JP2000095545A - Transfer film and production of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to improve the uniformity and smoothness of films, to prevent the erosion between bus electrodes and transparent electrodes, to obviate the peeling of both electrodes, to prevent the coloration of the bus electrodes and to form colorless and transparent dielectric layers by forming the laminated films of a first film forming material layer containing glass powder and a second film forming material layer containing glass powder having the softening point different from the above softening point on a supporting film. SOLUTION: The supporting film is a resin film having heat resistance, solvent resistance and flexibility and is, for example, polyethylene terephthalate. The thickness of the supporting film is formed to 20 to 100 μm. The softening point of the glass powder of the first film forming material layer is above 400 deg.C and below 600 deg.C and the softening point of the second glass powder is above 350 deg.C and below 550 deg.C. The composition examples of the glass powder are lead oxide, boron oxide, silicon oxide and calcium oxide. The grain size of the glass powder is 0.1 to 5 μm. A binder resin is preferably an acrylic resin and the content ratio thereof is 5 to 40 pts.wt. per 100 pts.wt. glass powder.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a transfer film containing glass powder as a main component, and more particularly, to a transfer film that can be suitably used for forming a dielectric layer of a plasma display panel.

[0002]

2. Description of the Related Art In recent years, a plasma display has attracted attention as a flat fluorescent display. FIG. 1 shows an AC type plasma display panel (hereinafter also referred to as “PDP”).
It is a schematic diagram which shows the cross-sectional shape of. In FIG. 1, reference numerals 1 and 2 denote glass substrates which are arranged to face each other, and reference numeral 3 denotes a partition. 4 is a transparent electrode fixed on the glass substrate 1, 5 is a bus electrode formed on the transparent electrode for the purpose of reducing the resistance of the transparent electrode, 6 is an address electrode fixed on the glass substrate 2, and 7 is a cell electrode. The retained fluorescent substance 8 covers the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5.
Is a dielectric layer formed on the surface of the glass substrate 2 so as to cover the address electrodes 6, and 10 is a protective film made of, for example, magnesium oxide.

[0003] The dielectric layer is formed of a glass sintered body and has a thickness of, for example, 20 to 50 µm. As a method for forming the dielectric layer, a paste-like composition containing a low-melting glass powder, a binder resin and a solvent (hereinafter, also referred to as “glass paste composition”) is prepared, and the glass paste composition is screened. A method of forming a film-forming material layer by coating the surface of the glass substrate 1 by a printing method and drying, or a method of forming a film-forming material layer by coating a glass paste composition on a support film and drying the coating film. Then, the film-forming material layer formed on the support film is transferred to the surface of the glass substrate to which the electrodes are fixed, and the transferred film-forming material layer is baked to form a dielectric layer on the surface of the glass substrate. Dry film method (for example, JP-A-9-10
No. 2273) has been proposed.

As a method of forming a transparent electrode and a bus electrode, first, a transparent electrode having a predetermined pattern made of a film containing ITO or SnO ₂ as a main component is formed on a glass substrate by a CVD method or a sputtering method. In general, a bus electrode is formed on the transparent electrode to form a laminated structure. In recent years, studies have been made to form a bus electrode by a screen printing method, a dry film method, or the like using a thick film paste which has higher mass productivity than conventional thin film forming methods, is easy to increase in area, and is inexpensive, and is inexpensive.

[0005]

Here, a dielectric paste containing a low melting point glass powder having a softening point of 500 ° C. or less as a main component is used on a thick-film bus electrode, and the above-mentioned screen printing method and dry film method are used. When the dielectric layer is formed by the method, the low-melting glass flows during the firing of the dielectric layer and erodes between the bus electrode and the transparent electrode, and as shown in FIG. 2, the bus electrode peels off from the transparent electrode. There is a problem that. Furthermore, when a dielectric layer is formed on a thick-film bus electrode mainly composed of silver by a dry film method, there is a problem that the bus electrode is colored during firing. On the other hand, when a dielectric paste containing a low-melting glass powder having a softening point of 550 ° C. or higher as a main component is used, many bubbles remain in the fired dielectric layer, and the transmittance becomes low due to cloudiness. There is a problem. As means for solving these problems, a first dielectric layer is provided on a thick-film bus electrode, and a glass paste containing a glass having a lower softening point is formed on the first dielectric layer. A method characterized by providing a second dielectric layer (Japanese Patent Publication No. 2705530) has been proposed. However, since this method forms a coating film by screen printing, the workability is complicated, the dispersion of the film thickness is large, the mesh mark of the screen remains on the coating film,
It has been difficult to increase the size and mass production of high-quality dielectric layers.

The present invention has been made based on the above circumstances. A first object of the present invention is to provide a transfer film and a method for manufacturing a plasma display panel, which can efficiently form a dielectric layer required for a large-sized plasma display panel. A second object of the present invention is to provide a transfer film capable of forming a dielectric layer having excellent film thickness uniformity. A third object of the present invention is to provide a transfer film capable of forming a dielectric layer having excellent thickness smoothness. A fourth object of the present invention is to form a dielectric layer that suppresses the flow of the low-melting glass during firing, suppresses erosion between the bus electrode and the transparent electrode, and prevents the bus electrode from peeling from the transparent electrode. To provide a transfer film. A fifth object of the present invention is to form a dielectric layer on a thick-film bus electrode containing silver as a main component by a dry film method so as not to color the bus electrode during firing. It is to provide a transfer film that can be formed. A sixth object of the present invention is to provide a transfer film capable of forming a dielectric layer having excellent colorless transparency.

[0007]

The transfer film of the present invention comprises a first film forming material layer containing glass powder and a second film forming material containing glass powder having a softening point different from that of the first film forming material layer. The laminated film with the film forming material layer is formed on the support film. The method for manufacturing a plasma display panel according to the present invention includes transferring the transfer film of the present invention onto a glass substrate to which electrodes are fixed, and baking the transferred film-forming material layer to form a dielectric film on the surface of the glass substrate. It is characterized by forming a body layer. By forming in advance a laminated film of film forming material layers having different softening points of glass powder on one support film, workability is improved, uniformity and smoothness of film thickness are excellent, and low gap between electrodes is achieved. It is possible to form a dielectric layer which suppresses erosion of the melting point glass, does not peel off the electrodes, does not color the bus electrodes during firing, and has excellent colorless and transparent properties.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. (1) Transfer Film The transfer film of the present invention comprises a support film and a film-forming material layer formed on the support film. <Support Film> The support film constituting the transfer film of the present invention is preferably a resin film having heat resistance and solvent resistance and having flexibility. Since the support film has flexibility, the glass paste composition can be applied by a roll coater, a blade coater, or the like, and the film forming material layer can be stored and supplied in a rolled state. . Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, and polyfluoroethylene, nylon, and cellulose. As the thickness of the support film, for example, 20 to 100
μm. The surface of the support film to which the glass paste composition is applied is preferably subjected to a release treatment. Thereby, in the step of transferring to the glass substrate, the operation of peeling the support film can be easily performed.

The film forming material layer constituting the transfer film of the present invention is formed by applying a glass paste composition containing glass powder, a binder resin and a solvent as essential components on the above-mentioned support film, and drying the coated film. By removing part or all of the solvent.

<Glass Powder> In the above-mentioned glass paste composition, it is necessary that the softening point of the glass powder, which is an essential component, be different in each of the film forming material layers. It is preferable that the softening point of the glass powder forming the film forming material layer is higher by at least 50 ° C. than the softening point of the glass powder forming the second film forming material layer. Specifically, the softening point of the glass powder contained in the first film forming material layer is usually 400 ° C.
Not less than 600 ° C, preferably not less than 500 ° C and 580 ° C
Is less than. The softening point of the glass powder contained in the second film forming material layer is usually 350 ° C. or more and less than 550 ° C., preferably 400 ° C. or more and less than 500 ° C. In addition, in this specification, the positional relationship of the film forming material layer when the transfer film is transferred is as follows: glass substrate with electrodes / first film forming material layer / second film forming material layer. Therefore, in the step of producing the transfer film, the order is such that the second film-forming material layer is formed on the support film, and the first film-forming material layer is formed thereon. Here, the “softening point” refers to a differential thermal analyzer (hereinafter “D
TA ”). When DTA having a heat center below the sample pan is used and the glass powder is heated at a constant heating rate, the first absorption shoulder and the second absorption bending point usually appear,
The former shoulder is defined as a transition point, and the latter bending point is defined as a softening point. It is considered that the transition point appears due to the heat absorption accompanying the glass transition, and the softening point appears due to a change in the shape of the glass powder (a change in which a flow occurs from the most compacted state).

As a specific example of the composition of a suitable glass powder,
Are lead oxide, boron oxide, silicon oxide, calcium oxide
Um (PbO-B_TwoO_Three-SiO_Two-CaO) oxidation
Zinc, boron oxide, silicon oxide (ZnO-B_TwoO_Three-Si
O_TwoSystem) Lead oxide, boron oxide, silicon oxide, oxide
Luminium (PbO-B_TwoO_Three-SiO_Two-Al_TwoO_Threesystem)
 Lead oxide, zinc oxide, boron oxide, silicon oxide (Pb
O-ZnO-B_TwoO_Three-SiO_TwoSystem) Lead oxide, oxide oxide
Iodine, silicon oxide (PbO-B_TwoO_Three-SiO_TwoSystem)
Bismuth oxide, boron oxide, silicon oxide (Bi_TwoO_Three-B
_TwoO_Three-SiO_TwoSystem) bismuth oxide, boron oxide, acid
Silicon oxide, aluminum oxide (Bi_TwoO_Three-B _TwoO_Three-Si
O_Two-Al_TwoO_ThreeSystem) and the like. Ma
The particle size of the glass powder used in the present invention is preferably
Is 0.1 to 5 μm. The softening point of the glass powder is
Adjustment is generally performed by weighing each acid when weighing raw materials for glass production.
The method of vitrification by varying the composition ratio of the
It is. In the glass paste composition used in the present invention
The glass powder content is 50% by weight or more.
Preferably.

<Binder Resin> The binder resin, which is an essential component of the glass paste composition, is preferably an acrylic resin. By containing the acrylic resin as the binder resin, the film-forming material layer to be formed exhibits excellent (heat) adhesion to the glass substrate. Therefore, when the composition of the present invention is applied on a support film to produce a transfer film, the resulting transfer film has excellent transferability of the film-forming material layer (transferability to a glass substrate). . As such an acrylic resin, it is possible to bind a glass powder with an appropriate tackiness,
Firing treatment temperature of the film forming material layer (normally 400 ° C. to 600 ° C.)
° C) to completely remove the (co) polymer. Specifically, a homopolymer of a (meth) acrylate compound represented by the following general formula (1), a copolymer of two or more (meth) acrylate compounds represented by the following general formula (1), and The copolymer includes a (meth) acrylate compound represented by the following general formula (1) and another copolymerizable monomer.

[0013]

Embedded image

[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic compound. ]

As specific examples of the (meth) acrylate compound represented by the general formula (1), methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl ( (Meth) acrylate, isobutyl (meth)
Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) Acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, Alkyl (meth) acrylates such as isostearyl (meth) acrylate;

Hydroxyethyl (meth) acrylate,
2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth)
Hydroxyalkyl (meth) acrylates such as acrylate; phenoxyethyl (meth) acrylate, 2-
Phenoxyalkyl (meth) acrylates, such as hydroxy-3-phenoxypropyl (meth) acrylate;
Alkoxyalkyl (meth) such as 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, and 2-methoxybutyl (meth) acrylate ) Acrylates;

Polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate Polyalkylene glycol (meth) acrylates such as methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, and nonylphenoxy polypropylene glycol (meth) acrylate; cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, Dicyclopentanyl (meth) acrylate Cycloalkyl (meth) acrylates such as dicyclopentenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl (meth) acrylate; benzyl (meth) ) Acrylate, tetrahydrofurfuryl (meth) acrylate and the like.

Of these, in the above general formula (1), R ²
Is preferably a group containing an alkyl group or an oxyalkylene group. As particularly preferred (meth) acrylate compounds, methyl (meth) acrylate, butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (Meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate can be mentioned.
The other copolymerizable monomer used for copolymerization with the (meth) acrylate compound is not particularly limited as long as it is a compound copolymerizable with the (meth) acrylate compound. For example, (meth) acrylic acid And unsaturated carboxylic acids such as vinylbenzoic acid, maleic acid and vinylphthalic acid; vinylbenzyl methyl ether, vinyl glycidyl ether,
Examples include vinyl group-containing radically polymerizable compounds such as styrene, α-methylstyrene, butadiene, and isoprene. In the acrylic resin constituting the composition of the present invention, the copolymer component derived from the (meth) acrylate compound represented by the general formula (1) is preferably 70% by weight.
The content is particularly preferably 90% by weight or more, and more preferably 100% by weight. As the molecular weight of the binder resin constituting the composition of the present invention, a weight average molecular weight in terms of polystyrene by GPC (hereinafter, also referred to as “Mw”) is 2,0.
It is preferably from 00 to 300,000, more preferably from 5,000 to 200,000.

The content of the binder resin is preferably 5 to 40 parts by weight, more preferably 10 to 30 parts by weight, based on 100 parts by weight of the glass powder.
If the ratio of the binder resin is too small, the glass powder cannot be securely bound and held.On the other hand, if the ratio is too large, a long time is required for the firing step or formation. The resulting dielectric layer may not have sufficient strength and film thickness.

<Solvent> The solvent, which is an essential component of the above-mentioned glass paste composition, has good affinity for glass powder and good solubility of the binder resin, and imparts appropriate viscosity to the glass paste composition. It is preferable that they can be easily evaporated and removed by drying.
Specific examples of such a solvent include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol; Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether;
alkyl esters of saturated aliphatic monocarboxylic acids such as n-butyl and amyl acetate; lactates such as ethyl lactate and n-butyl lactate; methyl cellosolve acetate;
Examples thereof include ether esters such as ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, and ethyl-3-ethoxypropionate. Of these, methyl butyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether , Propylene glycol monomethyl ether, ethyl lactate, ethyl-3-ethoxypropionate, and the like.

The content of the solvent in the glass paste composition is preferably 5 to 50 parts by weight with respect to 100 parts by weight of glass powder, from the viewpoint of maintaining the viscosity of the composition in a suitable range. Preferably 10-4
0 parts by weight.

The glass paste composition used in the present invention contains, in addition to the above essential components, a dispersant, a tackifier, a plasticizer, a surface tension regulator, a stabilizer, an antifoaming agent, a dispersant, and the like. Various additives may be contained as optional components.

As an example of a preferred glass paste composition, the glass paste composition for forming the first film forming material layer is composed of 50 to 80% by weight of lead oxide and 5 to 50% by weight of boron oxide.
Glass powder of 20% by weight, 10 to 50% by weight of silicon oxide and 0 to 20% by weight of calcium oxide (softening point 500 to
(580 ° C.) 100 parts by weight, a composition containing 10 to 30 parts by weight of polybutyl methacrylate (acrylic resin) and 10 to 50 parts by weight of propylene glycol monomethyl ether (solvent). The glass paste composition for forming the second film forming material layer includes lead oxide of 50 to 90% by weight, boron oxide of 0 to 10% by weight, silicon oxide of 5 to 50% by weight and zinc oxide of 0 to 20%.
100% by weight glass powder (softening point 400-500 ° C.)
Parts by weight and polybutyl methacrylate (acrylic resin)
Examples of the composition include 10 to 30 parts by weight and 10 to 50 parts by weight of propylene glycol monomethyl ether (solvent). The glass paste composition can be prepared by kneading the glass powder, the binder resin, the solvent, and optional components using a kneading / dispersing machine such as a roll kneader, a mixer, a homomixer, and a sand mill.

As a method of applying the glass paste composition on a support film, a method capable of efficiently forming a large (for example, 20 μm or more) coating film having excellent uniformity in film thickness is preferred. Preferably, specifically, a coating method using a roll coater, a coating method using a blade coater, a coating method using a curtain coater, a coating method using a wire coater, and the like can be mentioned as preferable examples. First, a glass paste composition for forming a second film forming material layer is applied on a support film, and a glass paste composition for forming a first film forming material layer is applied thereon. Further, the transfer film may be provided with a protective film layer on the surface of the film forming material layer. Examples of such a protective film layer include a polyethylene terephthalate film, a polyethylene film, and a polyvinyl alcohol-based film.

(2) Step of Transferring Film Forming Material Layer: In the method of manufacturing a plasma display panel of the present invention, the transfer film manufactured as described above is used, and the film forming material layer constituting the transfer film is replaced with an electrode. Is transferred to the surface of the fixed glass substrate.

An example of the transfer step is as follows. After peeling off the protective film layer of the transfer film used as necessary, the surface of the glass substrate (electrode fixing surface)
Then, a transfer film is overlaid so that the surface of the first film forming material layer is in contact with the transfer film, and the transfer film is thermocompression-bonded with a heating roller or the like, and then the support film is peeled off from the film forming material layer. Thereby, the film-forming material layer is transferred to the surface of the glass substrate and brought into close contact therewith. here,
As the transfer condition, for example, the surface temperature of the heating roller is 8
0-130 ° C, Roll pressure by heating roller is 1-5kg
/ Cm ² , the moving speed of the heating roller is 0.1 to 10.0 m
/ Min. The glass substrate may be preheated, and the preheating temperature is, for example, 50 to 100 ° C.
It can be.

(3) Firing step of film forming material layer: The film forming material layer transferred to the surface of the glass substrate is fired. Specifically, by placing the glass substrate on which the film-forming material layer is formed in a high-temperature atmosphere, the organic substances (eg, binder resin, residual solvent, ) Is removed by decomposition or the like, and the glass powder as an inorganic substance is melted and sintered. As a result, a dielectric layer made of a glass sintered body is formed on the glass substrate. Here, the firing temperature is set to, for example, 400 to 600 ° C., although the temperature varies depending on the constituent substances in the film forming material layer.

[0028]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited by these. In the following, “parts” indicates “parts by weight”.

<Example 1> [Process for preparing transfer film] As a glass powder, PbO having a composition of 60% by weight of lead oxide, 10% by weight of boron oxide, 20% by weight of silicon oxide and 10% by weight of calcium oxide was used.
—B ₂ O ₃ —SiO ₂ —CaO based glass (softening point 570)
° C) and a polymer (Mw: 80,000) of butyl methacrylate (100% by weight) (binder resin) 30
Parts and propylene glycol monomethyl ether (solvent) 30 parts by kneading to give a viscosity of 3,000 c.
p was prepared as a glass paste composition (hereinafter, also referred to as “glass paste composition 1”). Pb having a composition of 65% by weight of lead oxide, 5% by weight of boron oxide, 20% by weight of silicon oxide, and 10% by weight of zinc oxide as glass powder.
OB ₂ O ₃ —SiO ₂ —ZnO based glass (softening point 470)
° C) and a polymer (Mw: 80,000) of butyl methacrylate (100% by weight) (binder resin) 30
Part and 30 parts of propylene glycol monomethyl ether (solvent) by kneading to give a viscosity of 3,500 c
p was prepared as a glass paste composition (hereinafter, also referred to as “glass paste composition 2”).

Next, the glass paste composition 2 was applied onto a support film (width 200 mm, length 30 m, thickness 38 μm) made of a polyethylene terephthalate (PET) film previously subjected to a release treatment using a blade coater. A coating was formed. The solvent is removed by drying the formed coating film at 110 ° C. for 5 minutes, whereby the second film forming material layer (hereinafter, also referred to as “film forming material layer 2”).
Was formed on a support film to prepare a transfer film. Next, the solvent is removed by applying and drying the glass paste composition 1 on the film forming material layer 2 using a blade coater, thereby forming a first film on the film forming material layer 2. A transfer film in which a laminated film having a material layer (hereinafter, also referred to as “film-forming material layer 1”) was formed on a support film was produced.

[Transfer Step of Film Forming Material Layer] A transparent conductive film of SnO ₂ is formed in advance on a glass substrate for a 6-inch panel, and a silver paste is applied thereon by screen printing and baked to obtain a thickness of 10 μm. A bus electrode having a width of 70 μm was formed. A transfer film was overlaid on the substrate on which the bus electrode was formed so that the surface of the film-forming material layer 1 was in contact with the substrate, and the transfer film was thermocompression-bonded with a heating roller.
Here, as the pressure bonding condition, the surface temperature of the heating roller is set to 1
At 20 ° C., the roll pressure was 4 kg / cm ² , and the moving speed of the heating roller was 1 m / min. After the completion of the thermocompression bonding, the support film was peeled off from the transfer film. As a result, the film forming material layer 1 and the film forming material 2 are formed on the surface of the glass substrate.
Was transferred and brought into close contact. When the film thickness of this laminated film was measured, it was in the range of 60 μm ± 1 μm.

[Firing Step of Film Forming Material Layer] The transferred film forming material layer is heated from room temperature to 570 ° C. at a rate of 10 ° C./min.
The temperature was raised to 570 ° C., and firing was performed for 30 minutes in a temperature atmosphere of 570 ° C., thereby forming a dielectric layer made of a glass sintered body on the surface of the glass substrate. When the film thickness of this dielectric layer was measured, it was in the range of 30 μm ± 0.5 μm, and the film was excellent in uniformity in film thickness.

[Evaluation of Performance of Dielectric Layer]
Five panel materials made of a glass substrate having a dielectric layer were prepared. When the cross section and the surface of the formed dielectric layer were observed with a scanning electron microscope, no film defects such as pinholes and cracks were found in the dielectric layers formed on all the panel materials. An electron microscope (SEM-4200 manufactured by Hitachi, Ltd.)
As a result, it was found that the low-melting glass did not soften and flow to erode between the bus electrode and the transparent conductive film, nor did the bus electrode peel from the transparent conductive film. No coloration of the bus electrode was observed by visual observation of the appearance. Further, five panel materials made of a glass substrate having a dielectric layer were prepared in this way, and the light transmittance (measuring wavelength 550 nm) of the formed dielectric layer was measured. The value was 83%, and it was confirmed that the composition had good transparency. Table 1 shows the above results.

<Comparative Example 1> A glass paste composition 1 was applied on a glass substrate similar to that used in the examples by using a screen printing method, and dried to completely remove the solvent. The forming material layer 1 was formed. Next, the glass paste composition 2 was applied and dried to completely remove the solvent, thereby forming the film-forming material layer 2. When the film thickness of the laminated film of the obtained film forming material layer was measured,
It was in the range of 60 μm ± 3.0 μm. Next, a dielectric layer was formed on the surface of the glass substrate and evaluated in the same manner as in the examples. The results are shown in Table 1.

<Comparative Examples 2 and 3> A transfer film was prepared in the same manner as in Example except that the glass paste compositions shown in Table 1 were used, and in the same manner as in Example except that the transfer film was used. Then, a dielectric layer was formed and evaluated. The results are shown in Table 1.

[0036]

[Table 1]

[0037]

According to the method of the present invention, the manufacturing efficiency of the plasma display panel can be improved in the step of forming the dielectric layer by a simple method including the step of transferring the film forming material layer. Further, according to the method of the present invention, a dielectric layer having a large thickness can be formed while maintaining uniformity and smoothness of the film thickness, and is a dielectric layer required for a large panel. Can also be formed efficiently. Further, according to the method of the present invention, it is possible to form a dielectric layer such that the bus electrode does not peel off from the transparent electrode. In addition, even if a dielectric layer is formed on a thick bus electrode mainly composed of silver by a dry film method, the dielectric layer is formed so that the bus electrode is not colored during firing. can do. Therefore, stable dielectric properties are exhibited by such a highly reliable dielectric layer, and as a result, display defects such as uneven brightness do not occur in the PDP manufactured by the method of the present invention.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a cross-sectional shape of an AC type plasma display panel.

FIG. 2 is a schematic view showing cross-sectional shapes of a normal bus electrode state (a state in which the electrodes are in close contact) and a peeled bus electrode state (a state in which the electrodes are peeled) in the plasma display panel.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate (front substrate) 2 Glass substrate (rear substrate) 3 Partition wall 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Fluorescent substance 8 Dielectric layer (front substrate) 9 Dielectric layer (rear substrate) 10 Protective layer

Continued on front page F-term (reference) 3B005 FC08X FC20X FG08Z FG20Z 4F100 AG00A AG00B AG00C AG001 AK25A AK25B AK42C AS00A AS00B AT00C BA03 BA07 BA10A BA10C BA13 BA26 CC00A CC00B DE01A DE01B EC041 E41B05 J041 E04B05 J041 E04B01 J041 5C027 AA05 5C040 FA01 GD02 GD07 GD09 JA19 JA21 JA40 KA07 KA17 KB04 KB06 KB11 LA17 MA26

Claims (2)

[Claims] A laminated film of a first film forming material layer containing glass powder and a second film forming material layer containing glass powder having a different softening point from the first film forming material layer is supported. A transfer film, which is formed on a film. 2. A dielectric layer is formed on the surface of the glass substrate by transferring the transfer film according to claim 1 onto a glass substrate to which electrodes are fixed, and baking the transferred film forming material layer. A method for manufacturing a plasma display panel.