JP2000087526A - Substrate preparation and tape therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape capable of quickly performing substrate treatment for joints of boards in a dry type simple work without requiring a high skill compared to a wet type substrate preparation. SOLUTION: This tape 1 for substrate preparation has a resin-impregnated layer 3 with a width smaller than that of the central portion of a strip-shaped pasteboard 2 along the longitudinal direction, and synthetic resin sheets 4 narrower than the width of the resin-impregnated layer 3 adhered to the surface of the resin-impregnated layer 3; and an adhesive 5 is coated to the surface portion of the pasteboard including these synthetic resin sheets 4. In the case of the tape for a corner, two slender synthetic resin sheets 4 are arranged at the intervals of several millimeters. Edge portions at both the sides of the pasteboard 2 are so prepared that the outer side gradually becomes thinner. This tape for substrate preparation is adhered to the joint position of the boards and an interior finishing material such as cloth is adhered to the surface of joint tapes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foundation treatment method for shaping joints and corners of a foundation material such as a board provided on a wall of a building, and a base treatment tape suitable for use in the method. is there.

[0002]

2. Description of the Related Art Generally, the inner wall of a building is constructed by joining various boards. The surface of these boards is usually affixed with an interior material such as wallpaper, cloth, or painted. In this case, since a groove-shaped recess or a step appears at the joint (joint portion) of the board, when the interior material is stuck as it is, a groove-shaped recess or a step appears on the surface of the interior material. Not preferred. In addition, corner parts such as the outside corner and the inside corner of the room,
It is formed by abutting the ends of the board. However, in this case as well, a seam line of the board appears on the surface of the interior material as it is, which is not preferable from an aesthetic standpoint.

[0003]

A method which has heretofore been adopted as a base treatment method for eliminating the groove-like concave portions and steps of the seam of the board is a wet method using putty and water. In this method, a mesh-shaped joint tape is placed at the seam of the board to obtain strength, and a putty kneaded with water is applied from above and dried, and further overcoated after drying, and after drying of the overcoated, It was a method of polishing and finishing with sandpaper.

[0004] However, in the above-mentioned conventional construction method, there is a problem in occupational hygiene because putty dust is generated. Also,
Since it is a wet method, there is a problem that there is a lot of loss time, such as the time to wait for the putty to dry and the time to clear up, and the cost is high because skilled workers and various tools are required. I was

Accordingly, the present invention is an improvement over the above-mentioned conventional wet-type surface treatment method, which does not require much skill and is economical in that the dry-type simple operation can quickly perform the surface treatment of the seam of the board. An object of the present invention is to provide a construction method and a base treatment tape suitable for use in the method.

[0006]

In order to solve the above problems, the present invention provides the following manufacturing method. That is, the foundation treatment construction method according to the first invention is a construction method for shaping a seam of a board serving as a base material of an interior material, and arranging a synthetic resin sheet covering the seam on a surface of the seam of the board, A paper having a resin impregnated layer having a width wider than the width of the synthetic resin sheet is arranged on the outer surface of the synthetic resin sheet, and the paper is stuck and fixed to a base, and both sides of the paper are gently along the seam. It is characterized by being thinner.

Further, in the base treatment tape according to the second invention, a resin-impregnated layer is provided along the longitudinal direction with a width smaller than the width of the mount at the center of the band-shaped mount, and It is characterized in that a synthetic resin sheet having a width smaller than the width of the impregnated layer is superimposed on the surface, and an adhesive is applied to the surface of the mount including these synthetic resin sheets. In this case, it is preferable to process both sides of the backing sheet into a gentle slope such that the outside becomes gradually thinner.

[0008] Further, in the base treatment tape according to the third invention, a resin-impregnated layer is provided along the longitudinal direction at a central portion of the band-shaped backing paper with a width smaller than the width of the backing paper. It is characterized in that two strip-shaped synthetic resin sheets are adhered in parallel to each other at a predetermined interval on the surface, and an adhesive is applied to the surface of the mount including these two synthetic resin sheets. Also in this case, it is preferable that both sides of the mount are processed into a gentle slope such that the outside gradually becomes thinner.

[0009] According to the method of the present invention, since conventional putty is not used to close the seam of the board, dust and the like do not cause a problem. In addition, since it is not necessary to wait for the putty to dry, the processing can be performed in a very short time. If the undercoating tape of the present invention is used for this construction, the seam can be closed simply by pressing the tape on the seam of the board, so that the operation is simple and no special tools or skills are required. There is an advantage.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to specific examples. FIGS. 1 and 2 exemplify a tape for joint treatment, which is one type of tape for base treatment according to the present invention. This tape 1 for base treatment has a band-shaped backing sheet 2 and the width of the backing sheet 2. A resin-impregnated layer 3 is formed at a central portion in the direction in a range slightly smaller than the width of the mount. The backing sheet 2 has a thickness and strength that can be shaved by sandpaper or the like.
It is about 150 mm.

The resin impregnated layer 3 provided within the width of the mount 2 is a layer in which the mount is impregnated with a thermosetting resin. As the impregnating resin, for example, polyester resin, acrylic resin, etc. Can be used. The width of the resin impregnated layer 3 is, for example, 50 to 7
On both sides of the resin-impregnated layer 3, a mount portion not impregnated with the resin is exposed. The mount-exposed portion 2a is a portion for absorbing a step by gently shaving the surface at the time of construction, and is preferably about 20 to 30 mm.

A resin sheet 4 is overlapped on the center of the resin impregnated layer 3 in the width direction. This resin sheet is for closing the concave portion of the board seam, and it is preferable to use a resin sheet material having such a strength that the resin sheet is not dented when pressed with a finger after construction. As this resin sheet, for example, a thickness of 30
Polyester films of ~ 300 microns, more preferably 50-100 microns, can be used. Note that the width of the resin sheet 4 is preferably slightly smaller than the resin impregnated layer 3, for example, 45 to 55 mm.

A coating layer of an adhesive 5 is formed on the surface of the mount 2 including the resin impregnated layer 3 and the resin sheet 4, and a release paper 6 having the same width as the mount 2 is overlaid on the surface. Therefore, the base treatment sheet 1 can be easily attached to a desired location by peeling off the release paper 6. The width of the pressure-sensitive adhesive layer 5 is slightly smaller than the width of the backing sheet 2 and slightly larger than the width of the resin-impregnated layer 3. Note that the width of the adhesive layer 5 may be the same as the width of the mount 2.

The undercoating tape 1 is in the form of a strip having a predetermined width, and is manufactured, for example, as follows. First, a resin is impregnated at a predetermined width in a central portion in the width direction of a band-shaped backing sheet 2 having a predetermined width to form a resin-impregnated layer 3. A resin sheet 4 is attached to the center of the surface of the resin impregnated layer 3 in the width direction using an adhesive. Next, a release paper 6 coated with a known pressure-sensitive adhesive 5 is put on the surface and attached. Thereby, the adhesive 5
Adhere to the surface of the backing sheet 2, the resin-impregnated layer 3, and the resin sheet 4 in a layered manner, and the release paper 6 is covered thereon. The release paper 6 can be easily peeled off from the surface of the pressure-sensitive adhesive layer 5.

The undercoating tape 1 may be manufactured for each strip. However, a wide backing sheet is prepared, and a resin impregnated layer 3 having a predetermined width is formed at an appropriate interval to form a tape on each impregnated layer. If a method is used in which a resin sheet 4 is attached to the base material, and a release paper having the same width as the mount is coated with an adhesive 5 and then adhered, and then separated into individual strips, efficient production can be achieved.
It is preferable that the base treatment tape 1 be wound in a roll shape and be pulled out and cut to a necessary length when used. If you do this,
It is convenient for handling and transportation during storage and use.

Next, FIGS. 4 and 5 show an embodiment different from the above. The base treatment tape 10 is attached to a corner portion such as an outgoing corner or an ingoing corner to shape a seam of a board. The mounting paper 2, the resin-impregnated layer 3, the adhesive layer 5, and the release paper 6 are the same as the joint tape 1, but instead of the resin sheet 4, narrow resin sheets 40, 40 are used. Are attached in parallel at an interval t. This resin sheet 40
Is narrower than the resin-impregnated layer 3 even when two sheets are combined, and is preferably, for example, 15 to 30 mm. In addition,
The interval t between the two sheets is preferably several mm, for example, about 2 to 3 mm.

The corner undercoating tape 10 can also be manufactured by the same manufacturing method as the joint undercoating tape 1 described above.

Next, a construction method using the base treating tapes 1 and 10 will be described. First, in the case of the joint tape 1, as shown in FIG.
The base treatment tape 1 is attached so that the resin sheet 4 covers the groove-shaped concave portion of the seam J. In this case, it is only necessary to peel off the release paper 6 to expose the pressure-sensitive adhesive layer 5 and press it against the board.

When the tape 10 for corners is used, as shown in FIG. 6, the tape 10 for groundwork is attached to the corner C of the building. In this case, the two resin sheets 40, 40 are stuck so that the interval (t) is located at the sharp edge of the corner. This attachment may be performed by peeling the release paper 6 to expose the adhesive layer 5 and pressing it.

After the base treatment tapes 1 and 10 are attached, the exposed portions of the backing paper on both sides thereof are ground with sandpaper or the like so that the end sides become gradually lower. If the side edges of the joint tape are inclined as described above, no step is formed at the boundary between the board surface and the backing sheet when the interior material is later attached. It is convenient to use the tapes 1 and 10 on both sides of the backing paper 2 that have gentle slopes so that the outside becomes thinner, because the on-site grinding process is unnecessary.

An interior material such as wallpaper, cloth, or the like is stuck on the tapes 1 and 10 for base treatment. Since the resin sheet 4 (40, 40) is overlaid on the surface of the backing sheet 2, there is a possibility that a linear step may occur at the side edge of the resin sheet. Are formed and are reinforced more than the strength of the mount itself, so this step does not appear on the surface.

Further, according to this construction method, it is possible to easily cover the groove-shaped recess formed at the seam of the board or the like constituting the wall surface of the building so that the recess does not appear on the surface of the interior material. This construction method is dry and not only does not require a waiting time for drying, but is also economical because it does not require skilled or special tools.

[0023]

As is apparent from the above description, according to the present invention, it is possible to easily and quickly cover a concave portion formed at a seam of a board as a building material so that it does not appear on the surface of the interior material. Therefore, it is possible to obtain a beautiful finish. In the present invention, since no putty is used as in the related art, dust is not generated, and a loss time for drying and clearing can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a front view of a joint tape which is an example of a base treatment tape.

FIG. 2 is a schematic cross-sectional view thereof.

FIG. 3 is an explanatory view of a construction method, (a) is a front view,
(B) is a sectional view.

FIG. 4 is a front view of a corner tape, which is another example of the base treatment tape.

FIG. 5 is a schematic cross-sectional view thereof.

FIG. 6 is an explanatory view of a construction method.

[Explanation of symbols]

 1,10 Base treatment tape 2 Backing paper 3 Resin impregnated layer 4,40 Resin sheet 5 Adhesive 6 Release paper B Board

Claims (4)

[Claims] 1. A base treatment method for shaping a seam of a board serving as a base material of an interior material, wherein a synthetic resin sheet covering the seam is disposed on a surface of the seam of the board, and an outer surface of the synthetic resin sheet is provided. A paper on which a resin impregnated layer having a width greater than the width of the synthetic resin sheet is formed is arranged and adhered to a base, and both sides of the paper are gently thinned along the seams. The groundwork construction method. 2. A resin-impregnated layer having a width smaller than the width of the mount and provided along the longitudinal direction at the center of the band-shaped mount, and having a width smaller than the width of the impregnated layer on the surface of the resin-impregnated layer. A base treatment tape, wherein a synthetic resin sheet is adhered, and an adhesive is applied to a surface portion of a backing sheet including the synthetic resin sheet. 3. A resin-impregnated layer having a width smaller than the width of the mount and provided along the longitudinal direction at the center of the band-shaped mount, and two strip-shaped synthetic resin sheets are provided on a surface of the resin-impregnated layer in a predetermined manner. A base treatment tape characterized in that an adhesive is applied to a surface portion of a mount including these two synthetic resin sheets, which are adhered in parallel to each other at an interval. 4. The both sides of the mount are formed as gentle slopes so that the outside becomes gradually lower.
Or the undercoating tape according to claim 3.