JP2000100981A - Electronic element sealing case and electronic part provided therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic element sealing case that can be lessened in height adopting a press-fit sealing type which is high in sealing reliability and an electronic part provided therewith. SOLUTION: An electronic element sealing case 10 is composed of a cap 12 and a base 11, where the cap 12 is fitted into the base 11 to hermetically seal up an electronic element 14 arranged on the base 11. The opening 15 of the cap 12 is nearly elliptical in cut surface, and the base 11 spreads out in the direction of press-fitting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic element enclosure for improving the reliability of an electronic element by hermetically sealing the electronic element, and an electronic component using such an electronic element enclosure. In particular, the present invention relates to a structure of an electronic element enclosing container which enables a reduction in thickness and a highly reliable airtight maintenance and an electronic component using the same.

[0002]

2. Description of the Related Art A conventional technique will be described with reference to FIG. Conventionally, electronic devices that require extremely high-precision operation, such as quartz oscillators, piezoelectric devices, sensors, and semiconductor devices, are cut off from the outside air by some method, and are adversely affected by gas, moisture, or dust from the outside air. I try to eliminate. For example, in general, a semiconductor element such as an LSI is hermetically sealed from an external environment in the form of so-called mold sealing to ensure high reliability of the semiconductor element.

On the other hand, when the element itself needs to be in a free state in principle, such as a piezoelectric element or a quartz oscillator, it is sealed in a can case as shown in FIG. It had been. Quartz resonators and piezoelectric elements require very high-precision operation, such as a local oscillator reference oscillator. This is because the originally expected performance cannot be exhibited.

In FIG. 13, a base 132 is covered with a cap 132 so that an electrode 133 is projected on the base 131 so that an electronic element 134 is arranged on the electrode 133. The base 131 and the cap 132 have a generally cylindrical shape as shown in FIG.
The electronic device 134 is hermetically sealed by soldering or electrically welding the cap 132 to the device 1. However, in the case of solder welding or electric welding, the solder material or a part of the cap 132 and the base 131 is vaporized by heat and is sealed in the electronic element enclosing container 130 at the same time as the electronic element 134, so that the vapor is removed from the electronic element. There was a problem that the operation of the electronic element 134 was disturbed by touching the 134.

Therefore, in recent years, press-fitting has been adopted as a method of sealing the base and the cap in order to ensure the operation of the electronic element with higher precision. Press-fitting refers to pressing a cap against a base, deforming the base or a part of the cap to bring the interface between the base and the cap into close contact, and hermetically sealing the space inside the cap.
Therefore, in this case, since heating is not required for sealing, there is no possibility that a part of the constituent material becomes vapor and adversely affects the electronic element.

The most suitable shape of such a press-fit type electronic element enclosing container is a cylindrical shape as shown in FIG. 13 because the fitting pressure of the press-fit portion is over the entire circumference. It can be made uniform. For example, if the shape of the base and the cap is rectangular or elliptical, the fitting pressure at the joint between the cap and the base, that is, the press-fitting portion is widely distributed depending on the shape, and is not strong and weak throughout. This is because it is difficult to secure the fitting pressure. For the above reasons, a cylindrical enclosure as shown in FIG. 13 has conventionally been used as an electronic element enclosure for hermetically sealing electronic elements.

[0007]

As described above, a cylindrical electronic element encapsulation container has been conventionally used, but this cylindrical electronic element encapsulation container has been used to reduce the thickness of electronic equipment in recent years. It is gradually becoming a disadvantageous shape.
That is, as shown in FIG. 14A, such an electronic element enclosing container 141 encloses an electronic element inside, and is disposed on the motherboard 142 as an electronic component, and other electronic components 143 are provided.
A circuit having one function is configured in cooperation with the above. When an electronic element enclosing container 141 having a cylindrical shape is arranged on such a motherboard 142, only the element reduces the height of the entire motherboard 142. There is a problem that it becomes bulky more than necessary.

This is clear from the side view shown in FIG. Such a motherboard 142
The other electronic components 143 disposed thereon are, for example, semiconductor elements, chip-type capacitors, chip-type resistors, and chip-type coils, all of which are extremely short. However, this electronic element enclosure 141
Has a cylindrical shape, so even if it is placed on the motherboard 142 in a laid-down shape, it needs to be at least as high as the diameter of the cylindrical shape.

On the other hand, considering an electronic element sealed in such a cylindrical electronic element enclosure, as described above, a thin plate-like one such as a semiconductor element, a piezoelectric element, or a SAW resonator is used. Most of the volume of the electronic element enclosing container is a space unnecessary for ensuring the thin plate-shaped one from the outside in an airtight manner. Therefore, in the related art, the outer shape of such an electronic element encapsulating container is determined only by the necessity of press-fitting, and therefore, not only the electronic component using the electronic element enclosing container but also such an electronic component is used. There is a problem that the entire motherboard or the electronic device using the motherboard is bulky.

For example, in the case of a card-type electronic device which is being put into practical use in recent years, it is required to have a thickness of at most about 2 to 3 mm, and such a cylindrical electronic element enclosure is used. Therefore, there is a problem in that a thin container using solder sealing with low reliability or sealing by electric welding must be used instead. The present invention has been made in view of the above problems, and has an electronic element encapsulation capable of suppressing the bulkiness of an electronic element encapsulation container while employing a press-fit type sealing for improving sealing reliability. It is an object to provide a container and such an electronic component.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an electronic element enclosing container for press-fitting a cap to a base to hermetically seal electronic elements arranged on the base. The opening of the cap has a substantially elliptical cut shape, and the base provides an electronic element enclosure that is divergent in the press-fitting direction of the cap. Further, an electronic element enclosing container for press-fitting a cap to the base to hermetically seal an electronic element arranged on the base, wherein the opening of the cap has a substantially elliptical cut shape. The press-fitting of the cap and the base provides an electronic element enclosure in which the major axis side of the cut is smaller than the minor axis side.

Also, the cap is press-fitted into the base,
An electronic element enclosing container for hermetically sealing an electronic element arranged on a base, wherein the opening of the cap has a substantially elliptical cut shape, and a press fitting allowance between the cap and the base is:
Provided is an electronic element enclosing container in which the long-axis side fitting portion of the cut is smaller than the short-axis side fitting portion, and the base is divergent in the cap press-in direction only at the short-axis side fitting portion of the cut.

Further, the present invention provides the electronic element enclosure according to any one of claims 1 to 3, wherein the base is made of a ceramic material. The electronic device enclosure according to any one of claims 1 to 3, wherein the cap is made of a metal material and can be grounded via a ground electrode. Further, the cap is made of a glass material.
3. An electronic element enclosure according to any one of 1. to 3. above.

Further, an electronic component in which a piezoelectric element is enclosed as an electronic element in the electronic element enclosure according to any one of claims 1 to 6 is provided. Further, an electronic component in which a semiconductor element is sealed as an electronic element in the electronic element sealing container according to any one of claims 1 to 6 is provided. Further, an electronic component in which a light emitting element is sealed as an electronic element in the electronic element enclosing container according to claim 6 is provided.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, in the present invention, the fitting portion between the cap and the base of the electronic element encapsulating container is made to have a special shape, so that the bulk of the electronic element enclosing container is kept low and the electronic element encapsulating container is fitted. The present invention provides a low-profile and highly-reliable electronic element enclosure and an electronic component using the same by optimizing and uniformizing the fitting pressure over the entire periphery of the part. The present invention will be described below in the order of claims with reference to the drawings. FIGS. 1 and 2 illustrate the first embodiment of the present invention.

According to the first aspect of the present invention, as described above, there is provided an electronic element enclosing container for press-fitting a cap to a base to hermetically seal an electronic element arranged on the base. The opening has a substantially elliptical cut shape, and the base is an electronic element enclosure that widens in the direction of press-fitting of the cap. The first feature of the present invention is that the opening of the cap has a substantially elliptical cut shape in order to reduce the height.

If the cutout is formed in a substantially elliptical shape as described above, if the cutout is arranged on the motherboard, the height can be considerably reduced as compared with the conventional cylindrical type. This contributes to making electronic equipment thinner. Here, the approximate ellipse includes an actual ellipse and a shape close to the ellipse, and the shape close to the ellipse includes a compound circle or a shape formed by a circle and a straight line. .

Such a substantially elliptical shape is adopted, for example, when the cut shape of the opening of the cap is rectangular in order to reduce the height, and the cap having such a cut shape is press-fitted to the base. This is because the distribution of the fitting pressure at the time of performing the above is extremely uneven, and it is not appropriate because there is a very large fitting pressure difference between the short side and the long side which is extremely large. That is, by adopting such a substantially elliptical shape, it is possible to distribute the fitting pressure in a certain range over the short axis side and the long axis side, and the extremely strong or extremely weak fitting pressure is reduced. This is because it is possible to prevent the base or the cap from being damaged or leaking airtight.

Another feature of the present invention lies in the shape of the base. As described above, the base has a shape diverging in the press-fitting direction of the cap. The divergent shape is a shape in which the fitting portion can be seen in a trapezoidal shape at the time of the cross section. Originally, in this press-fitting method, a predetermined fitting pressure is secured by controlling the press-fitting margin between the cap and the base, and the electronic element on the base is hermetically sealed to the outside. However, as described above, the fitting pressure over the entire circumference of the ellipse has a certain variation by making it not a perfect circle but a substantially ellipse.

In the case where there is a certain variation as described above, the possibility of leakage of hermetic sealing increases in a weak part as well as a strong part, and it is necessary to improve this.
Therefore, in the present invention, as a second characteristic point, the base is formed so as to diverge in the press-fitting direction of the cap.
Although the fitting pressure should be strengthened by the press-fit allowance by adopting the divergent shape, if the fitting pressure is not sufficient even if the press-fit allowance is sufficient, the base formed to diverge in the cap press-fitting direction Further, during the press-fitting, the cap is expanded outward, and since the expansion is performed by the elastic deformation of the cap, an effect occurs such that the fitting pressure between the cap and the base is further increased.

As described above, when the base has a substantially elliptical cut shape, a portion where the fitting pressure is insufficient is always generated in a part thereof, so that the fitting pressure is insufficient. In order to increase the size of the base in particular, the base was formed so as to expand in the direction of press-fitting of the cap. In the invention described in claim 1, the substantially elliptical cut shape is only the shape of the fitting portion between the base and the cap.
The base 21 may be substantially rectangular and only the fitting portion 21a with the cap 22 may be substantially elliptical, as in the electronic element enclosure 20 shown in FIG.

FIG. 1 shows the invention of claim 1 in general with a diagram. As shown in FIG. 1, a cap is press-fitted on a base, and an electronic element is supported on an electrode protruding from the upper surface of the base. The electronic element is a cap press-fitted on the base. The entire structure is covered and hermetically sealed from the outside, so that highly reliable operation is ensured.

FIG. 1B is a perspective view of the perspective view of FIG. 1A, which further clarifies the state of the invention according to the first aspect. As shown in the figure, the first point of the feature is that the base 11 is widened in the press-fitting direction of the cap 12, that is, formed in a trapezoidal shape in a sectional view, and the press-fitting of the base 11 and the cap 12 is performed. This is that the mating portion, that is, the opening 15 of the cap has a substantially elliptical cut shape.

FIG. 2 (b) is a simplified representation of the definition of the above-mentioned substantially ellipse. The approximate ellipse may be repeated, as shown in FIG. 3B, an ellipse, a compound circle drawn under the ellipse, or a shape formed from a circle and a straight line. Good.

Next, the invention according to claim 2 will be described. As described above, the invention according to claim 2 is an electronic element enclosing container in which a cap is press-fitted into a base to hermetically seal an electronic element arranged on the base, wherein the opening of the cap is The cap has a substantially elliptical cut shape, and the press-fitting margin between the cap and the base is an electronic element enclosure in which the long axis side of the cut is smaller than the short axis side. The invention described in claim 2 also has such a configuration that it is possible to avoid the drawbacks characteristic of such a press-fitting and thin electronic element enclosure. The feature lies in the control of the press fitting allowance between the cap and the base as described above.

FIG. 4 briefly shows the problem of the second aspect of the present invention. FIG. 4A shows a pressure distribution at a fitting portion between a base and a cap of a general cylindrical electronic element enclosure. The circles in the figure indicate that the fitting pressure is the optimal fitting pressure. If the shape of the fitting part of the base and the cap is a perfect circle, the optimal fitting pressure is uniform over the entire circumference. Can be realized.

However, as shown in FIG. 3B, when the cutout is formed to have a substantially elliptical shape in order to reduce the thickness, the upper side of the major axis of the ellipse has excessive fitting pressure, and the side of the minor axis has excessive fitting pressure. Insufficient fitting pressure, the middle part between them is distributed to the optimum fitting pressure, and the part with excessive fitting pressure leads to mechanical breakage, that is, mechanical breakage of the cap or base, and Is insufficient in a portion where airtight sealing leaks, that is, a gap occurs between the base and the cap, and the hermetic sealing is broken from this portion.

In order to avoid such a problem, the invention according to claim 2 has been made. The feature of the invention is that a long press-fit margin between the cap and the base is set such that the long side of the cut is shorter than the short side. The purpose is to provide a small electronic element enclosure. The press-fitting margin is as shown in FIG. 3A, and is generally designed so that the inner diameter of the cap 32 is smaller than the outer diameter of the base 31. Elastic deformation of the cap 32 is induced, and the cap 32 is strongly tightened by this elastic force to hermetically seal the inside.

FIG. 2A shows the state before the press-fitting, and FIG. 2B shows the electronic element enclosure 30 after the press-fitting. After the press-fitting, as shown in FIG.
The cap 32 is largely elastically deformed, and this portion is hermetically sealed. However, as described above, if the press-fit allowance dimension d is a constant value over the entire circumference of the substantially elliptical shape having the cut shape of the cap, the optimum fitting pressure is obtained at the long shaft side fitting portion 41 as shown in FIG. However, there is a problem that the short shaft side fitting portion 42 is insufficient. Therefore, according to the present invention, by setting the press-fitting allowance dimension on the long shaft side and small on the short shaft side, the fitting on the short shaft side where the fitting pressure is originally weak is performed. It is configured to increase the joint pressure and to decrease the joint pressure on the long shaft side where the joint pressure is strong.

FIG. 5 (a) shows the distribution of the fitting pressure when the press-in allowance is fixed, and shows that the short axis side is small and the long axis side is large. FIG. 3B shows the distribution of the fitting pressure when the electronic element enclosure is formed with such press-fitting allowance. However, if the press-fitting margin is made smaller on the long axis side than on the short axis side as in the invention of claim 2, these pluses and minuses are offset, and FIG.
The fitting pressure can be optimized over the entire substantially elliptical shape as shown by the arrow below.

Next, the third aspect of the present invention will be described. As described above, the invention according to claim 3 is an electronic element enclosing container that press-fits a cap to a base and hermetically seals an electronic element arranged on the base, wherein the opening of the cap is The cap has a substantially elliptical cut shape, and the press-fitting allowance between the cap and the base is such that the long-axis fitting portion of the cut is smaller than the short-axis fitting portion, and the base is the short-axis fitting portion of the cut. Is an electronic element enclosing container that widens in the cap press-fitting direction only at.

The invention described in claim 3 can be said to be a mixture of the invention described in claim 1 and the invention described in claim 2 and optimized. As described above, the feature of the electronic element enclosing container in which the opening of this type of cap has a substantially elliptical cut shape is that it can be made thinner. We have already mentioned that it is not uniform.

As a solution, the press-fit allowance is controlled over the entire shape of this substantially elliptical cut, that is, the press-fit allowance is made smaller on the long axis side of the cut than on the short axis side. This tried to make this fitting pressure uniform over the entire circumference. However, even in the second aspect of the invention, the fitting pressure may not be sufficiently uniform.

This is due to the fact that the size of the press-fit allowance between the cap and the base is maximal and can only be taken up to the thickness of the cap. If the amount of press-fit required to make the fitting pressure uniform over the entire circumference or fall within a predetermined range becomes larger than the thickness of the material of the cap, this problem can be solved only by the invention described in claim 2. As a result, a thin electronic device enclosure cannot be realized.

However, the invention according to claim 3 is an electronic element encapsulating container in which, in addition to the invention according to claim 2, the divergent shape of the base in the cap press-fitting direction is formed only at the short shaft side fitting portion. With this configuration, the adjustment of the fitting pressure, which is insufficient only by controlling the press-fitting allowance, can be optimized by the base having the flared shape.

The reason why the shape of the base is divergent in the thickness direction of the cap is that, as described above, the cap gradually expands its diameter as the cap is pressed against the base and elastically deforms along the base. Then, an elastic deformation larger than the elastic deformation obtained by the press-fit allowance dimension is formed at this fitting portion.

After all, the magnitude of the fitting pressure between the base and the cap depends on the degree to which the cap is elastically deformed at the fitting portion, so that the elastic deformation is sufficient only by controlling the press-fitting allowance. If it is not possible to expand the cap further outward with this flared base, sufficient elastic deformation can be obtained, and conversely, the cap can tighten the base with sufficient elastic force. It is.

FIGS. 6 and 7 show the third embodiment of the present invention with drawings. As shown in FIG. 6 (a), the base having a substantially elliptical shape can maximize the fitting pressure of this portion by giving the maximum press-fitting margin on the short axis side. However, even with the maximum press fitting allowance as shown in FIG. 6A, the short shaft side fitting pressure may be insufficient as shown in FIG. 6B.

In this case, the invention described in claim 3, ie, FIG.
The solution as shown in (a) and (b) is obtained. As shown in FIG. 7 (a), if the base is formed so as to diverge in the press-fitting direction only in a portion where a sufficient fitting force cannot be obtained with the maximum press-fitting allowance, the short-axis side also becomes as shown in FIG. On the long shaft side, it is possible to design the fitting pressure within the optimum fitting pressure or the optimum width fitting pressure.

Next, the invention according to claim 4 will be described. According to a fourth aspect of the present invention, as described above, the electronic element enclosure according to any one of the first to third aspects, wherein the base is made of a ceramic material. In the description of the invention according to claims 1 to 3, in order to reduce the thickness and maintain the hermetic sealing with high reliability, it is necessary to optimize the press-fitting and press-fitting of an elliptical cap having an opening shape. Has shown that the shape of the base can be made wider by a predetermined design in the cap press-fitting direction.

In the inventions according to the first to third aspects, the design accuracy of the shape of the base is particularly problematic. The fitting pressure between the base and the cap ultimately depends on the precise design dimensions of the base and the cap. This is because any deviation in the design dimensions causes a leak from the hermetic seal or mechanical breakage due to excessive tightening pressure. In order to make such a precise design, for example, when the cap side is made of a metal material, a certain degree of design accuracy can be secured by extruding the cap at a constant rate.

However, in the conventional design of the base side, that is, in forming the base by sealing the inside of the metal outer ring with glass, even if there is a design precision of the metal outer ring itself, this is not the case. Since a number of heating steps or cooling steps must be performed when the terminal is sealed by filling the inside of the glass, it has been difficult to ensure sufficient dimensional accuracy. Therefore, as a means for easily securing such dimensional accuracy, it is conceivable to use a base made of a ceramic material as the base material. This is the invention of claim 4.

Since the ceramic material has sufficient mechanical strength and can be processed with high dimensional accuracy, it is extremely suitable as a base material having such high dimensional accuracy. Further, since the ceramic material can be entirely formed of an insulating material, it is not necessary to pay attention to the insulation between the metal outer ring and the terminal as in the case of using the metal outer ring.

For the above reasons, it can be said that a ceramic material is most suitable as the base material of the electronic element enclosing container according to claims 1 to 3 having such high precision processing. It is to be noted that the term “ceramic material” as used herein is intended to include not only a conventional ceramic material mixed with a metal oxide but also a so-called glass ceramic mixed with a glass material.

FIG. 8 shows the fourth embodiment of the present invention with a diagram. FIG. 8A shows a cap 8 on a base 81.
2 is an electronic element enclosing container 80 covered with a base 81 made of a ceramic material. This base 8
When the base 1 and the cap 82 are press-fitted, the base 81
It is necessary that the cap 82 be deformed while sliding at the fitting portion 85, but in order to facilitate this deformation, a material having high extensibility such as a metal material is partially disposed in the fitting portion 85 made of ceramic material. It is suitable.

Further, since the ceramic material is rich in workability, a composite electronic element enclosing container 80b can be realized by covering a large number of caps 82 on a single ceramic material plate 87 as shown in FIG. Is also easy. FIG. 9
As shown in FIG.
A number of caps 92 are put on the inside of the ceramic case 90 to hermetically seal it.
By performing b, the electronic element enclosure 90 having a double hermetic structure can be realized.

Next, the invention according to claim 5 will be described. The invention according to claim 5 is the electronic element enclosure according to any one of claims 1 to 3, wherein the cap is made of a metal material and can be grounded via a ground electrode, as described above. The characteristics of an electronic element sealed in this type of electronic element enclosure include a highly reliable electronic element that is easily affected by an external environment, such as a SAW resonator, a piezoelectric element, a semiconductor element, and an element of a sensor. As described above, this type of element is optimal, but this type of element may be sensitively affected not only by dust, moisture, gas and the like but also by an electromagnetic field.

In such a case, it becomes necessary that such an electronic element be electromagnetically shielded. The invention according to claim 5 provides an element enclosing container that is optimal for such an element that needs to be electromagnetically shielded.
The invention according to claim 5 is an electronic element enclosure in which the cap is made of a metal material and this metal material is connected to a ground electrode, for example, to a ground circuit on the motherboard.

FIG. 10 shows a base 101 of this type of electronic element enclosure, which is a conventional electrode 103 for electronic elements.
In addition to the two, an additional ground electrode 104 is further disposed, and this part is connected to the ground circuit on the motherboard and this part is also in contact with the metal cap, so that the entire metal cap is at the ground potential. As a result, the electronic element covered by the entire metal cap can be electromagnetically shielded.

Particularly, such a shape is such that when such a thin device is surrounded by a thin metal cap, an electromagnetic field is easily generated through the metal cap over the thin front and back surfaces. It is also in view of. The so-called metal cap serves as a kind of electrode in both cases, so as to prevent the metal cap from superimposingly adversely affecting the electronic element sandwiched in the middle, especially the plate-shaped electronic element. Structure.

Next, the invention according to claim 6 will be described. The invention according to claim 6 is the electronic element enclosing container according to any one of claims 1 to 3, wherein the cap is made of a glass material as described above. In the case of such a thin electronic element encapsulating container, the characteristic point is that the front or back surface of the plate-like electronic element encapsulated therein and the front and back surfaces of the cap to be put on the electronic element are substantially parallel. There is.

In such a parallel relationship, even if the outside is covered with a transparent material, it is sealed inside, that is, the surface or the back of the standing element is prevented from deteriorating in visibility due to refraction of light. An element that requires an internal view, for example, a fuse element 114 as shown in FIG. 11, is sealed in the base 111 and the cap 112 so that it can be easily viewed from the outside. Since the disconnection of the fuse can be confirmed, it can be said that the fuse is excellent as a highly reliable electronic element enclosure 110 for a fuse element. The present invention has been proposed from such a viewpoint.

Next, the invention according to claim 7 will be described. According to a seventh aspect of the present invention, as described above, there is provided an electronic component in which a piezoelectric element is sealed as an electronic element in the electronic element sealing container according to any one of the first to sixth aspects. According to an eighth aspect of the present invention, there is provided an electronic component in which a semiconductor element is sealed as an electronic element in the electronic element sealing container according to any one of the first to sixth aspects. The inventions of claims 7 and 8 are substantially the same as the inventions of claims 1 to 6. In short, a thin electronic component with high reliability can be realized.

Next, the ninth aspect of the present invention will be described. The invention of claim 9 is basically the same as the invention of claim 6. As described above, an electronic component in which a light emitting element is sealed as an electronic element in the electronic element sealing container according to claim 6. The difference from the invention according to claim 6 resides in that an electronic component and a light emitting element is sealed as an electronic element inside. For example, FIG. 12 shows a method of using such electronic components.

The device shown in FIG. 12 has a base 121 covered with a transparent cap 122, and a number display device 12 using a light tube using a light emitting element 124.
5 are arranged. Since the light-emitting element 124 is easily affected by the outside, it is preferable to operate the light-emitting element 124 in a hermetically sealed state.
The electronic element enclosing container according to the sixth aspect is most suitable, and a highly reliable electronic component enclosing the light emitting element 124 can be provided by using such an electronic element enclosing container 120.

[0056]

As described above, according to the present invention, a cap having a substantially elliptical cut shape and a base are press-fitted to each other, and the press-fitting margin of the base can be controlled to a predetermined value. By forming the shape into a predetermined divergent shape, it is possible to provide a thin and highly reliable electronic element enclosing container or a highly reliable electronic component using them.

[Brief description of the drawings]

FIG. 1 is a perspective view and a side sectional view of an example of an electronic element enclosure of the present invention.

FIG. 2 is a perspective view of another example of the electronic element enclosure of the present invention and a substantially elliptical cut shape.

FIG. 3 is a side sectional view showing a press-fitting allowance of the electronic element enclosure of the present invention.

FIG. 4 is a diagram showing a distribution of a fitting pressure depending on a cut shape of a base and a cap.

FIG. 5 is a diagram showing a distribution of a fitting pressure when a press-fitting allowance of a cap is fixed.

FIG. 6 is a diagram showing a case where the fitting pressure is insufficient even when the cap press-fitting allowance is the maximum.

FIG. 7 is a view showing a good fitting pressure obtained by a combination of a maximum press-fitting allowance of the cap and a divergent shape of the base.

FIG. 8 is a view showing an example in which the base of the electronic element enclosure is made of a ceramic material.

FIG. 9 is a perspective view showing an example in which a double airtight structure is formed by disposing individual electronic element enclosures on the bottom of a ceramic case as a base and covering the base with the lid.

FIG. 10 is a view showing a base of an electronic element enclosure having an electromagnetic shielding function.

FIG. 11 is a perspective view of an electronic element enclosing container whose cap is made of a glass material.

FIG. 12 is a perspective view of an electronic element enclosure in which a display device using a light tube is arranged.

FIG. 13 is a perspective view of a conventional electronic element enclosure.

FIG. 14 is a perspective view and a cross-sectional view of a motherboard on which a conventional electronic element enclosure is mounted.

[Explanation of symbols]

10, 20, 30, 80, 90, 110, 120 Electronic device enclosure 11, 21, 31, 81, 101, 111, 121 Base 12, 22, 32, 82, 92, 112, 122 Cap 124 Electronic device 15 Opening d Press-in allowance 41 Long shaft side fitting part 42 Short axis side fitting part 104 Ground electrode

Claims (9)

[Claims] 1. An electronic element enclosing container for press-fitting a cap to a base to hermetically seal an electronic element arranged on the base, wherein an opening of the cap has a substantially elliptical cut shape. An electronic element enclosure, wherein the base is divergent in the direction of press-fitting the cap. 2. An electronic element enclosing container in which a cap is press-fitted into a base to hermetically seal an electronic element disposed on the base, wherein the opening of the cap has a substantially elliptical cut shape. The press-fitting margin between the cap and the base is such that the major axis side of the cut is smaller than the minor axis side. 3. An electronic element enclosing container for press-fitting a cap to a base to hermetically seal an electronic element arranged on the base, wherein an opening of the cap has a substantially elliptical cut shape. However, the press-fitting allowance between the cap and the base is such that the long-axis side fitting portion of the cut is smaller than the short-axis side fitting portion, and the base diverges only in the short-axis side fitting portion of the cut in the cap press-fitting direction. An electronic element enclosure. 4. The electronic element enclosure according to claim 1, wherein the base is made of a ceramic material. 5. The electronic element enclosure according to claim 1, wherein the cap is made of a metal material and can be grounded via a ground electrode. 6. The electronic element enclosure according to claim 1, wherein the cap is made of a glass material. 7. An electronic component in which a piezoelectric element is sealed as an electronic element in the electronic element enclosing container according to any one of claims 1 to 6. 8. An electronic component in which a semiconductor element is sealed as an electronic element in the electronic element sealing container according to any one of claims 1 to 6. 9. An electronic component in which a light emitting element is sealed as an electronic element in the electronic element enclosing container according to claim 6.