JP2000072100A - Grounding structure of multi-layered heat insulating material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grounding structure of a multi-layered heat insulating material which is capable of easily and partially attaching/detaching the multi-layered heat insulating material (MLI), and surely grounding the multi-layered head insulating material by the outboard activity of an astronaut in a space. SOLUTION: A grounding structure of a multi-layered heat insulating material comprises a fixed multi-layered heat insulating material 12 and an attachable/detachable multi-layered heat insulating material 14, and has grounding parts 12a, 14a lapped on each other on its end part. An upper surface and a lower surface of the grounding part 12a are electrically connected to each other by an electrically conductive metallic plate 6, and the electrically conductive metallic plate 6 is mechanically grounded by a grounding wire 9. An electrically conductive tape 16a are fitted to the electrically conductive metallic plate 6 located on an upper surface of the grounding part 12a of the fixed multi-layered heat insulating material 12 is fitted with an electrically conductive adhesive 17. Metallic layers to constitute the attachable/detachable multi-layered heat insulating material 14 are electrically connected to each other, and the electrically conductive tape 16a and another attachable/detachable electrically conductive tape 16b are fitted to the electrically conductive metallic plate 6 located on the lower surface of the grounding part 14a of the attachable/detachable multi-layered heat insulating material with the electrically conductive adhesive 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grounding structure for a multilayer heat insulating material.

[0002]

2. Description of the Related Art FIG. 5 shows a multi-layer insulation (ML) used for heat insulation in outer space.
It is a lamination | stacking drawing of I). As shown in this figure, the multilayer heat insulating material is obtained by laminating an inner layer 4 having a separator 3 between the second layer 2 and the innermost layer 5 in a multilayer (18 layers in this example). The inner layer 4 reduces the emissivity of heat,
For example, it is made of a polyimide film having aluminum deposited on both sides. The separator 3 is made of, for example, a polyester net, and keeps an interval between the inner layers 4 so as not to adhere to each other. With this configuration, radiant heat transfer between the layers in a vacuum can be significantly reduced, and high heat insulation performance can be obtained. Further, in this figure, the outermost layer 1 is made of, for example, a beta cloth in which aluminum is evaporated on one side (inner surface), and covers the entire multilayer heat insulating material to prevent external damage. The beta cloth is a woven fabric made of glass fiber (Beta yarn) impregnated with Teflon.

When the above-mentioned multilayer insulation material for space (MLI) is used in space to protect each device from radiant heat from sunlight, electric charges are charged to an aluminum deposited film such as an inner layer. If this is left as it is, astronauts who are outboard from the spacecraft may receive an electrostatic shock or have a bad effect on the equipment surrounded by the insulation due to discharge. Need to reduce.

FIG. 6 is a view schematically showing a conventional grounding means of a multilayer heat insulating material. As shown in this figure, conventionally, an aluminum foil 6 is folded and sandwiched between the layers at the end portions of the multilayer heat insulating material, and this is brought into close contact with a crimp terminal 7 and a fastener 8 (bolt or rivet, etc.). The terminal 7 is mechanically fixed to the structural side (for example, the outer plate of the device) using a grounding wire 9 called a bonding wire. That is, conventionally, electrical conduction between the multilayer heat insulating material (MLI) and the structure is established by using a grounding wire 9 called a bonding wire, and the charge due to charging on the MLI is released to the structure side. . In this case, the continuity between the layers of the MLI is achieved by bringing the layers into contact with an aluminum foil and pressing them with a fastener 8 (bolt or rivet) for fixing a bonding wire.

[0005]

The space station and the like, which have been developed in recent years, are manned missions, and it is necessary to partially desorb the multilayer insulation (MLI) by extravehicular activities. In this case, in the above-mentioned conventional grounding means, it is necessary to attach and detach a bolt or the like to which the bonding wire (grounding wire 9) is attached. On the ground, attachment and detachment are possible. Above, there is a problem that it is difficult to perform attachment / detachment by an astronaut's extravehicular activity. In addition, when using special bolts or the like that are suitable for extravehicular activities, workability is improved,
There is a problem that a large tool and the like are required, and the overall weight and the like are increased.

The present invention has been made to solve such a problem. That is, an object of the present invention is to allow the multi-layer insulation material (MLI) to be easily partially detached and attached and to reliably ground the multi-layer insulation material by an astronaut's spacecraft in space. It is an object of the present invention to provide a multi-layer insulation material grounding structure.

[0007]

According to a first aspect of the present invention, a fixed multilayer heat insulating material (12) attached to a structure (11), and a detachable multilayer heat insulating material (1) attached to and detached from the heat insulating material.
4), and the fixed multilayer insulation material and the detachable multilayer insulation material are connected to the ground portions (12a, 1a) overlapping each other at their ends.
4a), the upper surface and the lower surface of the earth portion (12a) of the fixed multilayer heat insulating material are electrically connected to each other by a conductive metal plate (6), and the conductive metal plate (6) is It is mechanically grounded by a grounding wire (9), and a conductive magic tape (16a) is attached to a conductive metal plate (6) located on the upper surface of the ground portion (12a) by a conductive adhesive (17).
The metal layers constituting the detachable multilayer heat insulating material (14) are electrically connected to each other by a conductive metal plate (6), and the ground portion (14) of the detachable multilayer heat insulating material (14).
On the conductive metal plate (6) located on the lower surface of (a), another conductive magic tape (16b) detachable from the conductive magic tape (16a) is attached by a conductive adhesive (17). The grounding structure of the multilayer heat insulating material is provided.

According to the configuration of the present invention, the fixed multilayer heat insulating material (12) and the detachable multilayer heat insulating material (14) are detachably attached via the pair of conductive magic tapes (16a, 16b). There is a magic tape (16
According to a and 16b), the detachable multilayer insulation material (14) can be partially and easily detached by an astronaut's extravehicular activity in outer space. The magic tape (16a, 16b) is conductive and is electrically connected to the conductive metal plate (6) and the ground wire (9) via a conductive adhesive (17). Therefore, each of the multilayer heat insulating materials (12, 14) can be reliably grounded. That is, the electric charge charged on the detachable multilayer heat insulating material (14) to be removed flows through a conductive metal plate (6), for example, an aluminum foil, which electrically connects the respective metal layers (aluminum vapor-deposited films), and the conductive magic tape ( 16b). Here, the charge flows to another conductive magic tape (16a), and is finally grounded to the structure.

Further, according to the second aspect of the present invention, the ground portion (14) is attached to the end of the detachable multilayer heat insulating material (14) to be detached.
a), the metal layers constituting the detachable multilayer heat insulating material are electrically connected to each other by a conductive metal plate (6), and are located on the lower surface of the ground portion (14a) of the detachable multilayer heat insulating material. A conductive magic tape (16) is placed on the conductive metal plate (6).
b) is attached by a conductive adhesive (17), and another conductive magic tape (16a) detachable from the conductive magic tape (16b) is grounded below the ground portion. A ground insulation structure of a multilayer insulation material, which is fixed, is provided.

According to the structure of the present invention, the magic tapes (16a, 16a) can be used without the need for the fixed multilayer heat insulating material (12).
According to b), the detachable multilayer heat insulating material (14) can be easily detached alone. Also, via the conductive magic tape (16a, 16b) and the conductive adhesive (17),
The metal layer forming the fixed multilayer heat insulating material (12) can be reliably grounded via the conductive metal plate (6).

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. In each of the drawings, common portions are denoted by the same reference numerals, and redundant description will be omitted. FIG. 1 is a grounding structure diagram of a multilayer heat insulating material showing a first embodiment of the present invention, and FIG. 2 is an enlarged view of a portion A in FIG.
As shown in FIGS. 1 and 2, in the grounding structure of the present invention, the fixed multilayer heat insulating material 12 which is not detachable and the detachable multilayer heat insulating material 14 which is detachable are provided. The ground part 12 which overlaps with the end part
a and 14a. The fixed multilayer insulation 12 and the detachable multilayer insulation 14 are the same as the conventional multilayer insulation shown in FIG. In this figure, reference numerals 15a and 15b denote magic tapes for fixing the fixed multilayer heat insulating material 12 to the structure 11.

As shown in FIG. 2, in this embodiment, the upper surface and the lower surface of the ground portion 12a of the fixed multilayer heat insulating material 12 are electrically connected to each other by a conductive metal plate 6. In addition,
In another part of the fixed multilayer heat insulating material 12, as illustrated in FIG. 6, the aluminum foil 6 is folded and sandwiched between the conductive layers constituting the multilayer heat insulating material, and the aluminum foil 6 is brought into close contact with each other and electrically joined. ing. Also, the grounding portion 12 of the fixed multilayer heat insulating material 12
The conductive metal plate 6 of FIG.
Mechanically grounded to Further, the fixed multilayer insulation 12
The conductive magic tape 16a is attached to the conductive metal plate 6 located on the upper surface of the ground portion 12a by a conductive adhesive 17.

In FIG. 2, the metal layers constituting the detachable multilayer heat insulating material 14 are electrically connected to each other by a conductive metal plate 6. Further, the fixed multilayer heat insulating material 12 is attached to the conductive metal plate 6 located on the lower surface of the ground portion 14a of the detachable multilayer heat insulating material 14.
The conductive magic tape 16 a is detachably attached to another conductive magic tape 16 b by a conductive adhesive 17.

FIG. 3 is a schematic structural view of the conductive magic tape. In this example, the conductive magic tape 1
6a is formed of a hook-shaped conductive member, and the conductive magic tape 16b is formed of a loop-shaped conductive wire. When the magic tapes 16a and 16b are pressed against each other, the loop-shaped member is hooked on the hook-shaped member, thereby connecting the two and simultaneously electrically connecting the both. When the magic tapes 16a and 16b are peeled off, the catch can be easily removed. Such a magic tape is widely marketed, for example, as Velcro tape (trade name). The magic tape (velcro tape) used in the present invention uses a conductive material for each material. Further, as the conductive adhesive 17, an adhesive mixed with a conductive powder such as silver can be used. The magic tape on the loop side and the hook side may be turned upside down. Further, a magic tape having a configuration different from that of FIG. 3 may be used. With this configuration, the multilayer heat insulating material (MLI) and the structure can be coupled with a resistance of 1Ω or less.

FIG. 4 is a grounding structure diagram of a multilayer heat insulating material according to a second embodiment of the present invention. In this embodiment, a grounding portion 14a is provided at an end of the detachable multilayer heat insulating material 14 to be detached,
The metal layer constituting the detachable multilayer heat insulating material 14 is made of a conductive metal plate 6.
Are electrically connected to each other. Further, the conductive metal plate 6 located on the lower surface of the ground portion 14a of the detachable multilayer heat insulating material 14
Further, a conductive magic tape 16b is attached by a conductive adhesive 17. Further, a conductive magic tape 16b is provided below the ground portion 14a of the detachable multilayer heat insulating material 14.
And another conductive magic tape 16a, which is detachable, is fixed to the ground. Other configurations are the same as those in FIGS. That is, in this example, the fixed multilayer heat insulating material 12 in the first embodiment is not required, and the magic tape 1 is used.
The detachable multilayer heat insulating material 14 can be detached independently by 6a and 16b. According to this configuration, the metal layer forming the fixed multilayer heat insulating material 12 can be reliably grounded via the conductive magic tapes 16a and 16b and the conductive adhesive 17.

According to the construction of the present invention described above, the detachable multilayer heat insulating material (14) is made of a pair of conductive magic tapes (16).
a, 16b), the detachable multilayer insulation material (14) can be partially simplified by the astronauts in space using the magic tape (16a, 16b). Can be detached. The magic tape (16a, 16b) is conductive and is electrically connected to the conductive metal plate (6) and the ground wire (9) via a conductive adhesive (17). Therefore, each multilayer heat insulating material can be reliably grounded. That is, the detachable multilayer heat insulating material for detachment (14)
The charged electric charge flows through a conductive metal plate (6), for example, an aluminum foil, which electrically connects the respective metal layers (aluminum vapor-deposited films), and reaches the conductive magic tape (16b).
Here, the charge flows to another conductive magic tape (16a), and is finally grounded to the structure.

It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

[0018]

As described above, the multi-layer insulation material grounding structure of the present invention enables the multi-layer insulation material (MLI) to be partially and easily detached by astronauts in space. It has excellent effects such as that the multi-layered heat insulating material can be reliably grounded.

[Brief description of the drawings]

FIG. 1 is a grounding structure diagram of a multilayer heat insulating material according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A in FIG.

FIG. 3 is a configuration diagram of a conductive magic tape.

FIG. 4 is a grounding structure diagram of a multilayer heat insulating material according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a laminated structure of a multilayer heat insulating material (MLI).

FIG. 6 is a grounding structure diagram of a conventional multilayer heat insulating material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Outermost layer 2 2nd layer 3 Separator 4 Inner layer 5 Innermost layer 6 Aluminum foil 7 Crimp terminal 8 Fastener (bolt or rivet) 9 Grounding wire (bonding wire) 11 Structure 12 Fixed multilayer heat insulating material 12a Grounding section 14 Detachable multilayer Insulation material 14a Grounding part 15a, 15b Magic tape 16a Conductive magic tape (hook side) 16b Conductive magic tape (loop side) 17 Conductive adhesive

 ────────────────────────────────────────────────── ─── Continued on the front page F-term (reference) 4F100 AB01B AB01C AB10 AR00B AR00C AS00A BA03 BA07 BA10A BA10C BA31 CB00B CB00C DB16 DB16B DB16C EC15B EC15C EH66 GB07 GB31 GB90 JG01 JG01B JG01C JJ02 JJ02J JJ02C02

Claims (2)

[Claims] 1. A fixed multi-layer heat insulator (12) attached to a structure (11) and a detachable multi-layer heat insulator (14) detachably attached to the heat insulator, wherein the fixed multi-layer heat insulator and the detachable multi-layer heat insulator are attached. Is connected to the grounding part (12
a, 14a), and the upper surface and the lower surface of the ground portion (12a) of the fixed multilayer heat insulating material are:
Electrically connected to each other by a conductive metal plate (6),
The conductive metal plate (6) is mechanically grounded by a grounding wire (9). Further, the conductive metal plate (6) located on the upper surface of the ground portion (12a) has a conductive magic tape. (16a) is attached by a conductive adhesive (17), and the metal layers constituting the detachable multilayer heat insulating material (14) are electrically connected to each other by a conductive metal plate (6). The conductive magic tape (16a) is attached to the conductive metal plate (6) located on the lower surface of the ground portion (14a) of the heat insulating material.
A grounding structure of a multilayer heat insulating material, wherein another conductive magic tape (16b) detachably attached to the base is attached by a conductive adhesive (17). 2. A detachable multilayer heat insulator (14) to be detached has an earth portion (14a) at an end thereof, and metal layers constituting the detachable multilayer heat insulator are electrically connected to each other by a conductive metal plate (6). And the grounding portion (14) of the detachable multilayer insulation material.
A conductive magic tape (16b) is attached by a conductive adhesive (17) to a conductive metal plate (6) located on the lower surface of a), and the conductive magic tape is provided below the grounding portion. A grounding structure for a multilayer heat insulating material, wherein another conductive magic tape (16a) detachably attached to the tape (16b) is grounded and fixed.