JP2000188252A - Semiconductor projection aligner, device and method for manufacturing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stop production stop and device stop time due to parameter setting in the case of version-up by receiving a parameter value to be added or modified that is transmitted from a server along with the version-up and setting the received parameter value. SOLUTION: A server 202 is a control device for performing each kind of remote instruction and report data collection for each stepper that is connected onto a network, the classification retention control of a data file, the new creation/editing of the data file, or the like. The server 202 transmits a new parameter value or a parameter value whose input range has been changed that is required by a new program after version-up via an Ethernet communication network 108 to steppers 2011-2012. A parameter value to be newly added due to the version-up of software and a parameter value with an input modification range is stored on an auxiliary storage at the server side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a LAN-compatible semiconductor exposure apparatus capable of adding a function or correcting a defect by upgrading a software program in a semiconductor manufacturing plant or the like, a semiconductor manufacturing apparatus using a LAN, and a semiconductor. The present invention relates to a device manufacturing method.

[0002]

2. Description of the Related Art In recent years, the functions of control programs for semiconductor manufacturing equipment have been developed into software, and in order to improve maintainability, functions can be added or defects can be corrected by upgrading the software. Upgrading of software can be performed without replacing hardware components, but by simply performing version upgrade work using a medium storing a new software program, and can add functions or deal with defects.

[0003] Networking of semiconductor manufacturing factories is progressing, and semiconductor exposure apparatuses (steppers) are equipped with standard network protocols (TCP / IP, NetWa) such as Ethernet.
re, AppleTalk, etc.), various LAN
(Local Area Network) It is becoming increasingly common to use a connection device or a dedicated / public network. Due to the development and spread of standard network technology, the semiconductor exposure equipment management device (server) connected to the network
It has become possible to control a stepper via a network.

When a new parameter is added or a parameter input range is changed due to addition of a software function or the like at the time of the software version upgrade, an appropriate parameter value specific to the stepper to be upgraded is automatically updated. Therefore, the operator of the stepper had to go to the device in the clean room and set an appropriate parameter value before starting operation. For this reason, there has been a problem that the operation cannot be started immediately after the version upgrade.

[0005]

A first object of the present invention is to register in advance a new parameter of a stepper to be upgraded or a value to be taken as an input range change parameter on a server, and to register the server after the version upgrade. By transferring and setting the parameter values from the device to the stepper, the work of the operator in the clean room is not required, and the production stop time and equipment stop time associated with the parameter setting at the time of version upgrade are shortened, thereby improving the production efficiency in the semiconductor manufacturing plant. That is.

A second object of the present invention is to automatically transfer the initial values of the parameters set in the server by the above-mentioned method without performing the transfer operation in the server when the software version of the stepper is upgraded. It is an object of the present invention to improve the productivity and to shorten the production stop time and equipment stop time to improve the production efficiency in a semiconductor manufacturing plant.

[0007]

In order to achieve the above object, a semiconductor exposure apparatus according to the present invention is provided with an interface for connecting to a network such as a LAN or the like and an additional function of controlling by software by upgrading software. And means for enabling correction of defects, receive parameter values to be added or changed from the server along with the version upgrade via a network, and set the received parameter values for use after the version upgrade. It is characterized by having means for performing.

Further, the semiconductor manufacturing apparatus of the present invention is provided with an interface for connecting to a network and means for adding a function controlled by software and correcting a defect by upgrading the software. At least one stepper having means for receiving a parameter value to be added or changed via a network and setting the received parameter value for use after version upgrade; and a stepper to be added or changed with version upgrade. It is characterized by comprising a server having means for transferring registered parameter values to a stepper connected to a network via an interface, and a network connecting these steppers and the server.

A device manufacturing method according to the present invention is a method for manufacturing a device by controlling a semiconductor exposure apparatus by software. In the method, a parameter value to be added or changed in accordance with a software upgrade is determined in advance. When adding functions to be controlled by software and correcting defects by upgrading the version, the management device transfers the registered parameter values to the semiconductor exposure apparatus connected to the network via the interface, and updates the version. It is characterized in that the parameter values are set in the semiconductor exposure apparatus for use in the software after the upload.

In the present invention, the server normally transfers in advance an input device and a memory area for registering a new parameter of the stepper to be upgraded or a value to be taken for the input range change parameter, and transfers the parameter value to the stepper. It has means for setting.

With such a configuration, the operator does not need to go to each device for setting parameter values at the time of version upgrade, and can reduce the time until the start of operation. Further, since the stepper is usually installed in the clean room and the server is installed outside the clean room, the above configuration can eliminate the need for the operator in the clean room at the time of version upgrade.

In the present invention, the parameter values to be transferred include an initial value of a parameter to be additionally set for adjusting a device state in accordance with addition or change of software by version upgrade, and a change of software by version upgrade. Accordingly, values to be taken by parameters for which the input range is changed for device state adjustment are listed.

Further, the stepper transmits the current software version information to the server. Based on the received version information, the server checks the consistency between the parameter value to be transferred previously stored in the memory and the software of the stepper. The inspection may be performed. In this configuration, if the version of the software that can use the parameter value to be transferred is different from the version of the software of the stepper, the server does not transfer the parameter value.

Although the parameter value may be transmitted by the operator after confirming the completion of the version upgrade, the stepper requests the server for the parameter initial value after the software version upgrade is completed, and requests the parameter initial value transfer. May be automatically transferred to the stepper from the server that has received the parameter value. As a result, it is possible to further reduce the time until the operation starts after the version upgrade.

[0015]

FIG. 1 is a block diagram illustrating a hardware configuration of a semiconductor exposure apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 101 denotes a console CPU, which controls console display of the semiconductor exposure apparatus and operation control by console command input.
Reference numeral 102 denotes a RAM for storing an execution program and data by the CPU 101; 103, a ROM for storing the program; 104, a storage medium (hard disk or the like) used for storing data and programs; It is a storage device. In upgrading the software according to the present invention, parameter values such as an offset value and a system offset value unique to each stepper to which a new addition or an input range is changed are stored in the auxiliary storage device 104. The method of storing the parameter values includes a method of configuring a general file system on the auxiliary storage device 104 and managing it as a file, and a method of configuring a database such as a related database to search, set, call values, and the like. There are various methods. Generally, a magnetic disk device such as a hard disk is often used for the auxiliary storage device 104, but the configuration of the device, the nature of the exposure operation,
Depending on the operation, flash memory and NV-RAM
In some cases, software rewritable components such as (non-volatile memory) and EEP-ROM may be used. 1
Reference numeral 05 denotes a LAN interface for communicating with an external device via the Ethernet communication network 108. The protocol for communication on the LAN interface 105 is T
Standard network protocols such as CP / IP are often used, but AppleTalk and NetWare
For example, a commonly used protocol may be used. A console device 106 allows an operator (operator) to issue a command to the console CPU 101 from this device. As a display device of the console device 106, a CRT, a liquid crystal display device, an EL panel, a plasma display, or the like is generally used. As an input device of the console device 106, a keyboard for inputting a command by a key is often used. However, the console device 106 may be configured by a pen input device (tablet) using an electronic pen, a touch panel, or the like. 109
Is an external storage device. F as the external storage device 109
A DD (floppy disk drive) or MOD (magneto-optical disk drive) can be considered. When a drive capable of handling a new medium such as a DVD-RAM becomes widespread due to the development of technology, the new external storage device is used. In this example, the upgrade of the new program is basically performed by reading the data stored in the medium from the external storage device 109 and reading the data from the auxiliary storage device 1.
04. However, it is also possible to adopt a method of transferring a new program from a server via the network 108 and upgrading the version.
When such a method of transferring a new program from the server is used, the external storage device 109 is not essential in the present embodiment. Reference numeral 110 denotes a main CPU that controls various types of control devices included in the semiconductor exposure apparatus. Main CPU 110 and console CPU 101 are connected to main C
It is connected by a PU bus 107 and operates as a semiconductor exposure apparatus. An illumination device 111 controls a light source for exposing a semiconductor manufacturing wafer to light, and a 112 controls loading and unloading of a reticle (photomask) depicting a pattern to be exposed on the semiconductor manufacturing wafer. A reticle driving device 113 is a stage driving device for driving and controlling a wafer on an XY stage or the like in order to expose a wafer for semiconductor manufacturing in a step-and-repeat manner, and 114 is an accurate driving device for a semiconductor manufacturing wafer. This is an alignment TV system for positioning and controlling. These devices 111, 112, 113, and 114 are controlled by the main CPU 110 via a peripheral device bus 115. The peripheral device bus 115 uses SCSI in this example, but may be configured with any general-purpose standard bus.

The parameter values set by the method described in this embodiment include a mechanical or electrical parameter offset value associated with these devices, a set value for selecting a software usage, and a console operation content. User setting values to be stored and set as preferable ones,
Other various things are also targeted.

FIG. 2 is a diagram showing an example of a network connection form of the semiconductor manufacturing apparatus according to the embodiment of the present invention. The steppers 2011 and 2012 are connected to the server 202 via the Ethernet communication network 108. Server 2
A management device 02 performs various remote instructions and report data collection for each stepper connected on the network, classifying and managing data files, newly creating and editing data files, and the like. The server 202 sends the new or changed input range parameter values required for the new program after the version upgrade according to the present invention to the stepper 2011 via the Ethernet communication network 108 to each stepper.
To 2012.

A standard LAN is used as a data transfer means.
Function is used. As a data transfer method by LAN, a TCP / IP socket interface is used,
Although it is easy to use TP (File Transfer Protocol) and it is generally used, any unique protocol or method may be used. When a database is used as a parameter storage method, a method of transmitting a network-extended SQL command to each stepper may be considered.

FIG. 3 shows a server 2 according to the embodiment of the present invention.
FIG. 2 is a block diagram illustrating a hardware system configuration of No. 02. In FIG. 3, reference numeral 301 denotes a server CPU, which controls execution of a server program. 302, a server RAM for storing an execution program and data by the server CPU 301; 303, a server ROM for storing a boot program and the like; 304, a server used for storing data and programs Auxiliary storage device (such as a hard disk). The server auxiliary storage device 304 is connected from the memory bus 308 via an input / output interface 309 for peripheral devices. The input / output interface 309 generally has a SCSI or IDE
Etc. are used. In the configuration of the present example, the parameter value newly added or the parameter value with an input range change accompanying the software upgrade is stored in the auxiliary storage device 304 on the server side. The server operator prepares and saves the parameters from the server console device 305 before the stepper is upgraded. Reference numeral 306 denotes a LAN interface for communicating with the Ethernet communication network 108. A standard network protocol such as TCP / IP is often used as a protocol for communication via the LAN interface 306.
A commonly used protocol such as leTalk or NetWare may be used. A console device 305 allows the server operator to issue a command to the server from this device. As a display device of the console device 305, a CRT, a liquid crystal display device, an EL panel, a plasma display, or the like is generally used. As the input device of the console device, a keyboard for inputting a command by a key is often used, but it may be constituted by a pen input device (tablet) using an electronic pen or a touch panel. 307, a server CPU 301, a console device 305, and an LA
N interface 306 is a CPU bus, and 308 is a server CPU 301 and each memory 302.
To a memory bus 304.

In general, devices for processing a large amount of data, such as servers, employ a high-speed memory bus to improve the processing capability. However, small-scale semiconductor manufacturing plants which do not require high performance in the processing capability are required. If operated as a management device, there is no particular need for such a bus configuration.

FIG. 4 is a flowchart showing the operation of the server at the time of parameter transfer according to the first embodiment of the present invention. By executing the operation of this flowchart, the initial values of the parameters can be set from the server on the network. Before executing the operations in this flowchart, upgrade the software and the system default values of parameters that have new or changed input ranges due to the upgrade of the software, and the corresponding values that are transferred from the server to the stepper. It is assumed that appropriate parameter values specific to the stepper have been set.

The operation of the server at the time of software version up in the first embodiment of the present invention will be described below with reference to the flowchart of FIG. First, step 4
In step 01, the server operator acquires the parameter initial value of the version corresponding to the upgraded software stored in the storage device 304 of the server in advance for the corresponding stepper. In step 402, it is determined whether the version of the software on the stepper side and the version of the parameter value transferred from the server side match properly. If so, the process proceeds to step 403. The condition for judging whether or not the version is appropriate in step 402 is based on a perfect match of the version. However, if the stepper software is a higher version than the corresponding version of the parameter value, it is often upward compatible. However, this does not apply depending on the nature of the parameter. Finally, in step 403, the parameter data for the stepper is transferred from the server to the stepper via the network. The transfer method uses a file transfer function and a socket transfer function in a general LAN. For example, if the TCP / IP protocol is adopted, F
A protocol such as TP is conceivable. As another example, for example, if the method of storing parameters in the storage device is based on a network-compatible database, a network-extended SQL or the like is used.

(Second Embodiment) FIG. 5 is a flowchart showing an operation on the server side at the time of parameter transfer according to a second embodiment of the present invention. By executing the operation of this flowchart, when the initial value of the parameter is set from the server on the network, the initial value of the parameter is automatically transferred from the server as soon as the stepper-side software version-up operation is completed. It is possible to shorten the time lag until the operation of the device and improve the production efficiency.

The operation of the server at the time of parameter transfer according to the second embodiment of the present invention will be described below with reference to the flowchart of FIG. First, in step 501, a version upgrade wait for a stepper group to be upgraded is scheduled as a server process. In step 502, when the server receives the version upgrade end notification from the corresponding stepper, the server starts a parameter transfer process to the stepper. Steps 503 to 505 are the same as steps 401 to 403 in the flowchart of FIG. 4 for explaining the first embodiment.

(Embodiment of Device Manufacturing Method) Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described. FIG. 6 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and step 4
Is a process of forming a semiconductor chip using the wafer produced by the above process, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 7 shows the wafer process (step 4).
The detailed flow of is shown. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer.
Step 17 (development) develops the exposed wafer.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps,
Multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to manufacture a highly integrated device, which was conventionally difficult to manufacture, at low cost.

[0028]

As described above, according to the present invention,
A new parameter of the stepper to be upgraded or a value to be taken for the input range change parameter is registered in advance on the server, and the parameter value is transferred and set from the server to the stepper after the version is upgraded, so that the operator in the clean room can use the parameter. This eliminates the need for an operation and shortens the production stop time and equipment stop time associated with parameter setting at the time of version upgrade, thereby improving production efficiency in a semiconductor manufacturing factory.

Further, according to the present invention, the convenience of the operation can be improved by automatically transferring the initial values of the parameters set in the server without performing the transfer operation in the server when the software version of the stepper is upgraded. In addition, there is an effect that the production efficiency in a semiconductor manufacturing factory can be improved by shortening the production stop time and the equipment stop time.

[Brief description of the drawings]

FIG. 1 is a hardware configuration diagram showing an example of a semiconductor exposure apparatus of the present invention.

FIG. 2 is a network configuration diagram showing one example of a semiconductor manufacturing apparatus of the present invention.

FIG. 3 is a hardware configuration diagram showing an example of a server according to the present invention.

FIG. 4 is a flowchart for explaining a server-side operation at the time of parameter transfer according to the first embodiment of the present invention.

FIG. 5 is a flowchart illustrating a server-side operation during parameter transfer according to a second embodiment of the present invention.

FIG. 6 is a flowchart showing a device manufacturing method that can use the semiconductor manufacturing apparatus of the present invention.

FIG. 7 is a detailed flowchart of a wafer process in FIG. 6;

[Explanation of symbols]

101: CPU for console, 102: RAM for storing programs and data, 103: ROM for storing programs, 104: auxiliary storage device for storing data and programs, 105: LAN interface, 106 : Console device, 107: main CPU bus, 108: Ethernet communication network, 109:
External storage device, 110: Main CPU, 111: Illumination device, 112: Reticle drive device, 113: Stage drive device, 114: TV system for alignment, 115:
Peripheral device bus, 2011, 2012: semiconductor exposure apparatus (stepper), 202: semiconductor exposure apparatus management apparatus (server), 301: CPU of server, 302: RA of server
M, 303: ROM of the server, 304: auxiliary storage device of the server, 305: console device of the server, 306: LAN interface of the server, 307: CPU of the server
Bus 308: server memory bus; 309: server input / output interface.

Claims (7)

[Claims] 1. A semiconductor exposure apparatus comprising: an interface for connecting to a network; and means for enabling addition of a function controlled by software and correction of a defect by upgrading the software. A semiconductor exposure apparatus having means for receiving parameter values to be added or changed from a management apparatus of the apparatus via the network, and setting the reception parameter values for use after the version upgrade. . 2. An interface for connecting to a network and means for adding a function controlled by software and correcting a defect by upgrading the software, and a parameter to be added or changed in accordance with the version upgrade. At least one semiconductor exposure apparatus having means for receiving a value via the network and setting the reception parameter value for use after the version upgrade, and adding or changing the value in accordance with the version upgrade registered in advance. A semiconductor manufacturing apparatus, comprising: a management apparatus for a semiconductor exposure apparatus having means for transferring a power parameter value to a semiconductor exposure apparatus connected to a network via an interface; and a network connecting the apparatuses. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the management apparatus connects at least one semiconductor exposure apparatus via a local area network. 4. The current software version information is transmitted from the semiconductor exposure apparatus to the management apparatus, and the software version of the semiconductor exposure apparatus received by the management apparatus and parameter values to be transferred previously stored in the memory of the management apparatus. 4. The semiconductor manufacturing apparatus according to claim 2, wherein the management device does not transfer the parameter value when the version of the software that can use is different from the software version. 5. The semiconductor exposure apparatus requests a parameter value to be added or changed with the upgrade to the management apparatus after the completion of the version upgrade, and the management apparatus requests the semiconductor exposure apparatus which has requested the parameter value transfer. 5. The semiconductor manufacturing apparatus according to claim 2, wherein said parameter value is automatically transferred. 6. The semiconductor manufacturing apparatus according to claim 2, wherein the semiconductor exposure apparatus is installed in a clean room, and the management apparatus is installed outside the clean room. 7. A method of manufacturing a semiconductor device by controlling a semiconductor exposure apparatus by software, wherein parameter values to be added or changed in accordance with a software upgrade are registered in advance in a management apparatus of the semiconductor exposure apparatus. When adding a function controlled by software by the version upgrade and correcting a defect, the management device transfers the registered parameter values to the semiconductor exposure apparatus connected to the network via the interface, and performs the update after the version upgrade. A semiconductor manufacturing method comprising setting parameter values in a semiconductor exposure apparatus for use in software.