JP2000206696A - Resist substrate for x-ray exposure, its production, production of die using same and production of micro- parts using the die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably and tightly bond a resist layer to a metallic substrate layer by fixing the resist layer comprising a polymethyl methacrylate plate or sheet on the metallic substrate layer comprising a plating layer by way of a metallic middle layer. SOLUTION: This resist substrate 1 for X-ray exposure has a metallic substrate layer 2 comprising Ni, a middle layer 3 comprising Ni and a resist layer 4 comprising PMMA(polymethyl methacrylate). The, middle layer 3 is formed on the resist layer 4 by sputter vapor deposition and the metallic substrate layer 2 is formed by way of the middle layer 3 by electroplating using one of the substrate layer 2 and the middle layer 3 as an electrode. When electroplating is carried out at <=40 deg.C plating bath temperature, the warping and cracking of the metallic substrate layer 2 are inhibited even if the substrate layer 2 has a relatively large thickness and the resist substrate 1 for X-ray exposure is produced in a good yield. The adhesion of the resist layer 4 to the middle layer 3 is further improved by disposing a surface layer having fine ruggedness on the resist layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resist substrate for X-ray exposure, a method for manufacturing the same, a method for manufacturing a mold using the resist substrate, and a method for manufacturing a micro component using the mold.

[0002]

2. Description of the Related Art X-ray lithography using synchrotron radiation is called X-ray lithography.
It is positioned as an exposure technique that can transfer a very small fine pattern on an X-ray mask onto a resist layer with high accuracy by using a short wavelength of a line. The field of application of this X-ray lithography is a Si-LSI process technology for forming an element having a small dimension of about 0.2 μm or less, and a LIGA (Lithogr) for manufacturing a three-dimensional micromachine using a high aspect ratio.
aphie GalvanoformungAbformung: German) There are processes, etc., all of which are active in research and development.

The above LIGA process is described in, for example, MM-97-6 (1)
(Feb. 997), a processing method combining X-ray lithography, electroforming and molding. Exposure of X-rays from an SR (synchrotron radiation) optical device through an X-ray mask having a pattern of an absorber hardly transmitting X-rays on a thin film substrate made of a material that easily transmits X-rays Thus, polymethyl methacrylate (hereinafter referred to as PMM) on a resist substrate for X-ray exposure
A). A pattern is formed on the resist layer made of A).

Conventionally, as a method of manufacturing a resist substrate for X-ray exposure used in the LIGA process or the like,
As described in the above document MM-97-6, a syrup obtained by mixing PMMA and MMA (methyl methacrylate) is dropped on a substrate, and the PMMA and MMA are directly polymerized to form a resist layer made of PMMA. There are known a casting method for forming and a bonding method for bonding a PMMA sheet on a substrate with an adhesive.

[0005]

However, the resist substrate for X-ray exposure manufactured by the above-mentioned casting method has a nonuniform film thickness due to a change in volume due to polymerization, and has a warp or crack due to internal stress. There were problems such as insufficient adhesion between the layer and the substrate. On the other hand, a resist substrate for X-ray exposure by a conventional bonding method tends to generate a region where the resist layer and the substrate are not partially bonded to each other due to the incorporation of air bubbles into a gap between the substrate and the resist layer. Was. As a result, there has been a problem that the fine pattern formed through the steps of exposing and developing the resist layer falls down, and the fine pattern peels off from the substrate.

[0006]

According to the present invention, there is provided an X-ray exposure resist substrate in which a resist layer made of polymethyl methacrylate and a metal substrate layer are securely and firmly bonded to each other, and a method of manufacturing the same. The aim is to provide a method. Another object of the present invention is to provide a method of manufacturing a mold for manufacturing a mold for manufacturing a micro component using the resist substrate for X-ray exposure. Still another object of the present invention is to provide a method for manufacturing a micro component, which manufactures a micro component using the above-mentioned mold.

In the resist substrate for X-ray exposure according to the first aspect of the present invention, a resist layer composed of a polymethyl methacrylate plate or sheet is fixed in close contact with a metal substrate layer composed of a plating layer via a metal intermediate layer. It is characterized by having a structured structure. Here, the “plate” has a relatively large thickness,
For example, a sheet having a millimeter size is referred to, and a “sheet” has a relatively small thickness, for example, a sheet having a micron size.

According to a second aspect of the present invention, there is provided a method of manufacturing a resist substrate for X-ray exposure, comprising forming a metal intermediate layer on a resist layer comprising a polymethyl methacrylate plate or sheet by vacuum deposition. And forming a metal substrate layer on the intermediate layer by plating with an electrolytic plating bath having the above as one electrode.

That is, in the conventional manufacturing method, starting from a substrate, a resist layer is formed on the substrate (the casting method) or a resist layer formed in advance is bonded (the bonding method). On the other hand, in the present invention, by changing the idea, starting from a resist layer (using a sheet or a plate) made of polymethyl methacrylate, a metal substrate layer is formed on this resist layer via an intermediate layer by an electrolytic plating bath. Procedure.

According to a third aspect of the present invention, there is provided a method of manufacturing a resist substrate for X-ray exposure, comprising: forming a surface layer having fine irregularities on a surface of a resist layer comprising a plate or sheet of polymethyl methacrylate by ion irradiation; Forming a metal intermediate layer on the surface layer of the layer by deposition in a vacuum, and forming a metal substrate layer on the intermediate layer by plating with an electrolytic plating bath having the intermediate layer as one electrode. It is characterized by including.

A method of manufacturing a resist substrate for X-ray exposure according to claim 4 is characterized in that, in the method of claim 2 or 3, plating by the electrolytic plating bath is performed at a temperature of at least 40 ° C. or less. is there.

According to a fifth aspect of the present invention, there is provided a mold for forming a predetermined pattern on a resist layer of an X-ray exposure resist substrate manufactured by the manufacturing method according to any one of the second to fourth aspects via an X-ray mask. After exposure and development, the metal pattern layer is formed on the intermediate layer by forming a metal pattern layer by electrolytic plating on the window of this pattern, and subsequently removing the pattern of the resist layer. It is characterized by manufacturing a mold.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a micro component by filling a material of the micro component on a mold manufactured by the manufacturing method of the fifth aspect and transferring the shape of the metal pattern layer. It is characterized by manufacturing parts.

According to a seventh aspect of the present invention, in the method of the sixth aspect, the mold according to the fifth aspect has a metal pattern layer having a shape corresponding to a lattice shape. To manufacture a lattice-shaped micro component.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. The resist substrate for X-ray exposure according to the present embodiment is used for X-ray lithography or the like in a LIGA process for manufacturing a mold for manufacturing a micro component such as a micromachine. As shown in FIG. 1, the resist substrate 1 for X-ray exposure has a structure including a metal substrate layer 2 made of Ni, an intermediate layer 3 made of Ni, and a resist layer 4 made of PMMA. The intermediate layer 3 is formed by sputter deposition on the resist layer 4, and the metal substrate layer 2 is formed by electrolytic plating using the intermediate layer 3 as one electrode.

The thickness of the metal substrate layer 2 is, for example, 300 μm.
m, the thickness of the intermediate layer 3 is, for example, about 0.5 μm,
The thickness of the resist layer 4 can be, for example, about 200 μm. However, the thickness of each layer can be appropriately changed according to the size of a micro component to be manufactured using the resist substrate 1 for X-ray exposure. Further, the metal substrate layer 2 may be made of an electrolytic plating layer of a Ni alloy other than Ni, such as NiW or NiFe, or a metal other than Ni. Further, as the intermediate layer 3, another metal having a strong adhesion to PMMA, for example, an alloy such as Ti, Cr or NiCr may be used.

Hereinafter, a method of manufacturing the resist substrate 1 for X-ray exposure will be described. As shown in FIG.
For example, a PMMA sheet having a thickness of about 200 μm manufactured in advance is used. First, as shown in FIG. 3, the surface of the resist layer 4 is irradiated with Ar ions (called ion bombardment) to form a surface layer 4a having fine irregularities on the surface of the resist layer 4. Thereby, the adhesion of the intermediate layer 3 to the resist layer 4 in the next step can be surely and firmly made.

Subsequently, as shown in FIG. 4, an intermediate layer 3 made of Ni is formed on the surface layer 4a of the resist layer 4. This intermediate layer 3 is formed by applying Ar ions to a target made of Ni. By collision, Ni is sputter-deposited on the surface layer 4a at room temperature to form a film having a thickness of about 0.5 μm. The resist layer 4 and the intermediate layer 3
In order to further increase the adhesive strength to the surface layer, it is preferable that the formation of the surface layer 4a by ion bombardment and the sputter deposition of the intermediate layer 3 be performed continuously in the same vacuum apparatus.

After the formation of the intermediate layer 3, as shown in FIG.
The metal substrate layer 2 of Ni is formed on the surface of the
Nimmel aqueous solution (Ni (SO_ThreeNH_Two)_Two・ 4
H_TwoO), for example, 300 μm
It is formed so as to have a thickness of about. Figure 6 shows sulfamine
The process of electrolytic plating using an aqueous solution of niche acid is shown. anode
As the (+) Ni electrode, one made by electrolytic deposition
It is preferably used. In addition, the cathode (-) Ni electrode is used.
The intermediate layer of Ni formed on the resist layer 4
Use 3. Thereby, the cathode, that is, the intermediate layer 3 side
Then Ni⁺²The reaction of + 2e → Ni occurs and the intermediate layer 3
Then, the metal substrate layer 2 of Ni grows. On the other hand, on the anode side
Is Ni + (SO_ThreeNH_Two)_Two ^-2-2e → Ni⁺²+ (S
O_ThreeNH _Two)_Two ^-2Reaction will occur.

The present inventor has proposed that in the plating bath using the above-mentioned nimel sulfamate aqueous solution, the plating bath is plated at a temperature of 40 ° C. or lower, more preferably about 35 to 23 ° C. 2 has a relatively large thickness of about 300 μm or more, it is found that the X-ray exposure resist substrate 1 can be manufactured with a good yield while suppressing the warpage and cracking of the metal substrate layer 2. At a temperature of. On the other hand, when plating is performed at a high temperature exceeding 40 ° C., the internal stress is large, and the X-ray exposure resist substrate 1 may be easily warped or cracked.

In the present embodiment, as described above, the surface layer 4a having fine irregularities is provided on the resist layer 4 and the intermediate layer 3 is deposited on the surface layer 4a.
And the intermediate layer 3 have good adhesion. Further, since the metal substrate layer 2 is formed as a plating layer on the intermediate layer 3, the adhesion between the intermediate layer 3 and the metal substrate layer 2 is also improved. Therefore, the LI is formed on the resist layer 4 of the resist substrate 1 for X-ray exposure.
When a pattern is formed by a GA process or the like, even if the pattern is finer than the conventional one, it is difficult for the pattern to fall down on the metal substrate layer 2 or to be separated from the metal substrate layer 2, and the X-ray exposure resist Fine patterns can be formed on the substrate 1 with high yield.

When Ti, Cr or the like is used as the intermediate layer 3, the Ti, Cr or the like may be deposited on the surface layer 4a formed on the surface of the resist layer 4 by sputtering or the like as described above. . In particular, when Ti or Cr is used, P
There is an advantage that adhesion to the resist layer 4 made of MMA is good. When Ti, Cr, or the like is used for the intermediate layer 3, only the cathode (Ni (intermediate layer 3) in FIG. 6) is changed to Ti, Cr, or the like, and the cathode side in the electrolytic plating using the nimel sulfamate aqueous solution is performed. The reaction on the anode side is the same as described above (for example, when Ti is used for the intermediate layer 3, the metal substrate layer 2 made of Ni grows on the Ti).

The metal substrate layer 2 is made of NiFe or Ni.
When a Ni alloy such as W is used, in the electrolytic plating step, Fe or W is appropriately added to the aqueous solution of nimel sulfamate.
Or a solution or powder containing For example, when NiFe is used for the metal substrate layer 2, ferrous sulfamate (F
e (SO ₃ NH ₂ ) ₂ )
In an aqueous solution, ferrous sulfamate becomes Fe ⁺² + (SO ₃ N
By ionizing with H ₂ ) ₂ ^-2 , Fe grows on the intermediate layer 3 as the cathode while alloying with Ni by eutectoid. Also, for example,
If a powder of sodium tungstate (Na ₂ WO ₄ ) is mixed in an aqueous solution of nimel sulfamate, it is ionized with 2Na ₂ ⁺ + WO ₄ ^{-2 in the} aqueous solution, and WO is formed on the intermediate layer 3 as a cathode. It grows while alloying with Ni by eutectoid.

Next, a procedure for manufacturing a mold for manufacturing a lattice-shaped micro component using the resist substrate 1 for X-ray exposure will be described. As shown in FIG. 7, the resist substrate 1 for X-ray exposure is arranged upside down from FIG.
An X-ray mask 5 is arranged in parallel above the X-ray exposure resist substrate 1 at a predetermined interval. This X-ray mask 5
Is formed by forming a predetermined pattern, for example, a lattice-shaped pattern on the X-ray transmission film 5a by the X-ray non-transmission film 5b.

After that, after exposing the resist layer 4 of the resist substrate 1 for X-ray exposure through an X-ray mask 5 from an SR light device (not shown) and developing, as shown in FIG. The PMM corresponding to the pattern formed by the X-ray non-transmissive film 5b of the X-ray mask 5 with the portion removed.
A pattern 4a is formed. Here, PMM
The pattern 4a of A has a lattice shape.

As described above, since the thickness of the resist layer 4 is, for example, about 200 μm, the thickness of each pattern 4a is also about 200 μm, while the width of each pattern 4a is
For example, it is about 10 μm, and therefore, the aspect ratio is about 20. The pitch between the adjacent patterns 4a is, for example, about 110 μm, and the gap between the adjacent patterns 4a is about 100 μm.

Subsequently, as shown in FIG. 9, a metal pattern layer 6 made of Ni is formed in a gap between the adjacent patterns 4a by electrolytic plating so as to have the same thickness as that of the pattern 4a. Thereafter, when the pattern 4a of PMMA is removed by a solvent, a mold 7 having a lattice shape is formed as shown in FIGS. In FIG. 11, illustration of the intermediate layer 3 is omitted for simplicity. FIG.
As is clear from FIG. 1, the mold 7 is such that the gap between the metal pattern layers 6 has a lattice shape.

As described above, in the present embodiment, since the metal substrate layer 2 is formed by electrolytic plating, the adhesion between the metal substrate layer 2, the intermediate layer 3, and the resist layer 4 is improved.
Therefore, even if the aspect ratio of each pattern 4a is about 20 or more, problems such as falling down and peeling of the pattern 4a are unlikely to occur. Accordingly, the pattern 4a of PMMA having a larger aspect ratio than that of the related art can be formed with good reproducibility. Can be large.

Next, a procedure for manufacturing a lattice-shaped micro component using the mold 7 will be described. First, a release agent is applied on a metal plate (not shown) made of stainless steel or the like. Subsequently, an epoxy resin (not shown) is applied on the metal plate so as to have a thickness equal to or more than the thickness of the metal pattern layer 6 in the mold 7, for example, about 200 μm or more.

Thereafter, after the mold 7 of FIG. 11 is treated with a release agent, the mold 7 is held upside down from the state of FIG. To hold the metal substrate layer 2 parallel to the metal plate while keeping the top surface of each metal pattern layer 6 in contact with the metal plate, and wait until the epoxy resin solidifies. When the mold 7 and the metal plate are removed from the epoxy resin after the solidification of the epoxy resin, a lattice-shaped micro component 8 made of the epoxy resin as shown in FIG. 12 is completed.

The size of the micro component 8 is 200 μm in thickness.
m, the width of the lattice frame is about 10 μm, and therefore, the aspect ratio is about 20, and the lattice pitch is about 110 μm. The lattice window is about 100μm × 100μm,
The micro component 8 is used, for example, as a filter for removing fine particles having an outer dimension of about 100 μm or more.

The filter formed by using the mold 7 of the present embodiment can be manufactured with an aperture ratio of 82.6%, which is larger than the conventional one. This is because the micro component 8 has a large aspect ratio and therefore a large thickness of the grid, so that the mechanical strength is secured even if the window of the grid is widened. Further, the micro component 8 has a large mechanical strength,
Since the filter can be used even under pressure, the filter efficiency can be greatly improved by filtering while filtering the fine particles (liquid such as water and blood, gas, powder, etc.) in the filter transmission direction.

The thickness of the resist layer 4 of the resist substrate 1 for X-ray exposure can be changed according to the thickness of the lattice-shaped micro component 8 manufactured using the mold 7. The preferable thickness of the micro component 8 changes according to the size of the lattice window. For example, when the lattice window is about 5 μm × 5 μm, the thickness of the micro component 8, that is, the resist layer 4
Is preferably about 20 μm. Further, the preferred thickness of the metal substrate layer 2 changes according to the thickness of the resist layer 4,
For example, when the thickness of the resist layer 4 is about 20 μm, the preferable thickness of the metal substrate layer 2 is about 200 μm.

In the above embodiment, a case has been described in which a mold 7 corresponding to a lattice shape is manufactured from the resist substrate 1 for X-ray exposure, and a lattice-shaped micro component 8 is manufactured using the mold 7. However, the shape of the micro component 8 may be any shape other than the lattice shape, and the shape of the metal pattern layer 6 of the mold 7 may be changed according to the shape of the micro component 8.

[0035]

According to a first aspect of the present invention, there is provided a resist substrate for X-ray exposure, wherein a resist layer comprising a plate or sheet of polymethyl methacrylate (PMMA) comprises a metal substrate layer comprising a plating layer via a metal intermediate layer. Since the structure is tightly fixed, the adhesion between the resist layer, the intermediate layer and the metal substrate layer is good. As a result, when a mold for manufacturing micro parts or the like is manufactured by forming a pattern on the resist layer of the resist substrate for X-ray exposure by a LIGA process or the like, the PMMA pattern is finer than before. However, since the problem of the pattern falling down or peeling off from the metal substrate layer hardly occurs, it is possible to provide a resist substrate for X-ray exposure capable of producing a pattern with a high aspect ratio with good reproducibility.

Even if the surface area of the resist substrate for X-ray exposure is made larger than before, the adhesion between the metal substrate layer, the intermediate layer and the resist layer can be ensured, so that a mold having a larger area can be manufactured. By using such a large-area mold, it is also possible to manufacture a micro component or the like having a larger area than before.

According to a second aspect of the present invention, there is provided a method of manufacturing a resist substrate for X-ray exposure, comprising forming a metal intermediate layer on a resist layer comprising a plate or sheet of polymethyl methacrylate by vacuum deposition. Forming a metal substrate layer on the intermediate layer by plating with an electrolytic plating bath using the intermediate layer as one electrode, the resist substrate for X-ray exposure manufactured by such a procedure includes a metal substrate layer, The adhesiveness between the intermediate layer and the resist layer becomes good.

Further, even if the surface area of the resist substrate for X-ray exposure is made larger than before, the adhesion between the metal substrate layer, the intermediate layer and the resist layer can be ensured. And a resist substrate for X-ray exposure that can be used for the manufacture of the mold for the present invention. Further, by automating the manufacturing process, it is possible to greatly reduce labor, and it is possible to supply a high-yield resist substrate for X-ray exposure at low cost.

The method of manufacturing a resist substrate for X-ray exposure according to claim 3 of the present invention comprises the steps of forming a surface layer having fine irregularities by ion irradiation on the surface of a resist layer comprising a polymethyl methacrylate plate or sheet. Forming a metal intermediate layer on the surface layer of the resist layer by deposition in a vacuum, and forming a metal substrate layer on the intermediate layer by plating with an electrolytic plating bath using the intermediate layer as one electrode. And the step of forming fine irregularities on the surface of the resist layer in advance, and then applying the intermediate layer. Therefore, the adhesion between the resist layer and the intermediate layer can be further improved.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a resist substrate for X-ray exposure according to the second or third aspect, wherein the plating by the electrolytic plating bath is performed at a temperature of at least 40 ° C. or less. Thus, when plating is performed at a relatively low temperature, the internal stress of the metal substrate layer becomes smaller than when plating is performed at a temperature exceeding 40 ° C., and the resist substrate for X-ray exposure is warped or cracked. Is less likely to occur,
There is an advantage that the yield can be further improved.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a mold, comprising forming a predetermined pattern on a resist layer of an X-ray exposure resist substrate manufactured by the manufacturing method according to any one of the second to fourth aspects through an X-ray mask. After exposure and development, the metal pattern layer is formed on the intermediate layer by forming a metal pattern layer by electrolytic plating on the window of this pattern, and subsequently removing the pattern of the resist layer. It is used to manufacture molds.

As described above, LIG is applied to the resist layer.
When a mold is manufactured by forming a pattern by the A process or the like, even if the pattern is finer than before, the collapse and peeling of the pattern are reduced, and as a result, a metal having a fine pattern with a high aspect ratio is formed. The mold can be manufactured with good reproducibility. Further, the automation of the manufacturing process allows the above-mentioned mold to be manufactured at low cost. Furthermore, since the pattern collapse and peeling are reduced,
A mold having a larger area than before can be manufactured.

According to a sixth aspect of the invention, there is provided a method of manufacturing a micro component, comprising filling a material of the micro component on a mold manufactured by the manufacturing method of the fifth aspect and transferring the shape of the metal pattern layer. As described above, since the present mold has little pattern collapse or peeling, the use of such a mold makes it possible to manufacture high-precision micro parts at low cost. . Also,
According to the present manufacturing method with less pattern collapse and peeling, it is possible to manufacture a metal mold having a smaller aspect ratio and a higher aspect ratio than before, so that a micro component having a small aspect ratio and a large aspect ratio can be manufactured. Further, according to the present invention, it is possible to manufacture a mold having a larger area than before, so that a micro component having a larger area than before can be manufactured.

According to a seventh aspect of the present invention, in the method of the sixth aspect, the mold according to the fifth aspect has a metal pattern layer having a shape corresponding to a lattice shape. Therefore, a micropart having a lattice shape that can be used as a filter for fine particles or the like can be manufactured with good reproducibility and at a low cost. Further, since the aspect ratio of the lattice-shaped micro component can be increased, the mechanical strength of the micro component increases accordingly. Therefore, for example, when the filter is used as a filter for fine particles, the filter can be used even under pressure, thereby making it possible to further improve the filter function.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing a resist substrate for X-ray exposure according to an embodiment of the present invention.

FIG. 2 is an explanatory sectional view showing a procedure for manufacturing the resist substrate for X-ray exposure.

FIG. 3 is an explanatory sectional view showing a subsequent manufacturing procedure of the resist substrate for X-ray exposure.

FIG. 4 is an explanatory sectional view showing a subsequent manufacturing procedure of the resist substrate for X-ray exposure.

FIG. 5 is an explanatory sectional view showing a subsequent manufacturing procedure of the resist substrate for X-ray exposure.

FIG. 6 is an explanatory view showing a step of electrolytic plating in an aqueous nimel sulfamate solution.

FIG. 7 is an explanatory sectional view showing a procedure for manufacturing a mold from the resist substrate for X-ray exposure.

FIG. 8 is an explanatory sectional view showing a subsequent procedure for manufacturing a mold from the resist substrate for X-ray exposure.

FIG. 9 is an explanatory sectional view showing a subsequent procedure for manufacturing a mold from the resist substrate for X-ray exposure.

FIG. 10 is an explanatory sectional view showing a subsequent procedure for manufacturing a mold from the resist substrate for X-ray exposure.

FIG. 11 is a schematic perspective view showing the mold.

FIG. 12 is a schematic perspective view showing a lattice-shaped micro component manufactured using the above-mentioned mold.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 resist substrate for X-ray exposure 2 metal substrate layer 3 intermediate layer 4 resist layer 5 X-ray mask 6 metal pattern layer 7 mold 8 micro component

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Susumu Sugiyama 1-1-1 Nojihigashi, Kusatsu-shi, Shiga Ritsumeikan University Biwako-Kusatsu Campus Faculty of Science and Technology F-term (reference) DA40 FA44 2H097 CA15 FA09 FA10 4K024 AA03 AA14 AB01 AB02 AB03 AB08 AB15 BA01 BA12 BB07 BB28 CA04 DA10 FA05 GA01

Claims (7)

[Claims] An X-ray exposure apparatus characterized in that a resist layer composed of a polymethyl methacrylate plate or sheet is fixed in close contact with a metal substrate layer composed of a plating layer via a metal intermediate layer. Resist substrate. 2. A step of forming an intermediate layer of metal on a resist layer composed of a polymethyl methacrylate plate or sheet by applying the intermediate layer in a vacuum and plating the intermediate layer by using an electrolytic plating bath having one electrode as an electrode. Forming a metal substrate layer on the layer. A method for manufacturing a resist substrate for X-ray exposure. 3. A step of forming a surface layer having fine irregularities on the surface of a resist layer comprising a plate or sheet of polymethyl methacrylate by ion irradiation, and forming an intermediate metal layer on the surface layer of the resist layer in a vacuum. And a step of forming a metal substrate layer on the intermediate layer by plating with an electrolytic plating bath using the intermediate layer as one electrode. Production method. 4. The method for producing a resist substrate for X-ray exposure according to claim 2, wherein plating by said electrolytic plating bath is performed at a temperature of at least 40 ° C. or lower. 5. A pattern formed on a resist layer of an X-ray exposure resist substrate manufactured by the manufacturing method according to claim 2, which is exposed to a predetermined pattern via an X-ray mask and developed. Forming a metal pattern layer by electrolytic plating on the window part, and subsequently removing the pattern of the resist layer, thereby manufacturing a mold in which the metal pattern layer is laminated on the intermediate layer. Mold manufacturing method. 6. A micro component is manufactured by filling a material of the micro component on a mold manufactured by the manufacturing method according to claim 5, and transferring the shape of the metal pattern layer. Manufacturing method of micro parts. 7. A mold according to claim 5, wherein the mold has a metal pattern layer having a shape corresponding to the lattice shape, and the mold is used to manufacture a lattice-shaped micro component. 7. The method for producing a micro component according to item 6.