JP2000077332A - Scanning exposure method and apparatus, and manufacture of device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of a positional shift between a wafer and a reticle caused by a reaction of a drive force generated when a stage having the wafer and reticle mounted thereon is accelerated. SOLUTION: The scanning exposure apparatus synchronously moves a reticle 11 and a wafer 6 to transfer a pattern of the reticle 11 onto the wafer 6. In this case, the apparatus includes a reticle stage 9 movable while holding the reticle 11 thereon, and prevention means 14A, 15A, etc., for preventing a positional shift between the reticle 11 and wafer 6 caused by a change in a gravity center of the stage 9 when the stage 9 is moved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scanning exposure method and apparatus for exposing a reticle pattern image onto a wafer by, for example, a so-called slit scan exposure method.

[0002]

2. Description of the Related Art When a semiconductor device or a liquid crystal display device is manufactured by a lithography process, a pattern image of a photomask or a reticle (hereinafter, collectively referred to as a "reticle") is exposed through a projection optical system under exposure light. 2. Description of the Related Art A projection exposure apparatus that projects an image on a photosensitive substrate is used. In such a projection exposure apparatus, there is an increasing demand for a larger field for exposing an image of a larger chip pattern on a reticle onto a photosensitive substrate. In order to respond to the demand for a large field, a so-called slit scan exposure method in which a reticle and a photosensitive substrate are scanned in synchronization with, for example, a slit-shaped or arc-shaped illumination area is effective. Thus, an image of a pattern wider than the illumination area on the reticle can be exposed on the photosensitive substrate.

FIG. 4 shows a projection exposure apparatus of a conventional slit scan exposure system. In FIG. 4, a first column made of invar (an alloy having a low expansion coefficient) is provided on a base 1 via vibration isolating springs 2A and 2B. 3 is placed. A Y stage 4 and an X stage 5 are mounted inside the first column 3, and a wafer 6 as a photosensitive substrate is held on the X stage 5. The lens barrel 7 is fixed to the upper part of the first column 3, and the projection optical system PL is housed inside the lens barrel 7. The Y stage 4 positions the wafer 6 in a direction perpendicular to the plane of FIG. 4 in a plane (horizontal plane) perpendicular to the optical axis of the projection optical system PL, and the X stage 5 perpendicular to the Y axis in a horizontal plane. The wafer 6 is positioned in the X direction. Although not shown, the wafer 6 is located between the X stage 5 and the wafer 6.
A Z stage or the like for positioning the camera in the Z direction which is the optical axis direction of the projection optical system PL is also provided.

A second column 8 made of invar is fixed on the first column 3, and a reticle scanning stage 9 slidable in the X direction is mounted on the upper portion of the second column 8 and transferred onto the reticle scanning stage 9. The reticle 11 on which a pattern for use is formed is held. The pattern on the reticle 11 is illuminated with the exposure light IL emitted from the illumination optical system 10,
The pattern image on the reticle 11 is projected and exposed on the wafer 6 via the projection optical system PL. In this case, the illumination optical system 1
The illuminated area on the reticle 11 with 0 is, for example, a rectangular slit, and the entire illuminated pattern area on the reticle 11 is not illuminated.

[0005] Therefore, at the time of exposure, the reticle scanning stage 9 is driven to scan the reticle 11 at a constant speed V1 in the X direction, which is a direction perpendicular to the longitudinal direction of the illumination region, by driving the reticle scanning stage 9. In sync with this, X
By driving the stage 5, the wafer 6 scans the reticle image in the illumination area in the -X direction at a constant speed V2. Assuming that the projection magnification from the reticle 11 to the wafer 6 by the projection optical system PL is β, the speed V2 is β · V1. By scanning the reticle 11 and the wafer 5 in synchronization in this manner, images of all the patterns of the reticle 11 are projected and exposed on the wafer 6. Thereafter, by driving the Y stage 4 and the X stage 5, the wafer 6
The next upper exposure area moves into the exposure field of the projection optical system PL.

At this time, the vibration generated by driving the reticle scanning stage 9, the Y stage 4 and the X stage 5 is attenuated by the first column 3 and the second column 8. In addition, vibrations from the floor on which the base 1 is installed are absorbed by the vibration isolating springs 2A and 2B and are hardly transmitted to the first column 3 side.

[0007]

In the prior art as described above, it is necessary to scan the reticle 11 and the wafer 6 at the same speed, respectively. From the constant speed scanning until the stage reaches the stationary state, it is necessary to apply a predetermined driving force to the X stage 5 and the reticle scanning stage 9 from the first column 3 and the second column 8 that support them. .

For example, as shown in FIG. 5A, the mass of the reticle scanning stage 9 and the mass of the X stage 5 are each M
Assuming that the accelerations applied to the reticle scanning stage 9 and the X stage 5 are g1 and g2, respectively, as 1 and M2, the driving forces applied to the reticle scanning stage 9 and the X stage 5 are represented by M1 · g1 and M2 · g2, respectively. (Excluding errors due to friction for simplicity). The driving force continues to be applied until each of the stages reaches a constant scanning speed. In this process, due to the reaction, the forces F1 (= −M1 · g1) and F2 (= −M2 · g) in the opposite directions are also applied to the corresponding second column 8 and first column 3, respectively.
2) is added, and the entire first column 3 and the second column 8 may be inclined. Further, as shown in FIG. 5B, when a force F3 is applied to the second column 8 to apply an acceleration g3 to the reticle scanning stage 9, the weak portions 8a and 8b of the second column 8 are deformed. There was also a risk of doing so.

Thus, the first column 3 and the second column 8
When the inclination of the reticle 11 and the deformation of the second column 8 occur, the relative positional relationship between the reticle 11 and the wafer 6 changes, and the pattern on the reticle 11 is superimposed on the already formed circuit pattern on the wafer 6. However, there is a disadvantage that the overlay accuracy at the time of exposure is deteriorated. In addition, if the first column 3 and the second column 8 are formed to have a high rigidity in order to prevent this, the design of the columns becomes difficult, and the columns become complicated and large. Further, there is also a disadvantage that vibrations caused by the inclination and deformation of each column become external forces and deteriorate the position controllability between the reticle 11 and the wafer 6.

In view of the above, the present invention has been made in consideration of the above circumstances. When a stage on which a wafer or a reticle is mounted is accelerated, even if a supporting portion of the stage receives a force in the opposite direction due to a reaction of its driving force, It is an object of the present invention to provide a scanning exposure method and a scanning type exposure apparatus which do not cause a positional shift between the reticle and the reticle. Still another object of the present invention is to provide a device manufacturing method using the scanning exposure method.

[0011]

In order to solve the above-mentioned problems, a scanning exposure apparatus according to a first embodiment of the present invention will be described with reference to the drawings showing one embodiment. Scanning exposure apparatus for exposing the pattern of the mask (11) onto the substrate (6) by moving the mask (11) synchronously with the first stage, the first stage being movable while holding one of the mask (11) and the substrate (6) System (9 or 4, 5) and a mask (1) caused by a change in the center of gravity of the first stage system (9 or 4, 5) when moving the first stage system (9 or 4, 5).
(1) Prevention means (1) for preventing displacement of the substrate (6).
4 to 21).

Further, the scanning type exposure apparatus according to claim 3 is
A scanning exposure apparatus that synchronously moves a mask (11) and a substrate (6) to expose a pattern of the mask (11) onto the substrate (6), wherein one of the mask (11) and the substrate (6) is used. Stage system (9 or 4, 5) that can move while holding
A support member (12A, 12B) for supporting the first stage system (9 or 4, 5);
When moving the first stage system (9 or 4, 5) with respect to 12B), no change occurs in the support members (12A, 12B) due to a change in the center of gravity of the first stage system (9 or 4, 5). Prevention means (14 to 21).

Further, the scanning exposure method according to claim 17 is
A scanning exposure method for synchronously moving a mask (11) having a pattern and a substrate (6) to scan and expose a pattern of the mask (11) to a substrate (6). When driving the first stage system (9 or 4, 5) movable while holding one of the mask (11) and the substrate due to a change in the center of gravity of the first stage system (9 or 4, 5). Positional deviation from (6) is prevented.

Next, the device manufacturing method according to the present invention comprises:
A scanning exposure method or a scanning exposure apparatus according to the present invention is used.

[0015]

According to the scanning exposure apparatus of the first aspect, when the first stage system (9 or 4, 5) is moved, the center of gravity of the first stage system (9 or 4, 5) changes. (14 to 21) for preventing the mask (11) from being displaced from the substrate (6) caused by the above, it is possible to accurately expose the pattern of the mask (11) to the substrate (6). it can.

The scanning exposure apparatus according to claim 3 is
When moving the first stage system (9 or 4, 5) with respect to the support members (12A, 12B) supporting the first stage system (9 or 4, 5), the first stage system (9 or 4, 5) is moved. Due to the change in the center of gravity of 5), the support members (12A, 12A)
B) Prevention means (14 to 2) for preventing fluctuations
Because of the configuration (1), the support members (12A, 12B) do not tilt or deform. Therefore, the overlay accuracy of the conjugate image of the mask (11) and the substrate (6) is improved.

Further, the scanning exposure method according to the seventeenth aspect,
When driving the movable first stage system (9 or 4, 5) while holding one of the mask (11) and the substrate (6), the center of gravity of the first stage system (9 or 4, 5) is driven. Since the displacement between the mask (11) and the substrate (6) due to the change is prevented, the pattern of the mask (11) can be accurately exposed on the substrate (6).

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. In this embodiment, the present invention is applied to a projection exposure apparatus of a slit scan exposure type, and FIG.
3 to 3, parts corresponding to those in FIG. 4 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 shows a projection exposure apparatus according to the present embodiment. In FIG. 1, an anti-vibration spring 2A and 2B
The first column 12A made of Invar (an alloy having a low expansion coefficient) is placed via the, and the second column 12B made of Invar is fixed on the first column 12A. The wafer 6 is held inside the first column 12A via the Y stage 4 and the X stage 5, and the projection optical system PL is held via the lens barrel 7 above the first column 12A. The reticle 11 is held above the second column 12B via the reticle scanning stage 9. The illumination optical system 10 of this example also illuminates a slit-shaped illumination area on the reticle 11, and scans the wafer 6 in the −X direction in synchronization with scanning the reticle 11 in the X direction with respect to the illumination area. Thus, the image of the pattern of the reticle 11 is exposed on the wafer 6 by the slit scan exposure method.

In this embodiment, a fixed column 13 made of invar is planted on the peripheral portion of the base 1. Then, three permanent magnet embedded portions 14A to 14C are formed on the upper surface of the convex portion 12a on one side surface in the X direction of the first column 12A (only 14A is shown in FIG. 1), and these permanent magnet embedded portions are formed. Three electromagnet portions 15A to 15C are formed on the bottom of the convex portion 13a of the fixed column 13 so as to face the 14A to 14C (only 15A is shown in FIG. 1). Contrary to this, the protrusion 1 on the other side surface of the first column 12A in the X direction is used.
2b, three permanent magnet embedded portions 16A to 16C on the upper surface
(Only 16A is shown in FIG. 1), and these permanent magnet embedded portions 16A to 16C are opposed to each other.
Three electromagnet portions 1 are provided at the bottom of the convex portion 13b of the fixed column 13.
7A to 17C are formed (only 15A is shown in FIG. 1). Three sets of linear motors are constituted by the permanent magnet embedded portions 14A to 14C and the corresponding electromagnet portions 15A to 15C.

Also, two permanent magnet embedded portions 1 are provided on the upper surface of one convex portion 12c in the X direction at the upper end of the second column 12B.
8A and 18B (only 18A is shown in FIG. 1), and two electromagnet portions 19A are provided on the bottom of the convex portion 13c at the upper end of the fixed column 13 so as to face the permanent magnet embedded portions 18A and 18B. And 19B (only 19A appears in FIG. 1). In contrast to this, the second
Two permanent magnet embedded portions 20A and 20B are formed on the upper surface of the other convex portion 12d in the X direction at the upper end of the column 12B (only 20A is shown in FIG. 1), and these permanent magnet embedded portions 20A and 20B are formed. Two electromagnet parts 2 are provided on the bottom of the convex part 13d at the upper end of the fixed column 13 so as to face each other.
1A and 21B are formed (only 21A is shown in FIG. 1).

FIG. 2 is a sectional view taken along the line AA in FIG.
As shown in FIG. 2, three permanent magnet embedded portions 14 are provided.
A to 14C are arranged in the Y direction. Then, the permanent magnet embedded portions 14A and 14C at both ends are sequentially arranged in the X direction in the N-pole portion 22A, the S-pole portion 23 and the N-pole portion 22 of the permanent magnet.
B, and Y is embedded in the central permanent magnet embedded portion 14B.
N pole portion 22A, S pole portion 23 and N
The pole part 22B is embedded. The electromagnet portion 15A in FIG. 1 is configured by arranging electromagnets in the X direction, and the electromagnet portions facing the permanent magnet embedded portions 14B and 14C are configured by arranging electromagnets in the Y and X directions, respectively.

Therefore, the linear motor consisting of the permanent magnet buried portion 14A and the electromagnet portion 15A and the linear motor consisting of the permanent magnet buried portion 14C and the corresponding electromagnet portion apply an arbitrary force F4A to the first column 12A in the X direction. And F4C, and an arbitrary force F4B can be applied to the first column 12A in the Y direction by the linear motor including the central permanent magnet embedded portion 14B and the corresponding electromagnet portion.

Further, permanent magnets are embedded in the permanent magnet embedded portions 16A to 16C on the right side of the first column 12A in the same arrangement as the permanent magnet embedded portions 14A to 16C, and the corresponding electromagnet portions 17A to 17C are respectively inserted. The electromagnets are arranged in the direction in which the opposing permanent magnets are arranged. And
Applying an arbitrary force F5A in the X direction, an arbitrary force F5B in the Y direction, and an arbitrary force F5C in the X direction to the first column 12A by the linear motor including the permanent magnet embedded portions 16A, 16B, and 16C, respectively. Can be. Therefore, a force in an arbitrary direction can be applied to the first column 12A in a horizontal plane (XY plane) by the three sets of linear motors on the left side and the three sets of linear motors on the right side. Can be given any rotational force. Therefore, when a reaction is applied to the first column 12A when applying acceleration to the X stage 5 and the Y stage 4 during slit scan exposure or the like,
The six sets of linear motors apply a force to the first column 12A to cancel the reaction.

On the other hand, in FIG. 1, permanent magnets are buried in the X direction in the two permanent magnet buried portions 18A and 18B on the left side of the second column 12B, and the corresponding electromagnet portions 19A and 19B are also laid out in the X direction. An electromagnet is arranged and configured. Further, X is also applied to the two permanent magnet embedded portions 20A and 20B on the right side on the second column 12B.
The permanent magnets are embedded in the direction, and the corresponding electromagnet portions 21A and 21B are also configured by arranging the electromagnets in the X direction. Therefore, the second column 12 is driven by two linear motors each including the permanent magnet embedded portions 18A and 18B.
An arbitrary force in the X direction is applied to B, and an arbitrary force in the X direction is applied to the second column 12B from the two linear motors including the permanent magnet embedded portions 20A and 20B.

In this embodiment, since the reticle 11 is scanned in the X direction by the reticle scanning stage 9, the reaction on the second column 12B acts in the X direction. Therefore, the force applied from the linear motor to cancel the reaction on the second column 12B is only the force in the X direction. When the reticle 11 is driven also in the Y direction, linear motors for independently applying a force in the Y direction may be mounted in parallel.

Next, the operation of this embodiment will be described with reference to FIG. When the slit scan exposure is started in this embodiment, an acceleration g1 in the X direction is applied to the reticle 11, and an acceleration g in the −X direction is applied to the wafer 6, as shown in FIG.
2 are applied, and as a reaction therebetween, a force F1 in the −X direction is applied to the second column 12B, and a force F2 in the X direction is applied to the first column 12A. Therefore, the linear motor including the permanent magnet embedded portion 18A and the electromagnet portion 19A and the other three linear motors on the upper part of the second column 12B provide a total of F in the X direction with respect to the second column 12B.
Give 1 power.

A linear motor including a permanent magnet embedded portion 14A and an electromagnet portion 15A and a first column 12
A total of F2 force is applied to the first column 12A in the −X direction by the other five linear motors on the side surface of A. Since the permanent magnet portion 14A and the like and the electromagnet portion 15A and the like are fixed, even when a force is generated as a linear motor, actual movement is not performed. This allows
The forces acting on the first column 12A and the second column 12B become zero respectively, and the first column 12A and the second column 12B
Of the reticle 11 and the wafer 6 are maintained with high accuracy.

As shown in FIG. 2, when the center of gravity of the stage system is shifted from the optical axis of the projection optical system PL due to the position of the Y stage 4 and the position of the X stage 5, the Y stage 4 is also driven. In such a case, two types of force vectors <FY> and <FX> act on the stage system.
In such a case, the force vector applied to the first column 12A by the three linear motors on the left side in FIG. 2 is <FA>, and the force vector applied to the first column by the three linear motors on the right side is <FA>. FB>, these force distributions are as follows. <FA> + <FB> = <FX> + <FY> Thereby, the torsional force acting on the first column 12A becomes zero.

Although the linear motor generates a relatively large amount of heat, the effect of the linear motor of this embodiment is ignored since the linear motor is disposed away from the projection exposure section including the reticle 11, the projection optical system PL and the wafer 6. It is possible. However, by attaching an air-cooling or liquid-cooling type heat prevention mechanism to each of the linear motors, the influence of the heat generation can be further reduced.

In the above embodiment, the first column 12A
And a force is applied to the second column 12B from the fixed column 13 by a linear motor method. For example, the force is applied to the first column 12A and the second column 12B by a method of blowing compressed air. You may. Further, for example, a compression coil spring may be interposed between the fixed column 13 and the first column 12A, and a force may be applied to the first column 12A from the fixed column 13 via the compression coil spring. . When the compression coil spring is used, it is possible to prevent the vibration and the like of the fixed column 13 from being transmitted to the first column 12A, almost as in the non-contact type.

In the above-described embodiment, the fixed column 13 is arranged on the base 1. However, if there is a member that does not vibrate when the stages 4, 5, and 9 are evaluated, the fixed column 13 may be provided other than the base 1. The fixing column 13 may be fixed to a member. In the above embodiment, the electromagnet portions 15A to 15C and 17A to 17C on the wafer side and the electromagnet portions 19A to 19C and 21A to 21C on the reticle side are both fixed columns 1.
3, the electromagnet portion on the wafer side and the electromagnet portion on the reticle side may be respectively fixed to different fixed columns.

In the embodiment shown in FIG. 1, the first column 12
The Y stage 4 and the X stage 5 are stored inside A,
Anti-vibration springs 2A and 2B are interposed between the bottom portion and the base 1. The first column 12A is expanded right and left around the holding portion of the lens barrel 7, and the expanded portion is provided. Anti-vibration springs 2A and 2B may be interposed between the base and the base 1, respectively. In this case, a U-shaped column is mounted, preferably as an integral piece of metal, under the holding portion of the barrel 7 of the first column, and the Y stage 4 and the X stage 5 are mounted on the U-shaped column. Should be placed. With such a configuration, the influence of vibration is further reduced.

As described above, the present invention is not limited to the above-described embodiment, and can take various configurations without departing from the gist of the present invention.

[0035]

According to the first aspect of the present invention, the scanning type exposure apparatus is provided with the prevention means for preventing the displacement between the mask and the substrate due to the change of the center of gravity of the first stage system.
The relative positional relationship between the mask and the substrate does not change. Therefore, the pattern of the mask can be accurately exposed on the substrate.

The scanning exposure apparatus according to claim 3 is
Since there is provided a preventive means for preventing a change in the support member due to a change in the center of gravity of the first stage system, the support member does not tilt or deform. Therefore, the overlay accuracy of the conjugate image of the mask and the substrate can be improved. In the scanning exposure method according to the present invention, since the positional shift between the mask and the substrate due to the change in the center of gravity of the first stage system is prevented, the relative positional relationship between the mask and the substrate does not change. Therefore, the pattern of the mask can be accurately exposed on the substrate.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating a projection exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is an explanatory diagram showing forces acting on a first column 12A and a second column 12B in the embodiment of FIG.

FIG. 4 is a configuration diagram showing a conventional projection exposure apparatus.

5A is a diagram illustrating a state in which the projection exposure apparatus of FIG. 4 is inclined when the stage is driven, and FIG. 5B is a diagram illustrating a state in which a column of the projection exposure apparatus in FIG. 4 is deformed when the stage is driven.

[Explanation of symbols]

 Reference Signs List 1 base 2A, 2B anti-vibration spring 4 Y stage 5 X stage 6 wafer PL projection optical system 7 lens barrel 9 reticle scanning stage 10 illumination optical system 11 reticle 12A first column 12B second column 13 fixed column 14A, 16A, 18A, 20A Permanent magnet embedded part 15A, 17A, 19A, 21A Electromagnet part

Claims (28)

[Claims] 1. A scanning exposure apparatus for exposing a pattern of the mask on the substrate by synchronously moving the mask and the substrate, comprising: a first stage system capable of holding and moving one of the mask and the substrate; A scanning means for preventing a displacement between the mask and the substrate caused by a change in the center of gravity of the first stage system when moving the first stage system. Exposure equipment. 2. The apparatus according to claim 1, further comprising a support member that supports the first stage system, wherein the prevention unit suppresses a displacement between the mask and the substrate by suppressing a change in the support member. The scanning exposure apparatus according to claim 1. 3. A scanning exposure apparatus for exposing a pattern of the mask onto the substrate by synchronously moving the mask and the substrate, wherein the first stage system is movable while holding one of the mask and the substrate. And a support member for supporting the first stage system, and when the first stage system is moved with respect to the support member, the support member does not fluctuate due to a change in the center of gravity of the first stage system. A scanning type exposure apparatus, comprising: 4. The scanning type exposure apparatus according to claim 2, wherein said preventing means prevents a fluctuation of said support member by applying a force to said support member. 5. The scanning exposure apparatus according to claim 4, wherein said prevention means includes a non-contact means for applying a force to said support member in a non-contact manner. 6. The scanning exposure apparatus according to claim 5, wherein said non-contact means applies a force to said support member by an electromagnetic force. 7. The prevention means includes: a direction of the synchronous movement;
The scanning exposure apparatus according to any one of claims 4 to 6, wherein the force is applied in at least one of a direction intersecting the synchronous movement direction and a rotation direction. 8. The scanning exposure apparatus according to claim 2, wherein the fluctuation of the support member includes an inclination of the support member. 9. The scanning exposure apparatus according to claim 2, wherein the fluctuation of the support member includes a deformation of the support member. 10. The scanning exposure apparatus according to claim 9, wherein the deformation of the support member includes a twist of the support member. 11. The scanning exposure apparatus according to claim 2, wherein the fluctuation of the support member includes vibration of the support member. 12. The apparatus according to claim 2, wherein said support means holds at least a part of said prevention means.
The scanning exposure apparatus according to claim 1. 13. The scanning exposure apparatus according to claim 12, wherein said support member holds a magnet as at least a part of said prevention means. 14. The scanning exposure apparatus according to claim 2, further comprising a second stage system that can move while holding the other of the mask and the substrate. 15. The scanning exposure apparatus according to claim 14, wherein said support member movably supports said first stage system and said second stage system. 16. A device manufacturing method using the scanning exposure apparatus according to claim 1. Description: 17. A scanning exposure method for synchronously moving a mask having a pattern and a substrate and scanning and exposing the pattern of the mask on the substrate, wherein the mask is movable while holding one of the mask and the substrate. A scanning exposure method, comprising: preventing a displacement between the mask and the substrate due to a change in the center of gravity of the first stage system when driving the first stage system. 18. The scanning exposure method according to claim 17, wherein a displacement of the mask and the substrate is suppressed by preventing a change in a support member that supports the first stage system. 19. A scanning exposure method in which a mask and a substrate are synchronously moved for scanning exposure, wherein a first stage system which is movable while holding one of the mask and the substrate is driven. And a support member for supporting the first stage system does not change due to a change in the center of gravity of the first stage system. 20. The scanning exposure method according to claim 18, wherein a fluctuation of the support member is prevented by applying a force to the support member. 21. The scanning exposure method according to claim 20, wherein a force is applied to the support member in a non-contact manner. 22. The scanning exposure method according to claim 21, wherein the non-contact force is an electromagnetic force. 23. The scanning exposure method according to claim 17, wherein the fluctuation of the support member includes an inclination of the support member. 24. The scanning exposure method according to claim 17, wherein the fluctuation of the support member includes a deformation of the support member. 25. The scanning exposure method according to claim 24, wherein the deformation of the support member includes a twist of the support member. 26. The scanning exposure method according to claim 17, wherein the fluctuation of the support member includes vibration of the support member. 27. The apparatus according to claim 17, wherein the support member movably supports a second stage system that is movable while holding the other of the mask and the substrate. The scanning exposure method according to the above. 28. A device manufacturing method using the scanning exposure method according to claim 17.