JP2000156575A - Circuit module coupling type of electronic circuit device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To favorably reduce variations of the relative positions of the bottom for cooling of each circuit module, the topside for mounting of a circuit board on the second stage, the main surface of a connecting terminal, etc. SOLUTION: A coupling member 4 has a function of coupling each circuit module 1 with the next by press fitting, and a function of bearing a control circuit board 14 on the second stage by the topside for circuit board fast sticking to which a circuit board 1a is to stick fast. This way, the adhesion between the control circuit board 14 on the second stage where each circuit module 1 is mounted and the topside for circuit board fast sticking of each coupling member 4 bearing it is automatically improved by controlling the quantity of press fitting into the circuit module 1 of each coupling member 4, so a two- stage type of electronic circuit device which has a plurality of circuit modules can be materialized by simple constitution. Moreover, the backside of the circuit board 1a of each circuit module 1 can be leveled into the same plane at the same time with the leveling of the topside of the coupling member 4, by press.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit module connection type electronic circuit device formed by connecting and integrating a plurality of circuit modules, and a method of manufacturing the same.

[0002]

2. Description of the Related Art For example, when an electronic circuit device such as a large-capacity three-phase six-arm bridge-type inverter device is composed of a plurality of circuit modules, a method of sequentially assembling the circuit modules in a case having a cooling plate is used. However, this method has a problem that workability and maintainability after assembly are poor.

For this reason, a pre-assembly method has been adopted in which each circuit module is previously connected and integrated to form a module assembly, and this module assembly is assembled in a case. In either case, the bottom surface of each circuit module needs to be brought into close contact with the cooling plate of the case in order to cool the circuit module.

In some cases, a circuit board such as a control circuit is further assembled on the plurality of circuit modules to form a two-story structure.

[0005]

However, in the above-described method of pre-assembling a plurality of circuit modules, it is easy to maintain the flatness of the bottom surface for cooling each circuit module until the assembly to the case is completed. However, in the case of a two-story structure, the height of the support portion of each circuit module that supports the circuit board on the second floor side is likely to vary.

A plurality of circuit modules of this kind also have connection terminals, but their heights vary, making it difficult to connect to a member such as a bus bar. The present invention has been made in view of the above problems,
In a circuit module connection type electronic circuit device, a circuit module connection type that can reduce relative position variations, such as the bottom surface for cooling each circuit module, the top surface for mounting the second floor circuit board, and the main surface of the connection terminal, well. It is an object of the present invention to provide an electronic circuit device and a method for manufacturing the same.

[0007]

According to the circuit module connection type electronic circuit device of the first aspect, the connection member has a function of connecting the respective circuit modules by press-fitting, and a circuit board contact top to which the circuit board adheres. The surface has the function of supporting the circuit board, and the top surface for contacting the circuit board is formed on the side opposite to the fitting projection.

In this way, by controlling the amount of press-fitting of each connecting member into the circuit module, the circuit board on the second floor mounted on each circuit module and the circuit board contacting of the connecting members supporting the circuit board are supported. Since the adhesion to the top surface is automatically improved, a two-story electronic circuit device having a plurality of circuit modules can be realized with a simple configuration.

According to the second aspect of the present invention, in the circuit module-connected electronic circuit device according to the first aspect, the bottom of each circuit module is formed on the same plane.
The cooling surface of the cooling member that is in close contact with the bottom surface can be flattened, and the contact surface of the circuit board on the second floor that is in close contact with the top surface of each circuit board can be flattened, simplifying the structure. Becomes

According to a third aspect of the present invention, there is provided a method of manufacturing a circuit module connection type electronic circuit device, comprising: providing a top surface for contacting a circuit board of each connection member; Of the bottom surface can be realized by one step of lifting and lowering the upper mold. According to a fourth aspect of the present invention, in the method of the third aspect, the connection terminal of each circuit module is plastically deformed so that the upper mold has a predetermined height with respect to the bottom surface. In this case, one connecting step is performed to expose the top surface for contacting the circuit board of each connecting member, expose the bottom surface for cooling each circuit module, and expose the main surface of the connection terminal of each circuit module in a single lifting step. Can be realized.

According to a fifth aspect of the present invention, in the method for manufacturing a circuit module-connected electronic circuit device according to the third or fourth aspect, a female screw hole for fastening a circuit board is further provided in the connecting member, so that the method can be simplified. The circuit board can be fixed.
According to the method for manufacturing a circuit module-coupled electronic circuit device of the sixth aspect, the upper mold plastically deforms the connection terminals of each circuit module so as to have a predetermined height with respect to the bottom surface. Of the bottom surface and the main surface of the connection terminal of each circuit module can be realized in one elevating process.

In each of the above-described configurations, the following modifications may be adopted. The cooling surface of the cooling member is preferably in close contact with the bottom surface of each circuit module in the same plane, but is not limited thereto. The bottom surface of the circuit module and the cooling surface of the cooling member that is in close contact with the circuit module are preferably flat, but may be, for example, a corrugated surface or an uneven surface to increase the contact area. The fitting protrusion of the connecting member is preferably fitted into a hole of the circuit module. However, a hole may be provided in the fitting protrusion of the connecting member, and the protrusion on the circuit module side may be fitted. The circuit board, that is, the circuit board on the second floor is preferably adhered to the circuit board contact top surface of the connecting member on the main surface of the circuit module side, but by fixing a special intervening member to the circuit board, Can be mounted on the connecting member via the intervening member to make close contact therewith.

The upper mold and the lower mold are convenient names, and can be opened in the horizontal direction. Both the molds may be movable, and the circuit module may be moved to the movable mold instead of the fixed mold. They may be fitted. The above-mentioned plurality of connecting members means a connecting member having a plurality of circuit board contact top surfaces, and a connecting portion having a circuit board contact top surface and a plurality of fitting projections is connected and integrated. Is also good.

The setting of each circuit module at a predetermined position of the lower die can be performed by fitting a lower projection into a hole into which a screw for fastening each circuit module to the cooling member is inserted.

[0015]

[Embodiment 1] A procedure for manufacturing a circuit module-connected electronic circuit device according to the present invention will be described below. Reference numeral 1 denotes a rectangular frame-shaped resin case which individually accommodates each phase circuit (not shown) of the three-phase inverter circuit, and is set in three rows in accordance with the number of phases. The bottom of the resin case 1 is in close contact with the peripheral edge of the upper surface of the circuit board 1a on which the phase circuit is mounted. Each resin case 1 that constitutes a circuit module
Further, through holes 2a are formed at four corners of the circuit board 1a, and holes 2b are formed at the top surface of each resin case 1.

3 is a hole 2 outside the resin case 1 on both sides.
b, the metal fittings 4 to be press-fitted into the inner hole 2b of the resin case 1 on both sides, and the metal fittings to be press-fitted into the hole 2b of the central resin case 1 adjacent to the inner hole 2b ( (A connecting member in the present invention). The fittings 3 and 4 include a fitting protrusion 5 to be press-fitted into the hole 2 b, a plate-like top plate 6 provided at a base end of the fitting protrusion 5, and a fitting protrusion from an upper surface of the top plate 6. 5 has a female screw hole 7 formed inward,
The fitting 4 includes a pair of fitting projections 5 connected by a top plate 6.
have. The top surface (upper surface) of the top plate portion 6 is a flat surface (top surface for circuit board contact) extending perpendicular to the longitudinal direction of the fitting projection 5.

Reference numeral 8 denotes a core of a current detector for detecting the output current of each of the phase circuits, and reference numeral 9 denotes a fixed column for fixing an electrolytic capacitor described later for smoothing the input current of each of the phase circuits. Reference numeral 10 denotes an upper die of a press for press-fitting the metal fittings 3 and 4 from the upper part into the hole 2b of the resin case 1, and 11 denotes a circuit board 1a in close contact with the back surface (lower surface) of three circuit boards 1a in total. And a lower die of a press for holding the resin case 1. Reference numeral 12 denotes a convex portion of the upper die 10 which presses the peripheral portion of the through hole 2a of the resin case 1 downward to adhere the circuit board 1a to the upper surface of the lower die 11 through the resin case 1, and 13 denotes a resin case 1 and the circuit board. A protrusion of the lower mold 11 that fits into the through hole 2a of the first die 1a and defines the positions of the three resin cases 1 and the circuit board 1a.

The operation in FIG. 1 will be described. Three circuit modules each including a circuit board 1a on which a phase circuit is mounted and a resin case 1 which is in close contact with the circuit board are set in a line between the two dies 10, 11 as shown in FIG. Then, each of the through holes 2a is
Set to 3.

Next, the metal fittings 3 and 4 are pushed into the hole 2b of each resin case 1 shallowly. Next, the upper mold 10 is lowered,
First, the peripheral portion of the through hole 2 a of the resin case 1 is pressed downward by the convex portion 12, and the circuit board 1 a is passed through the resin case 1.
Is brought into close contact with the upper surface of the lower mold 11, and at the same time, the upper surface of the top plate 6 of the metal fittings 3, 4 on the lower surface of the upper mold 10 (top surface for circuit board adhesion).
Is pressed downward, and these fittings 3 and 4 are pressed into the holes 2b by a required amount.

Thereafter, the upper mold 10 is raised, and the connected circuit module assembly is detached from the lower mold 11.
In this way, in a single press operation, the integration of each circuit module, the planarization of the lower surface of the circuit board 1a of each circuit module, and the planarization of the top surfaces of the metal fittings 3 and 4 for contacting the circuit substrate are performed. It can be carried out.

Next, as shown in FIG.
4 is placed on the top surface of the metal fittings 3 and 4 for adhering to the circuit board, and the screw 15 is fastened to the hole 2b to thereby control the control circuit board 14.
To the circuit module assembly. Next, as shown in FIG. 3, the smoothing capacitor 16 is fixed and connected, and then the back surface of each circuit board 1a of the circuit device thus assembled is brought into close contact with the surface of a cooling plate (not shown), and the two are fastened.

With this configuration, since the back surface flatness of the plurality of circuit modules can be ensured, good adhesion of the circuit board 1a to the same plane of the common cooling member can be ensured. (Modification) The projection 12 of the upper mold 10 may be elastically deformable in the downward direction of the upper mold 10. In this way, while the circuit module is pressed against the lower mold 11 with an appropriate load, the plane portion of the upper mold 10 descends, and the metal fittings 3 and 4 are inserted into the hole 2b.
Can be press-fitted.

(Modification) In this embodiment, the metal fittings 3, 4
Are individually provided, but a part or all of them may be integrated.

[0024]

Embodiment 2 Another embodiment will be described with reference to FIG. In FIG. 4, reference numeral 17 denotes a high-level DC power supply terminal of the phase circuit (not shown), and 18 denotes a low-level DC power supply terminal of the phase circuit (not shown).
Each resin case 1 is fixed to the top surface by insert molding. The main surface of each of the power terminals 17 and 18 is the power terminal 1
7 and 18 rise obliquely from the base end to the front end.

A total of three high DC power terminals 17 are fastened to a high busbar (not shown) with screws, and the high busbar is connected to the positive electrode of the battery pack. Similarly, a total of three lower DC power terminals 18 are fastened to a lower busbar (not shown) with screws, and the lower busbar is connected to the negative electrode of the battery pack. In this embodiment, the upper die 10 pushes and bends each of the power terminals 17 and 18 by descending, so that the main surfaces of each of the power terminals 17 and 18 are coplanar.

In this way, when each power supply terminal 17 is subsequently connected to the higher busbar, the power supply terminal 17 can be satisfactorily aligned with the higher busbar. When the terminal 18 is connected to the lower busbar, the power supply terminal 18 can be satisfactorily aligned with the lower busbar, and this terminal exposing step can be performed simultaneously with another exposing step. In addition, simplification of the process can be achieved while securing the surface accuracy.

(Modification) In this embodiment, the power supply terminal 1
Although the surfaces 7 and 18 are exposed on the same plane, it is of course possible to give different positions and postures to the power terminals 17 and 18 according to the shape of the bus bar.

[Brief description of the drawings]

FIG. 1 is an assembled perspective view showing a pressing step of a method for manufacturing a circuit module-connected electronic circuit device of the present invention.

FIG. 2 is an assembly perspective view showing a control circuit board assembling step performed after the pressing step shown in FIG. 1; It is a perspective view which shows the press process of the manufacturing method of the circuit module connection type electronic circuit device of this invention.

FIG. 3 is a completed perspective view showing a state where a smoothing capacitor is assembled after a control circuit board assembling step shown in FIG. 2;

FIG. 4 is an assembled perspective view showing another embodiment of the method for manufacturing a circuit module-connected electronic circuit device of the present invention.

[Explanation of symbols]

1 is a resin case (part of a circuit module), 1a is a circuit board (part of a circuit module), 2b is a press-fit hole, 4 is a fitting (connecting member), 5 is a fitting projection, 7 is a female screw hole, 2a is a through-hole (lower mold setting part), 14 is a control circuit board (circuit board), 17 is a high-level DC power supply terminal (connection terminal), 18 is a low-level DC power supply terminal (connection terminal).

Claims (6)

[Claims] 1. A plurality of circuit modules each having a bottom surface that can be in close contact with a cooling surface of a cooling member, and a plurality of fitting projections individually press-fitted into a pair of adjacent circuit modules. A plurality of connecting members, and a circuit board disposed on the circuit module and fixed to the circuit module, wherein each of the connecting members is at a position opposite to the two fitting protrusions. A circuit module-coupled electronic circuit device having a top surface for circuit board contact formed and adhered to the circuit board. 2. The electronic circuit device according to claim 1, wherein a bottom surface of each of the circuit modules is formed on the same plane.
A circuit module connection type electronic circuit device, wherein each of the circuit board contacting top surfaces is formed on the same plane. 3. A plurality of circuit modules having a bottom surface that can be in close contact with a cooling surface of a cooling member, a lower mold set portion that can be in close contact with a predetermined position of a lower mold, and a press-fitting hole for connecting member press-fitting are prepared. The lower mold set part of each of the circuit modules is set in a lower mold having a guide surface that can be in close contact with the bottom surface of the circuit module, and a plurality of fitting protrusions protruding in a predetermined press-fit direction, and the both fittings A plurality of connecting members having a circuit board contact top surface extending on the opposite side to the protrusion are prepared, and the plurality of connecting members are fitted into fitting holes provided in a pair of adjacent circuit modules. The protruding portions are individually press-fitted to connect the respective circuit modules, and the upper die having the connecting member pressing portion for pressing down the connecting member and the module pressing portion for pressing down the lower die set portion of the circuit module is relatively lower. And lowering the bottom surface of each circuit module in close contact with the guide plane of the lower mold, and then determining the position of the top surface for connecting the circuit board of the connecting member with reference to the bottom surface of each circuit module. A method of manufacturing a circuit module-coupled type electronic circuit device, wherein the upper die is relatively raised, and the circuit module assembly connected by the connecting member is detached from the lower die. 4. The method of manufacturing a circuit module-connected electronic circuit device according to claim 3, wherein each of the circuit modules has a connection terminal whose main surface extends obliquely with respect to the direction of relative movement of the upper die. The method of manufacturing a circuit module-connected electronic circuit device, comprising: a plurality of circuit modules, wherein the upper mold plastically deforms the connection terminal by a predetermined angle during the lowering. 5. The method for manufacturing a circuit module-connected electronic circuit device according to claim 3, wherein said connecting member is used for fastening said circuit board mounted on said top surface for adhering said circuit board. A method for manufacturing a circuit module-connected electronic circuit device, comprising: 6. A plurality of circuit modules each having a connection terminal whose main surface extends obliquely with respect to the relative movement direction of the upper mold, and each said circuit module is set at a predetermined position of the lower mold. A connecting member for coupling each of the circuit modules is set at a predetermined position of the circuit module, and the upper mold is relatively lowered to urge the connecting member to integrate each of the circuit modules. A method for manufacturing a circuit module-connected electronic circuit device, wherein the connection terminal of the circuit module is plastically deformed with reference to a bottom surface of the circuit module.