JP2000178517A - Thermosetting adhesive sheet - Google Patents
Thermosetting adhesive sheetInfo
- Publication number
- JP2000178517A JP2000178517A JP10358502A JP35850298A JP2000178517A JP 2000178517 A JP2000178517 A JP 2000178517A JP 10358502 A JP10358502 A JP 10358502A JP 35850298 A JP35850298 A JP 35850298A JP 2000178517 A JP2000178517 A JP 2000178517A
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- Japan
- Prior art keywords
- parts
- adhesive sheet
- thermosetting adhesive
- cured
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品、半導体
部品接着材料として、熱ロール、熱プレス等により低温
低圧で熱接着硬化でき、且つポリイミド等のフィルム材
料、金属、シリコン、エポキシ、セラミック等に対する
接着性が硬化時、半硬化時共に優れ、半硬化時の加工性
に優れ、硬化時の耐湿性、耐熱性、高熱伝導性をあわせ
持つ熱硬化性接着シートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive material for electronic parts and semiconductor parts, which can be thermally bonded and hardened at a low temperature and a low pressure by a hot roll, a hot press or the like, and a film material such as polyimide, metal, silicon, epoxy, ceramic, etc. The present invention relates to a thermosetting adhesive sheet which has excellent adhesiveness to both cured and semi-cured products, has excellent workability during semi-cured conditions, and has both moisture resistance, heat resistance and high thermal conductivity during curing.
【０００２】[0002]
【従来の技術】従来、電子部品、半導体部品接着材料の
接着剤としては、ガラスエポキシプリプレグやエポキシ
樹脂に各種ゴムを添加した接着シート材料、液状の接着
剤を塗布して接着する等の方法が取られている。ここで
ガラスエポキシプリプレグを使用した場合、接着剤の薄
膜化が困難である、接着条件が高温で長時間である、吸
湿後の密着性の確保が困難である、加工時に切断粉が発
生する等の問題があった。また、エポキシ樹脂に各種ゴ
ムを添加した接着シート材料は、接着シート自身の凝集
破壊が起こり易い、接着剤の耐熱性が乏しい等の欠点が
あった。さらに、液状の接着剤では作業工数が大きい、
塗布時のにじみ、ずれ等による扱いずらさ等の問題があ
った。また電子部品、半導体部品接着の分野では、部品
の小型化、高性能化により発熱量が大きくなっており、
充填剤を含まない熱抵抗の大きい熱硬化性接着シートを
用いた場合、各種部品の誤作動の問題があった。2. Description of the Related Art Conventionally, as adhesives for adhesive materials for electronic parts and semiconductor parts, there have been used methods such as glass epoxy prepreg, an adhesive sheet material obtained by adding various rubbers to an epoxy resin, and a liquid adhesive applied and bonded. Has been taken. When a glass epoxy prepreg is used, it is difficult to reduce the thickness of the adhesive, the bonding condition is long time at high temperature, it is difficult to secure the adhesion after absorbing moisture, and cutting powder is generated during processing. There was a problem. Further, the adhesive sheet material obtained by adding various rubbers to the epoxy resin has disadvantages such as the cohesive failure of the adhesive sheet itself and the poor heat resistance of the adhesive. Furthermore, liquid adhesives require a large number of work steps,
There are problems such as bleeding at the time of application and mishandling due to misalignment. In addition, in the field of electronic parts and semiconductor parts bonding, the amount of heat generated has increased due to the miniaturization and high performance of parts,
When a thermosetting adhesive sheet containing no filler and having high heat resistance is used, there is a problem of malfunction of various parts.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、かかる状況
に鑑みなされたもので、電子部品、半導体部品接着材料
として、低温低圧で熱接着硬化でき、且つポリイミド等
のフィルム材料、金属、シリコン、エポキシ、セラミッ
ク等に対する接着性が硬化時、半硬化時共に優れ、半硬
化時の加工性に優れ、硬化時の耐湿性、耐熱性、高熱伝
導性をあわせ持つ熱硬化性接着シートを提供することを
目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and as an adhesive material for electronic parts and semiconductor parts, can be heat-adhesive-cured at low temperature and low pressure, and can be a film material such as polyimide, metal, silicon, or the like. To provide a thermosetting adhesive sheet that has excellent adhesion to epoxy, ceramic, etc. when cured and semi-cured, has excellent workability during semi-cured, and has moisture resistance, heat resistance, and high thermal conductivity when cured. With the goal.
【０００４】[0004]
【課題を解決するための手段】かかる目的は本発明によ
れば、エポキシ樹脂及び硬化剤成分１００重量部に対
し、分子量５万以上のゴム成分１００〜１７０重量部、
硬化促進剤０．３〜２．５重量部、無機充填剤を全樹脂
成分１００体積部に対して２０〜７０体積部からなる接
着剤組成物を基材フィルムに塗布し、半硬化状態に熱処
理してなる熱硬化性接着シートを用いることにより達成
される。According to the present invention, there is provided, according to the present invention, 100 to 170 parts by weight of a rubber component having a molecular weight of 50,000 or more per 100 parts by weight of an epoxy resin and a curing agent component.
An adhesive composition comprising 0.3 to 2.5 parts by weight of a curing accelerator and 20 to 70 parts by volume of an inorganic filler with respect to 100 parts by volume of all resin components is applied to a base film and heat-treated to a semi-cured state. This is achieved by using a thermosetting adhesive sheet formed as described above.
【０００５】[0005]
【発明の実施の形態】本発明で用いられるエポキシ樹脂
としては、特に制限するものではないが、好ましくはエ
ポキシ当量２５０以下の室温で液状のものが好ましく、
エポキシ当量２５０以下のエポキシ樹脂を用いることに
より、７０〜１４０℃の低温での熱ロール圧着、熱プレ
ス圧着性の向上が図れる。また、硬化後のＴｇの低下を
防止できる。このようなエポキシ樹脂としては、エピコ
ート８２８、エピコート８１５（油化シェル（株）
製）、エピクロン８５０、エピクロン８４０（大日本イ
ンキ化学（株）製）等がある。また、フェノールノボラ
ック型エポキシ樹脂を全エポキシ成分の１０〜５０％添
加することにより、耐熱性（Ｔｇ）の向上を図ることが
できる。このようなフェノールノボラック型エポキシに
は、ＥＳＣＮ−００１（住友化学工業（株）製）、エピ
クロンＮ−６７３（大日本インキ化学（株）製）等があ
る。硬化促進剤としては、各種イミダゾール類を使用す
ることが望ましい。イミダゾールとしては、２−メチル
イミダゾール、２−エチル−４−メチルイミダゾール、
１−シアノエチル−４−フェニルイミダゾール等が挙げ
られ、２ＭＺ、２Ｅ４ＭＺ、２ＰＺ−ＣＮ、２ＰＺ−Ｃ
ＮＳ、（四国化成工業（株）製）等がある。分子量５万
以上のゴム成分の添加はエポキシ樹脂、硬化剤成分だけ
では半硬化状態での膜特性が確保できないためである。
ゴム成分の添加量が１００重量部未満では、半硬化時に
基材フィルムから剥離する時割れの現像が発生し、１７
０重量部を超えると硬化物の耐熱性（Ｔｇ）が急激に低
下するという問題があるため、添加量は１００〜１７０
重量部が好ましい。また、このゴム成分はエポキシ基を
１〜１０モル％含有するアクリルゴムが好ましい。ゴム
成分の末端エポキシ基が硬化に関与し、ゴム成分添加に
よる硬化時の急激なＴｇの低下を防止させ、さらにエポ
キシとの相溶性を向上させる。このようなゴム成分に
は、ＨＴＲ−８６０Ｐ−３（帝国化学産業（株）製）等
がある。無機充填剤の材質は、放熱性と絶縁性に優れた
ものであれば特に制限はなく、酸化アルミニウム、窒化
アルミニウム、酸化マグネシウム、窒化ホウ素等の一般
に高熱伝導剤と称されるものが使用される。また、無機
充填剤は球形であることが好ましい。無機充填剤が針
状、鱗片状等の場合、接着剤樹脂中に高密度充填するこ
とが困難となり、その結果、絶縁層内に空隙が発生し絶
縁破壊電圧が低下するため好ましくない。無機充填剤の
添加量は、２０体積部未満の場合、加熱加圧による圧着
時の流動性が大きく膜厚が均一に保てない、７０体積部
を超える場合、ワニス粘度上昇等により基材フィルムへ
の塗布が困難となる。また、成膜後のシートに柔軟性が
小さく取り扱い時にクラック発生の問題がある。このた
め、添加量は２０〜７０体積部が好ましい。使用される
無機充填剤粒子径は、最大粒径６０μｍ以下であること
が必須である。最大粒径６０μｍ以上の場合、内部に空
隙を持つ凝集粒子を含むことが多く、この凝集粒子が耐
電圧を低下させるため好ましくない。このような無機充
填剤には、ＡＳ−２０、ＡＳ−５０（昭和電工（株）
製）等がある。また、無機充填剤の表面改質、分散性向
上のため、シランカップリング剤を添加してもよい。シ
ランカップリング剤には、Ａ−１８７、Ａ−１８９、Ａ
−１１００、Ａ−１１６０（日本ユニカー（株）製）等
が挙げられる。熱硬化性接着シートは、前記の接着剤組
成物をＭＥＫ、トルエン等の有機溶剤により溶解し基材
に塗布し乾燥することで得られる。基材にはＰＥＴ、ポ
リイミド、ポリエチレン、銅箔等が挙げられ、乾燥温度
に耐えられるものであれば、特に限定させるものではな
い。乾燥条件としては特に限定されないが、接着シート
の硬化率を１０〜６０％の乾燥条件により調整すること
が必要である。この時硬化率が１０％未満であると、３
０℃以上の温度で粘着性を発生させてしまい、ブロッキ
ングの発生や、取り扱いのしにくさ等の弊害が発生して
しまう。さらに硬化率が６０％を超えると圧着温度条件
が１４０℃以上、圧力条件が１０ｋｇ／ｃｍ2 以上と低
温低圧での接着が困難になる。従って、硬化率としては
１０〜６０％が好ましい。ここで、硬化率は以下の用に
定義するものとする。 未硬化状態の樹脂組成物のＤＳＣの発熱量＝Ａ（Ｊ／
ｇ） 乾燥後の半硬化状態の樹脂組成物のＤＳＣの発熱量＝Ｂ
（Ｊ／ｇ） 効果率（％）＝（Ａ−Ｂ）／Ａ×１００ これにより、圧着温度１４０℃、圧着圧力１０ｋｇ／ｃ
ｍ 以下、硬化温度１５０℃（６０分）のラミネート
低温低圧による圧着が可能となり、ポリイミド等のフィ
ルム材料、金属、シリコン、セラミック等に対する接着
性が硬化時、半硬化時共に優れ、半硬化時加工性に優
れ、硬化時の耐湿性、耐熱性、高熱伝導性をあわせ持つ
熱硬化性接着シートを得ることができた。DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin used in the present invention is not particularly limited, but is preferably a liquid at room temperature with an epoxy equivalent of 250 or less,
By using an epoxy resin having an epoxy equivalent of 250 or less, it is possible to improve hot roll press bonding and hot press press bonding at a low temperature of 70 to 140 ° C. Further, a decrease in Tg after curing can be prevented. Examples of such an epoxy resin include Epicoat 828 and Epicoat 815 (Yukaka Shell Co., Ltd.)
Manufactured by Dainippon Ink and Chemicals, Inc.), Epicron 850 and Epicron 840 (manufactured by Dainippon Ink and Chemicals, Inc.). Further, by adding 10 to 50% of the total epoxy component of the phenol novolak type epoxy resin, the heat resistance (Tg) can be improved. Examples of such a phenol novolak type epoxy include ESCN-001 (manufactured by Sumitomo Chemical Co., Ltd.) and Epicron N-673 (manufactured by Dainippon Ink and Chemicals, Inc.). It is desirable to use various imidazoles as the curing accelerator. Examples of imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole,
1-cyanoethyl-4-phenylimidazole and the like, and 2MZ, 2E4MZ, 2PZ-CN, 2PZ-C
NS (manufactured by Shikoku Chemical Industry Co., Ltd.) and the like. This is because the addition of a rubber component having a molecular weight of 50,000 or more cannot ensure film properties in a semi-cured state only with an epoxy resin and a curing agent component.
If the added amount of the rubber component is less than 100 parts by weight, cracking develops when peeled from the base film at the time of semi-curing.
If the amount exceeds 0 parts by weight, there is a problem that the heat resistance (Tg) of the cured product is rapidly reduced.
Parts by weight are preferred. The rubber component is preferably an acrylic rubber containing 1 to 10 mol% of an epoxy group. The terminal epoxy group of the rubber component is involved in the curing, which prevents a sharp decrease in Tg during curing due to the addition of the rubber component, and further improves the compatibility with the epoxy. Such rubber components include HTR-860P-3 (manufactured by Teikoku Chemical Industry Co., Ltd.). The material of the inorganic filler is not particularly limited as long as it has excellent heat dissipation and insulation properties, and materials generally called high thermal conductive agents such as aluminum oxide, aluminum nitride, magnesium oxide, and boron nitride are used. . Further, the inorganic filler is preferably spherical. If the inorganic filler is in the form of needles, scales, or the like, it is difficult to fill the adhesive resin with high density, and as a result, voids are generated in the insulating layer and the dielectric breakdown voltage is reduced, which is not preferable. When the addition amount of the inorganic filler is less than 20 parts by volume, the fluidity at the time of press bonding by heating and pressurizing is large and the film thickness cannot be kept uniform. It becomes difficult to apply to the surface. In addition, there is a problem in that the sheet after film formation has low flexibility and cracks occur during handling. For this reason, the addition amount is preferably 20 to 70 parts by volume. It is essential that the particle diameter of the inorganic filler used is 60 μm or less in maximum particle diameter. When the maximum particle size is 60 μm or more, aggregated particles having voids therein are often included, and this aggregated particle is not preferable because it lowers the withstand voltage. Such inorganic fillers include AS-20, AS-50 (Showa Denko KK)
Manufactured). Further, a silane coupling agent may be added for surface modification of the inorganic filler and improvement in dispersibility. A-187, A-189, A
-1100 and A-1160 (manufactured by Nippon Unicar Co., Ltd.). The thermosetting adhesive sheet is obtained by dissolving the above-mentioned adhesive composition with an organic solvent such as MEK and toluene, applying the solution to a substrate, and drying. Examples of the substrate include PET, polyimide, polyethylene, and copper foil, and are not particularly limited as long as they can withstand the drying temperature. The drying condition is not particularly limited, but it is necessary to adjust the curing rate of the adhesive sheet by a drying condition of 10 to 60%. At this time, if the curing rate is less than 10%, 3
At a temperature of 0 ° C. or higher, tackiness is generated, and adverse effects such as occurrence of blocking and difficulty in handling occur. Further, when the curing rate exceeds 60%, the pressure bonding condition is 140 ° C. or more and the pressure condition is 10 kg / cm 2 or more. Therefore, the curing rate is preferably from 10 to 60%. Here, the curing rate is defined as follows. Heat value of DSC of uncured resin composition = A (J /
g) Calorific value of DSC of semi-cured resin composition after drying = B
(J / g) Effective rate (%) = (A−B) / A × 100 Thus, the crimping temperature is 140 ° C., and the crimping pressure is 10 kg / c.
m or less, bonding at a low temperature and low pressure at a laminating temperature of 150 ° C (60 minutes) is possible. It was possible to obtain a thermosetting adhesive sheet having excellent heat resistance, moisture resistance during curing, heat resistance and high thermal conductivity.
【０００６】[0006]
【実施例】以下本発明を、実施例に基づきさらに具体的
に説明する。 実施例１ エポキシ樹脂エピコート８２８を６０重量部、硬化剤Ｌ
Ｆ−２８８２を４０重量部、ゴム成分ＨＴＲ−８６０Ｐ
−３を１５０重量部、硬化促進剤２ＰＺ−ＣＮを１．０
重量部、シランカップリング剤Ａ−１８７を３．０重量
部、無機充填剤４０体積部を有機溶剤ＭＥＫ１００重量
部に溶解し１時間撹拌した後、混練機で１時間混練し、
膜厚７５μｍのＰＥＴ基材上に塗布し、１３０℃、８分
乾燥し膜厚１００μｍ、硬化度３０％の熱硬化性接着シ
ートを作成した。評価方法としては、未硬化状態の基材
付き接着シートの３０℃の雰囲気での粘着性の有無、１
０℃での切断加工性、及び基材フィルムからの剥離の有
無について確認した。さらに接着品の評価には、熱硬化
性接着シートでポリイミドと電解銅箔とを１２０℃、１
２０ｋｇ／ｃｍ2 、３分圧着し、常圧１５０℃で６０分
硬化し、評価用の試験片を得た。評価項目及び結果を表
１に示す。The present invention will be described more specifically below with reference to examples. Example 1 60 parts by weight of epoxy resin Epicoat 828, curing agent L
40 parts by weight of F-2882, rubber component HTR-860P
-3, 150 parts by weight, curing accelerator 2PZ-CN, 1.0
Parts by weight, 3.0 parts by weight of the silane coupling agent A-187, and 40 parts by volume of the inorganic filler are dissolved in 100 parts by weight of the organic solvent MEK, stirred for 1 hour, and kneaded for 1 hour with a kneader.
The composition was applied on a PET substrate having a thickness of 75 μm and dried at 130 ° C. for 8 minutes to prepare a thermosetting adhesive sheet having a thickness of 100 μm and a curing degree of 30%. The evaluation method includes determining whether the adhesive sheet with a base material in an uncured state has tackiness in a 30 ° C. atmosphere,
The cutting workability at 0 ° C. and the presence or absence of peeling from the substrate film were confirmed. Further, for evaluation of the adhesive product, the polyimide and the electrolytic copper foil were heated at 120 ° C. for 1 hour using a thermosetting adhesive sheet.
It was press-bonded at 20 kg / cm 2 for 3 minutes and cured at normal pressure of 150 ° C. for 60 minutes to obtain a test piece for evaluation. Table 1 shows the evaluation items and the results.
【０００７】実施例２〜５ さらに同様の方法により、組成を変えて作成した接着シ
ートの実施例２〜５を表１に示す。Examples 2 to 5 Tables 1 to 5 show Examples 2 to 5 of adhesive sheets prepared by changing the composition in the same manner.
【０００８】比較例１〜５ 実施例と同様の方法により、作成した接着シートの比較
例１〜５を表２に示す。比較例１はゴム成分が規定より
少ないものであり、比較例２はゴム成分が規定より多い
ものである。比較例３は無機充填剤が規定よりも多いも
のである。比較例４は硬化率が規定より少ないものであ
り、比較例５は硬化率が規定より多いものである。Comparative Examples 1 to 5 Comparative examples 1 to 5 of the adhesive sheet prepared in the same manner as in the examples are shown in Table 2. In Comparative Example 1, the rubber component was smaller than the specified value, and in Comparative Example 2, the rubber component was larger than the specified value. Comparative Example 3 contains more inorganic filler than specified. Comparative Example 4 has a curing rate lower than the specified value, and Comparative Example 5 has a curing rate higher than the specified value.
【０００９】比較例６ 実施例１と同様な方法により接着シートを作成し、無機
充填剤の形状、粒子径について確認した。評価は、熱硬
化性接着シートでアルミニウム板と電解銅箔とを１２０
℃、１０ｋｇ／ｃｍ2 、３分圧着し、常圧１５０℃で６
０分硬化し、評価用の試験片を得た。評価項目は絶縁破
壊電圧について調べた。その結果を表３に示す。Comparative Example 6 An adhesive sheet was prepared in the same manner as in Example 1, and the shape and particle size of the inorganic filler were confirmed. The evaluation was performed using an aluminum plate and an electrolytic copper foil with a thermosetting adhesive sheet.
C, 10 kg / cm 2 , pressure bonding for 3 minutes.
It was cured for 0 minutes to obtain a test piece for evaluation. For the evaluation items, the breakdown voltage was examined. Table 3 shows the results.
【００１０】比較例６、７ 実施例１と同様な方法により接着シートを作成し、無機
充填剤の形状、粒子径について確認した。比較例６は鱗
片状、比較例７は最大粒子径７０μｍの無機充填剤を用
いた。評価は、熱硬化性接着シートでアルミニウム板と
電解銅箔とを１２０℃、１０ｋｇ／ｃｍ2 、３分圧着
し、常圧１５０℃で６０分硬化し、評価用の試験片を得
た。評価項目は絶縁破壊電圧について調べた。その結果
を表３に示す。Comparative Examples 6 and 7 An adhesive sheet was prepared in the same manner as in Example 1, and the shape and particle size of the inorganic filler were confirmed. Comparative Example 6 used a scaly shape, and Comparative Example 7 used an inorganic filler having a maximum particle size of 70 μm. In the evaluation, an aluminum plate and an electrolytic copper foil were pressure-bonded with a thermosetting adhesive sheet at 120 ° C., 10 kg / cm 2 for 3 minutes, and cured at normal pressure at 150 ° C. for 60 minutes to obtain a test piece for evaluation. For the evaluation items, the breakdown voltage was examined. Table 3 shows the results.
【００１１】[0011]
【表１】 [Table 1]
【００１２】[0012]
【表２】 [Table 2]
【００１３】[0013]
【表３】 [Table 3]
【００１４】[0014]
【発明の効果】本発明によれば、電子部品、半導体部品
接着材料として、低温低圧で圧着し熱接着硬化でき、且
つポリイミド等のフィルム材料、金属、シリコン、エポ
キシ、セラミック等に対する接着性が硬化時、半硬化時
共に優れ、半硬化時の加工性に優れ、硬化時の耐熱性、
高熱伝導性接着シートの提供が可能となった。According to the present invention, as an adhesive material for electronic parts and semiconductor parts, pressure bonding can be performed at a low temperature and a low pressure to thermally bond and cure, and adhesion to a film material such as polyimide, metal, silicon, epoxy, ceramic, etc. is cured. Time, semi-cured, excellent in semi-cured workability, heat resistance in curing,
It has become possible to provide a high heat conductive adhesive sheet.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 長尾 賢一 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮工場内 Ｆターム(参考） 4J002 BG04X CD00W CD06W DE077 DE147 DF017 DK007 EU116 FA087 FD017 FD156 GJ00 4J004 AA02 AA05 AA10 AA13 AA17 AA18 AB05 CA06 CC02 FA05 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Kenichi Nagao 1150 Goshomiya, Shimodate, Ibaraki Pref. GJ00 4J004 AA02 AA05 AA10 AA13 AA17 AA18 AB05 CA06 CC02 FA05
Claims (6)
に対し、分子量５万以上のゴム成分１００〜１７０重量
部、硬化促進剤０．３〜２．５重量部、無機充填剤を全
樹脂成分１００体積部に対して２０〜７０体積部からな
る接着剤組成物を基材フィルムに塗布し、半硬化状態に
熱処理してなる熱硬化性接着シート。1. 100 parts by weight of a rubber component having a molecular weight of 50,000 or more, 100 to 170 parts by weight of a curing accelerator, 0.3 to 2.5 parts by weight of a curing accelerator, and an inorganic filler based on 100 parts by weight of an epoxy resin and a curing agent component. A thermosetting adhesive sheet formed by applying an adhesive composition comprising 20 to 70 parts by volume to 100 parts by volume on a base film and heat-treating it to a semi-cured state.
あり、且つ室温で液状である請求項１記載の熱硬化性接
着シート。2. The thermosetting adhesive sheet according to claim 1, wherein the epoxy resin has an epoxy equivalent of 250 or less and is liquid at room temperature.
を１〜１０モル％含有するアクリルゴムである請求項１
または２記載の熱硬化性接着シート。3. The rubber component having a molecular weight of 50,000 or more is an acrylic rubber containing 1 to 10 mol% of epoxy groups.
Or the thermosetting adhesive sheet according to 2.
３記載の熱硬化性接着シート。4. The thermosetting adhesive sheet according to claim 1, wherein the inorganic filler is spherical.
ある請求項１乃至４のいずれかに記載の熱硬化性接着シ
ート。5. The thermosetting adhesive sheet according to claim 1, wherein the inorganic filler has a maximum particle size of 60 μm or less.
半硬化状態の硬化率が１０〜６０％である請求項１乃至
５のいずれかに記載の熱硬化性接着シート。6. The thermosetting adhesive sheet according to claim 1, wherein a curing rate in a semi-cured state by heat treatment after being applied to the base film is 10 to 60%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358502A JP2000178517A (en) | 1998-12-17 | 1998-12-17 | Thermosetting adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358502A JP2000178517A (en) | 1998-12-17 | 1998-12-17 | Thermosetting adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000178517A true JP2000178517A (en) | 2000-06-27 |
Family
ID=18459654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10358502A Pending JP2000178517A (en) | 1998-12-17 | 1998-12-17 | Thermosetting adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000178517A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002179886A (en) * | 2000-12-15 | 2002-06-26 | Nagase Chemtex Corp | Highly thermally conductive epoxy resin composition, sheetlike material comprising the same composition and highly thermally conductive substrate comprising the same sheetlike material |
| JP2011026457A (en) * | 2009-07-27 | 2011-02-10 | Taisei Plas Co Ltd | Solvent type epoxy adhesive and adhesion method |
| CN103409091A (en) * | 2013-08-14 | 2013-11-27 | 泰山体育产业集团有限公司 | Electric heating epoxy resin adhesive film |
-
1998
- 1998-12-17 JP JP10358502A patent/JP2000178517A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002179886A (en) * | 2000-12-15 | 2002-06-26 | Nagase Chemtex Corp | Highly thermally conductive epoxy resin composition, sheetlike material comprising the same composition and highly thermally conductive substrate comprising the same sheetlike material |
| JP2011026457A (en) * | 2009-07-27 | 2011-02-10 | Taisei Plas Co Ltd | Solvent type epoxy adhesive and adhesion method |
| CN103409091A (en) * | 2013-08-14 | 2013-11-27 | 泰山体育产业集团有限公司 | Electric heating epoxy resin adhesive film |
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