JP2000195634A - Ic socket and contact pin for ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the cost of an IC socket by facilitating the work of installing, in a socket body, a seating plate for positioning an IC relative to a contact pin and facilitating the manufacture of a die for molding the seating plate. SOLUTION: In this IC socket, tip parts 40, 42 of portions engaging with a slit 28 in a seating plate 27, of a first contact part 32 and a second contact part 34 of a contact pin 17, are made thinner than the other parts of the contact pin 17, and therefore, when the seating plate 27 is mounted on a socket body 3, the thinned tip parts 40, 42 of the contact pin 17 smoothly engage with the slit 28. The tip parts 40, 42 guide the engagement of the contact pin 17 with the slit 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a process for removing an initial failure of an IC (burn-in test or handler test).
The present invention relates to an IC socket as a jig used in the above and a contact pin of the IC socket.

[0002]

2. Description of the Related Art In general, an IC socket is used to conduct an electrical test of an IC placed in a certain environment. In order to perform an electrical test, an IC lead is connected to an external electrical test circuit by contact pins made of a conductive material attached to the socket body. Are connected so that a voltage, a signal, or the like can be applied to the IC.

For example, an IC socket 100 shown in FIG.
A plurality of contact pins 102
Are attached, and the tip portions 102a and 102b of the contact pins 102 are engaged with the slits 104 of the seating plate 103 assembled to the socket body 101, whereby the contact pins 102 are positioned with respect to the leads of the IC (not shown). It has become so. As a result, the IC leads and the contact pins 102
Are surely in contact with each other, and a burn-in test or the like is accurately performed.

[0004]

However, as shown in FIGS. 18 and 19, such an IC socket 100 is provided with a plurality of thin contact pins 102, each of which has a distal end portion 102.
a and 102b are engaged with the narrow slits 104 of the seating plate 103, respectively, so it is difficult to engage the contact pins 102 and the slits 104, that is, to assemble the seating plate 103 to the socket body 101. Therefore, the efficiency of the assembling work was not good.

A technique disclosed in Japanese Utility Model Laid-Open Publication No. 3-88290 is known as a technique for facilitating the work of engaging the contact pin 102 with the slit 104 of the seating plate 103. As shown in FIG. 20, this technique uses a slit 10
A partition wall 105 between the contact pins 102 and 104 is tapered, the opening area of the slit 104 is increased, and the tip 102a (102b) of the contact pin 102 and the seating plate 1
The slit 104 is designed so as to be easily engaged. However, when the pitch between the leads of the IC becomes narrow, the thickness of the partition wall 105 between the slits 104 of the sheeting plate 103 becomes thin, so that it becomes difficult to manufacture a mold for molding the sheeting plate 103, and
This leads to a rise in the price of the socket 100.

Therefore, according to the present invention, the contact pins can be easily engaged with the slits of the seating plate without changing the mold shape of the seating plate, and the IC socket can be easily assembled. An object of the present invention is to provide an IC socket and a contact pin of the IC socket.

[0007]

According to a first aspect of the present invention, an integrated circuit (IC) is provided.
A socket body for vertically supporting a cover having an insertion window formed therein, and a plurality of socket bodies attached to the socket body;
An IC socket comprising: a contact pin for connecting a terminal of C to an external electrical test circuit; and a seating plate assembled to the socket body and positioning the contact pin. The contact pin has a base fixed to the socket body, a first contact connected to the base via a first spring, and supporting a terminal of the IC; and a second contact connected to the base. When the cover is pushed down, the cover is pushed by the cover to bend and deform the second spring portion, and the first
A second contact portion for retracting the IC from the contact portion and receiving the IC, and pressing the terminal against the first contact portion with the elastic restoring force of the spring portion when the cover returns to the original position;
It has. Also, the seating plate engages with a first contact portion of the contact pin to support and position the first contact portion, and a seating portion for attaching the first contact portion to the socket body. And a slit for engaging the contact portion and the second contact portion, guiding the first contact portion to the seat portion, and guiding and positioning the second contact portion to a predetermined position. I have. A tip of a portion of the first contact portion and the second contact portion that engages with the slit is formed to be thinner than other portions.

According to the present invention having such a configuration, when the seating plate is assembled to the socket body,
First, the thin portions formed at the first contact portion and the second contact portion of the contact pin smoothly engage with the slits of the seating plate, and are then guided by the thin portion to form the first contact portion of the contact pin. The part and the other part of the second contact part engage with the slit of the seating plate. Therefore, the present invention enables the seating plate to be smoothly and easily assembled to the socket body. When the seating plate is assembled at a predetermined position on the socket main body, the first contact portion of the contact pin is seated on the seating portion of the seating plate, and the first contact portion and the second contact portion are slits of the floating plate. Accurate positioning. Therefore, the first contact portion and the second contact portion
The terminals of the IC are securely clamped between the contact portions of the IC, and the electrical test of the IC is accurately performed.

According to a second aspect of the present invention, in the IC socket of the first aspect, the bottom of the slit guides the first contact portion to the seat portion while gradually bending and deforming the first spring portion. It is characterized by a sloping wall.

According to the present invention having such a structure, when the seating plate is assembled to the socket main body, the first plate is used.
Since the contact portion moves along the inclined wall of the slit, the first spring portion gradually bends and deforms, the frictional resistance acting between the first contact portion and the seating plate decreases, and the contact pin and the seating plate are moved. The work of engaging the plate is performed smoothly.

According to a third aspect of the present invention, in the IC socket according to the first or second aspect, a portion which is in contact with a bottom portion of the slit at a tip portion of the first contact portion is formed in an arc shape. It is characterized by.

According to the present invention having such a structure, when the seating plate is assembled to the socket body, even if the first contact portion contacts the bottom while changing the posture,
Since the tip portion of the first contact portion and the portion that contacts the bottom of the slit are formed in an arc shape, the first contact portion moves smoothly along the bottom of the slit. as a result,
The seating plate is smoothly assembled to the socket body.

According to a fourth aspect of the present invention, there is provided a socket body having a cover openably and closably attached thereto, a plurality of contact pins attached to the socket body to connect terminals of an IC and an external electric test circuit, And a floating plate for positioning and supporting the IC and engaging with the contact pin to position the contact pin. Then, the contact pin is connected to the base via the base fixed to the socket body, a flexibly deformable spring extending from the base, and the spring, and supports the terminal of the IC. A contact portion. Further, the floating plate includes a slit that engages with the contact portion. The contact portion is formed with an engagement guide piece that is thinner than the contact portion that guides the engagement between the contact portion and the slit.

According to the present invention having such a configuration, when assembling the floating plate to the socket body, first, the thin engaging guide piece is smoothly engaged with the slit of the floating plate, The contact portion is guided by the piece and the contact portion is smoothly engaged with the slit. Therefore, the floating plate can be smoothly and easily assembled to the socket body.

According to a fifth aspect of the present invention, a plurality of covers are mounted on a socket body for supporting a cover having an IC insertion window formed thereon so as to be vertically movable, and are engaged with positioning slits of a seating plate assembled to the socket body. A contact pin of an IC socket for connecting a terminal of the IC to an external electrical test circuit, the base being fixed to the socket body, and connected to the base via a first spring portion, A first contact portion supporting a terminal is connected to the base portion via a second spring portion, and when the cover is pushed down, the first contact portion is pushed by the cover and the second contact portion is pushed.
When the cover is returned to the original position, the terminal is resiliently restored by the spring portion, and the terminal is connected to the first contact portion. A second contact portion that presses the first contact portion and the second contact portion, the tip of the portion that engages with the positioning slit is formed to be thinner than other portions. It is characterized by having been done.

According to a sixth aspect of the present invention, a plurality of covers are attached to a socket body to which the cover can be opened and closed, and the cover is engaged with a positioning slit of a floating plate assembled to the socket body, so that terminals of the IC and an external electrical test are connected. A contact pin of an IC socket for connecting a circuit, the base being fixed to the socket body;
A flexure-deformable spring portion extending from the base portion, and a contact portion connected to the base portion via the spring portion and supporting a terminal of the IC, wherein the contact portion includes the contact portion; An engagement guide piece thinner than the contact portion for guiding engagement with the slit is formed.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[First Embodiment] FIGS. 1 to 3 show an IC socket 1 according to a first embodiment of the present invention, and show an open-top type IC socket 1. FIG. . As shown in these figures, the IC socket 1
Is mounted so that the cover 2 can move up and down on the upper part of the socket body 3. Specifically, a cover guide groove 4 is formed in the socket body 3, while a slide guide 5 is formed in the cover 2, and the slide guide 5 is slidably engaged with the cover guide groove 4. As a result, the cover 2 is guided by the cover guide groove 4 of the socket body 3 and moves up and down. The socket body 3 and the cover 2
Is formed of an insulating resin material. Also, four cover guide grooves 4 are formed on the end side of the side edge of the socket body 3 (see FIG. 2). The slide guide 5 of the cover 2 is formed so as to correspond to the cover guide groove 4 of the socket body 3.

Here, FIG. 2 shows the internal structure of the IC socket 1 by cutting the right half in the figure because the IC socket 1 is symmetrical. In FIG. 2, a pair of coil springs 6 are disposed between the socket body 3 and the cover 2 at substantially symmetric positions. The cover 2 is elastically supported on the socket body 3 by a pair of coil springs 6, and the cover 2 is uniformly supported by the pair of coil springs 6. For details, see Socket 3
Has a spring mounting hole 7 and a spring support projection 8.
Are formed. On the other hand, a spring mounting hole 10 corresponding to the spring mounting hole 7 of the socket body 3 is formed in the cover 2. One end of the coil spring 6 is engaged with the spring mounting hole 7 of the socket body 3 and the spring support projection 8,
The other end of the coil spring 6 is the spring mounting hole 1 of the cover 2
0 is engaged.

Here, the cover 2 has a coil spring 6
1 is assembled to the socket body 3 so as to compress the socket body 3 by a predetermined amount.
(Upward in FIG. 3) and the upper position thereof is positioned by the stopper means 11 (see FIG. 3).

The stopper means 11 includes a stopper projection 12 formed at the upper end of the cover guide groove 4 of the socket body 3.
And a claw 13 formed at the lower end of the slide guide 5 of the cover 2. When the claw 13 of the cover 2 comes into contact with the stopper projection 12 of the socket body 3, the upper end position of the cover 2 is positioned. The slide guide 5 of the cover 2 corresponds to FIGS.
As shown in FIG. 5, the protrusion 13 is formed in a cantilever shape, and is elastically deformed so that the claw 13 is pushed and expanded when the claw 13 gets over the stopper protrusion 12, thereby enabling the claw 13 and the stopper protrusion 12 to be smoothly engaged. Also, as shown in FIGS.
The slide guide 5 of the cover 2 is elastically deformed and pushed open by inserting a plate-like member (not shown) through a rectangular hole 14 formed in the cover 2 to release the engagement state between the claw 13 and the stopper projection 12. If the cover 2 is separated from the socket body 3 (moved upward in FIGS. 1 and 3), the cover 2 and the socket body 3 can be separated.

As shown in FIGS. 1-3, the socket body 3
The IC 15 shown in FIG. 11 (for example, TSOP, QF
A plurality of contact pins 17 for connecting terminals (leads) 16 of P) and an external electrical test circuit (not shown) are attached so as to correspond to the terminals 16 of the IC 15. The contact pins 17 have their bases 18 engaged with the pin mounting grooves 20 of the socket body 3, and the projections 21, 22, 23 of the base 20 are pressed into the engagement holes 24.
In addition, the base 20 of the contact pin 17 is connected to the socket main body 3 so as not to contact another adjacent contact pin 17.
(Insulated). The tip of the contact pin 17 is
Each of them is positioned by a slit 28 of the seating plate 27 and is separated by a rib 30 of the seating plate 27 so as not to contact the tip of another adjacent contact pin 17.

As shown in detail in FIGS. 4 to 9, the contact pins 17 are formed with protrusions 21, 22 formed on a base 18.
One of 23 (projection 21) projects below socket body 3, and this projection 21 is connected to an external electric test circuit (not shown). The projection 21 connected to an external electrical test circuit (not shown) is formed so as to be shifted between adjacent contact pins 17. That is,
As shown in FIG. 10, there are three types of contact pins 17 having different formation positions of the projections 21 connected to the external electrical test circuit (first to third contact pins 17a, 1a).
7b, 17c), for example, the first contact pin 17
a, the second contact pin 17b, and the third contact pin 17c in this order (see FIG. 1). As described above, by increasing the dimension between the adjacent protrusions 21, it becomes easy to form a circuit pattern of the external electrical test circuit.

These contact pins 17 are formed of a material having excellent conductivity and elasticity, such as beryllium copper, and are provided on the base 18 via a first spring portion 31 as shown in FIGS. Connected first contact portion 32 and base 1
8 has a second contact portion 34 connected via a second spring portion 33. Among them, the second contact portion 34 is
When the first contact portion 32 is set on the seating plate 27, the first contact portion 32 comes into contact with the upper surface 35 of the first contact portion 32. The first spring portion 31 and the second spring portion 33 are both formed in an arc shape, and when the first contact portion 32 is set on the seating plate 27, the first spring portion 31 becomes the first spring portion. Of the second contact portion 3 is pressed against the seating plate 27.
4 is pressed against the upper surface 35 of the first contact portion 32.

The upper end of the second spring part 33 has
As shown in FIG. 7, an arm 36 is formed to protrude upward in the figure. When the cover 2 is pressed down against the force of the coil spring 6, the arm 36 is pressed by an arc-shaped pressing portion slope 37 formed on the cover 2, and is displaced to a position indicated by a two-dot chain line in FIG. 1.

The seating plate 27 is shown in FIGS.
As shown in FIG.
An IC guide 38 that guides the four corners a and positions the IC 15 with respect to the contact pin 17 is formed.
The seating plate 27 has an IC as described above.
A plurality of slits 28 for positioning the tip of the contact pin 17 are formed so as to correspond to the terminal 16 of the IC 15 positioned by the guide 38. The seating plate 27 thus formed is shown in FIGS.
After the contact pins 17 are assembled to the socket body 3 as shown in FIG. 7, the contact pins 17 are assembled on the socket body 3 from above the socket body 3.

At this time, first, as shown in FIG. 4, the distal end portion 40 of the first contact portion 32 of the contact pin 17 is engaged with the slit 28 formed in the seating plate 27. As shown in FIG. 5, the distal end portion 40 of the first contact portion 32 is formed thinner than the other portion of the contact pin 17, and is designed to easily engage with the slit 28. That is, the distal end portion 40 of the first contact portion 32 is tapered by forming inclined surfaces 40a on both sides as shown in FIG. 5A, or as shown in FIG. It is formed in a thin plate shape having a substantially uniform thickness. However, in the case shown in FIG.
By forming so that b and the other portion are connected by a continuous curve 40c, the step between the thin portion 40b and the other portion (first contact portion 32) is devised so as not to be caught by the corner of the slit 28. There is a need to. In addition, the tip portion 40 of the first contact portion 32 is not limited to the case shown in FIG. 5, and when the seating plate 27 is assembled to the socket body 3,
What is necessary is just a thin part shape which can be smoothly engaged with the slit 28 of the seating plate 27. Here, a portion 40d of the distal end portion 40 of the first contact portion 32 that is in sliding contact with the slit bottom portion 41 is formed in an arc shape, and the first contact portion 3 is formed.
The distal end portion 40 of the first contact portion 32 and the slit bottom portion 41 are prevented from galling by the elastic force of the first spring portion 31 connecting the base 2 and the base portion 18.

Further, when the seating plate 27 moves downward while deforming the contact pins 17, the first contact portions 32 of the contact pins 17 slide in the slits 28 of the seating plate 27, and the second contact pins 17 move. The tip 42 of the contact portion 34 engages with the slit 28 of the seating plate 27. A thin portion (see FIGS. 5A and 5B) is formed at the distal end portion 42 of the second contact portion 34, similarly to the distal end portion 40 of the first contact portion 32. Therefore, the second contact portion 34
As shown in FIG. 7, similarly to the first contact portion 32, the thin end portion 42 smoothly engages with the slit 27 of the seating plate 27. Here, a portion 42a of the distal end portion 42 of the second contact portion 34 that contacts the slit bottom 41 is formed in an arc shape (see FIG. 7). In addition, the lower end 34 a on the distal end side of the second contact portion 34 slides on the chamfered portion 43 formed on the first contact portion 32, and the first contact portion 3
2 is formed in an arc shape so as to be able to move toward the upper surface 35 side.

Thereafter, as shown in FIG. 8, when the lower end of the seating plate 27 is placed on the socket body 3, the first contact portion 32 that slides along the inclined slit bottom 41 is seated 44. And the first contact portion 32 is seated on the seat portion 44 by the elastic force of the first spring portion 31. As a result, the first contact portion 32 is
And the seating portion 44. Also, the second contact portion 3
4 is positioned at a predetermined position on the first contact portion 32 by the slit 28. Here, as shown in FIGS. 2 and 3, a pair of claws 4 formed on the seating plate 27 are formed.
5 is detachably engaged with an engagement protrusion 46 formed on the socket body 3. The lower end 45 of the claw 45
a and the upper end 46a of the engagement protrusion 46 are chamfered, and when the claw 45 is engaged with the engagement protrusion 46, the claw 4
After the tip of 5 has slid over the chamfered portion of the tip of the engagement projection 46 and climbs over the engagement projection 46, the tip of the claw 45 engages with the engagement projection 46 by the restoring force of the beam 45 b of the claw 45. .
In FIG. 3, a pair of the claws 45 is formed at symmetrical positions in FIG. 3, and the left claw 45 in the figure is omitted.
2 and 3, a tool insertion hole 47 is formed at a position adjacent to the claw 45, and a tool (not shown) is inserted through the tool insertion hole 47 to engage the claw 45 with the engagement protrusion 46. Can be canceled.

In this embodiment constructed as described above, when the cover 2 is pressed down against the force of the coil spring 6 in FIG.
Is pressed by the arc-shaped pressing portion slope 37 formed on the cover 2 and is displaced to the position indicated by the two-dot chain line in FIG.

At this time, the second spring portion 33 bends and deforms counterclockwise in FIG. As a result, the second contact portion 34
Is retracted from the upper surface of the first contact portion 32, and the first contact portion 3
2 is released. In this state, the IC 15 is inserted into the cover 2 from the IC insertion window 48 formed in the cover 2, and the terminals 16 of the IC 15 are connected to the first contact portions 32.
It is placed on the upper surface of. Thereafter, when the pressing force applied to the cover 2 is released, the cover 2 returns to the original position by the spring force of the coil spring 6. As a result, the second spring portion 33 is displaced in the clockwise direction from the two-dot chain line position to the solid line position in FIG. 1, and the second contact portion 34 is displaced in the second spring portion 3.
The terminal 16 of the IC 15 is pressed against the upper surface of the first contact portion 32 by the elastic force of 3. Therefore, the terminal 16 of the IC 15
The first contact portion 32 and the second contact portion 34 reliably hold the sheet at a predetermined contact pressure. In this state, an external electrical test circuit (not shown) and the IC 15
Are electrically connected via contact pins 17 and
An electrical test of C15 is performed.

When the electric test of the IC 15 is completed, the cover 2 is pushed down against the spring force of the coil spring 6 and the arm 36 is pressed by the pressing portion slope 37 of the cover 2.
Is pressed, the second spring portion 33 is flexed and deformed, and the second contact portion 34 is retracted from the upper surface of the terminal 16 to the position indicated by the two-dot chain line in FIG.
And the process proceeds to the next IC 15 electrical test.

As described above, in the present embodiment, the distal end portions 40 and 42 of the first contact portion 32 and the second contact portion 34 of the contact pin 17 that engage with the slit 28 of the seating plate 27. However, since the contact pins 17 are formed thinner than the other portions, when the seating plate 27 is mounted on the socket body 3, the thinly formed distal end portions 40 and 42 of the contact pins 17 are smoothly engaged. The engagement between the contact pin 17 and the slit 28 is guided. As a result, according to the present embodiment, the seating plate 27 and the contact pins 17 are easily engaged, and the work of assembling the seating plate 27 to the socket body 3 can be easily performed.

In this embodiment, the contact pins 17
Of the first contact portion 32 and the second contact portion 34
By making the thicknesses 0 and 42 thin, the engagement between the slits 28 of the seating plate 27 and the contact pins 17 is facilitated, so that it is not necessary to perform a difficult process on a mold for manufacturing the seating plate 27. In addition, the cost of the mold can be reduced, and the cost of the open-top type IC socket 1 can be reduced.

[Second Embodiment] FIGS. 12 to 17 show the second embodiment.
9 shows a second embodiment of the present invention. The IC socket 50 shown in these figures is a clamshell type I socket.
It is a C socket.

In these figures, a base 54 of a contact pin 53 is engaged with a socket body 51 in a pin mounting groove 52 formed so as to correspond to a plurality of terminals 16 of the IC 15 shown in FIG. The contact pin 53 has a connection arm 55 extending downward from a base portion 54 and pressed into an engagement hole 56 of the socket body 51.
Is connected to an external electrical test circuit (not shown). The contact pin 53 includes a spring portion 57 extending upward from the base portion 54 in a cantilever manner, and a contact portion 58 formed at the tip of the spring portion 57. Then, the contact portion 58
A thin engagement guide piece 60 protrudes from the upper end of the cover. In addition to the contact pins 53 shown in FIGS. 12 and 13, two types of contact pins 53a and 53b having different formation positions of the connection arms 55 are sequentially arranged to secure a space between the connection arms 55 and 55. Thus, the circuit pattern of the external electrical test circuit is designed to be easily formed.

The engagement guide piece 60 has a tongue shape.
As shown in FIG. 15, the contact pin 53 is formed to be thinner toward the tip, and is formed to be thinner than the contact portion 58 of the contact pin 53, the spring portion 57, and the like. or,
The engagement guide piece 60 is provided with a floating plate 61.
The terminal 16 of the IC 15 mounted on the upper surface of the contact portion 58 is formed so as to be thinner than the width of the slit 62.
(See FIG. 13). Then, the engagement guide piece 60 engages the contact portion 58 of the contact pin 53 with the slit 6 of the floating plate 61.
2 is engaged with the floating plate 61 first.
Of the contact portion 58 and the slit 62
To guide the smooth engagement with

As shown in detail in FIG. 17, the floating plate 61 has a package 1 of the IC 15 on its upper surface.
There are formed four guide pieces 63 which engage with the four corners of 5a and guide the IC 15 to a predetermined position of the floating plate 61. In addition, in the floating plate 61,
A plurality of slits 62 are formed to correspond to the terminals 16 of the IC 15 as shown in FIG. The slit 62 of the floating plate 61 is formed in a size that can smoothly accommodate the contact portion 58 of the contact pin 53, and positions the contact portion 58 of the contact pin 53. The contact pins 53 are insulated from other contact pins 53 by partition walls 64 between the slits 62 of the floating plate 61.

The floating plate 53 thus constructed is mounted on the socket body 51 from above the socket body 51 as shown in FIGS. At this time, as described above, when the floating plate 61 is lowered, first, the engagement guide piece 60 of the contact pin 53 is moved to the slit 62 of the floating plate 61.
14 and 15, and the contact portion 58 of the contact pin 53 smoothly engages with the slit 62 of the floating plate 61 while being guided by the engagement guide piece 60. When the floating plate 61 is lowered to the position shown in FIG. 13, the lower surface side of the floating plate 61 is elastically supported by a spring (not shown) having a weak spring force attached to the socket body 51. In this state, the upper surface of the contact portion 58 of the contact pin 53 protrudes above the floating plate 61.

Thereafter, the IC is placed on the contact portion 58 of the contact pin 53 projecting upward from the floating plate 61.
Fifteen terminals 16 are placed (see FIG. 13). At this time, as described above, the package 15a of the IC 15 is guided by the guide piece 63 of the floating plate 61, and the terminal 16 of the IC 15 is positioned with respect to the contact portion 58 of the contact pin 53 (see FIG. See figure).

FIG. 16 shows a state in which the cover 65 attached to the socket body 51 so as to be openable and closable is closed. As shown in FIG. 16, the right end of the cover 65 is attached to the cover attaching portion 66 of the socket body 51 by a shaft 67.
And is always urged by a spring 68 wound around a shaft 67 in a direction (clockwise direction in the figure) that always opens. A hook 70 is rotatably attached to the left end of the cover 65 via a shaft 71. The hook 70 is provided with a claw 7 formed at the tip thereof.
2 is engaged with the engagement projection 73 of the socket main body 51 to hold the cover 65 in the closed position. The hook 70 is constantly urged in the counterclockwise direction in the figure by a spring 74 wound around a shaft 71, and the engaging projection 7 of the socket body 51 is urged by the elastic force of the spring 74.
3 is engaged. When the cover 65 is closed, the guide pieces 63 of the floating plate 61 are closed.
Are accommodated in holes 75 formed in the cover 65.

When the cover 65 is closed, the IC pressing projection 76 formed on the surface of the cover 65 facing the socket body 51 presses each terminal 16 of the IC 15 toward the contact portion 58 of the contact pin 53. It has become. At this time, since the contact portion 58 of the contact pin 53 is pressed downward in the drawing by the IC pressing protrusion 76 of the cover 65,
The spring portion 57 of the contact pin 53 flexes and deforms to elastically support the IC. As a result, the terminal 16 of the IC 15 contacts the contact portion 58 of the contact pin 53 with a desired contact pressure. In this state, the connection arm 55 of the contact pin 53
And an electrical test of the IC 15 is performed. And
After the electrical test of the IC 15 is completed, the cover 65
Is opened, and the IC 15 placed on the contact pin 53 is taken out.

In order to open the cover 65, the lever 70a of the hook 70 is operated to rotate the hook 70 in the direction of the arrow (clockwise) in the figure against the spring force of the spring 74. The engagement state between the hook 70 and the engagement projection 73 is released. By doing so, the cover 65 is automatically opened by the spring force of the spring 68 wound around the shaft 67 serving as the rotation fulcrum.

As described above, in the present embodiment, the floating plate 61 for positioning the contact portion 58 of the contact pin 53 and the terminal 16 of the IC 15 is connected to the socket body 51.
When assembling on top, first, floating plate 6
The engagement guide piece 50 formed thinly of the contact pin 53 is smoothly engaged with the first slit 62, and then guided by the engagement guide piece 50 so that the contact portion 58 of the contact pin 53 is smoothly floating plate. 61 is engaged with the slit 62. Therefore, according to the present embodiment, floating plate 61 and socket body 5
The first assembling operation can be easily performed.

In this embodiment, the contact pins 53
A structure is adopted in which a thin engaging guide piece 60 is formed, and the engagement of the engaging guide piece 60 with the slit 62 of the floating plate 61 and the contact pin 53 is adopted. Since the conventional structure for performing the processing is not employed, the processing of the floating plate 61 is facilitated, the mold cost of the floating plate 61 can be reduced, and the clamshell type IC socket 50 can be reduced in cost. Can be achieved.

[0046]

As described above, according to the present invention, the tip of the portion of the first contact portion and the second contact portion of the contact pin that engages with the slit of the seating plate is the other portion of the contact pin. When the seating plate is mounted on the socket body, the thinly formed distal end of the contact pin smoothly engages to guide the engagement between the contact pin and the slit. As a result, according to the present invention, the seating plate is easily engaged with the contact pin, and the seating plate is easily assembled to the socket body.

Further, the present invention has a structure in which the tip of the first contact portion and the second contact portion of the contact pin is formed to be thin, thereby facilitating engagement between the slit of the seating plate and the contact pin. Therefore, it is not necessary to perform a difficult process on a mold for manufacturing a sheeting plate, and the cost of the mold can be reduced.
The cost of the C socket can be reduced.

According to the present invention, when the floating plate for positioning the contact portion of the contact pin and the terminal of the IC is assembled on the socket body, first, the thin engagement of the contact pin is formed in the slit of the floating plate. The guide piece engages smoothly, and then is guided by the engagement guide piece, and the contact portion of the contact pin smoothly engages with the slit of the floating plate, so that the work of assembling the floating plate and the socket body can be easily performed. Will be

Further, the present invention adopts a structure in which a thin engaging guide piece is formed on the contact pin and the engagement between the slit of the floating plate and the contact pin is guided by the engaging guide piece. Since the conventional configuration of processing the edge is not adopted, the processing of the floating plate becomes easy,
The mold cost of the floating plate can be reduced, and the cost of the IC socket can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing a cross section of a left half of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a plan view of the IC socket.

FIG. 3 is a side view showing a cross section of a right half of the IC socket.

FIG. 4 is a first assembled state diagram of the seating plate.

FIG. 5 is a view showing a shape of a tip portion of a contact pin. FIG. 5A is a diagram showing a first shape example, and FIG.
(B) is a figure which shows the 2nd example of a shape.

FIG. 6 is a second assembled state diagram of the seating plate.

FIG. 7 is an enlarged view of a portion A in FIG. 6;

FIG. 8 is a third assembled state diagram of the seating plate.

FIG. 9 is an enlarged view of a portion B in FIG. 8;

FIG. 10 is a front view of a contact pin. FIG.
10A is a first shape diagram of a contact pin, and FIG.
FIG. 10B is a second shape diagram of the contact pin, and FIG.
(C) is the 3rd shape figure of a contact pin.

FIG. 11 is a diagram showing an IC. FIG. 11A is a plan view of the IC, and FIG. 11B is a front view of the IC.

FIG. 12 is a first assembled state diagram of an IC socket showing a second embodiment of the present invention.

FIG. 13 is a second assembled state diagram of the IC socket showing the second embodiment of the present invention.

FIG. 14 is an enlarged view of a main part of FIG.

FIG. 15 is an enlarged sectional view cut along the line CC of FIG. 14; FIG. 15A is a cross-sectional view showing a first shape of the contact pin, and FIG. 15B is a cross-sectional view showing a second shape of the contact pin.

FIG. 16 is a sectional view showing a state in which a cover of an IC socket according to a second embodiment of the present invention is closed.

FIG. 17 is a plan view of a floating plate.

FIG. 18 is an assembled state diagram of a conventional IC socket.

FIG. 19 is an assembled state diagram of a conventional contact pin and a seating plate.

FIG. 20 is an assembled state diagram of a contact pin and a seating plate showing another conventional example.

[Explanation of symbols]

1,50 ... IC socket, 2 ... Cover, 3,51 ...
... Socket body, 15 ... IC, 16 ... Terminal, 17,
53 ... contact pin, 18, 54 ... base, 27 ...
... sheeting plate, 28, 62 ... slit, 3
1 ... first spring part, 32 ... first contact part, 33 ...
2nd spring part, 34 ... 2nd contact part, 40, 42 ...
Tip part, 41: Slit bottom (bottom part), 44: Seating part, 48: IC insertion window, 57: Spring part, 58: Contact part, 60: Engagement guide piece, 61: Floating plate

Claims (6)

[Claims] 1. A socket body for vertically supporting a cover having an IC insertion window formed thereon, a plurality of contact pins attached to the socket body for connecting an IC terminal and an external electrical test circuit, and the socket. An IC socket, which is assembled to a main body and includes a seating plate for positioning the contact pin, wherein the contact pin is connected to the base via a first spring portion, the base being fixed to the socket main body. A first contact portion for supporting a terminal of the IC; a first contact portion connected to the base portion via a second spring portion; and when the cover is pushed down, the cover is pushed by the cover to bend and deform the second spring portion. And retracts from the first contact portion to receive the IC, and when the cover returns to the original position, the elastic restoring force of the spring portion causes the IC to move forward. A second contact portion for pressing a terminal against the first contact portion, wherein the seating plate engages with the first contact portion of the contact pin to support the first contact portion. And a seating portion to be positioned together with the first contacting portion and the second contacting portion when being assembled to the socket body to guide the first contacting portion to the seating portion and And a slit for guiding and positioning the second contact portion to a predetermined position, wherein a tip of a portion of the first contact portion and the second contact portion that engages with the slit is more distal than another portion. An IC socket characterized in that it is also formed to be thin. 2. The bottom of the slit is an inclined wall that guides the first contact portion to the seat portion while gradually bending and deforming the first spring portion. IC socket. 3. The IC socket according to claim 1, wherein a tip portion of the first contact portion and a portion that contacts the bottom of the slit are formed in an arc shape. 4. A socket body to which a cover is attached so as to be openable and closable; a plurality of contact pins attached to the socket body to connect a terminal of an IC to an external electrical test circuit; An IC socket comprising: a floating plate that positions and supports the IC and engages with the contact pins to position the contact pins; and a base where the contact pins are fixed to the socket body. A flexure-deformable spring portion extending from the base portion, and a contact portion connected to the base portion via the spring portion and supporting the terminal of the IC, wherein the floating plate is engaged with the contact portion. The contact portion guiding the engagement between the contact portion and the slit. IC socket, characterized in that the remote thin engagement guide piece is formed. 5. A plurality of covers are mounted on a socket body for vertically supporting a cover having an IC insertion window formed thereon, and are engaged with positioning slits of a seating plate assembled to the socket body, so that terminals of the IC are connected to terminals of the IC. A contact pin of an IC socket for connecting to an external electrical test circuit, comprising: a base fixed to the socket body; a base connected to the base via a first spring to support a terminal of the IC. The first contact portion is connected to the base portion via a second spring portion, and when the cover is pressed down, the cover is pushed by the cover to bend and deform the second spring portion. A second contact portion that presses the terminal against the first contact portion with the elastic restoring force of the spring portion when the cover is returned to the original position by retracting from the IC; A tip portion of a portion of the first contact portion and the second contact portion that engages with the positioning slit is formed to be thinner than other portions. Contact pin. 6. A plurality of covers are attached to a socket body to which the cover can be opened and closed, and are engaged with positioning slits of a floating plate assembled to the socket body to connect a terminal of the IC to an external electrical test circuit. A contact pin of an IC socket, a base fixed to the socket main body, a flexibly deformable spring extending from the base, and connected to the base via the spring to connect the terminal of the IC. A contact portion to support;
A contact pin for an IC socket, wherein the contact portion has an engagement guide piece thinner than the contact portion for guiding engagement between the contact portion and the slit.