JP2000073197A - Substrate plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To well execute an electrolytic plating treatment. SOLUTION: When a substrate W is placed on a hollow tube 10 by directing the treating surface Ws of this substrate W upward in the shrunk state of the hollow tube 10 by reducing the pressure of the hollow part in the hollow tube 10 disposed atop a base member 3, a first electrode 5 is moved from a retreat position to a contact position. When the hollow tube 10 is expanded by pressurizing the hollow part in the hollow tube 10, the substrate W placed on the hollow tube 10 is moved in a direction parting from the front surface of the base member 3 in accordance with the expansion of the hollow tube 10 and the first electrode 5 existing in the contact position above the treating surface Ws of the substrate W and the treating surface Ws of the substrate W are brought into contact. When the expansion of the hollow tube 10 is further increased, the treating surface Ws of the substrate W presses the first electrode 5 and the sure contact of the treating surface Ws of the substrate W with the first electrode 5 is attained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate plating apparatus for plating a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display, and more particularly to a plating apparatus for electrolytically plating a treated surface of a substrate. Related to forming technology.

[0002]

2. Description of the Related Art As a conventional substrate plating apparatus of this kind,
For example, Japanese Patent Publication No. Hei 7-107199 (Japanese Unexamined Patent Publication No. 4-288)
No. 97).

As shown in FIG. 11, the apparatus disclosed in this publication has an electrolytic plating solution supply pipe 1 having an on-off valve 100.
An upper cup 103 having a ceiling 01, an electrolytic plating solution return pipe 102, and the like on the ceiling, and a lower cup 104 on which the substrate W can be placed and moved up and down. The upper cup 103
An upper mesh electrode 105 and a contact pin electrode 106 abutting on the substrate W are provided on the inner side thereof.
It is configured so that power can be supplied between the terminals 5 and 106. The lower cup 104 has a spin chuck 107 at the center.
And a drain pipe 110 having an on-off valve 109 are provided. Further, the lower cup 104
A drain cover 112 having a cleaning liquid drain pipe 111 is provided below the cleaning cup, and a cleaning liquid nozzle 113 is also provided beside the upper cup 103.

[0004] The electroplating process by this apparatus is performed as follows. First, the lower cup 104 is placed in a state where the substrate W is placed on the lower cup 104 so as to close the hole 108.
Is raised, the lower end of the upper cup 103 is tightly sealed to the bottom wall 114 of the lower cup 104, and the contact pin electrode 106 is brought into contact T with the processing surface Ws of the substrate W. Next, an electrolytic plating solution is supplied from the electrolytic plating solution supply pipe 101, and power is supplied between the electrodes 105 and 106 to perform an electrolytic plating process on the processing surface Ws of the substrate W.

[0005]

However, the prior art having such a structure has the following problems. By rotating the substrate W during the electrolytic plating process,
The electrolytic plating solution can be uniformly supplied to the processing surface Ws of the substrate W, and the variation of the current density can be reduced. As a result, a uniform plating layer can be formed on the processing surface Ws. However, in the configuration of the conventional apparatus, the substrate W is rotated during the electrolytic plating because the contact pin electrode 106 provided on the upper cup 103 is in contact with the processing surface Ws of the substrate W to perform the electrolytic plating. Can not. Therefore, despite the fact that this conventional apparatus has the spin chuck 107 for holding and rotating the substrate W, the substrate W
Has a structural problem that it cannot be rotated.

Further, in the configuration of the conventional apparatus, the lower cup 1
The configuration is such that the close contact seal S between the bottom wall 114 of the substrate 04 and the lower end of the upper cup 103 and the contact T between the contact pin electrode 106 and the processing surface Ws of the substrate W are simultaneously performed. Therefore, there is a problem that any one of the defect of the seal S and the defect of the contact T of the electrode is likely to occur. In particular, the bottom wall 114 of the lower cup 104 and the upper cup 103
If the contact T between the contact pin electrode 106 and the processing surface Ws of the substrate W is insufficient due to too much emphasis on the seal S with the lower end of the substrate W, and the contact T of the electrode is defective, the processing surface Ws
This leads to inconveniences such as a non-uniform plating layer to be formed on the substrate, and an inability to form a plating layer on the processing surface Ws.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate plating apparatus which can solve the above-mentioned inconvenience and can perform favorable electrolytic plating.

[0008]

The present invention has the following configuration in order to achieve the above object. In other words, the invention according to claim 1 is a substrate plating apparatus for performing plating on a substrate, wherein a base member, rotating means for rotating the base member, and an upper surface of the base member are provided. An expansion / contraction member for changing the height position of a substrate placed by contraction / expansion, expansion / contraction means for expanding / contracting the expansion / contraction member, and mounting the substrate on the contracted expansion / contraction member with the processing surface of the substrate facing upward. The first electrode provided on the base member and the expanded and contracted member mounted on the base member so as to be movable between a contact position above the processing surface of the placed substrate and a retracted position deviated from above the processing surface. An electrolytic plating solution supply means for supplying an electrolytic plating solution to the processing surface of the substrate in contact with the processing surface and the first electrode at the contact position; Of the substrate in contact with the processing surface and the first electrode A second electrode disposed opposite to the bedding plane, is characterized in that and a feeding means for feeding such current flows toward the second electrode to the first electrode.

According to a second aspect of the present invention, in the substrate plating apparatus according to the first aspect, the expansion / contraction member is constituted by a hollow tube formed in a ring shape in plan view, and the expansion / contraction means includes: The hollow tube is expanded / contracted by pressurizing / depressurizing a hollow portion in the hollow tube.

According to a third aspect of the present invention, there is provided a substrate plating apparatus for performing a plating process on a substrate, comprising: a base member; rotating means for rotating the base member; and an upper surface of the base member. A deforming member that changes the height position of the substrate placed by the deformation and its restoration, and a direction in which the processing surface of the substrate faces upward and the substrate placed on the deforming member approaches the upper surface of the base member. Between the deformation applying means for deforming the deformable member and the contact position above the processing surface of the substrate placed on the deformation member deformed by the deformation applying means and the retracted position deviated from above the processing surface. An electrolytic plating solution is movably supplied to the first electrode provided on the base member and the processing surface of the substrate placed on the deformable member and contacting the processing surface and the first electrode at the contact position. Electrolytic plating solution supply means A second electrode placed on the deformable member and arranged at a contact position so as to face a processing surface of the substrate where the processing surface and the first electrode are in contact with each other; and from the second electrode to the first electrode. Power supply means for supplying power so that a current flows toward the power supply.

According to a fourth aspect of the present invention, in the substrate plating apparatus according to the third aspect, the deformable member is formed of a V-shaped packing formed in a ring shape in a plan view, and the deformation imparting means includes: By lowering the space surrounded by the lower surface of the substrate mounted on the V packing, the inner peripheral surface of the V packing, and the upper surface of the base member, the substrate is moved in a direction to approach the upper surface of the base member. It is characterized in that the V packing is deformed.

According to a fifth aspect of the present invention, in the substrate plating apparatus according to the third or fourth aspect, a force acting on the substrate mounted on the deformable member in a direction to separate the substrate from the upper surface of the base member. And a separating force applying means for applying the force.

[0013]

The operation of the first aspect of the invention is as follows. When the expansion / contraction member provided on the upper surface of the base member is contracted by the expansion / contraction means, the processing surface of the substrate faces upward, and when the substrate is placed on the contracted expansion / contraction member,
The first electrode is moved from the retracted position to the contact position. When the expansion / contraction member is expanded by the expansion / contraction means, the substrate mounted on the expansion / contraction member is moved in a direction away from the upper surface of the base member with the expansion of the expansion / contraction member, and the processing surface of the substrate is removed. The first electrode located at the upper contact position is brought into contact with the processing surface of the substrate placed on the expansion / contraction member. When the expansion of the expansion member is further increased, the processing surface of the substrate presses the first electrode, and the contact between the processing surface of the substrate and the first electrode is ensured.

The expansion / contraction member and the first electrode are provided on the base member. Therefore, when the base member is rotated by the rotating means, the substrate, the expansion / contraction member, and the first electrode can be rotated together with the base member while the processing surface of the substrate is in contact with the first electrode.

In the electrolytic plating process, the electrolytic plating solution is supplied from the electrolytic plating solution supply means to the processing surface of the substrate while the substrate is rotated together with the base member, and the electrolytic plating solution is arranged to face the processing surface of the substrate by the power supply means. This is performed by supplying power so that a current flows from the second electrode to the first electrode.

When the electrolytic plating process is completed, the expansion / contraction member is contracted by the expansion / contraction means, and accordingly, the substrate placed on the expansion / contraction member is moved in a direction approaching the upper surface of the base member. The processing surface and the first electrode are separated from each other and become non-contact. When the processing surface of the substrate and the first electrode come out of contact, the first electrode is moved from the contact position to the retracted position. Thereby, the processed substrate placed on the expansion / contraction member can be taken out without receiving the interference of the first electrode.

According to the second aspect of the present invention, the expansion / contraction means expands the hollow tube by pressurizing / depressurizing the hollow portion inside the hollow tube which is a ring-shaped expansion / contraction member in plan view. / Shrink.

The operation of the invention described in claim 3 is as follows. In a state where the deformable member provided on the upper surface of the base member is deformed by the deformation applying means in a direction in which the placed substrate is brought closer to the upper surface of the base member, the deformable member is turned upward with the processing surface of the substrate facing upward. When the substrate is placed on the
The electrode is moved from the retracted position to the contact position. When the deformation of the deformation member by the deformation applying means is released, the substrate placed on the deformation member is moved in a direction away from the upper surface of the base member as the deformation member is restored, and the processing surface of the substrate is removed. The first electrode located at the contact position above the substrate contacts the processing surface of the substrate placed on the deformable member. By designing the restoring force of the deformable member to be sufficiently large, the processing surface of the substrate can be pressed against the first electrode, and the contact between the processing surface of the substrate and the first electrode can be ensured.

Since the deformable member and the first electrode are provided on the base member, when the base member is rotated by the rotating means, the base member and the substrate are kept in contact with the processing surface of the substrate and the first electrode. Then, the deformable member and the first electrode are rotated.

In the electrolytic plating process, the electrolytic plating solution is supplied from the electrolytic plating solution supply means to the processing surface of the substrate while the substrate is rotated together with the base member, and the electrolytic plating solution is arranged to face the processing surface of the substrate by the power supply means. This is performed by supplying power so that a current flows from the second electrode to the first electrode.

When the electrolytic plating process is completed, the deforming member is deformed by the deforming means, and the substrate mounted on the deforming member is moved in a direction approaching the upper surface of the base member. And the first electrode are separated from each other and become non-contact. When the processing surface of the substrate and the first electrode come out of contact, the first electrode is moved from the contact position to the retracted position. Thus, the processed substrate placed on the deformable member can be taken out without receiving the interference of the first electrode.

According to the fourth aspect of the present invention, the deformation applying means includes a lower surface of the substrate mounted on the V-packing, which is a deformation member formed in a ring shape in plan view, and an inner peripheral surface of the V-packing. And the space surrounded by the upper surface of the base member is reduced in pressure, so that V
Deform packing.

According to the fifth aspect of the present invention, in a state where the processing surface of the substrate and the first electrode are in contact with each other, the substrate placed on the deformable member by the separating force applying means is placed on the substrate from the upper surface of the base member. By applying a force acting in the direction to separate,
Pressing of the processing surface of the substrate to the first electrode can be strengthened, and contact between the processing surface of the substrate and the first electrode becomes more reliable.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing the overall configuration of a substrate plating apparatus according to a first embodiment of the present invention.
FIG. 4 is a plan view of a base member.

A base member 3 is integrally rotatably connected to an upper end of a rotating shaft 2 which is linked to an electric motor 1 as a rotating means and is rotatable around a vertical axis J. The rotating shaft 2 and the base member 3 are formed of an insulating material.

A plurality of (four in the figure) first electrode members 4 are provided on the outer peripheral portion of the upper surface of the base member 1 so as to be rotatable around a vertical axis P. Each first electrode member 4 has an eaves portion 4a formed on an upper portion, and a first electrode 5 is provided on a lower surface side of the eaves portion 4a. By rotating each electrode member 4 about the axis P, the first electrode 5 is brought into contact with the contact position indicated by the solid line (dotted line in FIG. 2) above the processing surface Ws of the substrate W and the substrate W
Is configured to be movable between a retreat position indicated by a two-dot chain line in FIG.

The rotation of each first electrode member 4 around the axis P is
For example, the synchronization is performed by a well-known link mechanism and a link drive mechanism (neither is shown).

Each first electrode 5 is connected to a rotating shaft 2 via a conductive wire 6.
Are electrically connected to a ring-shaped terminal portion 7 provided at the terminal. The terminal unit 7 is configured to be supplied with power from a power supply brush 9 connected to a power supply unit 8.

On the upper surface of the base member 3, a hollow tube 10 is provided inside each of the first electrode members 4 as an expanding / contracting member formed in a ring (donut) shape in plan view.

The hollow portion 10 a in the hollow tube 10 is connected through a pipe 11 to a suction pressure path 12 provided in the rotating shaft 2 and the base member 3. Suction pressurization path 12
Is connected to the pipe 14 even during the rotation of the rotary shaft 2 via the well-known rotary seal mechanism 13. Piping 1
4 is connected to a vacuum suction source 17 and a gas supply source 18 via on-off valves 15 and 16. By opening the on-off valve 15 and closing the on-off valve 16, the hollow portion 10 a in the hollow tube 10 can be depressurized to contract the hollow tube 10. Further, in a state where the hollow tube 10 is contracted,
By closing the on-off valve 15 and opening the on-off valve 16, the hollow portion 10 a in the hollow tube 10 that has been depressurized can be pressurized and the contracted hollow tube 10 can be expanded. The vacuum suction source 17 and the gas supply source 18 constitute the expansion / contraction means in the first aspect of the present invention.

A collection member 20 is arranged around the base member 3. The electrolytic plating solution and the cleaning liquid after being used for the processing and supplied to the substrate W and scattered from the outer peripheral portion of the substrate W to the periphery are received by the recovery member 20 and recovered.

The recovery member 20 is connected to an electrolytic plating solution recovery pipe 22 provided with an on-off valve 21 and a cleaning liquid recovery pipe 24 provided with an on-off valve 23. On-off valve 21, 2
By controlling the opening and closing of 3, the electrolytic plating solution and the cleaning solution collected by the collection member 20 and used after the process can be separated and collected. The collected washing liquid is discarded. The recovered electrolytic plating solution may be discarded, or may be returned to the electrolytic plating solution supply system 25 for reuse.

The recovery member 20 is configured to be able to move up and down by a lift mechanism (not shown) composed of a well-known uniaxial drive mechanism such as a ball screw.

Above the base member 3, there is provided a processing space forming mechanism 26 for forming a processing space for filling the liquid supplied to the processing surface Ws of the substrate W.

The processing space forming mechanism 26 has a lower end of a support shaft 27 suspended by a support arm (not shown) which can be moved up and down by a lifting mechanism (not shown) constituted by a well-known uniaxial driving mechanism such as a ball screw. A plate-like member 28 having substantially the same size as the substrate W is supported by the portion, and the plate-like member 28 is configured to be able to contact and separate from the processing surface Ws of the substrate W.

A liquid supply passage 29 is provided inside the support shaft 27 and the plate-like member 28. The electrolytic plating solution supply system 2 is provided in the solution supply path 29 by opening and closing control of the on-off valves 30 and 31.
5. The electrolytic plating liquid and the cleaning liquid from the cleaning liquid supply system 32 are selectively switched and supplied via the pipe 33. Then, the respective liquids are selectively supplied to the central portion (near the center of rotation) of the processing surface Ws of the substrate W from the liquid supply port 34 at the tip of the liquid supply path 29 on the plate member 28 side. The electrolytic plating solution supply system 25, the pipe 33, and the liquid supply path 29 constitute an electrolytic plating solution supply unit in the present invention.

The support shaft 27 and the plate-like member 28 are formed of an insulating material. On the lower surface of the plate-like member 28, a plate-like or mesh-like second surface having substantially the same area as the processing surface Ws of the substrate W is provided.
An electrode 35 is provided. The second electrode 35 includes a conductor 36
And is electrically connected to the power supply unit 8 via the.

The power supply unit 8 supplies power so that the power supply brush 9 is on the negative electrode side and the conductive wire 36 is on the positive electrode side. Therefore,
When performing electrolytic plating, the processing surface Ws of the substrate W becomes a negative electrode through the power supply brush 9, the terminal portion 7, the conductive wire 6, and the first electrode 5, and the second electrode 35 becomes a positive electrode through the conductive wire 36. Become. The power supply unit 8, the power supply brush 9, the terminal portion 7, and the conductive wires 6, 36 constitute a power supply unit in the present invention.

The apparatus of the first embodiment having the above configuration operates as follows under the control of a controller (not shown). This will be described with reference to FIGS.

The initial state is the state shown in FIG. That is, the open / close valves 15 and 16 are closed in a state where the hollow tube 10 is contracted, and the open / close valves 21 and 23,
30 and 31 are also closed. The plate-like member 28 is separated from the upper surface of the base member 3 and is waiting above. Further, the collecting member 20 is lowered so that the base member 3 is disposed above the collecting member 20. Further, the first electrode 5 is located at the retracted position.

In the initial state, the substrate W is placed on the hollow tube 10 on the upper surface of the base member 3 with the processing surface Ws facing upward by a substrate transport mechanism (not shown) (FIG. 3).
(B)). At this time, the plate member 28 waits upward,
Since the recovery member 20 is lowered and the first electrode 5 is located at the retracted position, the substrate transport mechanism performs the operation of the plate-like member 28, the recovery member 20, and the first electrode 5 (the eaves portion 4a of the first electrode member 4). The substrate W can be placed on the hollow tube 10 without interfering with the above.

When the substrate W is mounted on the hollow tube 10, each first electrode member 4 is rotated around the axis P to move each first electrode 5 from the retracted position to the contact position (FIG. 3).
(C)). When each first electrode 5 is moved from the retracted position to the contact position, the movement of the first electrode 5 is not hindered by the substrate W, and the first electrode 5 does not rub the processing surface Ws of the substrate W. In order to achieve this, the height position of the processing surface Ws of the substrate W placed on the contracted hollow tube 10 is set lower than the lower surface of the first electrode 5 as shown in FIG. That is, the hollow tube 10 is contracted to such an extent that the substrate W can be placed at such a height position.

When each first electrode 5 is located at the contact position,
The on-off valve 16 is opened and the hollow portion 1 in the hollow tube 10 is opened.
0a is expanded to expand the hollow tube 10 (FIG. 3).
(D)). As a result, the substrate W placed on the hollow tube 10 is moved in a direction away from the upper surface of the base member 3, and the first electrode 5 located at the contact position is brought into contact with the processing surface Ws of the substrate W. . When the expansion of the hollow tube 10 is further increased, the processing surface Ws of the substrate W presses the first electrode 5 to ensure the contact between the processing surface Ws of the substrate W and the first electrode 5, and the substrate W Is the hollow tube 1
0 and each of the first electrodes 5.

When the hollow tube 10 is expanded to such an extent that the processing surface Ws of the substrate W presses the first electrode 5, the on-off valve 16 is closed.

In this state, the plate-like member 28 is lowered to dispose the second electrode 35 close to the processing surface Ws of the substrate W, and the collecting member 20 is raised to dispose the collecting member 20 around the substrate W. Then, the following processes are performed in the state shown in FIG.

The distance between the lower surface of the plate member 28 and the processing surface Ws of the substrate W at this time depends on the reason that the processing can be performed with a reduced amount of liquid and that the liquid tightness of the liquid can be easily maintained. Is preferably set to be narrower, and the specific value is
For example, it is about 0.5 to 5 mm.

First, the on-off valve 23 is opened, and the electric motor 1 is driven at a low speed of, for example, about several tens of rpm, so that the substrate W, the hollow tube 10 and the first electrode 5 (first The electrode member 4) is rotated around the axis J. Then, the opening / closing valve 31 is opened and a cleaning liquid is supplied from the supply port 34 to the processing surface Ws of the substrate W to perform a pre-cleaning process.

When a predetermined cleaning time has elapsed, the on-off valve 2
3, 31 are closed and the on-off valve 21 is opened. Then, while the substrate W is being rotated, the opening / closing valve 30 is opened to supply the electrolytic plating solution from the supply port 34 to the processing surface Ws of the substrate W, and the gap between the first electrode 5 and the second electrode 35. And a plating layer having a predetermined thickness is formed on the processing surface Ws of the substrate W by electrolytic plating.

By performing the electrolytic plating while rotating the substrate W in this manner, the electrolytic plating solution supplied from the supply port 34 flows from the central portion to the peripheral portion by centrifugal force, and the processing of the substrate W is performed without flow unevenness. The electrolytic plating solution can be spread on the surface Ws. In the present embodiment, the second electrode 35
Are arranged so as to face the processing surface Ws of the substrate W and have substantially the same size (area) as the processing surface Ws, so that the distance from the second electrode 35 to the processing surface Ws of the substrate W is reduced. And the current density can be made substantially uniform over the entire processing surface Ws of the substrate W. However, by further rotating the substrate W, the processing surface W
Even if there is a variation in the current density within s, the effect can be suppressed. Therefore, a plating layer having a predetermined thickness can be uniformly formed on the processing surface Ws of the substrate W.

A predetermined electrolytic plating time (approximately 5,
After about 6 minutes), the on-off valves 21 and 30 are closed,
The on-off valve 23 is opened. Then, while the substrate W is being rotated, the on-off valve 31 is opened and the substrate W is supplied from the supply port 34.
The cleaning liquid is supplied to the processing surface Ws to perform the post-cleaning processing.

When a predetermined cleaning time has elapsed, the on-off valve 31
Is closed, the supply of the cleaning liquid is stopped, and the electric motor 1 is rotated at a high speed so as to shake off the cleaning liquid remaining on the substrate W to dry the substrate W.

When a predetermined drying time has elapsed, the rotation of the electric motor 1 is stopped, and the on-off valve 23 is closed. Further, the plate-like member 28 is raised to wait above, and the collecting member 20 is lowered so that the base member 3 is disposed above the collecting member 20.

In this state, the on-off valve 15 is opened and the pressure in the hollow portion 10a in the hollow tube 10 is reduced.
0 is contracted to the same extent as the initial state,
Is closed (FIG. 3C).

Then, each first electrode member 4 is rotated around the axis P to move each first electrode 5 from the contact position to the retracted position (FIG. 3B). As described above, the processing surface W of the substrate W mounted on the contracted hollow tube 10 is used.
Since the height position of s is set lower than the lower surface of the first electrode 5, the first electrode 5 moves the processing surface Ws of the substrate W when moving each first electrode 5 from the contact position to the retreat position. No rubbing.

When each first electrode 5 is moved to the retracted position,
The processed substrate W is taken out from the processing chamber by the substrate transport mechanism (not shown), and returns to the above-described initial state (FIG. 3A).

As described above, according to the apparatus of the first embodiment, the hollow tube 10 for making contact / non-contact between the first electrode 5 and the processing surface Ws of the substrate W, and the first electrode 5 (the first electrode 5) Since the member 4) is provided on the base member 3, the base member 3, the substrate W, the hollow tube, and the processing surface Ws of the substrate W are brought into contact with the first electrode 5 by rotating the base member 3. 10 and the first electrode 5 (the first electrode member 4) can be rotated, and the electrolytic plating process can be performed while rotating the substrate W in contact with the first electrode W. Therefore, a uniform plating layer can be formed on the processing surface Ws of the substrate W. In addition, the processing surface Ws of the substrate W can be brought into contact with the first electrode 5 by pressing the processing surface Ws of the substrate W against the first electrode 5 by the expansion of the hollow tube 10. Contact with one electrode 5 can be reliably performed, and poor contact of the electrode can be reliably prevented.

Next, the structure of the second embodiment of the present invention will be described with reference to FIG. FIG. 4A is a longitudinal sectional view showing a configuration of a main part of the second embodiment of the present invention, and FIG.
FIG. 4 is a plan view of a base member.

In the first embodiment, the expansion / contraction member is constituted by one hollow tube 10 formed in a ring shape in plan view. In the second embodiment, each of the first electrodes positioned at the contact position is formed. The expansion and contraction members 40 for independently expanding and contracting are provided below each of the members 5. Each of the expansion / contraction members 40 is connected to the suction / pressurizing path 12 via a pipe 41, and opens and closes the on-off valve 15 and closes the on-off valve 16, thereby opening the hollow portion 40a in each of the expansion / contraction members 40. By reducing the pressure, each expansion / contraction member 40 can be contracted. In addition, by closing the on-off valve 15 and opening the on-off valve 16 in a state where each of the expansion and contraction members 40 is contracted, the hollow portion 40a in each of the decompression and expansion members 40 is pressurized and contracted. Each expanding / contracting member 40 that has been set can be expanded.

The other constructions and operations are the same as those of the first embodiment, and a detailed description thereof will be omitted. Although FIG. 4 shows the spherical expansion / contraction members 40, each expansion / contraction member 40 may be formed in a shape other than a spherical shape.

As described above, even when a plurality of expansion / contraction members 40 are provided, the electrolytic plating can be performed while rotating the substrate W, and the processing surface Ws of the substrate W and the first electrode 5 Can be reliably performed.

Next, the configuration of a device according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a longitudinal sectional view showing the entire configuration of the third embodiment of the present invention, and FIG. 6 is a plan view of a base member.

In the third embodiment, instead of the hollow tube 10 of the first embodiment, a V-packing 50 as a deformable member formed in a ring shape in plan view is provided on the upper surface of the base member 3. I have. Further, the piping 11 is omitted, and the lower surface of the substrate W placed on the V packing 50 and the inner peripheral surface of the V packing 50
The space 51 surrounded by the upper surface of the base member 3 is decompressed to deform the V-packing 50 in a direction in which the substrate W approaches the upper surface of the base member 3, or the space 51 is pressurized and placed on the V-packing 50. The substrate W is configured so as to be able to apply a force acting in a direction away from the upper surface of the base member 3.

Since other structures are the same as those of the first embodiment, common parts are denoted by the same reference numerals as in FIGS. 1 and 2, and the description thereof is omitted.

In the third embodiment, the vacuum suction source 1
7 constitutes the deformation applying means in the invention of claim 3, and the gas supply source 18 constitutes the separating force applying means in the invention of claim 5.

Next, the operation of the apparatus according to the third embodiment having the above configuration will be described with reference to FIGS. 5, 7, and 8. FIG.

The initial state of the device of the third embodiment is shown in FIG.
As shown in (a), the on-off valves 15 and 16 are closed, and the V packing 50 is restored to a natural state. Further, the on-off valves 21, 23, 30, 31 are also closed.
Further, the plate-like member 28 is separated from the upper surface of the base member 3 and waits upward, and the collecting member 20 is lowered so that the base member 3 is disposed above the collecting member 20.
Further, the first electrode 5 is located at the retracted position.

In the initial state, the substrate W is placed on the V packing 50 on the upper surface of the base member 3 with the processing surface Ws facing upward by a substrate transport mechanism (not shown) (FIG. 7).
(B)). At this time, the plate member 28 waits upward,
Since the recovery member 20 is lowered and the first electrode 5 is located at the retracted position, the substrate transport mechanism performs the operation of the plate-like member 28, the recovery member 20, and the first electrode 5 (the eaves portion 4a of the first electrode member 4). The substrate W can be placed on the V packing 50 without interfering with the above.

In a state where the substrate W is placed on the V packing 50, the height position of the processing surface Ws of the substrate W is
The height of the V-packing 50 is determined so as to be higher than the lower surface of the V-packing.

When the substrate W is placed on the V packing 50,
The on-off valve 15 is opened, the lower surface of the substrate W placed on the V packing 50, the inner peripheral surface of the V packing 50, and the base member 3
The space 51 enclosed by the upper surface of the base member 3 is decompressed to deform the V packing 50 in a direction in which the substrate W approaches the upper surface of the base member 3, and the on-off valve 15 is closed (FIG. 7C).

Then, each first electrode member 4 is rotated around the axis P to move each first electrode 5 from the retracted position to the contact position (FIG. 8A). When moving each first electrode 5 from the retracted position to the contact position, the first electrode 5
In order to prevent the movement of the electrode 5 from being hindered or the first electrode 5 from rubbing against the processing surface Ws of the substrate W, the height position of the processing surface Ws of the substrate W close to the upper surface of the base member 3 However, as shown in FIGS. 7C and 8A, the V packing 50 is deformed so as to be lower than the lower surface of the first electrode 5.

When each first electrode 5 is located at the contact position,
The on-off valve 16 is opened to pressurize the space 51 (FIG. 8).
(B)). Thereby, the substrate W placed on the V-packing 50 is moved in a direction away from the upper surface of the base member 3, and the first electrode 5 located at the contact position is brought into contact with the processing surface Ws of the substrate W. . Further, a force acting in a direction away from the upper surface of the base member 3 is applied to the substrate W by the gas supplied to the space 51, and this force causes the substrate W
The processing surface Ws of the substrate W presses the first electrode 5 and the processing surface W of the substrate W
The contact between the s and the first electrode 5 can be ensured, and the substrate W can be pressed and held by each first electrode 5.

As shown in FIG. 7B, with the substrate W placed on the V packing 50, the processing surface W
Since the height of the V-packing 50 is determined so that the height position of s is higher than the lower surface of the first electrode 5, FIG.
In the state (b), the lower surface of the substrate W and the upper surface of the V-packing 50 are kept in close contact with each other, and the gas supplied to the space 51 does not leak from the space 51, and the space 51 is pressurized. A force acting in a direction away from the upper surface of the base member 3 can be applied to the substrate W. The on-off valve 16 is also opened during the cleaning process and the electrolytic plating process.

In this state, the plate-like member 28 is lowered to dispose the second electrode 35 close to the processing surface Ws of the substrate W, and the collecting member 20 is raised to dispose the collecting member 20 around the substrate W. Then, in the state shown in FIG. 5, the pre-cleaning process, the electrolytic plating process, the post-cleaning process, and the drying process are performed in the same operation as in the first embodiment.

When the rotation of the electric motor 1 is stopped and the on-off valve 23 is closed after the drying process, the plate-like member 28 is raised to stand by above and the base member 3 is placed above the collecting member 20. The collection member 20 is lowered so as to be arranged.

In this state, only the on-off valve 15 is opened, the pressure in the space 51 is reduced, and the V-packing 50 is deformed to close the on-off valve 15 (FIG. 8A).

Then, each first electrode member 4 is rotated around the axis P to move each first electrode 5 from the contact position to the retracted position (FIG. 7C). As described above, the processing surface Ws of the substrate W placed on the deformed V packing 50
Is set lower than the lower surface of the first electrode 5, the first electrode 5 moves the processing surface Ws of the substrate W when moving each first electrode 5 from the contact position to the retracted position. There is no slap.

When each first electrode 5 is moved to the retracted position,
The open / close valve 16 is opened to pressurize the space 51 to such an extent that the space 51 becomes normal pressure (FIG. 7B), and the processed substrate W is taken out by the substrate transfer mechanism (not shown) and carried out of the processing chamber. Then, the process returns to the initial state described above (FIG. 7A).

As described above, according to the third embodiment, the V-packing 50 for making the first electrode 5 contact / non-contact with the processing surface Ws of the substrate W, and the first electrode 5 3
By rotating the base member 3, the base member 3, the substrate W, the V packing 50, and the first electrode 5 are brought into contact with the processing surface Ws of the substrate W and the first electrode 5 in contact with each other.
The (first electrode member 4) can be rotated, and the electrolytic plating can be performed while rotating the substrate W in contact with the first electrode 5. Therefore, a uniform plating layer can be formed on the processing surface Ws of the substrate W. Further, since the space 51 is pressurized to apply a force acting in a direction of separating the substrate W placed on the V-packing 50 from the upper surface of the base member 3, the processing surface Ws of the substrate W The pressure on the first electrode 5 can be enhanced, and the processing surface W of the substrate W
s and the first electrode 5 can be more reliably contacted, and the poor contact of the electrode can be more reliably prevented.

In the third embodiment, the space 51 is pressurized to positively apply a force acting on the substrate W mounted on the V-packing 50 in a direction of separating the substrate W from the upper surface of the base member 3. However, when the processing surface Ws of the substrate W presses the first electrode 5 by restoring the V packing 50, the contact between the processing surface Ws of the substrate W and the first electrode 5 can be reliably performed. May omit the configuration for pressurizing the space 51 (the gas supply source 18). That is, the opening of the atmosphere is communicated to the pipe 14 via the on-off valve 16, the on-off valve 15 is closed and the on-off valve 16 is opened in the state of FIG.
Is returned to normal pressure, the deformed V packing 50 is restored, and by the restoration of the V packing 50, the processing surface Ws of the substrate W is pressed against the first electrode 5 so that the processing surface Ws of the substrate W and the first electrode 5 May be configured to contact with.

Next, the configuration of the fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a longitudinal sectional view showing the overall configuration of the fourth embodiment of the present invention.

In the apparatus of the first to third embodiments, the plate-like member 28 provided with the second electrode 35 and the liquid supply port 34 on the lower surface.
Is arranged close to the processing surface Ws of the substrate W to perform the electroplating process. This fourth embodiment is an embodiment in which the present invention is applied to a conventional device as a basic configuration.

That is, the rotating shaft 2 is erected in the fixed lower cup 70 so as to be rotatable in a sealed state, and the base member 3
Are arranged above the lower cup 70. The upper cup 71 can be moved up and down with respect to the lower cup 70. A second electrode 72 in the form of a mesh is provided in the upper cup 71, and power is supplied from the power supply unit 8 to the positive electrode side.

The side wall 73 of the lower cup 70 is configured to cover the periphery of the base member 3 and the substrate W, etc., and is scattered from the outer peripheral portion of the substrate W to the periphery during the cleaning processing, and the cleaning liquid after the processing is used. And can be collected. The bottom wall 74 of the lower cup 70 has an on-off valve 7
5 is provided, and a cleaning solution or an electrolytic plating solution used for processing is discharged from the drain tube 76.

On the ceiling of the upper cup 71, an electrolytic plating solution supply pipe 78 having an on-off valve 77, an electrolytic plating solution return pipe 79, and the like are provided as in the conventional apparatus. A cleaning liquid nozzle 80 is also provided on the side of the upper cup 71.

Since other structures are the same as those of the first embodiment, common parts are denoted by the same reference numerals as those in FIG. 1 and their description is omitted.

The operation of the fourth embodiment is as follows. That is, with the upper cup 71 raised,
The processing surface Ws of the substrate W is brought into contact with the first electrode 5 in the same manner as in the first embodiment. The pre-cleaning process is performed by supplying the cleaning liquid from the cleaning liquid nozzle 80 to the processing surface Ws of the substrate W while rotating the base member 3 and the substrate W around the axis J. Next, the upper cup 71 is lowered and the lower cup 7
The bottom wall 74 of the substrate W and the lower end of the upper cup 71 are tightly sealed to supply an electrolytic plating solution from an electrolytic plating solution supply pipe 78, and also to supply power between the electrodes 5 and 72 to electrolyze the processing surface Ws of the substrate W. Perform plating. And the upper cup 71
Is raised and the processing surface W of the substrate W is
After the cleaning liquid is supplied to the substrate W to perform the post-cleaning process, the substrate W is rotated at a high speed to perform the drying process.

The present invention can be similarly applied to an apparatus having such a configuration. Note that in FIG.
In the configuration of the embodiment, the case where the processing surface Ws of the substrate W is brought into contact with the first electrode 5 is shown. However, in the configurations of the second and third embodiments, the processing surface Ws of the substrate W and the first electrode 5 are connected. May be configured to contact with.

In each of the above embodiments, the first electrode member 4
Is rotated around the axis P to move the first electrode 5 between the contact position and the retracted position. For example, as shown in FIG. 10, the first electrode member 4 is horizontally movable. By configuring, the first electrode 5 may be moved between the contact position and the retracted position.

[0089]

As is clear from the above description, according to the first aspect of the present invention, the expansion / contraction member for making contact / non-contact between the first electrode and the processing surface of the substrate, Is provided on the base member. By rotating the base member, the base member, the substrate, the expansion / contraction member, and the first electrode can be rotated in a state where the processing surface of the substrate is in contact with the first electrode. The electrolytic plating can be performed while rotating the substrate in contact with the first electrode. Therefore, a uniform plating layer can be formed on the processing surface of the substrate. Further, the processing surface of the substrate is pressed against the first electrode by the expansion of the expansion / contraction member, and the processing surface of the substrate and the first electrode can be brought into contact with each other. This can reliably prevent poor contact of the electrodes.

According to the second aspect of the present invention, the expansion / contraction member is formed of a hollow tube formed in a ring shape in plan view, and the hollow tube is expanded by pressurizing / depressurizing the hollow portion in the hollow tube. / Contraction,
The device according to claim 1 can be realized with a simple configuration.

According to the third aspect of the present invention, since the deformable member for bringing the first electrode into and out of contact with the processing surface of the substrate and the first electrode are provided on the base member, the base member is rotated. By doing so, it is possible to rotate the base member, the substrate, the deformable member and the first electrode in a state where the processing surface of the substrate and the first electrode are in contact with each other, and while rotating the substrate contacted with the first electrode. An electrolytic plating process can be performed. Therefore, a uniform plating layer can be formed on the processing surface of the substrate. In addition, the processing surface of the substrate is changed to the first by restoring the deformable member.
The processing surface of the substrate can be brought into contact with the first electrode by pressing against the electrode, so that the processing surface of the substrate and the first electrode can be reliably contacted, and the contact failure of the electrode can be reliably prevented. Can be.

According to the fourth aspect of the present invention, the deformable member is constituted by a V-shaped packing formed in a ring shape in plan view,
By reducing the pressure in a space surrounded by the lower surface of the substrate placed on the V packing, the inner peripheral surface of the V packing, and the upper surface of the base member, V
Since the packing is deformed, the device according to claim 3 can be realized with a simple structure.

According to the fifth aspect of the present invention, a separation force applying means for applying a force acting in a direction to separate the substrate placed on the deformable member from the upper surface of the base member is further provided. Of the processing surface of the substrate to the first electrode can be strengthened, the contact between the processing surface of the substrate and the first electrode can be made more reliable, and the contact failure of the electrode can be more reliably prevented.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an overall configuration of a substrate plating apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of a base member of the first embodiment.

FIG. 3 is a diagram for explaining the operation of the first embodiment device.

FIG. 4 is a longitudinal sectional view showing a configuration of a main part of a device according to a second embodiment of the present invention, and a plan view of a base member of the second embodiment.

FIG. 5 is a longitudinal sectional view showing the entire configuration of a device according to a third embodiment of the present invention.

FIG. 6 is a plan view of a base member according to a third embodiment.

FIG. 7 is a diagram for explaining the operation of the device of the third embodiment.

FIG. 8 is a diagram for explaining the operation of the device of the third embodiment.

FIG. 9 is a longitudinal sectional view showing the overall configuration of a device according to a fourth embodiment of the present invention.

FIG. 10 is a diagram showing a configuration of a modification in which a first electrode is moved between a contact position and a retracted position.

FIG. 11 is a longitudinal sectional view showing the overall configuration of a conventional substrate plating apparatus.

[Explanation of symbols]

 1: Electric motor 3: Base member 5: First electrode 8: Power supply unit 10: Hollow tube 17: Vacuum suction source 18: Gas supply source 25: Electrolytic plating solution supply system 35: Second electrode 50: V packing W: Substrate Ws: processing surface

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K024 BB09 BB12 CB01 CB02 CB04 CB08 CB11 CB26 DA04 DB10 4M104 DD52 DD99 HH20

Claims (5)

[Claims] 1. A substrate plating apparatus for plating a substrate, comprising: a base member; rotating means for rotating the base member; and a mounting means provided on an upper surface of the base member and mounted by expansion / contraction. An expansion / contraction member for changing the height position of the substrate, an expansion / contraction means for expanding / contracting the expansion / contraction member, and processing of the substrate placed on the contracted expansion / contraction member with the processing surface of the substrate facing upward. A first electrode provided on the base member, movably between a contact position above the surface and a retreat position deviated from above the processing surface; An electrolytic plating solution supply means for supplying an electrolytic plating solution to the processing surface of the substrate in which the processing surface and the first electrode are in contact with each other; Facing the processing surface of the substrate where the electrode was in contact Substrate plating apparatus characterized by comprising a second electrode location, and a feeding means for feeding so that a current flows from the second electrode to the first electrode. 2. The substrate plating apparatus according to claim 1, wherein the expansion / contraction member is formed of a hollow tube formed in a ring shape in a plan view, and the expansion / contraction means is provided for a hollow portion in the hollow tube. A substrate plating apparatus characterized by expanding / contracting the hollow tube by pressurization / decompression. 3. A substrate plating apparatus for performing plating on a substrate, comprising: a base member; rotating means for rotating the base member; and a mounting member provided on an upper surface of the base member, and mounted by deformation and its restoration. A deforming member for changing the height position of the placed substrate; and a processing surface of the substrate facing upward, the deforming member being deformed in a direction in which the substrate placed on the deforming member approaches the upper surface of the base member. A deforming means, and the base member movably between a contact position above a processing surface of the substrate placed on the deformation member deformed by the deformation applying means and a retracted position deviated from above the processing surface. A first electrode disposed on the deformable member, and a processing surface and the first electrode at a contact position.
An electroplating solution supply means for supplying an electroplating solution to the processing surface of the substrate in contact with the electrode; being mounted on the deformable member;
A second electrode disposed opposite to the processing surface of the substrate in contact with the electrode; and a power supply unit configured to supply power so that current flows from the second electrode to the first electrode. Characteristic substrate plating equipment. 4. The substrate plating apparatus according to claim 3, wherein the deformable member is formed of a V-shaped packing formed in a ring shape in a plan view, and the deformation applying unit is provided on the substrate mounted on the V-shaped packing. A space surrounded by the lower surface of the V packing, the inner peripheral surface of the V packing, and the upper surface of the base member, thereby deforming the V packing in a direction in which the substrate approaches the upper surface of the base member. Substrate plating equipment. 5. The substrate plating apparatus according to claim 3, further comprising: a separating force applying unit that applies a force acting on the substrate placed on the deformable member in a direction of separating the substrate from the upper surface of the base member. A substrate plating apparatus further provided.