JP2000200929A - Dot matrix light emitting display body - Google Patents
Dot matrix light emitting display bodyInfo
- Publication number
- JP2000200929A JP2000200929A JP10377676A JP37767698A JP2000200929A JP 2000200929 A JP2000200929 A JP 2000200929A JP 10377676 A JP10377676 A JP 10377676A JP 37767698 A JP37767698 A JP 37767698A JP 2000200929 A JP2000200929 A JP 2000200929A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- heat
- plate
- dot matrix
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光ダイオード( Ｌ
ＥＤ) 等の発光体素子を用いて構成したドットマトリク
ス発光表示体に関し、より具体的にはバス、電車、ガソ
リンスタンド、各種施設、建物等において発光文字、発
光標識、電光掲示板等により案内、情報伝達等の表示を
行うディスプレイ形式のドットマトリクス発光表示体に
関する。The present invention relates to a light emitting diode (L)
ED) and other dot-matrix light-emitting displays using light-emitting elements. More specifically, guidance, information, etc., on buses, trains, gas stations, various facilities, buildings, etc. with luminescent characters, luminescent signs, electronic bulletin boards, etc. The present invention relates to a display-type dot matrix light-emitting display body for displaying transmission and the like.
【０００２】[0002]
【従来の技術】従来のドットマトリクス発光表示体は、
リードタイプＬＥＤを使用した大型ＬＥＤディスプレー
を例にとると、図７、図８に示すように、ＬＥＤドライ
ブ回路を実装したプリント基板(PＣＢ )の上方に、熱放
散スペースを設けてＬＥＤ実装ＰＣＢを配置し、さらに
各ＬＥＤから発散する熱放散スペースを設けて上面に遮
光膜を形成した樹脂板を配置し、該樹脂板の各ＬＥＤ対
応箇所に透孔を穿設した構造である。また図９に示すよ
うに、ＳＭＴタイプＬＥＤを使用した小型ＬＥＤディス
プレーを例にとると、ＬＥＤチップとＬＥＤドライブ回
路を実装したＰＣＢ上に、上面に遮光膜を形成した樹脂
板を直接設置し、該樹脂板の各ＬＥＤ対応箇所に透孔を
穿設した構造である。2. Description of the Related Art A conventional dot matrix light emitting display is
Taking a large LED display using a lead type LED as an example, as shown in FIGS. 7 and 8, a heat dissipation space is provided above a printed circuit board (PCB) on which an LED drive circuit is mounted to mount an LED mounting PCB. In this structure, a heat dissipation space for radiating heat from each LED is provided, a resin plate having a light-shielding film formed on the upper surface is arranged, and a through hole is formed in a portion of the resin plate corresponding to each LED. As shown in FIG. 9, taking a small LED display using an SMT type LED as an example, a resin plate having a light shielding film formed on an upper surface is directly installed on a PCB on which an LED chip and an LED drive circuit are mounted. The resin plate has a structure in which a through hole is formed at a location corresponding to each LED.
【０００３】さらに、図１０に示すように、ＰＣＢに直
接ベアチップを乗せるベアチップＬＥＤ実装方式のドッ
トマトリクス発光表示体は、ＬＥＤ対応箇所に透孔を穿
設した拡散シリコーンゴム板の上面に遮光膜を形成し、
ベアチップをクリアシーリング封止材で封止する構造と
していた。若しくは図１１に示すようにベアチップをク
リアシーリング封止材で封止しないで拡散シリコーンゴ
ム板の上面にシリコーンゴムによる拡散レンズを設ける
構造、又は、図１２に示すように拡散シリコーンゴム板
の上面にさらにＬＥＤ対応箇所を除いて両面マスク印刷
をしたクリア樹脂板を配置する構造であった。Further, as shown in FIG. 10, a bare chip LED mounting type dot matrix light emitting display in which a bare chip is directly mounted on a PCB is provided with a light shielding film on the upper surface of a diffusion silicone rubber plate having a through hole at a location corresponding to the LED. Forming
The bare chip was sealed with a clear sealing sealing material. Alternatively, as shown in FIG. 11, a structure in which a bare lens is not sealed with a clear sealing sealing material and a diffusion lens made of silicone rubber is provided on the upper surface of a diffusion silicone rubber plate, or as shown in FIG. Further, the structure was such that a clear resin plate on which double-sided mask printing was performed except for the portions corresponding to the LEDs was arranged.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の構造にあっ
ては、熱放散スペースを設けることにより装置全体が大
型化する等の難点がある。また遮光膜を形成した樹脂板
上にシリコーンゴムによる拡散レンズを設ける構造にあ
っては、成形時のシリコーンゴムによる拡散レンズの寸
法安定性に欠け、ＬＥＤとレンズの光軸を一致させるこ
とが困難となる。さらに、従来構造にあっては光の反射
特性が良好でなく、集光性等に難点があった。However, the above-mentioned conventional structure has a drawback in that the provision of a heat dissipation space increases the size of the entire apparatus. Also, in a structure in which a diffusion lens made of silicone rubber is provided on a resin plate on which a light shielding film is formed, the dimensional stability of the diffusion lens made of silicone rubber at the time of molding is lacking, and it is difficult to align the optical axis of the LED with the lens. Becomes Further, in the conventional structure, the light reflection characteristics are not good, and there is a problem in the light collecting property and the like.
【０００５】本発明は上記の点に鑑みてなされたもの
で、その目的とするところは、ゴム製レンズの寸法安定
性を図るとともに光の反射特性の向上と、熱の放熱特
性、光軸の安定性及び光の遮光特性の向上を図ったドッ
トマトリクス発光表示体を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to improve the dimensional stability of a rubber lens, to improve the light reflection characteristics, to dissipate heat, and to improve the optical axis. It is an object of the present invention to provide a dot matrix light emitting display which has improved stability and light blocking characteristics.
【０００６】[0006]
【課題を解決するための手段】本発明に係るドットマト
リクス発光表示体は多数のドット状の発光部をプリント
基板上にマトリクス状に配列したドットマトリクス発光
表示体であって、耐熱剛性板の各発光部相当部位に透孔
を穿設するとともに該各透孔が陥没するように各透孔周
辺を傾斜させるとともに、該傾斜した面上に透光性ゴム
材にてレンズ体を一体に固着形成し、かつ前記耐熱剛性
板の各透孔を除く裏面に前記透光性ゴム材にて一体に板
状に固着形成し、前記耐熱剛性板に前記透光性ゴム材を
一体に固着形成したレンズ体ユニットを上記プリント基
板上に直接又は間接的に配設したものである。A dot matrix light emitting display according to the present invention is a dot matrix light emitting display in which a large number of dot light emitting portions are arranged in a matrix on a printed circuit board. A through hole is formed in a portion corresponding to the light emitting portion, and the periphery of each through hole is inclined so that each through hole is depressed, and a lens body is integrally formed on the inclined surface with a transparent rubber material. And a lens in which the light-transmitting rubber material is integrally fixed to the rear surface of each of the heat-resistant rigid plates except for the respective through-holes in a plate shape, and the light-transmitting rubber material is integrally fixed to the heat-resistant rigid plate. The body unit is disposed directly or indirectly on the printed circuit board.
【０００７】また請求項１記載のドットマトリクス発光
表示体において、前記透光性ゴム材はシリコーンゴム、
ＥＰＤＭ等の透明なゴムで形成したものである。Further, in the dot matrix light emitting display according to claim 1, the translucent rubber material is silicone rubber,
It is formed of a transparent rubber such as EPDM.
【０００８】請求項１又は２記載のドットマトリクス発
光表示体において、前記耐熱剛性板はステンレス板、ア
ルミニウム板、スチール板等の反射面を備えた金属板で
形成したものである。In the dot matrix light emitting display according to claim 1 or 2, the heat-resistant rigid plate is formed of a metal plate having a reflection surface such as a stainless plate, an aluminum plate, and a steel plate.
【０００９】また請求項１又は２記載のドットマトリク
ス発光表示体において前記耐熱剛性板は熱硬化性樹脂又
は耐熱性の熱可塑性樹脂であって、透光性又は非透光性
で形成したものである。Further, in the dot matrix light-emitting display device according to claim 1 or 2, the heat-resistant rigid plate is made of a thermosetting resin or a heat-resistant thermoplastic resin, and is formed to be translucent or non-translucent. is there.
【００１０】さらに 請求項１、２、３又は４記載のド
ットマトリクス発光表示体において前記透光性ゴム材に
て形成したレンズ体はその下部に、プリント基板上の発
光部を収納する空間部を形成したものである。Further, in the dot matrix light emitting display according to claim 1, the lens body formed of the translucent rubber material has a space below the lens body for accommodating the light emitting unit on the printed circuit board. It is formed.
【００１１】請求項１、２、３、４又は５記載のドット
マトリクス発光表示体において、前記レンズ体ユニット
はプリント基板上にスペーサーを介して配設したもので
ある。[0011] In the dot matrix light emitting display according to claim 1, the lens unit is disposed on a printed board via a spacer.
【００１２】[0012]
【作用】本発明に係るドットマトリクス発光表示体は、
耐熱剛性板の各発光部相当部位に透孔を穿設するととも
に該各透孔が陥没するように各透孔周辺を傾斜させると
ともに、該傾斜した面上に透光性ゴム材にてレンズ体を
一体に固着形成し、かつ前記耐熱剛性板の各透孔を除く
裏面に前記透光性ゴム材にて一体に板状に固着形成し、
前記透光性ゴム材を耐熱剛性板に一体に固着形成したレ
ンズ体ユニットを、上記プリント基板上に直接又は間接
的に配設する構造としたので、ゴム材で作られるレンズ
体であるに拘わらず、耐熱剛性板で寸法が規制され、成
形後の寸法精度が良く、寸法の安定性が図られる。The dot matrix light emitting display according to the present invention is
A through hole is formed in a portion corresponding to each light emitting portion of the heat resistant rigid plate, and the periphery of each through hole is inclined so that each through hole is depressed, and the lens body is formed of a translucent rubber material on the inclined surface. Is fixedly formed integrally, and is fixedly formed in a plate shape integrally with the translucent rubber material on the back surface excluding each through hole of the heat resistant rigid plate,
Since the lens body unit in which the translucent rubber material is integrally fixed to the heat-resistant rigid plate is directly or indirectly disposed on the printed circuit board, the lens body unit is made of a rubber material. Instead, the size is regulated by the heat-resistant rigid plate, so that the dimensional accuracy after molding is good and the dimensional stability is achieved.
【００１３】前記耐熱剛性板をステンレス板、アルミニ
ウム板、スチール板等の反射面を備えた金属板とするこ
とにより、隣接する発光部への光の漏洩が防止されるだ
けでなく、各発光部に対応する各透孔が陥没するように
各透孔周辺を傾斜させているので、この傾斜面が光の反
斜面となりレンズ側に一層明るい光をおくることがで
き、光の反射特性が向上することとなる。When the heat-resistant rigid plate is a metal plate having a reflecting surface such as a stainless steel plate, an aluminum plate, a steel plate, etc., not only leakage of light to adjacent light emitting portions is prevented but also each light emitting portion Is inclined so that each through-hole corresponding to is depressed, so that the inclined surface becomes an anti-slope surface of light, so that brighter light can be sent to the lens side, and light reflection characteristics are improved. It will be.
【００１４】また前記耐熱剛性板をステンレス板、アル
ミニウム板、スチール板等の反射面を備えた金属板とす
ることにより、光の反射特性が向上することの他に、金
属板自体が熱伝導性が良好であるため、熱の放熱特性が
向上する。The heat-resistant rigid plate is made of a metal plate having a reflecting surface such as a stainless steel plate, an aluminum plate, a steel plate or the like. Is good, so that the heat radiation characteristics are improved.
【００１５】そして、多数のドット状の発光部はプリン
ト基板上にマトリクス状に配列されており、この各発光
部に対応する位置にレンズ体ユニットを載置固定するこ
とにより、ドット状の点光源とレンズ体の光軸を一致さ
せることが容易となり、結像時の収差が解消される。A large number of dot-shaped light-emitting portions are arranged in a matrix on a printed circuit board, and a lens unit is mounted and fixed at a position corresponding to each of the light-emitting portions. It is easy to make the optical axes of the lens and the lens body coincide with each other, and aberration at the time of image formation is eliminated.
【００１６】また従来のようにゴムシートにマトリック
ス状にレンズ体を形成していたものは、隣接する発光部
からの光の影響を無くすためにゴムシートの上面に遮光
膜を印刷等により形成していたが、本発明では耐熱剛性
板をステンレス板、アルミニウム板、スチール板等の反
射面を備えた金属板とした場合には、このような遮光膜
は不要であり、金属板が遮光の役割を果たすこととな
る。金属板以外にも耐熱剛性板を非透光性の樹脂板で形
成した場合も同様の遮光性を果たす。さらに樹脂板を白
色等の明るい板を使用することにより金属板と同様に光
の散乱効果が増し、一層明るい光を得ることが出来る。Further, in a conventional lens sheet in which a lens body is formed in a matrix shape, a light-shielding film is formed on the upper surface of the rubber sheet by printing or the like in order to eliminate the influence of light from an adjacent light emitting portion. However, in the present invention, when the heat-resistant rigid plate is a metal plate having a reflecting surface such as a stainless steel plate, an aluminum plate, and a steel plate, such a light-shielding film is unnecessary, and the metal plate plays a role of shielding light. Will be fulfilled. A similar light-shielding property is achieved when the heat-resistant rigid plate is formed of a non-translucent resin plate other than the metal plate. Further, by using a bright plate such as white as the resin plate, the light scattering effect is increased as in the case of the metal plate, so that brighter light can be obtained.
【００１７】耐熱剛性板を透光性の樹脂板で形成した場
合は、寸法の安定性、光軸の安定性は得られるが、光の
反射特性、放熱特性及び遮光特性は欠けるが、それは使
用目的等に応じて使い分ければ良い。また透光性の樹脂
板を積極的に使用することにより、用途により光の漏れ
をむしろ積極的に利用する使い方もある。When the heat-resistant rigid plate is formed of a translucent resin plate, dimensional stability and optical axis stability can be obtained, but light reflection characteristics, heat radiation characteristics and light-shielding characteristics are lacking. What is necessary is just to use properly according to the objective etc. In addition, there is a method of actively using light leakage depending on the application by positively using a translucent resin plate.
【００１８】[0018]
【発明実施の形態】１は本発明に係るドットマトリクス
発光表示体で、多数のドット状の発光部２をマトリクス
状に配列したプリント基板３と、該プリント基板３上に
載置固定したレンズ体ユニット４からなる。プリント基
板３上にレンズ体ユニット４を載置固定するに際して
は、直接載置する場合と、スぺーサー８を介して載置固
定する場合のいずれであってもよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference numeral 1 denotes a dot matrix light emitting display according to the present invention, which is a printed board 3 on which a number of dot-shaped light emitting portions 2 are arranged in a matrix, and a lens body mounted and fixed on the printed board 3. It consists of unit 4. The mounting and fixing of the lens unit 4 on the printed circuit board 3 may be either direct mounting or mounting and fixing via the spacer 8.
【００１９】レンズ体ユニット４は耐熱剛性板５の各発
光部２相当部位に透孔６が穿設されており、各透孔６が
陥没するように各透孔６周辺を傾斜させている。耐熱剛
性板５の透孔６及び傾斜面５ａの形成は、金属板の場合
はプレス成形で行い、樹脂板の場合は成形時等に行う。
金属板の場合はステンレス板、アルミニウム板、スチー
ル板等の反射面を備えた金属板が使用される。なお、耐
熱剛性板５の肉厚はレンズ体７の寸法安定性が得られる
程度の厚さであればよく、その厚さは材質等により決め
られ、あまり厚くするのも得策でない。In the lens unit 4, through holes 6 are formed in the heat-resistant rigid plate 5 at portions corresponding to the light emitting portions 2, and the periphery of each through hole 6 is inclined so that each through hole 6 is depressed. The formation of the through hole 6 and the inclined surface 5a of the heat-resistant rigid plate 5 is performed by press molding in the case of a metal plate, and is performed at the time of molding in the case of a resin plate.
In the case of a metal plate, a metal plate having a reflection surface such as a stainless plate, an aluminum plate, and a steel plate is used. Note that the thickness of the heat-resistant rigid plate 5 may be a thickness that allows the dimensional stability of the lens body 7 to be obtained, and the thickness is determined by the material and the like, and it is not advisable to make the thickness too large.
【００２０】また耐熱剛性板５が樹脂板の場合はエポキ
シ樹脂、メラミン樹脂等の熱硬化性樹脂又は強力な耐熱
性および機械的強さをもったポリアミド系樹脂やポリカ
ーボネイト、液晶プラスチック、耐熱ポリエステル、ポ
リサルフォン等の耐熱性の熱可塑性樹脂であって剛性を
備えているものが使用され、透明、半透明な透光性材料
又は有色の非透光性材料で形成したものが使用される。When the heat-resistant rigid plate 5 is a resin plate, a thermosetting resin such as an epoxy resin or a melamine resin, or a polyamide resin or polycarbonate having strong heat resistance and mechanical strength, a liquid crystal plastic, a heat-resistant polyester, A heat-resistant thermoplastic resin such as polysulfone having rigidity is used, and a transparent or translucent light-transmitting material or a colored non-light-transmitting material is used.
【００２１】各透孔６周辺を傾斜させた傾斜面５ａ上に
はプライマー処理等をした後、透光性ゴム材にて主とし
て凸レンズ形状をしたレンズ体７を一体に固着形成す
る。レンズ体７は傾斜面５ａ内に収まる形状とするか、
または傾斜面５ａ内から突出する形状のいずれの場合で
あってもよい。また耐熱剛性板５の各透孔６を除く裏面
にはプライマー処理等をした後、透光性ゴム材にて一体
に板状に固着形成する。板厚は傾斜面５ａの垂直高さと
略同じ厚さとする。。この固着形成はゴム金型で成形す
るときに金型内に耐熱剛性板５を収納した状態で透光性
ゴム材を装填して熱加硫等による成形をしてレンズ体ユ
ニット４を得ることが出来る。透光性ゴム材としてはシ
リコーンゴム、ＥＰＤＭ等の透明なゴム材が使用され
る。耐熱剛性板５が金属板の場合には、ゴム材との成形
時に図１に示すように金属板表面がゴム材にて被覆され
た構造の場合、電気的な絶縁効果が得られる。また図２
〜図５の場合のように耐熱剛性板５が露出する構造の場
合、反射面としての効果が増すばかりか、化粧性が増す
こととなる。After a primer treatment or the like is performed on the inclined surface 5a in which the periphery of each through hole 6 is inclined, a lens body 7 mainly having a convex lens shape and made of a translucent rubber material is integrally formed. Whether the lens body 7 has a shape that fits within the inclined surface 5a,
Alternatively, the shape may be any of the shapes protruding from the inclined surface 5a. The back surface of the heat-resistant rigid plate 5 excluding the respective through holes 6 is subjected to a primer treatment or the like, and is then integrally formed in a plate shape with a translucent rubber material. The plate thickness is approximately the same as the vertical height of the inclined surface 5a. . In this fixing, a lens body unit 4 is obtained by loading a translucent rubber material in a state where the heat-resistant rigid plate 5 is housed in the mold and molding by heat vulcanization or the like when molding with a rubber mold. Can be done. As the translucent rubber material, a transparent rubber material such as silicone rubber or EPDM is used. When the heat-resistant rigid plate 5 is a metal plate, an electrical insulating effect can be obtained when the metal plate surface is covered with a rubber material as shown in FIG. 1 during molding with a rubber material. FIG. 2
In the case of the structure in which the heat-resistant rigid plate 5 is exposed as shown in FIGS. 5 to 5, not only the effect as a reflecting surface is increased, but also the cosmetic property is increased.
【００２２】透光性ゴム材にて形成したレンズ体７はそ
の下部に、プリント基板３上のＬＥＤ等の発光部２を収
納する各種形状をした空間部９を形成する。この空間部
９に発光部２を収納でき、レンズ体ユニット４のプリン
ト基板３上への直接載置が可能となり、一層のコンパク
ト化が図られる。A lens body 7 made of a translucent rubber material has a space 9 formed in a lower portion of the lens body 7 having various shapes for accommodating the light emitting unit 2 such as an LED on the printed circuit board 3. The light emitting unit 2 can be housed in the space 9, and the lens unit 4 can be directly mounted on the printed circuit board 3, so that the size can be further reduced.
【００２３】[0023]
【発明の効果】本発明はゴム材で作られるレンズ体と耐
熱剛性板との一体固着形成した構造であるため、ゴム材
で作られるレンズ体は耐熱剛性板で寸法が規制され、成
形後の寸法精度が良く、寸法の安定性が図られる。Since the present invention has a structure in which a lens body made of rubber and a heat-resistant rigid plate are integrally formed, the dimensions of the lens body made of rubber are regulated by the heat-resistant rigid plate, and after molding, Good dimensional accuracy and dimensional stability.
【００２４】また耐熱剛性板をステンレス板、アルミニ
ウム板、スチール板等の反射面を備えた金属板とするこ
とにより、隣接する発光部への光の漏洩が防止され、傾
斜面が光の反斜面となりレンズ側に一層明るい光をおく
ることができ、光の反射特性が向上することとなる。Further, by using a heat-resistant rigid plate made of a metal plate having a reflecting surface such as a stainless steel plate, an aluminum plate, a steel plate, etc., light is prevented from leaking to the adjacent light emitting portion, and the inclined surface is formed on the anti-slope surface of the light. Thus, brighter light can be sent to the lens side, and the light reflection characteristics are improved.
【００２５】また前記耐熱剛性板をステンレス板、アル
ミニウム板、スチール板等の反射面を備えた金属板とす
ることにより、金属板自体が熱伝導性が良好であるた
め、熱の放熱特性が向上する。In addition, since the heat-resistant rigid plate is a metal plate having a reflection surface such as a stainless steel plate, an aluminum plate, a steel plate, etc., the metal plate itself has good thermal conductivity, so that heat radiation characteristics are improved. I do.
【００２６】そして、多数のドット状の発光部はプリン
ト基板上にマトリクス状に配列されており、この各発光
部に対応する位置にレンズ体ユニットを載置固定するこ
とにより、ドット状の点光源とレンズ体との光軸の一致
が容易となり、結像時の収差も解消される。A large number of dot-shaped light-emitting portions are arranged in a matrix on a printed circuit board. By mounting and fixing a lens unit at a position corresponding to each of the light-emitting portions, a dot-shaped point light source is provided. It is easy to match the optical axis of the lens with the lens body, and the aberration at the time of image formation is also eliminated.
【００２７】本発明では耐熱剛性板をステンレス板、ア
ルミニウム板、スチール板等の反射面を備えた金属板と
した場合には、従来のように遮光膜を形成する必要が無
く、金属板が遮光の役割を果たすこととなる。金属板以
外にも耐熱剛性板を非透光性の樹脂板で形成した場合も
同様の遮光性を果たす。さらに樹脂板を白色等の明るい
板を使用することにより金属板と同様に光の散乱効果が
増し、一層明るい光を得ることが出来る。In the present invention, when the heat-resistant rigid plate is a metal plate having a reflecting surface such as a stainless steel plate, an aluminum plate, a steel plate or the like, there is no need to form a light-shielding film as in the prior art, and the metal plate is light-shielded. Will play a role. A similar light-shielding property is achieved when the heat-resistant rigid plate is formed of a non-translucent resin plate other than the metal plate. Further, by using a bright plate such as white as the resin plate, the light scattering effect is increased as in the case of the metal plate, so that brighter light can be obtained.
【００２８】耐熱剛性板を透光性の樹脂板で形成した場
合も、寸法の安定性、光軸の安定性は得られる。Even when the heat-resistant rigid plate is formed of a translucent resin plate, dimensional stability and optical axis stability can be obtained.
【図１】本発明の一実施例を示すドットマトリクス発光
表示体の概略断面説明図である。FIG. 1 is a schematic cross-sectional explanatory view of a dot matrix light emitting display showing one embodiment of the present invention.
【図２】本発明の他の実施例を示すドットマトリクス発
光表示体の概略断面説明図である。FIG. 2 is a schematic cross-sectional explanatory view of a dot matrix light emitting display showing another embodiment of the present invention.
【図３】本発明の他の実施例を示すドットマトリクス発
光表示体の概略断面説明図である。FIG. 3 is a schematic sectional explanatory view of a dot matrix light emitting display showing another embodiment of the present invention.
【図４】本発明の他の実施例を示すドットマトリクス発
光表示体の概略断面説明図である。FIG. 4 is a schematic cross-sectional explanatory view of a dot matrix light emitting display showing another embodiment of the present invention.
【図５】本発明の他の実施例を示すドットマトリクス発
光表示体の概略断面説明図である。FIG. 5 is a schematic sectional explanatory view of a dot matrix light emitting display showing another embodiment of the present invention.
【図６】(ａ) は本発明の実施例を示すドットマトリク
ス発光表示体の概略平面図、( ｂ) はその概略側面図で
ある。FIG. 6A is a schematic plan view of a dot matrix light emitting display according to an embodiment of the present invention, and FIG. 6B is a schematic side view thereof.
【図７】従来の樹脂モールドＬＥＤ組込み方式の概念説
明図で、リードタイプＬＥＤを使用した大型ディスプレ
ーの場合である。FIG. 7 is a conceptual explanatory view of a conventional resin-molded LED incorporation system, which is a case of a large display using a lead type LED.
【図８】従来の樹脂モールドＬＥＤ組込み方式の概念説
明図で、リードタイプＬＥＤを使用した大型ＬＥＤディ
スプレーの場合である。FIG. 8 is a conceptual explanatory view of a conventional resin-molded LED assembling method, which is a case of a large-sized LED display using a lead type LED.
【図９】従来の樹脂モールドＬＥＤ組込み方式の概念説
明図で、ＳＭＴタイプＬＥＤを使用した小型ＬＥＤディ
スプレーの場合である。FIG. 9 is a conceptual explanatory view of a conventional resin-molded LED assembling method, which is a case of a small LED display using an SMT type LED.
【図１０】従来のベアーチップＬＥＤ実装方式概念図
で、ＰＣＢに直接ベアーチップを乗せる方式の断面説明
図である。FIG. 10 is a conceptual diagram of a conventional bare chip LED mounting method, and is a sectional explanatory view of a method of directly mounting a bare chip on a PCB.
【図１１】従来のベアーチップＬＥＤ実装方式概念図
で、ＰＣＢに直接ベアーチップを乗せる方式の断面説明
図である。FIG. 11 is a conceptual diagram of a conventional bare chip LED mounting method, and is a cross-sectional explanatory view of a method of directly mounting a bare chip on a PCB.
【図１２】従来のベアーチップＬＥＤ実装方式概念図
で、ＰＣＢに直接ベアーチップを乗せる方式の断面説明
図である。FIG. 12 is a conceptual view of a conventional bare chip LED mounting method, and is a cross-sectional explanatory view of a method of directly mounting a bare chip on a PCB.
１ ドットマトリクス発光表示体 ２ ドット状の発
光部 ３ プリント基板 ４ レンズ体ユニ
ット ５ 耐熱剛性板 ５ａ 傾斜面 ６ 透孔 ７ レンズ体 ８ スペーサー 1− −DESCRIPTION OF SYMBOLS 1 Dot matrix light-emitting display body 2 Dot-shaped light-emitting part 3 Printed circuit board 4 Lens body unit 5 Heat-resistant rigid plate 5a Inclined surface 6 Through-hole 7 Lens body 8 Spacer 1--
Claims (6)
上にマトリクス状に配列したドットマトリクス発光表示
体であって、耐熱剛性板の各発光部相当部位に透孔を穿
設するとともに該各透孔が陥没するように各透孔周辺を
傾斜させるとともに、該傾斜した面上に透光性ゴム材に
て各レンズ体を一体に固着形成し、かつ前記耐熱剛性板
の各透孔を除く裏面に前記透光性ゴム材にて一体に板状
に固着形成し、前記耐熱剛性板に前記透光性ゴム材を一
体に固着形成したレンズ体ユニットを上記プリント基板
上に直接又は間接的に配設したことを特徴とするドット
マトリクス発光表示体。1. A dot matrix light emitting display in which a large number of dot light emitting portions are arranged in a matrix on a printed circuit board, wherein a through hole is formed in a portion corresponding to each light emitting portion of a heat-resistant rigid plate. The periphery of each through hole is inclined so that the through hole is depressed, and each lens body is integrally formed with a transparent rubber material on the inclined surface, and each through hole of the heat resistant rigid plate is removed. A lens unit integrally formed on the back surface of the translucent rubber material in the form of a plate with the translucent rubber material and the translucent rubber material integrally formed on the heat-resistant rigid plate is directly or indirectly mounted on the printed circuit board. A dot matrix light-emitting display, wherein the display is provided.
ＰＤＭ等の透明なゴムであることを特徴とする請求項１
記載のドットマトリクス発光表示体。2. The light-transmitting rubber material is silicone rubber, E
2. A transparent rubber such as PDM.
The dot matrix light emitting display according to the above.
ニウム板、スチール板等の反射面を備えた金属板である
ことを特徴とする請求項１又は２記載のドットマトリク
ス発光表示体。3. The dot matrix light emitting display according to claim 1, wherein the heat-resistant rigid plate is a metal plate having a reflection surface such as a stainless plate, an aluminum plate, and a steel plate.
性の熱可塑性樹脂であって、透光性又は非透光性である
ことを特徴とする請求項１又は２記載のドットマトリク
ス発光表示体。4. The dot matrix light emission according to claim 1, wherein the heat-resistant rigid plate is made of a thermosetting resin or a heat-resistant thermoplastic resin, and is translucent or non-translucent. Display body.
はその下部に、プリント基板上の発光部を収納する空間
部を形成したことを特徴とする請求項１、２、３又は４
記載のドットマトリクス発光表示体。5. A lens body made of a translucent rubber material, wherein a space for accommodating a light emitting unit on a printed circuit board is formed below the lens body.
The dot matrix light emitting display according to the above.
にスペーサーを介して配設したことを特徴とする請求項
１、２、３、４又は５記載のドットマトリクス発光表示
体。6. The dot matrix light emitting display according to claim 1, wherein said lens unit is disposed on a printed circuit board via a spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10377676A JP2000200929A (en) | 1998-12-29 | 1998-12-29 | Dot matrix light emitting display body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10377676A JP2000200929A (en) | 1998-12-29 | 1998-12-29 | Dot matrix light emitting display body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000200929A true JP2000200929A (en) | 2000-07-18 |
Family
ID=18509068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10377676A Withdrawn JP2000200929A (en) | 1998-12-29 | 1998-12-29 | Dot matrix light emitting display body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000200929A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003019679A1 (en) * | 2001-08-28 | 2003-03-06 | Matsushita Electric Works, Ltd. | Light emitting device using led |
| US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| WO2008080390A3 (en) * | 2006-12-29 | 2008-09-25 | Osram Opto Semiconductors Gmbh | Lens arrangement und led display device |
| CN102569613A (en) * | 2004-03-29 | 2012-07-11 | 克里公司 | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| KR101216936B1 (en) | 2011-11-18 | 2012-12-31 | 서울반도체 주식회사 | Light emitting diode |
-
1998
- 1998-12-29 JP JP10377676A patent/JP2000200929A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| US6730533B2 (en) | 2000-09-01 | 2004-05-04 | General Electric Company | Plastic packaging of LED arrays |
| US6733711B2 (en) | 2000-09-01 | 2004-05-11 | General Electric Company | Plastic packaging of LED arrays |
| WO2003019679A1 (en) * | 2001-08-28 | 2003-03-06 | Matsushita Electric Works, Ltd. | Light emitting device using led |
| US6930332B2 (en) | 2001-08-28 | 2005-08-16 | Matsushita Electric Works, Ltd. | Light emitting device using LED |
| CN102569613A (en) * | 2004-03-29 | 2012-07-11 | 克里公司 | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| EP2259351A3 (en) * | 2004-03-29 | 2017-01-04 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| EP1730791B1 (en) * | 2004-03-29 | 2019-08-28 | Cree, Inc. | Semiconductor light emitting device including flexible film having therein an optical element, and method of assembling the same |
| WO2008080390A3 (en) * | 2006-12-29 | 2008-09-25 | Osram Opto Semiconductors Gmbh | Lens arrangement und led display device |
| US8754427B2 (en) | 2006-12-29 | 2014-06-17 | Osram Opto Semiconductors Gmbh | Lens arrangement and LED display device |
| KR101216936B1 (en) | 2011-11-18 | 2012-12-31 | 서울반도체 주식회사 | Light emitting diode |
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