JP2000114796A - Structure and method for positioning circuit board and adhesive-supplying device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To preventing the deterioration of the positioning operation of a circuit board and adverse influence to the bonding performance of electronic parts by preventing the occurrence of flash rubbish or a powder foreign matters due to the positioning operation of the circuit board. SOLUTION: Structure 16 for positioning a circuit board is provided with a circuit board 14 that has a reference hole 14a for positioning, a substrate placement member 84 that places the circuit board 14, a substrate-positioning member 18 that is fitted to the reference hole 14a for positioning the circuit board 14, and a cover member 72 that is provided while being freely opened and closed and presses down the circuit board 14 at a part to the substrate placement member 84 by changing from opening to closing state. In this case, as the positioning member 18, a spherical member for fitting to the reference hole 14a is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive supply device for supplying an adhesive for adhering an electronic component such as an integrated circuit chip to a predetermined position on a circuit board such as a printed wiring board. The present invention relates to a circuit board positioning structure and a positioning method used for positioning a circuit board, and an adhesive supply device using the same.

[0002]

2. Description of the Related Art As a conventional circuit board positioning structure, for example, there is a table structure 66 used in an adhesive supply device 50 as shown in FIGS. In the adhesive supply device 50 shown in the figure, an adhesive dispenser 54 is supported on the arch-shaped support structure 52, and the adhesive dispenser 54 moves in the X direction along a horizontal portion 56 of the arch-shaped support structure 52. Possible and lifting device 58
Is provided so as to be able to ascend and descend in the Z direction. The adhesive dispenser 54 includes an adhesive supply unit 6.
From 0, an adhesive such as a synthetic resin is supplied.

The arch-shaped support structure 52 is erected on a box-shaped work transfer base frame 62 without a lid. In the work transfer base frame 62, a circuit board 14 described later is placed. The table structure 66 thus positioned is movable in the Y direction orthogonal to each of the X and Z directions, and is stopped and fixed at a predetermined position below the nozzle 54a of the adhesive dispenser 54. I have. When the adhesive dispenser 54 moves in the X and Z directions to complete the final positioning, the adhesive dropped from the nozzle 54a is supplied to a predetermined position on the circuit board 14.

Next, a table structure 66 will be described with reference to FIGS. The table structure 66 includes a main body block 68 constituting a base portion, and the main body block 6.
8 is provided with a cover block 72 that rotates about a fulcrum pin 70 to open and close, and a lock mechanism 74 that fixes the cover block 72 so that it does not open when closed.

The lock mechanism 74 includes a main body block 68
The cover member 72 can be fixed so as not to open by engaging the claw member 76 rotatably provided on the cover block 72 with the opening 78 formed at the bent front end portion of the cover block 72. ing.

The middle plate 80 of the main body block 68 has four rough positioning pins 82 for roughly positioning the circuit board 14 such as a printed circuit board, and the circuit board 14.
Four substrate mounting pins 8 which abut against the lower surface of the
4 and two locating pins 86 which are fitted into the reference holes 14a of the circuit board 14 to finally position the circuit board 14 are provided upright.

At a position corresponding to the position between the two locate pins 86 of the cover block 72, a square working hole 8 is provided.
8 is formed, and the adhesive discharged from the nozzle 54a of the adhesive dispenser 54 is applied to the adhesive portion B of the circuit board 14 which can be seen from the working hole 88, and is integrated on the adhesive portion B in a later step. Electronic components such as circuit chips are bonded.

[0008]

However, in such a conventional circuit board positioning structure, the locate pin 86 is fitted into the reference hole 14a of the circuit board 14 to position the circuit board 14. As a result, due to long-term use, there may be no voids coming out of the corner between the peripheral surface of the reference hole 14a and the plane of the circuit board 14, and powdery foreign substances scraped by the locating pin 86 from the peripheral surface of the reference hole 14a. The locating pin 86 is attached to the peripheral surface of the locating pin 86, and the locating pin 86 becomes thicker. As a result, the locating pin 86 becomes difficult to enter the reference hole 14a, thereby deteriorating the positioning operation. Therefore, the adhesive performance of the electronic component may be adversely affected.

SUMMARY OF THE INVENTION In view of the above problems, the present invention prevents the occurrence of burrs and powdery foreign substances due to the positioning operation of a circuit board, thereby deteriorating the positioning operation of the circuit board and adhering electronic components. An object of the present invention is to provide a circuit board positioning structure and a positioning method, and an adhesive supply device using the same, which can prevent the performance from being adversely affected.

[0010]

In order to solve the above-mentioned problems, a circuit board positioning structure according to the present invention comprises a circuit board having a reference hole used for positioning, and a board mount for mounting the circuit board. A mounting member, a board positioning member for positioning the circuit board by fitting into the reference hole, and a circuit board mounted on the main body so as to be openable and closable to change the circuit board from the open state to the board mounting member. And a cover member to be held between the circuit board and the cover member, wherein a spherical member fitted into the reference hole is used as the positioning member.

According to the circuit board positioning structure having such a configuration, the circuit board is mounted on the board mounting member, the reference hole is fitted into the spherical member, and the cover member is closed to close the circuit board. Since the positioning of the circuit board can be completed by holding the board between the board mounting member, the spherical member does not slide with the reference hole unlike the locating pin. It is possible to prevent the occurrence of the above-mentioned burrs and powdery foreign substances, thereby preventing the positioning operation of the circuit board from deteriorating and adversely affecting the adhesive performance of the electronic component.

[0012]

Embodiments of the present invention will be specifically described below with reference to the drawings. 1 to 5
FIG. 1 is a diagram referred to for describing a first embodiment of a circuit board positioning structure and a positioning method according to the present invention, and an adhesive supply device using the same.

First, an adhesive supply device 5 shown in FIGS.
0 will be described. In the adhesive supply device 50 shown in the figure, an adhesive dispenser 54 (adhesive supply means) is supported on the arch-shaped support structure 52, and the adhesive dispenser 54 is attached to a horizontal portion 56 of the arch-shaped support structure 52. Along the X direction, and can be moved up and down in the Z direction by the elevating device 58. In the adhesive dispenser 54, an adhesive supply unit 60 is provided.
, An adhesive such as a synthetic resin is supplied.

The arch-shaped support structure 52 is erected on a box-shaped work transfer base frame 62 without a lid. In the work transfer base frame 62, a circuit board 14 described later is placed. The table structure 16 thus positioned is movable in the Y direction orthogonal to each of the X and Z directions, and is stopped and fixed at a predetermined position below the nozzle 54a of the adhesive dispenser 54. I have. When the adhesive dispenser 54 moves in the X and Z directions to complete the final positioning, the adhesive dropped from the nozzle 54a is supplied to a predetermined position on the circuit board 14.

Next, the table structure 16 (circuit board positioning structure) will be described with reference to FIGS. The table structure 16 includes a main body block 68 (main body) that forms a base portion, and a cover block 72 that rotates about a fulcrum pin 70 to open and close the main body block 68.
(Cover member) and a lock mechanism 74 for fixing the cover block 72 so as not to open when the cover block 72 is closed.

The lock mechanism 74 is provided with a main body block 68.
The cover member 72 can be fixed so as not to open by engaging the claw member 76 rotatably provided on the cover block 72 with the opening 78 formed at the bent front end portion of the cover block 72. ing.

On the middle plate 80 of the main body block 68, four rough positioning pins 82 for roughly positioning the circuit board 14 such as a printed wiring board, and the circuit board 14
Four substrate mounting pins 8 which abut against the lower surface of the
2 (a board mounting member) and a positioning ball member 18 (a board positioning member, a spherical member) that fits into the reference hole 14a of the circuit board 14 and finally positions the circuit board 14. Structure 20 stands.

A rectangular work hole 88 is formed in the cover block 72 at a position corresponding to the position between the two positioning ball support structures 20. The work hole 88 is formed at the bonding portion B of the circuit board 14 visible through the work hole 88. The adhesive discharged from the nozzle 54a of the adhesive dispenser 54 is applied, and an electronic component such as an integrated circuit chip is bonded to the bonding portion B in a later step.

The upper end of the positioning ball support structure 20
As shown in FIG. 3, a ball support 22 to which a positioning ball member 18 such as a steel ball is integrally fixed is constantly pressed upward in the figure by a compression spring 24, and the ball support 22 is a cylindrical case. 26 is slidably accommodated in the axial direction, and has a notch 22a of the ball support 22.
Abuts against the inner reduced diameter portion 26 a of the cylindrical case 26, so that the ball support portion 22 is pressed by the compression spring 24 so as not to come out of the cylindrical case 26.

As shown, the positioning ball member 18
Is fitted into the reference hole 14a of the circuit board 14 and
When positioning the circuit board 14, the cover block 72 is closed and the circuit board 14 is held down by pressing the circuit board 14 downward in the drawing.
Notch 22a is formed in the inner reduced diameter portion 2
Slightly descend away from 6a.

According to such an embodiment, since the positioning of the circuit board 14 is performed by fitting the positioning ball member 18 into the reference hole 14a, the position of the peripheral surface of the reference hole 14a differs from that of the conventional locate pin 86. Since there is no sliding, the reference hole 14a is formed in the peripheral surface of the positioning ball member 18.
Is unlikely to adhere to the corner holes.
Since the powdery foreign matter is not scraped off from the peripheral surface of the positioning ball member 18a,
Is less likely to adhere to the peripheral surface.

Further, since powdery foreign matter is not scraped off from the peripheral surface of the reference hole 14a, such powdery foreign matter falls on the bonding portion B of the circuit board 14 and adversely affects the bonding performance of the electronic component. Also does not affect. Therefore, according to the present embodiment, the positioning operation of the circuit board 14 can be prevented from generating the burrs and the powdery foreign substances as in the related art, and the positioning operation of the circuit board 14 can be deteriorated, Adverse effects on the adhesion performance can be prevented.

Further, by fixing the circuit board 14 on the board mounting pins 84 by the cover block 72, the circuit board 14 is positioned in a state where the flatness of the circuit board 14 is improved. It is possible to perform accurate positioning.

Before the circuit board 14 is fixed by the cover block 72, the circuit block 14 is pressed down by the cover block 72 even if the reference hole 14a is not directly above the positioning ball member 18 (even if it is slightly shifted). As a result, the corner portion of the reference hole 14a slides along the spherical surface of the positioning ball member 18, and the reference hole 14a finally fits accurately into the positioning ball member 18, so that the circuit board 1
4 can be positioned.

Also, since positioning is performed by the combination of the positioning ball member 18 and the cover block 72, foreign substances are unlikely to fall onto the circuit board 14 from the outside, so that foreign substances are less likely to adhere to the bonding portion B of the circuit board 14. it can.

In the above embodiment, the case where the present invention is applied to the adhesive supply device has been described.
The present invention is not limited to the adhesive supply device, and can be applied to any device other than the adhesive supply device as long as it is necessary to position the circuit board.

In the above embodiment, the cover block 72 is attached to the main body block 68 of the table structure 16.
However, the description has been given of the case in which the opening and closing operation is performed by rotating about the fulcrum pin 70.
2 does not need to be limited to the case of rotating and opening and closing,
You may comprise so that it may open and close by moving up and down.

Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and based on the technical idea of the present invention, various other embodiments are possible. Can be changed.

[0029]

As described above, according to the present invention,
The circuit board is placed on the board placing member, the reference hole is fitted into the spherical member, and the cover member is closed to suppress the circuit board between the board placing member, thereby forming the circuit board. Since the positioning can be completed, the spherical member does not slide with the reference hole like the locating pin. It is possible to prevent the positioning operation of the substrate from being deteriorated and the adhesive performance of the electronic component from being adversely affected.

[Brief description of the drawings]

FIG. 1 is a side sectional view schematically showing a configuration of a table structure 16 according to a first embodiment of the present invention.

FIG. 2 is a top view of the table structure 16 in FIG.

FIG. 3 is a partially enlarged cross-sectional side view for explaining the configuration and operation of the upper end portion of the positioning ball support structure 20.

FIG. 4 is a schematic side view of an adhesive supply device 50 using the table structure 16 in FIG. 1 or a conventional table structure 66.

FIG. 5 is a view on arrow V of the adhesive supply device 50 in FIG. 4;

FIG. 6 is a side sectional view schematically showing a configuration of a conventional table structure 66.

FIG. 7 is a top view of the table structure 66 in FIG.

[Explanation of symbols]

14 circuit board, 14a reference hole, 16 table structure, 18 positioning ball member, 20 positioning ball support structure, 22 ball support portion, 22a notch portion, 2
4 ... Compression spring, 26 ... Cylindrical case, 26a ... Inner reduced diameter part, 50 ... Adhesive supply device, 52 ... Arch support structure, 54 ... Adhesive dispenser, 54a ... Nozzle, 5
6 horizontal part, 58 lifting device, 60 adhesive supply part, 6
2 ... work transport base frame, 66 ... table structure, 68 ... body block, 70 ... fulcrum pin, 72 ... cover block,
74: locking mechanism, 76: claw member, 78: opening, 80:
Middle plate, 82: approximate positioning pin, 84: substrate mounting pin, 86: locate pin, 88: working hole, B: adhesive part

Claims (3)

[Claims] A circuit board having a reference hole used for positioning; a board mounting member for mounting the circuit board; and a board positioning for positioning the circuit board by fitting into the reference hole. A positioning member for the circuit board, comprising: A positioning structure for a circuit board, wherein a spherical member fitted into the reference hole is used. 2. A circuit board having a reference hole used for positioning, a board mounting member for mounting the circuit board, and a board positioning for positioning the circuit board by fitting into the reference hole. In a circuit board positioning structure, comprising: a member; and a cover member that is provided on the main body so as to be openable and closable and is held from the open state to the closed state to hold the circuit board between the substrate mounting member. Using a circuit board positioning structure using a spherical member that fits into the reference hole, the circuit board is placed on the substrate mounting member, and the reference hole is fitted into the spherical member, The positioning of the circuit board can be completed by holding the circuit board between the cover member and the board mounting member when the cover member is closed. The method of positioning the circuit board, wherein. 3. A circuit board having a reference hole used for positioning, a board mounting member for mounting the circuit board, and a board positioning for positioning the circuit board by fitting into the reference hole. And a cover member provided on the main body so as to be openable and closable to suppress the circuit board between the board mounting member by being changed from an open state to a closed state, and fitted into the positioning hole in the positioning member. An adhesive supply device, comprising: a circuit board positioning structure using a spherical member to be formed; and an adhesive supply means for supplying an adhesive onto the circuit board.