JP2002252498A - Assembling device of electronic component - Google Patents

Assembling device of electronic component

Info

Publication number
JP2002252498A
JP2002252498A JP2001050863A JP2001050863A JP2002252498A JP 2002252498 A JP2002252498 A JP 2002252498A JP 2001050863 A JP2001050863 A JP 2001050863A JP 2001050863 A JP2001050863 A JP 2001050863A JP 2002252498 A JP2002252498 A JP 2002252498A
Authority
JP
Japan
Prior art keywords
mounting
board
printed circuit
circuit board
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001050863A
Other languages
Japanese (ja)
Inventor
Ryuichi Komatsu
Teruyuki Tomizawa
Yoshio Tomizawa
喜男 富沢
照亨 富沢
龍一 小松
Original Assignee
Sanyo Electric Co Ltd
Sanyo High Technology Co Ltd
三洋ハイテクノロジー株式会社
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo High Technology Co Ltd, 三洋ハイテクノロジー株式会社, 三洋電機株式会社 filed Critical Sanyo Electric Co Ltd
Priority to JP2001050863A priority Critical patent/JP2002252498A/en
Publication of JP2002252498A publication Critical patent/JP2002252498A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To save a space and cost by fixing a recognition camera, as well as other units, to the same fixing table. SOLUTION: A mounting table 21 moves in the X direction from an upstream side and stops at an image pickup station. A retaining member 16A of a board retainer 16 presses a printed board from an upper side and a positioning unit positions and fixes the printed board. An image of each positioning mark on the printed board is picked up by means of the recognition camera 8 while moving a fixing head 17 horizontally by turning screw shafts 5 and 13. The positional shift of the printed board is grasped by a recognition unit based on an image thus picked up and stored in a storage section. At a coating station or a mounting station, the position is corrected while taking account of the positional shift stored in the storage section and an electronic component is coated with adhesive by means of a coating nozzle or mounted by means of a suction nozzle.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は、載置テーブル上に
載置されたプリント基板に付された位置決めマークを撮
像する基板認識カメラが取付けられ水平方向に移動する
取付ヘッドを有する電子部品の組立装置に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to assembling an electronic component having a mounting head which is mounted on a board recognizing camera for picking up a positioning mark attached to a printed board mounted on a mounting table and which moves in a horizontal direction. It concerns the device.
【0002】[0002]
【従来の技術】従来の基板認識カメラの取付体は、プリ
ント基板に付された位置決めマークを撮像する基板認識
カメラしか取付けられていなかった。
2. Description of the Related Art Conventionally, a mounting body of a board recognition camera is provided with only a board recognition camera for imaging a positioning mark attached to a printed board.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、同一の
取付体に前記認識カメラのみ取付けるのでは、省スペー
ス化、省コスト化が図れないという問題がある。
However, if only the recognition camera is mounted on the same mounting body, there is a problem that space and cost cannot be reduced.
【0004】そこで本発明は、同一の取付体に前記認識
カメラに加えて、他の装置を取付けるようにして省スペ
ース化、省コスト化が図ることを目的とする。
Accordingly, an object of the present invention is to save space and cost by mounting another device in addition to the recognition camera on the same mounting body.
【0005】[0005]
【課題を解決するための手段】このため第1の発明は、
載置テーブル上に載置されたプリント基板に付された位
置決めマークを撮像する基板認識カメラが取付けられ水
平方向に移動する取付体に、前記プリント基板を上方か
ら押圧する基板押圧装置、前記プリント基板上に接着剤
を塗布する接着剤塗布装置、前記プリント基板の高さレ
ベルを検出する高さ検出装置のいずれか1以上を取付け
たことを特徴とする。
Means for Solving the Problems For this reason, the first invention provides
A board pressing device for pressing the printed board from above onto a mounting body to which a board recognition camera for capturing a positioning mark attached to a printed board mounted on a mounting table is mounted and moving in a horizontal direction; At least one of an adhesive application device for applying an adhesive and a height detection device for detecting a height level of the printed circuit board is mounted thereon.
【0006】第2の発明は、前記プリント基板の搬送方
向と直交する方向に駆動モータにより前記取付体を移動
可能としたことを特徴とする。
A second invention is characterized in that the mounting body can be moved by a drive motor in a direction perpendicular to the direction of transport of the printed circuit board.
【0007】[0007]
【発明の実施の形態】以下本発明の一実施形態について
説明する。2はチップ状の電子部品の組立装置1の基台
で、該基台2の上部にはX軸駆動モータ3によりカップ
リング4を介して回動するネジ軸5が嵌合するナット体
6を案内するリニアガイド7が設けられている。10は
前記ナット体6に固定されたフレームで、Y軸駆動モー
タ11によりカップリング12を介して回動するネジ軸
13が嵌合するナット体14を案内するリニアガイド1
5が前記フレーム10に設けられている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Reference numeral 2 denotes a base of the chip-shaped electronic component assembling apparatus 1, and a nut body 6 to which a screw shaft 5 rotated via a coupling 4 by an X-axis drive motor 3 is fitted on an upper portion of the base 2. A linear guide 7 for guiding is provided. Reference numeral 10 denotes a frame fixed to the nut body 6, and a linear guide 1 for guiding a nut body 14 into which a screw shaft 13 rotated by a Y-axis drive motor 11 via a coupling 12 is fitted.
5 is provided on the frame 10.
【0008】そして、前記ナット体14には後述の認識
カメラ8及び基板押圧装置16が設けられる取付ヘッド
17が固定される。前記認識カメラ8は後述の載置テー
ブル21上に載置されたプリント基板19に付された位
置決めマーク20を撮像するもので、認識処理装置(図
示せず)により前記撮像された画像に基づいてプリント
基板19の位置ズレを把握する。前記基板押圧装置16
は前記プリント基板19を公知の位置決め装置(図示せ
ず)により位置決め固定する際に上方から押圧するもの
で、シリンダーで構成されロッド先端に合成樹脂製の押
さえ部材16Aが設けられている。
A mounting head 17 provided with a recognition camera 8 and a substrate pressing device 16 to be described later is fixed to the nut body 14. The recognition camera 8 captures an image of a positioning mark 20 attached to a printed circuit board 19 mounted on a mounting table 21, which will be described later, and based on an image captured by a recognition processing device (not shown). The displacement of the printed circuit board 19 is grasped. The substrate pressing device 16
When the printed circuit board 19 is positioned and fixed by a known positioning device (not shown), the printed circuit board 19 is pressed from above, and is constituted by a cylinder, and a pressing member 16A made of synthetic resin is provided at the tip of the rod.
【0009】尚、本実施形態では採用していないが、取
付ヘッド17に前記プリント基板19上に接着剤を塗布
する接着剤塗布装置や、前記プリント基板19の高さレ
ベルを検出する反射型センサ等の高さ検出装置を設けて
もよい。この場合、複数箇所を高さ検出装置で検出して
記憶部に記憶されたその高さレベルに応じて、前記接着
剤塗布装置の上下動可能な塗布ノズルや装着装置の吸着
ノズルのプリント基板19への押圧力を変えるようにす
るものである。
Although not employed in the present embodiment, an adhesive application device for applying an adhesive to the mounting board 17 on the printed circuit board 19 or a reflection type sensor for detecting the height level of the printed circuit board 19 Etc., a height detecting device may be provided. In this case, a plurality of locations are detected by the height detecting device, and according to the height levels stored in the storage unit, the vertically movable application nozzle of the adhesive application device and the printed circuit board 19 of the suction nozzle of the mounting device. To change the pressing force.
【0010】尚、この接着剤塗布装置は、シリンジ内の
接着剤を塗布する型式のものでも、転写型のものでもよ
い。
The adhesive application device may be of a type for applying an adhesive in a syringe or a transfer type.
【0011】そして、21は1枚又は複数枚(本実施形
態では2枚)の前記プリント基板19を載置する載置テ
ーブルで、載置したままプリント基板19を下流側の塗
布及び装着ステーションに搬送するものである。即ち、
図示しない駆動源により本組立装置1に固定された一対
のレール22に下部のガイド23が案内されてカメラ8
による撮像後、X方向に前記載置テーブル21が移動
し、下流側の塗布及び装着ステーションにレール24を
介して搬送する構成である。
Reference numeral 21 denotes a mounting table on which one or a plurality of (two in the present embodiment) printed boards 19 are mounted. It is to be transported. That is,
A lower guide 23 is guided by a pair of rails 22 fixed to the assembling apparatus 1 by a drive source (not shown) to
After the imaging by, the placing table 21 described above moves in the X direction, and is conveyed via the rail 24 to the coating and mounting station on the downstream side.
【0012】以上のような構成により、以下動作につい
て説明する。先ず、上流側からレール22にガイド23
が案内されて載置テーブル21がX方向に移動して、該
レール22の流れ方向の中央部、即ち撮像ステーション
に停止する。次いで、基板押圧装置16の押さえ部材1
6Aが前記プリント基板19を上方から押圧し、位置決
め装置(図示せず)により位置決め固定するが、プリン
ト基板19は2枚なので、一方の基板19を押圧し、位
置決め固定したら、X軸駆動モータ3及びY軸駆動モー
タ11を駆動してネジ軸5及び13を回動して取付ヘッ
ド17を水平移動させ、他方のプリント基板19を上方
から押圧し、位置決め固定するものである。
The operation of the above configuration will be described below. First, a guide 23 is attached to the rail 22 from the upstream side.
Is guided, the mounting table 21 moves in the X direction, and stops at the center of the rail 22 in the flow direction, that is, at the imaging station. Next, the holding member 1 of the substrate pressing device 16
6A presses the printed circuit board 19 from above and positions and fixes the printed circuit board 19 with a positioning device (not shown). Since there are two printed circuit boards 19, when one of the substrates 19 is pressed and positioned and fixed, the X-axis drive motor 3 And the Y-axis drive motor 11 is driven to rotate the screw shafts 5 and 13 to move the mounting head 17 horizontally, and to press and fix the other printed circuit board 19 from above.
【0013】次に、前述したように位置決め固定した状
態で、同様にX軸駆動モータ3及びY軸駆動モータ11
を駆動してネジ軸5及び13を回動して取付ヘッド17
を水平移動させつつ、2枚のプリント基板19の各位置
決めマーク20を認識カメラ8で撮像する。そして、認
識処理装置(図示せず)により前記撮像された画像に基
づいてプリント基板19の位置ズレを把握する。
Next, the X-axis driving motor 3 and the Y-axis driving motor 11
Is driven to rotate the screw shafts 5 and 13 to mount the mounting head 17.
Are horizontally moved, the respective positioning marks 20 of the two printed circuit boards 19 are imaged by the recognition camera 8. Then, a position shift of the printed circuit board 19 is grasped based on the captured image by a recognition processing device (not shown).
【0014】更に、この認識処理装置が把握した位置ズ
レ量を図示しない記憶部が記憶し、プリント基板19を
位置決め固定した状態の載置テーブル21を下流側にレ
ール24を介して搬送し、下流側の塗布ステーションや
電子部品の装着ステーションにおいて、前記記憶部に記
憶されたズレ量を加味して補正して塗布ノズルによる接
着剤の塗布や装着装置の吸着ノズルにより電子部品の装
着をする。
Further, a storage unit (not shown) stores the positional deviation amount grasped by the recognition processing device, and conveys the mounting table 21 in a state where the printed circuit board 19 is positioned and fixed to the downstream side via the rail 24, and In the application station or the electronic component mounting station on the side, the electronic component is mounted by applying the adhesive by the application nozzle or by the suction nozzle of the mounting device after making corrections in consideration of the deviation amount stored in the storage unit.
【0015】尚、この取付ヘッド17にプリント基板1
9の高さレベルを検出する反射型センサ等の高さ検出装
置を更に設けた場合には、撮像ステーションで前記複数
箇所を高さ検出装置で検出して記憶部に記憶されたその
高さレベルに応じて、下流側の塗布ステーションや電子
部品の装着ステーションにおいて、前記接着剤塗布装置
の上下動可能な塗布ノズルや装着装置の吸着ノズルのプ
リント基板19への押圧力を変えるようにするものであ
る。
Incidentally, the printed board 1 is attached to the mounting head 17.
In the case where a height detecting device such as a reflection type sensor for detecting the height level of 9 is further provided, the plurality of locations are detected by the height detecting device at the imaging station, and the height levels stored in the storage section are stored. The pressing force of the adhesive nozzle of the adhesive coating device and the suction nozzle of the mounting device on the printed circuit board 19 is changed at the downstream application station or the electronic component mounting station in accordance with the following. is there.
【0016】更に、高さ検出装置に加えて取付ヘッド1
7に接着剤塗布装置を設けた場合には、撮像ステーショ
ンで前記複数箇所を高さ検出装置で検出して記憶部に記
憶されたその高さレベルに応じて、当該撮像ステーショ
ンで前記接着剤塗布装置の上下動可能な塗布ノズルのプ
リント基板19への押圧力を変えて塗布し、下流側の電
子部品の装着ステーションにおいて装着装置の吸着ノズ
ルのプリント基板19への押圧力を変えて電子部品を装
着するものである。
Further, in addition to the height detecting device, the mounting head 1
In the case where the adhesive application device is provided in 7, the plurality of locations are detected by the height detection device in the imaging station, and the adhesive application is performed in the imaging station in accordance with the height level stored in the storage unit. The application is performed by changing the pressing force of the application nozzle that can be moved up and down on the printed circuit board 19, and the electronic component is changed by changing the pressing force of the suction nozzle of the mounting device on the printed circuit board 19 at the downstream mounting station of the electronic component. It is to be attached.
【0017】以上本発明の実施態様について説明した
が、上述の説明に基づいて当業者にとって種々の代替
例、修正又は変形が可能であり、本発明はその趣旨を逸
脱しない範囲で前述の種々の代替例、修正又は変形を包
含するものである。
Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited to the above various embodiments without departing from the spirit thereof. It is intended to cover alternatives, modifications or variations.
【0018】[0018]
【発明の効果】以上のように本発明は、同一の取付体に
プリント基板に付された位置決めマークを撮像する認識
カメラに加えて、前記プリント基板を上方から押圧する
基板押圧装置、前記プリント基板上に接着剤を塗布する
接着剤塗布装置、前記プリント基板の高さレベルを検出
する高さ検出装置のいずれか1以上を取付けたから、省
スペース化、省コスト化を図ることができる。
As described above, the present invention provides a board pressing device for pressing the printed board from above, in addition to a recognition camera for picking up a positioning mark attached to the printed board on the same mounting body, and the printed board. Since at least one of an adhesive application device for applying an adhesive and a height detection device for detecting the height level of the printed circuit board is attached, space saving and cost saving can be achieved.
【図面の簡単な説明】[Brief description of the drawings]
【図1】組立装置の正面図を示す。FIG. 1 shows a front view of an assembling apparatus.
【図2】組立装置の左側面図を示す。FIG. 2 shows a left side view of the assembling apparatus.
【図3】組立装置の平面図を示す。FIG. 3 shows a plan view of the assembly device.
【符号の説明】[Explanation of symbols]
1 組立装置 3 X軸駆動モータ 8 認識カメラ 11 Y軸駆動モータ 16 基板押圧装置 17 取付ヘッド 19 プリント基板 20 位置決めマーク 21 載置テーブル DESCRIPTION OF SYMBOLS 1 Assembling apparatus 3 X-axis drive motor 8 Recognition camera 11 Y-axis drive motor 16 Substrate pressing device 17 Mounting head 19 Printed circuit board 20 Positioning mark 21 Mounting table
───────────────────────────────────────────────────── フロントページの続き (72)発明者 富沢 喜男 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 (72)発明者 小松 龍一 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 Fターム(参考) 3C030 DA23 DA36 DA37 4F042 AA02 AA06 AB01 BA08 DF07 DF16 ED05 5E313 AA01 AA11 CC04 EE03 EE33 FF12 FF24 FF28 FF32 FG05 5E319 AC01 CC61 CD04 CD27 CD35 GG15  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Yoshio Tomizawa 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Ryuichi Komatsu 2-5-2 Keihanhondori, Moriguchi-shi, Osaka No. 5 Sanyo Electric Co., Ltd. F term (reference) 3C030 DA23 DA36 DA37 4F042 AA02 AA06 AB01 BA08 DF07 DF16 ED05 5E313 AA01 AA11 CC04 EE03 EE33 FF12 FF24 FF28 FF32 FG05 5E319 AC01 CC61 CD04 CD27 CD35 GG15

Claims (2)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 載置テーブル上に載置されたプリント基
    板に付された位置決めマークを撮像する基板認識カメラ
    が取付けられ水平方向に移動する取付体に、前記プリン
    ト基板を上方から押圧する基板押圧装置、前記プリント
    基板上に接着剤を塗布する接着剤塗布装置、前記プリン
    ト基板の高さレベルを検出する高さ検出装置のいずれか
    1以上を取付けたことを特徴とする電子部品の組立装
    置。
    1. A board pressing device for pressing a printed board from above on a mounting body to which a board recognition camera for capturing a positioning mark attached to a printed board mounted on a mounting table is mounted and which moves in a horizontal direction. A device for assembling an electronic component, comprising at least one of a device, an adhesive application device for applying an adhesive on the printed circuit board, and a height detecting device for detecting a height level of the printed circuit board.
  2. 【請求項2】 前記プリント基板の搬送方向と直交する
    方向に駆動モータにより前記取付体を移動可能としたこ
    とを特徴とする請求項1に記載の電子部品の組立装置。
    2. The electronic component assembling apparatus according to claim 1, wherein said mounting body is movable by a drive motor in a direction orthogonal to a direction in which said printed circuit board is transported.
JP2001050863A 2001-02-26 2001-02-26 Assembling device of electronic component Pending JP2002252498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001050863A JP2002252498A (en) 2001-02-26 2001-02-26 Assembling device of electronic component

Publications (1)

Publication Number Publication Date
JP2002252498A true JP2002252498A (en) 2002-09-06

Family

ID=18911757

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002252498A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086357A (en) * 2004-09-16 2006-03-30 Shibuya Kogyo Co Ltd Electronic component assembly method
JP2008135577A (en) * 2006-11-28 2008-06-12 Fuji Mach Mfg Co Ltd Device for holding printed board
KR101104604B1 (en) 2009-07-23 2012-01-12 박환승 Nut automatic insertion machinery for LCD/PDP base panel
JP2014078566A (en) * 2012-10-09 2014-05-01 Yamaha Motor Co Ltd Substrate work device and substrate work method
CN106334657A (en) * 2016-11-07 2017-01-18 广东贝贝机器人有限公司 Adhesive-dispensing and pressure-maintaining curing device and method
CN109465631A (en) * 2018-12-18 2019-03-15 苏州镭拓精工机械科技有限公司 A kind of streamline product height detection apparatus

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JPH06112696A (en) * 1992-09-29 1994-04-22 Sanyo Electric Co Ltd Positioning equipment for board
JPH0677298U (en) * 1993-03-30 1994-10-28 三洋電機株式会社 Printed circuit board assembly equipment
JPH07303000A (en) * 1994-05-06 1995-11-14 Matsushita Electric Ind Co Ltd Method and apparatus for mounting of ic component
JPH0983121A (en) * 1995-09-13 1997-03-28 Yamagata Casio Co Ltd Electronic part mounting method and device and board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106099A (en) * 1992-09-29 1994-04-19 Sanyo Electric Co Ltd Coating device
JPH06112695A (en) * 1992-09-29 1994-04-22 Sanyo Electric Co Ltd Positioning equipment for board
JPH06112696A (en) * 1992-09-29 1994-04-22 Sanyo Electric Co Ltd Positioning equipment for board
JPH0677298U (en) * 1993-03-30 1994-10-28 三洋電機株式会社 Printed circuit board assembly equipment
JPH07303000A (en) * 1994-05-06 1995-11-14 Matsushita Electric Ind Co Ltd Method and apparatus for mounting of ic component
JPH0983121A (en) * 1995-09-13 1997-03-28 Yamagata Casio Co Ltd Electronic part mounting method and device and board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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