JP2000076620A - Thin film magnetic head and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a thin film magnetic head in which the throat height of a recording head can be accurately controlled. SOLUTION: The lower magnetic pole of a recording head is bisected into a lower magnetic pole top end 19a and a lower magnetic pole layer 18. The lower magnetic pole top end 19a is formed in a projected shape on the flat face of the lower magnetic pole layer 18. A thin film coil 21 as a first layer together with insulating layers 20a, 20b made of an inorganic material are embedded in a recess formed between the lower magnetic pole top end 19a and a lower connecting part 19b. A throat height is stipulated by the edge of the insulating layer 20a on the lower magnetic pole top end 19a side, (namely, the edge opposite to the track face of the lower magnetic pole top end 19a). Therefore, unlike a conventional photoresist film, no changes in the position of the edge (pattern shift) nor the degradation of a profile are caused but the throat height can be accurately controlled. Further, the length of the upper magnetic pole top end 23a from the track face is larger than the length of the lower magnetic pole top end 19a and a contact area between the upper magnetic pole top end 23a and the upper magnetic layer 25 becomes wide as much as the length.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head having at least an inductive magnetic transducer for writing and a method of manufacturing the thin film magnetic head.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a thin film magnetic head has been required to be improved. As the thin film magnetic head, a composite thin film having a structure in which a recording head having an inductive magnetic transducer for writing and a reproducing head having a magnetoresistive (MR) element for reading is stacked. Magnetic heads are widely used. As an MR element, an anisotropic magnetoresistance (hereinafter, AMR) is used.
stive). AMR element using a film having an effect) and a giant magnetoresistance (hereinafter referred to as GMR (Giant Magneto Resi
stive). There is a GMR element using a film having an effect. A reproducing head using an AMR element is called an AMR head or simply an MR head, and a reproducing head using a GMR element is called a GMR head. The AMR head is used as a reproducing head having a surface recording density exceeding 1 gigabit / (inch) ² , and the GMR head is used as a reproducing head having a surface recording density exceeding 3 gigabit / (inch) ² .

Generally, an AMR film is a single layer structure made of a magnetic material exhibiting the MR effect. On the other hand, many GMR films have a multilayer structure in which a plurality of films are combined. There are several types of mechanisms by which the GMR effect occurs.
The layer structure of the MR film changes. As a GMR film, a superlattice G
Although an MR film, a spin valve film, a granular film, and the like have been proposed, the spin valve film is promising as a GMR film that is relatively simple in structure, exhibits a large resistance change even with a weak magnetic field, and is premised on mass production. .

Factors that determine the performance of the reproducing head include the pattern width, particularly the MR height. The MR height refers to the length (height) from the end on the air bearing surface side of the MR element to the end on the opposite side. The MR height is originally controlled by the polishing amount at the time of processing the air bearing surface. The air bearing surface (ABS) mentioned here
Is a surface of the thin-film magnetic head facing the magnetic recording medium, and is also called a track surface.

On the other hand, as the performance of the reproducing head is improved, the performance of the recording head is also required to be improved. To increase the recording density of the performance of the recording head, it is necessary to increase the track density in the magnetic recording medium. For this purpose, the width of the lower magnetic pole (bottom pole) and the upper magnetic pole (top pole) formed above and below the write gap (write gap) on the air bearing surface is reduced from several microns to submicron order. It is necessary to realize a recording head having a track structure, and therefore, a semiconductor processing technique is used.

Another factor that determines the performance of the recording head is the throat height (TH). The throat height refers to the length (height) of a portion (magnetic pole portion) from the air bearing surface to the edge of the insulating layer that electrically separates the thin-film coil. In order to improve the performance of the recording head, it is desired to reduce the throat height. This throat height is also controlled by the amount of polishing when processing the air bearing surface.

In order to improve the performance of a thin film magnetic head,
It is important to form the above-described recording head and reproducing head in a well-balanced manner.

Here, FIGS. 11 (a), (b) to 24
With reference to (a) and (b), an example of a method of manufacturing a composite thin film magnetic head will be described as an example of a conventional thin film magnetic head.

First, as shown in FIG. 11, for example, alumina (aluminum oxide, Al ₂ O ₃ ) is formed on a substrate 101 made of, for example, Altic (Al ₂ O ₃ .TiC).
The insulating layer 102 is formed with a thickness of about 5 to 10 μm. Subsequently, a lower shield layer 1 for a reproducing head made of, for example, permalloy (NiFe) is formed on the insulating layer 102.
03 is formed.

Next, as shown in FIG. 12, for example, alumina is coated on the lower shield layer 103 by 100 to 200 nm.
And a shield gap film 104 is formed. Next, on the shield gap film 104, M
An MR film 105 for forming an R element is formed with a thickness of several tens of nm, and is formed into a desired shape by high-precision photolithography. Subsequently, a lead terminal layer 106 for the MR film 105 is formed by a lift-off method. Next, a shield gap film 107 is formed on the shield gap film 104, the MR film 105, and the lead terminal layer 106,
The film 105 and the lead terminal layer 106 are embedded in the shield gap films 104 and 107. Subsequently, on the shield gap film 107, a magnetic material used for both the read head and the write head, for example, an upper shield / lower magnetic pole (hereinafter, referred to as a lower magnetic pole) 108 having a thickness of 3 μm made of permalloy (NiFe) is formed. I do.

Next, as shown in FIG.
08, an insulating layer such as an alumina film having a thickness of 200
A recording gap layer 109 of nm is formed. Further, the recording gap layer 109 is patterned by photolithography, and an opening 109 for connecting the upper magnetic pole and the lower magnetic pole is formed.
a is formed. Then, the permalloy (N
A magnetic pole tip (pole tip) 110 is formed of a magnetic material such as iFe) or iron nitride (FeN), and a connection pattern 110a between the upper magnetic pole and the lower magnetic pole is formed. The lower magnetic pole 108 is formed by the connection pattern 110a.
Is connected to an upper magnetic pole layer 116 to be described later.
(Chemical and Mechanical Polishing) It becomes easy to form an opening (through hole) after the step.

Next, as shown in FIG. 14, the recording gap layer 109 and the lower magnetic pole 108 are separated by about 0.3 to 0.5 μm by ion milling using the magnetic pole tip 110 as a mask.
Etch about m. By etching the lower magnetic pole 108 to form a trim structure, the spread of the effective write track width is prevented (that is, the spread of the magnetic flux in the lower magnetic pole during data writing is suppressed). Subsequently, an insulating layer 111 made of, for example, alumina having a thickness of about 3 μm is formed on the entire surface, and the entire surface is flattened by CMP.

Next, as shown in FIG.
1, a first-layer thin-film coil 11 for an inductive recording head made of, for example, copper (Cu) by plating, for example.
2 is formed selectively, and a photoresist film 113 is formed in a predetermined pattern on the insulating layer 111 and the thin film coil 112 by high-precision photolithography. Subsequently, heat treatment is performed at a predetermined temperature to planarize the photoresist film 113 and to insulate the thin film coil 112 from each other. Further, similarly, a second-layer thin-film coil 114 and a photoresist film 115 are formed on the photoresist film 113, and a predetermined temperature is set for flattening the photoresist film 115 and insulating between the thin-film coils 114. Heat treatment.

Next, as shown in FIG. 16, an upper yoke and upper magnetic pole layer (hereinafter referred to as an upper magnetic pole) made of a magnetic material for a recording head, for example, permalloy, is formed on the magnetic pole tip 110 and the photoresist films 113 and 115. A layer 116 is formed. The upper magnetic pole layer 116 is
2, 114, the lower magnetic pole 108
And is magnetically coupled. Subsequently, the upper magnetic pole layer 1
On the overcoat layer 1 made of, for example, alumina
17 is formed. Finally, the slider is machined to form track surfaces (air bearing surfaces) 118 of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

In FIG. 16, TH indicates the throat height, and MR-H indicates the MR height. P2W represents the track (magnetic pole) width.

In addition to the throat height TH and the MR height MR-H, factors that determine the performance of the thin-film magnetic head include an Apex Angle as indicated by θ in FIG. The apex angle refers to an angle between a straight line connecting the corners of the side surfaces on the track surface side of the photoresist films 113 and 115 and the upper surface of the upper magnetic pole layer 116.

[0017]

To improve the performance of the thin-film magnetic head, the throat height TH, MR height MR-H, apex angle θ as shown in FIG.
It is important to accurately form the track width P2W.

In particular, in recent years, in order to enable high areal density recording, that is, to form a recording head having a narrow track structure, the track width P2W is required to have a submicron size of 1.0 μm or less. I have. For that purpose, a technology for processing the upper magnetic pole to submicron using semiconductor processing technology is required. Further, with the narrow track structure, it is desired to use a magnetic material having a higher saturation magnetic flux density for the magnetic pole.

The problem here is that the photoresist film (for example, the photoresist films 113 and 11 shown in FIG.
It is difficult to finely form an upper magnetic pole layer (top pole) 116 formed on a coil portion (apex portion) covered with 5) and raised in a mountain shape.

As a method of forming the upper magnetic pole, for example, a frame plating method is used as shown in Japanese Patent Application Laid-Open No. Hei 7-262519. When the upper magnetic pole is formed by using the frame plating method, first, a thin electrode film made of, for example, permalloy is entirely formed on the apex portion. Next, a photoresist is applied thereon and patterned by photolithography to form a frame (outer frame) for plating. Then, the upper magnetic pole is formed by plating using the electrode film formed earlier as a seed layer.

The above-mentioned apex portion has a height difference of, for example, 7 to 10 μm or more. The thickness of the photoresist formed on the apex portion is at least 3 μm.
If it is necessary, the photoresist having fluidity is collected on the lower side, so that a photoresist film having a thickness of, for example, 8 to 10 μm or more is formed below the apex portion. As described above, in order to form a narrow track, it is necessary to form a submicron-width pattern using a photoresist film. Therefore, 8 to 1
It is necessary to form a submicron-width fine pattern using a photoresist film having a thickness of 0 μm or more, but this has been extremely difficult.

Moreover, at the time of photolithographic exposure,
Exposure light is reflected by, for example, an electrode film made of permalloy, and the photoresist is also exposed by the reflected light,
Deformation of the photoresist pattern occurs. As a result, the upper magnetic pole cannot be formed in a desired shape, for example, the side wall of the upper magnetic pole has a rounded shape. As described above, conventionally, it has been extremely difficult to accurately control the track P2W and accurately form the upper magnetic pole for the narrow track structure.

From the above, FIG.
As shown in the steps of FIGS. 3 to 16, after forming a track width of 1.0 μm or less at the magnetic pole tip portion 110 effective for forming a narrow track of the recording head, the upper portion serving as the yoke portion and the magnetic pole tip portion 110 is formed. A method of connecting the magnetic pole layer 116, that is, a method of dividing a normal upper magnetic pole into two parts: a magnetic pole tip 110 that determines a track width and an upper magnetic pole layer 116 that serves as a yoke for inducing magnetic flux. (Japanese Patent Laid-Open Nos. 62-245509 and 60-245).
No. 10409). By dividing the upper magnetic pole into two in this way, it becomes possible to finely process one magnetic pole tip 110 into a submicron width on the flat surface of the recording gap layer 109.

However, this thin-film magnetic head still has the following problems.

(1) First, in the conventional magnetic head, the throat height is determined at the end of the magnetic pole tip 110 farther from the track surface 118. However, when the width of the magnetic pole tip 110 is reduced, the pattern edge is formed round in photolithography. For this reason, the throat height, which requires high-precision dimensions, becomes non-uniform, and a lack of balance with the track width of the magnetoresistive effect element occurs during the processing and polishing of the track surface. For example, if the track width is 0.
When 5 to 0.6 μm is required, the end of the magnetic pole tip 110 remote from the track surface 118 shifts from the throat height zero position to the track surface side, and a large write gap is opened, making it impossible to write recording data. The problem often occurred.

(2) Next, as described above, in the conventional magnetic head, the track width of the recording head is defined by the magnetic pole tip 110 of one of the two divided upper magnetic poles. It can be said that the magnetic pole layer 116 does not need to be processed as finely as the magnetic pole tip 110. However,
Since the upper magnetic pole layer 116 is positioned above the magnetic pole tip 110 by photolithographic alignment, when both are largely displaced to one side when viewed from the track surface 118 (FIG. 16), the upper magnetic pole layer A so-called side write occurs in which writing is performed on the 116 side. As a result, the effective track width becomes wide, and a problem occurs that writing is performed in an area other than the original data recording area on the hard disk.

The track width of the recording head is extremely fine,
In particular, when the thickness becomes 0.5 μm or less, the upper magnetic pole layer 116
Also, a processing accuracy of a submicron width is required. That is, when viewed from the track surface 118 (FIG. 16) side,
If the dimensional difference in the horizontal direction between the magnetic pole tip 110 and the upper magnetic pole layer 116 is too large, as in the above case, side writing occurs, and writing is performed in an area other than the original data recording area. appear.

For this reason, it is necessary to process not only the magnetic pole tip 110 but also the upper magnetic pole layer 116 to have a submicron width. However, the apex portion below the upper magnetic pole layer 116 still has the above-described structure. Because there is such a large height difference,
Fine processing of the upper magnetic pole layer 116 was difficult.

(3) Further, there is a problem that it is difficult to shorten the magnetic path length (Yoke Length) in the conventional magnetic head. That is, as the coil pitch is narrower, a head with a shorter magnetic path length can be realized, and a recording head having particularly excellent high-frequency characteristics can be formed. The distance from the position where the height is zero to the outer peripheral end of the coil is a major factor that hinders the magnetic path length. Since the magnetic path length of a two-layer coil can be shorter than that of a single-layer coil, many high-frequency recording heads employ a two-layer coil. However, in a conventional magnetic head, a photoresist film is formed with a thickness of about 2 μm in order to form an insulating film between the coils after the first-layer coil is formed. Therefore, 1
A small rounded apex portion is formed at the outer peripheral end of the coil of the layer. Next, a second-layer coil is formed thereon. At this time, in the inclined portion of the apex portion,
Since the seed layer of the coil cannot be etched and the coil is short-circuited, a second-layer coil cannot be formed. Therefore, the coil of the second layer needs to be formed on a flat portion. If the thickness of the coil is 2-3 μm and the thickness of the inter-coil insulating film is 2 μm, the slope of the apex is 4 μm.
In the case of 5 to 55 degrees, the distance from the outer peripheral end of the coil to the vicinity of the zero position of the throat height is twice the distance of 4 to 5 μm (the distance from the contact between the upper magnetic pole and the lower magnetic pole to the outer peripheral end of the coil is also 4 to 5 μm. ) Of 8 to 10 μm is required, which is a factor that hinders the reduction of the magnetic path length. For example, when an 11-turn coil having a line / space of 1.0 μm / 1.0 μm is formed by two layers, if the first layer has six turns and the second layer has five turns, the length of the portion occupying the coil having the magnetic path length is set 11μ
m. Here, since the apex portion at the outer peripheral end of the coil needs 8 to 10 μm, it is impossible to further reduce the magnetic path length, which has hindered the improvement of the high frequency characteristics.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a thin-film magnetic head capable of accurately controlling the throat height of a recording head and a method of manufacturing the same.

A second object of the present invention is to enable not only accurate control of the throat height, but also ultra-fine processing of not only the tip of the magnetic pole but also the sub-micron width of the upper magnetic pole layer. And a method of manufacturing the same.

Further, a third object of the present invention is to provide a thin-film magnetic head in which the magnetic path length in the recording head can be reduced and the high-frequency characteristics are improved in addition to the accurate control of the throat height, and a method of manufacturing the same. To provide.

[0033]

SUMMARY OF THE INVENTION A thin-film magnetic head according to the present invention has a first magnetic pole and a second magnetic pole, which are magnetically connected and have a part facing a recording medium facing a recording gap layer therebetween. A thin-film magnetic head having at least two magnetic layers including magnetic poles and one or more thin-film coils for generating magnetic flux, wherein the first magnetic layer includes:
The first magnetic layer is formed separately from the first magnetic layer, and a surface opposite to a surface adjacent to the recording gap surface is provided with a first magnetic pole magnetically coupled to a partial region of the first magnetic layer. An insulating layer formed of an inorganic material and formed continuously on at least one surface of the first magnetic layer from a surface opposite to a surface of the first magnetic pole facing the recording medium; and a recording gap layer. A second magnetic pole formed to be longer than the first magnetic pole from the surface facing the recording medium toward the back side, and to be divided from the second magnetic pole. And a second magnetic layer magnetically coupled to the second magnetic pole on at least a part of the surface opposite to the recording gap surface of the second magnetic pole. I have.

In the thin-film magnetic head according to the present invention, since the first magnetic pole is divided from the first magnetic layer and is formed so as to project from the first magnetic layer, the insulating layer formed of an inorganic material is formed. Are formed adjacent to the first magnetic pole. Therefore, the throat height is accurately defined by making the length of the first magnetic pole in the depth direction from the surface facing the recording medium equal to the throat height of the recording head. Further, the length of the second magnetic pole facing the first magnetic pole via the recording gap layer is set to be longer than that of the first magnetic pole.
The contact area between the second magnetic pole and the second magnetic layer can be sufficiently ensured, and the magnetic coupling between the second magnetic pole and the second magnetic layer can be improved.

Further, by embedding the thin-film coil in the region where the insulating layer is formed, the step of the apex portion including the coil is accordingly reduced as compared with the conventional structure. Therefore, when the second magnetic pole is formed by the photolithography technique, the difference in the thickness of the photoresist film between the upper and lower portions of the apex portion is reduced. Therefore, the second
The sub-micron size of the magnetic pole can be miniaturized.

In the thin-film magnetic head according to the present invention, in addition to the above configuration, the following mode can be further adopted.

That is, in the thin-film magnetic head according to the present invention, the length of the first magnetic pole from the surface facing the recording medium is:
It is preferable to make the length equal to the length of the throat height of the recording head.

Further, in the thin film magnetic head according to the present invention,
It is preferable that the second magnetic pole is longer than the first magnetic pole by an amount corresponding to the thickness of the second magnetic pole.

In the thin film magnetic head according to the present invention,
At least one thin-film coil may be formed so that at least a part of the thin-film coil in the thickness direction is located in a region where the insulating layer is formed. A first magnetic layer formed continuously along one surface of the first magnetic layer from the opposite surface facing the medium.
, And at least a second insulating layer formed between the windings of the thin-film coil. Further, the surface of the insulating layer opposite to the surface adjacent to the first magnetic layer is the first magnetic layer.
The magnetic pole may be formed so as to be substantially flush with the surface opposite to the surface adjacent to the recording gap layer.

Further, in the thin film magnetic head according to the present invention,
The width of the first magnetic pole along the surface facing the recording medium may be wider than the width of the second magnetic pole.

Further, in the thin film magnetic head according to the present invention,
In the vicinity of the end of the second magnetic layer opposite to the side facing the recording medium, a first connecting portion formed adjacent to the first magnetic layer and a position facing the first connecting portion. And a second connection portion formed adjacent to the second magnetic layer, and the first connection portion and the second connection portion may have different areas on opposite sides. Further, the area of the second connecting portion may be wider than that of the first connecting portion.

Further, in the thin film magnetic head according to the present invention,
It is preferable that the end of the second magnetic layer on the side facing the recording medium is formed at a position recessed from the side facing the recording medium.

Further, in the thin film magnetic head according to the present invention,
The first insulating layer is formed along both sides except for the end face of the first magnetic pole facing the recording medium. A configuration in which a layer is formed in a region where the layer is formed may be employed. Further, the second insulating layer may be formed so as to be substantially flush with a surface of the first magnetic pole adjacent to the recording gap layer.

In the thin film magnetic head according to the present invention,
One surface of the recording gap layer is formed so as to cover the second insulating layer, and the third insulating layer is formed at least from the opposite surface of the second magnetic pole on the side facing the recording medium. It is good also as a structure formed continuously over the other surface. Further, a structure including at least one thin-film coil formed between the third insulating layer and the second magnetic layer so as to be covered with another insulating layer different from the first to third insulating layers. It may be. Further, the third insulating layer and the other insulating layer may be formed so as to be substantially flush with the surface opposite to the surface adjacent to the recording gap layer of the second magnetic pole.

Further, in the thin film magnetic head according to the present invention,
A configuration including a magnetoresistive element for reading may be employed.

The method of manufacturing a thin-film magnetic head according to the present invention includes a first magnetic pole and a second magnetic pole which are magnetically coupled and a part of the side facing the recording medium is opposed via a recording gap layer. A method of manufacturing a thin-film magnetic head having at least two magnetic layers and one or more thin-film coils for generating a magnetic flux, comprising: forming a first magnetic layer; Forming a first magnetic pole on the first magnetic layer so as to be magnetically coupled to a partial region of the first magnetic layer; and forming a first magnetic pole from at least a first surface of the first magnetic layer opposite to a surface facing the recording medium. Continuously forming an insulating layer made of an inorganic material over one surface of the magnetic layer, and forming a recording gap layer on at least the first magnetic pole, and then moving the second magnetic pole to a recording medium. From the surface opposite to It is intended to include a step of poles longer than, and forming a second magnetic layer magnetically coupled to form a second pole.

In the method of manufacturing a thin-film magnetic head according to the present invention, the first magnetic pole is formed so as to project from the first magnetic layer, and the insulating layer made of an inorganic material is adjacent to the first magnetic pole. Formed. Therefore, by setting the length of the first magnetic pole in the depth direction from the surface facing the recording medium to be equal to the length of the throat height of the recording head, the throat height is accurately defined. Further, the length of the second magnetic pole facing the first magnetic pole via the recording gap layer is the first magnetic pole.
Therefore, the contact area between the second magnetic pole and the second magnetic layer is ensured, and the magnetic coupling between the second magnetic pole and the second magnetic layer is improved.

In the method of manufacturing a thin-film magnetic head according to the present invention, in addition to the above-described configuration, the following mode can be further adopted.

That is, in the method of manufacturing a thin-film magnetic head according to the present invention, the first magnetic pole is formed, and at the same time, the first magnetic pole is formed at the position near the end of the second magnetic layer opposite to the side facing the recording medium. Forming a first connection part adjacent to the magnetic layer of the second magnetic layer, forming a second magnetic pole at the same time as forming a second magnetic pole at the position near the end of the second magnetic layer opposite to the side facing the recording medium; A second connection portion having an area different from that of the first connection portion may be formed adjacent to the second magnetic layer.

In the method of manufacturing a thin-film magnetic head according to the present invention, the step of forming at least one thin-film coil is such that at least a part thereof in the thickness direction is located in a region where the insulating layer is formed. May be included,
Alternatively, a step of continuously forming a first insulating layer along one surface of the first magnetic layer from a surface opposite to a side facing the recording medium of the first magnetic pole; And forming a second insulating layer on the first magnetic layer. The surface of the second insulating layer opposite to the surface adjacent to the first magnetic layer may be formed between the first magnetic pole and the recording gap layer. The method may include a step of flattening the surface to be substantially the same as the surface opposite to the adjacent surface.

Further, in the method of manufacturing a thin-film magnetic head according to the present invention, the width of the first magnetic pole along the surface facing the recording medium may be wider than that of the second magnetic pole.

In the method of manufacturing a thin-film magnetic head according to the present invention, the whole of the thin-film coil in the thickness direction may be formed in a region where the first insulating layer is formed.

Further, in the method of manufacturing a thin film magnetic head according to the present invention, after the second insulating layer is planarized, a recording gap layer is formed on the second insulating layer, and the second gap is formed on the recording gap layer.
, A third insulating layer is formed at least on the recording gap layer, and then a third insulating layer is formed on the recording gap layer.
Forming at least one thin-film coil on the insulating layer of
Subsequently, the thin film coil may be covered with another insulating layer different from the first to third insulating layers.

In the method of manufacturing a thin-film magnetic head according to the present invention, after another insulating layer is formed of an inorganic material,
The other insulating layer is planarized so that its surface forms the same plane as the surface of the second magnetic pole, and then a second magnetic layer is formed on the second magnetic pole and the other planarized insulating layer Alternatively, the second magnetic layer may be formed on the second magnetic pole and the other insulating layer after the other insulating layer is selectively formed of an organic material.

Further, the method of manufacturing a thin film magnetic head according to the present invention may include a step of forming a read magnetoresistive element.

[0056]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[First Embodiment] FIGS. 1A and 1B
7 (a) and 7 (b) show the first embodiment of the present invention, respectively.
14A to 14C show a manufacturing process of a composite thin film magnetic head as the thin film magnetic head according to the embodiment. 1 to 7, (a) shows a cross section perpendicular to the track surface (ABS), and (b) shows a cross section of the magnetic pole portion parallel to the track surface.

First, the configuration of the composite thin-film magnetic head according to the present embodiment will be described with reference to FIGS. 7 (a) and 7 (b). This magnetic head has a magnetoresistive read head for reproduction (hereinafter, referred to as reproduction head) 1A and an inductive recording head for recording (hereinafter, referred to as recording head) 1B.

The reproducing head 1A is formed on an insulating layer 12 made of, for example, alumina (aluminum oxide, Al ₂ O ₃ ), for example, iron aluminum silicide on a substrate 11 made of AlTiC (Al ₂ O ₃ .TiC). (FeA
1M), a pattern of a magnetoresistive film (hereinafter referred to as an MR film) 15 is sequentially formed via a lower shield layer 13 formed of 1Si), for example, a shield gap layer 14 formed of alumina. On the shield gap layer 14, a lead terminal layer 15a made of a material such as tantalum (Ta) or tungsten (W) which does not diffuse into the MR film is also formed. 15 is electrically connected. MR
The film 15 is formed of various materials having a magnetoresistance effect, such as permalloy (NiFe alloy) or nickel (Ni) -cobalt (Co) alloy. A shield gap layer 17 made of, for example, alumina is laminated on the MR film 15 and the lead terminal layer 15a. That is, M
The R film 15 and the lead terminal layer 15a are buried between the shield gap layers 14, 17. Note that the MR film 15
There is no particular limitation, and an AMR film, a GMR film, or another magnetoresistive film may be used.

The recording head 1 B
On A, an upper magnetic pole is formed via a lower magnetic pole also serving as an upper shield layer for the MR film 15 and a recording gap layer 22.

In the present embodiment, the lower magnetic pole includes a lower magnetic pole layer (lower pole) 18 formed on the shield gap layer 17 and a lower magnetic pole tip (formed on the lower magnetic pole layer 18 on the track surface side). Lower pole tip) 19a
And two parts. Similarly, the upper magnetic pole is also 2
The upper pole tip (upper pole tip) 23a is formed on the track surface side on the lower pole tip 19a with the recording gap layer 22 interposed therebetween, and contacts with the upper pole tip 23a. And an upper magnetic pole layer (upper pole) 25 which also functions as a yoke and is formed along the upper surface of an apex portion including a coil described later. The upper magnetic pole layer 25 is magnetically coupled to the lower magnetic pole layer 18 via the upper connecting portion 23b and the lower connecting portion 19b at a position opposite to the track surface of the apex portion (right side in FIG. 7A). ing.

The width of the upper connecting portion 23b is equal to the width of the lower connecting portion 19b.
In this embodiment, the area of the upper connecting portion 23b is different from the width of the lower connecting portion 19b.
Is larger than the area. Also, the lower connecting portion 19
b is in contact with the central position of the upper connection portion 23b, so that the flow of magnetic flux from the upper magnetic pole layer 25 to the lower magnetic pole layer 18 is smooth.

The above-described lower magnetic pole layer 18 and lower magnetic pole tip 1
9a, the lower connecting portion 19b, the upper magnetic pole tip 23a, the upper connecting portion 23b, and the upper magnetic pole layer 25 are each made of, for example, a high saturation magnetic flux density material (Hi-Bs material), for example, NiF.
e (Ni: 50% by weight, Fe: 50% by weight), NiFe
(Ni: 80% by weight, Fe: 20% by weight), FeN, F
It is formed of eZrNP, CoFeN, or the like.

In the recording head section 1B, the lower magnetic pole tip 19a facing the upper magnetic pole tip 23a has a trim (Trim) structure in which the surface portion is partly protruded. Thereby, the spread of the effective write track width, that is, the spread of the magnetic flux in the lower magnetic pole at the time of writing data is suppressed.

In this embodiment, the lower magnetic pole layer 18 is the first magnetic layer of the present invention and the lower magnetic pole tip 19a.
Correspond to the first magnetic pole of the present invention, and the upper magnetic pole tip 23a corresponds to the second magnetic pole and the upper magnetic pole layer 25 of the present invention.
Correspond to the second magnetic layer of the present invention, respectively.

In the present embodiment, the first-layer thin-film coil 2
Numeral 1 is formed in a concave region between the lower pole tip portion 19a and the lower connection portion 19b on the lower pole layer 18. That is, the insulating layer 20a is formed on the inner wall surface (bottom surface and side wall surface) of the concave region, and the thin film coil 21 is formed on the insulating layer 20a. The space between the coils of the thin-film coil 21 is buried with an insulating layer 20b.
And the surface of the lower pole tip 19a are flattened so as to form the same plane. Therefore, the step of the apex portion including the thin film coil 24 described later is reduced by the thin film coil 21. Note that the insulating layer 20a corresponds to the first insulating layer of the present invention, and the insulating layer 20b corresponds to the second insulating layer of the present invention.

A recording gap layer 22 extends on the flattened insulating layer 20 b and the thin film coil 21. An insulating layer 20c is formed on the recording gap layer 22 in a recessed region between the upper pole tip 23a and the upper connecting portion 23b. A second-layer thin-film coil 24 is formed on the insulating layer 20c. The thin-film coil 24 is covered with an insulating layer 20d made of, for example, alumina. This insulating layer 20d corresponds to another insulating layer of the present invention.

An upper magnetic pole layer 25 also serving as a yoke is formed on the insulating layer 20d. The upper magnetic pole layer 25 is covered with an overcoat layer 26. Although not shown, the thin-film coils 21 and 24 are formed of the insulating layer 20b and the insulating layer 20.
It is electrically connected at the interface with d.

In this magnetic head, information is read from a magnetic disk (not shown) by using the magnetoresistive effect of the MR film 15 in the reproducing head section 1A.
In the recording head unit 1B, information is written on the magnetic disk by utilizing the change in the magnetic flux between the top pole tip 23a and the bottom pole tip 19a by the thin-film coils 21 and 24.

Next, a method of manufacturing the above-described composite thin film magnetic head will be described.

In the manufacturing method according to the present embodiment, first,
As shown in FIG. 1, for example, Altic (Al ₂ O ₃
An insulating layer 12 made of, for example, alumina (Al ₂ O ₃ ) on a substrate 11 made of
Is formed with a thickness of about 3 to 5 μm. Next, using a photoresist film as a mask, permalloy (NiFe) is selectively formed to a thickness of about 3 μm on the insulating layer 12 by plating to form a lower shield layer 13 for a read head. Subsequently, for example, sputtering or CVD (Chemic
An alumina film (not shown) having a thickness of about 4 to 6 μm is formed by an Al Vapor Deposition method, and planarized by CMP.

Next, as shown in FIG. 2, for example, alumina is deposited on the lower shield layer 13 to a thickness of 100 to 200 nm by sputtering, and the shield gap layer 14 is formed.
To form Subsequently, an MR film 15 for forming a reproducing MR element or the like is formed on the shield gap layer 14 to a thickness of several tens of nm, and is formed into a desired shape by high-precision photolithography. Subsequently, a lead terminal layer 15a for the MR film 15 is formed by a lift-off method. Next, a shield gap layer 17 is formed on the shield gap layer 14, the MR film 15, and the lead terminal layer 15a,
The MR film 15 and the lead terminal layer 15a are embedded in the shield gap layers 14, 17.

Subsequently, on the shield gap film 17, a lower magnetic pole layer (lower pole) 18 also serving as an upper shield made of, for example, permalloy (NiFe) is provided for about 1.0 to 1..
It is formed with a thickness of 5 μm.

Next, as shown in FIG.
A lower pole tip (lower pole tip) 19a and a lower connecting portion 19b are formed on the upper surface 8 with a thickness of about 2.0 to 2.5 μm. Here, the lower magnetic pole tip 19a is formed so that the tip on the track side is near the position of zero MR (GMR) height, and at the same time, the opposite side of the track surface is located at zero throat height. I do. The lower magnetic pole tip 19a and the lower connecting portion 19b may be formed of a plating film of NiFe or the like as described above.
It may be formed by a sputtered film of eN, FeZrNP, CoFeN or the like.

Subsequently, an insulating layer 20a made of an insulating material, for example, alumina and having a thickness of 0.3 to 0.6 μm is formed on the entire surface by, for example, a sputtering method or a CVD method.

Next, as shown in FIG. 4, an inductive type made of, for example, copper (Cu) is formed in a concave region formed between the lower magnetic pole tip portion 19a and the lower connecting portion 19b by, for example, electrolytic plating. First-layer thin-film coil 21 for recording head
Is formed with a thickness of 1.5 to 2.5 μm.

Next, as shown in FIG. 5, an insulating layer 20b made of an insulating material, for example, alumina and having a thickness of 3.0 to 4.0 μm is formed on the entire surface by sputtering, and then the surface is formed by, for example, CMP. And the lower pole tip 19
The surface of a is exposed. At this time, in the present embodiment,
Although the surface of the thin-film coil 21 is also exposed at the same time, the surface portion of the thin-film coil 21 other than a connection portion with a second-layer thin-film coil 24 described later need not be exposed.

Next, as shown in FIG. 6, a film made of an insulating material, for example, alumina, having a film thickness of 0.2 to
A 0.3 μm recording gap layer 22 is formed. The recording gap layer 22 is made of aluminum nitride (Al) in addition to alumina.
N), a silicon oxide-based material, a silicon nitride-based material, or the like. Subsequently, the recording gap layer 22 is patterned by photolithography to form an opening 22a for connecting the upper magnetic pole and the lower magnetic pole.

Subsequently, an upper pole tip (pole tip) 23a for determining the track width of the recording head is formed on the recording gap layer 22 by photolithography. That is, a high saturation magnetic flux density material (Hi-Bs material) such as NiFe (Ni: 50% by weight, Fe: 50% by weight) is formed on the recording gap layer 22 by, for example, a sputtering method.
NiFe (Ni: 80% by weight, Fe: 20% by weight), F
A pole layer made of eN, FeZrNP, CoFeN or the like and having a thickness of 2.5 to 3.5 μm is formed. Subsequently, this magnetic pole layer is formed using, for example, Ar using a photoresist mask.
(Argon) is selectively removed by ion milling to form an upper magnetic pole tip 23a and an upper connecting portion 2 for magnetically connecting the upper magnetic pole and the lower magnetic pole.
3b is formed. The upper pole tip portion 23a and the upper connection portion 23b may be etched by using a mask made of an inorganic insulating layer such as alumina instead of a photoresist mask. It may be formed by a plating method, a sputtering method, or the like.

Here, in the present embodiment, the upper magnetic pole tip 23a is moved backward from the track surface to the lower magnetic pole tip 19a.
a, the upper connecting portion 23b is formed wider than the lower connecting portion 19b, and the upper connecting portion 2b is formed longer than the lower connecting portion 19b.
The lower connection portion 19b is brought into contact with the center position of 3b.

Subsequently, using the upper magnetic pole tip 23a as a mask, the surrounding recording gap layer 22 and the lower magnetic pole tip 19a are etched in a self-aligned manner. That is,
Chlorine-based gas (Cl
₂ , RIE (Reac) using CF ₄ , BCl ₂ , SF ₆ etc.
After selective removal of the recording gap layer 22 by tive ion etching, the exposed lower magnetic pole tip 19a is again removed by, for example, Ar ion milling to about 0.3 to
Etching is performed by about 0.6 μm to form a recording track having a trim structure.

Subsequently, an insulating layer 20c made of, for example, alumina having a thickness of about 0.3 to 0.6 μm is formed on the entire surface by, for example, a sputtering method or a CVD method. Subsequently, on the insulating layer 20c, a second-layer thin-film coil 24 of, for example, copper (Cu) for an induction type recording head is formed with a thickness of 1.5 to 2.5 μm by, for example, electrolytic plating. .

Subsequently, an insulating layer 20d made of, for example, alumina having a film thickness of about 3 to 4 μm is formed on the entire surface by, for example, a sputtering method or a CVD method. The insulating layer 20
The d and the insulating layer 20c are not limited to alumina, and may be formed of another insulating material such as silicon dioxide (SiO ₂ ) or silicon nitride (SiN). Subsequently, the insulating layer 20d and the insulating layer 20c are etched by, for example, a CMP method so that the surfaces of the upper magnetic pole tip portion 23a and the upper connecting portion 23b are exposed, and the surfaces of the insulating layers 20c and 20d and the upper magnetic pole tip portion 23a and Flattening is performed so that each surface of the upper connection portion 23b forms the same surface.

Next, as shown in FIG. 7, the upper magnetic pole layer 25 is formed to a thickness of about 3 to 4 μm by using, for example, the same material as the upper magnetic pole tip 23a, for example, by an electrolytic plating method or a sputtering method. Formed. This upper magnetic pole layer 25
When viewed from the track surface side, at a position behind the thin-film coils 21 and 24, the lower contact portion 19b is in contact with the lower connection portion 19b via the upper connection portion 23b, and is magnetically connected to the lower magnetic layer 18. Finally, an overcoat layer 26 made of alumina and having a thickness of about 30 μm is formed on the upper magnetic pole layer 25 by, for example, a sputtering method. Then, machining of the slider is performed, and the track surfaces (AB) of the recording head and the reproducing head are processed.
By forming S), a thin-film magnetic head is completed.

FIG. 8 is a plan view of the thin-film magnetic head according to the present embodiment. This figure shows a state before the slider is machined. In these figures, TH represents the throat height, and the throat height TH is defined by the edge of the insulating layer 20a on the magnetic pole portion side, that is, the edge of the lower magnetic pole tip portion 19a opposite to the track surface. . In this figure, the throat height T
Since H coincides with the GMR height, TH = GMR height. The thin film coil 21 has lead terminals 21
a is connected to one end. This lead terminal 21
The other end of a is connected to an electrode lead-out pad (not shown). One end is the MR element 1
The other end of the lead terminal layer 15a connected to the terminal 5 is also connected to an electrode lead-out pad (not shown).

In the above embodiment, the following effects can be obtained.

(1) First, in the present embodiment, the lower magnetic pole is divided into a lower magnetic pole tip 19a and a lower magnetic pole layer 18, and the lower magnetic pole tip 19a is placed on the flat surface of the lower magnetic pole layer 18. As a result, the insulating layers 20a and 20b made of an inorganic material are connected to the lower magnetic pole tip 19a and the lower connecting portion 1a.
9b. Therefore,
An edge of the insulating layer 20a on the side of the lower magnetic pole tip 19a (that is, an edge of the lower magnetic pole tip 19a opposite to the track surface).
Defines the throat height. Therefore, unlike the conventional photoresist film, there is no fluctuation in the position of the edge (pattern shift) and deterioration of the profile.
Accurate control of throat height becomes possible. Furthermore, MR
Accurate control of height and precise control of Apex angle are also possible.

(2) In this embodiment, the upper magnetic pole tip 23a is formed to be longer than the lower magnetic pole tip 19a, so that the upper magnetic pole tip 23a has the same length as the lower magnetic pole tip 19a. The contact area between the upper magnetic pole tip portion 23a and the upper magnetic pole layer 25 can be increased as compared with the case where the magnetic pole is provided, and the magnetic coupling at that portion is improved.
In particular, when the upper magnetic pole layer 25 is provided at a position recessed from the track surface (recess structure) as in the present embodiment, such a configuration is effective. That is,
If the upper magnetic pole layer 25 is located closer to the track surface than the throat height TH = zero (the edge of the lower magnetic pole tip 19a opposite to the track surface), for example, at a position near TH = 0.5 μm, Due to the upper magnetic pole layer 25, a side write defect for writing information on an adjacent track occurs. Ideally, the upper magnetic pole layer 25 is desirably formed at a position farther from the track surface than a position where TH is zero. On the other hand, in the present embodiment, the lower magnetic pole tip 19a for determining TH is magnetically coupled to the upper magnetic pole layer 25 via the upper magnetic pole tip 23a, and the upper magnetic pole tip 23a is connected to the upper magnetic pole. The layer 25 must be firmly connected in the direction opposite to the track plane from the position where TH is zero. For this reason, the upper magnetic pole tip 2
3a is desirably formed longer than the lower magnetic pole tip 19a.

(3) In this embodiment, as shown in FIG. 8, when each pattern is viewed from directly above, the width of the lower magnetic pole tip 19a is wider than the width of the upper magnetic pole tip 23a. Therefore, even if the upper magnetic pole tip 23a is a narrow track having a half-micron width, the lower magnetic pole tip 19a
Is not saturated in the vicinity of.

(4) By the way, as the upper pole tip 23a and the lower pole tip 19a become finer and narrower, the contact between the upper pole and the lower pole,
That is, the widths of the lower connecting portion 19b and the upper connecting portion 23b are also reduced. When the widths of the lower connection portion 19b and the upper connection portion 23b are reduced in this manner, the lower connection portion 19b
If the angle of the side wall of b with respect to the lower magnetic layer 18 or the angle of the side wall of the upper connection portion 23b with the upper magnetic layer 25 is perpendicular, the magnetic flux may be saturated at that portion. On the other hand, in the present embodiment, the area of the upper connection portion 23b is larger than that of the lower connection portion 19b, and the lower connection portion 19b faces the center of the upper connection portion 23b. When viewed in cross section, the entire contact portion has a shape having a slope along the inclined surface between the upper and lower coils, that is, the entire contact portion has a funnel-like shape. Therefore, the flow of the magnetic flux from the upper magnetic pole to the lower magnetic pole is smooth, and the magnetic coupling between the two magnetic poles is improved. The upper connecting portion 23b and the lower connecting portion 19b may each be provided with a taper. With such a configuration, the flow of the magnetic flux from the upper magnetic pole to the lower magnetic pole becomes smoother. Also, conversely,
The configuration may be such that the area of the lower connection portion 19b side is larger than the area of the upper connection portion 23b.

(5) Further, in this embodiment, between the thin film coil 21 and the lower magnetic pole layer 18 also serving as an upper shield, the inorganic insulating films 20a and 20b,
Between the recording gap film 22 and the insulating layer 20c,
By adjusting the thickness of each insulating layer, a large withstand voltage can be obtained between each of the thin-film coils 21 and 24 and the upper shield. Leakage of magnetic flux from the coils 21 and 24 can be reduced.

(6) In this embodiment, the upper magnetic pole is divided into an upper magnetic pole tip portion 23a and an upper magnetic pole layer 25, and the upper magnetic pole tip portion 23a is divided into a flat surface on the lower magnetic pole tip portion 19a. The upper magnetic pole tip 23a for regulating the recording track width can be formed with a submicron size with high precision. In addition, in the present embodiment, the first-layer thin-film coil 21 is buried in the recessed region adjacent to the lower pole tip 19a by the insulating layer 20b, and the surface of the insulating layer 20b is formed by the lower pole tip 19a.
Is formed so as to form the same surface as the surface. That is, the step in the apex portion including the second-layer thin-film coil 24 is lower than that of the conventional structure by the amount of the first-layer thin-film coil 21. Therefore, when the upper magnetic pole layer 25 that partially contacts the upper magnetic pole tip 23a is formed by photolithography, the difference in the thickness of the photoresist film between the upper and lower portions of the apex portion is reduced. The pole layer 25 can be miniaturized to submicron dimensions. Therefore, in the thin-film magnetic head obtained according to this embodiment, high areal density recording can be performed by the recording head, and the performance of the recording head can be further improved by laminating two or three coils. In addition, at the time of photolithography of the upper magnetic pole tip 23a and the upper magnetic pole layer 25, by using an inorganic insulating layer as a mask instead of a photoresist, the upper magnetic pole tip 23a and the upper magnetic pole layer 25 can be miniaturized. Higher accuracy can be achieved. Also, when the upper pole tip 23a and the upper pole layer 25 are formed by sputtering or the like other than photolithography, the influence of the step of the apex portion is similarly reduced.
a and the top pole layer 25 can be miniaturized.

(7) Further, in this embodiment, since the inclined portion of the photoresist pattern does not exist unlike the conventional example, the first and second thin-film coils 21 and 24 are both formed in flat portions. The distance between the outer peripheral end of the coil and the position of zero throat height due to the inclined portion does not hinder the magnetic path length from being reduced. Therefore, in this embodiment, the magnetic path length can be shortened, and the high frequency characteristics of the recording head can be significantly improved. Incidentally, in the present embodiment, 0.1% of the alignment error of photolithography is used.
μm-. Since it can be designed at 0.2 μm, it is 50% of the conventional example
In the following, the magnetic path length can be reduced.

(8) In this embodiment, since the magnetic layers such as the upper magnetic pole tip 23a and the upper magnetic pole layer 25 are made of a high saturation magnetic flux density (Hi-Bs) material, the track width is narrow. Even so, the magnetism generated in the thin film coils 21 and 24 effectively reaches the upper magnetic pole tip 23a and the lower magnetic pole tip 19a without being saturated on the way, thereby realizing a recording head without magnetic loss.

(9) Further, in this embodiment, the upper magnetic pole layer 25 formed on the upper magnetic pole tip 23a for determining the track width is not exposed on the track surface. There is no side light.

(10) In the present embodiment, the upper pole tip 23a for determining the track width is provided in the upper pole layer 2
5, the magnetic flux does not saturate in this portion even if a large amount of magnetic flux flows from the upper magnetic pole layer 25 because the distance between the upper magnetic pole layer 25 and the recording gap layer 22 is short. Write (overwrite) characteristics and nonlinear transition (NLTS) characteristics are improved.

Hereinafter, another embodiment of the present invention will be described. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. Only different portions will be described.

[Second Embodiment] FIGS. 9A and 9B
Shows a configuration of a composite thin-film magnetic head according to a second embodiment of the present invention. In the first embodiment,
The second-layer thin-film coil 24 is structured so as to be completely buried below the surface of the upper pole tip 23a, that is, in the flattened insulating layer 20d. However, when the upper pole tip 23a is thin, In a planarization process such as CMP, the surface of the thin film coil 24 may be exposed. In the present embodiment, in such a case, the thin-film coil 24 and the upper magnetic pole layer 2
5, an insulating layer 30 of, eg, a 1.0 μm-thick photoresist is selectively formed between the thin-film coil 24 and the upper magnetic pole layer 25. is there. The other configuration and operation and effect are the same as those of the first embodiment, and the description thereof is omitted.

[Third Embodiment] In this embodiment, as shown in FIGS. 10A, 10B, and 10C, the steps up to the step of forming the second-layer thin-film coil 24 are repeated. As in the first embodiment, after that, the thin film coil 24 is covered with a photoresist film 31, and then, the upper magnetic pole layer 25 is formed on the photoresist film 31, and the tip of the upper magnetic pole layer 25 is not exposed on the track surface. It was formed as follows. FIG. 3C shows the lower magnetic pole tip 1 in FIGS. 3A and 3B.
9A is a plan view of the lower magnetic pole 9a, the lower magnetic pole 19b, the upper magnetic pole tip 23a, the lower magnetic pole 23b, and the upper magnetic pole layer 25. FIG.

In this embodiment, unlike the first embodiment, after forming the second-layer thin-film coil 24, the CMP is performed.
Need not be performed. Therefore, the first
The manufacturing cost is reduced as compared with the embodiment. In addition,
Since the second-layer thin-film coil 24 has five turns and is formed in the flattened portion of the six-turn first-layer thin-film coil 21, the distance from the outer peripheral end of the thin-film coil 24 to the zero throat height position is small. There is no hindrance to the magnetic path length. Other configurations and operation and effects are the same as those of the first embodiment.
The description is omitted.

Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above-described embodiment and can be variously modified. For example, in the above embodiment, the upper magnetic pole tip 23a and the upper magnetic pole layer 25
NiFe (Ni: 50% by weight, Fe: 50% by weight), N
iFe (Ni: 80% by weight, Fe: 20% by weight)
Although an example using a high saturation magnetic flux density material such as FeN or FeCoZr has been described, a structure in which two or more types of these materials are stacked may be used.

In the first to fifth embodiments,
Although the thin film coil embedded in the concave portion formed adjacent to the lower magnetic pole tip portion 19a has one layer, it may have a laminated structure in which two or more layers of coils are embedded.

Further, in the above embodiment, the lower pole tip portion 19a has a side wall perpendicular to the lower pole layer 18. However, depending on the thickness of the coil, for example, θ = 50 to
An inclined surface (taper) of about 70 degrees may be provided. With such a configuration, the lower pole layer 18
Of the magnetic flux at the connection between the magnetic pole and the lower magnetic pole tip 19a is suppressed, and the flow of the magnetic flux becomes smooth.

In the above embodiment, the upper pole layer 2
Although the structure (recess structure) in which the upper magnetic pole layer 5 is formed at a position receded from the track surface has been described, the upper magnetic pole layer 25 is formed by making the upper magnetic pole layer 25 relatively thicker than the upper magnetic pole tip 23a. The structure may be such that it is exposed on the track surface together with the magnetic pole tip 23a. Thus, the disadvantage that the upper pole layer 25 generates side light can be solved without using the recess structure.

Further, in the above embodiment, the first thin film coil is buried by the insulating layer in the concave region adjacent to the lower magnetic pole tip portion 19a. May be an inorganic insulating layer made of, for example, alumina. In the above embodiment, the lower magnetic pole is used as the first magnetic layer,
Although the configuration is shown in which the upper magnetic poles correspond to the second magnetic layers, a configuration in which this correspondence is reversed is also possible. That is, the lower magnetic pole may correspond to the second magnetic layer, and the upper magnetic pole may correspond to the first magnetic layer.

In each of the above embodiments, the method of manufacturing the composite type thin film magnetic head has been described.
The present invention can also be applied to the manufacture of a thin-film magnetic head dedicated to recording having an inductive magnetic transducer for writing and a thin-film magnetic head used for both recording and reproduction. Further, the present invention can also be applied to the manufacture of a thin film magnetic head having a structure in which the order of lamination of the element for writing and the element for reproduction is changed.

[0107]

As described above, according to the thin-film magnetic head of the present invention or the method of manufacturing a thin-film magnetic head of the present invention, the first magnetic pole is divided into the first magnetic pole layer and the first magnetic pole layer. So that it is formed on the pole layer of
An insulating layer made of an inorganic material can be embedded in the recess adjacent to the first magnetic pole. Therefore, the throat height is defined by the edge of the first magnetic pole opposite to the track surface, and the position and the profile of the edge are not changed as in the conventional photoresist film, and the throat height is accurately controlled. This has the effect that it becomes possible. Also, the second magnetic pole facing the first magnetic pole is divided from the second magnetic pole layer, and the second magnetic pole is formed to be longer from the track surface toward the back than the first magnetic pole. So the second
Magnetic poles can be reduced to submicron dimensions,
The contact area between the magnetic pole and the second magnetic layer is increased, the flow of magnetic flux becomes smooth, and in combination with the above-described accurate control of the slow height, a high-precision thin-film magnetic head can be realized.

If the thin film coil is buried in the concave portion adjacent to the first magnetic pole, the step of the apex portion can be reduced by that much. When the second magnetic layer is formed by photolithography, the difference in the thickness of the photoresist film between the upper and lower portions of the apex portion is reduced, and as a result, the submicron size of the second magnetic layer is reduced. It becomes possible. Therefore, high area density recording by the recording head becomes possible, and the performance of the recording head can be further improved by laminating the coil with two or three layers.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a manufacturing process of a thin-film magnetic head according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a step following the step shown in FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step shown in FIG. 2;

FIG. 4 is a cross-sectional view for explaining a step following the step shown in FIG. 3;

FIG. 5 is a cross-sectional view for explaining a step following the step shown in FIG. 4;

FIG. 6 is a cross-sectional view for explaining a step following the step shown in FIG. 5;

FIG. 7 is a cross-sectional view for explaining a step following the step shown in FIG. 6;

FIG. 8 is a plan view of the thin-film magnetic head manufactured according to the first embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating a configuration of a thin-film magnetic head according to a second embodiment of the invention.

FIGS. 10A and 10B are a cross-sectional view and a plan view illustrating a configuration of a thin-film magnetic head according to a third embodiment of the invention.

FIG. 11 is a cross-sectional view for explaining a manufacturing process of a conventional thin-film magnetic head.

FIG. 12 is a cross-sectional view for explaining a step following the step shown in FIG. 11;

FIG. 13 is a cross-sectional view for explaining a step following the step shown in FIG. 12;

FIG. 14 is a sectional view for illustrating a step following the step shown in FIG. 13;

FIG. 15 is a sectional view for illustrating a step following the step shown in FIG. 14;

FIG. 16 is a cross-sectional view for explaining a step following the step shown in FIG. 15;

[Explanation of symbols]

11: substrate, 18: upper shield / lower magnetic pole (lower magnetic pole layer) (first magnetic layer), 19a: lower magnetic pole tip (first magnetic layer)
, Recording gap layer, 23a top tip of the upper magnetic pole (second magnetic pole), 20a insulating layer (first insulating layer), 20b insulating layer (second insulating layer), 20c insulating Layer (third insulating layer), 20d ... insulating layer (other insulating layer),
21, 24: thin-film coil, 25: upper magnetic pole layer (second magnetic layer)

Claims (29)

[Claims] At least two magnetic layers, including a first magnetic pole and a second magnetic pole, which are magnetically coupled and a part of a side facing a recording medium faces through a recording gap layer, and a magnetic flux. What is claimed is: 1. A thin-film magnetic head having one or more thin-film coils for generating a first magnetic layer, said first magnetic layer being formed separately from said first magnetic layer, A first magnetic pole magnetically coupled to a partial region of the first magnetic layer, and a surface opposite to an adjacent surface of the first magnetic layer; From the opposite surface facing the recording medium, the first
An insulating layer continuously formed on one surface of the magnetic layer, the first magnetic pole facing the first magnetic pole via the recording gap layer, and the second magnetic layer facing away from the surface facing the recording medium. A second magnetic pole formed longer than the first magnetic pole; and a second magnetic pole formed separately from the second magnetic pole.
A second magnetic layer magnetically coupled to the second magnetic pole on at least a part of a surface of the magnetic pole opposite to a surface adjacent to the recording gap surface. . 2. The thin film magnetic head according to claim 1, wherein a length of the first magnetic pole from a surface facing the recording medium is equal to a throat height of the recording head. 3. The thin-film magnetic head according to claim 1, wherein the second magnetic pole is longer than the first magnetic pole by a thickness corresponding to the thickness of the second magnetic pole. 4. The thin film coil according to claim 1, wherein at least a part of the thin film coil is formed so that at least a part thereof in a thickness direction is located in a region where the insulating layer is formed. The thin-film magnetic head according to any one of the above items. 5. The insulating layer according to claim 1, wherein the insulating layer is formed from a first surface of the first magnetic layer, the surface being opposite to a surface facing the recording medium, the first magnetic layer being continuously formed along one surface of the first magnetic layer. The thin-film magnetic head according to claim 4, further comprising a layer and at least a second insulating layer formed between the windings of the thin-film coil. 6. The surface of the insulating layer opposite to the surface adjacent to the first magnetic layer is substantially flush with the surface of the first magnetic pole opposite to the surface adjacent to the recording gap layer. 4. The device according to claim 1, wherein
Item 7. The thin-film magnetic head according to item 1. 7. The thin film magnetic device according to claim 6, wherein a width of the first magnetic pole along a surface facing the recording medium is formed wider than a width of the second magnetic pole. head. 8. A first connection portion formed adjacent to the first magnetic layer, near an end of the second magnetic layer opposite to the side facing the recording medium, and This first
And a second connection portion formed adjacent to the second magnetic layer at a position facing the connection portion of the first and second connection portions, and the first connection portion and the second connection portion face each other. The thin-film magnetic head according to any one of claims 1 to 7, wherein the areas on the sides are different. 9. The thin-film magnetic head according to claim 8, wherein the area of the second connection is larger than that of the first connection. 10. An end of the second magnetic layer on a surface facing the recording medium is formed at a position recessed from a surface facing the recording medium.
10. The thin film magnetic head according to any one of claims 9 to 9. 11. The first insulating layer further includes the first insulating layer.
The thin-film magnetic head according to any one of claims 5 to 9, wherein the magnetic poles are formed along both side surfaces excluding an end surface on a side facing the recording medium. 12. The whole of the thin film coil in the thickness direction is:
The thin-film magnetic head according to any one of claims 5 to 10, wherein the thin-film magnetic head is formed in a region where the first insulating layer is formed. 13. The method according to claim 12, wherein the second insulating layer is formed so as to be substantially flush with a surface of the first magnetic pole adjacent to the recording gap layer. The thin-film magnetic head as described in the above. 14. The thin-film magnetic head according to claim 13, wherein one surface of the recording gap layer is formed so as to cover the second insulating layer. 15. The semiconductor device according to claim 15, wherein the third insulating layer comprises at least:
15. The thin-film magnetic head according to claim 14, wherein the second magnetic pole is formed continuously from a surface opposite to a side facing the recording medium to the other surface of the recording gap layer. 16. At least one of a first insulating layer and a second insulating layer, which is formed between the third insulating layer and the second magnetic layer so as to be covered with another insulating layer different from the first to third insulating layers. The thin-film magnetic head according to claim 15, comprising a layer of thin-film coils. 17. The third insulating layer and another insulating layer are formed so as to be substantially flush with a surface of the second magnetic pole opposite to a surface adjacent to the recording gap layer. 17. The thin film magnetic head according to claim 16, wherein: 18. The thin-film magnetic head according to claim 1, further comprising a read magnetoresistive element. 19. A first magnetic recording medium, wherein a part of a side opposed to a recording medium is opposed to a recording medium via a recording gap layer.
A method of manufacturing a thin-film magnetic head having at least two magnetic layers including a magnetic pole and a second magnetic pole, and one or more thin-film coils for generating magnetic flux, comprising: After forming, on the first magnetic layer,
Forming a first magnetic pole so as to be magnetically coupled to a partial region of the first magnetic layer; and forming the first magnetic pole from at least an opposite surface of a side of the first magnetic pole facing the recording medium. Continuously forming an insulating layer made of an inorganic material over one surface of the magnetic layer, and forming a recording gap layer on at least the first magnetic pole, and then recording the second magnetic pole on the recording medium. Forming a second magnetic layer from the surface facing the medium toward the back side longer than the first magnetic pole; and forming a second magnetic layer by magnetically coupling to the second magnetic pole. A method for manufacturing a thin film magnetic head. 20. The method according to claim 19, further comprising: forming the first magnetic pole and simultaneously adjoining the first magnetic layer at a position near an end of the second magnetic layer opposite to the side facing the recording medium. At the same time as forming the first connection portion and forming the second magnetic pole, and at the same time, at the position near the end of the second magnetic layer opposite to the side facing the recording medium, the second magnetic pole. 20. The method of manufacturing a thin-film magnetic head according to claim 19, wherein a second connecting portion having an area different from that of the first connecting portion is formed adjacent to the magnetic layer. 21. The method according to claim 19, further comprising the step of forming at least one thin-film coil such that at least a part thereof in a thickness direction is located in a region where the insulating layer is formed. 20. The method for manufacturing a thin-film magnetic head according to 20. 22. A step of continuously forming a first insulating layer along one surface of the first magnetic layer from a surface of the first magnetic pole opposite to a surface facing the recording medium; Forming a second insulating layer between the windings of the thin-film coil. 22. The method according to claim 21, further comprising the step of: 23. The surface of the second insulating layer opposite to the surface adjacent to the first magnetic layer is substantially flush with the surface of the first magnetic pole opposite to the surface adjacent to the recording gap layer. 23. The method of manufacturing a thin-film magnetic head according to claim 22, comprising a step of flattening so as to satisfy the following condition. 24. The apparatus according to claim 19, wherein a width of the first magnetic pole along a surface facing the recording medium is formed wider than that of the second magnetic pole. Of manufacturing a thin film magnetic head. 25. The whole of the thin film coil in the thickness direction is
25. The method of manufacturing a thin-film magnetic head according to claim 19, wherein the thin-film magnetic head is formed in a region where the first insulating layer is formed. 26. After planarizing the second insulating layer, forming a recording gap layer on the second insulating layer, and forming the second magnetic pole on the recording gap layer, Forming a third insulating layer on the recording gap layer, and then forming at least one thin-film coil on the third insulating layer on the recording gap layer; 26. The method according to claim 25, wherein the thin-film magnetic head is covered with another insulating layer different from the third insulating layer. 27. After the other insulating layer is formed of an inorganic material, the other insulating layer is planarized so that its surface forms the same plane as the surface of the second magnetic pole.
27. The method according to claim 26, wherein the second magnetic layer is formed on the second magnetic pole and another planarized insulating layer. 28. The method according to claim 28, wherein the second magnetic layer is formed on the second magnetic pole and the other insulating layer after the other insulating layer is selectively formed of an organic material. 28. The method for manufacturing a thin-film magnetic head according to 27. 29. The method of manufacturing a thin-film magnetic head according to claim 19, further comprising the step of forming a read magnetoresistive element.