JP2000138101A - Electronic parts - Google Patents

Electronic parts

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Publication number
JP2000138101A
JP2000138101A JP10308489A JP30848998A JP2000138101A JP 2000138101 A JP2000138101 A JP 2000138101A JP 10308489 A JP10308489 A JP 10308489A JP 30848998 A JP30848998 A JP 30848998A JP 2000138101 A JP2000138101 A JP 2000138101A
Authority
JP
Japan
Prior art keywords
lead wire
thermistor element
electronic component
protective resin
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10308489A
Other languages
Japanese (ja)
Inventor
Tetsuya Kawamoto
哲也 河本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP10308489A priority Critical patent/JP2000138101A/en
Publication of JP2000138101A publication Critical patent/JP2000138101A/en
Pending legal-status Critical Current

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  • Thermistors And Varistors (AREA)

Abstract

PROBLEM TO BE SOLVED: To restrict infiltration of moisture from outside into a component body by a method wherein the component body is electrically connected to a lead wire insulation-coated, and one end of parts and the lead wire is coated, and the lead wire is bent together with an insulation-coated body of the lead wire inside a protection resin. SOLUTION: Electronic parts are temperature sensors using a thermistor element 1 in an electronic parts body and constituted by the thermistor element 1, a lead wire 12, and a protection resin 13. An electrode is formed on both end faces of the thermistor element 1, and the electrode on both end faces of the thermistor element 1 is electrically connected to one end of the lead wire 12 by soldering, etc. The lead wire 12 is constituted by a conductor part 12a and an insulation-coated body 12b, and the conductor part 12a is coated with the insulation-coated body 12b excluding one end connected to the thermistor element 1. The lead wire 12 is bent in a substantially S shape in a specified length from one end connected to the thermistor element 1, and the vicinity containing a bent part of the thermistor element 1 and the lead wire 12 is coated with the protection resin 13.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品本体にリ
ード線が接続された電子部品に関し、特にリード線が絶
縁被覆され、電子部品本体とともに保護樹脂で被覆され
た温度センサに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which a lead wire is connected to an electronic component body, and more particularly to a temperature sensor in which the lead wire is insulated and covered with a protective resin together with the electronic component body.

【0002】[0002]

【従来の技術】従来のこの種の電子部品について、電子
部品本体にサーミスタ素子を用いた温度センサの例を、
図2に基づいて説明する。温度センサは、サーミスタ素
子1、リード線2,2及び保護樹脂3から構成されてい
る。サーミスタ素子1は両端面に電極(図示せず)が形
成され、サーミスタ素子1の両端面の電極に、リード線
2,2の一端がはんだ等で電気的に接続されている。リ
ード線2は、導線部2a及び絶縁被覆体2bから構成さ
れ、導線部2aはサーミスタ素子1に接続された一端を
除いて絶縁被覆体2bで被覆されている。保護樹脂3
は、エポキシ系の樹脂であり、サーミスタ素子1と、サ
ーミスタ素子1側に接続されたリード線2の一端を含ん
で被覆している。
2. Description of the Related Art An example of a conventional temperature sensor using a thermistor element in the body of an electronic component of this type is described below.
A description will be given based on FIG. The temperature sensor includes a thermistor element 1, lead wires 2 and 2, and a protective resin 3. Electrodes (not shown) are formed on both end faces of the thermistor element 1, and one ends of the lead wires 2 are electrically connected to electrodes on both end faces of the thermistor element 1 by soldering or the like. The lead wire 2 is composed of a conductor 2a and an insulating cover 2b. The conductor 2a is covered with an insulating cover 2b except for one end connected to the thermistor element 1. Protective resin 3
Is an epoxy resin, which covers the thermistor element 1 and one end of the lead wire 2 connected to the thermistor element 1 side.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記構
成の温度センサにおいて、湿度が高い等の環境で使用さ
れている間に、水分が保護樹脂3の内部に浸入してサー
ミスタ素子1に到達し、絶縁不良やマイグレーションが
発生する問題がある。
However, in the temperature sensor having the above-mentioned structure, while the temperature sensor is used in an environment such as high humidity, water penetrates into the protective resin 3 and reaches the thermistor element 1. There is a problem that insulation failure and migration occur.

【0004】水分が浸入しやすい箇所としては、図2に
示すリード線2,2と保護樹脂3との界面4及びリード
線2,2の接触面5である。リード線2,2を保護樹脂
3で被覆する際に、2本のリード線2,2が互いに密着
していると、リード線2,2の接触面5に保護樹脂3が
回り込まない。このような状態において、図3に示すよ
うに、リード線2,2が相対する方向X1,X2に引き
離された場合に、保護樹脂3によって被覆されなかった
接触面5の隙間が広がり、水分が接触面5から浸入す
る。
[0004] The locations where moisture easily penetrates are the interface 4 between the lead wires 2 and 2 and the protective resin 3 and the contact surface 5 between the lead wires 2 and 2 shown in FIG. When the leads 2 are covered with the protective resin 3, if the two leads 2 are in close contact with each other, the protective resin 3 does not go around the contact surface 5 of the leads 2. In such a state, as shown in FIG. 3, when the lead wires 2 are separated in the opposite directions X1 and X2, the gap of the contact surface 5 not covered with the protective resin 3 is widened, and moisture is removed. It penetrates from the contact surface 5.

【0005】また、この保護樹脂3とリード線2,2と
は物理的に接触しており、化学的に結合したものではな
い。このため、保護樹脂3の硬化後、リード線2,2と
保護樹脂3の界面4に微少な隙間が発生し、水分が浸入
する原因となる。
Further, the protective resin 3 and the lead wires 2 are physically in contact with each other and are not chemically bonded. For this reason, after the protective resin 3 is cured, a minute gap is generated at the interface 4 between the lead wires 2 and 2 and the protective resin 3, which causes moisture to enter.

【0006】本発明の目的は、上記の問題点を解消すべ
くなされたもので、安価で防水性が高く、長寿命な電子
部品を提供することである。
An object of the present invention is to solve the above problems and to provide an inexpensive, highly waterproof and long-life electronic component.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明の電子部品においては、電子部品本体に絶縁
被覆されたリード線が電気的に接続され、前記電子部品
本体及び前記リード線の一端が保護樹脂で覆われてお
り、リード線は、前記保護樹脂内部で前記リード線の絶
縁被覆体とともに曲折されている。前記リード線は前記
保護樹脂内部から外部に導出される部分では互いに離間
していることが好ましい。
In order to achieve the above object, in an electronic component according to the present invention, a lead wire coated with insulation on an electronic component body is electrically connected to the electronic component body and the lead wire. Is covered with a protective resin, and the lead wire is bent inside the protective resin together with the insulating covering of the lead wire. It is preferable that the lead wires are separated from each other at a portion led out from the inside of the protective resin.

【0008】このようにして、外部から電子部品本体へ
の水分の浸入を抑制できる。
[0008] In this way, it is possible to suppress the penetration of moisture from the outside into the electronic component body.

【0009】[0009]

【発明の実施の形態】本発明による一つの実施の形態に
ついて、図1に基づいて詳細に説明する。図1に示され
る電子部品は、電子部品本体にサーミスタ素子1を用い
た温度センサであり、サーミスタ素子1,リード線1
2,12及び保護樹脂13から構成される。サーミスタ
素子1は両端面に電極(図示せず)が形成され、サーミ
スタ素子1の両端面の電極に、リード線12,12の一
端がはんだ等で電気的に接続されている。リード線12
は、導線部12a及び絶縁被覆体12bから構成され、
導線部12aはサーミスタ素子1に接続された一端を除
いて絶縁被覆体12bで被覆されている。さらに、リー
ド線12,12は、サーミスタ素子1に接続された一端
から所定の長さについて略S字状に曲折され、サーミス
タ素子1とリード線12,12の曲折部分を含む近傍
は、保護樹脂13で被覆されている。ここで、保護樹脂
13で被覆されたリード線12,12が保護樹脂13内
部から外部に導出される部分は、リード線12,12が
互いに接触しないように離間されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment according to the present invention will be described in detail with reference to FIG. The electronic component shown in FIG. 1 is a temperature sensor using a thermistor element 1 in an electronic component body, and includes a thermistor element 1 and a lead wire 1.
2 and 12 and a protective resin 13. Electrodes (not shown) are formed on both end faces of the thermistor element 1, and one ends of the lead wires 12 are electrically connected to electrodes on both end faces of the thermistor element 1 by soldering or the like. Lead wire 12
Is composed of a conductive wire portion 12a and an insulating cover 12b,
Except for one end connected to the thermistor element 1, the conductor 12a is covered with an insulating covering 12b. Further, the lead wires 12, 12 are bent in a substantially S-shape for a predetermined length from one end connected to the thermistor element 1, and the vicinity including the bent portions of the thermistor element 1 and the lead wires 12, 12 is formed of a protective resin. 13. Here, the portions where the lead wires 12, 12 covered with the protective resin 13 are led out from the inside of the protective resin 13 are separated so that the lead wires 12, 12 do not contact each other.

【0010】こうして、リード線12を略S字状に曲折
させ保護樹脂13の内部に被覆されるリード線12の長
さを従来技術と比べて長くしているため、水分が界面1
4から浸入しサーミスタ素子1に到達すること、及び水
分がリード線12の内部、つまり、導線部12aと絶縁
被覆体12bとの間を伝わり保護樹脂13の内部に浸入
しサーミスタ素子1に到達することを抑制できる。
In this manner, the lead wire 12 is bent in a substantially S-shape to make the length of the lead wire 12 covered with the protective resin 13 longer than in the prior art.
4 and reaches the thermistor element 1, and moisture penetrates into the protective resin 13 through the inside of the lead wire 12, that is, between the conductor 12 a and the insulating coating 12 b and reaches the thermistor element 1. Can be suppressed.

【0011】さらに保護樹脂13の内部から外部に導出
されるリード線12,12を接触しないように互いに離
間させてあるため、保護樹脂13はリード線12,12
の周囲に十分に回り込み、リード線12,12が相対す
る方向に引き離されても、従来例のようにリード線1
2,12の接触面から水分が浸入することを抑制でき
る。
Further, since the lead wires 12 extending from the inside of the protective resin 13 to the outside are separated from each other so as not to contact with each other, the protective resin 13 is
And the lead wires 12 and 12 are separated from each other in the opposite direction even if the lead wires 1 and 12 are separated from each other.
Infiltration of moisture from the contact surfaces 2 and 12 can be suppressed.

【0012】なお、上述した保護樹脂13は、エポキ
シ,ポリエチレン,テフロン,(登録商標)シリコン系
のいずれの材料も用いることができる。さらに、リード
線12の絶縁被覆体12bとして、通常、塩化ビニル,
ポリエチレン,テフロン,シリコン等の材料が用いられ
ることがあり、この場合、保護樹脂13は、結合度を増
すために絶縁被膜体12bと同種の材料を用いることが
より好ましい。
The protective resin 13 can be made of any of epoxy, polyethylene, Teflon, and (registered trademark) silicon-based materials. Further, as the insulating coating 12b of the lead wire 12, usually, vinyl chloride,
In some cases, a material such as polyethylene, Teflon, or silicon is used. In this case, it is more preferable that the protective resin 13 be made of the same material as the insulating coating 12b in order to increase the degree of bonding.

【0013】また、本実施例においては電子部品本体は
サーミスタ素子を用いたが、サーミスタ素子は負特性あ
るいは正特性サーミスタの何れでもよいばかりか、電子
部品をセンサーとして用いる場合、他のセンサー素子等
に変更することも可能である。
In the present embodiment, the electronic component body uses a thermistor element. However, the thermistor element may be either a negative or positive characteristic thermistor. It is also possible to change to

【0014】[0014]

【発明の効果】以上のように本発明による電子部品は、
電子部品本体に絶縁被覆されたリード線の導線部が電気
的に接続され、前記電子部品本体及び前記リード線の一
端は保護樹脂で覆われており、前記保護樹脂内部におい
て前記リード線の曲折部を備えており、前記曲折部は前
記電子部品本体から前記リード線の導出部までの距離を
長くして界面からの水分の浸入を抑える機能を有するこ
とで、従来品と同じ保護樹脂やリード線を使用しながら
水分の浸入をより効果的に抑制することができる。ま
た、リード線は保護樹脂内部から外部に導出される部分
で互いに離間しているため、2本のリード線間から水分
が浸入することを抑制できる。
As described above, the electronic component according to the present invention is
A lead portion of a lead wire that is insulated and coated on the electronic component body is electrically connected, one end of the electronic component body and one end of the lead wire are covered with a protective resin, and a bent portion of the lead wire inside the protective resin. The bent portion has a function of increasing the distance from the electronic component main body to the lead-out portion of the lead wire to suppress the entry of moisture from the interface, so that the same protective resin or lead wire as the conventional product is provided. It is possible to more effectively suppress the intrusion of water while using the water. Further, since the lead wires are separated from each other at a portion led out from the inside of the protective resin, it is possible to suppress moisture from entering between the two lead wires.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る一つの実施の形態として温度セン
サを示し、(a)は断面図、(b)は側面図である。
FIG. 1 shows a temperature sensor as one embodiment according to the present invention, wherein (a) is a cross-sectional view and (b) is a side view.

【図2】従来の温度センサを示し、(a)は断面図、
(b)は側面図である。
FIG. 2 shows a conventional temperature sensor, (a) is a sectional view,
(B) is a side view.

【図3】図2の温度センサについて、2本のリード線を
相対する方向に引き離した図である。
FIG. 3 is a diagram of the temperature sensor of FIG. 2 in which two lead wires are separated in opposite directions.

【符号の説明】[Explanation of symbols]

1 サーミスタ素子 12 リード線 12a 導線部 12b 絶縁被覆体 13 保護樹脂 14 界面 DESCRIPTION OF SYMBOLS 1 Thermistor element 12 Lead wire 12a Conductor part 12b Insulation coating 13 Protective resin 14 Interface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電子部品本体に絶縁被覆されたリード線
の導線部が電気的に接続され、前記電子部品本体及び前
記リード線の一端は保護樹脂で覆われており、 前記保護樹脂内部において前記リード線の曲折部を備え
ており、前記曲折部は前記電子部品本体から前記リード
線の導出部までの距離を長くして界面からの水分の浸入
を抑える機能を有することを特徴とする電子部品。
1. A lead portion of a lead wire, which is insulated and coated on an electronic component main body, is electrically connected to the electronic component main body and one end of the lead wire is covered with a protective resin. An electronic component having a bent portion of a lead wire, wherein the bent portion has a function of increasing a distance from the electronic component main body to a lead-out portion of the lead wire to suppress intrusion of moisture from an interface. .
【請求項2】 前記リード線は前記保護樹脂内部から外
部に導出される部分が互いに離間していることを特徴と
する請求項1に記載の電子部品。
2. The electronic component according to claim 1, wherein portions of the lead wire led out of the protective resin are separated from each other.
【請求項3】 前記電子部品本体は負特性サーミスタで
あることを特徴とする請求項1又は2に記載の電子部
品。
3. The electronic component according to claim 1, wherein the electronic component body is a negative temperature coefficient thermistor.
JP10308489A 1998-10-29 1998-10-29 Electronic parts Pending JP2000138101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10308489A JP2000138101A (en) 1998-10-29 1998-10-29 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10308489A JP2000138101A (en) 1998-10-29 1998-10-29 Electronic parts

Publications (1)

Publication Number Publication Date
JP2000138101A true JP2000138101A (en) 2000-05-16

Family

ID=17981639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10308489A Pending JP2000138101A (en) 1998-10-29 1998-10-29 Electronic parts

Country Status (1)

Country Link
JP (1) JP2000138101A (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49138348U (en) * 1973-03-29 1974-11-28
JPS6164092A (en) * 1984-09-03 1986-04-02 松下電器産業株式会社 Waterproof positive temperature coefficient thermistor unit
JPH01118403U (en) * 1988-02-04 1989-08-10
JPH0246121A (en) * 1988-08-08 1990-02-15 Sumitomo Wiring Syst Ltd Waterproofing of terminal joint of coated wire
JPH0327558A (en) * 1989-03-08 1991-02-05 Nec Corp Lead frame for mounting semiconductor device
JPH03242904A (en) * 1990-02-21 1991-10-29 Tdk Corp Thermistor
JPH0425198A (en) * 1990-05-21 1992-01-28 Toshiba Corp Electronic component
JPH04272671A (en) * 1991-02-26 1992-09-29 Murata Mfg Co Ltd Terminal for insert molding and method for molding case made of resin using this terminal
JPH04348512A (en) * 1991-05-27 1992-12-03 Nec Corp Chip type solid electrolytic capacitor
JPH08128901A (en) * 1994-10-31 1996-05-21 Sanyo Electric Co Ltd Temperature sensor and pack battery
JPH08250305A (en) * 1995-03-14 1996-09-27 Murata Mfg Co Ltd Thrmistor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49138348U (en) * 1973-03-29 1974-11-28
JPS6164092A (en) * 1984-09-03 1986-04-02 松下電器産業株式会社 Waterproof positive temperature coefficient thermistor unit
JPH01118403U (en) * 1988-02-04 1989-08-10
JPH0246121A (en) * 1988-08-08 1990-02-15 Sumitomo Wiring Syst Ltd Waterproofing of terminal joint of coated wire
JPH0327558A (en) * 1989-03-08 1991-02-05 Nec Corp Lead frame for mounting semiconductor device
JPH03242904A (en) * 1990-02-21 1991-10-29 Tdk Corp Thermistor
JPH0425198A (en) * 1990-05-21 1992-01-28 Toshiba Corp Electronic component
JPH04272671A (en) * 1991-02-26 1992-09-29 Murata Mfg Co Ltd Terminal for insert molding and method for molding case made of resin using this terminal
JPH04348512A (en) * 1991-05-27 1992-12-03 Nec Corp Chip type solid electrolytic capacitor
JPH08128901A (en) * 1994-10-31 1996-05-21 Sanyo Electric Co Ltd Temperature sensor and pack battery
JPH08250305A (en) * 1995-03-14 1996-09-27 Murata Mfg Co Ltd Thrmistor device

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