JP2000203052A - Production of board coated with liquid - Google Patents

Abstract

PROBLEM TO BE SOLVED: To coat one side of a board even with a low viscosity liquid by providing means for blocking leakage of the liquid to the opposite side when a board having a through hole or a through groove is coated with a liquid. SOLUTION: A board 1 having a through hole 1a is laminated on the side opposite to the coating side with a leakage blocking member, i.e., an adhesive film 2. A liquid 3 is applied to the coating side of the board 1 and dried before stripping the adhesive film 2. Consequently, the liquid 3 can be applied to the coating surface while blocking leakage to the rear surface. Any board may be employed including Si board, various metal board and resin board and a significant effect can be attained when a thin layer member is employed. A thermally stripping or UV-stripping type adhesive film is preferably employed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid-coated substrate, and more particularly to a method of manufacturing a liquid-coated substrate having a through hole or a through groove.

[0002]

2. Description of the Related Art A process for applying a liquid to a substrate is common, and an extremely large number of processes have been put to practical use. For example, surface modification in surface treatment, application of a resist in a semiconductor manufacturing process, application of a thin film adhesive, and the like can be mentioned. Generally, a spin coater is used for these coatings. However, when applying a liquid to a substrate having one or a plurality of through-holes or through-grooves, a general spin coater has a problem that the liquid flows through the through-holes or through-grooves to the back surface opposite to the application surface.

[0003] In view of this, transfer is performed on one side by a roll coater, or by using a screen printing or the like to selectively remove the holes and apply the coating. For example, in the case of the roll coater method, as shown in FIG. 6, the coating liquid 103 is dropped on the roller 104 while the substrate 101 having the through hole 101 a is being conveyed by the conveyance stand 102, and the thickness is regulated by the slit 105. After that, the transfer liquid 106 is transferred to the transfer roller 106, and the coating liquid 103 is selectively applied to the substrate 101 by the transfer roller 106.

When screen printing is used,
As shown in FIG. 7A, the substrate 101 was placed and fixed on a fixing table 107, and a screen 108 having an opening 108 a corresponding to an application area was placed on the substrate 101 and placed on the screen 108. Apply squeegee 109 with application liquid 103
After applying the coating liquid to the coating area coating on the substrate 101 through the opening 108a, the screen 108 is removed as shown in FIG.
03 is selectively applied.

[0005]

However, these coating methods use means such as transfer and printing.
The viscosity of the application liquid must be increased, and a low-viscosity liquid cannot be applied. This is limited by the type and viscosity of the liquid.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a liquid-coated substrate that can apply a low-viscosity liquid to one surface of the substrate.

[0007]

According to a first aspect of the present invention, there is provided a method of manufacturing a liquid-coated substrate, comprising applying a liquid to one side of a substrate having one or more through holes or through grooves and drying the liquid. In the method for manufacturing a liquid-coated substrate according to the above aspect, when the liquid is applied to the substrate, a wraparound preventing means for preventing the liquid from wrapping around on the back surface opposite to the application surface of the substrate is used.

According to a second aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to the first aspect, an adhesive film that can be attached to the back surface of the substrate is used as the wraparound means. .

According to a third aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to the second aspect, the adhesive film is a heat-peelable film whose adhesiveness is reduced or lost by heating. There was a certain configuration.

According to a fourth aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to the second aspect, the adhesive film is an ultraviolet release film which is cured by irradiating ultraviolet rays.

According to a fifth aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to the third aspect, the peeling temperature of the thermally peelable film is equal to or lower than the temperature used in the process.

According to a sixth aspect of the present invention, in the method of manufacturing a liquid coated substrate according to any one of the first to fifth aspects, the substrate is a thin layer member.

According to a seventh aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to any one of the first to sixth aspects, the thickness of the substrate is within 10 to 200 μm.

According to an eighth aspect of the present invention, in the method for manufacturing a liquid coated substrate according to any one of the first to seventh aspects, the substrate is a flow path member for forming a flow path of an ink jet head. And

According to a ninth aspect of the present invention, in the method of the eighth aspect, the flow path member is a member including one or a plurality of nozzles.

[0016]

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, the outline of the present invention will be described. In the present invention, when a liquid is applied to one surface of a substrate having a clear through hole or through groove, the liquid flows around the back surface opposite to the application surface to which the liquid is applied. Use blocking means.

The means for preventing the sneaking is made of a resin, a film or the like, and seals the through holes and the through grooves so as to suppress the liquid from sneaking to the back surface through the through holes and the through grooves. As the sealing material used for the wraparound prevention used in the present invention, a material having adhesiveness is preferable in order to enhance the sealing effect.

As such a material, an adhesive or a sticky film can be considered.
When present on the entire surface, a pressure-sensitive adhesive film that can easily cover the entire surface is preferable from the viewpoint of workability. Examples of such a film include an ELEP holder series (trade name) manufactured by Nitto Denko Corporation and supplied for transporting semiconductors and fixing during dicing.

Further, it is preferable that the sealing material has high peelability (removability) as another important characteristic.
After applying and drying the liquid, the sealing material needs to be promptly peeled and removed. At this time, depending on the substrate, if there is a residue on the back surface, a problem may occur. For example,
When the back surface of the substrate is subjected to a hydrophilic treatment and the holes (holes) are sealed from the back surface, and then the front surface is selectively subjected to a hydrophobic treatment. If there is any residue remaining when the sealing material is removed, the hydrophilicity of the back surface is significantly impaired. Become.

Therefore, as the adhesive film, a heat-peelable film or an ultraviolet-peelable film is preferably used. If a heat-peelable type is used, the adhesive strength of which is reduced by heating as an adhesive, by applying the liquid and then heating, the adhesive strength of the adhesive tape for sealing on the back surface will be reduced, and it will be easy to adhere without sticking Can be peeled off. Further, at this time, since there is no generation of stress as would occur when a normal adhesive tape is peeled off, there is no possibility of damaging the coated substrate. As such a film, for example, Riba Alpha (trade name) manufactured by Nitto Denko Corporation
Can be mentioned.

Although the peeling temperature of the heat-releasing film is variously commercially available, considering the simplification of the process and the improvement of the productivity, the peeling temperature is lower than the temperature used in the process, specifically, The temperature is desirably equal to or lower than the temperature of the drying step for drying the coating liquid. By setting the peeling temperature as described above, the thermal release film can be simultaneously peeled off in the in-process heating step, and there is no need to set a heating step for peeling.

Further, if an ultraviolet-peeling type is used as the adhesive film, it can be irradiated with ultraviolet rays,
The adhesive cures and can be easily peeled off, and the same effect can be obtained. As the ultraviolet peeling type, dicing tape UE of the above ELEP holder series is used.
(Product name).

The material of the substrate manufactured by applying the present invention is not particularly limited, such as Si, various metals, and resins. However, a very large effect can be obtained when the substrate is a thin layer member. The thin-layered member has no rigidity of its own, and since it has many through-holes and through-grooves, has low strength and is very liable to be deformed or damaged. If a heat-peelable film or an ultraviolet-peelable film is used, the film can be peeled without applying stress, and the yield is improved. Also, by attaching a low-strength component to the adhesive film, the overall strength is increased, handling is easy, and workability can be improved.

In this case, the effective thickness of the substrate is 10 to 20.
0 μm. If the thickness of the substrate is smaller than this, the substrate may be deformed only by the pressure at the time of attaching the film.

Further, as a specific example of the substrate, there may be mentioned constituent members constituting an ink jet head.
For example, the flow path member forming the ink flow path of the ink jet head is a member that requires extremely careful handling since it is extremely thin and has been finely processed. In addition, many members, such as nozzles, which require different characteristics on the front and back sides, require a technique for selectively treating only one side without damaging the opposite side. Such members can also be easily processed by applying the present invention.

Therefore, the first embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. First, an adhesive film (adhesive sheet) 2 serving as a wraparound member is laminated on the back surface opposite to the application surface of the substrate 1 having the through holes 1a as shown in FIG. .

Then, as shown in FIG.
After the liquid 3 is applied to the surface to be coated, the liquid 3 is dried as shown in FIG. 3D, and then the adhesive film 2 is peeled off as shown in FIG.

As a result, it is possible to obtain the substrate 1 in which the liquid 3 is applied to the application surface and the liquid 3 does not wrap around on the back surface side.

As described above, when the liquid is applied to one surface of the substrate having one or a plurality of through holes or through grooves, the sneaking-prevention means for preventing the liquid from flowing to the back surface opposite to the application surface of the substrate is provided. Since it is used, it is easy to apply the liquid without being limited by the type and viscosity of the application liquid,
It is possible to obtain a liquid-coated substrate in which the liquid does not flow to the back surface. Then, by using an adhesive film (adhesive sheet) as the wraparound preventing means, it is possible to reliably prevent the wraparound of the liquid.

Next, a second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. First, a heat release film (heat release sheet) 5 which is a wraparound member as shown in FIG. 2B is provided on the back surface opposite to the application surface of the substrate 1 having the through holes 1a as shown in FIG. Laminate.

Then, as shown in FIG.
After the liquid 3 is applied to the application surface of the heat release film 5, the liquid 3 is dried by heating as shown in FIG. Is peeled off from the substrate 1, the liquid 3 is applied to the application surface, and the substrate 1 in which the liquid 3 does not wrap around on the back surface can be obtained.

Next, the adhesive film 2 is peeled off as shown in FIG. Thereby, the liquid 3 is applied to the application surface, and the substrate 1 in which the liquid 3 does not wrap around on the back surface side can be obtained.

By using a heat-peelable film as the pressure-sensitive adhesive film, heat can be applied after application of the liquid, so that the pressure-sensitive adhesive film can be easily removed without remaining, and when the film is peeled off. Since there is no stress applied to the substrate, the possibility that the substrate is warped or bent can be avoided. Furthermore, by setting the peeling temperature of the heat-peelable film to a temperature lower than the heating temperature used in the step, the step can be used as the peeling step, and the step can be shortened.

Next, a third embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. First, an ultraviolet peeling film (ultraviolet sheet) 6 as a wraparound member is laminated on the back surface opposite to the application surface of the substrate 1 having the through holes 1a as shown in FIG. I do.

Then, as shown in FIG.
After the liquid 3 is applied to the application surface of FIG. 1, the liquid 3 is dried by heating as shown in FIG. 4D, and then is irradiated with ultraviolet rays to be peeled off as shown in FIG. The adhesive strength of the film 6 is reduced, the film 3 is peeled off from the substrate 1, the liquid 3 is applied to the application surface, and the substrate 1 without the liquid 3 on the back surface can be obtained.

By using an ultraviolet film as the adhesive film as described above, the adhesive film can be easily removed by applying ultraviolet light after application of the liquid, without leaving any residue on the adhesive film. Thus, there is no stress applied to the substrate, and the possibility that the substrate is warped or bent can be avoided.

Next, a fourth embodiment in which the present invention is applied to a nozzle plate as a flow path member of an ink jet head will be described with reference to FIGS. First, as shown in FIG. 4, a nozzle plate 12 having a nozzle hole 11 formed therein is formed.
A water-repellent treatment layer 13 is formed on the liquid discharge side surface of the nozzle plate 12 and has been subjected to a water-repellent treatment for stabilizing the ejection. In providing the member, for example, a resin film (for example, a photosensitive resist) to increase the bonding strength with the liquid chamber member
14 is formed.

In order to form the resin film 14 on such a nozzle plate 12, a nozzle hole 11 is formed as shown in FIG. Then, as shown in FIG. 4B, the heat-releasable film 5 is laminated on the back surface of the water-repellent treatment layer 13 (the surface on the liquid chamber side is defined as the application surface).

The photosensitive resin 15 is applied to the surface of the nozzle plate 12 on the liquid chamber side (including the inside of the nozzle hole 11) as shown in FIG. As shown in (d), the thermal release film 5 is also released.

Thereafter, a photolithography process of exposing and developing is performed on the nozzle plate 12 coated with the photosensitive resin 15 as shown in FIG. The photosensitive resin 15 is removed, and the nozzle plate 12 having the resin film 14 formed on the remaining portion is obtained.

Here, specifically, as the thermal release film 5 in FIG. 3
196 was laminated at a pressure of 3 kgf / cm ² , and a photosensitive resin 15 was applied as a resin film material by spin coating in the step of FIG. This photosensitive resin 15
Performs a bake at 90 ° C. in the step of FIG. Since the thermal peeling temperature of 3196 was also 90 ° C., after the pre-baking treatment, the thermal peeling film 5 was peeled off from the nozzle plate 12 and was simply put on, and could be easily removed with tweezers.

The photosensitive resin 15 did not wrap around the nozzle plate 12 on the back side (the liquid discharge surface side), and no residue of the thermally peelable film 5 was observed. Although the photolithography process is performed here to remove the photosensitive resin inside the nozzle hole, this process may be omitted if it is not necessary to remove the inner wall.

As described above, by applying the present invention to a flow path member such as a nozzle plate of an ink jet head, various processes such as a hydrophilization treatment, a water repellency treatment, an ink resistance improvement treatment, and a bonding strength improvement of the flow passage surface can be achieved. The surface treatment can be performed only on one side, and a reliable ink jet head with stable ejection characteristics can be obtained.

[0044]

As described above, according to the method of manufacturing a liquid-coated substrate according to the first aspect, when a liquid is applied to one surface of a substrate having one or a plurality of through holes or through grooves, the coated surface of the substrate is coated. Since the sneaking-preventing means for preventing the liquid from spilling on the reverse side is used, the liquid can easily be applied to one side, and the liquid can be applied irrespective of the type and viscosity of the liquid.

According to a second aspect of the present invention, in the method for manufacturing a liquid coated substrate according to the first aspect,
Since the adhesive film that can be attached to the back surface of the substrate is used, even a substrate having a plurality of through-holes and through-grooves can be easily sealed, and the liquid can easily be prevented from flowing around. it can.

According to a third aspect of the present invention, in the method for manufacturing a liquid-coated substrate according to the second aspect,
Since the adhesive film is configured to be a heat-peelable film in which the adhesiveness is reduced by heating or the adhesiveness is reduced, the film can be easily peeled off simply by heating after the application of the liquid, and the remaining film remains. Absent. Further, since no stress is applied to the substrate when the film is peeled off, the substrate does not warp or bend.

According to a fourth aspect of the present invention, in the method of the second aspect,
Since the adhesive film is an ultraviolet release film that is cured by irradiating ultraviolet rays, the film can be easily peeled off only by irradiating ultraviolet rays after applying the liquid, and there is no residue of the film. Further, since no stress is applied to the substrate when the film is peeled off, the substrate does not warp or bend.

According to the method of manufacturing a liquid-coated substrate according to claim 5, in the method of manufacturing a liquid-coated substrate of claim 3,
Since the peeling temperature of the heat-peelable film is lower than the temperature used in the process, the heat-peeling film can be used as the heat-peeling film only by performing the heating process in the process. The performance is improved.

According to the method of manufacturing a liquid-coated substrate according to the sixth aspect, in the method of manufacturing a liquid-coated substrate according to any one of the first to fifth aspects, the substrate is configured to be a thin layer member. The effect of eliminating the stress applied to the substrate at the time is maximized, and the overall strength by attaching the film can be improved, thereby improving workability.

According to the seventh aspect of the present invention, in the method of manufacturing a liquid-coated substrate according to any one of the first to sixth aspects, the thickness of the substrate is within a range of 10 to 200 μm. Thus, the above-described effects can be effectively exerted.

According to the method of manufacturing a liquid-coated substrate according to claim 8, in the method of manufacturing a liquid-coated substrate according to any one of claims 1 to 7, the substrate is a flow path member for forming a flow path of an ink jet head. With the configuration, the surface treatment having the purpose of hydrophilization treatment, water repellency treatment, ink resistance improvement treatment, and improvement of bonding force on the surface of the flow path member can be easily performed by limiting to only one side, and the cost can be reduced. A head having excellent ejection characteristics and reliability can be obtained.

According to a ninth aspect of the present invention, there is provided a method of manufacturing a liquid coated substrate according to the eighth aspect.
Since the flow path member is a member including one or a plurality of nozzles, the surface treatment for the purpose of water repellent treatment of the nozzle member surface, hydrophilic treatment of the inner wall surface of the nozzle, and improvement of the joining force is limited to only one surface. Thus, it is possible to obtain a head including a nozzle member having excellent ejection characteristics and reliability at a low cost.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a first embodiment of the present invention.

FIG. 2 is an explanatory diagram illustrating a second embodiment of the present invention.

FIG. 3 is an explanatory diagram illustrating a third embodiment of the present invention.

FIG. 4 is an explanatory view illustrating a substrate used in a fourth embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating the embodiment.

FIG. 6 is an explanatory view illustrating a method for manufacturing a liquid-coated substrate by a conventional roll coater method.

FIG. 7 is an explanatory view illustrating a method for manufacturing a liquid-coated substrate by a conventional screen printing method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 1a ... Through-hole, 2 ... Adhesive film, 3 ... Liquid, 5 ... Thermal release film, 6 ... UV release film, 1
DESCRIPTION OF SYMBOLS 1 ... Nozzle hole, 12 ... Nozzle plate, 13 ... Water-repellent treatment layer, 14 ... Photosensitive coating, 15 ... Photosensitive resin.

Claims (9)

[Claims] 1. A method for manufacturing a liquid-coated substrate by applying a liquid to one side of a substrate having one or a plurality of through holes or through grooves, and applying the liquid to the substrate when applying the liquid to the substrate. A sneaking-preventing means for preventing the liquid from spilling on the back surface opposite to the back surface. 2. The method for producing a liquid-coated substrate according to claim 1, wherein an adhesive film that can be attached to a back surface of the substrate is used as the wraparound means. 3. The method for producing a liquid-coated substrate according to claim 2, wherein the adhesive film is a heat-peelable film whose adhesiveness is reduced or lost by heating. Manufacturing method. 4. The method for producing a liquid-coated substrate according to claim 2, wherein said adhesive film is an ultraviolet-peeling film which is cured by irradiating ultraviolet rays. 5. The method for producing a liquid-coated substrate according to claim 3, wherein a peeling temperature of the thermally peelable film is lower than a temperature used in a process. 6. The method for manufacturing a liquid-coated substrate according to claim 1, wherein said substrate is a thin layer member. 7. The method for manufacturing a liquid-coated substrate according to claim 1, wherein said substrate has a thickness of 10 to 10.
A method for producing a liquid-coated substrate, which is within 200 μm. 8. The method of manufacturing a liquid-coated substrate according to claim 1, wherein the substrate is a flow path member that forms a flow path of an ink jet head. Method. 9. The method for manufacturing a liquid-coated substrate according to claim 8, wherein the flow path member is a member including one or a plurality of nozzles.