In addition, the precursor means an unsintered body of an inorganic material constituting each layer.

As a precursor of each layer, a green sheet for a substrate layer, a green sheet for a dielectric layer, and a green sheet for an intermediate layer are prepared. First, a raw material powder of an inorganic material constituting each layer and an organic binder are sufficiently mixed to prepare a slurry.

The inorganic material constituting each layer is as described above for the multilayer wiring board with a built-in capacitor according to the present invention. Examples of the raw material powder include ceramic powder and inorganic powder for the substrate layer. A mixture of glass powder and ceramic raw material powder can be used. As the inorganic powder for the dielectric layer, a raw material powder of a Pb-based composite perovskite compound, a raw material powder of barium titanate, and the like can be used. Further, as the inorganic powder for the intermediate layer, an inorganic powder containing at least one metal oxide selected from magnesium oxide, zinc oxide and calcium oxide can be used. Further, a component serving as a sintering aid for the inorganic powder for a dielectric layer (for example, when the inorganic powder for a dielectric layer is a raw material powder of a Pb-based composite perovskite compound, lead oxide, copper oxide, It is preferable to contain vanadium oxide, bismuth oxide), and components (for example, silicon oxide, aluminum oxide, and boron oxide) that improve the strength of the intermediate layer.

As the organic binder, a butyral resin, an acrylic resin, or the like can be used.
For kneading, a conventional kneader such as a three-roll mill or a ball mill can be used.

The slurry is applied to the surface of a base film, formed into a sheet, and dried to obtain a green sheet. As a method of applying the slurry to the base film, for example, a doctor blade method, a calendar method, a roll coater method, or the like can be employed. Further, as the base film, for example, polyethylene resin,
Polyester resin, paper, etc. can be used.

Next, conductor paste for wiring and electrodes,
A conductor paste for via is prepared. Each conductor paste can be prepared by sufficiently mixing and kneading a powder of a metal or a metal precursor, an organic binder and a solvent. The metal is not particularly limited, for example, copper, silver,
Gold, palladium, platinum, nickel, or alloys thereof can be appropriately selected according to the manufacturing conditions and use conditions of the multilayer wiring board. As the metal precursor, an oxide of the metal can be used, but in this case, a metallizing treatment is required as a subsequent step. In addition, as the organic binder, for example, an ethyl cellulose-based resin, a polyvinyl butyral resin, a polyacryl-based resin, or the like can be used. As the solvent, an alcohol such as terpineol, a ketone, or the like can be used. Further, a plasticizer or a surfactant may be appropriately added.

Next, a green sheet laminate is prepared by laminating the green sheets of each layer so as to have a predetermined layer structure.
A wiring layer, an electrode layer, and a via are appropriately formed. Electrode layer,
The formation of the wiring layer and the via, in the green sheet laminate, an electrode layer on both sides of the dielectric layer green sheet,
Wiring layers are respectively formed on the surface or between layers of the green sheet for a substrate layer, and the method is carried out so that the vias electrically connect between the electrode layers and the wiring layers and between the wiring layers.
The wiring layer and the electrode layer can be formed by printing using a conductive paste for wiring and electrodes. The via is formed by forming a via hole at a predetermined position of the green sheet for the substrate layer or the green sheet for the intermediate layer by punching, drilling, laser or the like, and filling the via hole with the conductive paste for the via. Can be implemented.

The green sheet laminate is manufactured so as to have a predetermined layer structure corresponding to the structure of the multilayer wiring board with a built-in capacitor according to the present invention described above. That is, when the green sheet for the substrate layer is one layer, the electrode layer is formed on the surface of the green sheet for the substrate layer when two or more green sheets for the substrate layer are present, and on both surfaces of the green sheet for the dielectric layer. Is formed, and is manufactured so as to have a structure in which a green sheet for an intermediate layer is interposed between a green sheet for a dielectric layer and a green sheet for a substrate layer so that they do not contact each other. .

As such a structure, for example, a structure in which a green sheet for a dielectric layer and a green sheet for an intermediate layer are arranged on the entire surface of a green sheet for a substrate layer, as shown in FIG. The green sheet for the dielectric layer corresponding to the structure 2 is arranged in a part of the green sheet for the substrate layer, and the green sheet for the intermediate layer surrounds the periphery of the green sheet for the dielectric layer. The structure arrange | positioned at a part of layer green sheet can be illustrated.

It is preferable to form an outermost layer on at least one surface of the green sheet laminate. The outermost layer is
5% shrinkage in the plane direction in the subsequent firing step
The following layers. As the outermost layer, a layer mainly composed of an inorganic powder that is not substantially sintered in the subsequent firing step, in other words, an inorganic powder whose sintering temperature is higher than each of the dielectric layer, the substrate layer, and the intermediate layer Can be used. In addition, a layered sintered body, a metal foil body, or the like that has been subjected to a sintering process can be used.

Each layer is laminated and thermocompression bonded, and if necessary,
After performing the binder removal treatment and the metallization treatment, the green sheet laminate is fired. The firing temperature and the firing time are appropriately set according to each inorganic material constituting the substrate layer and the dielectric layer. For example, when a glass-alumina composite material is used as the substrate layer and a Pb-based composite perovskite compound is used as the dielectric layer, the firing temperature is usually 850.
The firing time is set to 0.1 to 10.0 hours. Also, the processing atmosphere is not particularly limited,
For example, air, nitrogen, hydrogen, steam, carbon dioxide, or a mixed gas thereof can be used. After firing, if necessary, part or all of the outermost layer is removed to obtain a multilayer wiring board with a built-in capacitor.

In the above description, a method is described in which a green sheet is prepared as a dielectric layer precursor and an intermediate layer precursor, and the green sheet is laminated on a green sheet for a substrate layer. The method is not limited to such a method. For example, it is possible to adopt a method in which a paste containing an inorganic material of each layer is prepared as a dielectric layer precursor and an intermediate layer precursor, and the paste is printed on the surface of a green sheet for a substrate layer. Preparation of paste
Except for using the raw material powder of the inorganic material constituting each layer instead of the metal powder, it can be carried out in substantially the same manner as the above-mentioned conductor paste for wiring and electrode.

As described above, the method of manufacturing the multilayer wiring board with built-in passive components according to the present invention has been described by exemplifying the case where the built-in passive components are capacitors, but the present invention is not limited to this.

For example, in the above manufacturing method, a green sheet for a magnetic layer is prepared in place of the green sheet for a dielectric layer, and a green sheet laminate is prepared using the green sheet. be able to. The green sheet for the magnetic layer may be made of, for example, NiZnCu, NiZn, MnZn as an inorganic powder.
Except for using a raw material powder of a magnetic material such as spinel ferrite or garnet ferrite of an Al-based or MgZn-based material, it can be manufactured in the same manner as the green sheet for a dielectric layer.

According to the method for manufacturing a multilayer wiring board with a built-in passive component of the present invention as described above, the diffusion of the substrate layer component and the intermediate layer component into the dielectric layer can be effectively suppressed, and good characteristics can be obtained. Can be obtained.

[0056]

The present invention will be described below in detail with reference to examples. The characteristics of the samples manufactured in the respective examples were measured and evaluated by the following methods. (Capacitance, relative dielectric constant and dielectric loss tangent) The capacitance and the dielectric loss tangent were measured with an LCR meter at a frequency of 1 kHz according to the method described in JIS C5120. The relative dielectric constant was calculated by measuring the thickness of the dielectric layer by cutting a sample and observing the cross section thereof, and using the capacitance and the layer thickness. (Inductance) Frequency 1MH by LCR meter
It was measured under the condition of z. (Destruction Mode) The sample was mechanically broken by three-point bending fracture, and the state of the sample after the fracture was observed. The main destruction point,
The state between the functional layer (dielectric layer or magnetic layer) and the substrate layer was recorded as "delamination". In addition, a state in which destruction occurred in the entire sample and a main destruction location could not be specified between the functional layer and the substrate layer was recorded as “integral destruction”. (Shrinkage ratio) The size of the sample before firing was L ₁ , and the size of the sample after firing was L ₂ , which was calculated by the following equation. In addition, each dimension is a dimension measured in the horizontal direction of the sample (the surface direction of the layer constituting the sample).

Shrinkage (%) = (L ₁ −L ₂ ) / L ₁ × 100 (Example 1) First, 85 parts by weight of silver powder was used as a conductor material.
5 parts by weight of glass powder for fusion, ethyl cellulose resin 5
Parts by weight and 5 parts by weight of terpineol were sufficiently mixed and kneaded with a three-roll mill to prepare a conductor paste for wiring and electrodes. A conductor paste for via was prepared in the same manner except that 10 parts by weight of the glass powder for fusion was used.

Next, 50 parts by weight of a glass-alumina mixed powder (sintering temperature: 900 ° C.), 10 parts by weight of a butyral resin as a binder, 5 parts by weight of benzyl butyl phthalate as a plasticizer, and butyl carbitol 3 as a solvent
5 parts by weight were sufficiently mixed and kneaded with a ball mill, and then defoamed to obtain a slurry. The slurry was applied to the surface of a base film (polyphenyl sulfide) having been subjected to a mold release treatment by a doctor blade method and formed into a sheet shape to produce a green sheet for a substrate layer having a thickness of about 200 μm.

Instead of glass-alumina mixed powder, Pb
Powder (composition ratio Pb)
_1.0 Ca _0.03 (Mg _1/3 Nb _2/3 ) _0.8 Ti _0.14 (Ni _1/2
W _{1/2) 0 .06} O _3.03; alone fired at dielectric constant 10000, except using the sintering temperature 800 ° C.) in the same manner as the green sheet for the substrate layer, form a green sheet dielectric layer did.

In place of the glass-alumina mixed powder, Table 1
A green sheet for an intermediate layer was produced in the same manner as the green sheet for a substrate layer except that the various inorganic materials shown in (1) and (2) were used.

Further, the base film (polyethylene terephthalate) was coated on the base film (polyethylene terephthalate) surface in substantially the same manner as the green sheet for the substrate layer except that alumina powder was used instead of the glass-alumina mixed powder.
A thick outermost alumina sheet was prepared.

The above-described green sheet for the substrate layer, the green sheet for the dielectric layer, and the green sheet for the intermediate layer are laminated while appropriately forming an electrode layer, a wiring layer, and a via.
A green sheet laminate including 10 capacitor precursors each having an electrode layer formed on both surfaces of the dielectric layer green sheet was prepared. At this time, in the green sheet laminate, each capacitor precursor is sandwiched between green sheets for the substrate layer, and a green sheet for the intermediate layer is provided between the green sheet for the dielectric layer and the green sheet for the substrate layer. It was made to intervene. Note that the formation of the electrode layer and the wiring layer
Each was performed by printing using paste for electrodes and wiring. The via is formed by punching a via hole having a diameter of 0.2 mm at a predetermined position on the green sheet for the substrate layer and the green sheet for the intermediate layer by punching, and filling the via hole with a conductive paste for the via. Carried out.

Further, after laminating an alumina sheet for the outermost layer on both sides of the green sheet laminate, the laminate was thermocompressed at 80 ° C. to obtain a precursor of a multilayer wiring board with a built-in capacitor. This precursor was subjected to binder removal treatment in the air at 600 ° C. in a heating furnace, and then fired at 900 ° C. for 0.2 hours. After firing,
The alumina sheet for the outermost layer was removed by washing with water.

By the above manufacturing method, 12 kinds of multilayer wiring boards with built-in capacitors were obtained by changing various inorganic materials constituting the intermediate layer (Sample Nos. 1 to 12). The thickness of the dielectric layer of each sample was about 10 μm. Table 1 shows the results of measuring the relative permittivity and the dielectric loss tangent of each sample, together with the types of inorganic materials constituting the intermediate layer.

[0065]

[Table 1]

As is clear from Table 1, when the intermediate layer was not formed, the relative dielectric constant was extremely low, and almost no capacity was obtained (Sample No. 1). Further, as an intermediate layer, M
Also when various materials other than gO, ZnO and CaO were used, the relative dielectric constant was extremely small (Sample Nos. 2 to 2).
9).

On the other hand, MgO, Z
When nO or CaO was used, a high relative dielectric constant of 200 or more was obtained (Sample Nos. 10 to 11).

(Example 2) Twelve kinds of multilayer wiring boards with built-in capacitors were produced by the same operation as in Example 1 except that the composition of the intermediate layer was variously changed (Sample No. 13).
To 24). The thickness of the intermediate layer was adjusted to be 15 μm. Table 2 shows the measurement results of the relative dielectric constant and the dielectric loss tangent of each sample together with the composition of the intermediate layer.

[0069]

[Table 2]

As is clear from Table 2, PbO and C
When at least one kind of uO is added (Sample Nos. 14 to
24) When these components are not added (Sample No. 1)
A higher dielectric constant was obtained as compared to 3). However, PbO
When the amount or CuO amount is too large (Sample Nos. 17 and 21) or when the MgO amount is too small (Sample No. 2)
4) The dielectric loss tangent (dielectric loss) was slightly increased.

PbO and CuO are components that are considered to function as a sintering aid for the Pb-based composite perovskite compound used for the dielectric layer. From the above results, it was confirmed that when the intermediate layer contains a component functioning as a sintering aid for the inorganic material constituting the dielectric layer, a good relative dielectric constant can be obtained. In particular, when the intermediate layer had the following composition (Sample Nos. 22 and 23), it was confirmed that the relative dielectric constant was high, the dielectric loss was small, and the best characteristics were obtained.

50% by weight ≦ MgO ≦ 95% by weight 5% by weight ≦ (PbO + CuO) ≦ 50% by weight However, PbO and CuO are each 0% by weight ≦ PbO
≦ 40% by weight, 0% by weight ≦ CuO ≦ 30% by weight.

A sample was prepared in the same manner except that ZnO was used in place of MgO, and its characteristics were evaluated. As a result, although the relative permittivity was slightly smaller than that of MgO, almost the same tendency was confirmed. did it.

(Example 3) Twelve kinds of multilayer wiring boards with built-in capacitors were manufactured in the same manner as in Example 1 except that the composition and thickness of the intermediate layer were variously changed (Sample Nos. 25 to 36). ). For each sample, the relative permittivity and the dielectric loss tangent were measured, and the breakdown mode was observed.
Table 3 shows the results together with the composition and thickness of the intermediate layer.

[0075]

[Table 3]

As is clear from Table 3, the intermediate layer is made of ZnO.
In the case where no is contained, although a high relative dielectric constant was obtained, delamination between the dielectric layer and the substrate layer occurred, and the mechanical strength of the intermediate layer was low (Sample Nos. 25 and 30).

On the other hand, when the intermediate layer contains ZnO, delamination between the dielectric layer and the substrate layer does not occur, the mechanical strength of the intermediate layer is improved, and the strength of the multilayer wiring board is improved. Was confirmed (Sample Nos. 26 to 29 and Sample Nos. 31 to 34). In particular, the intermediate layer is made of MgO, Zn
When simultaneously containing O, PbO and CuO, the relative permittivity,
Both strengths were good (Sample Nos. 31 to 34).

The sample No. As is clear from the comparison of 31 to 35, the higher the interlayer thickness, the higher the relative dielectric constant was obtained. However, when the layer thickness exceeded 30 μm, a decrease in strength was observed (Sample Nos. 35 and 36).

Example 4 Twelve kinds of multilayer wiring boards with built-in capacitors were manufactured in the same manner as in Example 1 except that the composition of the intermediate layer was variously changed (Sample No. 3).
7-48). For each sample, the relative permittivity and the dielectric loss tangent were measured, and the breakdown mode was observed. The results are shown in Table 4 together with the composition of the intermediate layer. In Table 4,
The main component (MgO) of the intermediate layer is indicated as the first component, and the components (PbO, Cu
O, Bi ₂ O ₃ and V ₂ O ₅ ) as the second component,
Components that improve the strength of the intermediate layer (SiO ₂ , Al ₂ O ₃ and B ₂ O ₃ ) are indicated as third components.

[0080]

[Table 4]

As shown in Table 4, when a component functioning as a sintering aid for the dielectric layer was added to the intermediate layer (sample N
o. 38-41 and sample no. 45 to 48), and a high relative dielectric constant was obtained. When a component for improving the strength of the intermediate layer is added to the intermediate layer (Sample Nos. 42 to 48)
In the sample, the strength of the sample was improved. When both were simultaneously contained (Sample Nos. 45 to 48), a high relative dielectric constant and a high strength were obtained, and a particularly good sample was obtained.

(Example 5) As a raw material powder for the intermediate layer, M
A mixed powder of gO: PbO = 80: 20 (weight ratio) was used. 50 parts by weight of the mixed powder, butyral resin 15
Parts by weight, 5 parts by weight of benzyl butyl phthalate and 30 parts by weight of butyl carbitol were sufficiently mixed and kneaded to prepare a slurry. The slurry was applied to the surface of the base film subjected to the release treatment by a doctor blade method.
The resultant was dried under a temperature condition of ° C. to prepare a green sheet A for an intermediate layer having a thickness of about 20 μm. Further, except that the drying temperature was set to 10 ° C., the green sheet B for the intermediate layer was prepared in the same manner.
Was prepared. When the composition of each intermediate layer green sheet was analyzed, there was no substantial difference in PbO concentration between the front and back surfaces of the intermediate layer green sheet A. On the other hand, in the intermediate layer green sheet B, the PbO concentration on the front surface was higher than the PbO concentration on the back surface.

Three samples were prepared in the same manner as in Example 1 except that the above-mentioned intermediate green sheet was used. Sample A was produced using the green sheet A for an intermediate layer. Sample B-1 uses an intermediate layer green sheet B such that the sheet surface (the surface with a high PbO concentration) is on the substrate layer side and the sheet back surface (the surface with a low PbO concentration) is on the dielectric layer side. Produced. Sample B-2 uses the green sheet B for the intermediate layer, and the sheet surface (the surface with a high PbO concentration) is on the dielectric layer side, and the back surface of the sheet (the surface with a low PbO concentration).
Was formed on the substrate layer side.

When the relative permittivity of the capacitor portion of each sample was measured, the relative permittivity of sample B-2 was the highest at 10080, then the relative permittivity of sample A was 8320, followed by the relative permittivity of sample B320. It was the lowest with a dielectric constant of 6530.

From the above results, when the average concentration of the component serving as the sintering aid of the dielectric layer in the intermediate layer is the same,
It was confirmed that there was a gradient in the concentration of the components, and the more the components serving as the sintering aid for the dielectric layer were on the dielectric layer side, the better the characteristics could be obtained.

(Example 6) 50 parts by weight of NiZnCu-based ferrite raw material powder, 15 parts by weight of butyral-based resin, 5 parts by weight of benzyl butyl phthalate and 30 parts by weight of butyl carbitol were thoroughly mixed and kneaded by a ball mill.
Defoaming was performed to obtain a slurry. The slurry was applied to the surface of a base film (polyphenyl sulfide) that had been subjected to a release treatment by a doctor blade method and formed into a sheet shape to produce a green sheet for a magnetic layer. Note that Ni
As the ZnCu-based ferrite raw material powder, NiO = 7.
5 mol%, ZnO = 32.5 mol%, CuO = 1
A mixture of 1.0 mol% and Fe ₂ O ₃ = 9.0 mol% (calcination temperature 700 ° C., sintering temperature 900 ° C.) was used.

Next, a green sheet for an intermediate layer was prepared in the same manner as the green sheet for the magnetic layer except that the inorganic powder shown in Table 5 was used instead of the NiZnCu-based ferrite raw material powder. .

In the same manner as in Example 1, a green sheet for the substrate layer, an alumina sheet for the outermost layer, and a conductive paste were prepared.

The green sheet for the substrate layer, the green sheet for the magnetic layer, and the green sheet for the intermediate layer are appropriately laminated while forming a wiring layer and a via, and the wiring layer is sandwiched between the green sheets for the magnetic layer. A green sheet laminate including an inductor precursor was prepared. At this time, the green sheet laminate was prepared such that the intermediate layer green sheet was interposed between the magnetic layer green sheet and the substrate layer green sheet. The formation of the wiring layer and the via was performed in substantially the same manner as in Example 1.

Further, an alumina sheet for the outermost layer was laminated on both sides of the green sheet laminate, and then thermocompression bonded at 80 ° C. to obtain a precursor of a multilayer wiring board with a built-in inductor. The precursor was subjected to a binder removal treatment in a heating furnace at 600 ° C. in the air, and then fired at 920 ° C. for 0.5 hour. After firing,
The alumina sheet for the outermost layer was removed by washing with water.

By the above-mentioned manufacturing method, the composition of the intermediate layer was changed variously to obtain 12 kinds of multilayer wiring boards with built-in inductors (Sample Nos. 49 to 60). For each sample, the inductance was measured and the destruction mode was observed. Table 5 shows the results together with the composition of the intermediate layer.

[0092]

[Table 5]

As apparent from Table 5, when the intermediate layer was not formed, the inductance was extremely small. (Sample No. 49). Also, when a material having the same sintering temperature as the magnetic layer was used as the intermediate layer, the inductance was extremely small (Sample No. 50).

On the other hand, when an inorganic material containing MgO was used as the intermediate layer, high inductance was obtained (Sample Nos. 51 to 60). In particular, if the intermediate layer contains a component which functions as a sintering aid of the magnetic layer (CuO, Ag ₂ O or V ₂ O _5), good inductance was obtained (Sample No.52~54,59 and 60). In addition, components (ZnO, Si
When O ₂ , Al ₂ O ₃ or B ₂ O ₃ ) was included, the strength of the sample was improved (Sample Nos. 55 to 60). In particular, when both are included, in both characteristics of inductance and strength,
Good results were obtained (Sample Nos. 59 and 60).

Example 7 RuO was used as a raw material powder for a resistor.
₍₂₎ 80 parts by weight of powder, 5 parts by weight of glass powder for fusion, 8 parts by weight of ethyl cellulose resin and 7 parts by weight of terpineol were sufficiently mixed and kneaded with a three-roll mill to prepare a paste for a resistor.

A green sheet for an intermediate layer was prepared in the same manner as in Example 1 except that a mixed powder of MgO: ZnO = 60: 40 (weight ratio) was used. In the same manner as in Example 1, a green sheet for the substrate layer, an alumina sheet for the outermost layer, and a conductive paste were produced.

The above-described green sheet for the substrate layer and the green sheet for the intermediate layer are appropriately laminated while forming a resistor layer precursor, a wiring layer and a via, and a wiring layer is formed on the resistor layer precursor. A laminate including the resistor precursor was produced. At this time, the laminate was manufactured such that the intermediate layer green sheet was interposed between the resistor layer precursor and the substrate layer green sheet. The resistor layer precursor was formed by printing using a resistor layer paste.
The formation of the wiring layer and the via was performed in substantially the same manner as in Example 1.

Further, an alumina sheet for the outermost layer was laminated on both sides of the green sheet laminate, and then thermocompression-bonded at 80 ° C. to obtain a precursor of a multilayer wiring board with built-in resistors. This precursor was subjected to binder removal treatment in the air at 600 ° C. in a heating furnace, and then fired at 900 ° C. for 0.2 hours. After firing, the alumina sheet for the outermost layer was removed by washing with water to obtain a multilayer wiring board with a built-in resistor (sample C).

As a comparative example, a resistor built-in multilayer wiring board having a structure in which the substrate layer and the resistor layer were in direct contact was prepared in the same manner except that the intermediate layer was not formed (sample D). Further, a resistor layer and a wiring layer having the same shape were formed on a platinum plate, and after removing the binder layer under the condition of 600 ° C. in the air, firing was performed at 900 ° C. for 0.2 hours to produce a resistor. .

When the electric resistance of the resistor was measured for each sample, the resistance value of the resistor built in Sample C provided with the intermediate layer was substantially equal to that of the resistor formed on the platinum plate. The desired resistance was obtained. On the other hand, the resistance value of the resistor built in the sample D having no intermediate layer was about three times higher than that of the resistor formed on the platinum plate, and a desired resistance value could not be obtained.

Example 8 Example 1 was repeated except that silver, copper or copper oxide was used as the conductor material (or precursor).
In the same manner as described above, three types of conductive pastes for wiring and electrodes and pastes for vias were produced.

Next, MgO: ZnO: PbO: CuO =
A green sheet for an intermediate layer was prepared in the same manner as in Example 1 except that a mixed powder of 50: 30: 20: 10 (weight ratio) was used. Also, 75 parts by weight of the mixed powder, 15 parts by weight of ethyl cellulose resin and 10 parts by weight of terpineol were sufficiently mixed and kneaded to prepare a paste for an intermediate layer.

A green sheet for a substrate layer and a green sheet for a dielectric layer were prepared in the same manner as in Example 1 except that an acrylic resin was used as a binder. The thickness of each green sheet was about 200 μm.

An alumina sheet for the outermost layer having a thickness of about 200 μm was prepared in the same manner as in Example 1. An outermost copper sheet having a thickness of about 100 μm was prepared in the same manner except that copper powder was used instead of alumina powder. Further, a copper foil for an outermost layer having a surface roughness of about 50 μm was prepared.

Using the above-mentioned various green sheets and various pastes, a capacitor precursor obtained by forming an electrode layer on both surfaces of a dielectric layer green sheet is included, and a dielectric layer green sheet and a substrate layer green sheet are formed. A laminate having an intermediate layer precursor interposed therebetween was produced. The following two forms (Form I and Form II) were adopted as the built-in form of the capacitor.

Mode I is a mode corresponding to FIG. 1, in which the capacitor precursor and the intermediate layer precursor are arranged on the entire surface of the green sheet of the substrate layer. That is, the area of the dielectric layer green sheet and the area of the intermediate layer precursor are made equal to the area of the substrate layer green sheet. In this case, the method of forming the laminate is substantially the same as that of Example 1, using a green sheet for an intermediate layer as an intermediate layer precursor, and using a green sheet for a substrate layer and a green sheet for a dielectric layer. Were appropriately formed with an electrode layer, a wiring layer, and a via, and laminated.

Form II is a form corresponding to FIG. 2, in which the capacitor precursor and the intermediate layer precursor are arranged on a part of the substrate layer green sheet. That is, the area of the dielectric layer green sheet is adjusted to be smaller than the area of the substrate layer green sheet, and the intermediate layer precursor is formed so as to surround the dielectric layer green sheet. In this case, the method of forming the laminate is as follows:
A method of forming an intermediate layer precursor and a dielectric layer precursor on a part of the substrate layer green sheet as described below while appropriately forming the electrode layer, the wiring layer, and the via was employed.
The intermediate layer precursor was formed by printing the intermediate layer paste on the surface of the substrate layer green sheet. Also, the dielectric layer precursor is a dielectric layer green sheet,
In a state where a part was removed from the base film so as to have a predetermined area, after laminating at a predetermined position (position where the intermediate layer precursor was formed) of the laminate, the base film was peeled off and transferred. . The thicknesses of the intermediate layer precursor and the dielectric layer precursor were adjusted such that the thickness of each layer after firing was 10 μm for the intermediate layer and 8 μm for the dielectric layer.

In any case, the formation of the electrode layer, the wiring layer, and the via is substantially the same as that of the first embodiment except that the conductive paste is selected from the above three types. Was carried out.

When the outermost layer was used, the outermost layer was selected from the above three types and was laminated on both sides of the laminate.

After the produced laminate was thermocompressed at 80 ° C.,
The binder was removed. The binder removal treatment is performed at 600 ° C. in the atmosphere for a sample using a silver-based or copper oxide-based conductor paste as a conductor paste, and 50 ppm of oxygen for a sample using a copper-based conductor paste.
In nitrogen containing 700 ° C. In addition, the sample using a copper oxide-based conductor paste as the conductor paste was subjected to a metallization treatment at 300 ° C. in nitrogen containing 10% hydrogen after the binder removal treatment.

Next, the laminate was fired in nitrogen at 900 ° C. for 0.15 hours to obtain a multilayer wiring board with a built-in capacitor. In the sample using the outermost layer, at least a part of the outermost layer was removed after firing. For the removal of the outermost layer, all the samples using the alumina sheet as the outermost layer sheet were removed by washing, and the samples using the copper sheet or copper foil were partially removed by etching.

In the above manufacturing method, ten kinds of multilayer wiring boards with built-in capacitors were manufactured by changing manufacturing conditions (the built-in form of the capacitor, the presence / absence and type of the outermost layer, and the type of the conductive paste) variously (Sample No. 61). To 70).
For each sample, the shrinkage in the plane direction was measured and the appearance was observed. In addition, the capacitance and the dielectric loss tangent of the capacitor built in each sample were measured. The results are shown in Table 6 together with the production conditions for each sample. As for the built-in form of the capacitor, the form in which the capacitor is arranged on the entire surface of the substrate layer as shown in FIG.
The form in which the capacitor is disposed in a part of the substrate layer, which corresponds to the above, is indicated as “II”.

[0113]

[Table 6]

As is clear from Table 6, when no intermediate layer was provided (Sample Nos. 61 and 70), no capacitance was obtained regardless of the presence or absence of the outermost layer.

On the other hand, when the intermediate layer was provided (Sample Nos. 62 to 69), the capacitance was obtained. In particular, when the outermost layer was provided (Sample Nos. 62 to 66), the shrinkage in the horizontal direction due to firing was small, and the electrical characteristics such as capacitance and dielectric loss tangent were good.

[0116]

As described above, according to the multilayer wiring board with a built-in passive component of the present invention, a multilayer wiring board including at least one substrate layer which is an insulator mainly composed of a sintered body of an inorganic material is provided. A passive component built-in multilayer wiring board including a passive component containing a functional layer that is a dielectric, a magnetic material, or a resistor mainly composed of a sintered body of an inorganic material, wherein the functional layer and the substrate layer are An intermediate layer containing at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide is interposed between the functional layer and the substrate layer so that the functional layer does not contact the substrate layer. It is possible to provide a multilayer wiring board with built-in passive components having good characteristics and capable of suppressing diffusion to the substrate.

Further, according to the method for manufacturing a multilayer wiring board with a built-in passive component of the present invention, a multilayer wiring board including at least one substrate layer, which is an insulator mainly composed of a sintered body of an inorganic material, is provided with an inorganic material. A method for manufacturing a passive component built-in multilayer wiring board having a built-in passive component including a functional layer that is a dielectric, a magnetic material or a resistor mainly composed of a sintered body, comprising: A step of forming a laminate including a green body of the functional layer, and a step of firing the laminate,
In the step of forming the laminate, between the green body of the substrate layer and the green body of the functional layer, the green body of the functional layer and the green body of the substrate layer are To avoid contact
Since an intermediate layer containing at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide is interposed, the diffusion of the substrate layer component into the functional layer during firing is suppressed, and the passive component having good characteristics is built in. A multilayer wiring board can be manufactured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of the structure of a substrate with a built-in passive component according to the present invention.

FIG. 2 is a cross-sectional view showing another example of the structure of the substrate with built-in passive components according to the present invention.

[Explanation of symbols]

 1a, 1b, 1c, 1d Substrate layer 2 Dielectric layer 3, 3a, 3b Intermediate layer 4a, 4b Electrode layer 5a, 5b, 5c, 5d Wiring layer 6a, 6b, 6c, 6d, 6e, 6f Via 7a, 7b Outer layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichi Kato 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) EE26 EE27 EE35 FG06 FG26 FG27 FG54 GG08 GG11 GG21 HH43 JJ15 JJ23 KK01 LL01 LL02 LL35 MM22 MM24 PP03 PP09 PP10 5E346 AA11 AA12 AA13 AA14 AA15 AA23 AA24 BB01 CC25 CC31 CC25 CC30 CC18

Claims (14)

[Claims] A multilayer wiring board including at least one substrate layer which is an insulator mainly composed of a sintered body of an inorganic material, and a dielectric, a magnetic body or a resistor mainly composed of a sintered body of an inorganic material. A passive component built-in multilayer wiring board having a built-in passive component including a functional layer, wherein the oxidation is performed between the functional layer and the substrate layer so that the functional layer and the substrate layer do not come into contact with each other. A multilayer wiring board with a built-in passive component, wherein an intermediate layer containing at least one oxide selected from magnesium, zinc oxide and calcium oxide is interposed. 2. The multilayer wiring board with a built-in passive component according to claim 1, wherein the intermediate layer contains magnesium oxide and zinc oxide. 3. The multilayer wiring board with built-in passive components according to claim 1, wherein the intermediate layer contains 50 to 95% by weight of at least one oxide selected from magnesium oxide, zinc oxide and calcium oxide. 4. The multilayer wiring board with a built-in passive component according to claim 1, wherein said intermediate layer contains a sintering aid for an inorganic material constituting said functional layer. 5. The method according to claim 5, wherein the intermediate layer comprises the sintering aid in an amount of from 5 to 50.
The multilayer wiring board with a built-in passive component according to claim 4, wherein the weight of the multilayer wiring board is included. 6. The multilayer wiring board with built-in passive components according to claim 4, wherein the concentration of the sintering aid in the intermediate layer is higher on the functional layer side than on the substrate layer side. 7. The functional layer is a layer mainly composed of a Pb-based perovskite compound, and the sintering aid is at least one oxide selected from lead oxide, copper oxide, vanadium oxide and bismuth oxide. The multilayer wiring board with a built-in passive component according to claim 4. 8. The functional layer is a layer mainly composed of a Pb-based perovskite compound, and the intermediate layer contains 50 to 95% by weight of at least one oxide selected from magnesium oxide and zinc oxide, and lead oxide. And at least one oxide selected from copper oxide and 5 to 50% by weight, and the content of lead oxide in the intermediate layer is 40% by weight or less, and the content of copper oxide is 30% by weight. The multilayer wiring board with a built-in passive component according to claim 1, wherein: 9. The functional layer is a layer mainly composed of NiZn-based spinel ferrite or NiZnCu-based spinel ferrite, and the sintering aid is at least one oxide selected from copper oxide, vanadium oxide and silver oxide. The multilayer wiring board with a built-in passive component according to any one of claims 4 to 6. 10. The multilayer wiring board with a built-in passive component according to claim 1, wherein said intermediate layer contains at least one oxide selected from silicon oxide, aluminum oxide and boron oxide. 11. The multilayer wiring board with built-in passive components according to claim 10, wherein the intermediate layer contains 1 to 50% by weight of at least one oxide selected from silicon oxide, aluminum oxide and boron oxide. 12. The multilayer wiring board with built-in passive components according to claim 1, wherein said intermediate layer has a thickness of 5 to 30 μm. 13. A multilayer wiring board including at least one substrate layer which is an insulator mainly composed of a sintered body of an inorganic material,
A method for manufacturing a passive component built-in multilayer wiring board in which a passive component including a functional layer which is a dielectric, a magnetic material or a resistor mainly composed of a sintered body of an inorganic material is incorporated, wherein the substrate layer is not sintered. Forming a laminate including a green body and a green body of the functional layer, and firing the laminate, wherein in the step of forming the laminate, the green body of the substrate layer and At least one selected from magnesium oxide, zinc oxide and calcium oxide such that the green body of the functional layer and the green body of the substrate layer do not come into contact with the green body of the functional layer. A method for producing a multilayer wiring board with a built-in passive component, characterized by interposing an intermediate layer containing an oxide. 14. A step of laminating an outermost layer having a shrinkage ratio of 5% or less when performing the step of firing the laminate on at least one surface of the laminate before the step of firing the laminate. The method for manufacturing a multilayer wiring board with a built-in passive component according to claim 13, wherein a step of removing at least a part of the outermost layer is performed after the step of firing the laminate.