JP2000077148A - Fixing part for folded part of filmy board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing part for a folded part of a filmy board, capable of easily bending the filmy board without damaging a conductive layer and simply keeping it in a mechanically bent condition without using an adhesive. SOLUTION: This fixed part consists of a columnar part 11b having a desired radius to give a bending radius to a filmy board 12 and two flat plate parts 11d, 11e linked in parallel with the columnar part 11b through a hinge part 11c, and is equipped with a holding part to hold the folded filmy board 12 on the columnar part 11b by the two flat plates 11d, 11e. A locking protuberance 11g is provided on the one flat plate 11e of the two flat plates 11d, 11e and a locking hole 11f to be locked with the locking protuberance 11g is provided on the another flat plate 11d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component for fixing a folded portion of a film substrate.

A film substrate is formed by sandwiching a metal thin plate having a predetermined circuit pattern shape as a conductive layer between insulating films made of a flexible insulating plastic film such as PET (polyethylene terephthalate), or on the inner surface of the insulating film. A circuit pattern is formed as a conductive layer using a silver paste, a carbon paste, or the like, and an insulating film is attached. When bending and mounting such a film substrate, if the bending radius is too small, a problem such as peeling of the conductive layer at the bent portion occurs, so it is necessary to make sure that the bending radius is not smaller than the minimum allowable bending radius. There is. Conventionally, a round bar having a radius larger than the allowable minimum bending radius is inserted into the bending portion and bent, and the folded film substrates are bonded to each other to form a folded portion.

[0003]

However, in the above-described method, the bending process is troublesome, and it takes time to heat and cure the adhesive in order to bond the folded film substrates. There was a problem that the cost increased.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 is to attach a flat plate having a desired thickness to give a bending radius to a film substrate. The adhesive tape has a length for winding and holding the film substrate folded on the flat plate, and is a folded part fixing part of the film substrate. Here, the flat plate having a desired thickness is referred to as a flat plate having a thickness such that a bending radius of the film substrate is larger than an allowable minimum bending radius when the film substrate is bent over both surfaces of the flat plate. Meaning.

According to a second aspect of the present invention, there is provided a pillar having a desired radius of curvature for giving a bending radius to a film substrate, and the pillar is connected to the pillar in parallel with a hinge and locked together. And a holding portion for holding the film substrate folded back at the pillar portion between the two flat plate portions. Here, the column having a desired radius of curvature means a column or a streamlined column having a bent surface of the film substrate having a radius of curvature larger than the allowable minimum bending radius of the film substrate.

According to the first aspect of the present invention, the film substrate is bent over both sides of a flat plate having a desired thickness, and the bent film substrate is held by winding an adhesive tape. The layer can be easily folded without impairing the function of the layer, and can be easily held in a folded state without using an adhesive.

According to the second aspect of the present invention, the film substrate is bent at the pillar having a desired radius of curvature, and the bent film substrate is sandwiched between the two flat portions of the holding portion.
Since the film substrate is held, the film substrate can be easily bent without impairing the function of the conductive layer, and can be easily held in a mechanically bent state without using an adhesive.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1A to 1D are perspective explanatory views of one embodiment of the folded part fixing component of the film substrate according to the first aspect of the present invention. In FIG. 1A, a folded part fixing component 1 of a film substrate has a flat plate 3 attached to an adhesive tape 2. Here, the pressure-sensitive adhesive tape 2 is obtained by applying a pressure-sensitive adhesive to one surface of a flexible film such as a vinyl chloride sheet and cutting the film to a predetermined width and length. Further, the flat plate 3 is obtained by cutting a plastic foam such as urethane into a rectangular shape having a predetermined thickness and a predetermined size whose one side is equal to the width of the adhesive tape 2. Affixed to the location.

A film substrate is attached to the fixed component 1 in the following procedure. That is, 1) First, as shown in FIG. 1 (b), the film substrate 4 is bent so as to be orthogonal to the adhesive tape 2 so as to cover the adhesive tape 2 and the flat plate 3. Here, the thickness of the flat plate 3 is set to a thickness at which the radius of the bent portion 4a of the film substrate 4 becomes larger than the allowable minimum bending radius when the film substrate 4 is bent over both surfaces of the flat plate 3. Set it. The width of the flat plate 3 is set in advance so as not to be smaller than the width of the film substrate 4. 2) Next, one end 2a of the adhesive tape 2 is bent as shown by the arrow A and is attached to the film substrate 4 on the flat plate 3. FIG. 1C shows a state in which the adhesive tape 2 is bent and attached in this manner. 3) Then, as shown in FIG. 1 (c), the other end 2b of the adhesive tape 2 is bent as shown by the arrow B, and the adhesive tape 2 is attached from above the end 2a, and further wrapped around once to attach. FIG. 1D shows a state in which the film substrate 4 thus bent is fixed to the fixed component 1.
In addition, the adhesive tape 2 is set in advance to a length for fixing the film substrate 4 bent as described above. Also,
The flat plate 3 is positioned on the adhesive tape 2 in advance so that the ends 2a and 2b of the adhesive tape 2 have a length for fixing the film substrate 4 as described above.

In the present embodiment, by using the flat plate 3 having an appropriate thickness, the radius of the bent portion 4a of the film substrate 4 becomes larger than the allowable minimum bending radius, and the function of the conductive layer is impaired. It can be easily folded without any. Further, it is possible to easily maintain the mechanically folded state without using an adhesive.

As the material of the flat plate 3, a hard plastic such as PBT (polybutylene terephthalate) or nylon can be used. However, in this case, as shown in FIG. 2, it is preferable that the end face 3 a of the flat plate 3 which comes into contact with the bent portion of the film substrate be rounded so as not to damage the film substrate. When the flat plate 3 is a foam, there is no risk of this damage, so there is no need to add a radius.

FIGS. 3 (a) to 3 (c) are perspective explanatory views of an embodiment of the folded part fixing part of the film substrate according to the second aspect of the present invention. In FIG. 3A, the folded part fixing component 11 of the film substrate is made of a hard resin,
A cylindrical portion 11b extending in a right angle direction so as to form an L shape from the base portion 11a, and a base portion 11a substantially parallel to the cylindrical portion 11b;
And a holding portion composed of flat plate portions 11d and 11e connected to be foldable by a hinge portion 11c. The cylindrical portion 11b has a radius equal to or larger than the minimum bending radius of the film substrate 12 to be bent and held.
Further, a locking hole 11f is formed in the flat plate portion 11d, and a flat plate portion 11e is formed.
Are provided with locking projections 11g, respectively, and locking holes 11f are provided.
And the locking projection 11g are formed by a flat plate portion 11d at the hinge portion 11c,
11e can be locked when folded over.
The film substrate 12 is formed by printing a conductive paint such as carbon or silver paste on the inner surface of an insulating film such as PET to form a circuit pattern and bonding the insulating film to the circuit pattern. The film substrate 12 may be formed by punching a thin copper plate to form a predetermined circuit pattern and bonding an insulating film to the circuit board.

A film substrate 12 is attached to the fixed component 11 in the following procedure. That is, 1) First, as shown by an arrow C in FIG.
The cylindrical portion 11b is arranged in a. Or, cylindrical part 1
The bent portion 12a of the film substrate may be brought into contact with 1b to be bent. FIG. 3 (b) shows the cylindrical portion 1
1B shows a state where the film substrate 12 is bent along the line 1b. Note that the film substrate 12 is provided with two through holes 12b in advance so as to match the positions of the locking holes 11f. 2) Then, as shown by arrow D in FIG.
The flat plate portion 11e is folded back at the hinge portion 11c to form the flat plate portion 11e.
d, and the locking projections 11g are passed through the two through holes 12b of the film substrate 12 and locked in the locking holes 11f. In this way, as shown in FIG.
The film substrate 12 is held between d and 11e.

In this embodiment, since the folded portion 12a of the film substrate 12 is wound around the cylindrical portion 11b, the bending radius is set to be smaller than the radius of the cylindrical portion 11b (set to be equal to or larger than the minimum bending radius of the film substrate 12). The film substrate 12 can be easily bent without impairing the function of the conductive layer (not shown) without being reduced in size. Further, since the locking projection 11g of the fixed component 11 is inserted into the through hole 12b of the film substrate 12, the film substrate 12 does not shift from the fixed component 11 even when an external force is applied.

The locking projection 11g and the locking projection 11
The locking hole 11f for locking g may be provided in the direction of the base 11a shifted from the film substrate 12 without penetrating the film substrate 12. Further, in the above embodiment, the locking projections 11g and the locking holes 11f lock, but the locking projections may lock each other. Further, the pillar for giving the bending radius to the film substrate 12 is not limited to a columnar shape, but may be a columnar member.
It is sufficient that a desired radius of curvature is provided only in the portion that comes into contact with 2.

[0016]

As described above, according to the present invention, the film substrate can be easily bent without impairing the function of the conductive layer, and can be easily mechanically bent without using an adhesive. There is an excellent effect that it can be maintained in a state of being closed.

[Brief description of the drawings]

FIGS. 1A to 1D are perspective explanatory views of one embodiment of a folded part fixing part of a film substrate according to the first aspect of the present invention.

FIG. 2 is an explanatory perspective view of another embodiment of the invention described in claim 1;

FIGS. 3A to 3C are perspective explanatory views of an embodiment according to the second aspect of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 11 Fixed component 2 Adhesive tape 2a, 2b End part 3 Flat plate 3a End surface 4, 12 Film board 4a, 12a Bend part 11a Base part 11b Cylindrical part 11c Hinge part 11d, 11e Flat part 11f Lock hole 11g Lock projection 12b penetration Hole

Claims (2)

[Claims] 1. A pressure-sensitive adhesive tape to which a flat plate having a desired thickness for giving a bending radius to a film substrate is attached, and the pressure-sensitive adhesive tape has a length for winding and holding the film substrate folded on the flat plate. A component for fixing a folded portion of a film substrate, comprising: 2. A pillar having a desired radius of curvature for giving a bending radius to a film substrate, and two flat plates connected to each other via a hinge in parallel with the pillar and locked together. And a holding portion for holding the film substrate folded back at the pillar portion by the two flat plate portions.