JP2000142786A - Top tape - Google Patents
Top tapeInfo
- Publication number
- JP2000142786A JP2000142786A JP10323394A JP32339498A JP2000142786A JP 2000142786 A JP2000142786 A JP 2000142786A JP 10323394 A JP10323394 A JP 10323394A JP 32339498 A JP32339498 A JP 32339498A JP 2000142786 A JP2000142786 A JP 2000142786A
- Authority
- JP
- Japan
- Prior art keywords
- top tape
- layer
- intermediate layer
- tape
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種電子部品や精
密部品などの表面実装部品を収納して搬送するキャリア
テープの蓋材として用いられるトップテープに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a top tape used as a cover material of a carrier tape for storing and transporting surface mount components such as various electronic components and precision components.
【０００２】[0002]
【従来の技術】一般に、トップテープは、両面の表面層
に耐熱性を有するポリエステル、中間層にクッション性
を有するポリエチレンおよびそれらを貼り合わせる接着
剤層、並びに上記表面層の一面にキャリアテープに熱圧
着するヒートシール材層を貼り合わせた複数層で構成さ
れている。このような構成のトップテープをキャリアテ
ープの蓋材として用いた場合、キャリアテープに収納し
た、例えば、極小チップ部品をトップテープを剥がして
電子部品等に表面実装する際、チップ部品が静電気によ
ってトップテープに付着するというトラブルが発生す
る。そのため、従来は、トップテープの表面層に帯電防
止剤をコーティングしたり、ヒートシール材層に帯電防
止剤を練り込む方法で静電気による部品の付着を防止し
ていた。2. Description of the Related Art In general, a top tape is made of heat-resistant polyester on both surface layers, polyethylene having a cushioning property on an intermediate layer and an adhesive layer for bonding the same, and a carrier tape on one surface of the surface layer. It is composed of a plurality of layers in which a heat sealing material layer to be pressed is bonded. When the top tape having such a configuration is used as a cover material of the carrier tape, when the chip components housed in the carrier tape are surface-mounted on electronic components or the like by peeling off the top tape, for example, the chip components are topped by static electricity. The trouble of sticking to the tape occurs. Therefore, conventionally, the adhesion of components due to static electricity has been prevented by coating the surface layer of the top tape with an antistatic agent or kneading the antistatic agent into the heat sealing material layer.
【０００３】[0003]
【発明が解決しようとする課題】この方法によるトップ
テープは、帯電防止剤のコーティング層のバラツキによ
り接着強度のバラツキが発生したり、ヒートシール材層
に練りこまれた帯電防止剤の表面へのブリードアップな
どにより、製造ロットや経過時間による接着強度のバラ
ツキが発生し、帯電防止処理していないトップテープに
比べて安定した接着強度を確保するのが難しかった。そ
こで、本発明の課題は、トップテープの剥離時における
収納部品のトップテープへの付着防止機能を有し、かつ
接着強度のバラツキのないトップテープを提供すること
にある。In the top tape according to this method, the adhesive strength varies due to the variation of the coating layer of the antistatic agent, or the surface of the antistatic agent kneaded into the heat sealing material layer can be removed. Due to the bleed-up and the like, the adhesive strength varied depending on the production lot and the elapsed time, and it was difficult to secure a stable adhesive strength as compared with a top tape that had not been subjected to an antistatic treatment. Therefore, an object of the present invention is to provide a top tape which has a function of preventing a storage component from adhering to the top tape when the top tape is peeled off, and has no variation in adhesive strength.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明のトップテープは、表面層と中間層とヒート
シール材層及び前記表面層と中間層とを接着する接着剤
層からなるトップテープの中間層に静電気防止機能を付
与している。本発明では、上記中間層に静電気防止機能
を付与するために、中間層に帯電防止剤を練り込むか、
中間層と表面層との接着剤層に、導電物質を練り込み、
表面層とヒートシール材層には、帯電防止処理を施さな
い。In order to solve the above problems, a top tape of the present invention comprises a top layer comprising a surface layer, an intermediate layer and a heat sealing material layer, and an adhesive layer for bonding the surface layer and the intermediate layer. The intermediate layer of the tape has an antistatic function. In the present invention, in order to impart an antistatic function to the intermediate layer, or knead an antistatic agent in the intermediate layer,
Kneading a conductive substance into the adhesive layer between the intermediate layer and the surface layer,
No antistatic treatment is applied to the surface layer and the heat sealing material layer.
【０００５】中間層に練り込む帯電防止剤としては、ア
ニオン系、カチオン系、ノニオン系の界面活性剤や、オ
ルガノポリシロキサン系の帯電防止剤が好ましく、これ
らの帯電防止剤は、中間層に、０．１〜１０重量％の割
合で混入すると良い。また、接着剤層に練り込む導電物
質としては、酸化錫あるいは金、銀、銅、鉄、ニッケ
ル、亜鉛などの金属、もしくはケッチェンブラック、ア
セチレンブラックなどのカーボン等が挙げられ、これら
を粉末もしくは繊維状にして接着剤に練り込む。接着剤
層に練り込む導電物質の割合は、酸化錫であれば０．１
〜５重量％、上記金属であれば０．１〜３重量％、カー
ボンであれば１〜１５重量％の割合で混合すると良い。As the antistatic agent kneaded into the intermediate layer, anionic, cationic or nonionic surfactants or organopolysiloxane type antistatic agents are preferable. These antistatic agents are added to the intermediate layer. It is advisable to mix at a ratio of 0.1 to 10% by weight. Examples of the conductive substance kneaded into the adhesive layer include tin oxide or metals such as gold, silver, copper, iron, nickel and zinc, or carbon such as Ketjen black and acetylene black. It is made into a fibrous form and kneaded into the adhesive. The ratio of the conductive substance kneaded into the adhesive layer is 0.1% for tin oxide.
It is advisable to mix them at a ratio of about 5 to 5% by weight, 0.1 to 3% by weight of the above-mentioned metal, and 1 to 15% by weight of carbon.
【０００６】なお、中間層に静電気防止機能を付与する
ためには、通常、上記のように中間層に帯電防止剤を練
り込むか、中間層と表面層との接着剤層に導電性を有す
る金属粉または金属繊維を練り込むが、両方を併用して
も良い。このようにしてトップテープの中間層に静電気
防止機能を持たせることにより、トップテープを剥がし
た時に、キャリアテープに収納したチップ部品が静電気
によってトップテープ側に付着するというトラブルを防
止できるとともに、従来の帯電防止処理を施したトップ
テープのようにキャリアテープへの接着強度のバラツキ
がなくなる。In order to provide an antistatic function to the intermediate layer, usually, an antistatic agent is kneaded into the intermediate layer as described above, or the adhesive layer between the intermediate layer and the surface layer has conductivity. Metal powder or metal fiber is kneaded, but both may be used in combination. By giving the intermediate layer of the top tape an antistatic function in this way, it is possible to prevent the chip components stored in the carrier tape from adhering to the top tape side due to static electricity when the top tape is peeled off, As in the case of the top tape which has been subjected to the antistatic treatment, there is no variation in the adhesive strength to the carrier tape.
【０００７】[0007]
【発明の実施の形態】以下、本発明のトップテープの一
実施の形態を添付図面に基づいて説明する。図１は、本
発明のトップテープの部分拡大縦断面図であり、図２
は、本発明のトップテープを用いたキャリアテープの使
用状態を示す縦断面図である。図１に示すように、本発
明のトップテープ１は、表面層２，２’と中間層３およ
び表面層２，２’と中間層３の間の接着剤層４，４’で
形成され、さらに表面層２’上に、ヒートシール材層５
が形成されている。本発明のトップテープ１は、中間層
３に、帯電防止剤が練り込まれるか、接着剤層４，４’
に金属粉または金属繊維が練り込まれる。本発明のトッ
プテープ１は、図２に示すように、キャリアテープ６の
上面に貼り付けられ、チップ部品７等が収納された収納
凹部８の蓋材として使用される。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the top tape of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a partially enlarged longitudinal sectional view of the top tape of the present invention, and FIG.
FIG. 2 is a longitudinal sectional view showing a use state of a carrier tape using the top tape of the present invention. As shown in FIG. 1, the top tape 1 of the present invention is formed of surface layers 2, 2 ′ and an intermediate layer 3, and adhesive layers 4, 4 ′ between the surface layers 2, 2 ′ and the intermediate layer 3, Further, a heat sealing material layer 5 is formed on the surface layer 2 '.
Are formed. In the top tape 1 of the present invention, the antistatic agent is kneaded into the intermediate layer 3 or the adhesive layers 4, 4 'are used.
Metal powder or metal fiber is kneaded into the mixture. As shown in FIG. 2, the top tape 1 of the present invention is affixed to the upper surface of the carrier tape 6 and is used as a lid material for a storage recess 8 in which chip components 7 and the like are stored.
【０００８】[0008]
【実施例】［実施例１］本発明のトップテープのベース
フィルムとして、図１に示すような、表面層２にポリエ
ステル（９μｍ）、中間層３に帯電防止剤として、ＴＢ
−１０９（松本油脂製薬（株）製商品名）を１．０重量
％の割合で練り込んだポリエチレン（１２μｍ）、表面
層２’にポリエステル（９μｍ）が形成されたフィルム
を用いた。上記表面層２，２’と中間層３の接着剤層
４，４’には、ポリウレタン系接着剤を用い、さらに、
接着剤層４’上にポリエステル系接着剤をヒートシール
材層５（２μｍ）としてグラビアコーティングにより形
成し、本発明のトップテープ（総厚さ：３４μｍ）を作
製した。EXAMPLES Example 1 As a base film of a top tape of the present invention, as shown in FIG. 1, a polyester (9 μm) was used for a surface layer 2 and a TB was used as an antistatic agent for an intermediate layer 3.
Polyethylene (12 μm) kneaded with -109 (trade name, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.) at a ratio of 1.0% by weight, and a film having a polyester (9 μm) formed on the surface layer 2 ′ were used. For the surface layers 2, 2 'and the adhesive layers 4, 4' of the intermediate layer 3, a polyurethane-based adhesive was used.
A polyester adhesive was formed as a heat seal material layer 5 (2 μm) on the adhesive layer 4 ′ by gravure coating to prepare a top tape (total thickness: 34 μm) of the present invention.
【０００９】［実施例２］本発明のトップテープのベー
スフィルムとして、表面層２にポリエステル（９μ
ｍ）、中間層３にポリエチレン（１２μｍ）、表面層
２’にポリエステル（９μｍ）が形成されたフィルムを
用い、表面層２のポリエステルと中間層３のポリエチレ
ンを貼り合わせるポリウレタン系接着剤に、酸化錫の微
粉末を混合し１０ ７ 〜１０８ Ωの接着剤層４，４’
（各１μｍ）を有したラミネートフィルムを用い、さら
に、接着剤層４’上にポリエステル系接着剤をヒートシ
ール材層５（２μｍ）としてグラビアコーティングによ
り形成して本発明のトップテープ（総厚さ：３４μｍ）
を作製した。Example 2 Base of Top Tape of the Present Invention
Polyester (9μ)
m), polyethylene (12 μm) for the intermediate layer 3, surface layer
2 ′ polyester (9 μm) film
Polyester for the surface layer 2 and polyethylene for the intermediate layer 3
Fine tin oxide on the polyurethane adhesive
Mix powder and 10 7 -108 Ω adhesive layer 4, 4 '
(1 μm each)
Then, a polyester adhesive is heat-sealed on the adhesive layer 4 '.
Gravure coating as a metal material layer 5 (2 μm)
To form the top tape of the present invention (total thickness: 34 μm)
Was prepared.
【００１０】［比較例１］従来のトップテープのベース
フィルムとして、表面層にポリエステル（９μｍ）、中
間層にポリエチレン（１２μｍ）、表面層にポリエステ
ル（９μｍ）が形成されたフィルムを用い、上記表面層
と中間層の貼り合わせに用いたポリウレタン系接着剤層
（各１μｍ）を有するラミネートフィルムと同様のラミ
ネートフィルムに、カチオン系帯電防止剤を練り込んだ
ポリエステル系接着剤をヒートシール材層（２μｍ：表
面抵抗値が１０１２Ω）としてグラビアコーティングに
より形成して、従来の帯電防止処理を施したトップテー
プ（総厚さ：３４μｍ）を作製した。Comparative Example 1 As a base film of a conventional top tape, a film in which a polyester (9 μm) was formed in a surface layer, a polyethylene (12 μm) was formed in an intermediate layer, and a polyester (9 μm) was formed in a surface layer was used. A polyester adhesive obtained by kneading a cationic antistatic agent into a laminate film similar to the laminate film having a polyurethane adhesive layer (each 1 μm) used for bonding the layer and the intermediate layer was heat-sealed (2 μm). : A top tape (total thickness: 34 μm) formed by gravure coating with a surface resistance value of 10 12 Ω) and subjected to a conventional antistatic treatment.
【００１１】本発明のトップテープと上記従来のトップ
テープを用いて摩擦帯電によるチップ部品（セラミック
コンデンサー、2125タイプ）の付着比較試験を行った。
付着試験は、アクリル繊維布にそれぞれのトップテープ
の試験片を一定回数擦ってからチップ部品（１０個）に
近づけて、付着数を比較した。また、参考として帯電防
止処理を全く施していないトップテープの試験も行っ
た。付着比較試験の結果、実施例１及び２に示したトッ
プテープと、比較例１に示したトップテープは、ともに
チップ部品の付着が無く、本発明のトップテープが、従
来のトップテープと同等の帯電防止機能を有することが
確認できた。ちなみに、帯電防止処理を施さない従来の
トップテープでは、全数がトップテープに付着した。Using the top tape of the present invention and the above-mentioned conventional top tape, an adhesion comparison test of chip parts (ceramic capacitor, 2125 type) by triboelectric charging was performed.
In the adhesion test, a test piece of each top tape was rubbed with an acrylic fiber cloth for a certain number of times, and then approached to chip components (10 pieces) to compare the number of adhesions. Further, as a reference, a test was conducted on a top tape not subjected to any antistatic treatment. As a result of the adhesion comparison test, the top tape shown in Examples 1 and 2 and the top tape shown in Comparative Example 1 both had no chip component adhesion, and the top tape of the present invention was equivalent to the conventional top tape. It was confirmed that it had an antistatic function. By the way, in the case of the conventional top tape which was not subjected to the antistatic treatment, all the pieces adhered to the top tape.
【００１２】次に、図２に示すような形状のキャリアテ
ープ６（塩化ビニール樹脂製）に、比較例で示した従来
のトップテープと実施例１及び２で示した本発明のトッ
プテープをそれぞれ３製造ロットでＮ数：５（計Ｎ数：
１５）個を、一定温度（１５０℃）で熱シールして、剥
離強度のバラツキを比較したところ、従来のトップテー
プは５〜５０ｇ、本発明のトップテープは２５〜５５ｇ
であり、本発明のトップテープのバラツキ幅の方が、帯
電防止剤の影響を受けず安定していることが確認でき
た。Next, the conventional top tape shown in the comparative example and the top tape of the present invention shown in Examples 1 and 2 were respectively applied to a carrier tape 6 (made of vinyl chloride resin) having a shape as shown in FIG. N: 5 for 3 production lots (total N:
15) The pieces were heat-sealed at a constant temperature (150 ° C.), and the variation in peel strength was compared. The conventional top tape was 5 to 50 g, and the top tape of the present invention was 25 to 55 g.
It was confirmed that the variation width of the top tape of the present invention was more stable without being affected by the antistatic agent.
【００１３】[0013]
【発明の効果】本発明のトップテープによれば、トップ
テープの中間層に静電気防止機能を付与することによ
り、トップテープを剥がした時に、キャリアテープに収
納したチップ部品が静電気によってトップテープ側に付
着するというトラブルが防止されるとともに、キャリア
テープへの接着強度のバラツキもなくなる。According to the top tape of the present invention, by imparting an antistatic function to the intermediate layer of the top tape, when the top tape is peeled off, the chip components stored in the carrier tape are moved toward the top tape by the static electricity. The trouble of adhesion is prevented, and the adhesive strength to the carrier tape is not dispersed.
【図１】本発明のトップテープの部分拡大縦断面図であ
る。FIG. 1 is a partially enlarged longitudinal sectional view of a top tape of the present invention.
【図２】本発明のトップテープを用いたキャリアテープ
の使用状態を示す縦断面図である。FIG. 2 is a longitudinal sectional view showing a use state of a carrier tape using the top tape of the present invention.
１ トップテープ ２，２’ 表面層 ３ 中間層 ４，４’ 接着剤層 ５ ヒートシール材層 ６ キャリアテープ ７ チップ部品 ８ 収納凹部 DESCRIPTION OF SYMBOLS 1 Top tape 2, 2 'surface layer 3 Intermediate layer 4, 4' Adhesive layer 5 Heat seal material layer 6 Carrier tape 7 Chip component 8 Storage recess
Claims (3)
して用いる、表面層と中間層とヒートシール材層及び前
記表面層と中間層とを接着する接着剤層からなるトップ
テープであって、前記中間層が、静電気防止機能を有す
ることを特徴とするトップテープ。1. A top tape comprising a surface layer, an intermediate layer, a heat sealing material layer, and an adhesive layer for bonding the surface layer and the intermediate layer, wherein the top tape is used as a cover material of a carrier tape for transporting electronic components. A top tape, wherein the intermediate layer has an antistatic function.
求項１に記載のトップテープ。2. The top tape according to claim 1, wherein an antistatic agent is kneaded into the intermediate layer.
に、導電物質を練り込んでなる請求項１に記載のトップ
テープ。3. The top tape according to claim 1, wherein a conductive substance is kneaded into an adhesive layer for bonding the surface layer and the intermediate layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10323394A JP2000142786A (en) | 1998-11-13 | 1998-11-13 | Top tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10323394A JP2000142786A (en) | 1998-11-13 | 1998-11-13 | Top tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000142786A true JP2000142786A (en) | 2000-05-23 |
Family
ID=18154248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10323394A Pending JP2000142786A (en) | 1998-11-13 | 1998-11-13 | Top tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000142786A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006312489A (en) * | 2005-04-07 | 2006-11-16 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP2007331783A (en) * | 2006-06-14 | 2007-12-27 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component package |
| JP2008041909A (en) * | 2006-08-04 | 2008-02-21 | Nitto Denko Corp | Wiring circuit board |
| WO2011010453A1 (en) * | 2009-07-22 | 2011-01-27 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic part package |
| WO2012043608A1 (en) | 2010-09-30 | 2012-04-05 | 住友ベークライト株式会社 | Cover tape for packaging electronic component |
-
1998
- 1998-11-13 JP JP10323394A patent/JP2000142786A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006312489A (en) * | 2005-04-07 | 2006-11-16 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP2007331783A (en) * | 2006-06-14 | 2007-12-27 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component package |
| JP2008041909A (en) * | 2006-08-04 | 2008-02-21 | Nitto Denko Corp | Wiring circuit board |
| US8053674B2 (en) | 2006-08-04 | 2011-11-08 | Nitto Denko Corporation | Wired circuit board |
| WO2011010453A1 (en) * | 2009-07-22 | 2011-01-27 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic part package |
| JP4826858B2 (en) * | 2009-07-22 | 2011-11-30 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| KR101139545B1 (en) | 2009-07-22 | 2012-04-27 | 스미또모 베이크라이트 가부시키가이샤 | Cover tape for packaging electronic part and electronic part package |
| CN102470964A (en) * | 2009-07-22 | 2012-05-23 | 住友电木株式会社 | Cover tape for packaging electronic part and electronic part package |
| WO2012043608A1 (en) | 2010-09-30 | 2012-04-05 | 住友ベークライト株式会社 | Cover tape for packaging electronic component |
| US9127190B2 (en) | 2010-09-30 | 2015-09-08 | Sumitomo Bakelite, Co., Ltd | Cover tape for electronic component packaging |
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