JP2000153441A - Balance type trimming device - Google Patents

Balance type trimming device

Info

Publication number
JP2000153441A
JP2000153441A JP32714498A JP32714498A JP2000153441A JP 2000153441 A JP2000153441 A JP 2000153441A JP 32714498 A JP32714498 A JP 32714498A JP 32714498 A JP32714498 A JP 32714498A JP 2000153441 A JP2000153441 A JP 2000153441A
Authority
JP
Japan
Prior art keywords
cutting
balance
cutting tool
weight
balance bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32714498A
Other languages
Japanese (ja)
Inventor
Yasuhiko Kitajima
保彦 北島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP32714498A priority Critical patent/JP2000153441A/en
Publication of JP2000153441A publication Critical patent/JP2000153441A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To perform high accurate grinding work by simple equipment without being influenced by a cut object, even when it has dispersion in thickness, distortion, etc., so as to enhance durability of use of a cutting tool. SOLUTION: A balance bar 10 of which the halfway in the longitudinal direction is supported by a bearing on a support point 11 with its axis swingable is provided, a cutting tool 12 is provided on one end side of the balance bar 10, and a weight 13 is provided on the other end side. A cutting load by the cutting tool 12 abutting to a surface of a cut object 1 to apply cutting work is set by weight balance with the weight 13. Further, this set cutting load is fixedly maintained by a swing of the balance bar 10 in accordance with the cutting tool 12 abutting to the surface of the cut object 1, to constitute a balance type trimming device capable of cutting the surface of the cut object 1 by the cutting tool 12 sliding along the surface.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、切削具を被切削物
の表面に当接させて切削加工を施すトリミング装置の改
良に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a trimming apparatus for performing a cutting process by bringing a cutting tool into contact with a surface of a workpiece.

【0002】[0002]

【従来の技術】被切削物としてLC複合部品を例示する
と、LC複合部品は図2a,図2bで示すように内部電
極1aを設けたセラミック基板1bを基体に、上部電極
1cをセラミック基板1bの板面に設けてコンデンサ基
板1を構成すると共に、複数個のコイル2…をコンデン
サ基板1の板面に搭載することにより構成されている。
2. Description of the Related Art As an example of an LC composite component as an object to be cut, as shown in FIGS. 2A and 2B, a ceramic substrate 1b provided with an internal electrode 1a is used as a base and an upper electrode 1c is used as a ceramic substrate 1b. The capacitor substrate 1 is provided on a plate surface, and a plurality of coils 2 are mounted on the plate surface of the capacitor substrate 1.

【0003】そのLC複合部品においては、コンデンサ
基板1並びにコイル2の特性的なバラ付きにより目標と
する電気的特性が得られないことが多い。このため、コ
ンデンサ基板1の上部電極1cを削り取ってコンデンサ
容量を変えることにより、LC複合部品として電気的特
性を調整することが行われている。
In such an LC composite component, the desired electrical characteristics cannot be obtained in many cases due to characteristic variations in the capacitor substrate 1 and the coil 2. For this reason, the electrical characteristics of the LC composite component have been adjusted by shaving off the upper electrode 1c of the capacitor substrate 1 and changing the capacitor capacity.

【0004】従来、その上部電極1cの切削処理には、
図3で示すようにLC複合部品(図中、コンデンサ基板
1のみを図示する。)を保持具3に載置させて水平方向
に移動すると共に、回転砥石4aを回転駆動部4bで作
動させながら所定の高さ位置に保ってコンデンサ基板1
の上部電極1cに当接することにより上部電極1cを削
るトリミング装置が用いられている。
Conventionally, the cutting process of the upper electrode 1c has
As shown in FIG. 3, the LC composite component (only the capacitor substrate 1 is shown in the drawing) is placed on the holder 3 and moved in the horizontal direction, while the rotary grindstone 4a is operated by the rotary drive unit 4b. The capacitor substrate 1 is maintained at a predetermined height.
A trimming device that cuts the upper electrode 1c by contacting the upper electrode 1c is used.

【0005】そのトリミング装置では、回転砥石4aを
所定の高さ位置に保ってコンデンサ基板1を水平方向に
移動するものであるため、コンデンサ基板1の厚み誤差
や歪み等があると、切削深さのバラ付きが生ずることを
避けられない。
In the trimming apparatus, since the capacitor substrate 1 is moved in the horizontal direction while maintaining the rotating grindstone 4a at a predetermined height position, if there is a thickness error or distortion of the capacitor substrate 1, the cutting depth may be reduced. It is inevitable that the variations will occur.

【0006】特に、コンデンサ基板1では0.1mm程
度の厚み誤差が生ずる場合があり、また、内部電極10
と上部電極1cとの層間寸法が40〜50μmと厚み誤
差よりも小さいものがある。この場合に、図4で示すよ
うに回転砥石4aを所定の高さ位置に保って上部電極1
cを切削することでは内部電極1aまでも傷付けてしま
い、電気的特性の劣化や経時的変化による信頼性の低下
を招き、或いはコンデンサ基板1が割れることも生じ兼
ねない。
In particular, a thickness error of about 0.1 mm may occur in the capacitor substrate 1 and the internal electrodes 10
And the upper electrode 1c has an interlayer size of 40 to 50 μm, which is smaller than the thickness error. In this case, as shown in FIG. 4, the rotating whetstone 4a is maintained at a predetermined height position and the upper electrode 1
Cutting c may damage even the internal electrode 1a, resulting in deterioration of electrical characteristics and deterioration of reliability due to a change with time, or the capacitor substrate 1 may be broken.

【0007】それを避けるため、従来は各ロット毎に、
コンデンサ基板の厚みに合わせて回転砥石の高さ位置を
調整しているが、これでは作業に時間や手間を要する。
また、上述した不具合が生じないまでも、コンデンサ基
板の厚みが変動するのに伴って余分な厚みを切削するこ
とによる負荷で、回転砥石の消耗も著しいところから好
ましくない。
In order to avoid this, conventionally, for each lot,
The height position of the rotary grindstone is adjusted according to the thickness of the capacitor substrate, but this requires time and labor for the work.
Further, even if the above-described problem does not occur, the load caused by cutting the excess thickness in accordance with the variation in the thickness of the capacitor substrate is not preferable because the rotating grindstone is significantly consumed.

【0008】[0008]

【発明が解決しようとする課題】本発明は、厚みのバラ
付きや歪み等が被切削物にあっても、それに影響されな
いで高精度な研削加工を簡単な設備で行え、切削具の使
用耐久性も向上可能な天秤型のトリミング装置を提供す
ることを目的とする。
SUMMARY OF THE INVENTION According to the present invention, it is possible to carry out high-precision grinding with simple equipment without being affected by variations in thickness, distortion, etc., even in a workpiece, and the durability of a cutting tool. It is an object of the present invention to provide a balance type trimming device capable of improving the operability.

【0009】[0009]

【課題を解決するための手段】本発明の請求項1に係る
天秤型トリミング装置においては、長手方向の中腹を支
点に軸線を揺動可能に軸受け支持した天秤バーを備え、
この天秤バーの片端側には切削具を備え付けると共に、
他端側には分銅を備え付け、被切削物の表面に当接させ
て切削加工を施す切削具による切削荷重を分銅との重量
バランスにより設定し、且つ、その設定された切削荷重
を被切削物の表面と当接する切削具に応じた天秤バーの
揺動により一定に維持し、被切削物の表面を当該表面に
沿ってスライドする切削具で切削可能な天秤型に構成さ
れている。
According to a first aspect of the present invention, there is provided a balance-type trimming apparatus, comprising: a balance bar having a shaft supported by a shaft so as to be swingable about a longitudinal middle.
A cutting tool is provided on one end of this balance bar,
The other end is equipped with a weight, and the cutting load of the cutting tool that performs cutting by making contact with the surface of the workpiece is set according to the weight balance with the weight, and the set cutting load is set to the workpiece. It is configured as a balance type that can be kept constant by the swinging of the balance bar according to the cutting tool in contact with the surface of the workpiece, and can be cut by the cutting tool that slides along the surface of the workpiece.

【0010】本発明の請求項2に係る天秤型トリミング
装置においては、分銅を天秤バーの軸線上で長手方向に
沿って位置調整可能に備え付けることにより構成されて
いる。
The balance-type trimming device according to the second aspect of the present invention is configured such that a weight is provided so as to be position-adjustable along the longitudinal direction on the axis of the balance bar.

【0011】[0011]

【発明の実施の形態】以下、図1を参照して説明する
と、この実施の形態は従来例と同様な内部電極1aを設
けたセラミック基板1bを基体に、上部電極1cをセラ
ミック基板1bの板面に設けてコンデンサ基板1を構成
すると共に、複数個のコイル(図示せず)をセラミック基
板1の板面に搭載してなるLC複合部品等を被切削物と
するのに好適なトリミング装置として構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, this embodiment will be described. This embodiment uses a ceramic substrate 1b provided with an internal electrode 1a as a base and a top electrode 1c formed on a ceramic substrate 1b. A trimming device suitable for forming a capacitor substrate 1 on a surface thereof, and an LC composite component or the like obtained by mounting a plurality of coils (not shown) on the plate surface of the ceramic substrate 1 as a workpiece. It is configured.

【0012】そのトリミング装置は、所定の軸線長さを
有する天秤バー10を主体に構成されている。この天秤
バー10は水平方向に位置すると共に、長手方向の中腹
を機体フレーム(図示せず)等に支軸で枢着することによ
り、その支軸を支点11に軸線を図中で右下りに或いは
左下りに揺動できるよう軸受け支持されている。
The trimming device mainly comprises a balance bar 10 having a predetermined axial length. The balance bar 10 is located in the horizontal direction, and the middle of the longitudinal direction is pivotally attached to a body frame (not shown) or the like by a support shaft. Alternatively, it is supported by a bearing so that it can swing to the left.

【0013】その天秤バー10を主体とし、片軸端側に
は切削具12を備え付けると共に、他軸端側には分銅1
3を備え付けて構成されている。切削具12としては、
回転砥石12aを回転駆動部12bで作動する切削機が
備え付けられている。この切削機は、回転砥石12aを
下方に向けて回転駆動部12bを天秤バー10の軸端に
固定することにより天秤バー10と一体に装備されてい
る。
The balance bar 10 is a main component, and a cutting tool 12 is provided on one shaft end side, and a weight 1 is provided on the other shaft end side.
3 is provided. As the cutting tool 12,
A cutting machine that operates the rotary grindstone 12a by the rotation drive unit 12b is provided. The cutting machine is provided integrally with the balance bar 10 by fixing the rotation drive unit 12b to the shaft end of the balance bar 10 with the rotary grindstone 12a facing downward.

【0014】分銅13は、天秤バー10の軸線上にスラ
イド自在に嵌装すると共に、天秤バー10の締付けネジ
(図示せず)を分銅13よりねじ込み乃至はねじ戻し可能
に備えることにより天秤バー10の軸線上で長手方向に
沿って位置調整可能に備え付けられる。また、天秤バー
10の軸線をスクリュー軸として形成し、分銅13をス
クリュー軸と螺合することによっても分銅13を位置調
整可能に備え付けできる。
A weight 13 is slidably fitted on the axis of the balance bar 10 and a tightening screw of the balance bar 10 is attached.
(Not shown) can be screwed or unscrewed from the weight 13 so as to be adjustable on the axis of the balance bar 10 along the longitudinal direction. The weight 13 can also be provided so that its position can be adjusted by forming the axis of the balance bar 10 as a screw shaft and screwing the weight 13 with the screw shaft.

【0015】このように構成するトリミング装置は、コ
ンデンサ基板1を保持具14に載せて搬送する途上に、
回転砥石12aを上方よりコンデンサ基板1の上部電極
1cに当接させて切削加工を施すようにできる。
The trimming apparatus thus configured is configured to transport the capacitor substrate 1 on the holder 14 while transporting the same.
The rotating grindstone 12a can be brought into contact with the upper electrode 1c of the capacitor substrate 1 from above to perform cutting.

【0016】その切削加工に際し、コンデンサ基板1の
上部電極1cに当接させて切削加工を施す切削具12に
よる切削荷重を分銅13との重量バランスにより設定す
る。即ち、分銅13を天秤バー10の軸線上で切削具1
2より離間方向に位置調整すれば切削具12による切削
荷重を小さく、一方、分銅13を天秤バー10の軸線上
で切削具12と近接方向に切削具12による切削荷重を
位置調整すれば大きく設定できる。
At the time of the cutting process, the cutting load by the cutting tool 12 which makes contact with the upper electrode 1c of the capacitor substrate 1 and performs the cutting process is set by the weight balance with the weight 13. That is, the weight 13 is put on the cutting tool 1 on the axis of the balance bar 10.
If the position is adjusted in a direction away from 2, the cutting load by the cutting tool 12 is reduced, while the weight 13 is set to a large value by adjusting the cutting load by the cutting tool 12 in the direction close to the cutting tool 12 on the axis of the balance bar 10. it can.

【0017】その切削具12による切削荷重を分銅13
との重量バランスで設定することから、コンデンサ基板
1に対する回転砥石12aの高さ位置を定められる。こ
のため、一定の厚みを有するコンデンサ基板1に対して
は設定された切削荷重に相応する切削深さで切削加工を
高精度に施すことができる。コンデンサ基板1の上部電
極1cを切削するときには、切削深さを40μmとする
場合、切削具12の荷重は40〜80g程度に設定すれ
ばよい。
The cutting load of the cutting tool 12 is
Therefore, the height position of the rotary grindstone 12a with respect to the capacitor substrate 1 can be determined. For this reason, it is possible to perform cutting with high precision on the capacitor substrate 1 having a certain thickness at a cutting depth corresponding to the set cutting load. When cutting the upper electrode 1c of the capacitor substrate 1, when the cutting depth is set to 40 μm, the load of the cutting tool 12 may be set to about 40 to 80 g.

【0018】それと共に、上述した如く設定された切削
具12による切削荷重をコンデンサ基板1の表面と当接
する回転砥石12aに応じた天秤バー10の揺動により
一定に維持できる。即ち、セラミック基板1の厚みにバ
ラ付きがありまたは歪みがあっても、天秤バー10がセ
ラミック基板1の板面に当接する回転砥石12aを介し
て揺動し、回転砥石12aの高さ位置を変えられること
から切削荷重を一定に保てる。
At the same time, the cutting load by the cutting tool 12 set as described above can be kept constant by the swinging of the balance bar 10 according to the rotating grindstone 12a in contact with the surface of the capacitor substrate 1. That is, even if the thickness of the ceramic substrate 1 varies or is distorted, the balance bar 10 swings via the rotating grindstone 12a abutting on the plate surface of the ceramic substrate 1, and the height position of the rotating grindstone 12a is adjusted. The cutting load can be kept constant because it can be changed.

【0019】例えば、切削荷重を定めた初期設定のコン
デンサ基板1よりも厚みの厚いものの場合には、回転砥
石12aがコンデンサ基板1の上部電極1cに当接する
と同時に、天秤バー10が分銅13の装備側を下げるよ
う揺動するため、切削具12による切削荷重を一定に保
ってコンデンサ基板1の上部電極1cを所定の切削深さ
で切削加工できる。
For example, in a case where the thickness is larger than the initially set capacitor substrate 1 in which the cutting load is determined, the rotating bar 12a comes into contact with the upper electrode 1c of the capacitor substrate 1 and the balance bar 10 Since the swinging operation is performed so as to lower the equipment side, the upper electrode 1c of the capacitor substrate 1 can be cut at a predetermined cutting depth while keeping the cutting load by the cutting tool 12 constant.

【0020】それとは逆に、初期設定のコンデンサ基板
1よりも厚みが薄いものの場合には天秤バー10が切削
具12の装備側を下げるよう揺動するから、いずれの場
合でも、コンデンサ基板1の表面を当該表面に沿ってス
ライドする回転砥石12aの切削荷重により高精度な切
削加工を施すことができる。
Conversely, when the thickness of the capacitor substrate 1 is thinner than the initially set capacitor substrate 1, the balance bar 10 swings to lower the equipment side of the cutting tool 12, so that in any case, High-precision cutting can be performed by the cutting load of the rotating grindstone 12a that slides along the surface.

【0021】この天秤型のトリミング装置においては、
天秤バー10の支点11を介して両側直下に、天秤バー
10の揺動下限を規制するストッパー15a,15bを
装備するようにできる。このストッパー15a,15b
は上下動可能に備え、コンデンサ基板1を保持具14に
載せて回転砥石12aの直下に順次送り込みまたは送り
出す間に、天秤バー10を水平状態に支持するものとし
て用いることもできる。
In this balance type trimming device,
Immediately below both sides of the fulcrum 11 via the fulcrum 11 of the balance bar 10, stoppers 15a and 15b for regulating the lower limit of swing of the balance bar 10 can be provided. These stoppers 15a, 15b
Can be used to support the balance bar 10 in a horizontal state while the capacitor substrate 1 is placed on the holder 14 and is sequentially fed or fed immediately below the rotary grindstone 12a.

【0022】上述した実施の形態はLC複合部品を構成
するコンデンサ基板1の上部電極1cを切削加工するも
のに基づいて説明したが、これ以外に、通常のコンデン
サのトリミング電極を切削加工する等にも用いることが
できる。また、切削具12としては回転砥石12aに代
えて、カッター等の被切削物に応じた工具を備えたもの
を装備することができる。
Although the above-described embodiment has been described based on the case where the upper electrode 1c of the capacitor substrate 1 constituting the LC composite component is cut, other processes such as cutting a trimming electrode of a normal capacitor may be used. Can also be used. Further, as the cutting tool 12, instead of the rotary grindstone 12a, a tool provided with a tool such as a cutter in accordance with an object to be cut can be provided.

【0023】[0023]

【発明の効果】以上の如く、本発明の請求項1に係る天
秤型トリミング装置に依れば、切削具による切削荷重を
分銅との重量バランスで設定することから、一定の厚み
を有する被切削物に対しては設定された切削荷重に相応
する切削深さで切削加工を高精度に施すことができる。
As described above, according to the balance-type trimming device according to the first aspect of the present invention, since the cutting load by the cutting tool is set by the weight balance with the weight, the cut having a constant thickness can be obtained. An object can be cut with high precision at a cutting depth corresponding to the set cutting load.

【0024】それと共に、切削具が被切削物の表面と当
接することに応じ、天秤バーが揺動することにより切削
荷重を一定に維持できるため、被切削物の厚みにバラ付
きや歪み等があっても、当該被切削物の表面に沿ってス
ライドする切削具により被切削物を所定の切削深さで切
削加工でき、また、不必要な厚み切削を行わないで済む
ことから切削具の使用耐久性を高めることもできる。
At the same time, when the cutting tool comes into contact with the surface of the object to be cut, the cutting load can be kept constant by swinging the balance bar. Even if there is a cutting tool that slides along the surface of the workpiece, the workpiece can be cut at a predetermined cutting depth, and unnecessary cutting of the thickness is not required. Durability can also be increased.

【0025】本発明の請求項2に係る天秤型トリミング
装置に依れば、分銅を天秤バーの軸線上で長手方向に沿
って位置調整可能に備え付けることにより、切削具と分
銅との重量バランスを容易に設定できて被切削物に対す
る回転砥石の切削荷重を正確に定められるため、その設
定された切削荷重に相応する切削深さで切削加工を高精
度に施すことができる。
According to the balance-type trimming device according to the second aspect of the present invention, the weight is provided so as to be position-adjustable in the longitudinal direction on the axis of the balance bar, so that the weight balance between the cutting tool and the weight can be maintained. Since it can be easily set and the cutting load of the rotary grindstone on the object to be cut can be accurately determined, cutting can be performed with high precision at a cutting depth corresponding to the set cutting load.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る天秤型トリミング装置を示す説明
図である。
FIG. 1 is an explanatory view showing a balance-type trimming device according to the present invention.

【図2a】一般例に係る被切削物としてLC複合部品を
示す側面図である。
FIG. 2a is a side view showing an LC composite component as a workpiece according to a general example.

【図2b】図2aのLC複合部品を示す平面図である。FIG. 2b is a plan view showing the LC composite component of FIG. 2a.

【図3】従来例に係るトリミング装置を示す説明図であ
る。
FIG. 3 is an explanatory diagram showing a conventional trimming device.

【図4】従来例に係るトリミング装置の問題点を示す説
明図である。
FIG. 4 is an explanatory diagram showing a problem of a conventional trimming device.

【符号の説明】 1 被切削物 10 天秤バー 11 天秤バーの支点 12 切削具 13 分銅[Description of Signs] 1 Workpiece 10 Balance bar 11 Support bar of balance bar 12 Cutting tool 13 Weight

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 長手方向の中腹を支点に軸線を揺動可能
に軸受け支持した天秤バーを備え、この天秤バーの片端
側には切削具を備え付けると共に、他端側には分銅を備
え付け、被切削物の表面に当接させて切削加工を施す切
削具による切削荷重を分銅との重量バランスにより設定
し、且つ、その設定された切削荷重を被切削物の表面と
当接する切削具に応じた天秤バーの揺動により一定に維
持し、被切削物の表面を当該表面に沿ってスライドする
切削具で切削可能な天秤型に構成したことを特徴とする
天秤型トリミング装置。
1. A balance bar having an axis line swingably supported on a fulcrum centered in the longitudinal direction, a cutting tool is provided on one end of the balance bar, and a weight is provided on the other end of the balance bar. The cutting load by the cutting tool that performs cutting by contacting the surface of the cutting object is set by the weight balance with the weight, and the set cutting load is set according to the cutting tool that contacts the surface of the workpiece. A balance-type trimming device, wherein the balance-type trimming device is configured to be maintained constant by swinging a balance bar, and configured to be capable of cutting the surface of the workpiece with a cutting tool that slides along the surface.
【請求項2】 上記分銅を天秤バーの軸線上で長手方向
に沿って位置調整可能に備え付けたことを特徴とする請
求項1に記載の天秤型トリミング装置。
2. The balance-type trimming device according to claim 1, wherein the weight is provided so as to be position-adjustable in the longitudinal direction on the axis of the balance bar.
JP32714498A 1998-11-17 1998-11-17 Balance type trimming device Withdrawn JP2000153441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32714498A JP2000153441A (en) 1998-11-17 1998-11-17 Balance type trimming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32714498A JP2000153441A (en) 1998-11-17 1998-11-17 Balance type trimming device

Publications (1)

Publication Number Publication Date
JP2000153441A true JP2000153441A (en) 2000-06-06

Family

ID=18195813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32714498A Withdrawn JP2000153441A (en) 1998-11-17 1998-11-17 Balance type trimming device

Country Status (1)

Country Link
JP (1) JP2000153441A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6647784B2 (en) * 2000-12-01 2003-11-18 Honda Giken Kogyo Kabushiki Kaisha Balance adjusted wheel and manufacturing method
JP7416958B2 (en) 2021-01-28 2024-01-17 ティーディージー ホールディング カンパニー リミテッド Piezoelectric crystal weighing crystal growth apparatus and operating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6647784B2 (en) * 2000-12-01 2003-11-18 Honda Giken Kogyo Kabushiki Kaisha Balance adjusted wheel and manufacturing method
JP7416958B2 (en) 2021-01-28 2024-01-17 ティーディージー ホールディング カンパニー リミテッド Piezoelectric crystal weighing crystal growth apparatus and operating method

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A300 Withdrawal of application because of no request for examination

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Effective date: 20060207