JP2000192291A - Electroplating of metal wire rod and equipment for electroplating - Google Patents
Electroplating of metal wire rod and equipment for electroplatingInfo
- Publication number
- JP2000192291A JP2000192291A JP10371527A JP37152798A JP2000192291A JP 2000192291 A JP2000192291 A JP 2000192291A JP 10371527 A JP10371527 A JP 10371527A JP 37152798 A JP37152798 A JP 37152798A JP 2000192291 A JP2000192291 A JP 2000192291A
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- Japan
- Prior art keywords
- metal wire
- plating
- electroplating
- insoluble anode
- anode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、メッキ液中を走行
する金属線材に不溶性陽極板を対極として電気メッキを
施す金属線材への電気メッキ方法および装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for electroplating a metal wire which runs in a plating solution with an insoluble anode plate as a counter electrode.
【０００２】[0002]
【従来の技術】金属線材に電気メッキを施すために従来
一般に用いられている装置の例を図５に示す。この装置
は、メッキ液を収容するメッキ槽１３と、メッキ槽１３
の底部のみに設けられた陽極板２とを有し、メッキ液中
を並列して走行する複数の金属線材１に、陽極板２を対
極として電気メッキを施すものである。ここで、走行す
る金属線材１はガイドローラ１１等により所定の線材パ
スラインに誘導され、同時に給電ブラシ、給電ローラ等
の給電手段１２およびメッキ電源（図示せず）により陽
極板２との間に電流を流すことにより、金属線材１にメ
ッキが施される。なお、メッキ液をポンプＰによりメッ
キ槽１３と補助槽１４とを循環させ、メッキ槽１３から
オーバーフローさせることによりメッキ液面６を金属線
材１の上方に位置させている。2. Description of the Related Art FIG. 5 shows an example of an apparatus conventionally used for electroplating a metal wire. The apparatus comprises a plating tank 13 for containing a plating solution, and a plating tank 13.
And electroplating a plurality of metal wires 1 running in parallel in the plating solution with the anode plate 2 as a counter electrode. Here, the traveling metal wire 1 is guided to a predetermined wire pass line by a guide roller 11 and the like, and at the same time, between the power supply means 12 such as a power supply brush and a power supply roller, and a plating power supply (not shown) between the anode wire 2 and the metal wire 1. The metal wire 1 is plated by passing an electric current. The plating liquid is circulated between the plating tank 13 and the auxiliary tank 14 by the pump P and overflows from the plating tank 13 so that the plating liquid surface 6 is positioned above the metal wire 1.
【０００３】メッキ処理に伴って消費されるメッキ金属
イオンを補給する方法としては、陽極板２としてメッキ
金属と同材質の金属板等を用い、陽極板２自身がメッキ
液に溶解してメッキ金属イオンを補給する方法がある。
ところが、この方法では陽極板２の溶解により陽極板２
と金属線材１との距離が変化するため安定した品質が得
難く、さらに、陽極板の交換、補給等の作業が煩雑であ
る等の問題がある。そこで、メッキ金属イオン補給手段
を別途設け、陽極板２として、メッキ液中に実質的に溶
解しないいわゆる不溶性陽極板を用いる方法が採用され
てきている。As a method of replenishing plating metal ions consumed in the plating process, a metal plate or the like made of the same material as the plating metal is used as the anode plate 2, and the anode plate 2 itself dissolves in a plating solution to form the plating metal. There is a way to replenish ions.
However, in this method, the anode plate 2
There is a problem that it is difficult to obtain a stable quality because the distance between the metal wire 1 and the metal wire 1 changes, and that the work of replacing and replenishing the anode plate is complicated. Therefore, a method has been adopted in which a plating metal ion replenishing means is separately provided and a so-called insoluble anode plate which does not substantially dissolve in a plating solution is used as the anode plate 2.
【０００４】図５に示す従来の電気メッキ装置は、メッ
キ槽１３の底部のみに陽極板２を設けているため構造が
簡単であり、通線作業等を陽極板２が阻害しないという
利点があるが、金属線材１の下側にのみ陽極板２が位置
するため、金属線材周囲の電流密度分布が不均一になり
易く、陽極板２に面する側のメッキ付着量がその反対側
の付着量よりも多くなり易いという問題点がある。The conventional electroplating apparatus shown in FIG. 5 has an advantage that the anode plate 2 is provided only at the bottom of the plating tank 13 so that the structure is simple and that the anode plate 2 does not hinder the wiring operation or the like. However, since the anode plate 2 is located only below the metal wire 1, the current density distribution around the metal wire tends to be non-uniform, and the amount of plating on the side facing the anode plate 2 is the amount of plating on the opposite side. There is a problem that it tends to increase more than that.
【０００５】そこで、この問題を解決するために、図６
に示すように、金属線材１の上下両側に陽極板２を設
け、金属線材周囲の電流密度分布の均一化を図る方法が
ある。しかしながら、この方法は、線材パスラインの上
方に設けられた陽極板２が通線作業を阻害するのみなら
ず、陽極板２として不溶性陽極板を使用した際に、通電
に伴って陽極板２の表面から発生するガスがメッキ液中
に滞留するため、メッキ効率が低下するという問題点が
ある。In order to solve this problem, FIG.
As shown in (1), there is a method in which anode plates 2 are provided on the upper and lower sides of a metal wire 1 to make the current density distribution around the metal wire uniform. However, according to this method, not only the anode plate 2 provided above the wire rod pass line hinders the wiring work, but also when the insoluble anode plate is used as the anode plate 2, the anode plate 2 Since the gas generated from the surface stays in the plating solution, there is a problem that the plating efficiency is reduced.
【０００６】さらに、電流密度分布の均一化、あるいは
メッキ速度向上を目的としてメッキ液の撹拌を行おうと
しても、メッキ槽１３の底部が陽極板２に占められてい
るため、撹拌手段の設置位置が制限され、有効な強撹拌
の実施が困難である。Further, even if an attempt is made to stir the plating solution for the purpose of making the current density distribution uniform or to increase the plating speed, since the bottom of the plating tank 13 is occupied by the anode plate 2, the position of the stirrer is set. And it is difficult to perform effective strong stirring.
【０００７】また、従来の方法は、メッキ量の異なる多
数の仕様のメッキ線材の同時生産等の、種々の生産態様
への適応性についても問題がある。この適応性の向上策
の一つとして、陽極板の一部を遮蔽してメッキ設備の有
効長さを可変とする手段があり、例えば、特開平６−３
０６６９５号公報には、金属ストリップと平行に配した
略長方形の非消耗型電極の表面に接して、幅方向に分割
されたアノードマスクを個々に出入り自在に設けた金属
ストリップの連続電気装置が開示されている。しかしな
がら、金属ストリップとアノードマスクとの干渉を避け
るにはアノードマスクを側方へ出入り自在に設ける必要
があるため、装置が複雑になるとともに液漏れ防止等の
処置、保全が煩雑となるという問題点がある。Further, the conventional method has a problem in adaptability to various production modes such as simultaneous production of plated wires having a large number of specifications having different plating amounts. As one of the measures for improving the adaptability, there is a means for shielding a part of the anode plate to change the effective length of the plating equipment.
Japanese Patent Application Publication No. 06695 discloses a metal strip continuous electric device in which anode masks divided in the width direction are individually provided so as to freely come in and out of the surface of a substantially rectangular non-consumable electrode arranged in parallel with the metal strip. Have been. However, in order to avoid interference between the metal strip and the anode mask, it is necessary to provide the anode mask so that it can freely enter and exit from the side, so that the apparatus becomes complicated and measures and maintenance such as liquid leakage prevention become complicated. There is.
【０００８】[0008]
【発明が解決しようとする課題】上記のような従来技術
の問題点をふまえ、本発明の第１の目的は、被メッキ物
である線材の周囲に均一にメッキを施すことができる金
属線材へのメッキ方法および装置を提供することにあ
る。また、本発明の第２の目的は、上記第１の目的に加
え、メッキ液強撹拌によるメッキ速度の向上を図ること
ができる金属線材へのメッキ方法および装置を提供する
ことにある。さらに、本発明の第３の目的は、上記第１
および第２の目的に加え、陽極板の一部遮蔽によるメッ
キ設備有効長さの変更を、効果的かつ容易に行うことが
できる金属線材へのメッキ方法および装置を提供するこ
とにある。SUMMARY OF THE INVENTION In view of the above problems of the prior art, a first object of the present invention is to provide a metal wire which can be uniformly plated around a wire to be plated. To provide a plating method and apparatus. Further, a second object of the present invention is to provide a method and an apparatus for plating a metal wire rod capable of improving a plating speed by strong stirring of a plating solution, in addition to the first object. Further, a third object of the present invention is to provide the above-mentioned first object.
Another object of the present invention is to provide a method and an apparatus for plating a metal wire, which can effectively and easily change the effective length of plating equipment by partially shielding an anode plate.
【０００９】[0009]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明の金属線材へのメッキ方法は、メッキ液中
を走行する金属線材に不溶性陽極板を対極として電気メ
ッキを施す金属線材へのメッキ方法において、不溶性陽
極板を、金属線材の左右両側方に両者の板面同士を対向
させて配置することを特徴とするものであり、好ましく
は、左右両側方の不溶性陽極板の板面を、金属線材に対
して上下対称かつ左右対称となるように配置する。In order to solve the above-mentioned problems, a method for plating a metal wire according to the present invention is to provide a metal wire for electroplating a metal wire running in a plating solution with an insoluble anode plate as a counter electrode. In the plating method, the insoluble anode plate is characterized by being disposed on both left and right sides of the metal wire with both plate surfaces facing each other, preferably, the plate of the left and right both sides of the insoluble anode plate The surfaces are arranged so as to be vertically symmetric and left-right symmetric with respect to the metal wire.
【００１０】また、陽極板によって占有されない金属線
材の下方にメッキ液撹拌手段を設けてメッキ液を撹拌す
ることにより、メッキ速度を向上させることができる。[0010] Further, by providing a plating solution stirring means below the metal wire not occupied by the anode plate and stirring the plating solution, the plating speed can be improved.
【００１１】さらに、必要に応じ、不溶性陽極板を部分
的にシールド板にて遮蔽し、不溶性陽極板の有効長さを
短縮して電気メッキを行うことができる。シールド板に
よる不溶性陽極板の一部遮蔽は、本発明の特徴である陽
極板配置形態により、容易かつ簡便に行うことができ
る。Further, if necessary, the insoluble anode plate is partially shielded by a shield plate, and the effective length of the insoluble anode plate can be shortened to perform electroplating. Partial shielding of the insoluble anode plate by the shield plate can be easily and simply performed by the arrangement of the anode plate which is a feature of the present invention.
【００１２】次に、本発明のメッキ装置は、メッキ液を
収容するメッキ槽と、該メッキ槽内に設けられた不溶性
陽極板とを有し、所定の線材パスラインに沿ってメッキ
液中を走行する金属線材に不溶性陽極板を対極として電
気メッキを施す金属線材への電気メッキ装置において、
不溶性陽極板を、線材パスラインの左右両側方に両者の
板面同士を対向させて設けたことを特徴とするものであ
る。Next, the plating apparatus of the present invention has a plating tank containing a plating solution, and an insoluble anode plate provided in the plating tank. In an electroplating apparatus for a metal wire that performs electroplating on a traveling metal wire with an insoluble anode plate as a counter electrode,
The insoluble anode plate is provided on both left and right sides of the wire rod pass line with their plate surfaces facing each other.
【００１３】本装置においては、メッキ液を撹拌するた
めのメッキ液撹拌手段をメッキ槽底部に設け、メッキ速
度を向上することができる。また、必要に応じ、不溶性
陽極板の一部を覆うための着脱自在のシールド板を容易
かつ簡便に適用することができる。In the present apparatus, a plating solution stirring means for stirring the plating solution is provided at the bottom of the plating tank, so that the plating speed can be improved. Further, if necessary, a detachable shield plate for covering a part of the insoluble anode plate can be easily and simply applied.
【００１４】[0014]
【発明の実施の形態】まず、本発明の特徴である不溶性
陽極板の一配置形態について、図１を参照して説明す
る。図１において、（ａ）は線材走行方向の側方から見
た図であり、（ｂ）は（ａ）のＸ−Ｘ’に沿う断面図で
ある。被メッキ物である金属線材１は、上流に設けられ
た巻出し手段および下流に設けられた巻取り手段等によ
り、矢印の方向に走行する。不溶性陽極板２は、金属線
材１の左右両側方に、両者の板面を対向させて配置す
る。これにより、金属線材１の片側にのみ不溶性陽極板
を設けた場合に比べ電流密度分布が均一になるととも
に、金属線材１の上方および下方に、不溶性陽極板２に
よって占められないスペース３および４が確保される。
上方のスペース３により、通線作業や操業状態監視が容
易となる。また、下方のスペース４により、メッキ液撹
拌手段の効果的設置が可能となる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an arrangement of an insoluble anode plate which is a feature of the present invention will be described with reference to FIG. In FIG. 1, (a) is a diagram viewed from a side in the wire rod traveling direction, and (b) is a cross-sectional diagram along XX ′ of (a). The metal wire 1 to be plated travels in the direction of the arrow by unwinding means provided upstream and winding means provided downstream. The insoluble anode plate 2 is disposed on both left and right sides of the metal wire 1 with their plate surfaces facing each other. As a result, the current density distribution becomes uniform as compared with the case where the insoluble anode plate is provided only on one side of the metal wire 1, and the spaces 3 and 4 which are not occupied by the insoluble anode plate 2 above and below the metal wire 1. Secured.
The upper space 3 facilitates the work of connecting lines and monitoring the operation state. In addition, the lower space 4 enables effective installation of the plating solution stirring means.
【００１５】図１においては、後述するシールド板の適
用も考慮して、平板状の不溶性陽極板２をほぼ垂直に設
けてあるが、不溶性陽極板２の形状は平板に限定される
ものではない。また、図１に示す不溶性陽極板２は、メ
ッキ液中に全体を埋没させて設置してあるが、図２
（ａ）に示すように、上端をメッキ液面６の上方に露出
させて設置してもよい。また、電流密度分布の均一化を
促進すべく、例えば、図２（ｂ）に示すように断面を湾
曲状としたり、あるいは（ｃ）に示すようにカギカッコ
状とすることもできる。In FIG. 1, a flat insoluble anode plate 2 is provided substantially vertically in consideration of the application of a shield plate described later, but the shape of the insoluble anode plate 2 is not limited to a flat plate. . In addition, the insoluble anode plate 2 shown in FIG. 1 is installed so as to be entirely buried in a plating solution.
As shown in (a), the upper end may be installed so as to be exposed above the plating liquid surface 6. Further, in order to promote the uniformity of the current density distribution, for example, the cross section may be curved as shown in FIG. 2B, or may be squared as shown in FIG. 2C.
【００１６】特に好ましい陽極板設置形態は、上下のス
ペース３および４によるメリットの享受および電流密度
分布の均一性の観点から、左右両側方の不溶性陽極板２
を、金属線材に対して実質的に上下対称かつ左右対称に
配置すること、言い換えれば、左右対称に配置した不溶
性陽極板２に挟まれたメッキ液のほぼ中央に金属線材を
走行させることである。図１および図２の（ａ）〜
（ｃ）に示す各配置形態は、いずれもこの好ましい形態
に従うものである。上下対称については、図２（ａ）の
ように、不溶性陽極板の上端が液面６の上方に露出して
いる場合は、露出している部分を無視することとする。A particularly preferable configuration of the anode plate is that the insoluble anode plates 2 on both the left and right sides are used from the viewpoint of enjoying the advantages of the upper and lower spaces 3 and 4 and the uniformity of the current density distribution.
Is arranged substantially vertically symmetrically and horizontally symmetrically with respect to the metal wire, in other words, the metal wire is caused to travel substantially at the center of the plating solution sandwiched between the insoluble anode plates 2 arranged symmetrically left and right. . 1 and 2 (a)-
Each of the arrangements shown in (c) follows this preferred embodiment. Regarding the vertical symmetry, as shown in FIG. 2A, when the upper end of the insoluble anode plate is exposed above the liquid level 6, the exposed portion is ignored.
【００１７】なお、不溶性陽極板の素材については特に
限定するものではなく、表面に貴金属の被覆層を有する
板状あるいはメッシュ状の耐食性金属等の、公知のもの
を使用することができる。The material of the insoluble anode plate is not particularly limited, and a known material such as a plate-shaped or mesh-shaped corrosion-resistant metal having a noble metal coating layer on the surface can be used.
【００１８】本発明においては、不溶性陽極板２によっ
て占められていない金属線材１の下方のスペース４にメ
ッキ液撹拌手段を設けることができ、かかるメッキ液撹
拌手段として、例えば、図３に示すような、気体吹き込
みによる撹拌を適用することができる。図３において、
（ａ）は線材走行方向の側方から見た図であり、（ｂ）
は（ａ）のＹ−Ｙ’に沿う断面図である。図３に示すメ
ッキ液撹拌手段７は、多数の気体吹き込み孔８を有する
パイプを金属線材１の直下に設けたものであり、気体吹
き込み孔８から気体をメッキ液中に気泡として吹き込む
ことによりメッキ液を撹拌する。本発明においては、陽
極板設置によるメッキ液撹拌手段７の設置条件に対する
制限が極めて小さく、かつ吹き込まれた気泡がメッキ液
中に滞留することがないため、効果的な強撹拌を実施す
ることができる。In the present invention, a plating solution stirring means can be provided in the space 4 below the metal wire 1 which is not occupied by the insoluble anode plate 2, and the plating solution stirring means is, for example, as shown in FIG. In addition, stirring by blowing gas can be applied. In FIG.
(A) is the figure seen from the side of the wire rod running direction, (b)
FIG. 3A is a cross-sectional view along the line YY ′ in FIG. The plating solution stirring means 7 shown in FIG. 3 is provided with a pipe having a large number of gas injection holes 8 directly below the metal wire 1. The plating is performed by blowing gas as gas bubbles from the gas injection holes 8 into the plating solution. Stir the liquid. In the present invention, since the restrictions on the installation conditions of the plating solution stirring means 7 due to the installation of the anode plate are extremely small, and the blown bubbles do not stay in the plating solution, effective strong stirring can be performed. it can.
【００１９】次に、着脱自在のシールド板による遮蔽を
適用した本発明の一実施形態について図４を参照して説
明する。図４に示す実施形態では、複数の金属線材１ａ
〜１ｆを並列して走行させ、メッキ付着量の異なる多種
類のメッキ線材を同時に製造するものである。ここで
は、金属線材１ａ〜１ｆの各々に対する不溶性陽極板２
の配置形態は図２（ａ）に従っている。Next, an embodiment of the present invention to which shielding by a detachable shield plate is applied will be described with reference to FIG. In the embodiment shown in FIG. 4, a plurality of metal wires 1a
To 1f are run in parallel to simultaneously produce many types of plated wires having different amounts of plating. Here, the insoluble anode plate 2 for each of the metal wires 1a to 1f is used.
Is in accordance with FIG. 2A.
【００２０】各金属線材に対する不溶性陽極板２の有効
長さは、その板面の一部を、絶縁材料製の着脱自在のシ
ールド板９または１０により遮蔽することにより調整す
ることができる。例えば、図示する例では、金属線材１
ａおよび１ｂの左右両側面に対向する不溶性陽極板の板
面は各々シールド板９によって遮蔽され、有効長さＬｐ
が不溶性陽極板の長さＬａよりも短縮されている。一
方、金属線材１ｃ〜１ｅの左右両側面に対向する不溶性
陽極板の板面は遮蔽されておらず、その有効長さは不溶
性陽極板そのものの長さＬａに等しい。これにより、金
属線材１ａ〜１ｆが１対の給電ローラ１２を供用しかつ
線材走行速度を同じとした簡単な装置構造であっても、
すなわち金属線材１ａ〜１ｆへの給電電圧が等しくかつ
メッキ液中での滞在時間を同じとしても、メッキ付着量
の多いメッキ線材１ｃ〜１ｅと少ないメッキ線材１ａと
を同時に製造することができる。The effective length of the insoluble anode plate 2 for each metal wire can be adjusted by shielding a part of the plate surface with a detachable shield plate 9 or 10 made of an insulating material. For example, in the illustrated example, the metal wire 1
The plate surfaces of the insoluble anode plates opposing the left and right side surfaces of a and 1b are shielded by shield plates 9, respectively, and have an effective length Lp
Is shorter than the length La of the insoluble anode plate. On the other hand, the plate surface of the insoluble anode plate opposing the left and right side surfaces of the metal wires 1c to 1e is not shielded, and its effective length is equal to the length La of the insoluble anode plate itself. Thereby, even if the metal wires 1a to 1f have a simple device structure in which the pair of power supply rollers 12 are used and the wire running speed is the same,
That is, even if the power supply voltages to the metal wires 1a to 1f are equal and the staying time in the plating solution is the same, the plating wires 1c to 1e having a large amount of plating adhesion and the plating wires 1a having a small plating amount can be simultaneously manufactured.
【００２１】不溶性陽極板の有効長さＬｐは、遮蔽のた
めに適用するシールド板の長さを変更することで調整で
きるが、図４における金属線材１ｆの左右両側に適用し
た不溶性陽極板のように、長さの短いシールド板１０を
多数用意し、その適用個数を調整することで有効長さＬ
ｐを調整してもよい。各シールド板９または１０は、不
溶性陽極板２の上方から被せるようにして装着すること
ができ、また取り外しは、逆に上方に持ち上げて行うこ
とができる。シールド板着脱の操作は金属線材１ａ〜１
ｆと干渉しないため、操業中でも可能である。また、着
脱のための動力装置等を特に設ける必要はなく、シール
ド板９または１０に把手等を設ければ、手をメッキ液で
汚すことなく手動で着脱することができる。The effective length Lp of the insoluble anode plate can be adjusted by changing the length of the shield plate applied for shielding. However, the effective length Lp is the same as that of the insoluble anode plate applied to the left and right sides of the metal wire 1f in FIG. In addition, a large number of shield plates 10 having a short length are prepared, and the effective length L is adjusted by adjusting the number of shield plates.
p may be adjusted. Each shield plate 9 or 10 can be mounted so as to cover from above the insoluble anode plate 2, and can be removed by lifting it upward. The operation of attaching and detaching the shield plate is performed by using the metal wires 1a to 1
Since it does not interfere with f, it is possible even during operation. It is not necessary to provide a power unit or the like for attachment and detachment. If a handle or the like is provided on the shield plate 9 or 10, the hand can be attached and detached manually without soiling the hands with the plating solution.
【００２２】[0022]
【実施例】以下、実施例に基づきさらに詳しく説明す
る。実施例１ 図４に示す電気メッキ装置を用い、製品１ｋｇ当たりの
メッキ付着量が約２ｇで、直径１．５ｍｍの亜鉛メッキ
鋼線材を製造した。不溶性陽極板２としては表面に白金
を被覆したチタンメッシュを用い、各鋼線材の左右両側
方に設置した不溶性陽極板２間の距離は１５ｍｍとし
た。また、メッキ液は硫酸亜鉛を主成分とするものを用
い、ポンプによりメッキ槽１３と補助槽（図示せず）と
を循環させ、メッキ槽１３からオーバーフローさせた。
また、メッキ液面６を鋼線材パスラインの上方の所定の
位置に上げるため、メッキ槽１３の下流側および上流側
の壁に、鋼線材を通過させるためのスリットを設けた。
メッキ液面の高さは、メッキ槽底面から約６０ｍｍとし
た。鋼線材は、本発明の好適条件に従い、左右対称に配
置した不溶性陽極板に挟まれたメッキ液のほぼ中央を走
行させた。また、シールド板９、１０を全て取り外し、
陰極電流密度１２Ａ／ｄｍ２にて電気メッキを行った。The present invention will be described below in more detail with reference to examples. Example 1 Using an electroplating apparatus shown in FIG. 4, a galvanized steel wire having a diameter of 1.5 mm and a coating weight of about 2 g per kg of a product was produced. As the insoluble anode plate 2, a titanium mesh whose surface was coated with platinum was used, and the distance between the insoluble anode plates 2 installed on both left and right sides of each steel wire was 15 mm. A plating solution containing zinc sulfate as a main component was used, and the plating tank 13 and an auxiliary tank (not shown) were circulated by a pump to overflow the plating tank 13.
In order to raise the plating solution level 6 to a predetermined position above the steel wire rod pass line, slits for passing the steel wire rod are provided on the downstream and upstream walls of the plating tank 13.
The level of the plating solution was about 60 mm from the bottom of the plating tank. In accordance with the preferred conditions of the present invention, the steel wire rod traveled almost at the center of the plating solution sandwiched between symmetrically disposed insoluble anode plates. Also, remove all shield plates 9 and 10,
Electroplating was performed at a cathode current density of 12 A / dm 2 .
【００２３】製造された亜鉛メッキ鋼線材のメッキ付着
状態を、従来例のメッキ鋼線材についての結果とともに
図７に示す。図７中、（ａ）が実施例１のものであり、
（ｂ）が従来例のものである。ここで、（ｂ）に示す従
来例のメッキ鋼線材は、図５に示すような不溶性陽極板
をメッキ槽底部にのみ設けた装置を用い、メッキ液、陰
極電流密度およびメッキ槽滞在時間を実施例１と同じに
して製造したものである。なお、図７は、メッキ鋼線材
の１／４周毎の亜鉛メッキ付着量を、蛍光Ｘ線分析にお
ける特性Ｘ線のカウント値にて評価し、レーダーチャー
トで表したものである。FIG. 7 shows the state of adhesion of the galvanized steel wire thus produced, together with the results of the conventional galvanized steel wire. In FIG. 7, (a) is that of the first embodiment,
(B) is a conventional example. Here, the plating steel wire of the conventional example shown in (b) uses an apparatus in which an insoluble anode plate as shown in FIG. 5 is provided only at the bottom of the plating tank, and the plating solution, the cathode current density and the residence time in the plating tank are measured. This was manufactured in the same manner as in Example 1. FIG. 7 shows a radar chart in which the amount of galvanized coating per quarter turn of the plated steel wire is evaluated by the characteristic X-ray count value in the fluorescent X-ray analysis.
【００２４】図７に示すように、（ｂ）に示す従来例に
よるメッキ鋼線材は、下側すなわち不溶性陽極板に面す
る側の亜鉛付着量が高く、メッキ鋼線材周囲のメッキ付
着量分布が不均一である。これに対し、（ａ）に示す実
施例によるメッキ鋼線材は、上下左右のメッキ付着量の
差が著しく小さく、メッキが周囲に均一に付着してい
る。As shown in FIG. 7, the plated steel wire according to the conventional example shown in FIG. 7 (b) has a high zinc deposition amount on the lower side, that is, the side facing the insoluble anode plate, and the plating deposition amount distribution around the plated steel wire material. It is uneven. On the other hand, in the plated steel wire rod according to the embodiment shown in (a), the difference in the amount of plating applied to the upper, lower, left and right sides is extremely small, and the plating is uniformly attached to the periphery.
【００２５】実施例２ 図３に示すような、気体吹き込みによるメッキ液撹拌手
段７を有するメッキ装置を用い、直径２ｍｍの鋼線材に
銅メッキを施した。メッキ液撹拌手段７としては、３０
ｍｍピッチで設けた直径３ｍｍの気体吹き込み孔８を多
数有する塩化ビニル製パイプを用い、気体吹き込み孔８
が鋼線材１の直下に位置するようにメッキ層底部に設置
した。不溶性陽極板２としては表面に白金を被覆したチ
タンメッシュを用い、鋼線材１の左右両側方に設置した
不溶性陽極板２間の距離は２０ｍｍとした。また、メッ
キ液はピロリン酸銅を主成分とするものを用いた。 Example 2 A steel wire rod having a diameter of 2 mm was plated with copper using a plating apparatus having a plating solution stirring means 7 by blowing gas as shown in FIG. As the plating solution stirring means 7, 30
Using a polyvinyl chloride pipe having a large number of gas injection holes 8 having a diameter of 3 mm and provided at a pitch of mm, the gas injection holes 8
Was placed at the bottom of the plating layer such that it was located immediately below the steel wire 1. As the insoluble anode plate 2, a titanium mesh whose surface was coated with platinum was used, and the distance between the insoluble anode plates 2 provided on both left and right sides of the steel wire 1 was 20 mm. Further, a plating solution containing copper pyrophosphate as a main component was used.
【００２６】吹き込み気体としては空気を用い、吹き込
み流量約１００リットル／分にてメッキ液を撹拌しなが
らメッキを行ったところ、電流効率が９５％未満となる
限界電流密度が、撹拌を行わない場合に比べ約２倍に向
上した。また、メッキの均一性も良好であり、実施例１
と同等以上の結果が得られた。When the plating was performed while stirring the plating solution at a blowing flow rate of about 100 liters / minute using air as the blowing gas, the limiting current density at which the current efficiency was less than 95% was obtained when stirring was not performed. Approximately doubled compared to In addition, the uniformity of plating was also good.
The same or better results were obtained.
【００２７】実施例３ 実施例１にて用いた電気メッキ装置に着脱自在のシール
ド板を適用し、製品１ｋｇ当たりのメッキ付着量が異な
る直径１．５ｍｍの亜鉛メッキ鋼線材１ａ〜１ｆを同時
に製造した例を以下の表１に示す。 Example 3 A detachable shield plate was applied to the electroplating apparatus used in Example 1 to simultaneously produce galvanized steel wires 1a to 1f having a diameter of 1.5 mm and having different amounts of plating per 1 kg of product. Table 1 below shows an example of the calculation.
【００２８】[0028]
【表１】 ＊Ｌａは、不溶性陽極板の長さである。[Table 1] * La is the length of the insoluble anode plate.
【００２９】表１に示すように、不溶性陽極板２の一部
にシールド板を適用することにより、メッキ付着量の異
なるメッキ鋼線材を同時に製造することができた。メッ
キ付着量は、シールド板適用によって調整された陽極板
有効長さＬｐにほぼ対応しており、各メッキ鋼線材のメ
ッキの均一性も良好であった。As shown in Table 1, by applying a shield plate to a part of the insoluble anode plate 2, it was possible to simultaneously produce plated steel wires having different plating adhesion amounts. The plating adhesion amount substantially corresponded to the anode plate effective length Lp adjusted by applying the shield plate, and the plating uniformity of each plated steel wire was also good.
【００３０】[0030]
【発明の効果】以上に説明したように、本発明の金属線
材への電気メッキ方法および装置は、被メッキ物である
線材の周囲に均一にメッキを施すことができる。しか
も、メッキ液強撹拌によるメッキ速度向上を、容易かつ
効果的に行うことができる。さらに、シールド板による
陽極の一部遮蔽も容易であり、メッキ量の異なる多数の
仕様のメッキ線材の同時生産等の、種々の生産態様への
適応性にも優れるものである。As described above, the method and apparatus for electroplating a metal wire according to the present invention can uniformly plate the periphery of a wire to be plated. In addition, the plating speed can be easily and effectively improved by strong stirring of the plating solution. Further, it is easy to partially shield the anode by the shield plate, and it is excellent in adaptability to various production modes such as simultaneous production of plated wires of various specifications having different plating amounts.
【図１】本発明の金属線材への電気メッキ方法および装
置の一例を示す図である。FIG. 1 is a diagram showing an example of a method and an apparatus for electroplating a metal wire according to the present invention.
【図２】本発明の金属線材への電気メッキ装置の、夫々
別の形態を示す図である。FIG. 2 is a view showing another embodiment of an apparatus for electroplating a metal wire according to the present invention.
【図３】メッキ液撹拌手段を設けた、本発明の金属線材
への電気メッキ装置を示す図である。FIG. 3 is a diagram showing an apparatus for electroplating a metal wire according to the present invention, provided with a plating solution stirring means.
【図４】シールド板を適用した、本発明の金属線材への
電気メッキ装置を示す図である。FIG. 4 is a diagram showing an apparatus for electroplating a metal wire according to the present invention using a shield plate.
【図５】従来の金属線材への電気メッキ装置の一例を示
す図である。FIG. 5 is a view showing an example of a conventional apparatus for electroplating a metal wire.
【図６】従来の金属線材への電気メッキ装置の他の一例
を示す図である。FIG. 6 is a view showing another example of a conventional apparatus for electroplating a metal wire.
【図７】本発明の金属線材への電気メッキ方法、および
従来の金属線材への電気メッキ方法により製造したメッ
キ線材の、メッキ付着状況を示すグラフである。FIG. 7 is a graph showing a plating adhesion state of a plating wire manufactured by a method of electroplating a metal wire according to the present invention and a conventional method of electroplating a metal wire.
１ 金属線材 １ａ〜１ｆ 金属線材 ２ （不溶性）陽極板 ３ 上方のスペース ４ 下方のスペース ５ メッキ槽底部 ６ メッキ液面 ７ メッキ液撹拌手段 ８ 気体吹き込み孔 ９、１０ シールド板 １１ ガイドローラ １２ 給電手段 １３ メッキ槽 １４ 補助槽 REFERENCE SIGNS LIST 1 metal wire 1 a to 1 f metal wire 2 (insoluble) anode plate 3 upper space 4 lower space 5 plating tank bottom 6 plating solution surface 7 plating solution stirring means 8 gas blowing hole 9, 10 shield plate 11 guide roller 12 power supply means 13 Plating tank 14 Auxiliary tank
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ２５Ｄ 21/10 ３０２ Ｃ２５Ｄ 21/10 ３０２ (72)発明者 若生 靖 栃木県黒磯市下中野800番地 ブリヂスト ンメタルファ株式会社栃木工場内 Ｆターム(参考） 4K023 AA15 AA19 BA06 BA25 4K024 BC03 CB06 CB08 CB12 GA16──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C25D 21/10 302 C25D 21/10 302 (72) Inventor Yasushi Wakao 800 Shimonakano, Kuroiso City, Tochigi Pref. F-term (reference) in Tochigi factory 4K023 AA15 AA19 BA06 BA25 4K024 BC03 CB06 CB08 CB12 GA16
Claims (7)
性陽極板を対極として電気メッキを施す方法において、 前記不溶性陽極板を、金属線材の左右両側方に、両者の
板面同士を対向させて配置することを特徴とする金属線
材への電気メッキ方法。1. A method for electroplating a metal wire running in a plating solution with an insoluble anode plate as a counter electrode, wherein the insoluble anode plate is placed on both left and right sides of the metal wire with their plate surfaces facing each other. A method for electroplating a metal wire, characterized in that the metal wire is disposed in a vertical direction.
板面を、金属線材に対して上下対称かつ左右対称となる
ように配置する請求項１記載の金属線材への電気メッキ
方法。2. The method for electroplating a metal wire according to claim 1, wherein the plate surfaces of the insoluble anode plates on both left and right sides of the metal wire are arranged so as to be vertically symmetric and left-right symmetric with respect to the metal wire.
け、メッキ液を撹拌しつつ電気メッキを行う請求項１ま
たは２記載の金属線材への電気メッキ方法。3. The method for electroplating a metal wire according to claim 1, wherein a plating solution stirring means is provided below the metal wire, and the electroplating is performed while stirring the plating solution.
覆い、不溶性陽極板の有効長さを短縮して電気メッキを
行う請求項１から３のうちいずれか一項記載の金属線材
への電気メッキ方法。4. The method according to claim 1, wherein the insoluble anode plate is partially covered with a shield plate, and the effective length of the insoluble anode plate is reduced to perform electroplating. Electroplating method.
キ槽内に設けられた不溶性陽極板とを有し、所定の線材
パスラインに沿ってメッキ液中を走行する金属線材に、
不溶性陽極板を対極として電気メッキを施す金属線材へ
の電気メッキ装置において、 不溶性陽極板を、線材パスラインの左右両側方に、両者
の板面同士を対向させて設けたことを特徴とする金属線
材への電気メッキ装置。5. A metal wire having a plating bath containing a plating solution, and an insoluble anode plate provided in the plating bath, and traveling in the plating solution along a predetermined wire rod pass line,
An electroplating apparatus for a metal wire to be electroplated with an insoluble anode plate as a counter electrode, wherein the insoluble anode plate is provided on both left and right sides of a wire rod pass line, with both plate surfaces facing each other. Electroplating equipment for wires.
めのメッキ液撹拌手段を有する請求項５記載の金属線材
への電気メッキ装置。6. An apparatus for electroplating a metal wire according to claim 5, further comprising a plating solution stirring means for stirring the plating solution at the bottom of the plating tank.
在のシールド板を有する請求項５または６記載の金属線
材への電気メッキ装置。7. The apparatus for electroplating a metal wire according to claim 5, further comprising a detachable shield plate for covering a part of the insoluble anode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37152798A JP4020519B2 (en) | 1998-12-25 | 1998-12-25 | Method and apparatus for electroplating metal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37152798A JP4020519B2 (en) | 1998-12-25 | 1998-12-25 | Method and apparatus for electroplating metal wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000192291A true JP2000192291A (en) | 2000-07-11 |
| JP4020519B2 JP4020519B2 (en) | 2007-12-12 |
Family
ID=18498859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37152798A Expired - Fee Related JP4020519B2 (en) | 1998-12-25 | 1998-12-25 | Method and apparatus for electroplating metal wire |
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| Country | Link |
|---|---|
| JP (1) | JP4020519B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1010779A2 (en) * | 1998-12-01 | 2000-06-21 | Giovanna Angelini | Method and apparatus for the continuous chromium-plating of elongated members |
| WO2008001892A1 (en) | 2006-06-30 | 2008-01-03 | Daiso Co., Ltd. | Metal wire rod plating insoluble anode and metal wire rod plating method using it |
| KR20090111788A (en) * | 2008-04-22 | 2009-10-27 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Method of replenishing indium ions in indium electroplating compositions |
| JP2013155413A (en) * | 2012-01-31 | 2013-08-15 | Fudauchi Kogyo Co Ltd | Noncontact plating method and device therefor |
| JP2016089186A (en) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | Electrolytic plating apparatus |
| JP2018188695A (en) * | 2017-05-01 | 2018-11-29 | 株式会社エムエスデー | Electrocasting device |
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| TWI565574B (en) * | 2014-10-20 | 2017-01-11 | 東榮科技股份有限公司 | A producing method of a wafer cutting line and a producing equipment thereof |
-
1998
- 1998-12-25 JP JP37152798A patent/JP4020519B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1010779A2 (en) * | 1998-12-01 | 2000-06-21 | Giovanna Angelini | Method and apparatus for the continuous chromium-plating of elongated members |
| EP1010779A3 (en) * | 1998-12-01 | 2003-09-17 | Giovanna Angelini | Method and apparatus for the continuous chromium-plating of elongated members |
| WO2008001892A1 (en) | 2006-06-30 | 2008-01-03 | Daiso Co., Ltd. | Metal wire rod plating insoluble anode and metal wire rod plating method using it |
| EP2039809A1 (en) * | 2006-06-30 | 2009-03-25 | Daiso Co., Ltd. | Metal wire rod plating insoluble anode and metal wire rod plating method using it |
| EP2039809A4 (en) * | 2006-06-30 | 2012-11-14 | Daiso Co Ltd | Metal wire rod plating insoluble anode and metal wire rod plating method using it |
| KR20090111788A (en) * | 2008-04-22 | 2009-10-27 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Method of replenishing indium ions in indium electroplating compositions |
| KR101598470B1 (en) | 2008-04-22 | 2016-02-29 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | Method of replenishing indium ions in indium electroplating compositions |
| JP2013155413A (en) * | 2012-01-31 | 2013-08-15 | Fudauchi Kogyo Co Ltd | Noncontact plating method and device therefor |
| JP2016089186A (en) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | Electrolytic plating apparatus |
| JP2018188695A (en) * | 2017-05-01 | 2018-11-29 | 株式会社エムエスデー | Electrocasting device |
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|---|---|
| JP4020519B2 (en) | 2007-12-12 |
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