JP2000076711A - Manufacturing device for sticking type optical disk - Google Patents

Manufacturing device for sticking type optical disk

Info

Publication number
JP2000076711A
JP2000076711A JP10243009A JP24300998A JP2000076711A JP 2000076711 A JP2000076711 A JP 2000076711A JP 10243009 A JP10243009 A JP 10243009A JP 24300998 A JP24300998 A JP 24300998A JP 2000076711 A JP2000076711 A JP 2000076711A
Authority
JP
Japan
Prior art keywords
disk
bonded
optical disk
pressing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10243009A
Other languages
Japanese (ja)
Inventor
Yoshizo Hamada
嘉三 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP10243009A priority Critical patent/JP2000076711A/en
Publication of JP2000076711A publication Critical patent/JP2000076711A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/345Progressively making the joint, e.g. starting from the middle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/81General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81455General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/82Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824Actuating mechanisms
    • B29C66/8242Pneumatic or hydraulic drives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a manufacturing device for a sticking type optical disk with which the sticking type optical disk less in warpage and excellent in mechanical characteristics is manufactured. SOLUTION: The manufacturing device for the sticking type optical disk is provided with a supporting base 3 on which two sheets of disk substrate, on at least one side of which a recording layer is formed, are set by being superimposed via an adhesive member 10, a pressurizing means 6, which pressurizes and sticks the disk substrates set on the supporting base 3, and a uniformizing means, which makes the sticking state of the stuck disk substrates uniform. In this manufacturing device for the sticking type optical disk, the supporting surface 36 of the supporting base 3 is formed a truncated cone shape having a slope with an inclined angle of 0.2 to 5 degrees and the pressurizing part 6a of the pressurizing means 6 is formed to a semi-spherical shape.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は2枚のディスク基板
を貼り合せた貼合せ型光ディスクの製造装置に関し、更
に詳細には、2枚のディスク基板を押付けて貼合すとき
に反りおよび面振れを修正させることが出来る貼合せ型
光ディスクの製造装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a bonded optical disk in which two disk substrates are bonded, and more particularly, to warpage and runout when pressing and bonding two disk substrates. The present invention relates to an apparatus for manufacturing a bonded optical disk capable of correcting the above.

【0002】[0002]

【従来の技術】従来より、2枚のディスク基板を貼り合
せた貼合せ型の高密度光ディスクを製造する方法として
は、ターンテーブル上で2枚のディスク基板の内の1枚
に接着剤を塗布または貼付け、その後他の1枚を接着剤
の上に重ね、押付けて製造するディスク基板の貼合せ方
法が知られている。
2. Description of the Related Art Conventionally, as a method of manufacturing a bonded high-density optical disk in which two disk substrates are bonded together, an adhesive is applied to one of the two disk substrates on a turntable. Alternatively, there has been known a method of laminating a disc substrate manufactured by laminating and then pressing another one on an adhesive.

【0003】通常、このような貼合せ方法は、2枚のデ
ィスク基板の内の1枚をターンテーブル上のディスク基
板の支持台に設置し、ターンテーブルを回転させ、次の
固定された位置で接着剤の塗布または貼付けを実施し、
さらに他の1枚をその上に重ね、押付け、さらに、オー
トクレーブで加圧し、高密度光ディスクの貼合せ品を製
造し、後加工を施して製品として使用される。
Usually, such a bonding method is such that one of the two disk substrates is placed on a support for the disk substrate on the turntable, the turntable is rotated, and the next fixed position is set. Apply or paste the adhesive,
Further, another one is superimposed thereon, pressed, and further pressurized by an autoclave to produce a bonded product of a high-density optical disc, which is subjected to post-processing and used as a product.

【0004】ここで、図1はこのような貼合せ型の高密
度光ディスクをディスク基板を貼合せて連続製造する製
造装置の一例を示す。
FIG. 1 shows an example of a manufacturing apparatus for continuously manufacturing such a bonding type high-density optical disk by bonding disk substrates.

【0005】この製造装置において、ターンテーブル1
に対し固定された位置の第1の基板供給手段2より貼り
合わす2枚の内の1枚のディスク基板9aをターンテー
ブル1上のディスク基板の支持台3に自動的にセットす
る。そして、ターンテーブル1を回転させることによ
り、ディスク基板9aの自動供給を繰返すことが出来る
ようになっている。
In this manufacturing apparatus, the turntable 1
Then, one of the two disk substrates 9a to be bonded by the first substrate supply means 2 at a fixed position is automatically set on the disk substrate support base 3 on the turntable 1. By rotating the turntable 1, automatic supply of the disk substrate 9a can be repeated.

【0006】該ターンテーブル1を回転させることによ
り、ディスク基板の支持台3を接着付与手段4まで移動
させ、該接着付与手段4でディスク基板9a上に貼合す
ための接着部材10の付与具体的には接着剤の塗布また
はシート上に塗布された接着剤をシート上から半球形状
のゴムで中心部からディスク基板9aに押付ることによ
り、接着部にエアーを巻込ないように付与して、ディス
ク基板9aに接着部材10を付与する。
By rotating the turntable 1, the support 3 for the disk substrate is moved to the adhesion applying means 4, and the adhesion applying means 4 applies the adhesive member 10 for bonding to the disk substrate 9a. Specifically, by applying an adhesive or pressing the adhesive applied on the sheet to the disk substrate 9a from the center with a hemispherical rubber from the sheet, the air is applied so as not to entangle the air into the adhesive portion. Then, the adhesive member 10 is applied to the disk substrate 9a.

【0007】その後、さらにターンテーブル1を回転さ
せ、次のステーションで他のもう1枚のディスク基板9
bを第2の基板供給手段5からディスク基板9aの接着
剤塗布面上に重ねる。
After that, the turntable 1 is further rotated, and another disk substrate 9 is rotated at the next station.
b from the second substrate supply means 5 on the adhesive applied surface of the disk substrate 9a.

【0008】その後ターンテーブル1を回転させ、支持
台3上に重ねられたディスク基板9a,9bを図4のよ
うに半球形状のゴムからなる押圧部6aを備えた押圧手
段6の押圧位置に移送する。押圧手段6は重ねた2枚の
ディスク基板9a,9b上から押付けエアーシリンダー
8で押圧部6aを押付ることにより、内周側から外周側
にエアーを押出すようにして2枚のディスク基板9a,
9bを貼り合せる。
Thereafter, the turntable 1 is rotated to transfer the disk substrates 9a and 9b superimposed on the support table 3 to the pressing position of the pressing means 6 having a pressing portion 6a made of hemispherical rubber as shown in FIG. I do. The pressing means 6 presses the pressing portion 6a from above the two stacked disk substrates 9a and 9b with the pressing air cylinder 8, thereby pushing out the air from the inner peripheral side to the outer peripheral side so that the two disk substrates 9a are pushed out. ,
9b is laminated.

【0009】この2枚のディスク基板9a,9bを貼り
合せた貼合せ光ディスク11をターンテーブル1上で回
転させ、次のオートクレーブ7に移送する。オートクレ
ーブ7で、圧空の圧力約1トンで均等に貼合せ光ディス
ク11を押圧して貼合せの状態をより均一なものにす
る。その後、さらにターテーブル1を回転させ、貼合せ
光ディスク11は製品として第1の基板供給手段5によ
り取出す。
The bonded optical disk 11 on which the two disk substrates 9a and 9b are bonded is rotated on the turntable 1 and transferred to the next autoclave 7. In the autoclave 7, the bonded optical disks 11 are evenly pressed with the pressure of the compressed air of about 1 ton to make the bonding state more uniform. Thereafter, the table 1 is further rotated, and the bonded optical disk 11 is taken out as a product by the first substrate supply means 5.

【0010】この際、従来のターンテーブル上に設置し
てあるディスク基板の支持台3は図4に示すようにその
ディスク支持面がフラットに仕上げられ、その上で2枚
のディスク基板を上側から押付けるため、得られる高密
度光ディスクは常に上反りなり、その反り量は中心と周
辺を結ぶ直線の傾斜角で0.2〜0.4度程度になる。
At this time, as shown in FIG. 4, the support base 3 for the disk substrate installed on the conventional turntable has a flat disk support surface, and the two disk substrates are then moved from above. Due to the pressing, the resulting high-density optical disk always warps, and the amount of warping is about 0.2 to 0.4 degrees as the inclination angle of the straight line connecting the center and the periphery.

【0011】また、2枚のディスク基板の反りは貼合せ
時のエアー巻込みを少なくするため図5のように反りを
調整したディスク基板9a,9bを組み合わせて貼合せ
ることが一般的になっている。
Further, in order to reduce air entrainment at the time of bonding, it is general to bond two disk substrates by combining disk substrates 9a and 9b whose warpage is adjusted as shown in FIG. I have.

【0012】貼合せた光ディスクの反りを小さくする対
策としては、2枚のディスク基板の内の下部に設置する
ディスク基板の反りを上部に設置するディスク基板より
も一定量大きくすることにより、貼合せた光ディスクの
反りを調整することは可能であるが、製膜および保管方
法、時間等の全てを考慮する必要があり、光ディスクの
反りをコントロールすることは容易ではない。
As a measure for reducing the warpage of the bonded optical disks, the warpage of the disk substrate installed at the lower part of the two disk substrates is made larger by a certain amount than that of the disk substrate installed at the upper part. Although it is possible to adjust the warpage of the optical disk, it is necessary to consider all of the film forming and storage methods, time, and the like, and it is not easy to control the warp of the optical disk.

【0013】また、ディスク基板の反りを大きくする
と、面振れが大きくなり、バラツキも大きくなるので2
枚のディスク基板貼合せ後の状態も変化が大きく、加速
度等の機械特性上の不良率が増大する。
Further, when the warpage of the disk substrate is increased, the surface runout is increased and the variation is increased.
The state after lamination of two disk substrates also changes greatly, and the failure rate in mechanical characteristics such as acceleration increases.

【0014】このため、貼合せ光ディスク製品の反りを
規格上限ギリギリで調整を実施しているが、ディスク基
板成形におけるバラツキがあり、不良品を多発させるこ
ともあり、生産上の歩留りを悪くさせている。
For this reason, the warpage of the bonded optical disk product is adjusted to the limit of the upper limit of the specification. I have.

【0015】[0015]

【発明が解決しようとする課題】現状の高密度光ディス
クは2枚のディスク基板を貼合せて使用する方法が一般
的になっている。このため、貼合せについては多くの装
置が開発されているが、大きく分類するとディスク基板
上に直接接着剤を塗布する方法とシート上に塗布したも
のをディスク基板上に貼付る方法がある。
The current high-density optical disk generally uses a method in which two disk substrates are bonded and used. For this reason, many devices have been developed for laminating, but broadly classified are a method of directly applying an adhesive on a disk substrate and a method of applying an adhesive applied on a sheet to a disk substrate.

【0016】これらの方法は、ターンテーブル上に設置
されているディスク基板の支持台に貼り合わせる2枚の
ディスク基板の内の1枚を設置して、接着剤を塗布また
は貼付け、他の1枚をその上に重ね、加圧することによ
り、高密度光ディスクを製造するが、そのディスク基板
の支持台の支持面がフラットで、これに半球形状のゴム
で中央部より押付るため、中央部の押付け力が高くな
り、押付け側に反りが発生するのは単なる物理的なこと
である。このため、前述の通り2枚のディスク基板の反
りを変化させて使用する方法を用いているが、管理上の
問題および反りを大にすることによる面振れおよび反り
のバラツキ大等により、2枚のディスク基板の貼合せ後
の状態が悪く、貼合せ後に多くの問題が発生する。
In these methods, one of two disk substrates to be bonded to a support for a disk substrate mounted on a turntable is installed, an adhesive is applied or bonded, and the other is mounted. A high-density optical disk is manufactured by stacking it on top of it and pressing it, but the support surface of the support base of the disk substrate is flat, and the hemispherical rubber presses it from the center, so the center part is pressed. It is merely a physical matter that the force is increased and the pressing side is warped. For this reason, as described above, a method is used in which the warpage of the two disk substrates is changed. However, due to a management problem and a large variation in surface runout and warpage caused by increasing the warpage, two disk substrates are used. The state after lamination of the disk substrate is bad, and many problems occur after lamination.

【0017】[0017]

【課題を解決するための手段】かかる課題に対して、鋭
意検討をした結果、2枚のディスク基板を貼合せた後の
反りとは逆方向に、言い換えればディスク基板の支持台
の内周側を高く、外周側を低くする円錐台状に加工す
る。すなわち、本発明は、少なくとも一方に記録層が形
成された2枚のディスク基板が接着部材を介して重ねら
れてセットされる支持台と、支持台上にセットされたデ
ィスク基板を押圧して貼り合せる押圧手段と、貼り合せ
られたディスク基板の貼り合せ状態を均一化する均一化
手段を備えた貼合せ型光ディスクの製造装置において、
前記支持台の支持面を斜面の傾斜角が0.2〜5度の円
錐台状とし、前記押圧手段の押圧部を半球状としたこと
を特徴とする貼合せ型光ディスクの製造装置である。
As a result of diligent studies on such a problem, as a result of the study, a direction opposite to the warpage after the two disk substrates are bonded, in other words, on the inner peripheral side of the support of the disk substrate. Into a frusto-conical shape with high and low outer circumference. In other words, the present invention provides a support base on which two disk substrates each having a recording layer formed on at least one of them are set by being stacked via an adhesive member, and pressing and attaching the disk substrate set on the support base. In a manufacturing apparatus for a laminated optical disk, comprising: a pressing means for bonding, and a uniforming means for equalizing a bonding state of the bonded disk substrates.
An apparatus for manufacturing a laminated optical disc, wherein a support surface of the support table is formed in a truncated cone shape with a slope angle of 0.2 to 5 degrees, and a pressing portion of the pressing means is formed in a hemispherical shape.

【0018】上述の本発明は、ディスク基板の支持台を
2枚貼合せたディスク基板の反りの状態により、0.2
〜5度傾け、加圧等の均一化手段により2枚の貼合せた
反りをゼロに近づけ、その結果、面振れ等においても小
さくすることが出来、全体として機械特性に優れた貼合
せ型光ディスクを得られるものである。
According to the above-described present invention, the warpage of the disk substrate obtained by laminating two disk substrate supports is set to 0.2.
A tilted optical disk having an inclination of up to 5 degrees and a warpage of the two sheets being brought close to zero by means of equalizing such as pressing, and as a result, surface runout etc. can be reduced, and the mechanical properties as a whole are excellent. Can be obtained.

【0019】上記の本発明において、ディスク基板を設
置する支持台をターンテーブル等の移送手段上に設置す
ることにより、連続してディスク基板を貼り合せること
が出来、連続して貼合せ型光ディスクを製造することが
できる。
In the present invention, the disk substrate can be continuously bonded by installing the support base on which the disk substrate is mounted on a transfer means such as a turntable. Can be manufactured.

【0020】なお、ディスク基板の材としては、アクリ
ル、ポリカーボネート、エポキシ、アモルファスオレフ
ィン等、もしくはこれらの共重合体等の合成樹脂のほか
無機ガラスなどが適用できる。
In addition, as a material for the disk substrate, an inorganic glass, in addition to a synthetic resin such as acryl, polycarbonate, epoxy, amorphous olefin, or a copolymer thereof can be used.

【0021】[0021]

【発明の実施の形態】本発明の貼合せ光ディスクの製造
装置はターンテーブル等の移送手段上に設置されたディ
スク基板の支持台に2枚のディスク基板の内の1枚を設
置して、接着剤を塗布または貼付け、その後他の1枚の
ディスク基板を接着剤の上に重ね、さらに加圧すること
により高密度の光ディスクを製造する。
BEST MODE FOR CARRYING OUT THE INVENTION In the apparatus for manufacturing a bonded optical disk of the present invention, one of two disk substrates is mounted on a support for a disk substrate mounted on a transfer means such as a turntable and bonded. An agent is applied or affixed, and then another disk substrate is overlaid on the adhesive, and further pressed to produce a high-density optical disk.

【0022】この重ねられた2枚のディスク基板を押付
けるときに半球形状のゴムで押付けられるため、内周部
の圧力が高くなり、ディスク基板は押付け側に反る。す
なわち、上部から押付ければ上方向に反りが発生する。
この対策としてディスク基板の支持台の支持面を反りを
修正させる方向、すなわち、マイナス方向に傾けること
により、ディスク基板押付け時の反りをキャンセルさせ
る。この結果、反りはゼロ近くにすることが出来、面振
れも大きく改善出来、優れた高密度光ディスクの製造で
きる。
When the two disc substrates are pressed together, they are pressed by hemispherical rubber, so that the pressure on the inner peripheral portion increases and the disk substrates warp to the pressing side. That is, if pressed from above, upward warpage occurs.
As a countermeasure, the tilt of the support surface of the support of the disk substrate in the direction in which the warp is corrected, that is, in the minus direction, cancels the warp when pressing the disk substrate. As a result, warpage can be reduced to near zero, surface runout can be greatly improved, and an excellent high-density optical disk can be manufactured.

【0023】ここで、本発明の貼合せ型ディスクの製造
装置について図1の連続生産に適した構成を用いて詳述
する。
Here, an apparatus for manufacturing a laminated disk according to the present invention will be described in detail with reference to a configuration suitable for continuous production shown in FIG.

【0024】本図の装置はターンテーブル方式によるも
ので、ターンテーブル1に対して固定された位置の第1
の基板供給手段2により、貼り合せる2枚の内の1枚の
ディスク基板9aをターンテーブル1上のディスク基板
の支持台3に自動的にセットする。そして、そのターン
テーブル1を回転させることにより、ディスク基板9a
の自動供給を繰返させるようになっている。なお、支持
台3の支持面は図3に示すように、中心部にディスク基
板9a,9bの中心孔に挿入される支柱3aを備え、デ
ィスク基板9aを支持する支持面3bは貼合せ光ディス
ク11の反りがゼロになるような所定傾斜角の傾斜面の
円錐台状に形成されている。
The device shown in the figure is of a turntable type, and a first fixed position with respect to the turntable 1 is shown.
The substrate supply means 2 described above automatically sets one of the two disk substrates 9a to be bonded to the support 3 of the disk substrate on the turntable 1. Then, by rotating the turntable 1, the disk substrate 9a
The automatic supply is repeated. As shown in FIG. 3, the support surface of the support base 3 has a column 3a inserted into the center hole of the disk substrates 9a and 9b at the center, and the support surface 3b supporting the disk substrate 9a is Is formed in the shape of a truncated cone with an inclined surface having a predetermined inclination angle such that the warpage becomes zero.

【0025】このターンテーブル1を回転させることに
より、次のステーションの接着付与手段4でディスク基
板9aに接着部材10の付与具体的には接着剤の塗布ま
たはシート上に塗布された接着剤をシート上から半球形
状のゴムで中心部からディスク基板9aに押付け、貼付
け部にエアーを巻込ないように付与して、ディスク基板
9に接着部材10を付与させる。この際、接着剤の収縮
または上部から押付けによりディスク基板9aは若干接
着剤側に反りを発生させるが、ディスク基板の支持台3
が前述の通り貼合せ光ディスク11でゼロになるように
マイナス方向にしてあるので、本ステーションのディス
ク基板9押付け後の反りはマイナスである。
When the turntable 1 is rotated, an adhesive member 10 is applied to the disk substrate 9a by the adhesive applying means 4 at the next station. Specifically, the adhesive applied or the adhesive applied on the sheet is applied to the sheet. The disc member 9 is provided with an adhesive member 10 by pressing the disc substrate 9a from the center with a hemispherical rubber from above and applying air so as not to be wound around the sticking portion. At this time, the disk substrate 9a slightly warps on the adhesive side due to the contraction of the adhesive or the pressing from above, but the disk substrate 9a
Is set in the minus direction so as to become zero on the bonded optical disk 11 as described above, so that the warpage after pressing the disk substrate 9 of this station is negative.

【0026】その後、さらにターンテーブル1を回転さ
せ、第2の基板供給手段5で他の1枚のディスク基板9
bをディスク基板9aの接着剤塗布面上に重ねる。
After that, the turntable 1 is further rotated, and the other one of the disk substrates 9 is
b on the adhesive-applied surface of the disk substrate 9a.

【0027】その後ターテーブル1を移転させ、押圧手
段6の押圧位置まで移動する。押圧手段6は図3のよう
に半球形状のゴムからなる押圧部6aとこれを駆動する
シリンダー8とからなり、重ねた2枚のディスク基板9
a,9b上から押圧部6aで押圧することにより、内周
部から外周部にエアーを押出すようにして2枚のディス
ク基板9a,9bを貼合す。この場合、ディスク基板の
支持台3の支持面3bの傾きはディスク基板9a,9b
の成形および貼合せの条件等により、貼合せ後の製品光
ディスク11の反りがゼロ近くになるディスク基板の支
持台3の支持面3bの傾き、すなわち、ディスク基板の
支持台3の支持面3bは0.2〜5度マイナス方向に傾
けたものを設定する。
Thereafter, the tar table 1 is moved and moved to the pressing position of the pressing means 6. The pressing means 6 comprises a pressing portion 6a made of hemispherical rubber and a cylinder 8 for driving the pressing portion 6a as shown in FIG.
The two disk substrates 9a and 9b are bonded to each other by pushing the air from the inner peripheral portion to the outer peripheral portion by pressing from above the a and 9b with the pressing portion 6a. In this case, the inclination of the support surface 3b of the support 3 of the disk substrate is equal to the disk substrates 9a and 9b.
The inclination of the support surface 3b of the support 3 of the disk substrate, in which the warp of the product optical disk 11 after bonding is close to zero due to the conditions of molding and bonding of the disk substrate, that is, the support surface 3b of the support 3 of the disk substrate Set one that is tilted in the negative direction by 0.2 to 5 degrees.

【0028】この貼合せた光ディスク11を次の均一化
手段のオートクレーブ7のセット位置に移転させる。オ
ートクレーブ7は、圧空の圧力約1トンで均等に光ディ
スク11を加圧し、光ディスク11の貼合せ部の状態を
より均一なものにする。
The bonded optical disk 11 is moved to the next set position of the autoclave 7 of the equalizing means. The autoclave 7 presses the optical disk 11 evenly with the pressure of the compressed air of about 1 ton to make the state of the bonded portion of the optical disk 11 more uniform.

【0029】その後、さらにターンテーブル1を移動さ
せて貼合せた製品光ディスク11は第1の基板供給装置
2によりディスク基板9aを供給すると同時に製品光デ
ィスク11を取出す。
Thereafter, the product optical disk 11 bonded by further moving the turntable 1 is supplied with the disk substrate 9a by the first substrate supply device 2, and at the same time, the product optical disk 11 is taken out.

【0030】この際、さらに本装置について詳述する
と、ターンテーブル1上で1枚および2枚のディスク基
板9a,9bを押付ける3ヶ所、すなわち、接着付与手
段4、押圧手段6、オートクレーブ7で、ディスク基板
の支持台3を0.2〜5度マイナス方向に傾けて押付け
ることにより、貼合せた2枚のディスク基板9がゼロに
近付けるように反りを修正させる。すなわち、ディスク
基板の支持台3をマイナス方向に傾けることにより、接
着部材10の塗布または貼付け時における接着部材10
の収縮を修正させる方向、また、2枚のディスク基板9
a,9b貼合せ後の押付けにおいては中央部が強く加圧
されることにより、押付け側に反るため、ディスク基板
の支持台3をマイナス方向に傾けることにより、傾きを
キャンセルさせる。
At this time, the present apparatus will be described in more detail. To be more specific, the three positions for pressing one and two disk substrates 9a and 9b on the turntable 1, namely, the adhesion applying means 4, the pressing means 6, and the autoclave 7, are used. Then, the support 3 of the disk substrate is tilted in the negative direction by 0.2 to 5 degrees and pressed to correct the warp so that the two disk substrates 9 bonded to each other approach zero. That is, by tilting the support 3 of the disk substrate in the minus direction, the adhesive
Direction to correct the shrinkage of the
In the pressing after the lamination of steps 9a and 9b, the central portion is strongly pressurized and warps to the pressing side. Therefore, the tilt is canceled by tilting the support 3 of the disk substrate in the minus direction.

【0031】その後オートクレーブ室7で光ディスク1
1の貼合せ部が均等になるように加圧するが、ディスク
基板の支持台3が連続性のため、さらにマイナス方向へ
押付け、製品光ディスク11でゼロに近付ける。
Thereafter, the optical disk 1 is placed in the autoclave chamber 7.
Although the pressure is applied so that the bonded portions 1 are equal, the support 3 of the disk substrate is further pressed in the minus direction because of the continuity, so that the product optical disk 11 approaches zero.

【0032】これらの3ヶ所における反りの補正量はデ
ィスク基板9a,9bの成形条件により、また、貼合せ
の条件により変化するため、貼合せ後の反りがゼロにな
るようなディスク基板の支持台3の支持面3bの傾きを
設定する。このディスク基板の支持台3は、その支持面
3bの傾斜角が0.2〜5度のものを通常使用する。
Since the amount of warpage correction at these three locations changes depending on the molding conditions of the disk substrates 9a and 9b and the bonding conditions, the disk substrate support base such that the warpage after bonding becomes zero. The inclination of the support surface 3b is set. As the support 3 for the disk substrate, one having a support surface 3b with an inclination angle of 0.2 to 5 degrees is usually used.

【0033】上記と同等な装置であって、テーブルを回
転させないで、逆に製品を移転させることにより、貼合
せを実施させる方法があり、この場合、ディスク基板の
支持台の傾きはそれぞれの押付け状態により変化させる
ことが出来る。
There is a method equivalent to the above, in which the products are transferred without rotating the table, and the bonding is performed. In this case, the inclination of the support of the disk substrate is determined by the pressing of the respective substrates. It can be changed depending on the state.

【0034】さらに移送手段に図1と異なりコンベア方
式を用いたものを図2に示す。移送手段を除いてその他
の構成は図1と同じであり、同じ番号で示した。
FIG. 2 shows a transfer means using a conveyor system unlike FIG. Except for the transfer means, other configurations are the same as those in FIG.

【0035】すなわち、同図に示すようにコンベア1a
上に設置してあるディスク基板の支持台3は前述のター
ンテーブルの場合と同一であり、一方のディスク基板9
aの第1の基板供給手段2から接着部材10の接着付与
手段、さらに他方のディスク基板9bを重ねる第2の基
板供給手段、その後の押圧手段6、オートクレーブ7ま
で、円形による処理を直線上で処理させるようにしたも
ので、製品取出し手段12を設けた以外の構成は全て図
1と同じである。
That is, as shown in FIG.
The support 3 for the disk substrate installed on the disk substrate is the same as that of the above-described turntable.
From the first substrate supply means 2 of FIG. 1A to the adhesion applying means of the adhesive member 10, the second substrate supply means on which the other disk substrate 9b is stacked, the pressing means 6 and the autoclave 7, the circular processing is performed in a straight line. The configuration is the same as that of FIG. 1 except that the product take-out means 12 is provided.

【0036】これらの装置においてエアーの巻込み対策
として半球形状のゴムで押付けるが、反りは押付け側に
発生するため、ディスク基板の支持台3をマイナス方向
に0.2〜5度傾けることにより、反りが修正され、面
振れを小さくすることが出来る。
In these devices, pressing is performed with a hemispherical rubber as a measure against air entrapment. Since warpage occurs on the pressing side, the support 3 of the disk substrate is inclined by 0.2 to 5 degrees in the minus direction. The warpage is corrected, and the runout can be reduced.

【0037】言い換えれば、2枚のディスク基板が成形
時に管理された一定の反り量のものが使用され、接着剤
の収縮量を考慮し、押付け、加圧による条件等が一定に
なれば、ディスク基板貼合せ後の反りは同等になるの
で、完成品の反りをゼロに近ずけるディスク基板の支持
台の傾きを決定することは可能である。
In other words, two disk substrates having a constant warpage controlled at the time of molding are used. In consideration of the amount of shrinkage of the adhesive, if the conditions of pressing and pressing become constant, the disk is Since the warpage after bonding the substrates is equal, it is possible to determine the inclination of the support of the disk substrate so that the warpage of the finished product approaches zero.

【0038】これらの装置により成形された高密度光デ
ィスクは反りをゼロに近付けるだけではなく、面振れも
小さくなり、機械特性に優れた貼合せ光ディスクの製造
装置を提供する。以下、本発明による製造例を説明す
る。
A high-density optical disk formed by these devices not only reduces the warp to zero, but also reduces the surface runout, and provides an apparatus for manufacturing a bonded optical disk having excellent mechanical properties. Hereinafter, a production example according to the present invention will be described.

【0039】[0039]

【製造例1】本発明の実施例である図1のターンテーブ
ル方式の製造装置を用いた製造例を説明する。この装置
により、貼合せた光ディスク11の反りが図3で上方向
(プラス側)0.4度になるディスク基板9a,9bお
よび貼合せの条件において、ターンテーブル1上のディ
スク基板の支持台3の支持面3bを図3に図示のように
下方向(マイナス側)に1度傾け、ディスク基板9a,
9bの貼合せを実施した。この結果、反りはゼロ近くの
ものが出来、ディスク基板9a,9bの成形のバラツキ
があっても0.2度以内になり、規格を満足し、反りに
よる不良品がなくなった。これにより、面振れも従来の
1/2になり、加速度等の機械特性も良好になり、好適
な高密度の光ディスクを提供することが出来る。
Manufacturing Example 1 A manufacturing example using a turntable type manufacturing apparatus shown in FIG. 1 which is an embodiment of the present invention will be described. With this apparatus, under the conditions of the disk substrates 9a and 9b in which the warp of the bonded optical disk 11 becomes 0.4 degrees upward (plus side) in FIG. The support surface 3b is tilted downward (minus side) by one degree as shown in FIG.
9b was laminated. As a result, the warpage was almost zero, and even if there was a variation in the molding of the disk substrates 9a and 9b, the warpage was within 0.2 degrees, satisfying the standard and eliminating defective products due to the warpage. As a result, the surface runout is reduced to half that of the conventional one, the mechanical properties such as acceleration are improved, and a suitable high-density optical disk can be provided.

【0040】[0040]

【製造例2】製造例1と同一装置において、ディスク基
板9a,9bの成形の反りが異なるもので、反りが図5
に示すようなディスク基板の支持台側に0.2度のも
の、押付け側に0.4度のものを使用した。すると、押
付け側に大きく変化するので、ディスク基板の支持台3
にはその支持面の傾きが2度のものを使用して貼合せを
実施した。若干マイナス方向ではあるが、ゼロ近くの製
品が出来た。
[Manufacturing Example 2] In the same apparatus as in Manufacturing Example 1, the warpage of the disk substrates 9a and 9b is different from that of FIG.
The disk substrate used was 0.2 degrees on the support base side and 0.4 degrees on the pressed side. Then, since it changes greatly to the pressing side, the support 3
Was bonded by using the support surface having an inclination of 2 degrees. Although the product was in a slightly negative direction, a product near zero was made.

【0041】[0041]

【発明の効果】上述のように本発明によれば、ターンテ
ーブルまたはコンベア方式による装置において、2枚の
ディスク基板を貼合わせるディスク基板の支持台をその
支持面が傾斜角0.2〜5度の傾斜面の円錐台状とする
ことにより、貼合せによる反りをゼロに近づけることが
でき、実用上支障ない貼合せ型光ディスクを製造でき
る。この結果、面振れが約1/2になり、加速度等の機
械特性に優れた高密度光ディスクの製造に好適な貼合せ
型光ディスクの製造装置が実現した。
As described above, according to the present invention, in a device using a turntable or a conveyor system, the support surface of a disk substrate to which two disk substrates are bonded is inclined at an inclination angle of 0.2 to 5 degrees. By making the inclined surface into a truncated conical shape, the warpage due to lamination can be made close to zero, and a laminated optical disk that does not hinder practical use can be manufactured. As a result, an apparatus for manufacturing a laminated optical disk suitable for manufacturing a high-density optical disk excellent in mechanical characteristics such as acceleration and the like is reduced to about 1/2.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は、ターンテーブル方式の貼合せ型光ディ
スクの製造装置の構成の説明図である。
FIG. 1 is an explanatory diagram of a configuration of a manufacturing apparatus for a turntable type laminated optical disk.

【図2】図2は、コンベア方式の貼合せ型光ディスクの
製造装置の構成の説明図である。
FIG. 2 is an explanatory diagram of a configuration of a manufacturing apparatus for a conveyer-type bonded optical disk.

【図3】図3は、本発明の製造装置の押圧手段の詳細説
明図である。
FIG. 3 is a detailed explanatory view of a pressing means of the manufacturing apparatus of the present invention.

【図4】図4は、従来の製造装置の押圧手段の詳細説明
図である。
FIG. 4 is a detailed explanatory view of a pressing means of a conventional manufacturing apparatus.

【図5】図5は、貼合せ前のディスク基板の反りの状態
の説明図である。
FIG. 5 is an explanatory diagram of a warped state of the disk substrate before bonding.

【符号の説明】[Explanation of symbols]

1 ターンテーブル 1a コンベア 2 第1の基板供給手段 3 支持台 4 接着付与手段 5 第2の基板供給手段 6 押圧手段 7 オートクレーブ 8 押付けシリンダー 9a、9b ディスク基板 10 接着部材 11 貼合せ光ディスク 12 ディスク基板取出し手段 DESCRIPTION OF SYMBOLS 1 Turntable 1a Conveyor 2 1st board supply means 3 Support stand 4 Adhesion provision means 5 2nd board supply means 6 Pressing means 7 Autoclave 8 Press cylinder 9a, 9b Disk substrate 10 Adhesive member 11 Laminated optical disk 12 Disk substrate removal means

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも一方に記録層が形成された2
枚のディスク基板が接着部材を介して重ねられてセット
される支持台と、支持台上にセットされたディスク基板
を押圧して貼り合せる押圧手段と、貼り合せられたディ
スク基板の貼り合せ状態を均一化する均一化手段を備え
た貼合せ型光ディスクの製造装置において、前記支持台
の支持面を斜面の傾斜角が0.2〜5度の円錐台状と
し、前記押圧手段の押圧部を半球状としたことを特徴と
する貼合せ型光ディスクの製造装置。
A recording layer formed on at least one of the recording layers;
A support table on which a plurality of disk substrates are stacked via an adhesive member, a pressing unit for pressing and bonding the disk substrates set on the support table, and a bonding state of the bonded disk substrates. In the apparatus for manufacturing a laminated optical disk provided with a uniformizing means for uniforming, a support surface of the support base is formed into a truncated cone with a slope angle of 0.2 to 5 degrees, and a pressing portion of the pressing means is a hemisphere. An apparatus for manufacturing a laminated optical disk, comprising:
【請求項2】 複数の前記支持台を移送手段に設置し、
押圧手段の押圧位置、均一化手段のセット位置へ支持台
を順次移送して、貼り合せるようにした請求項1記載の
貼合せ型光ディスクの製造装置。
2. The method according to claim 1, wherein a plurality of the supports are provided on a transfer means,
2. The apparatus for manufacturing a bonded optical disk according to claim 1, wherein the support table is sequentially transferred to a pressing position of the pressing means and a set position of the equalizing means so as to be bonded.
【請求項3】 移送手段に沿って、貼り合せる一方のデ
ィスク基板を支持台にセットする基板供給手段、接着部
材を支持台上のディスク基板に付与する接着付与手段、
接着部材が付与されたディスク基板上に他方のディスク
基板をセットする第2の基板供給手段、前記押圧手段、
及び前記均一化手段を所定間隔で配置し、移送手段によ
り各手段間を順次間欠的に移送して貼合せ型ディスクを
連続製造するようにした請求項2記載の貼合せ型光ディ
スクの製造装置。
3. A substrate supply means for setting one of the disk substrates to be bonded on a support table along with the transfer means, an adhesion applying means for applying an adhesive member to the disk substrate on the support table,
Second substrate supply means for setting the other disk substrate on the disk substrate to which the adhesive member has been provided, the pressing means,
3. The apparatus for manufacturing a bonded optical disk according to claim 2, wherein said equalizing means are arranged at predetermined intervals, and said means is successively and intermittently transferred by means of a transfer means to continuously manufacture a bonded disk.
【請求項4】 前記均一化手段が、貼り合せられたディ
スク基板の貼り合せ状態を空気圧により均一化するオー
トクレーブである請求項3記載の貼合せ型光ディスクの
製造装置。
4. The apparatus for manufacturing a bonded optical disk according to claim 3, wherein said equalizing means is an autoclave for equalizing the bonded state of the bonded disk substrates by air pressure.
【請求項5】 移送手段がターンテーブルまたはコンベ
アである請求項2〜4記載のいずれかの貼合せ型光ディ
スクの製造装置。
5. The apparatus according to claim 2, wherein the transfer means is a turntable or a conveyor.
JP10243009A 1998-08-28 1998-08-28 Manufacturing device for sticking type optical disk Pending JP2000076711A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10243009A JP2000076711A (en) 1998-08-28 1998-08-28 Manufacturing device for sticking type optical disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10243009A JP2000076711A (en) 1998-08-28 1998-08-28 Manufacturing device for sticking type optical disk

Publications (1)

Publication Number Publication Date
JP2000076711A true JP2000076711A (en) 2000-03-14

Family

ID=17097539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10243009A Pending JP2000076711A (en) 1998-08-28 1998-08-28 Manufacturing device for sticking type optical disk

Country Status (1)

Country Link
JP (1) JP2000076711A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770162B2 (en) * 2000-09-28 2004-08-03 Pioneer Corporation Method of manufacturing a disk and transfer method for the disk

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770162B2 (en) * 2000-09-28 2004-08-03 Pioneer Corporation Method of manufacturing a disk and transfer method for the disk

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