JP2000199836A - Optical parallel transmitting receiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure simply realizing the work optically coupling plural optical fibers with plural optical elements. SOLUTION: This device is an optical parallel transmitting receiver containing a photodetector array 3f arranging plural photodetectors in an array state on the same semiconductor substrate and a preamplifier IC 3g integrating plural receiving circuits, and the photodetector array 3f is a back incident type photodetector, and the photodetector array 3f is flip chip mounted on the upper surface of the preamplifier IC 3g.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical parallel transmission / reception system used for optical communication, and more particularly to an optical parallel transmission receiver for optically coupling a plurality of light receiving elements and a plurality of optical fibers.

[0002]

2. Description of the Related Art With the increase in required transmission capacity, expectations for optical parallel data transmission technology in an optical communication system are increasing. An optical communication system using the optical parallel data transmission technology is divided into three parts: a transmission unit, an optical fiber transmission line, and a reception unit. In the transmission unit, a plurality of electronic signals forming a bit string are input, subjected to signal processing, waveform shaping, amplification, and the like, and then converted into an optical signal through a current driving circuit and a light emitting element. In the receiving unit, the light signal is converted from an optical signal into an electric signal by a light receiving element, and further subjected to amplification, signal processing, etc., and returns to the original electric signal bit string (the latest data collection of optical communication technology III,
"Optical parallel data transmission system and hardware configuration", pp.191
-192).

In order to realize an optical communication system using the optical parallel data transmission method, the optical axis between the optical element array and the optical fiber array must be easily adjusted with high precision and fixed, and degraded by humidity or ionic elements. It is necessary to hermetically seal the optical element array which is easy to perform. Therefore, there is known a technique of optically coupling an optical element and an optical fiber by interposing a bundle fiber between the plurality of optical elements and the plurality of optical fibers (JP-A-5-188250).

[0004] Further, as shown in the academic journal "1995 IEICE General Conference C-185", a V-shaped groove is formed on a silicon substrate, and a V-shaped groove is formed at a predetermined position on the tip side of the V-shaped groove. The light emitting element is positioned and fixed.
2. Description of the Related Art There is known a structure in which an optical fiber is arranged and fixed in a U-shaped groove so that an optical axis of the optical fiber is aligned with an optical axis of a light emitting element.

Further, from the viewpoint of facilitating and automating the manufacturing process, there has been proposed a structure in which optical coupling with a light emitting element or a light receiving element is performed by using a ferrule into which an optical fiber is inserted and fixed (Japanese Patent Application No. Hei 10-26139). 9-83004).

[0006]

However, in the case of optically coupling a plurality of optical fibers and a plurality of optical elements (light receiving elements, light emitting elements), it is difficult to apply the conventional system. For example, unlike the case where a single-core optical fiber is connected to an optical element, a 12-core fiber array has a drawback that the operation becomes extremely complicated unless a displacement due to rotation is taken into account.

An object of the present invention is to provide a structure which can easily realize the operation of optically coupling a plurality of optical fibers and a plurality of optical elements.

[0008]

In order to solve the above-mentioned problems, the present invention provides a preamplifier in which a plurality of light receiving elements are arranged in an array on the same semiconductor substrate and a plurality of receiving circuits are integrated. An optical parallel transmission receiver including an IC, wherein the light receiving element array is a back illuminated light receiving element, and the light receiving element array is flip-chip mounted on an upper surface of the preamplifier IC. .

The light-receiving element array and the preamplifier IC are mounted on light-receiving element holding means for holding one end of a pair of guide pins. It may be optically coupled to a fiber.

Further, the plurality of optical fibers are fixed to fiber holding means held by the pair of guide pins, and the light receiving element holding means and the fiber holding means are inserted into the pair of guide pins. The plurality of light receiving elements and the plurality of optical fibers may be optically coupled.

Further, the light receiving element holding means includes a first holding part for holding the guide pin and a second holding part for holding the plurality of light receiving elements, and the second holding part is provided with the first holding part.
The positioning may be performed based on the holding unit.

Further, the fiber holding means and the light receiving element holding means may be integrally held by resin molding.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements will be denoted by the same reference symbols, without redundant description.

FIG. 1 is a perspective view showing an optical parallel transmission receiver immediately after resin molding according to an embodiment of the present invention. The optical parallel transmission receiver according to the present embodiment includes a pair of guide pins 1, an MT ferrule 2 for holding a multi-core optical fiber, and a PD subcarrier 3 for holding a light receiving element in a lead frame 4.
Together with resin molding, a mold package 5 is formed.

Thereafter, the leads extending from the sides and the rear of the mold package 5 are cut from just before the support leads, and the tie bars between the leads are cut.

In this embodiment, the mold package 5 is used as a fixing method, but it may be fixed by a metal package or a plastic package.

FIGS. 2 and 3 are perspective views showing the optical parallel transmission receiver according to this embodiment before resin molding. FIG.
FIG. 3 is a perspective view of the PD subcarrier 3 as seen from the MT ferrule 2 side, and FIG. 3 is a perspective view of the PD subcarrier 3 as seen from behind. Since these are all simplified diagrams emphasizing clarity, for example, only a part of the wires connecting the PD subcarrier 3 and the ceramic substrate 6 is illustrated.

The guide pins 1 and the lead frame 4 are held by a resin molding die, whereby the guide pins 1, MT ferrules 2, P
The relative position between the D subcarrier 3, the lead frame 4, and the ceramic substrate 6 is realized with high accuracy. At this stage, the guide pin 1, the MT ferrule 2, and the PD subcarrier 3 are assembled with high accuracy based on the guide pin 1.

The guide pin 1 is usually formed of metal,
It is configured to be longer than at least the total length of the MT ferrule 2 and the PD subcarrier 3 overlapped. Another MT ferrule (not shown) is inserted into the guide pin 1 protruding from the MT ferrule 2. Therefore, a taper is formed at the tip of the guide pin 1 to facilitate insertion. The guide pin 1 is inserted into the MT ferrule 2 and is not fixed. However, when the other MT ferrule is removed, the other MT ferrule is guided by the guide pin 1.
Guide pin 1 with a certain degree of rigidity so that
Are held in the MT ferrule 2. A plurality of V-shaped grooves are formed between the guide pins 1 at regular intervals in parallel with the longitudinal direction of the guide pins 1, and a plurality of optical fibers are fixed therein. Therefore, the arrangement pitch of the plurality of optical fibers is constant, and this usually matches the standard of the other MT ferrule.

The MT ferrule 2 has a function of holding at least a plurality of optical fibers and guide pins. Therefore, it has a fiber holding portion corresponding to the number of optical fibers to be held and a pin holding portion corresponding to the number of guide pins to be held. The detailed structure will be described later with reference to FIG.

The PD subcarrier 3 has a pair of through holes 3a.
And two plastic first flat plates 3b and second
It is composed of a flat plate 3c and a metal lead frame which partially includes the heat radiation lead pin 3d and the connection lead pin 3e and is sandwiched between the first flat plate 3b and the second flat plate 3c. It is mounted between the MT ferrule 2 and the ceramic substrate 16. In order to accurately position the PD subcarrier 3 on the MT ferrule 2, P
In the D subcarrier 3, a through hole 3a for receiving one end of the guide pin 1 is formed penetrating from the surface of the PD subcarrier 3 facing the MT ferrule 2 to the opposite surface (see FIG. 3). Since the light receiving element array 3f and the preamplifier IC 3g are accurately mounted on the PD subcarrier 3 with reference to the through hole 3a, the PD subcarrier 3 is mounted on the MT ferrule 2 simply by inserting the PD subcarrier 3 into the guide pin 1. A plurality of optical fibers and a plurality of light receiving element arrays 3f mounted on the PD subcarrier 3 can be optically coupled easily and accurately. The heat dissipation lead pins 3d extending from both sides of the PD subcarrier 3 are effective for dissipating heat from the preamplifier conducted through the metal lead frame. It is possible. The connection lead pin 3e is PD
After the subcarrier 3 is packaged, it is bent into a substantially S-shape (see FIG. 3), so that wire bonding with the ceramic substrate 6 is facilitated. In the present embodiment, the PD subcarrier 3 and the ceramic substrate 6 are connected by wires, but the connection lead pins 3e and the electrode terminals on the ceramic substrate 6 may be directly connected.

The lead frame 4 includes support leads 4a forming a rectangular frame, islands 4b on which the ceramic substrate 6 is mounted, and lead pins 4c connecting the islands 4b and the support leads 4a.

The ceramic substrate 6 is mounted on the island 4b of the lead frame 4, but strict positioning is not required as long as the substrate is connected to the PD subcarrier 3 by wires. On the upper surface of the ceramic substrate 6, electronic circuits (such as a signal processing circuit, a waveform shaping circuit, and an amplifier circuit) necessary for driving the light receiving element are formed.

FIG. 4 is a perspective view of a sub-assembly combining a guide pin 1, an MT ferrule 2, and a PD subcarrier 3 which can be used in the present embodiment, as viewed from the MT ferrule 2 side. Is turned over and the subassembly is viewed from the PD subcarrier 3 side, FIG. 6 is a perspective view of the subassembly of FIG. 4 with the MT ferrule 2 removed, and FIG. 7 is an optical fiber and a light receiving element. 5 is a perspective view showing a state before the connection lead 3e is bent into a substantially S shape by omitting a half of the lid 2c of the MT ferrule 2 to show the connection state of FIG. In order to clearly show the details, the connection lead frame 3e and the preamplifier 3f are shown.
And the wire connecting the light receiving element array 3f and the preamplifier IC 3g are omitted.

What is important here is that a plurality of optical fibers (for example, a fiber array) and a plurality of light receiving elements are used with a guide pin as a mechanical reference so that the optical fiber and the light receiving surface of the light receiving element are orthogonal (optical coupling). An element (for example, a light receiving element array) is positioned with high accuracy. Although it was difficult to position the optical fiber and the light receiving element held by separate members with high precision in the order of μm, the holes for fixing the guide pins were provided on both members with high precision, so that the guide pins could be inserted through the guide pins. High precision positioning has been achieved.

Hereinafter, the guide pin 1, the MT ferrule 2, and the PD subcarrier 3 constituting this subassembly are
The description will be made sequentially with reference to FIGS. 8 to 11 based on FIGS. 4 to 7.

The guide pin 1 is usually formed in an elongated cylindrical shape in order to provide a positioning function between a plurality of members (MT ferrule 2 and PD subcarrier 3 in this embodiment) into which the guide pin 1 is inserted. 7 and 8). The material is formed of a material that does not deform or bend under the environment in which the receiver is used, for example, stainless steel. The amount by which the guide pin 1 protrudes from the MT ferrule 2 is calculated in consideration of the connection with the mating MT connector or the MT ferrule inserted therein and the alignment of the optical axis. 1 is determined.

The MT ferrule 2 includes a lid 2c and a fiber holding member 2d (see FIGS. 6 and 8). The two plate members, that is, the lid 2c and the fiber holding member 2d are fitted together, and a pair of guide pins 1 and a plurality of optical fibers are held on the mating surfaces. Therefore, a pair of trapezoidal grooves forming a pair of through holes 2a into which the pair of guide pins 1 are inserted are formed in the lid 2c and the fiber holding member 2d, and a plurality of optical fibers are held in the fiber holding member 2d. A V-shaped groove 2b is formed (see FIGS. 6 and 8). Since these grooves are formed in parallel with each other, the guide pin 1 inserted into the MT ferrule 2 and all the optical fibers held by the MT ferrule 2 are held in parallel. On the side where the MT ferrule 2 faces the PD subcarrier 3, the light receiving element array 3
A recess 2e is formed to prevent interference between f and the wire connecting the preamplifier IC 3g.

The PD subcarrier 3 includes a first flat plate 3b, a second flat plate 3c, and a lead frame (see FIGS. 6 and 11). The first flat plate 3b is formed of a plastic material so that the outer contour becomes rectangular, and a first opening 3h for mounting the preamplifier IC 3g is formed above (or below) the center portion thereof, and below (or below). Above) a light receiving element array 3f holding a plurality of top-incident light receiving elements
Is formed in the second opening 3i. First
The opening 3h is formed wide enough to accommodate the preamplifier IC 3g, while the second opening 3i is formed with the optical fiber held by the MT ferrule 2 and the light receiving element array 3
The opening f matches the shape of the light receiving element array 3f so that f is positioned with high precision with respect to the guide pin 1. Therefore, on both sides of the second opening 3i, a hexagonal ridge having a hole 3a to be inserted for positioning the guide pin 1 is formed. The lead frame includes a large number of connection pins 3e extending in one direction (for example, downward), a small number of heat radiation pins 3d extending in the other direction (for example, sideways), a light receiving element array 3f, and a preamplifier 3g.
Is sandwiched between two first flat plates 3b and second flat plates 3c, including island portions 3j1 and 3j2 where
1). The connection lead pin 3e is connected to a signal source, ground, VDD, VGC, or the like, so that one end is bent in a substantially S shape and directed to the ceramic substrate 6, but the other end extends to the first opening 3h. (See FIGS. 4 and 11). The preamplifier IC 3g is formed in a substantially rectangular parallelepiped chip shape (see FIGS. 4 and 9), and an electrode (not shown) is formed on the upper surface. Therefore, it is possible to easily connect to the other end of the connection lead pin 3e by wire bonding. The second flat plate 3c has a function of sandwiching and fixing the lead frame between the first flat plate 3b and the through hole 3a for inserting the guide pin 1 only as an opening. 5). The guide pin 1 penetrates not only the first flat plate 3b but also the second flat plate 3c.
An escape portion is provided to escape (see FIG. 12). The preamplifier IC 3g and the light receiving element array 3f do not come into contact with the second flat plate 3c, but are placed on a metal lead frame so as to make surface contact (see FIG. 9). The heat can be efficiently dissipated through.

Next, the structure of the MT ferrule 2 and the PD subcarrier 3 constituting the subassembly will be described in more detail with reference to FIGS.

FIG. 8 is an exploded perspective view showing the MT ferrule together with the guide pin. A pair of trapezoidal grooves are formed on the back surface of the lid 2c constituting the MT ferrule 2, that is, on the surface facing the fiber holding member 2d, in parallel with a region near the side. The depth of the groove is the fiber holding member 2d
The guide pin 1 is calculated and determined so as not to float in the through hole 2a formed when the combination is performed. A plane is formed between these trapezoidal grooves, and this surface presses the upper surface of the optical fiber held by the fiber holding member 2d. On the other hand, in the fiber holding member 2d, a trapezoidal groove having a similar shape is formed at a position corresponding to the trapezoidal groove formed in the lid 2c. Therefore, when these two members are overlapped, a through-hole 2a that fits the guide pin 1 is formed. V-shaped grooves 2b are formed in parallel between the two trapezoidal grooves formed on the upper surface of the fiber holding member 2d by the number of optical fibers to be held (see FIG. 8). The V-shaped groove 2b is formed using the trapezoidal groove as a mechanical reference.
In these V-shaped grooves 2b, optical fibers longer than the entire length of the V-shaped grooves 2b are arranged. The lid 2c is
In a state where the guide pin 1 is not placed, it is fixed to the fiber holding member 2d with an adhesive, and then the guide pin 1 is inserted. After the optical fiber is held by the lid 2c and the fiber holding member 2d, the length of the optical fiber protruding beyond the V-shaped groove 2b is made uniform by end face polishing.

FIG. 9 is a perspective view showing a metal lead frame which is a component of the PD subcarrier 3. As shown in FIG. Light receiving element array 3f and preamplifier IC3 indicated by a two-dot chain line
g is displayed to indicate the positional relationship between the lead frame and the island portions 3j1 and 3j2 where the light receiving element array 3f and the preamplifier IC 3g are placed. As shown, the two island portions 3j1 and 3j2 are formed adjacent to each other, and the connection lead pin 3e extends to the vicinity of the island portion 3j2 where the preamplifier IC 3g is placed. Therefore, the wires required for the light receiving element array 3f and the preamplifier IC 3g, and the preamplifier IC 3g and the connection lead pins 3e are small, and the wire bonding can be easily performed. In the wire bonding, the electrode pads on the light receiving element array 3f and the preamplifier IC 3g are heated to a predetermined temperature, for example, 170.degree.
May be heated. The four lead pins 3d extending to the side orthogonal to the longitudinal direction of the connection lead pin 3e are mainly provided for heat dissipation, but these terminals can be used to provide a ground function. is there. An escape portion 3k through which the guide pin 1 passes is formed between the pair of lead pins 3d extending laterally.

In this embodiment, a single lead frame is used.
May be separated. By separating, the thermal influence from the preamplifier IC 3g, which generates a large amount of heat, on the light receiving element array 3f can be cut off.

FIG. 10 is a perspective view showing a state in which the above-described metal lead frame is sandwiched and fixed between the first flat plate 3b and the second flat plate 3c, and FIG. 11 is a connecting lead pin 3e shown in FIG.
It is a perspective view which shows the state which bent.

What is important here is that the light receiving element array 3f
Is positioned and formed with high accuracy (accuracy of 1 μm or less) in consideration of the outer dimensions of the light receiving element array 3f with reference to the positioning hole 3a into which the guide pin 1 is inserted. That is the point. The precision required here can be achieved by resin molding (plastic insert molding, transfer molding, etc.). Therefore, using plastic as the material of the first flat plate 3b and the second flat plate 3c is meaningful for realizing high accuracy. Furthermore, compared to a conventional silicon substrate that has been finely processed with high precision, there is no problem of parasitic capacitance, and the performance is improved. Furthermore, since the material is inexpensive, cost reduction of the product can be expected.

On the other hand, since the first opening 3h is not restricted by optical coupling with an optical fiber, and the preamplifier IC 3g is connected to the light receiving element array 3f and the connection lead pins 3e via wire bonding, the positional accuracy is high. It may be lower than the first opening 3i. Therefore, the first opening 3i
Is formed to be somewhat wider (about 2 mm wide while the width of the preamplifier IC mounting surface is about 1 mm) so that a jig (for example, a collet) used for wire bonding can be used without any trouble. . The distance between the first opening 3h and the second opening 3i is preferably narrowed in view of the requirement for connection with a short wire, but a width (for example, about 0.5
mm). That is, it is of the utmost importance that the second opening 3i is formed with high accuracy. for that reason,
The four corners of the second opening 3i correspond to the corners of the light receiving element array 3f.
In order to exclude the influence of the irregular shape of the corner of f, a portion corresponding to the corner is largely pierced. It is known that chips, burrs, and the like are easily generated at the corners of an array (usually a semiconductor chip) and are likely to be irregularly shaped. Hexagonal ridges are formed on both sides of the second opening 3i for positioning the guide pins 1 and preventing interference of bonding wires, and through holes 3a into which the guide pins 1 are inserted are formed therein. Have been. By forming the guide pin positioning raised portion in a hexagonal shape, a space accessible by a wire bonding jig is secured, and wire bonding between the light receiving element array 3f and the preamplifier IC 3g is facilitated. The entrance of the through hole 3a is tapered to facilitate insertion of the guide pin 1.

FIG. 12 shows a light receiving element array 3f and a preamplifier IC in the island portions 3j1 and 3j2 shown in FIG.
FIG. 3 is a perspective view showing a state where 3g is mounted and these are wire-bonded together with a guide pin 1 and an MT ferrule 2.

In the MT ferrule 2, all the optical fibers are accurately positioned with reference to the through hole 2a in which the guide pin 1 is inserted and fixed.
Similarly, all the light receiving elements of the light receiving element array 3f are accurately positioned with reference to the through hole 3a into which the guide pin 1 is inserted and fixed. Therefore, the optical coupling between the plurality of optical fibers and the plurality of light receiving elements can be achieved with high accuracy only by inserting the guide pins 1 into the through holes 1a and 3a.

Although one embodiment of the optical parallel transmission receiver according to the present invention has been described with reference to FIG. 1 to FIG. 12, the present invention is not limited to the above-described embodiment, and a wide variety of embodiments are possible. Deformation is possible.

For example, in the present embodiment, the light receiving element array 3f
In the above, a light receiving element array structure using a top illuminated light receiving element is used (see FIG. 12), but a so-called back illuminated light receiving element may be employed.

FIG. 13 shows a P-type photodetector using a back illuminated light receiving element.
FIG. 14 is a perspective view showing the D subcarrier 3 together with the MT ferrule 2 and FIG. 14 is a perspective view of the PD subcarrier 3 shown in FIG. The difference from the above-described embodiment is that firstly, since it is not necessary to prevent interference of wire bonding, hexagonal ridges are not formed on the MT ferrule 2 and the first flat plate 3b. Second, an opening is also formed in the second flat plate 3c in order to receive the light emitted from the optical fiber on the opposite surface (back surface) of the surface on which the electrode pads are formed.

The light emitted from the optical fiber is transmitted to the second flat plate 3c.
And enters the light receiving surface of the back illuminated light receiving element array 3f. The electric signal photoelectrically converted by the light receiving element array 3f is transmitted to the preamplifier IC 3g via a wire. The signal transmitted to the preamplifier IC 3g is sent to the connection lead pin 3e by wire connection. As described above, by using the back illuminated light receiving element array 3f, the shapes of the MT ferrule 2 and the PD subcarrier 3 can be simplified.

In the above embodiment, the light receiving element and the preamplifier are connected by wires, but one (for example, a light receiving element array) may be flip-chip mounted on the other (for example, a preamplifier IC).

FIG. 15 is a perspective view showing a connection state between the light receiving element array 3f and the preamplifier IC 3g used in the above-described embodiment, and FIG. 16 is a perspective view showing a connection method according to another embodiment.

The difference between the two is that, in the above-described embodiment, the light receiving element array 3f and the preamplifier IC 3g are juxtaposed on the same plane, and the respective electrode pads are connected by wire bonding (see FIG. 15). In the connection structure according to the other embodiment, the use of the back illuminated light receiving element array eliminates the need for wire bonding between the light receiving element array 3f and the preamplifier IC 3g (FIG. 16).
reference).

According to the connection method according to the other embodiment,
In addition to reducing the mounting area, crosstalk between adjacent channels is reduced. For example, according to the wire bond connection method shown in FIG. 15, the mounting area is 3.5 mm × 3 mm, but according to the flip chip connection method shown in FIG. 16, the mounting area is 3.5 mm × 1.5 mm.

Regarding the crosstalk, an experiment was conducted under the following conditions shown in FIG. That is, when the input impedance of each channel is 100 ohms, the input capacitance of each channel is 0.5 pF, and the capacitance between adjacent channels other than wire wiring is 10 pF, the frequency is 10 ohms.
In the case of MHz, the crosstalk amount by the wire bond connection method was -66.7 dB, whereas the crosstalk amount by the flip chip connection method was -84.0 dB.
When the frequency is 100 MHz, the crosstalk amount by the wire bond connection method is -46.7 dB, whereas the crosstalk amount by the flip chip connection method is -6.
It was 4.0 dB. Further, when the frequency is 1 GHz, the crosstalk amount by the wire bond connection method is -2.
In contrast to 7.4 dB, the amount of crosstalk by the flip-chip connection method was -44.0 dB. The coupling capacity between wire bonds: C is such that the relative permittivity εr of the resin to be filled is 3.69, the wire length: L is 2 × 10 ⁻³ [m],
Wire radius r is 1 × 10 ^-5 [m], distance between wires: d
Is assumed to be 2.5 × 10 ⁻⁴ [m], C = (27.8 × εr × L) × 10 ⁻¹² / ln (d / r)
[F] can be calculated.

Next, a first embodiment of an optical parallel transmission transmitter according to the present invention is shown in FIGS. 17 to 26, a second embodiment is shown in FIGS. 27 to 38, and a third embodiment is shown in FIGS. 39 to 49. Then, each will be described.

The basic differences between the optical parallel transmission transmitter and the optical parallel transmission receiver are as follows. First, the latter has a structure in which the optical fiber and the light receiving surface of the light receiving element are orthogonal to each other, whereas the former has an optical fiber and the light emitting element whose emission directions are substantially the same. Second, the latter has a problem with the optical fiber core diameter (about 9 μm in the case of a single mode optical fiber) and the optical axis of the light receiving surface (about 100 μm ² ). Optical axis alignment with the diameter is required, and highly accurate positioning is required.

Hereinafter, a transmitter for optical parallel transmission according to the first embodiment will be described. In the description, the same reference numerals are used for components having the same function, and duplicate description is omitted.

FIG. 17 is a perspective view showing the optical parallel transmission transmitter immediately after resin molding. This transmitter for optical parallel transmission,
MT holding a pair of guide pins 11 and a multi-core optical fiber
A ferrule 12 and an LD subcarrier 13 holding a light emitting element are resin-molded together with a lead frame 14 to form a mold package 15.

Thereafter, the leads extending from the sides and the rear of the mold package 15 are cut from the front of the support leads, and the tie bars between the leads are cut.

In this embodiment, the mold package 15 is used as a fixing method, but it may be fixed by a metal package or a plastic package.

FIGS. 18 and 19 show an optical parallel transmission transmitter according to this embodiment before resin molding. FIG. 18 is an exploded perspective view showing the inside of the MT ferrule 12 and the LD subcarrier 13, and FIG. 19 is a perspective view showing a state where the lid of the LD subcarrier 13 is omitted. Since FIGS. 18 and 19 are simplified diagrams emphasizing clarity, for example, wires connecting the LD subcarrier 13 and the ceramic substrate 16 are omitted.

The guide pin 11 and the lead frame 14 are held by a resin molding die, whereby the guide pin 11, the MT ferrule 12, the LD subcarrier 13, the lead frame 14,
The relative position with respect to the ceramic substrate 16 is realized with high accuracy. At this stage, the guide pin 11 and the MT ferrule 1
2. The LD subcarrier 13 is assembled with high accuracy based on the guide pins 11.

The guide pin 11 is usually made of metal, and is configured to be longer than at least the entire length of the MT ferrule 12 and the LD subcarrier 13 juxtaposed. Another MT connector (not shown) is inserted into the guide pin 11 protruding from the MT ferrule 12. for that reason,
The tip of the guide pin 11 is tapered to facilitate insertion. The guide pin 11 is inserted into the MT ferrule 12 and is not fixed. However, when the other MT connector is disconnected, the guide pin 11 is held to the MT ferrule 12 with a certain degree of rigidity so that the other MT connector does not pull out the guide pin 11. Between the guide pins 11, a plurality of V-shaped grooves are formed at regular intervals in parallel with the longitudinal direction of the guide pins 11, and a plurality of optical fibers are fixed therein. Therefore, the arrangement pitch of the plurality of optical fibers is constant, and this usually matches the standard of the other MT connector.

The MT ferrule 12 has a function of holding at least a plurality of optical fibers and the guide pins 11. Therefore, it has a fiber holding portion corresponding to the number of optical fibers to be held and a pin holding portion corresponding to the number of guide pins 11 to be held. The detailed structure is shown in FIG.
1, will be described later with reference to FIG.

The LD subcarrier 13 has a pair of through holes 1.
The first and second flat plates 13b and 13c made of plastic forming the 3a and the lead pin 13d for heat radiation are partially formed and a metal lead sandwiched between the first and second flat plates 13b and 13c. The MT ferrule 12 is composed of a frame and a lid 13 e,
And the ceramic substrate 16. In order to accurately position the LD subcarrier 13 on the MT ferrule 12, a through hole 13a for receiving one end of the guide pin 11 is formed in the LD subcarrier 13.
Since the light emitting element array 13f and the driver IC array 13g are accurately mounted on the LD subcarrier 13 with reference to the through hole 13a, the LD subcarrier 13 is attached to the MT ferrule 12 simply by inserting the LD subcarrier 13 into the guide pin 11. A plurality of optical fibers and LD subcarrier 13
Can be easily and accurately optically coupled to the plurality of light emitting element arrays 13f mounted on the optical disk. LD subcarrier 13
The heat radiation lead pins 3d extending from both sides are effective for releasing the heat from the driver conducted through the metal lead frame, but grounding is possible using the heat radiation lead pins 13d. In this embodiment,
The configuration is such that the LD subcarrier 13 and the ceramic substrate 16 are connected by wires. The lid 13e is
It is formed of a plastic material and is adhesively fixed to the first flat plate 13b. Thereafter, the guide pins 11 are inserted into the through holes 13a. The guide pin 11 may not be fixed in the through hole 13a.

The lead frame 14 includes support leads 14a forming a rectangular frame, islands 14b on which the ceramic substrate 16 is mounted, and lead pins 14c connecting the islands 14b and the support leads 14a.

The ceramic substrate 16 is formed of the lead frame 1
4 is mounted on the island 14b.
Strict positioning is not required as long as it is connected to the subcarrier 13. On the upper surface of the ceramic substrate 16, an electronic circuit (a signal processing circuit, a waveform shaping circuit, an amplification circuit, and the like) necessary for driving the light emitting element is formed.

FIG. 20 is a perspective view showing an LD subcarrier 13 which can be used in this embodiment together with a lead frame 14 and a ceramic substrate 16, wherein the MT ferrule 12 is omitted from the optical parallel transmission transmitter of FIG. Is equivalent to In order to clearly show the details, the ceramic substrate 16
A wire connecting the light emitting element array 13f to the driver IC array 13g and a wire connecting the light emitting element array 13f to the driver IC array 13g are omitted.

What is important here is that a plurality of optical fibers (for example, a fiber array) and a plurality of light emitting elements are used with a guide pin as a mechanical reference so that the optical axis of the optical fiber coincides with the optical axis of the light emitting element. (For example, a light emitting element array) is positioned with higher precision. It was difficult to position the optical fiber and the light emitting element held by separate members with high precision in the order of μm, but by providing the holes for fixing the guide pins in both members with high precision, the High precision positioning has been achieved.

Hereinafter, the guide pin 11, the MT ferrule 12, the LD subcarrier 1 constituting this subassembly will be described.
3 will be described in order based on FIG. 20 with reference to FIGS. 21 to 26.

The guide pin 11 is usually formed in an elongated cylindrical shape in order to provide a positioning function between a plurality of members (in this embodiment, the MT ferrule 12 and the LD subcarrier 13) into which the guide pin 11 is inserted. 20 and 26). The material is formed of a material that does not deform or bend under the environment where the transmitter is used, for example, stainless steel. The amount by which the guide pins 11 protrude from the MT ferrule 12 is calculated in consideration of the connection with the mating MT connector or MT ferrule inserted therein and the alignment of the optical axis, and based on this calculated value,
The total length of the guide pin 11 is determined.

The MT ferrule 12 includes a lid 12c and a fiber holding member 12d (FIG. 2).
1, see FIG. 22). Two plate members, namely lid 1
The 2c and the fiber holding member 12d are fitted together, and a pair of guide pins 11 and a plurality of optical fibers 12e are held on the mating surfaces. Therefore, a pair of trapezoidal grooves forming a pair of through holes 12a into which the pair of guide pins 11 are inserted are formed in the lid 12c and the fiber holding member 12d, and a plurality of optical fibers 12e are formed in the fiber holding member 12d. A V-shaped groove 12b to be held is formed (see FIGS. 21 and 22). Since these grooves are formed in parallel with each other, the guide pin 11 inserted into the MT ferrule 12 and all the optical fibers 12e held by the MT ferrule 12 are held in parallel. In the case of the receiver, in order to make the optical axis of the optical fiber orthogonal to the light receiving surface of the light receiving element, it is necessary to escape a wire connecting the light receiving element array and the preamplifier IC. Since the MT ferrules 12 are juxtaposed, the wire connection does not become an obstacle, and such consideration is not required.

The LD subcarrier 13 includes a first flat plate 13
b, the second flat plate 13c, and a lead frame (see FIGS. 23 and 24). The first flat plate 13b is formed of a plastic material so that the outer contour thereof is rectangular, and a driver IC array 13g is provided above (or below) the central portion thereof.
Is formed, and a second opening 13i for mounting the light emitting element array 13f is formed below (or above) the first opening 13h. First opening 13h
Is formed large enough to accommodate the driver IC array 13g, but the second opening 13i is formed with the optical fiber held by the MT ferrule 12 and the light emitting element array 1
The opening shape matches the shape of the light emitting element array 13f so that 3f is positioned with high accuracy. On both sides of the first opening 13h and the second opening 13i, trapezoidal grooves are formed to define through holes 13a into which the guide pins 11 are inserted. Lead frame for receiver (Fig. 9
Unlike the lead frame of this embodiment (see FIG. 23), a large number of connection pins 3e extending in one direction (for example, downward) are not provided. However, the first plate 13b and the second plate 13 include a small number of heat radiation pins 13d extending in the other direction (for example, sideways), island portions 13j1 and 13j2 on which the light emitting element array 13f and the driver IC array 13g are placed. 13c (see FIG. 26). The absence of the connection lead pin 3e is due to the driver IC
This is because the array 13g and the ceramic substrate 16 are directly connected by wires. The driver IC array 13g is formed in a substantially rectangular parallelepiped chip shape (see FIGS. 20 and 26).
An electrode (not shown) is formed on the upper surface. Therefore, it is possible to easily connect to the electrodes on the ceramic substrate 16 by wire bonding. Second flat plate 13c
Has a function of sandwiching and fixing the lead frame between the first flat plate 13b, and no opening is particularly formed. Unlike the lead frame for the receiver (FIG. 12), the guide pin 11 does not penetrate the first flat plate 13b and the second flat plate 13c, so that a relief portion for releasing the guide pin 11 is provided in the metal lead frame. Not (Fig. 23
reference). Driver IC array 13g and light emitting element array 1
23f does not contact the second flat plate 13c, but is placed on the metal lead frame so as to make surface contact (FIG. 23).
See, for example, the heat from the driver IC array 13g.
Heat can be efficiently radiated through the lead pins 13d.

Next, the structures of the MT ferrule 12 and the LD subcarrier 13 constituting the subassembly will be described in more detail with reference to FIGS.

FIG. 21 is an exploded perspective view showing the MT ferrule together with the guide pin, and FIG. 22 is a perspective view of the guide pin and the MT ferrule of FIG. 21 viewed from below. A pair of trapezoidal grooves are formed on the back surface of the lid 12c constituting the MT ferrule 12, that is, on the surface facing the fiber holding member 12d, in parallel with a region near the side. The depth of the groove is calculated and determined so that the guide pin 11 does not float in the through hole 12a formed when the groove is combined with the fiber holding member 12d. The space between these trapezoidal grooves is flat, and the fiber holding member 12
The upper surface of the optical fiber held by d is pressed. On the other hand, a trapezoidal groove having a similar shape is formed on the fiber holding member 12d at a position corresponding to the trapezoidal groove formed on the lid 12c. Therefore, when these two members are overlapped, a through-hole 12a that fits the guide pin 11 is formed. Between the two trapezoidal grooves formed on the upper surface of the fiber holding member 12d, V-shaped grooves 12b are formed in parallel with the number of optical fibers to be held (see FIG. 22). The V-shaped groove 12b is formed using the trapezoidal groove as a mechanical reference. These V-shaped grooves 12b are provided with the V-shaped grooves 12b.
The optical fibers longer than the total length are arranged. The lid 12c is fixed to the fiber holding member 12d with an adhesive in a state where the guide pin 11 is not placed, and then the guide pin 11 is inserted. After the optical fiber is held by the lid 12c and the fiber holding member 12d, the length of the optical fiber 12e protruding beyond the V-shaped groove 12b is made uniform by end face polishing.

FIG. 23 is a perspective view showing a metal lead frame which is a component of the LD subcarrier 13.
Light emitting element array 13f and driver I indicated by a two-dot chain line
The C array 13g is displayed to show the positional relationship between the lead frame and the island portions 13j1 and 13j2 where the light emitting element array 13f and the driver IC array 13g are placed. As shown, two islands 1
3j1 and 13j2 are formed adjacent to each other. for that reason,
The number of wires required for the light emitting element array 13f and the driver IC array 13g is small, and wire bonding can be easily performed. The wire bonding utilizes the heat conduction effect via the lead frame to form the light emitting element array 13f.
Alternatively, the electrode pads on the driver IC array 13g may be heated to a predetermined temperature, for example, 170 ° C. 4 stretched to the side
Although the lead pins 13d are mainly provided for heat dissipation, these terminals can be used to provide a ground function.

In this embodiment, a single lead frame is used, but it may be separated into a light emitting element array and a driver IC array. By separating, the thermal influence from the driver IC array 13g, which generates a large amount of heat, on the light emitting element array 13f can be cut off.

FIG. 24 is a perspective view showing a state in which the above-described metal lead frame is sandwiched and fixed between the first flat plate 13b and the second flat plate 13c. FIG. 25 is a view showing FIG. 24 as viewed from the driver IC array mounting portion 13j1. FIG.

It is important that the light emitting element array 13
The second opening 13i, into which the guide pin 11 is inserted, is highly accurate (1 μm or less) with reference to the trapezoidal groove defining the positioning hole 13a into which the guide pin 11 is inserted, in consideration of the outer dimensions of the light emitting element array 13f. (Accuracy). The precision required here is achieved by resin molding (plastic insert molding, transfer molding, etc.). Therefore, using plastic as the material of the first flat plate 13b and the second flat plate 13c
It is meaningful to achieve high accuracy. Furthermore, compared to a conventional silicon substrate that has been finely processed with high precision, there is no problem of parasitic capacitance, and the performance is improved. Furthermore, since the material is inexpensive, cost reduction of the product can be expected.

On the other hand, since the first opening 13h is not restricted by optical coupling with an optical fiber and the driver IC array 13g is connected to the light emitting element array 13f and the ceramic substrate 16 via wire bonding, the positional accuracy of the first opening 13h can be improved. May be lower than the first opening 13i. Therefore, the first opening 13i is formed to be somewhat wider so that a jig (for example, a collet) used for wire bonding can be used without any trouble. A monitor light receiving element mounting portion 13m is provided between the first opening 13h and the second opening 13i. What is important here is that the monitor light-receiving element mounting portion 13m is inclined with respect to the surface including the light-emitting element emission portion so that the monitor light-receiving device 13p mounted thereon receives the light emitted from the light-emitting device obliquely. This is the point that is formed. Therefore, the reflected light from the light receiving surface of the monitoring light receiving element 13p does not enter any of the light emitting elements, thereby enhancing the performance of the light emitting elements. In order to provide the monitor light receiving element 13p with such a function, the monitor light receiving element mounting portion 13m is inclined with respect to the emission surface of the light emitting element array, and metallized wirings 13n1 are provided on both sides of the monitor light receiving element 13p. 13n2 is growing. Monitor light receiving element 1
3p has a light receiving surface formed on the upper surface, one electrode formed on the upper surface, and one electrode formed on the back surface. Therefore, one metallized wiring 13
While n1 is in contact with the back surface of the monitor light receiving surface, the other metallized wiring 13n2 is spaced apart and connected by, for example, wire bonding.

FIG. 26 shows a state where the light emitting element array 13f, the driver IC array 13g, and the monitoring light receiving element 13p are mounted on the island portions 13j1, 13j2 and the monitoring light receiving element 13m shown in FIG. 1
1 is a perspective view shown together with FIG. In FIG. 26, wires and the like are omitted to emphasize clarity.

Although the MT ferrule 12 is not shown, a through hole 12 into which the guide pin 11 is inserted and fixed is provided.
All the optical fibers are accurately positioned based on a, and all the light emitting elements of the light emitting element array 13f of the LD subcarrier 13 are accurately positioned based on the through hole 13a into which the guide pin 11 is inserted and fixed. Positioned. Therefore, the guide pin 11 is connected to the through holes 11a and 13a.
The optical coupling between the plurality of optical fibers and the plurality of light emitting elements can be achieved with high accuracy only by inserting the optical fiber into the optical fiber.

Next, an optical parallel transmission transmitter according to a second embodiment will be described with reference to FIG. 17, FIG. 27 to FIG.

The basic difference between the optical parallel transmission transmitter according to the first embodiment and the optical parallel transmission transmitter according to the second embodiment is that the method of positioning the light receiving element array is not an opening but a groove. The lead frame forming the LD subcarrier 23 is formed on the first flat plate forming the LD subcarrier 23.
That is, they are separated into two. It is necessary to align the optical axis of the light emitting element and the core diameter of the optical fiber, and there is no change in the need for more accurate positioning.

Hereinafter, a transmitter for optical parallel transmission according to the second embodiment will be described. In the description, the same reference numerals are used for components having the same function, and duplicate description is omitted.

The transmitter for optical parallel transmission according to the second embodiment after resin molding has the shape shown in FIG. Since the functions and configurations are the same, the description is omitted.

FIGS. 27 to 29 show an optical parallel transmission transmitter according to this embodiment before resin molding. FIG. 27 shows lid 2
FIG. 28 is a perspective view showing a state in which 3e is removed from the ceramic substrate 26 side. FIG.
FIG. 29 is a perspective view of the ferrule 22 with the lid 22c removed, and FIG. 29 is a perspective view of the ferrule 22 with the lid 22c and lid 23e removed from the MT ferrule 22 side. FIG.
29 are simple diagrams emphasizing clarity, and for example, wires connecting the LD subcarrier 23 and the ceramic substrate 26 are omitted.

In this embodiment, since a plastic material is used for the LD subcarrier 23 and a transfer mold is used, a processing accuracy of 1 μm or less can be realized. Therefore, the core diameter of the single mode optical fiber (about 9
μm) and a light-emitting element.

The guide pins 21 and the lead frame 24 are held by a resin molding die, thereby fixing the guide pins 21 and M fixed by a mold package (see FIG. 17).
The relative positions among the T ferrule 22, the LD subcarrier 23, the lead frame 24, and the ceramic substrate 26 are realized with high accuracy. At this stage, the guide pin 21, the MT ferrule 22, and the LD subcarrier 23 are
Can be assembled with high accuracy based on

The guide pin 21 is usually formed of a metal, and is longer than at least the entire length of the MT ferrule 22 and the LD subcarrier 23 juxtaposed. Another MT ferrule (not shown) is inserted into the guide pin 21 protruding from the MT ferrule 22. Therefore, at the tip of the guide pin 21, in order to facilitate insertion,
A taper is formed. The guide pin 21 is not inserted and fixed to the MT ferrule 22.
However, when removing the other MT ferrule, the other MT ferrule is removed.
The guide pin 21 is held by the MT ferrule 22 with a certain degree of rigidity so that the ferrule does not pull out the guide pin 21. A plurality of V-shaped grooves are formed between the guide pins 21 at regular intervals in parallel with the longitudinal direction of the guide pins 21, and a plurality of optical fibers are fixed therein.
Therefore, the arrangement pitch of the plurality of optical fibers is constant, and this usually matches the standard of the other MT ferrule.

The MT ferrule 22 has a function of holding at least a plurality of optical fibers and the guide pins 21. Therefore, it has a fiber holding portion corresponding to the number of optical fibers to be held and a pin holding portion corresponding to the number of guide pins 21 to be held. Its detailed structure is
The description is omitted because it is not substantially different from the optical parallel transmission transmitter according to the embodiment (see FIGS. 21 and 22).

The LD subcarrier 23 has a pair of through holes 2.
3a, two first and second flat plates 23b and 23c made of plastic, and a lead pin 23d for heat radiation.
And a lid 23e formed between the first flat plate 23b and the second flat plate 23c, and the MT ferrule 22 and the ceramic substrate 26 with the guide pin 21 as a reference. It is located between them. In order to accurately position the LD subcarrier 23 on the MT ferrule 22, a through hole 23a for receiving one end of the guide pin 21 is formed in the LD subcarrier 23 (see FIG. 30). The LD subcarrier 23 has a through hole 2
Since the light emitting element array 23f and the driver IC array 23g are mounted with high accuracy on the basis of the reference 3a, only by inserting the LD subcarrier 23 into the guide pin 21, the plurality of optical fibers attached to the MT ferrule 22 and the LD
Plural light emitting element arrays 2 mounted on subcarrier 23
3f can be easily and accurately optically coupled. LD
The heat dissipation lead pins 23d extending from both sides of the subcarrier 23 are effective for dissipating heat from the driver conducted through the metal lead frame, but grounding is also possible using the heat dissipation lead pins 23d. It is. In this embodiment, the configuration is such that the LD subcarrier 23 and the ceramic substrate 26 are connected by wires. The lid 23e is formed of a plastic material, and is adhered and fixed to the first flat plate 23b with a transparent resin or the like. afterwards,
The guide pin 21 is inserted into the through hole 23a. The guide pin 21 does not need to be fixed in the through hole 23a.

The lead frame 24 includes support leads 24a forming a rectangular frame, islands 24b on which the ceramic substrate 26 is mounted, and lead pins 24c connecting the islands 24b and the support leads 24a.

The ceramic substrate 26 is a lead frame 2
4 is placed on the island 24b, and the LD
Strict positioning is not required as long as it is connected to the subcarrier 23. On the upper surface of the ceramic substrate 26, an electronic circuit (a signal processing circuit, a waveform shaping circuit, an amplifier circuit, an APC circuit, and the like) necessary for driving the light emitting element is formed.

FIGS. 30 and 31 are perspective views showing the LD subcarrier 23 usable in this embodiment together with the lead frame 24 and the ceramic substrate 26. FIG. In order to clearly show the details, the wires connecting the ceramic substrate 26 and the driver IC array 23g, the light emitting element array 23f
The wire connecting the driver IC array 23g and the driver IC array 23g is omitted.

What is important here is that a plurality of optical fibers (for example, a fiber array) and a plurality of light emitting elements are used with the guide pin as a mechanical reference so that the optical axis of the optical fiber matches the optical axis of the light emitting element. (For example, a light emitting element array) is positioned with higher precision. It was difficult to position the optical fiber and the light emitting element held by separate members with high precision in the order of μm, but by providing the holes for fixing the guide pins in both members with high precision, the High precision positioning has been achieved.

Hereinafter, the guide pin 21, the MT ferrule 22, the LD subcarrier 2
3 will be described in order based on FIGS.

FIG. 32 is a perspective view showing the LD subcarrier 23 omitting the lid 23e together with the MT ferrule 22.
FIG. 33 shows an LD subcarrier 23 in which the lid 23e is omitted.
FIG. 34 is a perspective view showing the first flat plate 23b and the second flat plate 23 constituting the LD subcarrier 23.
c, a perspective view showing two lead frames held by them, and FIG. 35 shows a state where the light emitting element array 23f, the driver IC array 23g, and the monitor light receiving element 23p are removed from the first flat plate 23b shown in FIG. FIG. 36 is a perspective view showing a metal lead frame which is one component of the LD subcarrier 23 according to the second embodiment.

The guide pin 21 is usually formed in an elongated cylindrical shape to provide a positioning function between a plurality of members (in this embodiment, the MT ferrule 22 and the LD subcarrier 23) into which the guide pin 21 is inserted. See FIG. 33). The material is formed of a material that does not deform or bend under the environment where the transmitter is used, for example, stainless steel. Guide pin 21 is MT ferrule 22
Is calculated in consideration of the connection with the mating MT connector or MT ferrule inserted therein and the alignment of the optical axis, and based on this calculated value, the guide pin 2
1 is determined.

The MT ferrule 22 includes a lid 22c and a fiber holding member 22d (FIG. 32).
reference). The two plate members, namely, the lid 22c and the fiber holding member 22d are fitted together, and a pair of guide pins 21 and a plurality of optical fibers 22e are held on the mating surfaces. Therefore, a pair of trapezoidal grooves forming a pair of through holes 22a into which the pair of guide pins 21 are inserted are formed in the lid 22c and the fiber holding member 22d, and a plurality of optical fibers 22 are formed in the fiber holding member 22d.
e is formed with a V-shaped groove 22b in which e is held.
1, see FIG. 22). Since these grooves are formed in parallel with each other, the guide pin 21 inserted into the MT ferrule 22 and all the optical fibers 22e held by the MT ferrule 22 are held in parallel. In the case of a receiver, to make the optical axis of the optical fiber orthogonal to the light receiving surface of the light receiving element,
It was necessary to escape the wire connecting the light receiving element array and the preamplifier IC to each other. In this case, since the LD subcarrier 23 and the MT ferrule 22 were juxtaposed, the wire connection did not hinder. Not required.

Lid 22 constituting MT ferrule 22
A pair of trapezoidal grooves are formed on the back surface of c, that is, on the surface facing the fiber holding member 12d, in parallel with a region near the side. The depth of the groove is calculated and determined so that the guide pin 21 does not float in the through hole 22a formed when the groove is combined with the fiber holding member 22d. A plane is formed between these trapezoidal grooves, and this surface presses the upper surface of the optical fiber held by the fiber holding member 22d. On the other hand, the fiber holding member 22d is
A trapezoidal groove having a similar shape is formed at a position corresponding to the trapezoidal groove formed in c. Therefore, if these two members are overlapped, the through-hole 22a that fits the guide pin 21
Is formed. V-shaped grooves 22b are formed in parallel between the two trapezoidal grooves formed on the upper surface of the fiber holding member 22d by the number of optical fibers to be held (FIG. 2).
1). The V-shaped groove 22b is formed using the trapezoidal groove as a mechanical reference. In the V-shaped grooves 22b, optical fibers longer than the entire length of the V-shaped grooves 22b are arranged. The lid 22c is fixed to the fiber holding member 22d with an adhesive in a state where the guide pin 21 is not placed, and then the guide pin 21 is inserted. Lid 22
After the optical fiber is held by c and the fiber holding member 22d, the length of the optical fiber 22e projecting beyond the V-shaped groove 22b is made uniform by end face polishing.

The LD subcarrier 23 has a first flat plate 23
b, a second flat plate 23c, a lead frame, and a lid 23e (see FIGS. 29 and 32). First flat plate 2
3b is formed of a plastic material so that the outer contour is rectangular, and a driver I is provided above (or below) the central portion thereof.
A first groove 23h for mounting the C array 23g is formed, and a second groove 23i for mounting the light emitting element array 23f is formed below (or above) the first groove 23h. The first groove 23h is formed wide enough to accommodate the driver IC array 23g.
The opening shape matches the shape of the light emitting element array 23f so that the optical fiber held by the T ferrule 22 and the light emitting element array 23f are positioned with high accuracy.
On both sides of the first groove 23h and the second groove 23i, trapezoidal grooves are formed to define holes 23a into which the guide pins 21 are inserted. Unlike the lead frame for the receiver (see FIG. 9), the lead frame of this embodiment (see FIG. 36) is not provided with a large number of connection pins 3e extending in one direction (for example, downward). However, the two first flat plates 23b and the second flat plate 23 include a small number of heat radiation pins 23d extending in the other direction (for example, sideways), island portions 23j1 and 23j2 on which the light emitting element array 23f and the driver IC array 23g are placed. 23c (see FIG. 26). The absence of the connection lead pin 3e is due to the driver IC
This is because the array 23g and the ceramic substrate 26 are directly connected by wires. The driver IC array 23g is formed in a substantially rectangular parallelepiped chip shape (see FIGS. 32 and 36).
An electrode (not shown) is formed on the upper surface. Therefore, it is possible to easily connect the electrodes on the ceramic substrate 26 by wire bonding. 2nd flat plate 23c
Has a function of sandwiching and fixing the lead frame between the first flat plate 23b, and no opening is particularly formed. Unlike the lead frame for the receiver (FIG. 12), the guide pin 21 does not penetrate through the first flat plate 23b and the second flat plate 23c. Not (Fig. 36
reference). The driver IC array 23g includes a second flat plate 23c.
However, since it is placed in surface contact with the metal lead frame (see FIG. 36), for example, heat from the driver IC array 23g can be efficiently dissipated through the lead pins 23d.

The light emitting element array 23f is mounted via a submount 23q on the light emitting element mounting surface 23j2 of the lead frame spatially separated from the driver IC array 23g (see FIGS. 35 and 36). ). The submount 23q has at least a function of adjusting the light emitting position of the light emitting element array 23f to the optical axis of the optical fiber. Therefore, the light emitting element array 23 whose light emitting element height is sufficiently high
When f is used, the submount 23q becomes unnecessary.

Light emitting element array 23f indicated by a two-dot chain line
And the driver IC array 23g (see FIG. 36) are displayed to show the positional relationship between the lead frame and the island portions 23j1 and 23j2 where the light emitting element array 23f and the driver IC array 23g are placed. Although a gap (space) is provided between the two island portions 23j1 and 23j2, they are arranged sufficiently close. Therefore, the light emitting element array 23f and the driver IC array 2
The wire required for 3 g is short, wire bonding can be easily performed, and thermal interference with each other is prevented. The wire bonding is performed by heating the electrode pads on the light emitting element array 23f and the driver IC array 23g to a predetermined temperature, for example, 170 ° C. by utilizing the heat conduction effect via the lead frame. The four lead pins 23d extending to the side are mainly provided for heat dissipation,
These terminals can be used to provide a ground function.

It is important that the light emitting element array 23
The second groove 23i into which the f is inserted (see FIG. 35) is highly accurate with reference to the trapezoidal groove defining the positioning hole 23a into which the guide pin 21 is inserted, in consideration of the outer dimensions of the light emitting element array 23f. (Accuracy of 1 μm or less). The precision required here can be achieved by resin molding (plastic insert molding, transfer molding, etc.). Therefore, the first flat plate 23
b, The use of plastic as the material of the second flat plate 23c is meaningful for achieving high accuracy. Furthermore, compared to a conventional silicon substrate that has been finely processed with high precision, there is no problem of parasitic capacitance, and the performance is improved. Furthermore, since the material is inexpensive, cost reduction of the product can be expected.

On the other hand, the first groove 23h has no restriction on optical coupling with an optical fiber, and the driver IC array 23g is connected to the light emitting element array 23f and the ceramic substrate 26 via wire bonding. It may be lower than the first opening 23i. Therefore, the first opening 23i is formed to be somewhat wider so that a jig (for example, a collet) used for wire bonding can be used without any trouble. A monitor light receiving element mounting portion 23m is provided between the first groove portion 23h and the second groove portion 23i (see FIG. 35).

What is important here is that the monitor light receiving element mounting portion 23m is mounted on the surface including the light emitting element emission portion so that the monitor light receiving element 23p mounted thereon receives the light emitted from the light emitting element obliquely. This is a point that is formed so as to be oblique to it. Therefore, the reflected light from the light receiving surface of the monitoring light receiving element 23p does not enter any of the light emitting elements, thereby enhancing the performance of the light emitting elements. In order to provide the monitor light receiving element 23p with such a function, the monitor light receiving element mounting portion 2 is provided.
3m is inclined with respect to the emission surface of the light emitting element array, and metallized wirings 23 are provided on both sides of the monitoring light receiving element 23p.
n1 and 23n2 are extended. Monitor light receiving element 23p
Has a light receiving surface on the upper surface, one electrode on the upper surface, and one electrode on the back surface. Therefore, one metallization wiring 23n1
Is in contact with the back surface of the light receiving surface for monitoring, but the other metallized wiring 23n2 is spaced apart, and is connected by, for example, wire bonding. Unlike the first embodiment,
Although a groove is provided instead of the opening in the present embodiment,
The light emitting element array 23f and the driver IC array 23g
For example, mounting can be performed with high accuracy by automatic recognition and positioning using the groove as a marker.

According to the optical parallel transmission optical receiver according to the second embodiment, the assemblability can be improved, the cost can be reduced, and the cost can be reduced by reducing the number of parts. Also, since the precision of the MT ferrule, the precision of the light emitting element, and the precision of their arrangement can be improved from the beginning, the guide pin of the MT ferrule is used as a mechanical reference, and the light emitting element is arranged on the guide pin. As a result, it is possible to perform an alignmentless assembly. Furthermore, the lens alignment work can be eliminated by the bad joint.

Next, based on FIGS. 37 and 38, FIG.
With reference to FIG. 36 to FIG. 36, the structures of the MT ferrule 22 and the LD subcarrier 23 constituting the subassembly of the optical transmitter for optical parallel transmission according to the modification of the second embodiment will be described.

FIG. 37 is a perspective view showing the LD subcarrier 23 from which the lid 23e is omitted, together with the guide pin 21 and the MT ferrule 22, and FIG.
FIG. 3 is a cross-sectional view of the LD subcarrier 23 cut along a plane orthogonal to the arrangement plane of the optical fibers.

The difference from the transmitter for optical parallel transmission according to the second embodiment is that the guide pins are arranged at a fixed angle with respect to the optical axis (see FIG. 38). By adopting such a structure, it is possible to prevent reflection of light incident on the optical fiber to the light emitting element.

Hereinafter, the guide pin 21, the MT ferrule 22, and the guide pin 21 constituting the optical transmitter for optical parallel transmission according to this modification are described.
The LD subcarrier 23 will be described in order.

The guide pin 21 and the MT ferrule 22
Since it is basically the same as that used in the second embodiment,
Description is omitted.

The LD subcarrier 23 is formed by a first flat plate 23
b, a second flat plate 23c, a lead frame, and a lid 23e, which are the same as the second embodiment, except that the through-hole 23a into which the guide pin 21 is inserted is formed to be inclined with respect to the lead frame. Different. Therefore, the groove defining the through hole 23a has a certain inclination with respect to the plane including the island portion of the lead frame. The degree of the inclination is calculated and determined so that the light emitted from the light emitting element enters the core of the optical fiber, but is generally inclined about 8 degrees. By adopting such a configuration, the guide pins 21 protruding from the MT ferrule 22 are simply inserted into the through holes 23a, and the light emitted from the plurality of light emitting elements is positioned so as to enter the cores of the corresponding plurality of optical fibers. Thus, the two optical elements can be optically coupled easily and accurately.

The first flat plate 23 on which the inclined groove is formed
b is formed of a plastic material so that the outer contour becomes rectangular, and a driver IC is provided above (or below) a central portion thereof.
A first groove 23h for mounting the array 23g is formed, and a second groove 23i for mounting the light emitting element array 23f is formed below (or above) the first groove 23h. The first groove 23h is formed wide enough to accommodate the driver IC array 23g.
The opening shape matches the shape of the light emitting element array 23f so that the optical fiber held by the T ferrule 22 and the light emitting element array 23f are positioned with high accuracy.
On both sides of the first groove 23h and the second groove 23i, trapezoidal grooves are formed to define holes 23a into which the guide pins 21 are inserted. Unlike the lead frame for the receiver (see FIG. 9), the lead frame of this embodiment (see FIG. 36) is not provided with a large number of connection pins 3e extending in one direction (for example, downward). However, the two first flat plates 23b and the second flat plate 23 include a small number of heat radiation pins 23d extending in the other direction (for example, sideways), island portions 23j1 and 23j2 on which the light emitting element array 23f and the driver IC array 23g are placed. 23c (see FIG. 26). The absence of the connection lead pin 3e is due to the driver IC
This is because the array 23g and the ceramic substrate 26 are directly connected by wires. The driver IC array 23g is formed in a substantially rectangular parallelepiped chip shape (see FIGS. 32 and 36).
An electrode (not shown) is formed on the upper surface. Therefore, it is possible to easily connect the electrodes on the ceramic substrate 26 by wire bonding. 2nd flat plate 23c
Has a function of sandwiching and fixing the lead frame between the first flat plate 23b, and no opening is particularly formed. Unlike the lead frame for the receiver (FIG. 12), the guide pin 21 does not penetrate through the first flat plate 23b and the second flat plate 23c. Not (Fig. 36
reference). The driver IC array 23g includes a second flat plate 23c.
However, since it is placed in surface contact with the metal lead frame (see FIG. 36), for example, heat from the driver IC array 23g can be efficiently dissipated through the lead pins 23d.

The light emitting element array 23f is mounted on the light emitting element mounting surface 23j2 of the lead frame spatially separated from the driver IC array 23g via a submount 23q (see FIGS. 35 and 36). ). The submount 23q has at least a function of adjusting the light emitting position of the light emitting element array 23f to the optical axis of the optical fiber. Therefore, the light emitting element array 23 whose light emitting element height is sufficiently high
When f is used, the submount 23q becomes unnecessary.

Light emitting element array 23f indicated by a two-dot chain line
And the driver IC array 23g (see FIG. 36) are displayed to show the positional relationship between the lead frame and the island portions 23j1 and 23j2 where the light emitting element array 23f and the driver IC array 23g are placed. Although a gap (space) is provided between the two island portions 23j1 and 23j2, they are arranged sufficiently close. Therefore, the light emitting element array 23f and the driver IC array 2
The wire required for 3 g is small, wire bonding can be easily performed, and thermal interference with each other is prevented. In the wire bonding, the electrode pads on the light emitting element array 23f and the driver IC array 23g may be heated to a predetermined temperature, for example, 170 ° C., by using a heat conduction effect via a lead frame. The four lead pins 23d extending to the side are mainly provided for heat dissipation, but these terminals can be used to provide a ground function.

It is important that the light emitting element array 23
The second groove 23i into which the f is inserted (see FIG. 35) is highly accurate with reference to the trapezoidal groove defining the positioning hole 23a into which the guide pin 21 is inserted, in consideration of the outer dimensions of the light emitting element array 23f. (Accuracy of 1 μm or less). The precision required here can be achieved by resin molding (plastic insert molding, transfer molding, etc.). Therefore, the first flat plate 23
b, The use of plastic as the material of the second flat plate 23c is meaningful for achieving high accuracy. Furthermore, compared to a conventional silicon substrate that has been finely processed with high precision, there is no problem of parasitic capacitance, and the performance is improved. Furthermore, since the material is inexpensive, cost reduction of the product can be expected.

On the other hand, the first groove 23h is not restricted by optical coupling with an optical fiber, and the driver IC array 23g is connected to the light emitting element array 23f and the ceramic substrate 26 via wire bonding. It may be lower than the first opening 23i. Therefore, the first opening 23i is formed to be somewhat wider so that a jig (for example, a collet) used for wire bonding can be used without any trouble. A monitor light receiving element mounting portion 23m is provided between the first groove portion 23h and the second groove portion 23i (see FIG. 35). What is important here is that the monitor light receiving element mounting section 23p is mounted so that the monitor light receiving element 23p mounted thereon receives the light emitted from the light emitting element obliquely.
m is a point formed so as to be oblique with respect to the plane including the light emitting portion of the light emitting element. Therefore, the reflected light from the light receiving surface of the monitoring light receiving element 23p does not enter any of the light emitting elements, thereby enhancing the performance of the light emitting elements. Monitor light receiving element 2
In order to provide the 3p with such a function, the monitor light receiving element mounting portion 23m is inclined with respect to the emission surface of the light emitting element array, and metallized wirings 23n1, 23n2 extend on both sides of the monitor light receiving element 23p. ing. The monitoring light receiving element 23p has a light receiving surface on the upper surface, one electrode on the upper surface, and one electrode on the rear surface. Therefore, one metallized wiring 23n1 is in contact with the back surface of the light receiving surface for monitoring, while the other metallized wiring 23n2 is spaced apart and connected by, for example, wire bonding.

The transmitter for optical parallel transmission according to the second embodiment and its modification have been described with reference to FIGS. 17 and 27 to 38. However, the present invention is not limited to the above embodiment. Instead, a wide variety of variations are possible.

Next, an optical parallel transmission transmitter according to a third embodiment will be described with reference to FIG. 17 and FIGS.

The basic difference between the optical parallel transmission transmitter according to the first embodiment and the optical parallel transmission transmitter according to the third embodiment is that the first flat plate 33b and the lid 33e constituting the LD subcarrier 23 are different. Is formed of a ceramic substrate and the lid 3
3e is that the monitoring light receiving element 33p is arranged. The difference from the second embodiment is that, in the third embodiment, the light emitting element and the monitoring light receiving element are separated and individually mounted on separate components. In addition, it is necessary to align the optical axis of the light emitting element and the core diameter of the optical fiber, and a more precise positioning is required. It is.

Hereinafter, a transmitter for optical parallel transmission according to the third embodiment will be described. In the description, the same reference numerals are used for components having the same function, and duplicate description is omitted.

The optical parallel transmission transmitter according to the third embodiment after resin molding has the shape shown in FIG. Since the functions and configurations are the same, the description is omitted.

FIGS. 39 and 40 show an optical parallel transmission transmitter according to this embodiment before resin molding. FIG. 39 is a perspective view showing the optical parallel transmission transmitter from the ceramic substrate 26 side, omitting the MT ferrule 32 from the optical parallel transmission transmitter before resin molding. FIG. It is a perspective view showing the state where it was removed. FIG. 39 and FIG.
Since this is a simplified diagram emphasizing clarity, for example, wires connecting the LD subcarrier 33 and the ceramic substrate 36 are omitted.

The guide pins 31 and the lead frame 34 are held by a resin molding die, thereby fixing the guide pins 31 and M fixed by a mold package (see FIG. 17).
The relative positions among the T ferrule 32, the LD subcarrier 33, the lead frame 34, and the ceramic substrate 36 are realized with high accuracy. At this stage, the guide pin 31, the MT ferrule 32, and the LD subcarrier 33 are connected to the guide pin 31.
Can be assembled with high accuracy based on

The guide pin 31 is usually made of metal, and is longer than at least the entire length of the MT ferrule 32 and the LD subcarrier 33 juxtaposed. Another MT connector (not shown) is inserted into the guide pin 31 projecting from the MT ferrule 32. for that reason,
The tip of the guide pin 31 is tapered to facilitate insertion. The guide pin 31 is not inserted into and fixed to the MT ferrule 32. However, when the other MT connector is disconnected, the guide pin 31 is held by the MT ferrule 32 with a certain degree of rigidity so that the other MT connector does not pull out the guide pin 31. Between the guide pins 31, a plurality of V-shaped grooves are formed at regular intervals in parallel with the longitudinal direction of the guide pins 31, and a plurality of optical fibers are fixed therein. Therefore, the arrangement pitch of the plurality of optical fibers is constant, and this usually matches the standard of the other MT connector.

Although the MT ferrule 32 is omitted in FIG. 39, its function is the same as that of the receiver for optical parallel transmission according to the first embodiment, and a function of holding at least a plurality of optical fibers and the guide pins 21. Having. Therefore, it has a fiber holding portion corresponding to the number of optical fibers to be held and a pin holding portion corresponding to the number of guide pins 31 to be held. The detailed structure is substantially the same as that of the transmitter for optical parallel transmission according to the first embodiment, and a description thereof will be omitted (see FIGS. 21 and 22).

The LD subcarrier 33 according to the third embodiment
Is the LD subcarrier 1 of the first embodiment and the second embodiment.
Compared with 3, 23, there is an advantage in that the number of parts is smaller and the structure is simplified, and a lead frame for the LD subcarrier 33 is not required. Therefore, the LD subcarrier 33 is composed of the first flat plate 33b and the lid 33e, and is mounted between the MT ferrule 32 and the ceramic substrate 36 with the guide pin 31 as a reference. High-precision LD subcarrier 33 MT ferrule 3
In order to position the LD subcarrier 33 in the second position, a through hole 33a for receiving one end of the guide pin 31 is formed in the LD subcarrier 33. The LD subcarrier 33 has a light emitting element array 33f (see FIG. 40) and a driver I based on the through hole 33a.
Since the C array 33g is mounted with high precision, the plurality of optical fibers attached to the MT ferrule 32 and the LD
Plural light emitting element arrays 3 mounted on subcarrier 33
3f can be easily and accurately optically coupled. In this embodiment, the configuration is such that the LD subcarrier 33 and the ceramic substrate 36 are connected by wires. The lid 33e is formed of a ceramic material, and is adhered and fixed to the first flat plate 33b. After that, the guide pin 31 is
3a.

The lead frame 34 includes support leads 34a forming a rectangular frame, islands 34b on which the ceramic substrate 36 is mounted, and lead pins 34c connecting the islands 34b and the support leads 34a.

The ceramic substrate 36 is a lead frame 3
4 is placed on the island 34b.
Strict positioning is not required as long as it is connected to the subcarrier 33. On the upper surface of the ceramic substrate 36, electronic circuits (such as a signal processing circuit, a waveform shaping circuit, an amplifier circuit, and an APC circuit) necessary for driving the light emitting element are formed.

FIGS. 41 to 44 are perspective views showing an LD subcarrier 33 usable in this embodiment, and FIGS.
9 is a perspective view showing a lid 33e of the LD subcarrier 33 that can be used in this embodiment. 41 to FIG.
4, in order to clearly show the details, the light emitting element array 33f
The wires connecting the driver IC array 33g and the driver IC array 33g are omitted.

What is important here is that a plurality of optical fibers (for example, a fiber array) and a plurality of light emitting elements are used with the guide pin as a mechanical reference so that the optical axis of the optical fiber matches the optical axis of the light emitting element. (For example, a light emitting element array) is positioned with higher precision. It was difficult to position the optical fiber and the light emitting element held by separate members with high precision in the order of μm, but by providing the holes for fixing the guide pins in both members with high precision, the High precision positioning has been achieved.

Hereinafter, the LD subcarrier 33 usable in the third embodiment will be described in more detail. What is important here is that a ceramic material is used as the material of the LD subcarrier, and a monitor light receiving element is attached to the back surface of the lid.

The LD subcarrier 33 has a first flat plate 33b.
And the lid 33e, and the first flat plate 33b is formed of a ceramic material having a rectangular outer contour. Unlike the LD subcarriers 13 and 23 (see FIGS. 24 and 35) according to the first and second embodiments, no openings are provided. A pair of trapezoidal grooves are formed in a flat substrate. A first region 33i for mounting the light emitting element array 33f is formed above (or below) the central portion thereof, and a second region for mounting the driver IC array 33g is formed below (or above) the lower region (or above).
A region 33h (not shown) is formed. Second area 3
3h is formed wide enough to mount the driver IC array 33g. Unlike the receiver and the LD subcarrier according to the first and second embodiments, the LD subcarrier according to the present embodiment has no lead frame. The driver IC array 33g is formed in a substantially rectangular parallelepiped chip shape (see FIGS. 41 to 44), and has electrodes (not shown) formed on the upper surface. Therefore, it is possible to easily connect the electrodes on the ceramic substrate 36 by wire bonding. Predetermined metallization patterns 33n1 and 33n2 are formed on the surface of the lid 33e, and a mounting portion 33q (FIG. 49) is provided at a position facing the light emitting element of the light emitting element array 33f.

By using ceramic as the material of the first flat plate 33b and the lid 33e, the problem of the parasitic capacitance is reduced and the performance is improved as compared with a conventional silicon substrate which is finely processed with high precision. Furthermore, since ceramic is a cheaper material than silicon, cost reduction of products can be expected.

On the other hand, the first region 33h is not restricted by optical coupling with an optical fiber, and the driver IC array 33g is connected to the light emitting element array 33f and the ceramic substrate 36 via wire bonding. It may be lower than the first area 33i. Therefore, the first area 3
3i is formed somewhat wide so that a jig (for example, a collet) used for wire bonding can be used without any trouble. A monitor light receiving element 33p is provided at a portion corresponding to the lid 33e disposed between the first area 33h and the second area 33i (see FIG. 41).

What is important here is that the monitor light receiving element mounting section 33q includes the light emitting element emitting section so that the monitoring light receiving element 33p mounted on the mounting section 33q receives the emitted light of the light emitting element obliquely. This is a point formed so as to be oblique to the plane (see FIGS. 41 and 47). Therefore, the reflected light from the light receiving surface of the monitor light receiving element 33p is
The performance of the light emitting element is enhanced without entering any light emitting element. In order to provide the monitor light receiving element 33p with such a function, the monitor light receiving element mounting portion 33q is inclined with respect to the emission surface of the light emitting element array 33f, and metallized wirings 33n1 are provided on both sides of the monitor light receiving element 33p. , 33
n2 is extended (see FIGS. 47 and 49). The monitor light receiving element 33p has a light receiving surface formed on the upper surface, one electrode formed on the upper surface, and one electrode formed on the rear surface. Therefore, one metallized wiring 33n1 is in contact with the back surface of the light receiving surface for monitoring, while the other metallized wiring 33n2 is spaced apart and connected by, for example, wire bonding.

According to the optical parallel transmission transmitter according to the third embodiment, the mounting area of 23 m allocated to the monitor light receiving element in the second embodiment is maintained without impairing the required functions.
(See FIG. 35) can be used effectively. Further, a more sophisticated pattern design can be realized on a ceramic substrate. Therefore, the degree of freedom in design can be increased. In addition, lid 33
e, by providing a region 33q on the back surface thereof in which a monitor light receiving element can be mounted, in addition to the guide pin holding function,
The board layout mounted on the light emitting element has a margin.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made.

[0134]

As described above, the present invention provides a structure which can easily realize an operation of optically coupling a plurality of optical fibers with a plurality of optical elements (light receiving elements, light emitting elements). can do.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an optical parallel transmission receiver immediately after resin molding according to an embodiment of the present invention.

FIG. 2 is a perspective view of a PD subcarrier 3 that can be used in a receiver for optical parallel transmission according to an embodiment of the present invention, as viewed from an MT ferrule 2 side.

FIG. 3 is a rear perspective view of a PD subcarrier 3 that can be used in the optical parallel transmission receiver according to one embodiment of the present invention.

FIG. 4 is a view showing a guide pin 1, an MT ferrule 2, and a guide pin which can be used in a receiver for optical parallel transmission according to an embodiment of the present invention.
Subassembly combining PD subcarrier 3 is denoted by M
It is the perspective view seen from T ferrule 2 side.

FIG. 5 is a perspective view of the subassembly of FIG. 4 turned upside down and the subassembly viewed from the PD subcarrier 3 side.

FIG. 6 is a perspective view of the subassembly of FIG. 4 with the MT ferrule 2 removed.

FIG. 7 omits a half of a lid 2c of an MT ferrule 2 to show a connection state between an optical fiber and a light receiving element that can be used in a receiver for optical parallel transmission according to one embodiment of the present invention; It is a perspective view which shows the state before bending the connection lead 3e in a substantially S shape for convenience.

FIG. 8 is an exploded perspective view showing an MT ferrule together with a guide pin that can be used in the optical parallel transmission receiver according to one embodiment of the present invention.

FIG. 9 is a perspective view showing a metal lead frame as one component of the PD subcarrier 3 that can be used in the optical parallel transmission receiver according to one embodiment of the present invention.

FIG. 10 is a perspective view showing a state where a metal lead frame that can be used in the optical parallel transmission receiver according to one embodiment of the present invention is sandwiched and fixed between a first flat plate 3b and a second flat plate 3c. is there.

FIG. 11 is a perspective view showing a state where the connection lead pin 3e of FIG. 10 is bent.

FIG. 12 is a sectional view of the island portion 3 shown in FIG. 11;
The light receiving element array 3f and the preamplifier IC 3 are provided for j1 and 3j2.
FIG. 2 is a perspective view showing a state in which g is mounted and these are wire-bonded together with a guide pin 1 and an MT ferrule 2.

FIG. 13 is a perspective view showing a PD subcarrier 3 using a back-illuminated light-receiving element, together with an MT ferrule 2, which can be used in a receiver for optical parallel transmission according to one embodiment of the present invention.

FIG. 14 is a perspective view of the PD subcarrier 3 shown in FIG. 13 as viewed from the back side.

FIG. 15 is a perspective view showing a connection state between a light receiving element array 3f and a preamplifier IC 3g that can be used in the optical parallel transmission receiver according to one embodiment of the present invention.

FIG. 16 is a perspective view showing a connection method according to another embodiment, which can be used for the optical parallel transmission receiver according to one embodiment of the present invention.

FIG. 17 is a perspective view showing an optical parallel transmission transmitter immediately after resin molding, which can be used for the optical parallel transmission transmitter according to the first embodiment of the present invention.

FIG. 18 is an exploded perspective view showing the inside of the MT ferrule 12 and the LD subcarrier 13 before resin molding, which can be used for the optical parallel transmission transmitter according to the first embodiment of the present invention.

FIG. 19 is a perspective view showing a state where the lid of the LD subcarrier 13 is omitted, which can be used for the optical parallel transmission transmitter according to the first embodiment of the present invention.

FIG. 20 is a perspective view showing an LD subcarrier 13 that can be used in the optical parallel transmission transmitter according to the first embodiment of the present invention, together with a lead frame 14 and a ceramic substrate 16, and FIG. This corresponds to a transmitter in which the MT ferrule 12 is omitted from the transmitter for parallel transmission.

FIG. 21 is an exploded perspective view showing an MT ferrule together with a guide pin that can be used in the optical parallel transmission transmitter according to the first embodiment of the present invention.

FIG. 22 is a perspective view of the guide pin and the MT ferrule of FIG. 21 as viewed from below.

FIG. 23 is a perspective view showing a metal lead frame as one component of the LD subcarrier 13 that can be used for the optical parallel transmission transmitter according to the first embodiment of the present invention.

FIG. 24 shows a first metal lead frame usable for the optical parallel transmission transmitter according to the first embodiment of the present invention.
It is a perspective view showing the state where it was pinched and fixed between flat plate 13b and 2nd flat plate 13c.

25 and FIG. 25 are perspective views showing FIG. 24 as viewed from the driver IC array mounting portion 13j1 side.

FIG. 26 is an island portion 1 shown in FIG. 24;
The state in which the light emitting element array 13f, the driver IC array 13g, and the monitoring light receiving element 13p are mounted on the 3j1, 13j2 and the monitoring light receiving element 13m is referred to as a guide pin 11.
It is a perspective view shown with it.

FIG. 27 shows an optical parallel transmission transmitter according to the first embodiment before resin molding, which can be used for the optical parallel transmission transmitter according to the second embodiment of the present invention. FIG. 13 is a perspective view showing the ceramic substrate 26 with a lid 23e removed.

FIG. 28 is a perspective view showing a state in which a lid 22c of the MT ferrule 22 has been further removed from the optical parallel transmission transmitter of FIG. 27;

FIG. 29 is a perspective view showing a state in which a lid 22c and a lid 23e are removed from the MT ferrule 22 side.

FIG. 30 is a perspective view showing an LD subcarrier 23 which can be used in a transmitter for optical parallel transmission according to a second embodiment of the present invention, together with a lead frame 24 and a ceramic substrate 26.

FIG. 31 is a perspective view of the transmitter for optical parallel transmission according to the second embodiment shown in FIG. 30, with a lid 23e of an LD subcarrier 23 removed.

FIG. 32 is an LD in which a lid 23e usable in a transmitter for optical parallel transmission according to a second embodiment of the present invention is omitted.
FIG. 3 is a perspective view showing a subcarrier 23 together with an MT ferrule 22.

FIG. 33 is a diagram illustrating an L-type transmitter for use in the optical parallel transmission transmitter according to the second embodiment of the present invention, in which the lid 23e is omitted.
FIG. 3 is a perspective view showing a D subcarrier together with guide pins.

FIG. 34 is a diagram illustrating a first flat plate 23b and a second flat plate 23c constituting an LD subcarrier 23, which can be used in the transmitter for optical parallel transmission according to the second embodiment of the present invention, and are held by these. It is a perspective view which shows two lead frames.

FIG. 35 is a first flat plate 23b shown in FIG. 34;
To light emitting element array 23f, driver IC array 23
g is a perspective view showing a state where the monitoring light receiving element 23p is removed.

FIG. 36 is a perspective view showing a metal lead frame as one component of the LD subcarrier 23 that can be used in the optical parallel transmission transmitter according to the second embodiment of the present invention.

FIG. 37 is a perspective view showing a guide pin 21 and an MT ferrule 22 that can be used in a transmitter for optical parallel transmission according to a second embodiment of the present invention, and an LD subcarrier 23 from which a lid 23e is omitted. is there.

FIG. 38 shows MT ferrules 22 and L that can be used in the optical parallel transmission transmitter according to the second embodiment of the present invention.
It is sectional drawing which cut | disconnected D subcarrier 23 in the surface orthogonal to the arrangement surface of an optical fiber.

FIG. 39 is a side view of the transmitter for optical parallel transmission before resin molding, in which the MT ferrule 32 is omitted and which can be used for the transmitter for optical parallel transmission according to the second embodiment of the present invention; FIG.

FIG. 40 is a perspective view showing a state where a lid 33e of the transmitter for optical parallel transmission in FIG. 39 is removed.

FIG. 41 is a perspective view showing an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

FIG. 42 is a perspective view showing an LD subcarrier 33 that can be used in the optical parallel transmission transmitter according to the third embodiment of the present invention.

FIG. 43 is a perspective view showing an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

FIG. 44 is a perspective view showing an LD subcarrier 33 that can be used for the optical parallel transmission transmitter according to the third embodiment of the present invention.

FIG. 45 is a perspective view showing a lid 33e of an LD subcarrier 33 that can be used in the optical parallel transmission transmitter according to the third embodiment of the present invention.

FIG. 46 is a perspective view showing a lid 33e of an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

FIG. 47 is a perspective view showing a lid 33e of an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

FIG. 48 is a perspective view showing a lid 33e of an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

FIG. 49 is a perspective view showing a lid 33e of an LD subcarrier 33 that can be used in a transmitter for optical parallel transmission according to a third embodiment of the present invention.

[Explanation of symbols]

1, 11, 21, 31, ... guide pins, 2, 12, 22,
32 ... MT ferrule, 3 ... PD subcarrier, 13,
23, 33... LD subcarriers, 4, 14, 24, 34
... lead frame, 5 ... mold package, 6 ... ceramic substrate.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H037 AA01 BA05 BA14 DA03 DA04 DA06 DA12 DA33 DA35 5F088 AA01 BB01 EA02 EA11 JA02 JA14 LA01

Claims (5)

[Claims] 1. An optical parallel transmission receiver comprising: a light receiving element array in which a plurality of light receiving elements are arranged in an array on a same semiconductor substrate; and a preamplifier IC in which a plurality of receiving circuits are integrated. A receiver for optical parallel transmission, wherein the light receiving element array is a back illuminated light receiving element, and the light receiving element array is flip-chip mounted on an upper surface of the preamplifier IC. 2. The light-receiving element array and the preamplifier IC are mounted on a light-receiving element holding means for holding one end of a pair of guide pins, and the plurality of light-receiving elements are provided with a plurality of light beams based on the pair of guide pins. 2. The receiver for optical parallel transmission according to claim 1, wherein the receiver is optically coupled to a fiber. 3. The plurality of optical fibers are fixed to fiber holding means held by the pair of guide pins, and the light receiving element holding means and the fiber holding means are inserted into the pair of guide pins. The optical parallel transmission receiver according to claim 2, wherein the plurality of light receiving elements and the plurality of optical fibers are optically coupled. 4. The light receiving element holding means includes a first holding part for holding the guide pin and a second holding part for holding the plurality of light receiving elements, wherein the second holding part is the first holding part. The optical parallel transmission receiver according to claim 2, wherein the receiver is positioned with reference to the following. 5. The optical parallel transmission receiver according to claim 3, wherein said fiber holding means and said light receiving element holding means are integrally held by resin molding.