JP2000077911A - Multilayer-transmission-line and electronic part using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer-transmission-line which suppresses the fluctuation of combined capacitance between upper and lower transmission lines and has desired characteristic impedance and to provide an electronic part using it. SOLUTION: In this multilayer-transmission-line which successively laminates a transmission line conductor 6 and transmission line conductors 7 to 9 placed almost opposite to it through dielectric ceramic layers, the line width of the transmission line conductors 6 and 8 is constructed to mutually differ from the line width of the transmission line conductors 7 and 9 between opposite upper and lower transmission lines. Thus, it is possible to absorb the stack deviation of the transmission line conductors to obtain a multilayer-transmission- line which suppresses the fluctuation of combined capacitance between the respective transmission lines and has desired characteristic impedance.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a first transmission line,
A second at least part of which is substantially opposed to the first transmission line;
The present invention relates to a multilayer transmission line in which a transmission line is laminated via a dielectric layer, and an electronic component using the multilayer transmission line.

[0002]

2. Description of the Related Art Hitherto, for example, a structure as shown in FIG. 8 has been proposed as a transmission line for transmitting a high-frequency signal or the like. In this transmission line, dielectric layers 41, 42, 43, and 44 made of a dielectric substrate or a dielectric sheet are sequentially laminated, and ground conductors 45a and 45b are provided on the surfaces of the dielectric layers 42 and 44, respectively. Ground conductor 45
A transmission line conductor 46 having a meandering shape is provided on the surface of a dielectric layer 43 disposed between the transmission line conductors 46a and 45b. It is formed as a strip line.

However, such a transmission line has the following problems.
Since the transmission line conductor 46 is provided only on the dielectric layer 43 of the layer, if the line length of the transmission line conductor 46 is to be increased, it is necessary to increase the substrate area, and the line length is naturally limited. .

On the other hand, Japanese Patent Publication No. Hei 8-508615 discloses that a plurality of dielectric layers and a plurality of transmission line conductors are laminated as shown in FIGS. There has been proposed a multilayer transmission line having a configuration in which conductors are substantially opposed to each other in a stacking direction via a dielectric layer.

In this multi-layer transmission line 50, dielectric layers 51, 52, 53, 54 and 55 are sequentially laminated, and the surface of each of the dielectric layers 52 to 55 has a substantially rectangular shape partially open. Transmission line conductors 57a, 57b, 5
7c and 57d are provided. The uppermost dielectric layer 51 is provided with a through hole 56a at a position corresponding to one end of the transmission line conductor 57a, and an electric signal is supplied to the transmission line conductor 57a from a signal input unit (not shown). You. The other end of the transmission line conductor 57a and one end of the transmission line conductor 57b, the other end of the transmission line conductor 57b and one end of the transmission line conductor 57c, the other end of the transmission line conductor 57c and one end of the transmission line conductor 57d are respectively inductive. Body layer 5
Through holes 56b, 56c provided in 2, 53 and 54
And 56d are connected in a stacked state. Further, the transmission line conductors 57a to 57d are formed of the respective dielectric layers 52 to 5
5, the electric signal propagating through each of the transmission line conductors 57a to 57d is, as shown by an arrow a in the figure, an electric signal propagating through each of the transmission line conductors 57a to 57d.
Through 57d to flow in the same direction.

According to the multilayer transmission line 50, since the transmission line is formed over multiple layers, the line length can be made long, and downsizing of electronic components such as an LC resonator using the transmission line can be achieved.

[0007]

However, in the multilayer transmission line 50 shown in FIGS. 9 and 10, the line width w of each of the transmission line conductors 57a to 57d is set to the same length, and the dielectric layer 51 When stacking layers 55 to 55 (substrate thickness t), a stacking shift or the like occurs between the dielectric layers 51 to 55, and as a result, as shown in FIG. Between the transmission line conductors 57a 'and 57b', or between the transmission line conductors 57c 'and 57b'.
In some cases, a deviation Δw may occur between d ′ and the like.

[0008] As described above, when the opposing positions of the upper and lower transmission line conductors in the multi-layer transmission line are shifted, the variation of the coupling capacitance between the transmission line conductors becomes large, and a desired characteristic impedance cannot be obtained. This has a great effect on the characteristic fluctuation of the electronic component. In particular, when a transmission line having a high inductance component is formed, the line width of each transmission line conductor needs to be reduced, so that the characteristic fluctuation may be further increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. It is an object of the present invention to suppress a variation in coupling capacitance between upper and lower transmission lines, to provide a multilayer transmission line having a desired characteristic impedance, and And an electronic component using the same.

[0010]

In order to solve the above-mentioned problems, a multilayer transmission line according to the present invention comprises a first transmission line and a second transmission line at least part of which is substantially opposed to the first transmission line. In a multi-layer transmission line laminated with a dielectric layer interposed therebetween, the line width of the first transmission line and the line width of the second transmission line are different between opposing transmission lines. I do.

Further, the multilayer transmission line of the present invention is characterized in that the first
Assuming that the line width of the transmission line is WA, the line width of the second transmission line is WB, and the distance between the transmission lines is T, WA <WB and T / WB < 3 is characterized.

Further, an electronic component according to the present invention is characterized by using the multilayer transmission line according to the first or second aspect.

[0013] According to the multilayer transmission line of the present invention, the first transmission line formed in a predetermined pattern and the second transmission line at least partially facing the first transmission line via the dielectric layer. In the multi-layered transmission line, the line width of the first transmission line and the line width of the second transmission line are different between opposing transmission lines.
The stacking deviation of the transmission line conductors can be absorbed, and the variation of the coupling capacitance between the transmission lines is suppressed, so that a multilayer transmission line having a desired characteristic impedance can be obtained.

In the multilayer transmission line of the present invention, when the line width of the first transmission line is WA, the line width of the second transmission line is WB, and the distance between the transmission lines is T, By setting WA <WB and T / WB <3 (1) between the transmission lines to be formed, even if the line width is small and the distance between the upper and lower transmission lines is short, normal stacking at the time of lamination or the like is performed. The displacement can be sufficiently absorbed.

Further, according to the electronic component of the present invention, since the above-described multilayer transmission line of the present invention is used, the electronic component such as a high-frequency switch, a high-frequency filter, a high-frequency delay circuit, and the like, which has a small characteristic variation, can be obtained. Can be

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first example of a multilayer transmission line according to the present invention.
FIG. 2 is an exploded perspective view of the embodiment, and FIG. 2 is a schematic sectional view thereof. However, FIG. 2A is a cross-sectional view taken along line AA of each dielectric layer in FIG.

As shown in FIGS. 1 and 2, a multilayer transmission line (multilayer transmission line structure) 17 according to the present embodiment has a dielectric layer 1 made of a dielectric substrate or a dielectric sheet and a part thereof being open. Transmission line conductor 6 formed in a substantially square shape
A dielectric layer 2 having a transmission line conductor 7 substantially opposing the transmission line conductor 6, a dielectric layer 4 having a transmission line conductor 8 substantially opposing the transmission line conductor 7, This is a multilayer transmission line in which a transmission line conductor 8 and a dielectric layer 5 having a transmission line conductor 9 substantially opposed to each other are sequentially laminated.

The protective dielectric layer 1 is provided with a through hole 10a at a position corresponding to one end of the transmission line conductor 6, and an electric signal is supplied to the transmission line conductor 6 from a signal input portion (not shown). Is done. Further, the other end of the transmission line conductor 6 and one end of the transmission line conductor 7, the other end of the transmission line conductor 7 and one end of the transmission line conductor 8, the other end of the transmission line conductor 8 and one end of the transmission line conductor 9 are respectively inductive. They are connected in a laminated state by through holes 10b, 10c and 10d provided in the body layers 2, 3 and 4. The transmission line conductors 6 to 9
Are substantially opposed to each other in the stacking direction of the dielectric layers 1 to 5, and the electric signals propagating through the transmission line conductors 6 to 9 are, as shown by arrows a in the figure, -9 are configured to flow in the same direction.

Further, according to the present invention, the line width of each transmission line differs between the upper and lower transmission line conductors facing each other. In the present embodiment, as shown in FIG. 2, the transmission line conductor 6 on the dielectric layer 2 has a width W ₁ , the transmission line conductor 7 on the dielectric layer 3 has a width W ₂ , and the transmission on the dielectric layer 4 The line conductor 8 has a width W ₁ , and the transmission line conductor 9 on the dielectric layer 4 has a width W ₂ (W ₁ <W ₂ ), and the transmission line conductors 6, 7, 8
And 9 are almost aligned at the center.

That is, in the present invention, the width W
₁ , W ₂ , W ₃ , W ₄ ,..., W _2n−1 , W _{2 n} (where n is an arbitrary natural number, W ₁ = W ₃ =... = W _2n−1 , and W ₂ = W
₄ =... = W _2n ), when a plurality of transmission line conductors having a dielectric layer are laminated via a dielectric layer, the difference between the vertically adjacent transmission line conductors is Δw, and Δw <| W _2n −W _2n If the width of each transmission line conductor is different so that _-1 |
Even if stacking misalignment during lamination or misalignment during firing due to different shrinkage rates occurs, the misalignment can be sufficiently absorbed as compared to the case where transmission line conductors having the same line width are stacked, and therefore, up and down. Fluctuations in coupling capacitance between transmission line conductors can be reduced. That is, since the line width difference (| W _2n −W _2n−1 |) in the upper and lower transmission lines is larger than the stacking deviation amount (Δw), the variation in the coupling capacitance of the transmission lines is suppressed to a minimum, and When it has a characteristic impedance and particularly has a high inductance component, a multilayer transmission line having a large Q value can be formed, and as a result, electronic components excellent in various characteristics can be obtained.

In the present invention, it is desirable that the above-mentioned expression (1) is satisfied. For example, in the present embodiment, specifically, as shown in FIG. 2, the line width of the transmission line conductor 6 is W ₁ , and the transmission line conductor 7 is the width W ₂ (W
₁ <W ₂ ), when the distance between the transmission line conductor 6 and the transmission line conductor 7 is T, W ₁ <W ₂ and T / W ₂ <3 hold. As a result, even when the widths W ₁ and W ₂ are small and the distance between the upper and lower transmission lines is short, it is possible to sufficiently control the variation in the coupling capacitance due to stacking deviation or the like during lamination.
Variations in characteristics of each product can be further reduced.

Further, in the multilayer transmission line according to the present embodiment, since the transmission direction of the electric signal is the same direction at the position facing each transmission line, the orbit of the magnetic flux generated around each transmission line conductor. The directions are the same as each other. Therefore, when the distance between the opposing upper and lower transmission line conductors is reduced,
The coupling between the transmission line conductors increases.

That is, in FIG. 1, the through hole 10a
When a high-frequency signal is input through the transmission line conductor 6,
Since the traveling directions of the high-frequency signals sequentially propagating through the transmission line conductor 7, the transmission line conductor 8, and the transmission line conductor 9 are in the same direction, the transmission line conductors are electromagnetically coupled by the magnetic flux circling in the same direction. Will be. In particular, by setting the distance between the transmission line conductors to a predetermined interval, the coupling capacitance between the transmission line conductors can be increased, and a desired characteristic impedance can be obtained.

FIG. 3 is a schematic sectional view of a multilayer transmission line according to a second embodiment of the present invention.

As shown in FIG. 3, the multilayer transmission line 18 according to the present embodiment has a protection dielectric layer 12a and a width W _3.
A dielectric layer 12b on which a transmission line conductor 13a is formed;
Dielectric layer 12 on which transmission line conductor 13b of width W ₄ is formed
c, a dielectric layer 12d on which a transmission line conductor 13c having a width W ₅ is formed, and a dielectric layer 12e on which a transmission line conductor 13d having a width W ₆ is formed.

Here, in the multilayer transmission line 18 according to the present embodiment, the line widths W ₃ , W ₄ , W ₅ of the respective transmission line conductors.
And W ₆ satisfy the relationship of W ₃ <W ₄ <W ₅ <W ₆ , and the difference in line width between the opposing transmission line conductors is larger than the difference due to lamination or firing. , A variation in coupling capacitance between wires is small, and a multilayer transmission line having a desired characteristic impedance can be obtained.

That is, the widths W ₁ , W ₂ , W ₃ .
W _n , W _{n + 1} (where n is an arbitrary natural number and W ₁ <W ₂
<W ₃ ... <W _n <W _{n + 1} . If) are laminated via a dielectric layer transmission line conductor having, when [Delta] w stacking deviation of the transmission line conductors to each other to vertically _{adjacent, Δw <| W n + 1} -W n | so holds that each transmission If the line widths of the line conductors are different, even if the stacking deviation during lamination or the deviation during firing due to different shrinkage rates occurs, this deviation is sufficiently reduced compared to the case where the transmission line conductors with the same line width are stacked. Therefore, the fluctuation of the coupling capacitance generated between the upper and lower transmission line conductors can be reduced. That is, the difference in line width (| W _{n + 1} −W _n |) between the upper and lower transmission lines is larger than the stacking deviation amount (Δw), so that the variation in the coupling capacitance of the transmission line can be minimized. A multilayer transmission line having a large Q value can be formed even when a desired characteristic impedance is provided and the inductance component is particularly high. As a result, an electronic component such as a high-frequency switch with little characteristic fluctuation can be obtained.

FIG. 4 is a schematic sectional view of a multilayer transmission line according to a third embodiment of the present invention.

As shown in FIG. 4, the multilayer transmission line 19 according to the present embodiment has a protection dielectric layer 15a and a width W _7.
A dielectric layer 15b on which a transmission line conductor 16a is formed;
Dielectric layer 15 on which transmission line conductor 16b of width W ₈ is formed
c, a dielectric layer 15d on which a transmission line conductor 16c having a width W ₉ is formed, a dielectric layer 15e on which a transmission line conductor 16d having a width W ₁₀ is formed, and a transmission line conductor 16e having a width W _11. This is a multi-layer transmission line in which five dielectric layers 15f are sequentially laminated and five transmission line conductors are laminated.

Here, in the multilayer transmission line 19 according to the present embodiment, the line widths W ₇ , W ₈ ,
W ₉ , W ₁₀ and W ₁₁ are respectively W ₇ <W ₈ , W ₈ > W ₉ ,
The relationship of W ₉ <W ₁₀ and W ₁₀ <W ₁₁ is satisfied, and if the difference between the widths of the upper and lower transmission lines is made larger than the stacking deviation at the time of lamination and the deviation at the time of sintering due to different shrinkage ratios, the wiring Thus, a multilayer transmission line having a desired characteristic impedance with little variation in the coupling capacitance and an electronic component excellent in various characteristics can be obtained.

FIG. 5 is an exploded perspective view showing the configuration of each layer of a multilayer transmission line according to a fourth embodiment of the present invention.

As shown in FIG. 5, the multi-layer transmission line according to the present embodiment has a dielectric layer 1 for protection and a transmission line conductor 20 formed in a substantially rectangular shape with a part opened. A body layer 2, a dielectric layer 3 having a transmission line conductor 21 substantially opposed to the transmission line conductor 20;
Dielectric layer 4 having transmission line conductor 22 substantially facing 1
And a dielectric layer 5 having a transmission line conductor 23 substantially opposed to the transmission line conductor 22, and a multilayer transmission line formed by laminating four transmission line conductors.

The protective dielectric layer 1 is provided with a through-hole 10a at a position corresponding to one end of the transmission line conductor 20.
Is supplied with an input signal. The transmission line conductor 2
0, one end of the transmission line conductor 21, the transmission line conductor 21
The other end of the transmission line conductor 22 and the other end of the transmission line conductor 22 and one end of the transmission line conductor 23 are
Through holes 1 provided in dielectric layers 2, 3 and 4, respectively
Ob, 10c and 10d are connected so that the propagation directions of the electric signals are alternately opposite. Therefore, the propagation direction of the electric signal in the transmission line conductors 20 to 23 is the direction shown by the arrow b in the transmission line conductors 20 and 22, and the direction shown by the arrow c in the figure in the transmission line conductors 21 and 23. Becomes

Further, according to the present invention, the line width of each transmission line is different between the transmission line conductors facing vertically. For example, as in the first embodiment, the transmission line conductors 20 and 22 have a width W ₁ , and the transmission line conductors 21 and 23 have a width W ₂ , where W ₁ <W ₂ (where W ₂ −W ₁ >
ΔW). When the distance between the transmission lines is T, T / W ₂ <3 according to the above-described equation (1).
Holds. Therefore, even if a shift due to a stacking shift during lamination or a difference in shrinkage ratio during sintering occurs, the shift is sufficiently absorbed to suppress a change in the coupling capacitance between the transmission lines, and a desired characteristic impedance is obtained. Is obtained.

In the multi-layer transmission line according to the present embodiment, since the propagation directions of the electric signals are different from each other at the opposing positions between the upper and lower transmission lines, the circling direction of the magnetic flux generated around the transmission line conductor is changed. In the opposite direction. Therefore, when the interval between the upper and lower transmission line conductors facing each other is set to a predetermined value, the coupling between the transmission line conductors is reduced.

That is, when a high-frequency signal is input through the through-hole 10a, the transmission direction of the high-frequency signal in the transmission line conductor 20 (direction of arrow b), the transmission direction of the high-frequency signal in the transmission line conductor 21 (direction of arrow c), The transmission direction of the high-frequency signal in the transmission line conductor 21 (direction of arrow c), the transmission direction of the high-frequency signal in the transmission line conductor 22 (direction of arrow b), and the transmission direction of the high-frequency signal in the transmission line conductor 22 (direction of arrow b). Since the transmission directions (directions of arrows c) of the high-frequency signals in the transmission line conductors 23 are opposite to each other, the circulating directions of the magnetic fluxes generated around the respective transmission line conductors are opposite to each other between the transmission lines. The line conductors are magnetically canceled by the magnetic fluxes circling in opposite directions, and are capacitively coupled. Therefore, a desired characteristic impedance can be obtained by setting the interval between the transmission line conductors to a predetermined interval.

FIG. 6 is a circuit diagram of a multilayer transmission line according to a fifth embodiment of the present invention, and more specifically, an electric equivalent circuit diagram of a high-frequency switch for transmitting and receiving signals.

In this high frequency switch, the transmission circuit terminal Tx is connected to the anode side of the diode D1 via the capacitor C1, and the anode side of the diode D1 is connected to the strip line transmission line STL1 serving as a branch line of the bias circuit. And a ground circuit via a series circuit of a capacitor C2. A connection point between the stripline transmission line STL1 and the capacitor C2 is connected to a voltage control terminal VC1 via a resistor R1, and the voltage control terminal VC1 performs transmission line switching of a high-frequency switch. Control circuit is connected. Then, both ends of the diode D1 (the anode-
Between the cathodes), the strip line transmission line STLt
And a series circuit of a capacitor C3 is connected in parallel. The stripline transmission line STLt and the capacitor C3 are for ensuring isolation when the diode D1 is in the off state. Further, the cathode side of the diode D1 is connected to the antenna terminal ANT via the capacitor C4.

The antenna terminal ANT includes a strip line transmission line STL2 as a main line and a capacitor C6.
Is connected to the receiving circuit terminal Rx via
The receiving circuit terminal Rx is also connected to the anode side of the diode D2 via the capacitor C5. The cathode side of the diode D2 is grounded. Further, a connection point between the diode D2 and the capacitor C5 is connected to a voltage control terminal VC2 via a resistor R2. As with the voltage control terminal VC1, a control circuit for switching the transmission path of the high-frequency switch is connected to the voltage control terminal VC2.

Although not shown, for example, a resistor for stabilizing the voltage at the time of applying a reverse bias and a capacitor for securing the isolation at the time of off-state are connected in parallel with the diode D1. You may. Further, as with the diode D1, a resistor, a capacitor, a transmission line, a capacitor, and the like may be connected to the diode D2. When using the high-frequency switch, the terminal Tx for the transmission circuit, the terminal Rx for the reception circuit, and
Each of the antenna terminals ANT is connected to a transmission circuit, a reception circuit, and an antenna via a coupling capacitor for cutting bias, which is a separate component.

Next, transmission and reception using the high-frequency switch shown in FIG. 6 will be described.

First, when transmitting, a positive potential difference is applied between the voltage control terminals VC1 and VC2. Since this potential difference acts as a forward bias voltage on the diodes D1 and D2, the diodes D1 and D2 are turned on. At this time, the DC component is cut by each capacitor, and the voltage applied to the voltage control terminals VC1 and VC2 is applied only to the circuit including the diodes D1 and D2. Therefore, the stripline transmission line STL2 is grounded by the diode D2, resonates at the transmission frequency, and the impedance becomes almost infinite. As a result, the transmission signal input to the transmission circuit terminal Tx is transmitted to the antenna terminal ANT via the diode D1 without being transmitted to the reception circuit terminal Rx. On the other hand, since the stripline transmission line STL1 is grounded via the capacitor C2, it resonates at the transmission frequency and the impedance becomes almost infinite, so that the stripline transmission line STL1 forms a choke coil and the transmission signal is transmitted to the ground side. To prevent leakage.

When receiving, a negative potential difference is applied between the voltage control terminals VC1 and VC2. Since this voltage acts as a reverse bias voltage on the diodes D1 and D2, the diodes D1 and D2 are turned off, and the reception signal input to the antenna terminal ANT is transmitted to the voltage control terminal Tx. Not done.

As described above, the high-frequency switch according to the present embodiment can appropriately switch the transmission path of the signal for transmission and reception by controlling the bias voltage applied to the voltage control terminals VC1 and VC2.

In the high-frequency switch according to the present embodiment, the strip line transmission lines STL1, STL
Since a multi-layer transmission line having a different line width according to the present invention (for example, a two-layer transmission line having an upper transmission line width of 150 μm and a lower transmission line width of 100 μm) according to the present invention is used, the fluctuation width of the resonance frequency in the resonance circuit is reduced. The fluctuation of the isolation between the antenna ANT and the terminal Tx for the transmitting circuit, and the fluctuation of the impedance and the reactance between the antenna ANT and the terminal Rx for the receiving circuit become smaller,
Variations in characteristics due to manufacturing variations are suppressed, and a high-frequency switch with excellent reliability is obtained.

The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments.

For example, the shape of the transmission line conductor on the dielectric layer is not limited to a substantially rectangular shape as shown in the figure, but may be any shape such as a circle, an ellipse, a rectangle, and a meander. Is applicable. Also, the dielectric layer, for example,
Various shapes such as a sheet shape and a plate shape are applicable. Although not shown, it is preferable that each transmission line conductor is disposed between ground electrodes (ground patterns).

The dielectric layer may be a ceramic dielectric layer,
In particular, a low-temperature sintered ceramic layer is preferable, but a dielectric layer made of a resin, a semiconductor, or the like may be used. Also, as the transmission line conductor, any conductive material such as silver, palladium, a silver-palladium alloy, copper, and gold can be used. Furthermore, as a method of forming a transmission line conductor having a predetermined pattern on the dielectric layer, any method such as a screen printing method, a sputtering method, and a vacuum evaporation method can be applied.

The multi-layer transmission line of the present invention has four layers or five layers.
The present invention is not limited to the transmission line structure having a plurality of layers, and is applicable to a multilayer transmission line structure in which two or three layers, or six or more transmission lines are stacked. The multilayer transmission line of the present invention is not limited to a transmission line having a high inductor component such as a coil, but can be applied to any transmission line such as a stripline or a microstrip line. Further, the electronic component of the present invention is not limited to a high-frequency switch, but can be applied to various uses such as a high-frequency delay circuit and a transmission line in a high-frequency filter.

Further, when the ceramic dielectric layers to be laminated are dielectric layers having different compositions from each other, their shrinkage rates during sintering and the like often differ from each other. Therefore, according to the multilayer transmission line of the present invention, even when the dielectric layers having different compositions from each other are stacked, the shift amount of the upper and lower transmission lines due to sintering or the like is sufficiently absorbed, the variation of the coupling capacitance is small, and the desired A multilayer transmission line having characteristic impedance can be obtained.

Next, the configuration of a specific embodiment of the multilayer transmission line of the present invention will be described with reference to FIG.

Embodiments 1 to 3 As shown in FIG. 7A, a capacitor C having a predetermined capacitance and a strip line S are provided between an input side in and an output side out.
A strip line resonance circuit in which a coil L made of TL was arranged in parallel was constructed.

As shown in FIG. 7B, the coil L in the strip line resonance circuit is connected to the ground electrode 31.
a and the ground electrode 31b.
1b, a dielectric ceramic sheet having a transmission line conductor 33 of a predetermined pattern, and a transmission line conductor 32 substantially opposing the transmission line conductor 33.
And a ground electrode 31
This is manufactured by sequentially laminating dielectric ceramic sheets having a and a firing process or the like.

The coil L is, as shown in FIG.
At a position where the transmission line conductor 32 and the transmission line conductor 33 face each other, a high-frequency signal is transmitted in the same direction. Therefore, the transmission line conductor 32, the transmission line conductor 33
Of the magnetic fluxes generated around the transmission line conductors are the same direction, and the transmission line conductors 32 and 33 are electromagnetically coupled by these magnetic fluxes.

Here, in the present embodiment, the transmission line conductor 32
Is set to 100 μm, and the width Wb of the transmission line conductor 33 is set to 100 μm.
Was set to 150 μm. The distance Ta between the ground electrode 31a and the transmission line conductor 32 is 150 μm, the distance T between the transmission line conductor 32 and the transmission line conductor 33 (the distance between the upper and lower transmission lines) is 25 μm, and the transmission line conductor 33 and the ground electrode 3
The distance Tb to 1b was set to 150 μm. Note that these values satisfy the above-described expression (1).

Then, the center position of the transmission line conductor 32 and the center position of the transmission line conductor 33 were intentionally shifted by a predetermined amount (center fluctuation distance ΔW), and the fluctuation width (MHz) of the resonance frequency at that time was measured. . The measurement results are shown in Table 1 below.
In the first embodiment, the center fluctuation distance ΔW = 0 μm, and the second embodiment
Is the center fluctuation distance ΔW = 25 μm, and the third embodiment is the center fluctuation distance ΔW = 50 μm. The capacitance of the capacitor C was 1 pF.

Comparative Examples 1 to 3 In the same manner as in Examples 1 to 3, except that the line width Wb of the transmission line conductor 33 was set to 100 μm, the center position of the transmission line conductor 32 and the center position of the transmission line conductor 33 were changed. After shifting by a predetermined amount (center fluctuation distance ΔW), the fluctuation width (MHz) of the resonance frequency at that time was measured. That is, this comparative example relates to a multilayer transmission line in which the width of each of the upper and lower transmission lines is the same. The center variation distance ΔW = 0 μm in Comparative Example 1, the center variation distance ΔW = 25 μm in Comparative Example 2, and the center variation distance ΔW = 50 μm in Comparative Example 3. The measurement results are shown in Table 1 below.

[0059]

【table 1】

From Table 1, it can be seen that the resonance circuit according to the present embodiment, in which the line widths of the opposing transmission line conductors are different from each other, is different from the resonance circuit of the comparative example in which the widths of the opposing transmission line conductors are the same. Even if the center position of the line was changed, the fluctuation width of the resonance frequency was small, so that the fluctuation of the characteristic impedance could be suppressed. This means that even if there is some stacking deviation during manufacturing, fluctuations in the coupling capacitance due to the deviation can be sufficiently absorbed, fluctuations in the characteristic impedance can be minimized, there is little variation among products, and high performance and This means that small electronic components can be obtained.

Next, using the strip line resonance circuit shown in FIG. 7, the relationship between the distance T between the upper and lower transmission lines and the shift amount (center variation distance) ΔW was measured for the center frequency (MHz). The measurement results are shown in Table 2 below. In addition,
The width Wa of the transmission line conductor 32 is 100 μm, the width Wb of the transmission line conductor 33 is 150 μm, and the capacitance of the capacitor C is 5 p.
F.

[0062]

[Table 1]

From Table 2, when the distance T between the upper and lower lines is three times the width Wb (Wb = 150 μm) of the transmission line conductor 33 (T
= 450 μm), it can be seen that the stacking deviation hardly affects the center frequency. That is, Wa <W
If b and T / Wb <3, even if the line width is small and the distance between the upper and lower transmission lines is short, the normal stacking deviation at the time of lamination or the like is sufficiently absorbed, and the multilayer having excellent characteristic impedance is obtained. It can be seen that a transmission line is obtained.

[0064]

According to the multilayer transmission line of the present invention, the first transmission line formed in a predetermined pattern and the second transmission line at least partially facing the first transmission line are formed of a dielectric layer. In a multilayer transmission line that is laminated via
Since the line width of the first transmission line and the line width of the second transmission line are different from each other between the opposing transmission lines, a stacking deviation at the time of stacking the transmission lines or the like is absorbed, and the transmission line width is reduced. A multilayer transmission line having a desired characteristic impedance can be obtained by suppressing the variation in the coupling capacitance between the lines.

Further, according to the electronic component of the present invention, since the above-described multilayer transmission line of the present invention is used, the electronic component can be applied to a small high-frequency switch, a high-frequency filter, a high-frequency delay circuit, etc. with little characteristic fluctuation.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a layer configuration of a multilayer transmission line according to a first embodiment of the present invention.

FIG. 2A is a schematic sectional view of each layer of the multilayer transmission line according to the first embodiment of the present invention, and FIG. 2B is a schematic sectional view of the same multilayer transmission line.

FIG. 3 is a schematic sectional view of a multilayer transmission line according to a second embodiment of the present invention.

FIG. 4 is a schematic sectional view of a multilayer transmission line according to a third embodiment of the present invention.

FIG. 5 is an exploded perspective view showing a layer configuration of a multilayer transmission line according to a fourth embodiment of the present invention.

FIG. 6 is a circuit configuration diagram including a multilayer transmission line according to a fifth embodiment of the present invention.

FIG. 7A is a circuit configuration diagram including a multilayer transmission line according to a first embodiment of the present invention, and FIG. 7B is a schematic cross-sectional view of the same multilayer transmission circuit.

FIG. 8 is an exploded perspective view showing a layer configuration of a conventional transmission line.

FIG. 9 is an exploded perspective view showing a layer configuration of a conventional multilayer transmission line.

FIG. 10 is a schematic sectional view of a conventional multilayer transmission line.

FIG. 11 is a schematic cross-sectional view of a conventional multilayer transmission line when a transmission line conductor has a stacking error.

[Explanation of symbols]

 1, 2, 3, 4, 5 ... dielectric layers 6, 7, 8, 9 ... transmission line conductors 10a, 10b, 10c, 10d ... through holes 17 ... multilayer transmission line structure

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5J006 HD08 HD12 LA12 LA21 LA28 5J014 CA02 CA41 CA55 5J024 AA10 CA09 DA28 DA29 DA32

Claims (3)

[Claims] 1. A multi-layer transmission line comprising a first transmission line and a second transmission line at least partly substantially facing the first transmission line laminated via a dielectric layer, wherein: A multilayer transmission line, wherein a line width of the line and a line width of the second transmission line are different from each other between opposing transmission lines. 2. When the line width of the first transmission line is WA, the line width of the second transmission line is WB, and the distance between the transmission lines is T, WA < 2. The multilayer transmission line according to claim 1, wherein WB and T / WB <3. 3. An electronic component using the multilayer transmission line according to claim 1 or 2.