JP2000133998A5

JP2000133998A5 -

Info

Publication number: JP2000133998A5
Application number: JP1998304882A
Authority: JP
Filing date: 1998-10-27
Publication date: 2005-07-14
Anticipated expiration: 2018-10-27

Description

【０００８】
【課題を解決するための手段】
上記目的を達成するために、本発明の電子部品の実装方法は、部品吸着位置の吸着ノズルで吸着した電子部品を、前記吸着ノズルが認識位置に移動したときに画像認識することにより、前記電子部品の前記吸着ノズルの中央部に対する位置ずれ量を求め、前記吸着ノズルが部品装着位置に移動したときに、回路基板の部品装着部を、電子部品の装着位置データを前記位置ずれ量だけ補正した補正位置に位置決めして電子部品に相対向させ、前記吸着ノズルの下降により電子部品を前記部品装着部に実装する電子部品の実装方法において、前記吸着ノズルに吸着保持されている電子部品を、前記吸着ノズルに対し互いの中央部が合致する相対位置になるよう位置修正した後に、前記画像認識を行うことを特徴とする。 0008
[Means for solving problems]
In order to achieve the above object, the method of mounting an electronic component of the present invention recognizes an electronic component sucked by a suction nozzle at a component suction position as an image when the suction nozzle moves to the recognition position. The amount of misalignment of the component with respect to the central portion of the suction nozzle was obtained, and when the suction nozzle moved to the component mounting position, the component mounting portion of the circuit board was corrected for the mounting position data of the electronic component by the amount of the misalignment. In the method of mounting an electronic component in which the electronic component is positioned at the correction position so as to face the electronic component and the electronic component is mounted on the component mounting portion by lowering the suction nozzle, the electronic component sucked and held by the suction nozzle is described. after cormorants by comprising a relative position position fixes central portion matches one another with respect to the suction nozzle, and performs the image recognition.

この電子部品の実装方法では、吸着ノズルが認識位置に移動したときに、吸着ノズルの中央部に対する電子部品の位置ずれ量が画像認識により求められるが、画像認識前に電子部品の吸着ノズルとの相対位置が修正されているので、位置ずれが殆ど無い。したがって、吸着ノズルが部品装着位置に移動されたときに、回路基板の部品装着部は、電子部品の吸着ノズルに対する位置ずれが無いことから、位置ずれによる補正をされることなく予め設定された装着位置データに基づく位置に位置決めされる。これにより、電子部品とこれを吸着保持する吸着ノズルとが共に回路基板の部品装着部に対し正確に相対向するよう位置決めされるので、電子部品が高密度に実装される場合においても、次に吸着ノズルが下降してこれに吸着している電子部品が回路基板の部品装着部に実装されるときに、この部品装着部に隣接する部品装着部に実装済みの電子部品に吸着ノズルの端部が当接するといったことは生じることがない。そのため、この電子部品の実装方法では、電子部品の実装不良を確実に防止しながら電子部品を高密度に実装することができる。 In this method of mounting an electronic component, when the suction nozzle moves to the recognition position, the amount of misalignment of the electronic component with respect to the central portion of the suction nozzle is obtained by image recognition . because it is Tadashisa relative position GaOsamu, almost no positional deviation. Therefore, when the suction nozzle is moved to the component mounting position, the component mounting portion of the circuit board does not have a positional deviation with respect to the suction nozzle of the electronic component, so that the mounting is set in advance without being corrected by the displacement. It is positioned at a position based on the position data. As a result, both the electronic component and the suction nozzle that sucks and holds the electronic component are positioned so as to accurately face each other with respect to the component mounting portion of the circuit board. Therefore, even when the electronic component is mounted at high density, the next step is When the suction nozzle is lowered and the electronic component sucked on the electronic component is mounted on the component mounting portion of the circuit board, the end of the suction nozzle is mounted on the electronic component mounted on the component mounting portion adjacent to the component mounting portion. Does not come into contact with each other. Therefore, in this method of mounting electronic components, it is possible to mount electronic components at a high density while reliably preventing mounting defects of the electronic components.

また、本発明の電子部品の実装装置は、部品吸着位置の吸着ノズルで吸着した電子部品を、前記吸着ノズルが認識位置に移動したときに画像認識することにより、前記電子部品の前記吸着ノズルの中央部に対する位置ずれ量を求め、前記吸着ノズルが部品装着位置に移動したときに、回路基板の部品装着部を、電子部品の装着位置データを前記位置ずれ量だけ補正した補正位置に位置決めして電子部品に相対向させ、前記吸着ノズルの下降により電子部品を前記部品装着部に実装する電子部品の実装装置において、前記画像認識を行う前に、前記吸着ノズルに吸着保持されている電子部品を、前記吸着ノズルに対し互いの中央部が合致する相対位置になるよう位置修正する位置修正ユニットを設け、前記位置修正ユニットは、前記吸着ノズルに対し互いの中央部が合致する相対位置に相対向され、前記吸着ノズルの下降により前記吸着ノズルに吸着保持している電子部品が載置される修正ステージと、この修正ステージ上に連動しながら互いに接離方向に移動可能に設けられて、互いに近接方向に移動するときに前記修正ステージ上の電子部品を前記吸着ノズルに対し互いの中央部が合致する相対位置で対向するよう両側から位置決めする少なくとも一対の位置修正部材とを備えていることを特徴とする。 In addition, the electronic component mounting device of the present invention recognizes an image of an electronic component sucked by a suction nozzle at a component suction position when the suction nozzle moves to the recognition position, so that the suction nozzle of the electronic component can be used. The amount of misalignment with respect to the central portion is obtained, and when the suction nozzle moves to the component mounting position, the component mounting portion of the circuit board is positioned at the correction position where the mounting position data of the electronic component is corrected by the amount of the misalignment. In an electronic component mounting device that faces an electronic component and mounts the electronic component on the component mounting portion by lowering the suction nozzle, the electronic component that is sucked and held by the suction nozzle is sucked and held before the image recognition is performed. , the suction nozzle with respect to providing a position correction unit for position correction so that the relative position that matches the central part of each other, the position correction unit, the relative position that matches the central portion of each other over the previous SL suction nozzle A correction stage on which electronic components that are opposed to each other and are sucked and held on the suction nozzle by lowering the suction nozzle are placed, and a correction stage that is interlocked with the correction stage and is provided so as to be movable in contact with each other. It is provided with at least a pair of position correction members that position the electronic components on the correction stage from both sides so as to face each other at a relative position where the central portions of the suction nozzles match each other when moving in the proximity direction to each other. It is characterized by.

上記電子部品の実装装置において、修正ステージは、ステージ駆動部により移動される受板部に固定されて、前記吸着ノズルが修正位置に移動する毎に前記ステージ駆動部の駆動により前記吸着ノズルに対し互いの中央部が合致する相対位置で対向するよう位置決めされるようになっている構成とすることができる。 In the mounting apparatus of the electronic component, amendments stage is fixed to the receiving plate portion which is moved by the stage driving unit, the suction nozzle by the driving of the stage drive unit each time the suction nozzle is moved to the corrected position On the other hand, the configuration may be such that the central portions of each other are positioned so as to face each other at the matching relative positions.

【００３１】
【発明の効果】
以上のように、本発明の電子部品の実装方法によれば、吸着ノズルに吸着保持されている電子部品を、画像認識前に、吸着ノズルに対し互いの中央部が合致する相対位置になるよう強制的に位置修正するようにしたので、吸着ノズルが部品装着位置に移動されたときに、回路基板の部品装着部は、電子部品の吸着ノズルに対する位置ずれが無いことから、位置ずれによる補正をされることなく予め設定された装着位置データに基づく位置に位置決めされるので、電子部品とこれを吸着保持する吸着ノズルとを共に回路基板の部品装着部に対し正確に相対向するよう位置決めできる。このため、電子部品が高密度に実装される場合においても、吸着ノズルが下降してこれに吸着している電子部品を回路基板の部品装着部に実装するときに、この部品装着部に隣接する部品装着部に実装済みの電子部品に吸着ノズルの端部が当接するといったことは生じることがないので、電子部品の実装不良を防止しながら電子部品を高密度に実装することができる。 0031
【Effect of the invention】
As described above, according to the mounting method of the electronic component of the present invention, the electronic part being sucked and held by the adsorption nozzle, before the image recognition, the relative position that matches the central portion of one another with respect to the suction nozzle When the suction nozzle is moved to the component mounting position, the component mounting part of the circuit board does not have a misalignment with respect to the suction nozzle of the electronic component, so the position is corrected by the misalignment. Since it is positioned at a position based on the preset mounting position data, both the electronic component and the suction nozzle that sucks and holds the electronic component can be positioned so as to accurately face each other with respect to the component mounting portion of the circuit board. .. Therefore, even when the electronic components are mounted at high density, when the suction nozzle is lowered and the electronic components sucked on the electronic components are mounted on the component mounting portion of the circuit board, the electronic components are adjacent to the component mounting portion. Since the end of the suction nozzle does not come into contact with the electronic component already mounted on the component mounting portion, the electronic component can be mounted at high density while preventing the mounting failure of the electronic component.

Claims

By recognizing the image of the electronic component sucked by the suction nozzle at the component suction position when the suction nozzle moves to the recognition position, the amount of positional deviation of the electronic component relative to the central portion of the suction nozzle is obtained,
When the suction nozzle moves to the component mounting position, the component mounting portion of the circuit board is positioned at a correction position in which the mounting position data of the electronic component is corrected by the amount of positional deviation, and is opposed to the electronic component.
In the electronic component mounting method of mounting the electronic component on the component mounting portion by lowering the suction nozzle,
The electronic components held by suction to the suction nozzle, after said central portion of one another with respect to the suction nozzle is by the Hare position fix becomes the relative position of the matching of electronic components and performs the image recognition Implementation method.

By recognizing the image of the electronic component sucked by the suction nozzle at the component suction position when the suction nozzle moves to the recognition position, the amount of positional deviation of the electronic component relative to the central portion of the suction nozzle is obtained,
When the suction nozzle moves to the component mounting position, the component mounting portion of the circuit board is positioned at a correction position in which the mounting position data of the electronic component is corrected by the amount of positional deviation, and is opposed to the electronic component.
In an electronic component mounting apparatus that mounts an electronic component on the component mounting portion by lowering the suction nozzle,
Before performing the image recognition, the electronic components held by suction to the suction nozzle, provided position correction unit for position correction so that the central portion of one another is a relative position that matches to the suction nozzle,
The position correction unit is pre SL is opposite to the relative position that matches the central portion of one another with respect to the suction nozzle, the correction stage which electronic components are sucked and held on the suction nozzle by the lowering of the suction nozzle is placed When,
Relative positions provided on the correction stage so as to be movable toward and away from each other, and when the electronic parts on the correction stage are moved toward each other, the center portions of the electronic parts are aligned with the suction nozzle. An electronic component mounting apparatus comprising: at least a pair of position correcting members positioned from both sides so as to face each other.

The correction stage is fixed to a receiving plate portion that is moved by a stage drive unit, and each time the suction nozzle moves to a correction position, the center portion of the correction stage matches the suction nozzle by driving the stage drive unit. The electronic component mounting apparatus according to claim 2, wherein the electronic component mounting apparatus is positioned so as to face each other.