JP2000205850A - Semiconductor element positioning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device which can accurately position a semiconductor element without damaging by allowing an angular deviation though a simple constitution device. SOLUTION: A positioning device positions a semiconductor element (b) which is formed in a square shape in a top view to a prescribed position. The device is provided with a holding base 20 which holds an appropriate member (a) for placing the element (b) and a pair of pawls 18 and 19 which are constituted in such a way that the pawls 18 and 19 are brought closer to each other and separated from each other above the member (a) held by the base 20. On the front face of each pawl 18 and 19, recessed corners matching the pair of corner sections on the diagonal line of the element (b) placed on the member (a) are formed and straight line sections are respectively formed on both sides of the recessed corner section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an LED (light)
emitting diode (light emitting diode)
The present invention relates to an apparatus for positioning a semiconductor element such as a chip at a predetermined position while being mounted on an appropriate member such as a stage or a substrate of an inspection apparatus.

[0002]

2. Description of the Related Art Semiconductor devices such as LED chips, for example,
Before shipment, a needle-shaped probe is pressed against a terminal on the surface of the semiconductor element to conduct electricity to emit light, and an inspection for measuring luminous intensity and output is performed. Various electronic components are manufactured by die bonding these semiconductor elements to a lead frame, a substrate, or the like using an Ag paste or the like. When performing such inspections and die bonding, in order to maintain the current and the accuracy of the inspection,
It is necessary to position the semiconductor element with respect to an appropriate member such as a stage or a substrate of an inspection device with high accuracy.

Conventionally, such positioning of a semiconductor element has been performed by:
This is performed as in the following (1) to (3). (1) Positioning Using Image Processing To describe an example in which a semiconductor element is positioned in an inspection apparatus, first, an operator places a semiconductor element on a positioning stage while adjusting the position and angle, and places the semiconductor element on the positioning stage. The position of the semiconductor device is checked by photographing the semiconductor device with a CCD camera, and the position shift is corrected by image processing. Then, the semiconductor element is held by a vacuum suction jig (collet), and the semiconductor element is transported to an inspection stage. In the inspection stage, the probe is pressed against the terminal on the surface of the semiconductor element to emit electricity, and the luminous intensity and the output are measured and inspected. After the inspection, the semiconductor element is transferred to the next stage or the like by the suction collet on the unloading side.

(2) Positioning using nails shown in FIG. 9 That is, as shown in FIG. 9, a semiconductor element b is placed on a member a such as an inspection stage or a substrate, and is positioned on a diagonal line of the semiconductor element b. In this method, a pair of corners b ', b' is sandwiched from both sides by claws 50, 50 arranged opposite to each other for positioning.

(3) Positioning using nails shown in FIG. 10 That is, as shown in FIG. 10, a corner-shaped holder 60 is arranged on the back of the semiconductor element b, and the semiconductor element b is held by two nails 61 and 62. This is a method of positioning by pressing against the presser 60.

[0006]

However, the positioning of these (1) to (3) has the following problems.
That is, in the positioning of (1), a shift due to a mechanical error or the like easily occurs when the semiconductor element is held by the collet or during transport. In addition, this positioning is complicated in operation, and it is not possible to correct the displacement after the transfer. Also, since image processing is used,
Position shift occurs due to the accuracy of the image processing apparatus itself and the accuracy of the collet to be sucked. Further, when performing image processing, it is difficult to accurately recognize the shape of the semiconductor element because there is almost no difference in color between the background and the semiconductor element, and since the electrodes are round, it is not possible to specify the angle shift of the semiconductor element. .

In the positioning of (2), it is difficult to perform positioning when there is an angle shift, and an accurate operation is required so that the angle shift does not occur when the semiconductor element is mounted. In both of the positioning of (2) and the positioning of (3), there is a concern that the semiconductor element may be damaged when the semiconductor element whose angle is shifted is pushed. This is caused by pinching between the nails or between the nail and the presser, and is caused by pushing the semiconductor element too much because the nail is harder.
Further, according to these positionings, since the shape of the nail is fixed, it is impossible to cope with a change in the size of the semiconductor element.

An object of the present invention is to provide a device which can accurately position a semiconductor element while having a simple structure, and can position the semiconductor element without damage by allowing an angle shift.

[0009]

Means for Solving the Problems In order to achieve this object, the present inventors have conducted the following studies on the above problems (1) to (3). That is, the method of indirectly confirming the position by image processing or the like and then picking up the semiconductor element is stopped, and means for positioning the semiconductor element at a predetermined position regardless of the position are examined. In addition, actually LED
The chip was positioned by pressing it, and the shape of the tip of the nail was changed in various ways to simulate the behavior of the LED chip. At that time, we tried to make the shape of the nail as simple as possible in consideration of the malfunction of the semiconductor element, the change in the size of the semiconductor element, the variation in height, the manufacturing cost, etc. . In addition, the study was basically conducted by simulation of drawing a picture by CAD.

According to a first aspect of the present invention, there is provided a semiconductor device positioning device for positioning a semiconductor element formed in a rectangular shape in a plan view at a predetermined position. A holder for holding appropriate members,
A pair of claws are provided so as to be relatively movable toward and away from each other above the members held by the holding table, and are located on the front surface of each of the claws on a diagonal line of the semiconductor element mounted on the member. The present invention is characterized in that a reentrant angle corresponding to a pair of corners and straight portions disposed on both sides of the reentrant angle are formed.

In the positioning device according to the first aspect, first, an appropriate member such as a stage or a substrate of an inspection device is held by the holding table. Then, the semiconductor element is mounted on the member held by the holding table. In this case, the claws are moved apart in advance.

Next, the claws are moved close to each other. Then
The semiconductor element is appropriately rotated by being pushed on the front surface of the nail, and a pair of corners located on a diagonal line of the semiconductor element respectively correspond to the concave angles formed on the front surface of the nail, and further disposed on both sides of the concave angle. The straight portions thus formed adhere to the side surfaces of the semiconductor element, and the semiconductor element is positioned at a predetermined position on the member.

[0013] In the positioning device of the first aspect, as described in the second aspect, the length of the linear portion is longer than a length of a rectangular piece indicated by the outer periphery of the semiconductor element in a plan view. preferable. By doing so, the straight portion on the front surface of the nail can be pressed in close contact with the entire length of the side surface of the semiconductor element, reducing the risk of damage to the semiconductor element and widely correcting the positioning of the semiconductor element placed on the member. Can be accurately positioned.

According to a third aspect of the present invention, when the semiconductor element is positioned between the pair of claws, a stopper for terminating the relative movement of the claws may be provided. By doing so, it is possible to prevent excessive pushing between the claws, and it is possible to more reliably prevent damage to the semiconductor element.

Further, as described in claim 4, the semiconductor element mounted on the member is, for example, an LED chip or the like, and has a small rectangular shape of 300 to 500 μm square in plan view.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a positioning device 1 according to an embodiment of the present invention, and FIG. 2 is a plan view of the same positioning device 1.

A pair of guides 11, 11 are provided on the upper surface of the support plate 10, and a pair of frames 12, 13 slidable along the guides 11, 11 are provided. Hook-shaped columns 15, 16 formed so as to bend inwardly from each other are fixed to the frames 12, 13, respectively. In addition, claws 18 and claws 19 are attached to the tips of the struts 15 and 16, and the claws 18 and claws 19 are arranged so as to face each other.

Between the pair of guides 11 provided on the upper surface of the support plate 10, there is provided a holding table 20 for holding an appropriate member a such as, for example, a stage or a substrate of an inspection apparatus. When the member a is held on the holding base 20, the claw 18 and the claw 19 are positioned above the member a.

The bearing 2 is located above the center of the support plate 10.
A rotation shaft 25 rotatably supported by 3, 24 is provided. A damper 27 is provided at one end of the rotating shaft 25.
A drive shaft 29 of a motor 28 having a rotation shaft 25 is connected via a coupling 30, and the rotation of the rotation shaft 25
Rotates forward and backward. The motor 28 is composed of a servo motor, and can control the amount of rotation.

On the peripheral surface of the rotating shaft 25, screw portions 35 and 36 which are opposite to each other are formed, and the rotating shaft 25 penetrates the support post 15 at the screw portion 35 and the support post 16 at the screw portion 36. are doing. A ball nut 38 screwed to the screw portion 35 is fixed to the support 15, and a ball nut 39 screwed to the screw portion 36 is fixed to the support 16. Thus, the support 15 and the support 16 are moved in the opposite directions along the guide 11 by the forward and reverse rotation operation of the motor 28, and the claws 18 and 19 at the tips of the supports 15 and 16 approach and separate from each other. It has become. The holding base 20 has a hole (not shown) sufficient to allow the rotation shaft 25 to pass therethrough.

As will be described later, a semiconductor element b is mounted on the member a held by the holding table 20. The semiconductor element b is, for example, an LED chip and has a shape of 300 mm in plan view. It is in the form of a small square of about 500 μm square.

FIG. 3 is an enlarged perspective view of the tip of the claw 18. The tip of the claw 18 has a shape obtained by removing substantially the upper half thereof, and a concave angle 40 is formed at the center of the front surface of the claw 18 (the inner surface facing the claw 19). The angle of the reentrant angle 40 is equal to the corner of the semiconductor element b which is rectangular in plan view, and is 90 °. Straight portions 41, 41 are formed on both sides of the reentrant angle 40, respectively. The length of each of the straight portions 41 is equal to the length of a square (300 to 50) indicated by the outer periphery of the semiconductor element b in plan view.
0 μm).

FIG. 4 is an enlarged perspective view of the tip of the nail 19, and FIG. 5 is an enlarged perspective view of the tip of the nail 19 as viewed from below. The tip of the claw 19 has a shape in which the lower half is cut off, and a concave angle 45 is formed at the center of the front surface of the claw 19 (the inner side surface facing the claw 18).
The angle of the reentrant angle 45 is also equal to the corner of the semiconductor element b which is rectangular in plan view, and is 90 °. The length of the straight portions 46, 46 formed on both sides of the reentrant angle 45 is sufficiently longer than the length of one square (300 to 500 μm) indicated by the outer periphery of the semiconductor element b in plan view.

As shown in FIG. 5, on the lower surface of the claw 19, a pair of stopper surfaces 47, 47 formed from a position slightly forward of the center of the reentrant angle 45 are provided. The angle between these stopper surfaces 47, 47 is also 90 °, and as will be described later, when the claws 18 and 19 are brought closer to each other, the stopper surfaces 47, 47
Abut on the straight portions 41, 41 formed on both sides of the reentrant angle 40 on the front surface of the claw 18, respectively, to stop the movement of the claw 18 and the claw 19.

In the positioning device 1 constructed as described above, first, the holding member 20 holds an appropriate member a such as a stage or a substrate of an inspection device.
Then, the semiconductor element b is placed on the member a held by the holding table 20. When the semiconductor element b is mounted as described above, the support 1 is previously operated by operating the motor 28.
5 and the support 16 are moved, and the claw 1 at the end of the support 15, 16 is moved.
By separating the claws 8 and the claws 19 from each other, a sufficient space is formed between the front surface of the claws 18 and the front surface of the claws 19, as shown in FIG. The semiconductor element b is mounted thereon.

Next, the operation of the motor 28 causes the support 15 to move.
And the support 16 are moved, and the claws 18 at the tips of the supports 15 and 16 are moved.
And the claws 19 approach each other. In this case, as shown in FIG. 3, the tip of the claw 18 has a shape in which almost the upper half has been cut off, and as shown in FIG. 4, the tip of the claw 19 has a shape in which the lower half has been cut out. Since the tip of the nail 18 does not collide with the tip of the nail 19, the nail 1
8 moves so that the tip of 8 enters under the tip of the nail 19. While the claws 18 and the claws 19 are approaching each other, the semiconductor element b is appropriately rotated on the member a by being pushed on the front surface of the claws 18 and the claws 19,
The semiconductor element b is gradually positioned at a predetermined position on the member a (for example, at the center of the member a).

In this case, as described above, the linear portions 41, 41 on the front surface of the claw 18 and the linear portions 46, 46 on the front surface of the claw 19, as described above.
Is sufficiently longer than the length of a rectangular piece (300 to 500 μm) indicated by the outer periphery of the semiconductor element b in plan view, so that the side surface of the semiconductor element b can be pushed over the entire length, There is little fear of damaging the element b. In addition, the position shift of the semiconductor element b mounted on the member a can be widely tolerated, and accurate positioning can be performed.

Then, as shown in FIG. 7, the positioning is completed by sandwiching the semiconductor element b from both sides between the front surface of the nail 18 and the front surface of the nail 19. When the positioning is completed in this manner, a pair of corners located on a diagonal line of the semiconductor element b is formed with the concave corner 40 formed on the front surface of the nail 18 and the nail 1.
9 correspond to the concave angles 45 formed on the front surface of the
8, the straight portions 41, 41 on the front and the straight portions 46 on the front of the claw 19,
46 are in close contact with the side surfaces of the semiconductor element b, respectively, and can wrap the entire side surface of the semiconductor element b from all sides.

When the positioning is completed as described above, the stopper surfaces 47, 47 provided on the lower surface of the claw 19 described above with reference to FIG.
To stop the movement of the claws 18 and 19, it is possible to prevent the claws 18 and 19 from being excessively pushed, and to more reliably prevent the semiconductor element b from being damaged.

Next, the operation of the motor 28 causes the support 15 to move.
Then, the support 16 is moved, and the claws 18 and 19 are separated again as shown in FIG. In this way, for example, inspection is performed by bringing a prober into contact with the semiconductor element b positioned at a predetermined position on the member a and suctioned by the suction mechanism described above.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment. For example, the positioning device of the present invention can be applied not only to the LED chip but also to the positioning of another semiconductor element b. Further, when the size of the semiconductor element b is changed, the motor 28
The amount of operation is controlled by the number of pulses, and the nails 18 and
It is possible to stop the movement of 19 and set so as not to damage the semiconductor element b. Also, by appropriately changing the height of the claws 18 and 19 and the moving speed of the claws 18 and 19,
The height variation of the semiconductor element b can be coped with, and the semiconductor element b can be prevented from falling down at the time of positioning. The number of pulses can be finely set by using an AC servomotor for the motor 28, and the movement pitch of the claws 18 and 19 (rotation axis 2
(How many millimeters advance per rotation of 5) should be selected as fine as possible. Then, by setting the number of pulses most suitable for an arbitrary chip size, it is possible to avoid excessive pressing of the semiconductor element b. In addition to the present invention, in addition to positioning on the stage of the inspection apparatus,
For example, the present invention can also be applied to positioning when a semiconductor element b is die-bonded on a substrate.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A positioning device of the present invention is actually manufactured and
The LED chip was positioned on the inspection stage of the inspection device for measuring the luminous intensity and output of the ED chip. The required positioning accuracy is such that the displacement between the needle (probe) and the center of the tip is up to ± 25 μm.
It was reproducible at 023 μm, and the required positioning accuracy was sufficiently satisfied. In addition, positioning was able to be performed without any problem even for angular deviation. Furthermore, even if the type of LED chip changes,
It was able to cope with the current six sizes without any problems.

[0033]

According to the first to fourth aspects of the present invention, it is possible to position a semiconductor element with high accuracy with respect to an appropriate member such as a stage or a substrate of an inspection apparatus. In addition, the semiconductor device can be positioned without damage by permitting an angle shift while the device configuration is simple.

[Brief description of the drawings]

FIG. 1 is a front view of a positioning device according to an embodiment of the present invention.

FIG. 2 is a plan view of the positioning device according to the embodiment of the present invention.

FIG. 3 is an enlarged perspective view showing a tip of a nail.

FIG. 4 is an enlarged perspective view showing a tip of a nail.

FIG. 5 is an enlarged perspective view showing the tip of the nail as viewed from below.

FIG. 6 is an explanatory diagram of a state where a semiconductor element is mounted on a member in a space formed between claws.

FIG. 7 is an explanatory diagram of a state where positioning is completed by sandwiching a semiconductor element between claws from both sides.

FIG. 8 is an explanatory diagram of a state in which claws are separated from each other after positioning is completed.

FIG. 9 is an explanatory diagram of a conventional technique.

FIG. 10 is an explanatory diagram of another conventional technique.

[Explanation of symbols]

 Reference Signs List a member b semiconductor element 1 positioning device 10 support plate 11 guide 11 12, 13 frame 15, 16 support column 18, 19 claw 20 holding table 20 23, 24 bearing 25 rotation axis 27 damper 28 motor 29 drive shaft 30 coupling 35, 36 Screw part 38, 39 Ball nut 40 Concave angle 41 Linear part 45 Concave angle 46 Linear part 47 Stopper surface

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F069 AA12 BB13 CC06 DD12 DD25 GG01 JJ04 MM01 MM17 MM31 PP02 5F047 CA08 FA17

Claims (4)

[Claims] An apparatus for positioning a semiconductor element formed in a rectangular shape in a plan view at a predetermined position, comprising: a holding table for holding an appropriate member for mounting the semiconductor element; and a holding table for holding the member. Relatively close above the
A pair of pawls configured to be movable apart from each other is provided. On the front surface of each pawl, a concave angle corresponding to a pair of corners located on a diagonal line of the semiconductor element mounted on the member, and both sides sandwiching the concave angle A linear device arranged on a semiconductor device is formed. 2. The semiconductor device positioning device according to claim 1, wherein the length of the linear portion is longer than a length of a rectangular piece indicated by an outer periphery of the semiconductor device in plan view. 3. The semiconductor device according to claim 1, further comprising a stopper for terminating relative movement between the claws when the semiconductor element is positioned between the pair of claws. Device positioning device. 4. The apparatus according to claim 1, wherein the semiconductor element is an LED chip.