JP2000187893A - Sputtering device, its operation control method, and optical disk - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent fine particles from being produced owing to the breakage of molding burrs when a disk having molding burrs on its outer peripheral surface is mounted horizontally on an annular disk support member and carried by the fast revolving motion of the support member. SOLUTION: Many columnar members 4 made of fluororubber are fitted longitudinally to the inner peripheral part of the disk support member 1 and the outer peripheral surfaces of those columnar members 4 are exposed partially on the outer peripheral surface 2 of the disk support member 1 to form many round projection parts on the inner peripheral surface 2 of the disk support member 1. When the disk is carried, the disk outer peripheral surface comes into substantially point contact with the projection parts, so that the breakage of molding burrs can greatly be decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus for providing a metal reflective film on a resin-made molded substrate in an optical disk manufacturing process, an operation control method thereof, and an optical disk manufactured by the sputtering apparatus.

[0002]

2. Description of the Related Art An optical disk is a read-only optical disk (CD-
ROM) write-once type that can be recorded only once (WOR
M) and those capable of recording / erasing (recording / reproducing / erasing / rewriting possible) are known. Conventionally, in these optical disks, a dye material is used for a recording layer and a metal material is used for a reflective layer.

The above write-once optical disc is provided with a dye (cyanine, phthalocyanine) having a slight absorption with respect to the laser wavelength on a transparent resin substrate such as polycarbonate having a groove shape for signal formation called a groove in the circumferential direction. ) Is applied as a recording layer, and a metal reflective film, an ultraviolet-curing protective film, and a hard coat printing layer are sequentially laminated. The signal was recorded at the output 10 from the substrate side without the groove.
Laser light of about mW is incident, a part of the laser light is absorbed by a dye to cause thermal decomposition, and the optical characteristics of this portion are made different from those of the unrecorded portion. The signal is reproduced by detecting the difference in reflectance between the recorded portion and the unrecorded portion as a bit signal using a laser beam of several mW.

Conventionally, an Au thin film has been used as a metal reflective film of a write-once optical disc. However, recently, an Ag thin film has been used in order to improve reflectivity and reduce costs. In this case, since Ag is inferior to Au in corrosion resistance, some kind of reaction suppression treatment is required for the Ag thin film in order to ensure the same high reliability as Au. As this method, for example, there is a method of performing wet coating (spin coating) after forming a thin film with a chelating reagent that forms a chelating compound with Ag. In this method, an organic solvent having a desired solubility in the chelating reagent is used as a solvent, but the following problems are newly generated.

That is, since the Ag thin film is very thin, at most 100 nm, if there is any minute defect in the Ag thin film, the organic solvent seeps into the dye layer and dissolves this part, and the dye defect of 1 to several tens μm is formed. Induces. Actually, when the unrecorded reflectivity of such an optical disc medium is measured by a pickup, a black defect having a low reflectivity is suddenly observed even though there is no recorded pit. Such a black defect increases the error rate after recording and greatly impairs the quality of the optical disk medium.

First, a conventional sputtering apparatus will be described with reference to FIG. 7 to help understand the above problem. This sputtering apparatus includes (1) a rotating arm 51
The vacuum suction portions 53 of the disk
An external transport mechanism 50 in which 55 are arranged facing each other;
(2) a load lock chamber 60 whose inside is connected to a vacuum generation source (not shown); and (3) a load lock chamber pusher 6.
1 and (4) Arms 72 and 74 are arranged on the rotating shaft 71 so as to face each other, and a ring-shaped transport member 73 is provided at the distal end of the arm 72 and a ring-shaped transport member 75 is provided at the distal end of the arm 74. Internal transport mechanism 70 fixed
And (5) annular disk support members 81, 8 which are loosely mounted on the ring-shaped transport members 73, 75 and transported.
2 (see FIG. 8) and (6) a sputter chamber 90.

The interior of the load lock chamber 60 is connected to a pipe 62 connected to the vacuum source and a pipe 64 for opening to the atmosphere.
3, 65 are provided respectively. The load lock chamber pusher 61 includes an elevating shaft 61a and a push-up member 61b fixed to an upper end thereof.

The sputtering chamber 90 is a main body of the sputtering apparatus, and has a metal target 91 and a mask 92 in an upper portion and a sputter chamber pusher 93 in a lower portion. Further, a known mechanism (not shown) required for the sputtering apparatus is provided. The sputtering chamber pusher 93 includes an elevating shaft 93a and a push-up plate 93b fixed to an upper end thereof. In FIG. 7, black circles (•) indicate O-rings for sealing.

Next, a method of forming an Ag reflection film on a disk surface by using this sputtering apparatus will be described with reference to FIG. After the unprocessed disk 11 in the line is inserted into the load lock chamber 60 by the external transfer mechanism 50, it is set in the sputter chamber 90 by the internal transfer mechanism 70,
Here, a metal reflection film is formed on the surface of the disk by sputtering (in FIG. 7, reference numeral 12 denotes a disk being sputtered).
0, and then return to the line by the external transport mechanism 50.

In these series of steps, the load lock chamber 60 into which the unprocessed disk 11 has been inserted includes the plate 54,
Disc support member 8 pushed up by push-up member 61b
After that, the vacuum source is evacuated to a predetermined pressure. In the load lock chamber 60, the unprocessed disk 11 is horizontally supported by the push-up member 61b. Next, the unprocessed disk 11 is received by the disk support member 81 (the state shown in FIG. 8). In this case, the push-up member 61b descends, and the disk support member 81 on which the unprocessed disk 11 is placed is transferred to the ring-shaped transport member 73. Is loosely mounted. This disk support member 8
1 is inserted into the sputter chamber 90 by the rotation of the arm 72, and is brought into the state of the disk support member 82 in FIG. Then, the unprocessed disk 11 on the disk support member 82 is pushed up by the lifting of the push-up plate 93b, and comes into pressure contact with the mask 92 (see reference numeral 12). Sputtering is performed in this state.

The disk after the sputtering is a push-up plate 93b.
Is received by the disk support member 82 by the downward movement, is taken out of the sputter chamber 90 by the rotation of the arm 74, is pushed up integrally with the disk support member 82 by the lifting of the push-up member 61b, and is collected by the load lock chamber 60. . Next, it is taken out of the load lock chamber 60 by the external transport mechanism 50 and carried out to the line as the processing disk 13.

Thus, (1) receiving the disk from the load lock chamber 60, (2) collecting the disk in the load lock chamber 60, (3) setting the disk in the sputter chamber 90, and (4) sputtering The removal of the disk from the chamber 90 is performed by the ring-shaped transfer members 73 and 7.
5, the disk support members 81, 8 loosely mounted, respectively.
2 is performed. In this case, the disk support member revolves integrally with the ring-shaped transport members 73 and 75 by the rotation of the rotation shaft 71 (the rotation of the arms 72 and 74).

The disk supporting member 81 (and 82)
Is an annular shape as shown in FIG. 8, and an upper half portion is a flange portion 81a. Further, a plurality of claws 81b for mounting and supporting the disk are provided on the inner peripheral portion of the lower half, and the claw 81b is formed between the outer peripheral surface of the disk 11 (12, 13) and the inner peripheral surface 81c of the disk support member 81. The disk 11 is placed on the claw 81b in a horizontal direction with an appropriate interval therebetween. The flange portion 81a is for loosely inserting and holding the lower half of the disk support member 81 in the ring-shaped transport members 73 and 75. Further, the push-up member 61b and the push-up plate 93b pass the disk up and down through a substantially circular through hole inside the claw 81b, thereby transferring the disk.

The principle of sputtering is that a negative potential of several hundred volts is applied to a metal target 91 under an Ar gas pressure of several Pa to generate a plasma 94, and Ar ions in the plasma 94 are sputtered by the sputtering effect on the metal target. The constituent element 91 is to be deposited on the disk 12 facing the same. Although not shown, usually, a magnetic field generating means is provided on the rear surface of the metal target 91 in order to prevent the disk from being damaged by electrons in the plasma 94 and to efficiently generate high-density plasma. Such a sputtering means is widely used in industry as a planar magnetron type sputtering source.

[0015]

As a result of the inventor's intensive investigation, the minute defects of the Ag thin film that induce the black defects are as follows.
It has been found that fine particles having a diameter of several μm made of a disc constituent material are formed because they are sputtered while adhering to the dye surface. Since the fine particles are one or more digits larger than the thickness of the Ag thin film of 100 nm, they are not completely covered with Ag even after sputtering. Therefore, when a wet process for suppressing the reaction of the Ag thin film is performed, the organic solvent of the solvent permeates through gaps where the dye surface is exposed, or fine particles are separated by spin coating to completely dissolve the dye surface. By doing so, a black defect is generated.

Further, it has been found that the fine particles do not adhere in the dye coating or annealing step in the previous process, but are generated after the introduction into the sputtering apparatus. That is, FIG.
(A) As shown in FIG.
A molding burr 103 having a dimension in the substrate thickness direction of about 20 μm exists at a position very close to the surface of the groove 102 in correspondence with the gas vent groove when the substrate is injection-molded.
Usually, this molding burr 103 does not pose a problem in optical disk products. FIG. 3B is a sketch of a photograph taken at a magnification of 400 times with a microscope.

However, when the disk 100 having such a molding burr 103 is supported by the disk support member 81 shown in FIG. 8 and is conveyed at high speed (the arms 72 and 74 in FIG. 7 are rotated at high speed), the centrifugal force is generated. Therefore, it was found that the molding burr 103 collides with the inner peripheral surface 81c of the support member 81, and the molding burr 103 is crushed and scattered as fine particles on the pigment surface.

The transport time by the disk support member 81, that is, one rotation time of the support member 81 (for example, the time required for inserting the disk received from the load lock chamber 60 into the sputter chamber 90) is about 0.3. However, if the transfer time is about 7 to 8 seconds and the transfer is performed extremely slow, the defect rate due to the black defect is reduced by one to two digits, and the case where the wet processing for suppressing the Ag thin film reaction is not performed is performed. Became equivalent. This is apparently because the impact force at the time of collision between the inner peripheral surface 81c and the molding burr 103 has been reduced.
However, it is disadvantageous to adopt such a low-speed transport method as actual production conditions.

It is also possible to eliminate the molding burrs 103 by improving the molding conditions of the resin substrate. However, while maintaining the current molding tact, the mechanical properties such as warpage and surface runout of the substrate and the like are improved. It is not always easy to obtain a molded product that also satisfies specifications such as birefringence and groove shape transferability.

Accordingly, an object of the present invention is to provide a sputtering apparatus provided with a disk transport mechanism that does not generate fine particles even when a disk having the above-mentioned molding burrs is transported at the same high speed as before, and a disk by the transport mechanism. An object of the present invention is to provide a transporting method, and to prevent the occurrence of minute defects of the Ag reflection film which induces the above-mentioned black defect, thereby producing a high-quality optical disk with high yield.

[0021]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is an improvement of the inner peripheral surface structure of an annular disk support member for transferring a disk by revolving rotational movement on the disk. When the centrifugal force due to the rotational movement acts on the disk, the molding burrs remaining on the outer peripheral surface of the disk come into point contact with the inner peripheral surface of the disk support member, or during the rotational movement. In this case, the molding burrs are configured not to contact the inner peripheral surface at all.

According to the first aspect of the present invention, there is provided a disk transport mechanism provided with an annular disk support member in a horizontal direction at a tip end of a rotary arm which rotates in a horizontal direction, so that a resin-made molded substrate is provided. An optical disk, wherein the disk is transported in a horizontal direction on the disk support member and the disk support member is revolved by the rotation arm to convey the disk in a state of concentrically surrounding the outer peripheral surface of the disk. In a sputtering apparatus for forming a reflective film, three or more rounded protrusions are formed on the inner peripheral surface of the disk support member so as to protrude toward the center side of the disk support member. Is on the protrusion,
It is characterized in that the contact can be made substantially by point contact.

According to a second aspect of the present invention, in the first aspect, the protrusion is formed of an elastic body made of a soft material.

According to a third aspect of the present invention, a disk made of a resin-made molded substrate is placed and supported horizontally in a state where the disk is surrounded concentrically, and the disk is rotated by revolving motion. In a sputtering apparatus for forming an optical disk reflective film, comprising an annular disk supporting member to be conveyed, an upper half inner diameter of the disk supporting member is made larger than a lower half inner diameter to form a step, and the disk supporting member is provided with a step. When the disk is placed in the horizontal direction, the upper portion of the outer peripheral surface of the disk can be positioned above the upper surface of the step. As described above, in the disk support member, when the disk is mounted on the disk support member, the molding burrs on the outer peripheral surface of the disk are positioned above the upper surface of the step.

According to a fourth aspect of the present invention, in the third aspect, when the disk is placed on the disk support member in a horizontal direction, the upper end of the disk outer peripheral surface is preferably at least 0.02 mm from the upper surface of the step. Is characterized in that it can be positioned above 0.1 mm or more.

According to a fifth aspect of the present invention, there is provided a sputtering apparatus which mounts a disk made of a molded substrate made of resin, supports the disk in a horizontal direction with its outer peripheral surface concentrically surrounded, and rotates the disk by revolving rotational movement. In a sputtering apparatus for forming an optical disk reflective film provided with an annular disk support member to be conveyed, an inner peripheral surface of the disk support member is inclined at an inclination angle of 1.5.
It is characterized in that it is formed in an inverted conical shape having a taper of not less than °. In this manner, the disk support member has a draft for facilitating the loading and unloading of the disk.

According to a sixth aspect of the present invention, there is provided a method for controlling operation of a sputtering apparatus, wherein a disk made of a resin-made molded substrate is placed and supported in a horizontal direction with its outer peripheral surface concentrically surrounded.
When operating a sputtering apparatus for forming an optical disk reflective film provided with an annular disk support member that conveys a disk by a revolving rotational movement, a deceleration operation of the revolving rotational movement of the disk support member is performed. It is characterized in that it is performed without overshooting in which the moving direction is reversed.

According to a seventh aspect of the present invention, there is provided an operation control method for a sputtering apparatus, wherein a disk made of a resin-made molded substrate is placed and supported in a horizontal direction with its outer peripheral surface concentrically surrounded,
When operating a sputtering apparatus for forming an optical disk reflective film, which is provided with an annular disk support member that conveys a disk by a revolving rotational movement, an acceleration operation of the revolving rotational movement of the disk support member is accelerated. Is performed without generating a discontinuous point.

An eighth aspect of the present invention is the sputtering apparatus according to the first, second, third, fourth or fifth aspect, further comprising a control device capable of implementing the operation control method of the sixth aspect.

According to a ninth aspect of the present invention, there is provided a sputtering apparatus according to the first, second, third, fourth, or fifth aspect, further comprising a control device capable of implementing the operation control method of the seventh aspect.

An optical disk according to a tenth aspect is manufactured by the sputtering apparatus according to the first, second, third, fourth, fifth, eighth or ninth aspect.

[0032]

Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIGS. 1A and 1B show a disk support member in which the structure of a conventional disk support member 81 is improved. FIG.
(B) is a sectional view thereof. This disk support member 1
Is formed with a plurality of through-holes (six in this embodiment) having a substantially circular cross section in the inner peripheral portion, and inserts and fixes a cylindrical member 4 made of a soft elastic material into these through-holes. Is formed so that a part of the outer peripheral surface thereof protrudes toward the center of the disk support member 1. 2 is the disk support member 1
5 is a flange portion. In FIG. 1, the columnar member 4 is arranged at the center of the claw 3 in the width direction, but may be provided at a position separated from the claw 3. Further, as the soft elastic material, for example, it is preferable to use fluororubber (trade name: Viton).

When the support member 1 is provided in the sputtering apparatus of FIG. 7 and the disk is transported at a high speed, the outer peripheral surface of the disk collides with and contacts the protruding surface of the cylindrical member 4 due to centrifugal force, and this contact state is maintained. It is transported as it is. However, in this case, since the contact is performed by point contact, generation of particles can be suppressed to an extremely small value even if the disk has a molding burr.

(1) The disk supporting member 1 of this embodiment is used in the sputtering apparatus shown in FIG.
The defect rate of the optical disk in the case of 3 seconds and (2) FIG.
In the case where the sputtering apparatus of FIG. 7 including the disk support member 81 shown in FIG. 7 is used, the defect rate of the optical disk when the disk transport time is also about 0.3 seconds, and
FIG. 6 also shows the defect rate when the disk transport time was 7.5 seconds.

In the above comparison of the defect rates, in order to clarify the effect of the present invention, the transport operation by the internal transport mechanism 70 is performed five reciprocations (turning operation is performed ten times) off-line, and thereafter, the medium is formed by sputtering. What was done was investigated.
As is clear from FIG. 6, the off-line defect rate of the optical disk according to the present embodiment is reduced by one to two digits from that of the optical disk according to the conventional apparatus, and the conventional apparatus performs low-speed transport (the transport time is 7.5 seconds). It was almost equal to the defect rate in the case.

Instead of providing the columnar member 4, the cylindrical inner peripheral surface 2 of the disk support member 1 is processed into an R shape (a part of the inner peripheral surface is formed into a rounded projection shape). ) Is also possible. In this case, since the fluorocarbon rubber-made columnar member 4 does not exist, the trouble caused by the deterioration does not occur, the maintenance-free operation is realized, and the off-line defect rate of the optical disk is equal to that of the above embodiment. . However, in an actual production line, the defect rate of the optical disk is slightly higher than in the case where the columnar member 4 is provided.

The reason is that the contact between the molding burr of the disk and the R-shaped portion of the disk support member 1 becomes a point contact and the contact area is reduced, so that the generation of particles is reduced. However, it is considered that since the R-shaped portion is made of metal and is much harder than a molding burr made of resin, particles are rarely generated depending on the shape of the molding burr that collides. Can be

Embodiment 2 As described above, the molding burrs (see FIG. 9 (b)) are formed at a position very close to the groove surface 102 side of the optical disk outer peripheral surface in the substrate forming process. Has a thickness dimension of about 20 μm. Therefore, as shown in FIGS. 2A and 2B, the disc supporting member 1 of the present embodiment has a relief structure so that molding burrs do not collide with the inner peripheral surface 2 of the supporting member 1 when the disc is transported. Things. That is, when the diameter of the inner peripheral surface of the upper half portion of the support member 1 is made larger than the diameter of the inner peripheral surface of the lower half portion to form a step 2a, and the disc is placed on the claw 3 of the support member 1 in the horizontal direction. In addition, the molding burr 103 is positioned above the upper surface of the step 2a. Considering the position where the molding burrs are generated, in FIG. 2B, the upper surface of the step 2a and the disk 1
The distance d between the groove surface 102 and the groove surface 102 may be set to 20 μm or more. By setting the distance d to 0.1 mm or more, generation of particles can be reliably prevented.

The results of an investigation of the off-line defect rate of the optical disk according to this embodiment under the same conditions as in the case of Embodiment 1 are as shown in FIG.
The defect rate of the optical disk at 3 seconds is one to two orders of magnitude lower than the defect rate of the optical disk according to the conventional apparatus of FIG. 7, and is substantially equal to the defect rate at 7.5 seconds of the disk transport time. became. As described above, according to the present embodiment, the disk forming burrs 103 do not collide with the inner peripheral surface 2 of the disk support member 1 when the disk is transported, so that particles are not generated and black defects caused by this are prevented. Is done.

Embodiment 3 The disk support member 1 of this embodiment has an inner peripheral surface 2 formed in an inverted conical shape as shown in FIG. That is,
The inner peripheral surface 2 is tapered at an inclination angle of 1.5 ° or more to form a draft. According to this draft, the second embodiment
As in the case of the step 2a, since the molding burrs do not collide with the inner peripheral surface 2 during the transport of the disk, no particles are generated, and black defects caused by this are prevented. In the disk support member 1 of FIG. 2, when the disk is received, the outer peripheral end of the disk is caught by the step 2a, and the disk is transported at a high speed while being inclined, so that a transport trouble rarely occurs. In the disk support member 1 shown in FIG. 3, such a trouble was completely eliminated.

COMPARATIVE EXAMPLE 1 According to the study by the present inventors, the state of collision of the outer peripheral surface of the disk against the inner peripheral surface of the disk support member is shown in FIG.
It has been found that there is a great difference depending on the method of operation 2, 74, that is, the method of controlling the rotation speed of the disk support member. FIG. 4 is a graph showing a monitor output of the rotation speed of the rotation shaft 71 according to the conventional control method. The rotation speed output has the polarity reversed with respect to the forward rotation / reverse rotation of the two arms 72 and 74, respectively. In the conventional control method, ARM
_{1 A} remarkable overshoot 201 was observed in the rotation speed of (arm 72). This overshoot 201
Since the rotation speed protrudes to the opposite polarity side, the rotation direction is instantaneously reversed when deceleration is applied.

On the other hand, such overshoot is not observed in ARM ₂ (arm 74). In the off-line defect rate evaluation, the defect rate on the ARM ₁ side is higher than that on the ARM ₂ side, and the collision sound during disk transport is also loud.
It is apparent that the overshoot 201 has increased the collision of the outer peripheral surface of the disk with the inner peripheral surface of the disk support member.

The difference in the disk transfer speed between the arms 72 and 74 is caused by the difference in the rotational moment due to the difference in the structure, and when the rotation shaft is a coaxial structure, the difference between the rotation shaft diameter and the point of action of the control. This is due to the difference in the distance between them. By eliminating the overshoot 201 caused by such a hardware difference by using a soft means, the defect rate on the ARM ₁ side can be reduced as much as the ARM ₂ side.

Embodiment 4 Therefore, in this embodiment, as shown in FIG. 5, the acceleration parameter of the arm rotation speed is made gradual to eliminate overshoot of the rotation speed, and the acceleration becomes suddenly infinite when the acceleration becomes theoretically infinite. The speed change point 202, that is, the discontinuity point of the acceleration is eliminated. With such a control method, the sound of collision of the disk outer peripheral surface with the inner peripheral surface of the disk support member during disk transport is eliminated, and as shown in FIG. It decreased by two orders of magnitude, and became almost equal to the defect rate of low-speed transport. In addition, highly reliable transfer with less transfer trouble was realized.

[0045]

As apparent from the above description, the following effects can be obtained according to the present invention. (1) In the sputtering apparatus according to the first and second aspects, the inner peripheral surface shape of the disk support member is improved so that the outer peripheral surface of the disk contacts the inner peripheral surface of the disk support member at a point contact when the disk is transported. The contact area is reduced, and the amount of particles that cause black defects is significantly reduced. Therefore, the yield of the process is improved, and a high-quality optical disc with a low error rate can be produced. In particular, the sputtering apparatus according to claim 2 is configured such that the outer peripheral surface of the disk contacts the soft elastic body provided on the inner peripheral surface of the disk support member at a point contact when the disk is transported. Even if a molding burr collides with this soft elastic body, generation of particles is suppressed.

(2) In the sputtering apparatus according to the third to fifth aspects, the shape of the inner peripheral surface of the disk support member is improved, and the burrs formed on the inner surface of the disk support member are weakened when the disk is transported. As a result, the amount of particles that cause black defects is drastically reduced. As a result, the yield of the process is improved, and a high-quality optical disk with a low error rate can be produced. In particular,
In the sputter device of the fifth aspect, the predetermined draft angle is formed in the disk support member, so that the delivery of the disk proceeds smoothly, and no transport trouble occurs. As a result, the yield and operation rate of the process are further improved.

(3) In the method for controlling the rotation of the disk support member according to the sixth and seventh aspects, the overshoot in which the rotation direction is instantaneously reversed is eliminated, so that the burrs formed on the disk during the transport of the disk cause the disk support. Since the impact force at the time of colliding with the inner peripheral surface of the member is reduced, the amount of particles that cause black defects is significantly reduced. As a result, the yield of the process is improved, and a high-quality optical disc with a low error rate can be produced. In addition, in the rotation control method according to the seventh aspect, since there is no discontinuity in the acceleration of the rotation speed, the impact at the time of collision between the disk forming burr and the inner peripheral surface of the disk support member is reduced. Therefore, the amount of particles that cause black defects is extremely reduced. As a result, the yield of the process is improved, and a high-quality optical disc with a low error rate can be produced.

(4) The sputtering apparatus according to the eighth or ninth aspect of the present invention is the apparatus according to the first, second, third, fourth or fifth aspect, further comprising a control device capable of implementing the operation control method according to the sixth aspect. Therefore, the above effects according to the inventions according to these claims can be obtained. In addition to the above, according to the sputtering apparatus of the ninth aspect, the area of the inner peripheral surface in contact with the outer peripheral surface of the disk is reduced. (The transport of the disk becomes unstable), it is possible to avoid the transport downtime by ensuring the reliability of the disk transport.

(5) In the optical disk according to the tenth aspect, since the defect rate of black defects is extremely low, the error rate during recording, for example, BLER is 10 or less (22 in the OB standard).
0 or less), and the optical disc has extremely high reliability during recording and reproduction.

[Brief description of the drawings]

FIGS. 1A and 1B show a disk support member according to a first embodiment of the present invention, wherein FIG. 1A is a plan view and FIG.

FIGS. 2A and 2B show a disk support member according to a second embodiment, in which FIG. 2A is a sectional view of a main part, and FIG. 2B is an enlarged view of a portion A in FIG.

FIG. 3 is a sectional view of a main part showing a disk support member according to a third embodiment.

FIG. 4 is a graph showing a monitor output of a rotation speed of a rotation shaft for rotating the disk support member, according to a method of controlling rotation of a disk support member in a conventional sputtering apparatus.

FIG. 5 is a graph showing a monitor output of a rotation speed of a rotation shaft for rotating the disk support member according to the method for controlling rotation of the disk support member in the fourth embodiment.

FIG. 6 is a graph showing the off-line defect rates obtained in Examples 1 to 4 and Comparative Example 1.

FIG. 7 is a schematic cross-sectional view showing a main structure of a conventional sputtering apparatus and a disk transport operation.

8 (a) is a plan view and FIG. 8 (b) is a cross-sectional view of the disk supporting member provided in the sputtering apparatus of FIG.

9A and 9B show a conventional optical disk made of a resin substrate, wherein FIG. 9A is a perspective view of the entirety, and FIG. 9B is a cross-sectional view of an outer peripheral portion of the optical disk, in which a micrograph is sketched.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Disc support member 2 Inner peripheral surface 2a Step 3 Claw 4 Columnar member 5 Flange part 11 Unprocessed disk 12 Disk being sputtered 13 Processed disk 50 External transport mechanism 51 Rotating arms 52, 54 Plate 53, 55 Vacuum suction part Reference Signs List 60 Load lock chamber 61 Load lock chamber pusher 61a Elevating shaft 61b Push-up member 62, 64 Piping 63, 65 Automatic open / close valve 70 Internal transfer mechanism 71 Rotating shaft 72, 74 Arm 73, 75 Ring-shaped transfer member 81, 82 Disk support Member 81a Flange portion 81b Claw 81c Inner peripheral surface 100 Disc 101 Outer peripheral surface 102 Groove surface 103 Molded burr 201 Overshoot 202 Discontinuity point of acceleration

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 4K029 AA11 AA24 BC07 BD00 BD09 JA02 JA05 5D029 KB20 MA11 5D121 AA05 EE03 EE19

Claims (10)

[Claims] An annular disk support member for mounting a disk made of a resin molded substrate, supporting the disk in a horizontal direction with its outer peripheral surface concentrically surrounded, and transporting the disk by revolving rotational movement. In the sputtering apparatus for forming an optical disk reflection film, the disk support member is formed by projecting three or more rounded protrusions on the inner peripheral surface of the disk support member toward the center side of the disk support member, and transporting the disk. A sputter apparatus wherein an outer peripheral surface of a disk can come into contact with said projection substantially by point contact. 2. The sputtering apparatus according to claim 1, wherein the protrusion is formed of an elastic body made of a soft material. 3. An annular disk support member for mounting a disk made of a resin molded substrate, supporting the disk in a horizontal direction with its outer peripheral surface concentrically surrounded, and transporting the disk by revolving rotational movement. In the sputtering apparatus for forming an optical disk reflective film, a step is formed by making the inner diameter of the upper half of the disk support member larger than the inner diameter of the lower half, and the disk is placed on the disk support member in the horizontal direction. A sputter device wherein an upper portion of the outer peripheral surface of the disk can be positioned above an upper surface of the step. 4. The apparatus according to claim 3, wherein when the disk is placed on the disk support member in a horizontal direction, the upper end of the disk outer peripheral surface is at least 0.02 mm, preferably 0.1 mm or more, above the upper surface of the step. A sputtering apparatus characterized in that it can be positioned. 5. An annular disk support member for mounting a disk made of a resin molded substrate, supporting the disk in a horizontal direction with its outer peripheral surface concentrically surrounded, and transporting the disk by revolving rotational movement. A sputter apparatus for forming an optical disk reflection film, wherein the inner peripheral surface of the disk support member is formed in an inverted conical shape having a taper having an inclination angle of 1.5 ° or more. 6. An annular disk support member for mounting a disk made of a molded substrate made of resin, supporting the disk in a horizontal direction while concentrically surrounding its outer peripheral surface, and transporting the disk by revolving rotational movement. When operating a sputtering apparatus for forming an optical disc reflective film, the deceleration operation of the revolving rotational movement of the disk support member is performed without overshooting in which the rotational direction is reversed. An operation control method for a sputtering apparatus. 7. An annular disk support member for mounting a disk made of a resin molded substrate, supporting the disk in a horizontal direction with its outer peripheral surface concentrically surrounded, and transporting the disk by revolving rotational movement. When operating a sputtering apparatus for forming an optical disk reflective film, the operation of accelerating the orbital rotation of the disk support member is performed without causing a discontinuity in the acceleration. Operation control method. 8. A sputtering apparatus according to claim 1, 2, 3, 4, or 5, further comprising a control device capable of implementing the operation control method according to claim 6. 9. A sputtering apparatus according to claim 1, further comprising a control device capable of implementing the operation control method according to claim 7. Description: 10. An optical disk manufactured by the sputtering apparatus according to claim 1, 2, 3, 4, 5, 8, or 9.