JP2000106269A - Heat exchanger for heating reaction gas for semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heating efficiency of a cartridge heater by spirally, densely winding two heat resistant pipes, through which reaction gas flows on the surface of the cartridge heater, controlling the electric power supplying to the cartridge heater, and controlling the temperature of the cartridge heater. SOLUTION: Two heat resistant metal pipes 2, having connecting fixture 1 at the opposite ends, are densely wound on the surface of a rod-shaped cartridge heater 3 to use as a heat exchanging element 4. A temperature sensor 5 contained in the cartridge heater 3 is connected to a temperature controller 6 to control the temperature of the cartridge heater 3. A heat insulating material 7 is arranged in the surrounding of the heat exchanging element 4, and they are housed in a case 9 which contains a control device 8 for controlling the electric power supplied to the cartridge heater 3. The temperature controller 6 is set at a temperature determined by the kind and flow rate of reaction gas, a power source is turned on, the temperature of the cartridge heater 3 is raised, and reaction gas is fully heated inside the densely wound metal pipes 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat exchanger for heating a fluid, and more particularly, to a heat exchanger for cooling a reaction gas in a fluid heating pipe to prevent crystallization or liquefaction in a semiconductor manufacturing apparatus. It is about a vessel.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, in order to prevent a reaction gas from being cooled and liquefied in a fluid heating pipe, various kinds of heaters are attached to the pipe to heat the reaction gas, and the temperature of the reaction gas is reduced to a liquefaction temperature. What is raised above is known, for example, as disclosed in Japanese Patent Application Laid-Open No. Hei 9-17555.

[0003]

However, in the prior art, a relatively long pipe is required in order to sufficiently exchange heat to a required temperature. In addition, the piping is installed between the reaction gas supply tank and the reaction furnace, and it interferes with various devices, etc., so its shape is complicated, and it is protected by a metal case. Installation work is extremely difficult.

[0004] For example, when a belt-shaped heater is attached to a pipe, a large number of parts must be fixed with a binding band in order to fix the heater to the pipe. The removed heater has a problem that it cannot be reused because it is hardened by heat. When a heating element as disclosed in JP-A-9-17555 is used, if the pipes are close to each other, or if the pipe and the metal case are close to each other, the heater element cannot be attached or removed, or The required temperature may not be obtained. Furthermore, because the range of mounting the heater is wide,
A large number of heaters are required, and there are problems such as a large heat dissipation area and poor heating efficiency.

The present invention has been made to eliminate the above disadvantages.

[0006]

SUMMARY OF THE INVENTION A heat exchanger for fluid heating according to the present invention comprises a heat-resistant tube through which a fluid to be heat-exchanged flows, and a cartridge heater having a surface around which the heat-resistant tube is spirally wound. It is characterized by using an element.

Further, the heat exchanger for fluid heating of the present invention is provided with a heat insulating material provided around the heat exchange element, a control device for controlling electric power supplied to the cartridge heater, and a heat exchanger attached to the heat exchange element. It is characterized by comprising a temperature sensor, a temperature controller for controlling the temperature of the cartridge heater, and a case in which these are installed.

[0008] A plurality of the heat-resistant tubes wound around the cartridge heater are characterized in that they are provided.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

In the present invention, as shown in FIG. 1, a heat-exchange element 4 is a heat-resistant metal tube 2 having connection fittings 1 attached to both ends and spirally tightly wound around the surface of a rod-shaped cartridge heater 3. Used.

The cartridge heater 3 has a built-in temperature sensor 5 such as a thermocouple, and the temperature sensor 5 is connected to a temperature controller 6 to control the temperature of the heater 3. Further, a temperature sensor (not shown) is attached to the metal tube 2 to monitor the temperature of the metal tube 2. A heat insulating material 7 such as alumina or silica is provided around the heat exchange element 4, and these are installed in a case 9 having a built-in control device 8 such as SSR for controlling the power supplied to the heater 3.

One of the metal fittings 1 attached to both ends of the metal tube 2 is connected to a reaction gas supply tank, and the other is connected to a port of a reaction furnace.

Since the heat exchanger for fluid heating of the present invention has the above-described configuration, the temperature controller is set to a temperature determined by the type and flow rate of the reaction gas and the like. As the temperature rises, the fluid is sufficiently heated in the spirally wound metal tube 2.

When heating two systems simultaneously, such as when there are two types of reaction gas, one cartridge heater 3
Two metal tubes 2 are wound around and heated.

[0015]

As described above, the heat exchanger for fluid heating according to the present invention has a structure in which the heat-resistant metal tube is closely wound around the surface of the cartridge heater, so that the heat of the heater is efficiently converted into the fluid in the metal tube. It can be absorbed, and if multiple metal tubes are wrapped around one cartridge heater, all the metal tubes can be heated with one cartridge heater. When heating a plurality of gases at the same time without restriction, there are various advantages such as space saving.

[Brief description of the drawings]

FIG. 1 is a plan view of a heat exchanger for heating fluid of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection metal fitting 2 Metal tube 3 Cartridge heater 4 Heat exchange element 5 Temperature sensor 6 Temperature controller 7 Insulation material 8 Control device 9 Case

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[Procedure amendment]

[Submission date] August 23, 1999 (1999.8.2
3)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

Title: Heat exchanger for heating reaction gas for semiconductor manufacturing equipment

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing device.
In a heat exchanger for heating a reaction gas, particularly, in a semiconductor manufacturing apparatus, a plurality of reaction gases are cooled in a pipe for fluid heating,
The present invention relates to a heat exchanger for heating for preventing crystallization or liquefaction.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, in order to prevent a reaction gas from being cooled and liquefied in a fluid heating pipe, various kinds of heaters are attached to the pipe to heat the reaction gas, and the temperature of the reaction gas is reduced to a liquefaction temperature. What is raised above is known, for example, as disclosed in Japanese Patent Application Laid-Open No. Hei 9-17555.

[0003]

However, in the prior art, a relatively long pipe is required in order to sufficiently exchange heat to a required temperature. In addition, the piping is installed between the reaction gas supply tank and the reaction furnace, and it interferes with various devices, etc., so its shape is complicated, and it is protected by a metal case. Installation work is extremely difficult.

[0004] For example, when a belt-shaped heater is attached to a pipe, a large number of parts must be fixed with a binding band in order to fix the heater to the pipe. The removed heater has a problem that it cannot be reused because it is hardened by heat. When a heating element as disclosed in JP-A-9-17555 is used, if the pipes are close to each other, or if the pipe and the metal case are close to each other, the heater element cannot be attached or removed, or The required temperature may not be obtained. Furthermore, because the range of mounting the heater is wide,
A large number of heaters are required, and there are problems such as a large heat dissipation area and poor heating efficiency.

[0005] Also, Japanese Utility Model Publication No. 4-4393 discloses
Liquid heating device is also known, but as shown in FIG.
Is space-wound with a liquid suction / discharge pipe around the rod-shaped heat conductor.
The heat transfer efficiency is extremely poor due to the
FIG. 2 in which the circumference and side surfaces are heated by a heat conductor
Is extremely complicated in its structure.

[0006] The present invention has been so except for the above-mentioned drawbacks.

[ 0007 ]

A semiconductor manufacturing apparatus according to the present invention.
Heating heat exchanger use reactive gas, the surface of the two heat pipes flowing reactive gas <br/> should heat exchanger, heat pipe of the two is-out closely <br/> wound helically Exchange element comprising a cartridge heater having a heat exchanger, and a heat insulating material provided around the heat exchange element
And the power supplied to the cartridge heater
Control device and a temperature sensor attached to the heat exchange element
And a temperature controller for adjusting the temperature of the cartridge heater.
It is characterized by comprising a node and a case in which these are installed .

[ 0008 ]

Embodiments of the present invention will be described below with reference to the drawings.

[0009] In the present invention, as shown in FIG. 1, the heat exchange element of those wound tightly spirally the refractory metal tube 2 fitted with a fitting 1 at each end two bar-shaped surface of the cartridge heater 3 Used as 4.

Further, in the cartridge heater 3 allowed chip temperature sensor 5 such as a thermocouple, connect this temperature sensor 5 to the temperature controller 6 to adjust the temperature of the heater 3. Further, a temperature sensor (not shown) is attached to the metal tube 2 to monitor the temperature of the metal tube 2. A heat insulating material 7 such as alumina or silica is provided around the heat exchange element 4, and these are installed in a case 9 having a built-in control device 8 such as SSR for controlling electric power supplied to the heater 3.

[0011] Incidentally, one of the fitting 1 attached to opposite ends of each metal pipe 2 is connected to the corresponding reaction gas supply tank and the other is connected to a port of the reactor.

[0012] heating heat exchanger of the semiconductor manufacturing device for the reaction gas present invention, since a configuration as described above, set the temperature controller so that the temperature determined by the type and flow rate of the reaction gas, When the power switch is turned on, the temperature of the heater 3 rises, and the reaction gas is sufficiently heated in the spirally wound metal tube 2.

[ 0013 ]

As described above, the semiconductor manufacturing apparatus of the present invention
The heat exchanger for heating the reaction gas has a structure in which two heat-resistant metal tubes are closely wound around the surface of the cartridge heater, so that the heat of the heater can be efficiently absorbed by the reaction gas in the metal tube, In addition, there are various advantages such as no need to install a heater, compactness, no restrictions on the installation location, and space saving.

[Brief description of the drawings]

FIG. 1 is a plan view of a heat exchanger for heating a reaction gas for a semiconductor manufacturing apparatus of the present invention.

[Description of Signs] 1 Connection fitting 2 Metal tube 3 Cartridge heater 4 Heat exchange element 5 Temperature sensor 6 Temperature controller 7 Insulation material 8 Control device 9 Case

Claims (3)

[Claims] 1. A heat exchanger for fluid heating, comprising a heat exchange element comprising a heat-resistant tube through which a fluid to be subjected to heat exchange flows, and a cartridge heater having a surface around which the heat-resistant tube is spirally wound. . 2. A heat insulating material provided around the heat exchange element, a control device for controlling electric power supplied to the cartridge heater, a temperature sensor attached to the heat exchange element, and adjusting a temperature of the cartridge heater. The heat exchanger for heating fluid according to claim 1, wherein the heat exchanger comprises a temperature controller to be used and a case in which the temperature controllers are installed. 3. The heat exchanger for fluid heating according to claim 1, wherein a plurality of the heat-resistant tubes wound around the cartridge heater are provided.