JP2000158375A - Manipulator head - Google Patents

Manipulator head

Info

Publication number
JP2000158375A
JP2000158375A JP10000299A JP10000299A JP2000158375A JP 2000158375 A JP2000158375 A JP 2000158375A JP 10000299 A JP10000299 A JP 10000299A JP 10000299 A JP10000299 A JP 10000299A JP 2000158375 A JP2000158375 A JP 2000158375A
Authority
JP
Japan
Prior art keywords
giant magnetostrictive
coil
manipulator head
magnetostrictive element
yoke
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10000299A
Other languages
Japanese (ja)
Other versions
JP3443031B2 (en
Inventor
Yuko Morito
戸 祐 幸 森
Yoshio Yamamoto
本 佳 男 山
Takaaki Makino
野 隆 明 牧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moritex Corp
Original Assignee
Moritex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moritex Corp filed Critical Moritex Corp
Priority to JP10000299A priority Critical patent/JP3443031B2/en
Publication of JP2000158375A publication Critical patent/JP2000158375A/en
Application granted granted Critical
Publication of JP3443031B2 publication Critical patent/JP3443031B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512Aligning
    • H01L2224/85148Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518Translational movements
    • H01L2224/85181Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01042Molybdenum [Mo]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Manipulator (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent a change in an opening/closing stroke and clamping pressure without practically causing heating of a coil and the thermal expansion of a super magnetostrictive element caused by this even if a manupulator head is continuously used for many hours. SOLUTION: A super magnetostrictive actuator 3 for opening/closing a pair of fingers 2R, 2L has a coil 7, a super magnetostrictive element 8 arranged in the center and a yoke arranged outside the coil 7, and a closed magnetic circuit for passing a magnetic flux generated by the coil 7 is formed of the super magnetostrictive element 8 and the yoke.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ワークを掴むフィ
ンガーを超磁歪アクチュエータにより開閉するマニピュ
レータヘッドに関し、特に、半導体素子などの電極と外
部リード端子との間をワイヤボンディングするボンディ
ングマシンのワイヤクランパなどに用いて好適なもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manipulator head which opens and closes a finger for gripping a work by a giant magnetostrictive actuator, and more particularly to a wire clamper of a bonding machine for wire bonding between an electrode such as a semiconductor element and an external lead terminal. It is suitable for use in

【0002】[0002]

【従来の技術】ワイヤボンディングマシンは、半導体素
子をリードフレームに固着した後、その半導体素子及び
リードフレームに形成された電極間を極細の金線で電気
的に接続するためのもので、図4に示すように、スプー
ル41に巻回されている金線42を案内するガイド43
と、金線42を挿通保持するキャピラリ44と、金線4
2を所定のタイミングでクランプするワイヤクランパ4
5が配され、前記キャピラリ44とワイヤクランパ45
がロボットアームに一体的に取り付けられてXYZ方向
に移動できるように成されている。
2. Description of the Related Art A wire bonding machine is for electrically connecting a semiconductor element to a lead frame and then electrically connecting the semiconductor element and an electrode formed on the lead frame with a very fine gold wire. As shown in the figure, a guide 43 for guiding the gold wire 42 wound around the spool 41
A capillary 44 for inserting and holding the gold wire 42;
Wire clamper 4 for clamping 2 at a predetermined timing
5, the capillary 44 and the wire clamper 45
Are integrally attached to the robot arm and can move in the XYZ directions.

【0003】このボンディングマシンを用いて半導体素
子46の電極47と外部リード端子48との間をワイヤ
ボンディングする場合、まず、金線42の先端をキャピ
ラリ44に通して所定長さだけ出しておき、ワイヤクラ
ンパ45を閉じて金線42を固定しておく。
When wire bonding is performed between the electrode 47 of the semiconductor element 46 and the external lead terminal 48 using this bonding machine, first, the tip of the gold wire 42 is passed through a capillary 44 to a predetermined length, and The wire clamper 45 is closed and the gold wire 42 is fixed.

【0004】そして、金線42の先端で放電を起こさ
せ、当該金線42を溶かしてボール状の液滴を形成し、
この状態でキャピラリ44を半導体素子46の電極47
に降下させて液滴を電極47に押し当てて第一ボンディ
ングを行う。
Then, a discharge is caused at the tip of the gold wire 42 to melt the gold wire 42 to form a ball-shaped droplet.
In this state, the capillary 44 is connected to the electrode 47 of the semiconductor element 46.
Then, the droplet is pressed against the electrode 47 to perform the first bonding.

【0005】次いで、ワイヤクランパ45を開いて金線
42を離した状態で、キャピラリ44を外部リード端子
48まで移動させ、金線42を当該端子48に押し当て
て第二ボンディングを行う。
Next, with the wire clamper 45 opened and the gold wire 42 separated, the capillary 44 is moved to the external lead terminal 48, and the gold wire 42 is pressed against the terminal 48 to perform second bonding.

【0006】最後に、キャピラリ44を上昇させて、金
線42をキャピラリ44の先端から所定長さだけ繰り出
した状態で、ワイヤクランパ45を閉じ、さらにキャピ
ラリ44を上昇させると、金線42が引っ張られて外部
リード端子48から引きちぎられ、一つの電極について
ボンディング作業が終了する。そして、これを次々と繰
り返して、各電極について連続してボンディング作業を
行う。
Finally, the capillary 44 is raised, and the wire clamper 45 is closed in a state where the gold wire 42 is extended by a predetermined length from the tip of the capillary 44. When the capillary 44 is further raised, the gold wire 42 is pulled. Then, it is torn off from the external lead terminal 48, and the bonding operation for one electrode is completed. This is repeated one after another, and the bonding operation is continuously performed for each electrode.

【0007】このようなボンディングマシンに使用する
ワイヤクランパ45は、金線42を係脱自在に掴むフィ
ンガーと、これを開閉するアクチュエータからなる。そ
して、フィンガーを開閉するアクチュエータとして、種
々のタイプのものがあるが、プッシュプルソレノイドコ
イルを用いたものは応答速度が遅く、構造が複雑であ
り、ボイスコイル系リニアモータを用いたものは大型で
構造が複雑であり、圧電素子を用いたものは製作コスト
が嵩み故障しやすく信頼性に欠けるという問題点があっ
た。
[0007] The wire clamper 45 used in such a bonding machine is composed of a finger for removably holding the gold wire 42 and an actuator for opening and closing the finger. There are various types of actuators for opening and closing the fingers, but those using a push-pull solenoid coil have a slow response speed and a complicated structure, and those using a voice coil linear motor are large. The structure using the piezoelectric element has a complicated structure, and has a problem that the manufacturing cost is increased, the device is easily broken, and the reliability is low.

【0008】このため、本出願人は、コイルで生ずる磁
界により棒状の超磁歪素子を軸方向に伸縮させる超磁歪
アクチュエータを用い、その伸縮変形を利用してフィン
ガーを開閉するワイヤクランパを試作した。このワイヤ
クランパは、超磁歪アクチュエータによりフィンガーを
開閉するので、小型,軽量,安価に製造することがで
き、構造が簡単で故障しにくく、開閉の応答速度が速
く、低電圧で駆動することができるというメリットがあ
る。
For this reason, the present applicant has experimentally manufactured a wire clamper that uses a giant magnetostrictive actuator that expands and contracts a bar-shaped giant magnetostrictive element in the axial direction by a magnetic field generated by a coil, and that opens and closes a finger by using the expansion and contraction deformation. Since this wire clamper opens and closes fingers with a giant magnetostrictive actuator, it can be manufactured small, light, and inexpensively, has a simple structure, does not easily break down, has a fast opening and closing response speed, and can be driven at low voltage. There is an advantage.

【0009】[0009]

【発明が解決しようとする課題】しかしながら、クラン
パとして必要な所定の開閉ストロークや所定のクランプ
圧を得るには、コイルに電流を流して高磁界を形成しな
ければならないので、連続的に開閉動作を繰り返した場
合には、コイルが発熱して、その熱により超磁歪素子が
熱膨張し、その変位がフィンガーに伝えられて、開閉ス
トロークやクランプ圧に変化を生じるという新たな問題
を生じた。
However, in order to obtain a predetermined opening / closing stroke and a predetermined clamping pressure required as a clamper, it is necessary to supply a current to the coil to form a high magnetic field. When the step is repeated, the coil generates heat, the heat causes the giant magnetostrictive element to thermally expand, and the displacement is transmitted to the finger, causing a new problem in that the opening / closing stroke and the clamp pressure are changed.

【0010】例えば、直径が数10μmの金線をフィン
ガーの先端に通すには、開成時に100μm程度の隙間
ができるようにし、閉成時には金線を引きちぎるために
約50gf前後の力でクランプする必要がある。この条
件を満たすように、線径0.25mmの銅線を870ターン
巻回して形成したコイルを用いて、±0.6 Aの電流を、
周波数10Hz(開成時間0.09秒,閉成時間0.01秒)の
サイクルで通電したところ、コイルの表面温度は70〜
80℃まで上昇した。
For example, in order to pass a gold wire having a diameter of several tens of μm through the tip of the finger, a gap of about 100 μm must be formed at the time of opening, and a clamp of about 50 gf is required to tear the gold wire at the time of closing. There is. To satisfy this condition, using a coil formed by winding a copper wire having a wire diameter of 0.25 mm for 870 turns, a current of ± 0.6 A is obtained.
When energized at a frequency of 10 Hz (opening time 0.09 seconds, closing time 0.01 seconds), the coil surface temperature was 70-
The temperature rose to 80 ° C.

【0011】したがって、超磁歪素子を伸長させてフィ
ンガーを開く構造のクランパにあっては、超磁歪素子の
熱膨張によりフィンガーが開くように作用するので、金
線を掴んでも十分なクランプ圧が得られず、金線を引き
ちぎることができなくなってしまう。また、超磁歪素子
を伸長させてフィンガーを閉じる構造のクランパにあっ
ては、超磁歪素子の熱膨張によりフィンガーが閉じるよ
うに作用するので、フィンガーを開いても十分な隙間が
できず、金線がひっかかってその間を自由にすり抜ける
ことができなくなるといった不都合を生ずる。
Therefore, in a clamper having a structure in which the finger is opened by extending the giant magnetostrictive element, the finger acts to open due to the thermal expansion of the giant magnetostrictive element, so that a sufficient clamping pressure can be obtained even if the gold wire is grasped. You will not be able to tear off the gold wire. Also, in a clamper having a structure in which the finger is closed by extending the giant magnetostrictive element, the finger acts to close due to the thermal expansion of the giant magnetostrictive element. Inconvenience such that it is not possible to pass through the space freely.

【0012】そこで本発明は、長時間連続して使用して
もコイルの発熱が少なく、開閉ストロークやクランプ圧
が変化しないようにすることを技術的課題としている。
Accordingly, it is a technical object of the present invention to prevent the coil from generating heat even when used continuously for a long time and to prevent the opening / closing stroke and the clamping pressure from changing.

【0013】[0013]

【課題を解決するための手段】この課題を解決するため
に、本発明は、コイルにより生ずる磁界で棒状の超磁歪
素子を軸方向に伸縮させ、その伸縮変形を利用して一対
のフィンガーを開閉させる超磁歪アクチュエータを備え
たマニピュレータヘッドにおいて、前記超磁歪アクチュ
エータは、コイルの中心に配された前記超磁歪素子とコ
イルの外側に配されたヨークとでコイルにより生ずる磁
束を通す閉磁気回路が形成されたことを特徴とする。
In order to solve this problem, the present invention expands and contracts a bar-shaped giant magnetostrictive element in the axial direction by a magnetic field generated by a coil, and opens and closes a pair of fingers using the expansion and contraction deformation. In the manipulator head provided with a giant magnetostrictive actuator, the giant magnetostrictive actuator forms a closed magnetic circuit that passes a magnetic flux generated by the coil by the giant magnetostrictive element arranged at the center of the coil and the yoke arranged outside the coil. It is characterized by having been done.

【0014】本発明によれば、コイルの中心に配された
超磁歪素子と、コイルの外側に配されたヨークとでコイ
ルにより生ずる磁束を通す閉磁気回路が形成されている
ので、全体の磁気抵抗が減少すると同時に、漏洩磁束が
減少し、その磁束を効率的に超磁歪素子に作用させるこ
とができる。したがって、マニピュレータヘッドとして
必要な性能を従来より大幅に小さい起磁力で得ることが
でき、その分、コイルに流す電流量を減少させて、発熱
量を抑えることができる。
According to the present invention, since the giant magnetostrictive element disposed at the center of the coil and the yoke disposed outside the coil form a closed magnetic circuit through which the magnetic flux generated by the coil passes, the entire magnetic field is reduced. At the same time as the resistance decreases, the leakage magnetic flux decreases, and the magnetic flux can efficiently act on the giant magnetostrictive element. Therefore, the performance required for the manipulator head can be obtained with a much smaller magnetomotive force than in the past, and the amount of current flowing through the coil can be reduced accordingly, and the amount of heat generation can be suppressed.

【0015】また、超磁歪アクチュエータを装着するフ
レームを外側に向かって突出する放熱フィンを有する断
面T字状に形成すれば、フレームに伝搬された熱を外気
に放熱することができるだけでなく、全体重量が軽くな
るので高速応答性にも優れる。
If the frame on which the giant magnetostrictive actuator is mounted is formed to have a T-shaped cross section having radiating fins protruding outward, not only can the heat transmitted to the frame be radiated to the outside air, but also the entire structure can be radiated. Since the weight is light, high-speed response is also excellent.

【0016】さらに、ヨークを略方形の枠型に形成すれ
ば、コイルは外気に曝されたままであるので、コイルが
多少発熱することがあっても、その熱が放熱されやす
く、超磁歪素子を熱膨張させるまでの影響を与えること
はない。また、ヨークを任意の角度に傾ければ、マニピ
ュレータヘッドの全高が高くなることもなく、また、幅
方向にも広げる必要がないので、設置スペースの限られ
た場所にもそのまま組み込むことができる。
Further, if the yoke is formed in a substantially rectangular frame shape, the coil remains exposed to the outside air. Therefore, even if the coil generates heat to some extent, the heat is easily radiated, and the giant magnetostrictive element can be used. There is no effect until thermal expansion. Further, if the yoke is inclined at an arbitrary angle, the overall height of the manipulator head does not increase, and it is not necessary to expand the manipulator head in the width direction.

【0017】さらにまた、ヨークを、45パーマロイ、
50パーマロイ、78パーマロイ、純鉄、ケイ素綱、軟
磁性アモルファス、方向性ケイ素綱、アルパーム、セン
ダスト、Mo入りスーパーマロイ、Cu入りスーパーマ
ロイなどの高透磁率材料で形成すれば、磁気抵抗を従来
の40%程度にまで下げることができる。したがって、
コイルに供給する電流をより減少させて、発熱量をさら
に少なくすることができる。
Further, the yoke is made of 45 permalloy,
If it is made of a high magnetic permeability material such as 50 permalloy, 78 permalloy, pure iron, silicon class, soft magnetic amorphous, directional silicon class, alpalm, sendust, supermalloy with Mo, supermalloy with Cu, the magnetic resistance can be reduced to the conventional value. It can be reduced to about 40%. Therefore,
The amount of heat generated can be further reduced by further reducing the current supplied to the coil.

【0018】[0018]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて具体的に説明する。図1は本発明に係るマニ
ピュレータヘッドを示す説明図、図2はそのA−A線断
面図、図3は超磁歪アクチュエータを示す説明図であ
る。
Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is an explanatory view showing a manipulator head according to the present invention, FIG. 2 is a sectional view taken along line AA, and FIG. 3 is an explanatory view showing a giant magnetostrictive actuator.

【0019】本例に係るマニピュレータヘッド1は、例
えば、ワイヤボンディングマシンのロボットアームに装
着されるワイヤクランパとして用いられるもので、ワイ
ヤを掴む左右一対のフィンガー2R,2Lと、フィンガ
ー2R,2Lを開閉する超磁歪アクチュエータ3を備え
ている。
The manipulator head 1 according to the present embodiment is used, for example, as a wire clamper mounted on a robot arm of a wire bonding machine, and opens and closes a pair of left and right fingers 2R, 2L for gripping a wire and fingers 2R, 2L. Is provided.

【0020】フィンガー2R,2Lは、その先端にワイ
ヤクランプ用のパッド4R,4Lが設けられ、その後端
側には、超磁歪アクチュエータ3を装着するフレーム5
が一体的に取り付けられている。
The fingers 2R, 2L are provided with wire clamp pads 4R, 4L at the tips thereof, and the frame 5 on which the giant magnetostrictive actuator 3 is mounted is provided at the rear end thereof.
Are attached integrally.

【0021】フィンガー2R,2Lは、後端が力点P1
となり、先端のパッド4R,4Lが作用点P2 となり、
フレーム5に接続された中間点が支点P3 となる梃を形
成する。したがって、フレーム5内に配された超磁歪ア
クチュエータ3により超磁歪素子8が伸長されて、力点
1 が作用点P2 方向へ圧されると、支点P3 を中心に
外側へ開くように回動される。このフィンガー2R,2
L及びフレーム5は、外側に突出する放熱フィン6を有
する断面T字状に形成され、当該放熱フィン6により放
熱効果が高められると共に、機械的強度を低下させるこ
となく軽量化が図られている。
The rear ends of the fingers 2R and 2L have a force point P 1.
Next, pads 4R tip, 4L is the point P 2, and the
Intermediate point connected to the frame 5 to form a leverage as a fulcrum P 3. Therefore, is super-magnetostrictive element 8 is extended by the super-magnetostrictive actuator 3 arranged in a frame 5, when the power point P 1 is pressurized to the working point P 2 direction, times to open outwardly about the fulcrum P 3 Be moved. This finger 2R, 2
The L and the frame 5 are formed in a T-shaped cross section having outwardly protruding radiating fins 6 so that the radiating fins 6 enhance the heat radiation effect and reduce the weight without lowering the mechanical strength. .

【0022】一方、超磁歪アクチュエータ3は、コイル
7の中心に棒状の超磁歪素子8が配され、その後端が前
記フレーム5の後枠5aに押し当てられると共に、先端
がプッシュロッド9を介してフィンガー2R,2Lの後
端に形成された力点P1 に押し当てられており、超磁歪
素子8が伸長すると、力点P1 が作用点P 2 側へ移動さ
れることになるので、前述したように、フィンガー2
R,2Lが確実に開く。
On the other hand, the giant magnetostrictive actuator 3 has a coil
7, a bar-shaped giant magnetostrictive element 8 is arranged at the center of
While being pressed against the rear frame 5a of the frame 5,
After the fingers 2R and 2L via the push rod 9
Force point P formed at the end1, And giant magnetostriction
When the element 8 is extended, the power point P1Is the action point P TwoMoved to the side
As described above, the finger 2
R and 2L open reliably.

【0023】また、超磁歪アクチュエータ3には、前記
超磁歪素子8と、コイル7の外側に配されたヨーク10
とで閉磁気回路が形成されているので、コイル7で生ず
る磁界が超磁歪素子8とヨーク10内を通り、その磁気
回路の磁気抵抗を低くすることができる。
The giant magnetostrictive actuator 3 includes the giant magnetostrictive element 8 and a yoke 10 arranged outside the coil 7.
Since the closed magnetic circuit is formed by (1) and (2), the magnetic field generated by the coil 7 passes through the giant magnetostrictive element 8 and the yoke 10, and the magnetic resistance of the magnetic circuit can be reduced.

【0024】このヨーク10は、45パーマロイ、50
パーマロイ、78パーマロイ、純鉄、ケイ素綱、軟磁性
アモルファス、方向性ケイ素綱、アルパーム、センダス
ト、Mo入りスーパーマロイ、Cu入りスーパーマロイ
などの最大比透磁率1000以上、より好ましくは50
00以上の合金で形成されている。
The yoke 10 is made of 45 permalloy, 50
Permalloy, 78 permalloy, pure iron, silicon steel, soft magnetic amorphous, directional silicon steel, alpalm, sendust, Mo-containing supermalloy, Cu-containing supermalloy, etc., have a maximum relative magnetic permeability of 1000 or more, more preferably 50 or more.
It is formed of an alloy of 00 or more.

【0025】また、ヨーク10は、超磁歪素子8の後端
側に当接される略U字状の下枠10Aと、超磁歪素子8
の先端側に当接される略一字状の上枠10Bの二つの部
材により、略方形の枠型に形成されている。そして、下
枠10Aの先端に形成されたピン11,11に上枠10
Bが係合されて、超磁歪素子8の伸縮方向に摺動可能に
形成されている。これにより、超磁歪素子8が伸長した
ときに上枠10Bがその伸長方向にスライドするので、
ヨーク10が変形したり、超磁歪素子8の伸びが制限さ
れることもない。
The yoke 10 includes a substantially U-shaped lower frame 10A which is in contact with the rear end of the giant magnetostrictive element 8 and a giant magnetostrictive element 8
It is formed in a substantially rectangular frame shape by two members of a substantially one-letter upper frame 10B abutting on the tip side of the frame. Then, the upper frame 10 is attached to the pins 11, 11 formed at the tip of the lower frame 10A.
B is engaged so as to be slidable in the direction of expansion and contraction of the giant magnetostrictive element 8. Thereby, when the giant magnetostrictive element 8 is extended, the upper frame 10B slides in the extending direction.
The yoke 10 is not deformed, and the elongation of the giant magnetostrictive element 8 is not limited.

【0026】さらに、ヨーク10は、超磁歪素子8を中
心に回動可能に配設されているので、図1に示すよう
に、フレーム5を水平に位置させた状態で、ヨーク10
をフレーム5に対して所定角度傾斜させて配置すれば、
全高が高くなることもなく、したがって高さ方向の設置
スペースに余裕のない装置にも装着することができる。
Further, since the yoke 10 is disposed so as to be rotatable around the giant magnetostrictive element 8, as shown in FIG.
Is arranged at a predetermined angle with respect to the frame 5,
The device can be mounted on a device that does not have a high overall height and therefore does not have enough space for installation in the height direction.

【0027】なお、超磁歪素子8の断面積をSm、その
飽和磁束密度をBmとし、ヨーク10を形成する材料の
飽和磁束密度をBy、その断面積をSyとしたときに、
超磁歪素子8及びヨーク10内に形成される磁束が飽和
状態にあれば、 Bm・Sm=By・Sy が成り立つ。
When the sectional area of the giant magnetostrictive element 8 is Sm, its saturation magnetic flux density is Bm, the saturation magnetic flux density of the material forming the yoke 10 is By, and its sectional area is Sy,
If the magnetic flux formed in the giant magnetostrictive element 8 and the yoke 10 is in a saturated state, then Bm · Sm = By · Sy holds.

【0028】例えば、超磁歪素子8として、断面積25
mm2 のETREMATERFENOL−D(エトリー
マ社の商品名)を用い、ヨーク10を45パーマロイで
成形すると、Sm=25×10-6〔m2 〕、Bm=0.9
〔T〕、By=1.4 〔T〕である。したがって、超磁歪
素子8に飽和磁束密度で磁束を形成するためには、ヨー
ク10の断面積Syは約17×10-6〔m2 〕あれば足
りる。ここで、ヨーク10は、方形枠型に形成されてお
り、コイル7の外側に二つの閉磁気回路が形成されるの
で、ヨーク10を構成する各部材の断面積は、超磁歪素
子8に接触する部分を除き、その半分の8.5 ×10
-6〔m2 〕あれば足りることになる。
For example, as the giant magnetostrictive element 8,
When the yoke 10 is molded with 45 permalloy using ETREMATERENOL-D (trade name of Etrimer) of mm 2 , Sm = 25 × 10 −6 [m 2 ], Bm = 0.9
[T], By = 1.4 [T]. Therefore, in order to form a magnetic flux in the giant magnetostrictive element 8 with a saturation magnetic flux density, it is sufficient that the cross-sectional area Sy of the yoke 10 is about 17 × 10 −6 [m 2 ]. Here, the yoke 10 is formed in a rectangular frame shape, and two closed magnetic circuits are formed outside the coil 7. Therefore, the sectional area of each member constituting the yoke 10 is in contact with the giant magnetostrictive element 8. 8.5 x 10
-6 [m 2 ] is sufficient.

【0029】なお、12はフィンガー2R,2Lを閉じ
る方向に付勢するスプリング、13はスプリング12の
強さを調節することによりフィンガー2R,2Lのクラ
ンプ圧を調整するクランプ圧調整ネジ、14は超磁歪素
子8にプリストレスを付与するプリストレス調節ネジで
ある。
Reference numeral 12 denotes a spring that urges the fingers 2R and 2L in the closing direction, 13 denotes a clamp pressure adjusting screw that adjusts the clamp pressure of the fingers 2R and 2L by adjusting the strength of the spring 12, and 14 denotes an ultra-high pressure screw. A prestress adjusting screw for applying a prestress to the magnetostrictive element 8.

【0030】以上が本発明の一例構成であって、次にそ
の作用を説明する。まず、予めクランプ圧調整ネジ13
及びプリストレス調節ネジ14を調節しておく。具体的
には、コイル7にバイアス電流を供給して磁気バイアス
をかけ、さらに正電流を供給した状態で、パッド4R,
4L間が100 μm程度開くように各ネジ13,14を調
節し、また、バイアス電流をキャンセルする負電流を供
給するか、バイアス電流をオフしたときにパッド4R,
4Lが密着して50gf程度の力が得られるように各ネ
ジ13,14を調節する。
The above is an example of the configuration of the present invention, and its operation will be described below. First, the clamp pressure adjusting screw 13
And the prestress adjusting screw 14 is adjusted. More specifically, a bias current is supplied to the coil 7 to apply a magnetic bias, and the pad 4R,
The screws 13 and 14 are adjusted so that the distance between the 4Ls is about 100 μm, and a negative current for canceling the bias current is supplied or the pads 4R and 14R are turned off when the bias current is turned off.
The screws 13 and 14 are adjusted so that 4L is in close contact and a force of about 50 gf is obtained.

【0031】ここで、コイル7に正電流を流すと磁界が
形成され、その磁力により超磁歪素子8が伸長して、フ
ィンガー2R,2Lの後端の力点P1 が圧されるので、
フィンガー2R,2Lはフレーム5に連結された支点P
3 を中心に外側へ回動して開く。このとき、超磁歪素子
8とヨーク10で、コイル7により生ずる磁束を通す閉
磁気回路が形成されているので、全体の磁気抵抗が減少
すると同時に、漏洩磁束が減少し、その磁束を効率的に
超磁歪素子8に作用させることができる。ここで、ヨー
ク10を高透磁率材料で形成すれば、磁気抵抗はさらに
小さくなる。したがって、マニピュレータヘッド1とし
て必要な性能を従来より大幅に小さい起磁力で得ること
ができ、その分コイル7に供給する電圧/電流は少なく
て済み、本例の場合、+2V/+0.25A程度であった。
[0031] Here, the magnetic field when passing a positive current is formed in the coil 7, and super-magnetostrictive element 8 is extended by its magnetic force, finger 2R, since the force point P 1 of the rear end of 2L is pressurized,
The fingers 2R and 2L are connected to the fulcrum P connected to the frame 5.
Rotate outward around 3 and open. At this time, since the giant magnetostrictive element 8 and the yoke 10 form a closed magnetic circuit through which the magnetic flux generated by the coil 7 passes, the total magnetic resistance is reduced, and at the same time, the leakage magnetic flux is reduced, and the magnetic flux is efficiently reduced. It can act on the giant magnetostrictive element 8. Here, if the yoke 10 is formed of a material having a high magnetic permeability, the magnetic resistance is further reduced. Therefore, the performance required for the manipulator head 1 can be obtained with a much smaller magnetomotive force than in the past, and the voltage / current supplied to the coil 7 can be reduced by that much, and in this example, about +2 V / + 0.25 A there were.

【0032】次いで、正電流をオフして、コイル7に負
電流を流すと逆方向の磁界が形成され、その磁力によ
り、フィンガー2R,2Lの後端の力点P1 を圧してい
た超磁歪素子8が収縮するので、スプリング12の弾撥
力によりフィンガー2R,2Lはフレーム5に連結され
た支点P3 を中心に内側へ回動して閉じる。この場合
も、超磁歪素子8とヨーク10で閉磁気回路が形成され
ているので、その磁束を効率的に超磁歪素子8に作用さ
せることができ、コイル7に供給する負の電圧/電流は
−2V/−0.25A程度で足りる。
[0032] Then, a positive current is turned off, the magnetic field in the reverse direction flows negative current is formed in the coil 7, by the magnetic force, finger 2R, super-magnetostrictive element which has pressed the force point P 1 of the rear end of the 2L since 8 contracts, finger 2R by the resilience of the spring 12, 2L close pivoted inward about the fulcrum P 3 which is connected to the frame 5. Also in this case, since the closed magnetic circuit is formed by the giant magnetostrictive element 8 and the yoke 10, the magnetic flux can be efficiently applied to the giant magnetostrictive element 8, and the negative voltage / current supplied to the coil 7 is About -2V / -0.25A is enough.

【0033】そして、前述と同じ条件で、線径0.25mm
の銅線を870ターン巻回して形成したコイル7を用い
て、±0.25Aの電流を、周波数10Hz(開成時間0.09
秒,閉成時間0.01秒)のサイクルで通電したところ、30
00時間(駆動回数1×108 回)経過した時点において
も、当初のクランプ性能が維持され、コイル7の表面の
相対的な上昇温度は5℃以下であった。
Then, under the same conditions as described above, a wire diameter of 0.25 mm
Current of ± 0.25 A at a frequency of 10 Hz (opening time 0.09
Seconds and a closing time of 0.01 seconds).
Even after the lapse of 00 hours (1 × 10 8 times of driving), the initial clamping performance was maintained, and the relative temperature increase of the surface of the coil 7 was 5 ° C. or less.

【0034】したがって、コイル7の発熱及びこれに起
因する超磁歪素子8の熱膨張がほとんどなく、長時間使
用しても性能変化を生じないので、このワイヤクランパ
を組み込んだワイヤボンディングマシンの信頼性,製品
の歩留りが向上し、ボンディング作業の高効率化を図る
ことができる。
Accordingly, heat generation of the coil 7 and thermal expansion of the giant magnetostrictive element 8 due to the heat hardly occur, and there is no change in performance even when used for a long time, so that the reliability of the wire bonding machine incorporating this wire clamper is improved. The product yield is improved, and the efficiency of the bonding operation can be increased.

【0035】なお、上述したように、超磁歪素子8に磁
気バイアスをかける手段としてコイル7にバイアス電流
を供給する場合に限らず、磁気回路中(例えば超磁歪素
子8とヨーク10が接する2ケ所又はヨーク10の一
部)にサマリウムコバルト磁石等の表面磁束密度の大き
い永久磁石を配設してもよい。
As described above, the means for applying a magnetic bias to the giant magnetostrictive element 8 is not limited to the case where a bias current is supplied to the coil 7 but may be applied to a magnetic circuit (for example, at two places where the giant magnetostrictive element 8 and the yoke 10 are in contact with each other). Alternatively, a permanent magnet having a large surface magnetic flux density, such as a samarium-cobalt magnet, may be provided on the yoke 10).

【0036】また、本発明に係るマニピュレータヘッド
1をワイヤボンディングマシンのワイヤクランパとして
使用する場合について説明したが、本発明はこれに限ら
ず、数μm〜数百μmの微小物体を掴むマニピュレータ
ヘッドとして、工作機械、医療機械、マイクロマシンな
ど任意の用途に用いることができる。
Also, the case where the manipulator head 1 according to the present invention is used as a wire clamper of a wire bonding machine has been described, but the present invention is not limited to this, and the manipulator head as a manipulator head for gripping a minute object of several μm to several hundred μm is described. , Machine tools, medical machines, micromachines and the like.

【0037】[0037]

【発明の効果】以上述べたように、本発明によれば、超
磁歪素子とヨークとで閉磁気回路が形成されているの
で、コイルで生ずる磁界の磁気抵抗が減少し、マニピュ
レータヘッドとして必要な性能を従来より大幅に小さい
起磁力で得ることができ、その分、コイルに流す電流量
を減少させて、発熱量を抑えることができるだけでな
く、これに起因する超磁歪素子の熱膨張による性能変化
を起こすことがないという大変優れた効果を有する。ま
た、ヨークとして高透磁率材料を用いれば、磁気抵抗が
より減少するので、コイルに流す電流量もさらに減少さ
せることができるという効果がある。
As described above, according to the present invention, since the closed magnetic circuit is formed by the giant magnetostrictive element and the yoke, the magnetic reluctance of the magnetic field generated by the coil is reduced, which is necessary for the manipulator head. Performance can be obtained with a much smaller magnetomotive force than before, and not only can the amount of current flowing through the coil be reduced to reduce the amount of heat generated, but also the performance due to the thermal expansion of the giant magnetostrictive element caused by this. It has a very good effect of not causing a change. Further, when a material having a high magnetic permeability is used for the yoke, the magnetic resistance is further reduced, so that the amount of current flowing through the coil can be further reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係るマニピュレータヘッドを示す説明
図。
FIG. 1 is an explanatory view showing a manipulator head according to the present invention.

【図2】そのA−A線断面図。FIG. 2 is a sectional view taken along line AA of FIG.

【図3】超磁歪アクチュエータを示す説明図。FIG. 3 is an explanatory view showing a giant magnetostrictive actuator.

【図4】ワイヤボンディングマシンを示す説明図。FIG. 4 is an explanatory view showing a wire bonding machine.

【符号の説明】[Explanation of symbols]

1・・・マニピュレータヘッド 2R,2L・・・フ
ィンガー 3・・・超磁歪アクチュエータ 4R,4L・・・パ
ッド 5・・・フレーム 6・・・放熱フィン 7・・・コイル 8・・・超磁歪素子 10・・・ヨーク
DESCRIPTION OF SYMBOLS 1 ... Manipulator head 2R, 2L ... Finger 3 ... Giant magnetostrictive actuator 4R, 4L ... Pad 5 ... Frame 6 ... Radiation fin 7 ... Coil 8 ... Giant magnetostrictive element 10 ... Yoke

───────────────────────────────────────────────────── フロントページの続き (72)発明者 牧 野 隆 明 神奈川県横浜市青葉区あざみ野南一丁目3 番3号 株式会社モリテックス横浜技術セ ンター内 Fターム(参考) 3F060 GA00 GB11 HA00 3F061 AA01 BA03 BB03 BC09 BD00 DB00 5F044 BB15  ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Takaaki Makino 1-3-3 Azaminominami, Aoba-ku, Yokohama-shi, Kanagawa Prefecture F-term in the Moritex Yokohama Technical Center 3F060 GA00 GB11 HA00 3F061 AA01 BA03 BB03 BC09 BD00 DB00 5F044 BB15

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】コイル(7)により生ずる磁界で棒状の超
磁歪素子(8)を軸方向に伸縮させ、その伸縮変形を利
用して一対のフィンガー (2R, 2L) を開閉させる超磁歪
アクチュエータ(3)を備えたマニピュレータヘッドに
おいて、前記超磁歪アクチュエータ(3)は、コイル
(7)の中心に配された前記超磁歪素子(8)とコイル
(7)の外側に配されたヨーク(10)とで、コイル
(7)により生ずる磁束を通す閉磁気回路が形成された
ことを特徴とするマニピュレータヘッド。
A giant magnetostrictive actuator that expands and contracts a bar-shaped giant magnetostrictive element (8) in the axial direction with a magnetic field generated by a coil (7) and that opens and closes a pair of fingers (2R, 2L) using the elastic deformation. In the manipulator head provided with 3), the giant magnetostrictive actuator (3) includes the giant magnetostrictive element (8) arranged at the center of the coil (7) and the yoke (10) arranged outside the coil (7). And a closed magnetic circuit for passing a magnetic flux generated by the coil (7).
【請求項2】前記超磁歪アクチュエータ(3)を装着す
るフレーム(5)が前記フィンガー(2R,2L)の後端側
に一体的に取り付けられると共に、当該フレーム(5)
は外側に向かって突出する放熱フィン(6)を有する断
面T字状に形成されてなる請求項1記載のマニピュレー
タヘッド。
2. A frame (5) on which said giant magnetostrictive actuator (3) is mounted is integrally attached to a rear end side of said fingers (2R, 2L), and said frame (5).
2. The manipulator head according to claim 1, wherein the manipulator head is formed to have a T-shaped cross section having radiation fins protruding outward.
【請求項3】前記ヨーク(10)が、前記超磁歪素子(8)
を中心に回動可能な略方形の枠型に形成されてなる請求
項1乃至2記載のマニピュレータヘッド。
3. The giant magnetostrictive element (8), wherein the yoke (10) is provided.
The manipulator head according to claim 1, wherein the manipulator head is formed in a substantially rectangular frame shape rotatable around the center.
【請求項4】前記ヨーク(10)が、45パーマロイ、50
パーマロイ、78パーマロイ、純鉄、ケイ素綱、軟磁性
アモルファス、方向性ケイ素綱、アルパーム、センダス
ト、Mo入りスーパーマロイ、Cu入りスーパーマロイ
などの高透磁率材料で形成された請求項1乃至3記載の
マニピュレータヘッド。
4. The yoke (10) is made of 45 permalloy, 50
4. A high magnetic permeability material such as permalloy, 78 permalloy, pure iron, silicon class, soft magnetic amorphous, directional silicon class, alpalm, sendust, superalloy with Mo, supermalloy with Cu, etc. Manipulator head.
【請求項5】前記ヨーク (10) が、少なくとも二つの部
材(10A, 10B) からなり、一方の部材(10A) が他方の部
材(10B) に対して超磁歪素子(8)の伸縮方向に摺動可
能に形成されてなる請求項1乃至4記載のマニピュレー
タヘッド。
5. The yoke (10) is composed of at least two members (10A, 10B), one of which (10A) extends with respect to the other (10B) in the direction of expansion and contraction of the giant magnetostrictive element (8). 5. The manipulator head according to claim 1, which is slidably formed.
【請求項6】コイル(7)により生ずる磁界で棒状の超
磁歪素子(8)を軸方向に伸縮させ、その伸縮変形を利
用して一対のフィンガー (2R, 2L) を開閉させる超磁歪
アクチュエータ(3)を備えたマニピュレータヘッドに
おいて、前記超磁歪アクチュエータ(3)を装着するフ
レーム(5)が前記フィンガー(2R,2L)の後端側に一
体的に取り付けられると共に、当該フレーム(5)は外
側に向かって突出する放熱フィン(6)を有する断面T
字状に形成されたことを特徴とするマニピュレータヘッ
ド。
6. A giant magnetostrictive actuator which expands and contracts a bar-shaped giant magnetostrictive element (8) in the axial direction by a magnetic field generated by a coil (7), and opens and closes a pair of fingers (2R, 2L) using the elastic deformation. In the manipulator head provided with 3), a frame (5) on which the giant magnetostrictive actuator (3) is mounted is integrally attached to a rear end side of the fingers (2R, 2L), and the frame (5) is mounted on an outer side. Cross section T having a radiation fin (6) projecting toward
A manipulator head formed in a character shape.
JP10000299A 1998-09-24 1999-04-07 Manipulator head Expired - Fee Related JP3443031B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10000299A JP3443031B2 (en) 1998-09-24 1999-04-07 Manipulator head

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP26957298 1998-09-24
JP10-269572 1998-09-24
JP10000299A JP3443031B2 (en) 1998-09-24 1999-04-07 Manipulator head

Publications (2)

Publication Number Publication Date
JP2000158375A true JP2000158375A (en) 2000-06-13
JP3443031B2 JP3443031B2 (en) 2003-09-02

Family

ID=26441092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10000299A Expired - Fee Related JP3443031B2 (en) 1998-09-24 1999-04-07 Manipulator head

Country Status (1)

Country Link
JP (1) JP3443031B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011255467A (en) * 2010-06-10 2011-12-22 Seiko Epson Corp Electric actuator
WO2016015953A1 (en) * 2014-08-01 2016-02-04 Eto Magnetic Gmbh Gripper device, and use of a gripper device
CN105773573A (en) * 2016-01-22 2016-07-20 陈昊哲 High-precision micro-gripper
CN114012632A (en) * 2021-12-13 2022-02-08 昆山昆博智能感知产业技术研究院有限公司 Electromagnetic micro-gripper for planar micro-coil

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04171989A (en) * 1990-11-06 1992-06-19 Tdk Corp Magnetostriction element
JPH05282044A (en) * 1992-03-31 1993-10-29 Toshiba Corp Magnetostrictive actuator
JPH0715053A (en) * 1993-06-22 1995-01-17 Toshiba Corp Magnetostriction actuator
JPH1092863A (en) * 1996-09-13 1998-04-10 Tosok Corp Wire clamper for wire bonding apparatus
JPH10178032A (en) * 1996-12-16 1998-06-30 Kaijo Corp Wire clamp mechanism and wire bonder employing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04171989A (en) * 1990-11-06 1992-06-19 Tdk Corp Magnetostriction element
JPH05282044A (en) * 1992-03-31 1993-10-29 Toshiba Corp Magnetostrictive actuator
JPH0715053A (en) * 1993-06-22 1995-01-17 Toshiba Corp Magnetostriction actuator
JPH1092863A (en) * 1996-09-13 1998-04-10 Tosok Corp Wire clamper for wire bonding apparatus
JPH10178032A (en) * 1996-12-16 1998-06-30 Kaijo Corp Wire clamp mechanism and wire bonder employing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011255467A (en) * 2010-06-10 2011-12-22 Seiko Epson Corp Electric actuator
WO2016015953A1 (en) * 2014-08-01 2016-02-04 Eto Magnetic Gmbh Gripper device, and use of a gripper device
CN107000216A (en) * 2014-08-01 2017-08-01 Eto电磁有限责任公司 Grab clamp device and grab the application of clamp device
US10695914B2 (en) 2014-08-01 2020-06-30 Eto Magnetic Gmbh Gripper device, and use of a gripper device
CN107000216B (en) * 2014-08-01 2020-09-15 Eto电磁有限责任公司 Gripper device and use of a gripper device
CN105773573A (en) * 2016-01-22 2016-07-20 陈昊哲 High-precision micro-gripper
CN114012632A (en) * 2021-12-13 2022-02-08 昆山昆博智能感知产业技术研究院有限公司 Electromagnetic micro-gripper for planar micro-coil

Also Published As

Publication number Publication date
JP3443031B2 (en) 2003-09-02

Similar Documents

Publication Publication Date Title
JP4199192B2 (en) Valve with compact shape memory alloy drive
US6564989B2 (en) Wire bonding method and wire bonding apparatus
US5931452A (en) Wire clamper for bonding apparatus
JP2000158375A (en) Manipulator head
JP2981948B2 (en) Wire clamper
JP2002164380A (en) Wire-bonding apparatus
JP3403661B2 (en) Wire bonder
US7565995B2 (en) Roller wire brake for wire bonding machine
JP2885753B2 (en) Wire clamp mechanism and wire bonding apparatus using the same
JPH11150019A (en) Supermagnetostrictive actuator
US6533158B2 (en) Wire bonding apparatus having wire clamp
KR100280615B1 (en) Wire Clamper for Bonding Device
JP2618279B2 (en) Wire bonding equipment
JP5340633B2 (en) Displacement magnification mechanism type magnetostrictive actuator
JP2002368035A (en) Wire clamp device for wire bonder
TWI732189B (en) Multiple actuator wire bonding apparatus
JP2503691B2 (en) Suction nozzle replacement mechanism
JPH10270489A (en) Wire clamping device of wire bonding apparatus
JP2000353719A (en) Wire-clamping mechanism in wire-bonding device
CN110752119B (en) Negative magnetostriction control relay device
JPS61101042A (en) Bonding device
JP2002158254A (en) Control method of wire clamp mechanism in wire bonding apparatus
JPH06218700A (en) Cut of lead wire and coil part
JP2902083B2 (en) Drive control method of wire clamp
JP2626989B2 (en) Shape memory alloy device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees