JP2000164679A - Substrate-processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate-processing device which uses a non contact type sensor and can suppress noncenformities which occur when this sensor is used. SOLUTION: This substrate-processing device is provided with a transfer roller, a spray nozzle, a position sensor 34, and a spot nozzle 340. The transfer roller transfers a substrate W, and the spray nozzle supplies a liquid chemical to the substrate W. The position sensor 34 detects the presence of the substrate W at a prescribed position, without waking contact with the substrate W. The spot nozzle 340 jets out a nitrogen gas to a detection position P. This detection position P is a position to be detected by the position sensor 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for processing substrates such as glass substrates for liquid crystal displays, glass substrates for color filters, substrates for photomasks, ceramic substrates for thermal heads, printed substrates, and semiconductor wafers. In particular, the present invention relates to a substrate processing apparatus provided with a detecting unit provided for detecting a position of a substrate to be transferred.

[0002]

2. Description of the Related Art There are many substrate processing apparatuses which transport a substrate and supply a processing liquid to the substrate to perform the substrate processing. In such an apparatus, it is usually necessary to detect the loading and unloading of the substrate in each processing unit, and in the case where the substrate is swung by reciprocating along the transport direction in a predetermined processing unit, the substrate is It is necessary to switch the transport direction by detecting the front end and the rear end of the printer. For this reason, a conventional substrate processing apparatus is provided with a detection sensor for detecting a substrate position.

The detection sensor installed in this conventional substrate processing apparatus is a contact type sensor, that is, a sensor that detects the presence of a substrate by contacting the front end of the substrate or the like. Examples of the contact-type sensor include a sensor that detects the inclination of a contact portion that contacts the substrate with a reed switch or the like.

[0004] As described above, the reason why a contact-type sensor is conventionally employed is that a non-contact-type sensor such as a photoelectric sensor, an ultrasonic sensor, or a capacitance-type proximity sensor is used.
This is because there is a high possibility that the sensor will not function or the sensor itself will be damaged due to the processing liquid adhering to the substrate or these sensors. Specifically, when the photoelectric sensor is used, if the processing liquid adheres to the substrate, light that should reach the photoelectric sensor is irregularly reflected, the sensor malfunctions, and the processing liquid adheres to the photoelectric sensor itself. Sometimes there is a risk of malfunction. In addition, the capacitance proximity sensor has a high risk of malfunction in detecting the processing liquid having a higher dielectric constant than the substrate first, and the ultrasonic sensor has a high risk of failure if the processing liquid adheres to the sensor. Exists.

[0005]

As described above, the contact type sensor is widely used in the conventional substrate processing apparatus, but there is a problem due to the contact type sensor. The problem is that, for example, the movable part is inevitably present due to the movement of the contact part with the substrate, but the movable part often breaks due to repeated operation, or the processing liquid crystallizes on the movable part and makes contact. The sensor may malfunction because the part does not move or the processing liquid hits the contact part instead of the substrate.

For this reason, it is desirable to use a non-contact sensor instead of a contact sensor in the substrate processing apparatus. However, as described above, a non-contact sensor is used in the substrate processing apparatus due to the presence of the processing liquid. It is difficult to select this, and a contact-type sensor has been conventionally used.

An object of the present invention is to provide a substrate processing apparatus that uses a non-contact type sensor and that suppresses problems caused by using the non-contact type sensor.

[0008]

According to a first aspect of the present invention, there is provided a substrate processing apparatus including a transporting unit, a processing liquid supplying unit, a non-contact detecting unit, and a gas supplying unit. The transfer means transfers the substrate. The processing liquid supply unit supplies the processing liquid to the substrate. The non-contact detection unit is a detection unit that can detect whether or not the substrate exists at a predetermined position without contacting the substrate. The gas supply means blows out gas at or near the detection position. This detection position is a position detected by the non-contact detection means.

In the apparatus according to the present invention, gas is blown out to the detection position or the vicinity of the detection position by the gas supply means. For this reason, even when the processing liquid adheres to the substrate, the processing liquid adhering to the substrate can be partially blown off at the detection position. Therefore, when the non-contact detecting means is used, the malfunction that the processing liquid adheres to the substrate to cause a malfunction does not occur, and the conveyed substrate can be reliably detected by the non-contact detecting means.

It is often desirable to use an inert gas such as a nitrogen gas in consideration of the characteristics of the processing solution for the gas blown out from the gas supply means. A gas may be used.

According to a second aspect of the present invention, there is provided a substrate processing apparatus.
2. The device according to claim 1, further comprising a cover. The cover surrounds the non-contact detecting means. The cover has an opening. The opening of the cover is located in a space connecting the non-contact detection means and the detection position.

In the apparatus according to the present invention, since the non-contact detecting means is surrounded by the cover, the processing liquid and the mist of the processing liquid in the atmosphere are suppressed from adhering to the non-contact detecting means. Thereby, malfunction or failure of the non-contact detection means caused by the treatment liquid or the like adhering to the non-contact detection means can be suppressed. Therefore, the detection of the transport substrate by the non-contact detection means in the substrate processing apparatus becomes more reliable.

The cover is provided with an opening in a space connecting the non-contact detection means and the detection position so that the cover does not block light or sound waves used by the non-contact detection means for detecting the substrate. .

A third aspect of the present invention provides a substrate processing apparatus.
The non-contact detection means is arranged in a flow of gas blown out from the gas supply means.

In the device according to the present invention, the non-contact detecting means is arranged in the flow of the gas by utilizing the blowing of the gas at or near the detecting position. For this reason, the processing liquid supplied from the processing liquid supply unit and the mist of the processing liquid in the atmosphere are suppressed from approaching the non-contact detection unit, and these are hardly attached to the non-contact detection unit. Therefore, malfunction or failure of the non-contact detection means caused by the processing liquid or the like adhering to the non-contact detection means is suppressed, and the detection of the transport substrate by the non-contact detection means in the substrate processing apparatus becomes more reliable. . In other words, the gas blown out from the gas supply means serves to make the processing liquid attached to the substrate partially blown off when it reaches the detection position, and the processing liquid etc. is used for non-contact detection. It also plays a role in suppressing adhesion to the means.

It is necessary that the gas supply means blows the gas to the detection position or to the vicinity of the detection position at least when the detection is required, but the gas is always blown even when the detection is not performed. If this is the case, it is possible to more effectively suppress the problem that the treatment liquid or the like adheres to the non-contact detection means and impairs the function of the non-contact detection means or damages the non-contact detection means.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus.
The gas supply means has a nozzle for blowing gas. Further, the non-contact detecting means is disposed in the nozzle of the gas supply means.

In the apparatus according to the present invention, the non-contact detecting means is arranged in the nozzle for blowing the gas so that the non-contact detecting means is placed in the flow of the gas blown from the gas supply means. I have. Here, the non-contact detection means is generally surrounded by the nozzle, and the inside of the nozzle is less likely to enter the atmosphere including the mist of the processing liquid from the outside due to the blown gas. The processing liquid and the mist of the processing liquid hardly adhere, and the probability of malfunction or damage of the non-contact detecting means can be extremely reduced.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus according to the first aspect.
5. The apparatus according to any one of items 1 to 4, further comprising control means. The control means performs control to reduce the speed of the gas blown out from the gas supply means when there is no need for detection by the non-contact detection means.

In the apparatus according to the present invention, the speed of the gas blown from the gas supply means to the detection position or the vicinity of the detection position is increased when detecting the substrate being transferred, and the speed of the gas blown when the detection is not performed. Late (small)
are doing. In this way, when detection is performed, the processing liquid adhering to the substrate is reliably blown off to ensure detection. On the other hand, when detection is not performed, the processing liquid on the substrate is at least partially removed. Is prevented from being blown off and adversely affecting the substrate processing. That is, even when it is not necessary to perform the detection, if the gas is blown at a high speed on the substrate passing through the detection position, it may affect the substrate processing, and the processing may be deteriorated or the processing may be uneven. When it is not necessary to perform the process, the speed of the gas blown out is controlled to be small, so that it is possible to suppress the deterioration of the process and the occurrence of the process unevenness.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus.
5. The apparatus according to any one of items 1 to 4, further comprising control means. The control means performs control to reduce the amount of gas blown from the gas supply means when there is no need for detection by the non-contact detection means.

In the apparatus according to the present invention, the amount of gas blown from the gas supply means to the detection position or near the detection position is increased when detecting the substrate being transferred, and the amount of gas blown when no detection is performed. I have less. In this way, when detection is performed, the processing liquid adhering to the substrate is reliably blown off to ensure detection. On the other hand, when detection is not performed, the processing liquid on the substrate is at least partially removed. Is prevented from being blown off and adversely affecting the substrate processing.

Further, since a large amount of gas is blown out from the gas supply means only when detection is necessary, the total amount of gas required for detecting the substrate by the non-contact detection means is suppressed, and the running cost is reduced. Can be

According to a seventh aspect of the present invention, there is provided a substrate processing apparatus according to the fifth aspect.
Wherein the control means reduces the velocity of the gas blown from the gas supply means when the non-contact detection means detects the front end in the traveling direction of the substrate conveyed by the conveyance means at the detection position at the detection position. Perform control. Further, when the substrate passes the detection position as it is, the control unit performs control to keep the speed of the gas blown out from the gas supply unit low until the substrate passes the detection position thereafter.

In the apparatus according to the present invention, the non-contact detecting means detects the presence of the substrate at the predetermined position by detecting the front end of the conveyed substrate in the traveling direction. And
When the substrate passes the detection position while maintaining the same traveling direction, after detecting the front end in the traveling direction of the substrate, until the substrate passes the detection position, keep the speed of the gas blown out from the gas supply means small. .

Since such control is performed, the gas blown out of the gas supply means at such a high speed that the processing liquid adhering to the substrate is blown off may collide only with the front end in the traveling direction of the substrate. Absent. In other words, the front end in the traveling direction of the substrate is blown away by the gas at the detection position or in the vicinity of the detection position, and the attached processing liquid is blown off. The phenomenon that the processing liquid is blown off the substrate without blowing the gas hardly occurs. Therefore, the deterioration of the processing of the substrate and the unevenness of the processing of the substrate, which are problematic due to the blowing of the gas from the gas supply means, are almost eliminated.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment <Overall Configuration of Apparatus> FIG. 1 shows a substrate processing apparatus 1 according to one embodiment of the present invention. The substrate processing apparatus 1 is an apparatus that etches a thin film formed on a glass substrate W for a liquid crystal display, and mainly includes an inlet conveyor chamber 2, an etching chamber 3, a washing chamber 4, and a drying / unloading chamber 5. And transport rollers (transport means) 6 provided in each of the chambers 2 to 5.
In a space below each of the chambers 2 to 5, a chemical tank and a pipe for supplying a chemical to the etching chamber 3, a pure water tank and a pipe for supplying pure water to the washing chamber 4, high-pressure air, exhaust, and drainage -Various piping such as drainage, control devices, electric wiring, etc. are arranged.

<Outline of Operation of Apparatus> When a substrate W having a thin film formed on its surface is carried to the substrate processing apparatus 1, first, the substrate W is carried into the entrance conveyor chamber 2. afterwards,
The substrate W is transported by the transfer roller 6 to the etching chamber 3.
Go to In the etching chamber 3, a chemical solution for etching is sprayed on the substrate W, and a thin film on the substrate surface is etched by a predetermined thickness. The substrate W thus etched is then sent to the rinsing chamber 4, where the chemical solution attached to the substrate W is washed away with pure water. Then, the substrate W that has been subjected to the water washing process is carried out after the drying process by blowing air is performed in the drying / unloading chamber 5.
As described above, the substrate W is transferred from the inlet conveyor chamber 2 to the drying / unloading chamber 5, that is, from the left side to the right side in FIG.

In this case, the substrate W is placed in each of the chambers 2 to
At 5, it is processed and transported in a predetermined inclined state.
The transport rollers 6 are arranged such that their longitudinal directions are orthogonal to the transport direction D of the substrate W, and transport the substrate W while holding the substrate W in an inclined state. Above the transport roller 6, a transport path C (shown by a dashed line in FIG. 1) through which the substrate W passes is formed. The inclination of the transport roller 6, that is, the inclination of the substrate W, is set at 5 ° to 10 ° with respect to the horizontal plane in consideration of the etching processing efficiency and the like.

<Configuration and Operation of Each Chamber> In the etching chamber 3, as shown in FIG. 1, a spray nozzle 33 for injecting a chemical solution onto the substrate W, and the substrate W are moved along the transport path C by the transport roller 6 as shown in FIG. Position sensors (non-contact detecting means) 34, 35 used for swinging;
And an EPS (end point sensor) 36 for detecting the end point of the etching. The spray nozzles 33 extend along the transport path C of the substrate W, and a plurality of discharge ports are arranged at equal intervals in the width direction of the substrate W. After the substrate W is carried in between the position sensors 34 and 35, the spray nozzle 33 rotates the substrate W reciprocally by a predetermined angle about the longitudinal direction thereof.
The chemical solution is sprayed almost uniformly. Details of the position sensors 34 and 35 will be described later. This etching chamber 3
In the inside, the end of the etching is automatically detected by the EPS 36. In the meantime, the substrate W is oscillated by reciprocating between the position sensors 34 and 35 along the transport path C until then. The spray nozzle 33 receives the injection of the chemical solution.

The washing chamber 4 mainly includes an upper cleaning spray 41, a lower cleaning spray 42, position sensors (non-contact detecting means) 43 and 44, and an entrance curtain 45.
Is arranged. Upper and lower cleaning sprays 41, 4
2 injects pure water to the substrate W. Position sensor 4
Reference numerals 3 and 44 denote photoelectric sensors that detect the position of the substrate W on the transport path C in the washing chamber 4. Details of the position sensors 43 and 44 will be described later. The entrance curtain 45 supplies pure water to the substrate W in a curtain shape in a direction intersecting with the transport direction D.

The substrate W in a state where the etching is performed by the chemical solution in the etching chamber 3 and the chemical solution is attached,
When it is sent to the washing chamber 4 by the transport roller 6, layered pure water is applied from the entrance curtain 45,
The substrate W repeatedly swings back and forth between the two position sensors 43 and 44 for a predetermined time. At this time, pure water is sprayed onto the substrate W from the upper and lower cleaning sprays 41 and 42. The pure water comes into contact with and collides with the substrate W, and the chemical solution attached to the substrate W is washed away from the substrate W. Pure water contaminated by cleaning the substrate W and mixing with the chemical solution is discharged from the lower portion of the water cleaning chamber 4.

The drying / unloading chamber 5 is provided with upper and lower air knives 51 and 52 for injecting dry air onto the substrate W. In the drying / unloading chamber 5, the pure water remaining on the substrate W after the rinsing process in the rinsing chamber 4 is blown off by the dry air jetted from the air knives 51 and 52 to dry the substrate W.

<Position Sensor and Spot Nozzle> The position sensors 34 and 35 of the etching chamber 3 and the position sensors 43 and 44 of the washing chamber 4 have the same configuration, and move on the transport path C of the substrate W in the same manner. It detects that the substrate W to be conveyed has come directly under each position sensor.
Therefore, the position sensor 34 will be described below in detail, but the other position sensors 35, 43, and 44 will not be described in detail.

FIG. 2 shows a cross section near the position sensor 34.
The position sensor 34 is disposed above the transport path C, and projects light downward to receive reflected light reflected on the surface of the substrate W (light projection, reflection, and light reception are indicated by dotted lines in FIG. 2). This is a reflection type photoelectric sensor capable of detecting whether or not the substrate W exists at the detection position P (simulated by an arrow).

As shown in FIG. 2, the main body of the position sensor 34 including the light projecting portion and the light receiving portion is provided with a substantially cylindrical spot nozzle 340 provided for spraying nitrogen gas onto the detection position P in a spot-like manner. Located inside. The detection position P is located on the transport path C of the substrate W. The spot nozzle 340 is connected to the device 1 orthogonal to the transport path C.
Are provided at only one location in the width direction, and the lower end is narrowed. The narrowed lower opening 340a is arranged close to the detection position P. At the time of detection, a part of the substrate W which is transported by the nitrogen gas (flow direction is indicated by a two-dot chain arrow in FIG. 2) blown downward from the opening 340a and passes through the detection position P adheres. The processing liquid (chemical liquid) L is blown off (see FIG. 2).

A nitrogen gas is supplied to the spot nozzle 340 from a nitrogen gas supply pipe 340b connected to the upper portion. Therefore, the flow of the nitrogen gas in the spot nozzle 340 is a one-way flow flowing from the upper side to the lower side. Since the position sensor 34 is housed in the spot nozzle 340, it is arranged in the flow of the nitrogen gas. Since nitrogen gas is always blown downward from the opening 340 a of the spot nozzle 340, the atmosphere containing the mist of the chemical solution in the etching chamber 3 does not enter from outside the spot nozzle 340, and Also, the atmosphere containing the mist of the chemical does not approach.

As for the position sensors 35, 43, and 44,
Spot nozzles 35 arranged to surround each
0, 430, and 440 (see FIG. 1), and nitrogen gas (spot nozzles 430, 430,
The chemical liquid or pure water attached to a part of the substrate W passing through the detection position is blown off by air (440). Also, the atmosphere containing the mist of the chemical solution in the etching chamber 3 or the mist of the chemical solution or the pure water mist in the washing chamber 4 does not enter from outside the spot nozzles 350, 430, 440, and the position sensors 35, 43. , 4
The atmosphere containing the mist does not come close to 4.

The spot nozzles 340, 350, 4
The magnitude of the amount of nitrogen gas / air blown downward by the units 30 and 440 is switched by the control of the control unit 70 described later. When the amount of the nitrogen gas / air is increased, the nitrogen gas / air hits the substrate W at such a speed that the liquid adhering to the substrate W can be blown off. When the amount of nitrogen gas / air is reduced,
The speed of the nitrogen gas / air at the time of collision with the substrate W becomes extremely slow, and the liquid adhering to the substrate W hardly flows.

<Control of Apparatus> Next, the etching chamber 3 and the rinsing chamber 4 of the substrate processing apparatus 1 are mainly used.
The control of the substrate processing in the above will be described.

FIG. 3 shows a control system. In the control unit 70,
Signals from the position sensors 34, 35, 43, 44 and the EPS 36 are input. Based on these input signals, the control unit 7
0 denotes a conveying roller 6, a spray nozzle 33, an entrance curtain 45, cleaning sprays 41 and 42, an air knife 51,
52, spot nozzles 340, 350, 430, 440
Etc. The control unit 70 performs control as follows. When transporting the substrate W from the inlet conveyor chamber 2 to the etching chamber 3, the substrate W is in a dry state, and there is no need to blow nitrogen gas from the spot nozzles 340 and 350 to blow liquid from the substrate W. The substrate W is carried into the etching chamber 3 with the amount of nitrogen gas blown from 340 and 350 reduced.

When the position sensor 35 confirms that the front end of the substrate W in the traveling direction has reached the detection position immediately below the position sensor 35, the control unit 70 stops the transport roller 6 in the etching chamber 3. And spray nozzle 3
Etching is started by spraying a chemical solution for etching from 3.

At the time of this etching, the rotation direction of the transport roller 6 is switched to swing the substrate W between the position sensors 34 and 35, so that the position sensors 34 and 35 need to detect the position of the substrate W. Since the chemical liquid is attached to W (it is placed on it), the amount of nitrogen gas blown out from spot nozzles 340 and 350 is increased. Accordingly, the front end of the substrate W in the traveling direction (the end of the substrate W on the entrance conveyor chamber 2 side /
When the position sensor 35 enters the edge of the substrate W on the side of the washing chamber 4), the chemical liquid adhering to this portion is blown off by blowing nitrogen gas to expose the surface of the substrate W, The position sensors 34 and 35 can reliably detect the presence of the front end of the substrate W in the traveling direction.

In the swing control of the substrate W, when the control unit 70 receives a detection signal from the position sensor 34, the control unit 70 switches the transport roller 6 to forward rotation (rotation for transporting the substrate W in the transport direction D). Upon receiving the detection signal from the sensor 35, the transport roller 6 is switched to the reverse rotation. Accordingly, the substrate W swings back and forth along the transport path C between the position sensors 34 and 35 while receiving the injection of the chemical solution from the spray nozzle 33.

When the completion of the etching is detected by the EPS 36, the control unit 70 stops the injection of the chemical solution from the spray nozzle 33 and reduces the amount of nitrogen gas blown out from the spot nozzles 340 and 350. And the substrate W
Transfer processing from the etching chamber 3 to the washing chamber 4 is performed. At this time, since the blowing speed of the nitrogen gas from the spot nozzle 350 is extremely low, the chemical solution on the substrate W is blown away from only a part of the width of the substrate W passing through the detection position of the position sensor 35, and the etching process is performed. A problem such as uneven processing does not occur. Note that the amount of nitrogen gas blown out from the spot nozzle 350 is kept small at least until it is confirmed that the substrate W has been carried into the washing chamber 4 as described later.

When the substrate W is carried into the washing chamber 4, pure water is sprayed in a curtain shape on the substrate W conveyed from the entrance curtain 45, and the amount of air blown out from the spot nozzles 430 and 440 is increased. Then, the position sensor 43 arranged slightly closer to the drying and unloading chamber 5 than the entrance curtain 45 and the position sensor 4 arranged on the drying and unloading chamber 5 side
4, the position of the transferred substrate W is detected.
At this time, since the air is blown out from the spot nozzle 430 at a high speed, the substrate W passes through a detection position of the position sensor 43 in a part of the width direction of the substrate W (a direction orthogonal to the transport direction D on the substrate surface). The liquid is blown off from above, but when passing through it, the substrate W
Is supplied with pure water from the entrance curtain 45, and the air blown out from the spot nozzle 430 hardly affects the etching process.

When the position sensor 44 confirms that the front end of the substrate W in the traveling direction has reached the detection position immediately below the position sensor 44, the control unit 70 stops the transport roller 6 in the washing chamber 4. And the cleaning sprays 41 and 42
To start the cleaning process.

In this cleaning process, the position of the substrate W is required to be detected by the position sensors 43 and 44 in order to swing the substrate W between the position sensors 43 and 44 by switching the rotation direction of the transport roller 6. Since pure water is placed on the substrate W, the spot nozzles 430, 44
Increase the amount of air blown from zero. Thus, the front end in the traveling direction of the substrate W (the end of the substrate W on the side of the etching chamber 3 in the position sensor 43 / the side of the drying / unloading chamber 5 of the substrate W in the position sensor 44) is located at the detection position immediately below the position sensors 43 and 44. End)
Since the pure water on this portion is blown off by blowing air, the position sensors 43 and 44 can reliably detect the presence of the front end of the substrate W in the traveling direction.

In the swing control of the substrate W, the control unit 70 switches the transport roller 6 to forward rotation when receiving a detection signal from the position sensor 43, and switches the transport roller 6 when receiving the detection signal from the position sensor 44. Switch to reverse rotation. Thus, the substrate W swings back and forth along the transport path C between the position sensors 43 and 44 while receiving the jet of pure water from the cleaning sprays 41 and 42.

When the cleaning process is completed after a lapse of a predetermined time, the control unit 70 stops the injection of the pure water from the cleaning sprays 41 and 42, and reduces the amount of air blown out from the spot nozzles 430 and 440. Then, the process proceeds to a process of transporting the substrate W from the washing chamber 4 to the drying / unloading chamber 5.

<Features of Apparatus> (1) In the present apparatus 1, spot nozzles 340, 350, 430, and 440 are provided as shown in FIGS.
Nitrogen gas / air is blown to the detection position P. For this reason, even when a processing liquid such as a chemical solution or pure water adheres to the substrate W, the processing liquid adhering to the substrate W is partially blown off at the detection position P. Therefore, the position sensors 34, 35, 43, and 44, which are non-contact reflective photoelectric sensors, are prevented from malfunctioning due to the treatment liquid adhering to the substrate, and the substrate W to be transported can be reliably transferred. Can be detected.

(2) In the present apparatus 1, the spot nozzle 34
0, 350, 430, 440 to the detection position
By blowing air, the nitrogen gas / air flow, that is, spot nozzles 340, 35
Position sensors 34, 35, 4 inside 0, 430, 440
3, 44 are arranged. That is, the position sensor 34,
35, 43, and 44 are spot nozzles 340, 350,
430, 440 and spot nozzle 3
The inside of 40, 350, 430, 440 has a positive pressure.
For this reason, the chemical solution sprayed in the etching chamber 3 and the mist in the atmosphere, or the pure water sprayed in the washing chamber 4 and the mist in the atmosphere approach the position sensors 34, 35, 43, and 44 and adhere thereto. Will not be done. Therefore, malfunctions and failures of the position sensors 34, 35, 43, and 44 caused by the adhesion of the chemical solution or the like and the mist of the chemical solution to the position sensors 34, 35, 43, and 44 are suppressed, and the position in the substrate processing apparatus 1 is reduced. Sensor 34, 3
Detection of the substrate W by 5, 43, 44 is more reliable.

(3) In the present apparatus 1, when detecting the transported substrate W, the spot nozzles 340, 350
The speed is increased by increasing the amount of nitrogen gas blown out from the sensor to the detection position, and the speed is reduced by reducing the amount of nitrogen gas blown out when no detection is performed. Because of this, when detection is performed, the chemical liquid adhering to the substrate W is reliably blown off to ensure detection. On the other hand, when detection is not performed, even if the detection is partially performed in the width direction of the substrate W. It is possible to prevent the chemical solution on the substrate W from being blown off and adversely affecting the etching process. That is, even when it is not necessary to perform the detection, if the nitrogen gas is sprayed at a high speed on the substrate W passing through the detection position, it may affect the etching process and may deteriorate the process or cause uneven processing. Here, the control is performed such that the velocity of the nitrogen gas blown out when it is not necessary to perform the detection can suppress the deterioration of the processing and the occurrence of the processing unevenness.

Also, since a large amount of nitrogen gas is blown out only when detection is necessary, the position sensors 34 and 3
5, the total amount of nitrogen gas required for detecting the substrate W is suppressed, and the running cost is suppressed.

(4) In the present apparatus 1, the amount of air blown from the spot nozzles 430 and 440 to the detection position is increased when detecting a substrate being transported, and the amount of air blown is reduced when detection is not performed. ing. Since a large amount of air is blown out only when detection is necessary, the total amount of air required for detecting the substrate W by the position sensors 43 and 44 is suppressed, and the running cost is suppressed.

(5) In the present apparatus 1, when the substrate W is transferred from the etching chamber 3 to the washing chamber 4,
The amount of nitrogen gas blown out from the spot nozzle 350 is controlled so that the blowout speed becomes extremely slow. For this reason, the nitrogen gas blown out from the spot nozzle 350 at such a high speed that the chemical solution attached to the substrate W is blown off collides only with the front end of the substrate W in the traveling direction. In other words, at the time of swinging, the front end of the substrate W in the traveling direction is blown with the nitrogen gas at the detection position and the attached chemical solution is blown off. Only the nitrogen gas is blown, and the phenomenon that the chemical solution is blown off from above the substrate W does not occur. Therefore, here, there is no problem such that the chemical solution on the substrate W is blown off from a part of the width direction of the substrate W passing through the detection position of the position sensor 35, thereby deteriorating the etching process and causing the processing unevenness.

(6) In the present device 1, non-contact type position sensors 34, 35, 43, 44 are used instead of contact type position sensors.
, These can be arranged above the conveying path C, and the position sensors 34 and 43 are located at positions overlapping the conveying roller 6 in a plane regardless of the arrangement of the conveying roller 6.
Can be arranged.

(7) In the present apparatus 1, the position sensors 34, 3
5 and the position sensors 43 and 4
4 is reduced when the substrate is not detected, so that the spot nozzles 340, 350, 43
The speed of the nitrogen gas or air flowing in the chambers 0 and 440 is reduced. Therefore, when the speed of the nitrogen gas or air is reduced, the physical force that the nitrogen gas or air exerts on the position sensors 34, 35, 43, and 44 becomes small.

Therefore, as the liquid on the substrate is blown off, the position sensors 34, 35, 43, and 44 are less likely to break down due to physical force than when a large amount of nitrogen gas or air is constantly flowing at a high speed. Become.

Therefore, the position sensors 34, 35, 43, 4
4 becomes longer, and the running cost of the apparatus can be prevented from increasing.

<Other Embodiments> (A) The present invention is not limited to the above-described substrate processing apparatus 1 relating to etching, but may be applied to a substrate processing apparatus relating to development and peeling, an in-line system including the same, and the like. it can.

(B) Although the photoelectric sensor is used as the position sensor in the above embodiment, other non-contact sensors,
For example, it is possible to employ an ultrasonic sensor or a capacitance type proximity sensor.

[Second Embodiment] In the first embodiment, as shown in FIG. 1 and FIG.
5, 43, 44 are spot nozzles 340, 350, 43
0,440, the position sensor 3
4, 35, 43 and 44 are kept away from liquids such as chemicals.
0, 350, 430, 440, the position sensor 34,
35, 43 and 44 can also be arranged.

In this embodiment, the position sensors 35,
43, 44 and spot nozzles 350, 430, 440
Are similar to those of the position sensor 34 and the spot nozzle 340.
And the spot nozzle 340 will be described.

In this embodiment, as shown in FIG. 4, the position sensor 34 is disposed outside the spot nozzle 340, and a cover 34a surrounding the position sensor 34 is provided separately from the spot nozzle 340. Then, a mist of a chemical solution or the like or a mist of the chemical solution or the like is
4 is prevented. An opening 34b is formed in a lower portion of the cover 34a so that light can travel between the position sensor 34 and the detection position P.

The spot nozzle 340 is disposed obliquely so that nitrogen gas can be blown between the position sensor 34 and the substrate W. And spot nozzle 3
Numeral 40 denotes an oblique spray of nitrogen gas at a high speed near the detection position P (the direction of the flow is indicated by a two-dot chain line arrow in FIG. 4). Can be exposed.

In the case of such a structure, the first
The same effect as in the embodiment can be obtained, and the problem in the case of employing the non-contact type position sensor can be solved.

[0068]

According to the present invention, since the gas is blown out to the detection position or the vicinity of the detection position by the gas supply means, even if the processing liquid adheres to the substrate, the processing liquid adhered to the substrate at the detection position. Can be in a state of being partially blown off, and when using the non-contact detection means, the malfunction that the processing liquid adheres to the substrate to cause malfunctions is eliminated, and the transported substrate can be removed. The non-contact detecting means can surely detect.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view near a position sensor.

FIG. 3 is a control system diagram of an etching chamber and a washing chamber.

FIG. 4 is an enlarged cross-sectional view near a position sensor according to a second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 6 Conveyance roller (conveyance means) 33 Spray nozzle (treatment liquid supply means) 34, 35, 43, 44 Position sensor (non-contact detection means) 41, 42 Cleaning spray (treatment liquid supply means) 340, 350, 430, 440 Spot nozzle (gas supply means) 34a Cover 34b Opening 70 Control unit P Detection position W Substrate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Mitsuo Ogasawara 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori-Terauchi, Kamigyo-ku, Kyoto F-term 5F031 CA02 CA05 CA07 CA20 JA01 JA14 JA22 JA36 5F043 AA01 DD23 DD24 EE07

Claims (7)

[Claims] 1. A transfer means for transferring a substrate, a processing liquid supply means for supplying a processing liquid to the substrate, and a non-contact method capable of detecting whether the substrate is present at a predetermined position without contacting the substrate. A substrate processing apparatus comprising: a detection unit; and a gas supply unit that blows gas to a detection position that is a position detected by the non-contact detection unit or a vicinity of the detection position. 2. The substrate processing apparatus according to claim 1, further comprising a cover surrounding said non-contact detection means, said cover having an opening in a space connecting said non-contact detection means and said detection position. 3. The substrate processing apparatus according to claim 1, wherein said non-contact detection means is arranged in a flow of gas blown from said gas supply means. 4. The substrate processing apparatus according to claim 3, wherein said gas supply means has a nozzle for blowing gas, and said non-contact detection means is arranged inside said nozzle. 5. The apparatus according to claim 1, further comprising control means for performing control to reduce the speed of gas blown from said gas supply means when detection by said non-contact detection means is unnecessary. The substrate processing apparatus according to any one of the preceding claims. 6. The control device according to claim 1, further comprising control means for performing control to reduce the amount of gas blown out from said gas supply means when detection by said non-contact detection means is not necessary. Substrate processing equipment. 7. The control means reduces the velocity of gas blown from the gas supply means when the non-contact detection means detects the front end in the traveling direction of the substrate conveyed by the conveyance means at the detection position at the detection position. 6. The substrate processing apparatus according to claim 5, wherein when the substrate passes the detection position, control is performed to keep the velocity of the gas blown out from the gas supply unit small until the substrate passes the detection position.