JP2000195416A - Manufacture of image forming device, and image forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deformation of a pattern in printing to an insignificant level, and suppress the incidence of blurs or deformation and the increase in the number of processes to a minimum, by dividing an arrangement area of wiring on a rear plate into plural regions, and by executing successively wiring patterns in each divided area by printing of a screen printing method. SOLUTION: An arrangement area of lower wiring on a rear plate 1 is divided into 8-block lower wiring pattern area 2-9, in an oblong shape having several lines of the lower wiring as one block. An enlarged boundary part contains the lower wiring 13 connecting to a left-side element electrode 11 and a right-side element electrode 12, and P1 shows a picture element pitch in the lateral direction and P2 shows a pitch of the lower wiring 13 respectively, and the lengths are same in the case of P1=P2. The lower wiring pattern is divided into the areas, 2, 4, 6, 8 and 3, 5, 7, 9, and printed successively by a screen printing method, and formed in the order of figure (a) and figure (b). Hereby, a high-precision and large-area plate image display device, capable of preventing the incidence of blurs or deformation of an adjacent pattern, can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing method for a screen printing machine, and more particularly to a method for manufacturing an image display device using the printing method.

[0002]

2. Description of the Related Art At present, a cathode ray tube (CRT) is generally widely used as an image display device. Recently, a cathode ray tube having a display screen exceeding 30 inches has appeared. However, in order to enlarge the display screen of the cathode ray tube, it is necessary to increase the depth in accordance with the screen, and the larger the size, the heavier it becomes.
Therefore, in order to respond to a consumer's desire to view a powerful image on a larger screen, a CRT requires a larger installation space, and is not suitable. Therefore, the appearance of a thin, light, large-screen flat-panel image display device with low power consumption has been expected so that it can be mounted on a wall instead of a large and heavy cathode ray tube (CRT).

As a flat panel image display device, a liquid crystal display device (LCD) has been actively researched and developed.
Is not a self-luminous type, it requires a light source called a backlight, and most of the power consumption is used for the backlight. Further, LCDs still have problems such as dark images due to low light use efficiency, limited viewing angle, and difficulty in increasing the screen size to over 20 inches.

[0004] Instead of the LCD having the above-mentioned problems,
A thin self-luminous image display device is receiving attention. Examples of the display device include a plasma display panel (PDP) that excites and emits a phosphor by irradiating the phosphor with ultraviolet rays, a field emission type electron emission element (FE), and a surface conduction type electron emission element. For example, there is a flat panel image display device in which electrons emitted from the electron-emitting device are irradiated on the phosphor to excite the phosphor and emit light. Among them, PDPs having a large screen of about 40 inches have begun to be marketed.

The self-luminous image display device can obtain a brighter image than an LCD and has no problem of a viewing angle.

[0006] However, the PDP is suitable for enlargement of the screen, but is inferior in emission luminance and contrast as compared with a cathode ray tube. Also, the power consumption is still far from the desired value.

On the other hand, a display device using an FE or a surface conduction electron-emitting device has a light emission principle basically the same as that of a cathode ray tube. Therefore, there is a possibility that brightness and contrast can be achieved equivalent to those of a cathode ray tube.

The present applicant has paid attention to an image display device using a surface conduction electron-emitting device, among self-luminous flat plate image display devices. This is because the structure is relatively simple,
This is because it is suitable for forming a large area.

A surface conduction electron-emitting device is a device in which a voltage is applied to a conductive thin film made of fine particles formed on a substrate from a pair of electrodes called device electrodes to the conductive thin film. Electrons are emitted into a vacuum from the electron emission portion formed in the portion. The principle of an image display device using a surface conduction electron-emitting device is to emit light by irradiating a phosphor with electrons emitted from the surface conduction electron-emitting device.

The applicant of the present invention has previously described Japanese Patent Application Laid-Open No. 6-34263.
Japanese Patent Application Laid-open No. 6 discloses an example of an image display device using a surface conduction electron-emitting device as an electron source. FIG. 6 shows a schematic configuration of the surface conduction electron-emitting device disclosed in the above publication. FIG. 7 shows a schematic configuration diagram of an image display device using the surface conduction electron-emitting device disclosed in the above publication.

FIG. 6A is a plan view of the structure of the surface conduction electron-emitting device, and FIG. 6B is a cross-sectional view of the structure of the surface conduction electron-emitting device. In FIG. 6, reference numeral 101 denotes an insulating substrate;
04 is a conductive thin film made of fine particles, 102 and 103 are a pair of device electrodes for obtaining electrical connection with the conductive thin film 104, and 105 is an electron emitting portion.

In this surface conduction type electron-emitting device, the distance L between the pair of device electrodes 102 and 103 is several hundred μm.
The length W is set to several thousand μm, and the length W of the device electrodes 102 and 103 is determined in consideration of the resistance value of the device electrodes and the electron emission characteristics.
It is set to several μm to several hundred μm. In addition, the device electrode 10
The film thickness d of 2,103 is the conductive thin film 10 composed of fine particles.
The distance is set in the range of several hundreds to several μm in order to maintain an electrical connection with the fourth. The device electrodes 102 and 103 are formed by, for example, a photolithography technique.

The thickness of the conductive thin film 104 made of fine particles depends on the step coverage of the device electrodes 102 and 103,
It is appropriately set in consideration of the resistance value between the device electrodes, forming conditions, and the like, but is preferably set in the range of several μm to several thousand μm, and more preferably set in the range of 10 μm to 500 μm. Further, the resistance value of the conductive thin film 104 is preferably set such that Rs is 10 ² to 10 ⁷ Ω / □. Note that Rs has a thickness t, a width w, and a length a.
When the resistance measured in the length direction of the thin film of R is R, R = R
It is represented by s (a / w). Further, when the thickness t and the resistivity ρ are constant, it is expressed by Rs = ρ / t.

FIG. 7 is a schematic diagram showing an example of an image display device using a surface conduction electron-emitting device. In the figure, 1
005 is a rear plate, 1006 is an outer frame, and 1007 is a face plate. Outer frame 1006, rear plate 1
The connection portions of the face plate 1007 are sealed with an adhesive such as a low-melting glass frit (not shown) to form an envelope (airtight container) for maintaining the inside of the image display device in a vacuum. The substrate 1001 is fixed to the rear plate 1005. N × M surface-conduction electron-emitting devices 1002 are formed and arrayed on the substrate 1001 (N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels. ).

A surface conduction electron-emitting device 1002
Are wired by M row-direction wirings and N column-direction wirings 1003 and 1004, as shown in FIG. The row wiring 1003 and the column wiring 1004 are formed by, for example, a photolithography technique. The portion constituted by the substrate 1001, a plurality of electron-emitting devices such as the surface conduction electron-emitting device 1002, the row wiring 1003, and the column wiring 1004 is called a multi-electron beam source. Further, at least at a portion where the row wiring and the column wiring cross each other, an interlayer insulating layer (not shown) is formed between the two wirings, so that electrical insulation between the row wiring 1003 and the column wiring 1004 is ensured. Is kept.

A phosphor film 1008 made of a phosphor is formed on the lower surface of the face plate 1007, and phosphors of three primary colors of red (R), green (G), and blue (B) (not shown) are applied. Divided. In addition, a black body (not shown) is arranged between the phosphors of the respective colors constituting the fluorescent film 1008. Further, a metal back 1009 made of Al or the like is formed on the surface of the fluorescent film 1008 on the rear plate side.

In FIG. 7, Dx1-Dxm, D
y1 to Dyn and Hv are electric connection terminals having an airtight structure provided for electrically connecting the image display device and an electric circuit (not shown). Dx1 to Dxm are electrically connected to the column direction wiring 1004 of the multi-electron beam source. Similarly, Dy1 to Dyn are also electrically connected to the row wiring 1003 of the multi-electron beam source. Hv is electrically connected to the metal back 1009.

The inside of the envelope (airtight container) is 10 ⁻⁶ T.
The vacuum is maintained at or or more. Therefore, the larger the display screen of the image display device, the larger the envelope (airtight container)
A means for preventing deformation or destruction of the rear plate 1005 and the face plate 1007 due to a pressure difference between the inside and the outside is required. Therefore, the face plate 1007
In some cases, a support member (not shown) called a spacer or a rib for supporting atmospheric pressure resistance is disposed between the support plate and the rear plate 1005. In this way, the distance between the substrate 1001 on which the electron-emitting devices are formed and the face plate 1007 on which the fluorescent film is formed is generally maintained at several hundred μm to several mm, and the inside of the envelope (airtight container) is maintained at a high vacuum. Have been.

The above-described image display device comprises the external terminals Dx1 to Dxm, Dy1 to Dyn, and the row wiring 1
003, by applying a voltage to each surface conduction electron-emitting device through the column direction wiring 1004, electrons are emitted from each surface conduction electron-emitting device. At the same time, by applying a high voltage of several hundred V to several kV to the metal back 1009 through the external terminal Hv, the electrons emitted from the surface conduction electron-emitting device are accelerated, and the face plate 10
07 is made to collide with each color phosphor formed on the inner surface. Thereby, the phosphor is excited and emits light, and an image is displayed.

In order to form the above-mentioned image display device, it is necessary to form a large number of the above-mentioned electron-emitting devices, and row and column wirings.

As a method of forming a large number of the electron-emitting devices and the wirings in the row and column directions, a photolithography technique, an etching technique and the like can be mentioned.

However, for example, when forming an image display device having a large screen of several tens of inches using surface conduction electron-emitting devices, if a photolithography technique and an etching technique are used, a large substrate having a diagonal size of several tens of inches is used. In addition, large-scale manufacturing equipment such as an evaporation apparatus and a spin coater, an exposure apparatus, an etching apparatus, and the like are required, and there are problems such as difficulty in handling in a manufacturing process and an increase in cost.

Therefore, it is conceivable to form a large number of the above-described electron-emitting devices, row-direction and column-direction wirings by using a printing technique which is relatively inexpensive and does not require a vacuum device and can cope with a large area.

The present applicant has previously disclosed in Japanese Patent Application Laid-Open No. Hei 8-34110 that a large number of the row-direction wirings and the column-direction wirings are arrayed using a screen printing technique.

In screen printing, for example, an ink mixed with metal particles is used as a mask with a plate having an opening of a desired pattern as a mask, and the ink is printed and formed on the substrate, which is a printing medium, from the opening, followed by baking. Thus, a conductor wiring having a desired pattern is formed.

An example of the screen printing machine will be described below with reference to FIGS. 8 and 9, 2002
Is a plate frame, 2003 is a screen mesh, 2007 is a squeegee, 2016 is a work (substrate to be printed), 2017 is a pressing portion, 2018 is a plate pattern, 2019 is an ink pattern, 2020 is ink extruded from the squeegee 2007, and 2024 is a squeegee 2007 To work, 2023
Is a gap between the plate frame 2002 and the work 2016 as a printing medium. The screen mesh 2003 is formed on a resin film formed on a mesh made of a material such as stainless steel.
A plate pattern 2018 for discharging 020 is ejected and formed on the plate frame 2002 with appropriately set tension.

Next, the procedure of screen printing will be described below with reference to FIGS. First, as shown in FIG.
002 (that is, the surface of the screen mesh 2003) and the work (substrate to be printed) 2016 are set in a predetermined gap 2023. Next, the screen mesh 2003 is pressed
At 017, the squeegee 2007 is lowered until it comes into contact with the work (substrate to be printed) 2016. Next, the ink 2020 is set before the squeegee 2007. Next, the squeegee 2007 is lowered while the squeegee 2007 is lowered so that the screen mesh 2003 is always in contact with the work (substrate) 2016.
Is operated in the direction of the arrow in the figure to scrape the ink. that time,
As shown in FIG. 8, the ink 2020 is ejected onto a work (substrate) 2016 through the plate pattern 2018 by the pressure from the squeegee 2007. Such ink 2020
When the screen mesh 2003 moves away from the work (printed material) 2016 due to the restoring force derived from the vertical component of the tension 2024 of the screen pressing unit 2017 shown in FIG. The desired ink pattern 2 shown in FIG.
019 is formed.

[0028]

However, when the above-described screen printing method is used to form a large number of row-direction and column-direction wirings, the following problems may occur.

For example, the frame size of the screen plate is 750 ×
750mm (frame width 80mm), gap 3mm
When printing a pattern of 350 mm in height and 400 mm in width, and using a squeegee width of 450 mm, the squeegee pushes the plate up by about 80 μm, and this expansion becomes an error in printing accuracy. There was a problem that the pattern accuracy later was poor.

Further, since the screen plate is made of a warp yarn and a weft yarn in a mesh form, the tension of the yarn in the vertical direction is lower than that in the horizontal direction due to the manufacturing process. For this reason, when the warp yarns are placed in substantially the same direction as the squeegee direction, the printing accuracy in the vertical direction is worse than that in the horizontal direction. Furthermore, in general printing, since the printing is performed with a squeegee angle (hereinafter referred to as a bias) with respect to the squeegee direction, the influence of the bias angle and the tension balance of the yarn are involved, and the pattern shape after printing becomes trapezoidal. Or distorted.

Further, the present inventors have disclosed a division printing method as a method for improving the accuracy. However, when screen printing is performed on a portion adjacent to the preceding pattern, a part of the preceding pattern is printed. In order to prevent fading and deformation of the print pattern caused by contact of the screen plate, at least a drying step is performed.However, if drying is performed for each printing, the number of steps increases, and work is attached and detached from the printing apparatus. In addition, there is a problem that the work alignment must be performed each time, and the required time increases.

[0032]

In view of the above problems, the present inventor has solved the following problems. (1) At least a rear plate and a face plate, a plurality of electron emission portions corresponding to pixels on a one-to-one basis, and a vertical and horizontal interlayer insulating layer for supplying power to the electron emission portions on the rear plate. In the method of manufacturing a flat plate type image forming apparatus having an image forming member on the face plate, an area where the wiring of the rear plate is divided into a plurality of regions, Provided is a method for manufacturing a flat panel image device, wherein a wiring pattern is sequentially printed by a screen printing method every time. (2) In printing for each divided area, when performing printing of an area exceeding at least the pixel pitch with respect to a previously printed print pattern, the previously printed print pattern is subjected to a drying step. When printing is performed without performing at least an area having a pixel pitch or less, at least a drying step is performed on a previously printed print pattern, and then printing is performed.
The present invention provides a method for manufacturing a flat panel image device according to the item (1). (3) In the printing for each divided area, printing is performed for an area that exceeds at least the pixel pitch with respect to a printing pattern that has been printed earlier, and a printing pattern that has been printed earlier including the printing pattern is also included. On the other hand, after sequentially performing printing of at least the area exceeding the pixel pitch in advance, when printing the area of at least the pixel pitch or less, perform at least a drying step on the previously printed print pattern, Further, the present invention provides the method of manufacturing a flat plate type image forming apparatus according to the above item 2, wherein the printing procedure is repeatedly performed. (4) If the division method for each division area has a wiring pattern or an insulating layer pattern in the vertical direction, the division is performed only in the vertical direction so as to be divided into a plurality of wiring patterns or insulation patterns. In the case where there is a wiring pattern or an insulating pattern in the horizontal direction, the division pattern described in the above item 3 is such that it is divided only in the horizontal direction so as to be divided for each of a plurality of wiring patterns or each of the insulating patterns. A method of manufacturing a flat plate type image forming apparatus, wherein the printing procedure is repeated. (5) In the above-described division method, a printing method in which printing is performed sequentially while shifting the positional relationship between the plate and the substrate using a plate divided into 1 / n divided areas with respect to a pattern to be formed on the rear plate. And a method for manufacturing a flat plate type image forming apparatus, wherein the printing procedure described in the above item 3 is repeatedly performed. (6) To provide a flat plate type image forming apparatus using the wiring formed by the above manufacturing method.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described.
This will be described in detail with reference to the drawings.

[Embodiment] A method of forming a wiring formed on a rear plate according to the present invention will be described in detail. First, the electron-emitting device is formed either in the case where the electron-emitting device is formed directly on the rear plate or in the case where the electron-emitting device is formed on the rear plate via a substrate. As a substrate on which the electron-emitting device is formed, a flat plate made of a material such as glass is used, and a plurality of pixels of an image display section of a face plate which is aligned in a later process on a surface thereof are provided. A conductive thin film pattern is formed as an element electrode by an offset printing method or a photolithography method so as to correspond to almost the same position. next,
A lower wiring (same as the row wiring described in the conventional example), which is one of the parts related to the present invention, is formed by a screen printing machine. Further, an insulating layer and upper wiring (synonymous with the column wiring described in the conventional example) are formed in the same manner.

FIG. 1 is a view showing a method of manufacturing a lower wiring according to an embodiment of the present invention. In the figure, the arrangement area of the lower wiring of the rear plate is divided into eight strips by dividing several lines of the lower wiring into one block. 1 is a rear plate,
Reference numerals 2 to 9 denote lower wiring pattern areas each having several lines of the lower wiring as one block, 10 denotes an enlarged boundary portion of the lower wiring pattern area, 11 denotes a left element electrode, and 12 denotes a left element electrode.
Denotes a lower device electrode, and 13 denotes a lower wiring connected to the right device electrode 12. P1 indicates the pixel pitch in the horizontal direction, and P2
Indicates the pitch of the lower wiring. Incidentally, P1 and P2 have the same length. FIG. 1A shows a state in which the lower wiring pattern is printed in areas 2, 4, 6, and 8, and FIG.
(B) shows a state in which the lower wiring pattern is further printed on areas 3, 5, 7, and 9.

FIG. 2 shows the configuration of the screen printing apparatus used in the present embodiment.
Are the block patterns produced on the screen plate 20, 22
Is a squeegee and 23 is a scraper. The squeegee 22 and the scraper 23 are supported by an arm 24. Reference numeral 1 denotes a rear plate, which is placed on a table 25. The table 25 can move X, Y, and Θ for alignment. In particular, the direction (X direction) perpendicular to the squeegee traveling direction (Y direction) is an integral multiple of the pitch of the block pattern. Movement and precise positioning of 3 μm or less in a range are possible.

The present embodiment will be described in consideration of the pattern diagrams shown in FIGS. 1 and 2 and the outline of the screen printing apparatus. In this case, for the lower wiring to be formed, for example, a rear plate having a shorter vertical and horizontal length is used, and the wiring is formed in the vertical direction of the rear plate. At this time, the pattern of the lower wiring formed on the screen plate is a fraction of the area (finally, several hundred to several thousand wirings) formed on the substrate. , Blocks) are used on the screen plate only.

The number of divisions of the area is determined from 1/2 to 1/3, 1/4, 1/8, 1/16, the accuracy of the lower wiring to be printed, and the convenience of the process.
After using this screen plate and sweeping using silver paste as ink, squeezing is performed, and one area of the lower wiring is first printed on a rear plate arranged below the screen plate.

Next, printing of the next area is performed while shifting the relative positions of the screen plate and the rear plate. Then, a distance exceeding a horizontal pixel pitch (in this case, the line pitch is equal to the horizontal pixel pitch because the wiring is divided between lines) is separated from the preceding pattern, and the next pattern is printed.

Further, the printing of the next area is performed while sequentially shifting the relative positions of the screen plate and the rear plate. In this case as well, the minimum pattern, including the pattern printed immediately before,
The next pattern is printed at a distance exceeding the pixel pitch in the horizontal direction from the preceding pattern.

As described above, when printing the next area at least apart from the pixel pitch, the relative position of the screen plate and the rear plate is sequentially set while the rear plate is set on the table of the printing apparatus. Printing while shifting the position. The purpose of printing the next area at least at a distance exceeding the pixel pitch is to prevent the screen plate or the like from touching the previously printed pattern during printing. Thereafter, when printing at least a portion having a distance equal to or less than the pixel pitch from the preceding pattern, the paste, which is the printed print pattern, is always dried on the rear plate, which is the work. In some cases, baking after drying is also performed. Further, by repeating the above steps, it is possible to finally print the lower wiring capable of supplying power to one side of the element electrode pattern on the entire surface of one rear plate.

In the next step, when an insulating layer is formed on the lower wiring, printing is performed in the same manner as in the formation of the lower wiring as described above. In the case of the flat plate type image forming apparatus of the present invention, since the insulating layer has a linear insulating pattern in a direction perpendicular to the lower wiring, the division is also in the horizontal direction. In this case, too, at least the distance exceeding the vertical pixel pitch (in this case, the line pitch is the same as the vertical pixel pitch because the wiring is divided between the wiring lines), is separated from the preceding pattern by printing. When printing is performed with priority in order and printing of a portion smaller than the pixel pitch, at least the insulating paste is dried in advance for the preceding pattern. In some cases, baking after drying is also performed. By repeating this process, an insulating layer pattern can be finally printed on the entire surface on one rear plate.

Further, as the next step, when forming the upper wiring on the upper layer of the insulating layer, the printing is performed by the above-described method, so that the entire surface of one rear plate is finally formed.
The upper wiring can be printed.

As another embodiment, in addition to the above-described method of dividing the print area in either the vertical or horizontal direction, the print area is divided in both the vertical and horizontal directions, in other words, the area divided in the shape of a cross. The same can be applied to the printing method described above.

Further, using a plate divided into 1 / n divided areas with respect to the lower wiring pattern, the insulating layer pattern or the upper wiring pattern to be formed on the rear plate, and sequentially shifting the positional relationship between the plate and the substrate. In a printing method for performing printing, in a printing of a distance exceeding a pixel pitch with respect to a preceding pattern, a distance of a pitch corresponding to a division width divided into 1 / n (hereinafter referred to as a division pitch) is set. Printing is performed sequentially, and then when printing on a portion that is separated by the division pitch, a drying process is performed in advance (a firing process is also performed in some cases) in order to print the preceding pattern at a pixel pitch or less. Then, by performing printing, a desired pattern can be finally printed on the entire surface of one rear plate.

As described above, when the lower wiring, the insulating layer, and the upper wiring are formed separately on the element electrode, the drying step is not performed in printing at a distance exceeding the pixel pitch. When printing a portion that exceeds the pitch with priority, and when printing a portion that is less than the pixel pitch, high-definition and large-scale printing is performed by performing at least a drying step on the preceding pattern in advance. This realizes an image forming apparatus having a large area.

[0047]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.

[Embodiment 1] FIG. 1 is a view showing a method of manufacturing a lower wiring according to a first embodiment of the present invention. In the figure,
The area where the lower wiring is arranged on the rear plate is divided into eight strips by dividing several lines of the lower wiring into one block. 1 is a rear plate, 2, 3, 4, 5, 6, 7, 8, 9 are lower wiring pattern areas each having several lines of lower wiring as one block, and 10 is an enlarged boundary portion of the lower wiring pattern area. Where 11 is the element electrode left, 12 is the element electrode right,
13 is a lower wiring. P1 indicates the pixel pitch in the horizontal direction, and P2 indicates the pitch of the lower wiring. By the way, P1
And P2 are the same length. FIG. 5A shows a state in which the lower wiring pattern is printed on areas 2, 4, 6, and 8, and FIG. 4B shows a state in which the lower wiring pattern is further printed on areas 3, 5, 7, and 9. FIG.

FIG. 2 shows the structure of the screen printing apparatus used in this embodiment. Reference numeral 20 denotes a screen plate, reference numeral 21 denotes a block pattern produced on the screen plate 20, reference numeral 22 denotes a squeegee, reference numeral 23 denotes a scraper, and reference numeral 20 denotes a squeegee.
3 is supported by an arm 24. Reference numeral 1 denotes a rear plate, which is placed on a table 25. The table 25 can move X, Y, and の た め for alignment.
In particular, in the direction (X direction) perpendicular to the squeegee running direction (Y direction), movement by an integral multiple of the pitch of the block pattern and precise positioning of 3 μm or less in the range are possible.

The manufacturing method of the present invention will be described with reference to FIGS. In the present embodiment, an example is shown in which a region for forming a lower wiring is printed eight times using a screen printing apparatus. The rear plate is 400mm long and 45mm wide.
0 mm soda lime glass was used. In addition, device electrodes were formed in the pattern area in advance by an offset printing method. The pattern area at this time is about 350 mm long,
The width of the device electrode is about 400 mm, and the number of element electrodes is 480 at the vertical pitch of 730 μm, which is the same as the pixel pitch, and the horizontal pitch is 3
1328 pieces having a size of 00 μm were used.

First, as shown in FIG. 1A, screen printing was performed on a portion of the pattern area 2 where the lower wiring was to be formed, using a screen plate in which about 166 lower wiring patterns were arranged at a pitch of 300 μm. In the screen printing apparatus of FIG. 2, the table 25 is moved so that the lower wiring can be printed on the pattern area 2 of the rear plate 1.
Printed. The printing position of the lower wiring was printed so as to overlap a part of the right side 12 of the element electrode so that power could be supplied to the right side of the element electrode from the lower wiring.

The plate used at this time has a frame size of 750 × 7
# 360 of 50 mm (frame width 80 mm), silver paste was used as the paste, and the press-in amount of the plate during printing was 3
mm. Also, the width of the squeegee 22 is
A width of about 66 mm, that is, a width of one block, about 50 mm, with a margin of about 25 mm left and right, and about 100 mm was used.

Further, the table 25 was moved while the rear plate 1 was fixed and mounted on the table 25, and a lower wiring pattern was printed on the pattern area 4 of the rear plate. Next, the lower wiring pattern was printed on the pattern area 6 in the same manner, and then the lower wiring pattern was printed on the pattern area 8 in the same manner. As described above, the lower wiring pattern was printed on the areas 2, 4, 6, and 8. The printed portions of the areas 2, 4, 6, and 8 are the previously printed areas (area 2 for area 4, area 4 for area 6, area 8 for area 6, respectively).
For area 6), at least the pixel pitch P
This is an area corresponding to a distant position exceeding 1, and the corresponding area was printed before the table was shifted.

Next, the rear plate 1 was removed from the table of the printing press and dried at about 100 ° C.

Subsequently, a lower wiring pattern was printed on the pattern area 3 as shown in FIG. 1B. As shown in the screen printing apparatus of FIG.
The lower wiring was printed on the pattern area 3 of the rear plate. The plate and printing conditions used at this time were the same as when printing on area 2.

Further, the table 25 was moved while the rear plate 1 was placed on the table 25, and a lower wiring pattern was printed on the pattern area 5 of the rear plate. Next, the lower wiring pattern was printed on the pattern area 7 in the same manner, and then the lower wiring pattern was printed on the pattern area 9 in the same manner. As described above, the lower wiring pattern was printed on the areas 3, 5, 7, and 9. The printed portions of the areas 3, 5, 7, and 9 are the areas printed in advance, that is,
Area 3 and Area 4 for Area 3 and Area 4 for Area 5
6 and 8 in the case of area 7, and areas 8 and 8 in the case of area 9, since the area corresponds to at least a position equal to or less than the pixel pitch P1,
Areas 6 and 8 are performing a drying process.

Through the above steps, a lower wiring pattern was formed in all areas on the rear plate 1. Thereafter, the rear plate was dried at 100 ° C., and further baked at 480 ° C., whereby a lower wiring mainly composed of silver was formed on the rear plate.

Here, when the positional accuracy of the four corners of the printed pattern in each of the pattern areas of the rear plate was measured, each was manufactured within a range of approximately ± 15 μm. There was no deformation.

As described above, as a method of printing an area in which the lower wiring pattern is divided into several blocks on the rear plate, printing of the area exceeding the pixel pitch is performed in advance and then the pixel pitch is reduced. When printing the following areas, according to a method in which a drying step is added in advance and then printing is performed sequentially, first, the printing is divided and the printing area is reduced. For this reason, the printing accuracy can be adjusted in each printing area, and the printing accuracy is improved.
Since the scraper size can also be reduced, compared to the case where printing is performed once, the deformation of the printed pattern is reduced because the tensile stress applied to the screen plate is reduced even with the same pressing amount, and as a result, the printed image is printed. Since the pattern accuracy in each area is improved, printing on a large-area substrate was possible while maintaining high accuracy.

Further, when printing a portion exceeding the pixel pitch, printing is performed as it is, and when printing a portion having a pixel pitch or less, drying of the adjacent preceding pattern is carried out, thereby fading the adjacent pattern in the divided portion. The deformation is gone. In the case of this embodiment, printing of a portion exceeding the pixel pitch is equivalent to printing by separating one divided area, and by doing so, the screen pattern or the like does not contact the preceding pattern at the time of printing. There is no blurring or deformation of the adjacent pattern. More specifically, in this embodiment, the width of the separation area is 300 μm × 16
Six = about 50 mm, and the width of the squeegee 22 is 100 mm. When one divided area is separated, the interval to the next print area is 50 mm. At this time, since the frame size of the screen plate is 750 × 750 mm (frame width 80 mm) and the pressing amount is 3 mm, the clearance between the plate and the substrate at the position of the next print area is calculated to be 0.26 mm. Since the printing height of the lower wiring is about 0.01 mm or less per layer, it does not come into contact with the pattern in the preceding pattern area.

Further, by performing the printing and drying steps in the order described in the present embodiment, only one drying step is required for the printing of the preceding area and the printing of the adjacent area. The number of steps could be minimized as compared with the method of performing the above.

Needless to say, the present embodiment shows an example of eight divisions, but the number of divisions can be arbitrarily divided according to the required accuracy and the like.

[Embodiment 2] FIG. 3 is a view showing a method of manufacturing an insulating layer according to a second embodiment of the present invention. That is, in the first embodiment, the lower wiring in the column direction is printed by the screen printing method, but in the present embodiment, the insulating layer is printed in the row direction by the screen printing method. In the drawing, the area where the insulating layer of the rear plate 1 is arranged is divided into six sections in a strip shape with several lines of the insulating layer as one block. 1 is a rear plate, 32, 33, 34, 35, 36, and 37 are insulating layer pattern areas each having several lines of insulating layers as one block, and 40 is an enlarged boundary portion of the insulating layer pattern area. Device electrode left, 12 is device electrode right, 13
Denotes a lower wiring, and 41 denotes an insulating layer. P3 indicates the vertical pixel pitch, and P4 indicates the insulating layer pitch. Incidentally, P3 and P4 have the same length. FIG. 3A shows a state in which the insulating layer pattern is printed on the areas 32, 34 and 36, and FIG.
This shows a state where printing is performed in areas 3, 35, and 37.

The same screen printing device as that shown in FIG. 2 of the first embodiment is used, and the plate uses a block pattern of an insulating layer pattern.

Referring to FIG. 3, the manufacturing method of the present invention will be described. In this embodiment, an example is shown in which the region for forming the insulating layer is printed six times. First, as shown in FIG. 3A, about 80 insulating layer patterns are arranged at a pitch of 730 μm on the rear plate having the lower wiring formed in Example 1 on the pattern area 32 where the insulating layer is to be formed. Screen printing was performed using a screen plate. The printing position of the insulating layer substantially matches the concave pattern (arranged at a pitch of 300 μm) of the insulating layer at the upper left portion 11 of the element electrode.
At a position where the upper part of the element electrode left 11 is partially exposed,
An insulating layer was printed so that an upper wiring, which will be described later in Example 3, was contacted at an upper portion of the device electrode left 11, so that power could be supplied to the device electrode left.

The plate used at this time has a frame size of 750 × 7
It was # 360 of 50 mm (frame width 80 mm), and an insulating paste containing lead as a main component was used as the paste, and printing was performed with a press-in amount of the plate of 3 mm during printing. In addition, squeegee 22
Is the width of 80 insulating layers, that is, the width of one block,
Allow about 25mm left and right margin for about 58mm, about 1
The thing of 00 mm was used.

Further, the table 25 was moved while the rear plate 1 was placed on the table 25, and an insulating layer pattern was printed on the pattern area 34 of the rear plate 1. Next, an insulating layer pattern was printed on the pattern area 36 in the same manner. By doing the above,
An insulating layer pattern was printed on the areas 32, 34 and 36. The printed portions of the areas 32, 34, and 36 are at least exceeding the pixel pitch P3 with respect to the previously printed areas, that is, the area 32 in the case of the area 34 and the area 34 in the case of the area 36. This is an area corresponding to a distant position, and the corresponding area was printed before shifting the table 25.

Next, the rear plate 1 was removed from the table 25 of the printing press and dried at about 100 ° C.

Subsequently, the rear plate 1 was set on the table 25 of the screen printing apparatus, and an insulating layer was printed on the pattern area 33 of the rear plate 1 as shown in FIG. The plate and printing conditions used at this time are
The printing was the same as when printing in area 32. Further, while the rear plate 1 was placed on the table, the table 25 was moved, and an insulating layer pattern was printed on the pattern area 35 of the rear plate 1. Next, an insulating layer pattern was printed on the pattern area 37 in the same manner. As described above, the insulating layer pattern was printed on the areas 33, 35, and 37. This area 33, 3
The print portions 5 and 37 are respectively the previously printed areas, that is, the areas 32 and 34 in the case of the area 33,
Since each of the areas 35 and 36 in the case of the area 35 and the area 36 in the case of the area 37 correspond to at least a position equal to or less than the pixel pitch P3, the areas 32, 34, and 36 are set in advance. A drying step is being performed.

Through the above steps, an insulating layer pattern was formed in all areas on the rear plate 1. Thereafter, the rear plate 1 was dried at 100 ° C., and was further baked at 480 ° C., thereby forming an insulating layer on the rear plate 1.

Here, when the positional accuracy of the four corners of the printed pattern in each of the pattern areas of the rear plate 1 was measured, each was manufactured within a range of about ± 15 μm. There was no deformation.

As described above, as a method of printing an area in which the insulating layer pattern is divided into several blocks on the rear plate 1, the printing of the area exceeding the pixel pitch is performed in advance and then the pixel According to the method of printing the area below the pitch after adding a drying step in advance and then printing sequentially, firstly, by dividing and printing, each print area becomes smaller. The printing accuracy can be adjusted in each printing area, and the accuracy is improved.
Since the scraper size can also be reduced, compared to the case where printing is performed once, the deformation of the printed pattern is reduced because the tensile stress applied to the screen plate is reduced even with the same pressing amount, and as a result, the printed image is printed. Since the pattern accuracy in each area is improved, printing on a large-area substrate was possible while maintaining high accuracy.

Further, when printing a portion exceeding the pixel pitch, printing is performed as it is, and when printing a portion having a pixel pitch or less, drying of an adjacent preceding pattern is performed, thereby fading the adjacent pattern in the divided portion. The deformation is gone. In the case of this embodiment, printing of a portion exceeding the pixel pitch is equivalent to printing by separating one divided area, and by doing so, the screen pattern or the like does not contact the preceding pattern at the time of printing. There is no blurring or deformation of the adjacent pattern. More specifically, in this embodiment, the width of the divided area is 730 μm × 80
Books = about 58 mm, and the width of the squeegee 22 is 100 mm. When one divided area is separated, the distance to the next print area is 58 mm. At this time, since the frame size of the screen plate is 750 × 750 mm (frame width 80 mm) and the pressing amount is 3 mm, the clearance between the plate and the substrate at the position of the next printing area is calculated to be 0.3 mm. Since the printing height of the insulating layer is about 0.01 mm per layer, there is no contact with the pattern in the preceding pattern area.

Further, by performing the printing and drying steps in the order described in this embodiment, only one drying step is required for the printing of the preceding area and the printing of the adjacent area. The number of steps could be minimized as compared with the method of performing the above.

Needless to say, this embodiment shows an example of six divisions, but the number of divisions can be arbitrarily divided in consideration of the required accuracy and the like.

[Embodiment 3] FIG. 4 is a view showing a method of manufacturing an upper wiring according to a third embodiment of the present invention. In this embodiment,
On the insulating layer formed in the second embodiment, an upper wiring connected to the left device electrode is manufactured.

In FIG. 4, the layout area of the upper wiring of the rear plate 1 is divided into six strips in the form of several blocks of the upper wiring as one block. 1 is a rear plate, 52,
Reference numerals 53, 54, 55, 56, and 57 denote upper wiring pattern areas each having several lines of the upper wiring as one block, and reference numeral 60 denotes an enlarged boundary portion of the insulating layer pattern area.
1 is the element electrode left, 12 is the element electrode right, 13 is the lower wiring, 4
1 is an insulating layer and 61 is an upper wiring. P3 indicates the vertical pixel pitch, and P5 indicates the pitch of the upper wiring.
Incidentally, P3 and P5 are the same length.

FIG. 4A shows that the upper wiring pattern is 52,5.
FIG. 4B shows a state where printing is performed on areas 4 and 56.
Shows a state where the upper wiring pattern is further printed on the areas 53, 55 and 57.

The same screen printing apparatus as that shown in FIG. 2 of the first embodiment is used, and the block uses the block pattern of the upper wiring pattern.

The manufacturing method of the present invention will be described with reference to FIG. In the present embodiment, an example is shown in which an area in which an upper wiring is formed is printed in six times. In the rear plate 1 having the lower wiring and the insulating layer formed in the first and second embodiments, first, as shown in FIG. 4A, 80 upper wiring patterns are formed on the pattern area 52 where the upper wiring is to be formed. 730μm pitch
Screen printing was performed using the screen plates arranged in the above. The printing position of the upper wiring is printed so as to be almost at the center with respect to the width direction of the insulating layer, and the concave portion of the insulating layer is contacted at the upper part of the left side of the element electrode so that power can be supplied to the left side of the element electrode. Regarding the direction, the upper wiring is simply width 4
Since the line has a size of about 50 to 500 μm, printing was performed without much concern for positional accuracy.

The plate used at this time has a frame size of 750 × 7
# 360 of 50 mm (frame width 80 mm), silver paste is used as the paste, and the press-in amount of the plate at the time of printing is 3 m
m. In addition, the width of the squeegee is equal to the width of 80 insulating layers, that is, the width of one block, ie,
An allowance of about 5 mm was used, and about 100 mm was used.

Further, the table 25 was moved while the rear plate 1 was placed on the table 25, and an upper wiring pattern was printed on the pattern area 54 of the rear plate 1. Next, the upper wiring pattern was printed on the pattern area 56 in the same manner. By doing the above,
The upper wiring pattern was printed on the areas 52, 54 and 56. The printed portions of the areas 52, 54, and 56 are separated from the previously printed areas, that is, the area 52 in the case of the area 54 and the area 54 in the case of the area 56 by at least the pixel pitch P3. The printing was performed while shifting the table ahead of this area.

Next, the rear plate 1 was removed from the table 25 of the printing press and dried at about 100 ° C.

Subsequently, the rear plate 1 was set on the table 25 of the screen printing apparatus, and upper wiring was printed on the pattern area 53 of the rear plate 1 as shown in FIG. The plate and printing conditions used at this time are
Printing was performed in the same manner as when printing was performed on the area 52. Further, while the rear plate 1 is placed on the table 25, the table 25 is moved and the pattern area 5 of the rear plate 1 is moved.
The upper wiring pattern was printed on the portion of No. 5. Next, the upper wiring pattern was printed on the pattern area 57 in the same manner.

As described above, the area 5
Upper wiring patterns were printed on portions 3, 55 and 57. The printed portions of the areas 53, 55, and 57 are the areas printed in advance, that is, the areas 52 and 54 for the area 53 and the areas 54 and 5 for the area 55.
6. In the case of area 57, for each of area 56,
At least the area corresponding to the position equal to or less than the pixel pitch P3, the areas 52, 54, and 56 are set in advance.
A drying step is being performed.

Through the above steps, an upper wiring pattern was formed in all areas on the rear plate 1. Thereafter, the rear plate 1 was dried at 100 ° C., and was further baked at 480 ° C., whereby an upper wiring was formed on the rear plate 1.

Here, when the positional accuracy of the four corners of the printed pattern in each of the pattern areas of the rear plate 1 was measured, each was manufactured within a range of about ± 15 μm. There was no deformation.

As described above, as a method of printing an area in which the upper wiring pattern is divided into several blocks on the rear plate 1, the printing of the area exceeding the pixel pitch is performed in advance and then the pixel According to a method in which a printing process is performed in advance after a drying step is performed in advance when printing an area equal to or smaller than the pitch, each printing area is reduced by first performing divided printing. For this reason, the printing accuracy can be adjusted in each printing area, and the printing accuracy is improved.
Since the scraper size can also be reduced, compared to the case where printing is performed once, the deformation of the printed pattern is reduced because the tensile stress applied to the screen plate is reduced even with the same pressing amount, and as a result, the printed image is printed. Since the pattern accuracy in each area is improved, printing on a large-area substrate was possible while maintaining high accuracy.

Further, the printing of the portion exceeding the pixel pitch is performed as it is, and the printing of the portion having the pixel pitch or less is performed by drying the adjacent preceding pattern. The deformation is gone. In the case of this embodiment, printing of a portion exceeding the pixel pitch is equivalent to printing one divided area apart, and by doing so, the preceding pattern does not come into contact with the screen plate or the like at the time of printing. No fading or deformation of the pattern occurs.

More specifically, in this embodiment,
The width of the divided area is 730 μm × 80 = about 58 mm,
The width of the squeegee 22 is 100 mm. 1 divided area
When separated, the distance to the next print area is 58 mm. At this time, the frame size of the screen version is 750 x 75
Since it is 0 mm (frame width 80 mm) and the indentation amount is 3 mm, the clearance between the plate and the substrate is calculated to be 0.3 mm at the position of the next printing area, and the printing height of the upper wiring is 0 per layer. Since it is about 0.01 mm or less, it does not come into contact with the pattern in the preceding pattern area.

Further, by performing the printing and drying steps in the order described in the present embodiment, only one drying step is required for the printing of the preceding area and the printing of the adjacent area. The number of steps could be minimized as compared with the method of performing the above.

Needless to say, the present embodiment shows an example of six divisions, but the number of divisions can be arbitrarily divided according to the required accuracy and the like.

[Embodiment 4] Next, Embodiments 1 to
3 shows an example in which the image display device is made by bonding the rear plate made in 3 with a face plate.

FIG. 5 is a view of an assembling apparatus of an image display device for explaining the bonding of the rear plate 1 to the face plate 71. Reference numeral 1 denotes a rear plate, 71 denotes a face plate, 72 denotes a frame, and 73 denotes an adhesive. Wood frit glass,
74 is an alignment and marker on the rear plate side, 75
Is the alignment and marker on the face plate side, 76
Is a lower heating plate, 77 is an upper heating plate, 78 is a table, 79 is a Z-direction moving mechanism, 80 is an assembly apparatus frame, and 81 is an image recognition camera.

First, the rear plate 1 having the device electrodes and the wiring patterns manufactured by the method as in the first to third embodiments is placed on the lower heating plate 76 provided on the XY table 78, and not shown. Attached with pins. The upper heating plate 77 attached to the Z-direction moving mechanism 79 provided on the assembly apparatus frame 80 has a face plate having an image display section in which each pixel is partitioned by a black stripe and a phosphor is formed in each pixel. 71 was attached by a pin (not shown). The lower heating plate and the upper heating plate have a built-in cartridge heater and can be heated independently. Alignment marks are formed on the rear plate 1 and the face plate 71 in advance, and the marks may be an island-shaped circle or a cross shape. At the time of lower wiring printing or upper wiring printing may be used, but in this embodiment, a plate provided with circular alignment marks 74 at the time of element electrode printing is used,
The face plate 71 used was provided with a circular alignment mark 75 when the black stripe was formed.

Further, a frame was arranged on the rear plate 1, and a frit glass 73 in which a frit glass paste was preliminarily calcined in advance was formed on the frame 72 and the rear plate 1. The frit glass 73 is 410 ° C.
A low-melting-point sealing glass having a working temperature (a temperature at which frit glass is melted and sealing work is possible) is used.

In this state, the lower heating plate 76 and the upper heating plate 76 are held in a state in which the frame on the rear plate 1 and the face plate 71 are kept at a distance of several mm so as not to abut each other.
And heating of 77 are started. At this time, the assembly device frame 8
0, the alignment marker 74 on the rear plate side and the alignment marker 75 on the face plate side are monitored through holes in the lower heating plate 76, and the face plate 71 and the rear plate 1 are positioned at desired positions. The XY-axis directions of the table are controlled so that alignment is performed, and alignment is performed. When the temperature of the hot plate becomes close to the working temperature of the frit glass 73, the face plate 7 is moved by the Z-direction moving mechanism 79.
1 and press the frame 72 and the rear plate 1 together with the frit 73 on the frame. Thereafter, the temperature of the heating plate is lowered. At this time, in the alignment work, the viscosity of the frit glass 73 becomes high, and the face plate 71 and the rear plate 1
After the temperature of the XY table 78 is maintained until the temperature of the XY table 78 does not shift, the XY table 78 is set free. After that, when the temperature becomes about room temperature, the bonded face plate 71
The image display device was manufactured by removing the rear plate 1, the frame 72, that is, the image display device from the heating plate.

Thus, the device electrodes formed on the rear plate 1 can be manufactured by aligning them so as to correspond to a plurality of pixels of the face plate 71.

[0099]

As described above, when the lower wiring, the insulating layer and the upper wiring on the rear plate are divided and printed according to the present invention, the area exceeding the pixel pitch is printed first. , When printing the area below the pixel pitch,
According to the manufacturing method in which the minimum drying step is performed in advance, the deformation of the pattern during printing can be suppressed to a level that does not cause any problem, and there is no blurring or deformation of the adjacent pattern, and the increase in the number of steps is further minimized Can be minimized. Accordingly, a high-definition, large-area flat panel image display device can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a rear plate illustrating an embodiment of the present invention.

FIG. 2 is a schematic view of a screen printing machine illustrating an embodiment of the present invention.

FIG. 3 is a schematic plan view of a rear plate illustrating a second embodiment of the present invention.

FIG. 4 is a schematic plan view of a rear plate illustrating a third embodiment of the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing the image forming apparatus of the present invention.

FIG. 6 is a diagram showing a conventional example of a surface conduction electron-emitting device.

FIG. 7 is a diagram illustrating a conventional example of an image forming apparatus.

FIG. 8 is a diagram showing a conventional example of screen printing.

FIG. 9 is a diagram showing a conventional example of screen printing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rear plate 2,3,4,5,6,7,8 Lower wiring pattern area 10 Enlarged view 11 Left of element electrode 12 Right of element electrode 13 Lower wiring 20 Screen plate 21 Block pattern 22 Squeegee 23 Scraper 24 Arm 25 Table 32, 33, 34, 35, 36, 37 Area 40 Enlarged view 41 Insulating layer 52, 53, 54, 55, 56, 57 Area 60 Enlarged view 61 Upper wiring 71 Face plate 72 Frame 73 Frit 74, 75 Alignment marker 76 Lower Side heating plate 77 Upper heating plate 78 Table 79 Z-direction moving mechanism 80 Assembly frame 81 Image recognition camera

Claims (6)

[Claims] 1. A plurality of electron-emitting portions corresponding to pixels at least one-to-one on a rear plate and a vertical and horizontal interlayer for supplying power to the electron-emitting portions. Having wiring via an insulating layer,
In the method of manufacturing an image forming apparatus having an image forming member that forms an image with electrons from the electron emission unit on the face plate, an area where the wiring of the rear plate is divided into a plurality of regions; A method for manufacturing an image forming apparatus, wherein a wiring pattern is sequentially printed by a screen printing method for each divided area. 2. The method for manufacturing an image forming apparatus according to claim 1, wherein, in the printing for each of the divided areas, printing of an area exceeding at least a pixel pitch is performed on a previously printed print pattern. When performing, the print pattern printed earlier is printed without performing the drying process,
When printing at least the area below the pixel pitch,
A method for manufacturing an image forming apparatus, wherein the printing is performed after at least a drying step is performed on a print pattern printed in advance. 3. In the printing for each of the divided areas, printing is performed for an area that exceeds at least the pixel pitch with respect to a printing pattern that has been printed in advance, and printing is performed in advance including the printing pattern. After sequentially printing at least the area exceeding the pixel pitch in advance for the print pattern, when printing at least the area equal to or less than the pixel pitch, at least a drying step is performed on the previously printed print pattern. The method according to claim 2, wherein the printing step is performed repeatedly. 4. The dividing method for each divided area is such that, when there is a wiring pattern or an insulating layer pattern in the vertical direction, only the vertical direction is divided so as to be divided into a plurality of wiring patterns or each insulating pattern. And also
When there is a wiring pattern or an insulating pattern in the horizontal direction, the method is performed on a divided pattern that is divided only in the horizontal direction so as to be divided for each of a plurality of wiring patterns or each of the insulating patterns. Item 4. A method for manufacturing an image forming apparatus according to Item 3. 5. The method for manufacturing an image forming apparatus according to claim 4, wherein a plate divided into 1 / n divided areas with respect to a pattern to be formed on the rear plate is used. A method for manufacturing an image forming apparatus, comprising: a printing method for sequentially performing printing while shifting a positional relationship between plates. 6. An image forming apparatus using a wiring formed by the method of manufacturing an image forming apparatus according to claim 1.