JP2000071694A - Bead array base material and bead picture using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly fix arrayed beads without rolling the beads in the case of automatically fixedly arraying the beads according to a predetermined motif. SOLUTION: A bead adhesive resin layer 4 having flexibility to be deformed at the time of pressing beads 2 against a surface of a base material body 3 and exhibiting adhesive properties at the ambient temperature is formed. Then, when the beads 2 are arrayed, the beads 2 are pressed against the layer 4, and hence the layer 4 is deformed the beads 2 are adhered, and temporarily fastened. When a bead array base material 1 is heated to a lower predetermined temperature than a heat resistant temperature of the beads 2 after the array of the beads 2 is finished, the layer 4 is cured in the state that the beads 2 are adhered, and hence the beads 2 are uniformly fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bead array substrate for immobilizing beads of each color according to a predetermined motif, and a bead image prepared using the same.

[0002]

2. Description of the Related Art For example, when trying to form a design by arranging glass balls having a diameter of 2 to 3 mm, conventionally, a bead with a hole is passed through a thread in a predetermined color arrangement in a line according to the motif. Is a weft thread, and is woven with a warp thread to form a predetermined design. According to this,
It is necessary to disassemble the pattern for each line and specify the color arrangement, pass the beads through the thread as it is, and use this as the weft and weave it with the warp so that the bead ball does not shift. This operation is difficult to automate and must be performed by hand, and is very troublesome, so that the product is expensive.

[0003] For this reason, the present applicant uses a marble having a diameter of about 2 to 3 mm without a hole as a glass ball, and automatically arranges and fixes the marble in accordance with a predetermined motif to industrially produce a bead image. We have proposed a bead drawing manufacturing device that can be used (Japanese Patent Application No. 8-115595). According to this, the original image captured by the imaging device is divided for each pixel, the color of each pixel is automatically identified, and a marble of the color is placed on a glass plate or the like according to the position of the pixel. They can be automatically arranged in order.

[0004]

In order to firmly fix the marbles to the glass plate, it is most preferable to soften the marbles and heat-bond the marbles. However, the marbles are made of a coloring material mixed for coloring. Since the softening point is slightly different due to the difference, it has been found that it is very difficult to uniformly soften marbles of all colors and fuse them to a glass plate even when heated to a predetermined temperature. That is, marbles having a high softening point do not sufficiently soften and are incompletely fused to a glass plate and are easily detached, and marbles having a low softening point are excessively softened and deformed, so that the shapes of individual marbles are irregular. And there was a problem that a uniform finished state could not be obtained.

Accordingly, the present invention provides a method for automatically arranging beads such as marbles according to a predetermined motif, whereby the beads can be arranged without rolling,
It is a technical task to uniformly fix beads of all colors arranged.

[0006]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a bead array base material in which beads of each color to be pixels of a bead image are arranged and fixed according to a predetermined motif. On the surface, while exhibiting adhesive at room temperature, has the flexibility to deform when pressing the beads,
A bead-adhesive resin layer that is cured when heated to a predetermined temperature lower than the heat-resistant temperature of the beads is formed, and the base body has heat resistance at a temperature higher than the curing temperature of the bead-adhesive resin layer. And In the present invention, beads refer to spherical pieces of several mm to about 1 cm serving as pixels of a bead image, and the material may be glass, ceramic, plastic or any other material. Nor is it limited to the above.

According to the bead array substrate according to the present invention,
A bead adhesive resin layer is formed on the surface, and when the beads are pressed, the adhesive resin layer is deformed, and the beads are adhered and temporarily fixed. Since the adhesive resin layer is formed of a thermosetting resin that cures when heated to a predetermined temperature or a heat-curing reaction-type resin mixed with a curing agent, after the arrangement of the beads is completed, When the material is heated to a predetermined temperature lower than the heat resistant temperature of the beads, the material is cured in a state where the beads are bonded, and the beads are uniformly bonded to the bead array substrate, and thereafter, the beads are maintained in a fixed state even when cooled. .

In addition, if a hot-melt type resin that melts when heated to a predetermined temperature higher than room temperature and lower than the heat resistance temperature of the beads and solidifies with cooling is used as the adhesive resin layer, the base material body can be heated. The beads are arranged in a state where the adhesive resin layer is melted while maintaining the temperature, and then cooled to room temperature, whereby the resin layer is solidified and the beads are maintained in a fixed state.

[0009]

Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a perspective view showing a bead array base material according to the present invention, FIGS. 2 (a) to 2 (d) are explanatory views showing a bead drawing manufacturing process, and FIG. 3 is a view showing an automatic bead arrangement apparatus.

A bead array substrate 1 shown in FIG. 1 is a marble having a diameter of 2 to 3 mm, a ceramic,
The beads 2 of each color, such as plastic, are arranged and fixed in accordance with a predetermined motif. A bead adhesive resin layer 4 is formed on the surface of a heat-resistant base material body 3. Is covered with a release paper 5 or a release film to prevent oxidation, deterioration and drying.

The base material body 3 includes a glass cloth, a glass mat, a glass strand mat, a glass continuous strand mat, a nonwoven fabric such as glass paper or polyester fiber, a woven fabric, and a film as a core material. It is formed of a rigid material impregnated or laminated with a saturated polyester resin, a silicone resin, a polyimide resin, or the like, or a laminated material for forming a flexible printed wiring board.

The adhesive resin layer 4 formed on the surface exhibits tackiness at room temperature, and the beads 2.
Is formed of a resin that has a flexibility to deform when pressed and is cured when heated to a predetermined temperature lower than the heat resistant temperature of the beads 2, for example, the thickness is 0.1 to 1 mm
It is formed to the extent. As the adhesive resin layer 4, specifically, a thermosetting resin or a heat-reaction-curable resin mixed with a curing agent is used. A lower temperature has been selected.

The heat-reaction curable resin includes
Epoxy resin, unsaturated polyester resin, vinyl ester resin, allyl resin, silicone resin, phenol resin,
Main agent 4 mainly composed of polyimide resin or urethane resin
P is mixed with a curing agent 4F which starts a curing reaction when heated to a predetermined temperature lower than the heat resistant temperature of the beads 2. As the curing agent 4F, those which are activated by heating or those which are encapsulated in microcapsules in advance and which are broken by heating and start to react with the main agent 4P are mixed.

As a specific example of the curing agent 4F, for example,
Methyl ethyl ketone peroxide, benzoyl peroxide, acetylacetone peroxide, cumene hydroperoxide, t-butylperoxy octoate, dicumyl peroxide, cobalt soap, tertiary amine, tetrahydrophthalic anhydride, methylnadic acid, m-phenylenediamine, ethylmethylimidazole, polyamide,
Examples include diethylenetriamine, triethylenetetramine, aminoethylpepyrazine, chlorendexic anhydride, trimectic anhydride, boron trifluoride monoethylamine, and dicyandiamide. Particularly, when an epoxy resin is used as the main component 4P, the curing agent 4F is an amine or amide. System materials are used. In this case, the mixing ratio of the curing agent 4F varies depending on the main agent 4P and the curing agent 4F.
It is desirably 0 parts by weight.

Further, if necessary, calcium carbonate, clay, talc, kaolin, alumina, blush, barium sulfate, diatomaceous earth, milled fiber, mica powder,
An inorganic filler such as magnesium carbonate, calcium sulfate, titanium oxide or silica is added, and its mixing ratio is preferably from 10 to 300 parts by weight, particularly from 20 to 200 parts by weight, based on 100 parts by weight of the main agent. Is preferred.

Next, when producing a bead image using the bead array base material 1 formed as described above, first,
As shown in FIG. 2A, the release paper 5 is peeled off to expose the bead-adhesive resin layer 4 to support the bead array base material 1 substantially horizontally, and as shown in FIG. Bead 2
Are arranged by pressing against the adhesive resin layer 4 in accordance with a predetermined motif using an automatic arrangement device described later shown in FIG.

Since the bead adhesive resin layer 4 formed on the surface of the arrangement base material 1 has tackiness and flexibility at room temperature, the beads 2 are temporarily fixed on the arrangement base material 1 when pressed.
At this time, the bead-adhesive resin layer 4 is depressed at that portion, and the contact area between the resin layer 4 and the beads 2 increases, so that even if some vibration or impact is applied or the array base material 1 is inclined, The arranged beads 2 do not roll.

FIG. 3 is a block diagram showing an automatic arrangement device 10 for automatically arranging the beads 2. The image input means 11 inputs a desired original image serving as a motif of a bead image. Processing means 12 which divides each piece into pieces each having the same size as beads 2 and determines the color of each piece
And a feeder 1 for sequentially supplying beads 2 of the color of each piece
3 and an actuator 14 for arranging the beads 2 supplied from the feeder 13 on the arrangement base material 1 in accordance with the arrangement order of each piece in the original image.

The image processing means 12 divides the original image input by the image input means 11 into pieces each having the same size as the beads 2, and calculates the color or brightness of each piece by the average density value in each piece. The numerical data quantized by the above is compared with the numerical data obtained by quantizing the color or brightness of each bead 2, and the numerical data of each piece is converted into a color code assigned to the bead 2 having the numerical data most similar to the numerical data. And outputs the color codes together with the coordinate data corresponding to the arrangement position of each piece in the original image.

In addition, the feeder 13 stores each bead 2 separately according to the color code assigned to the bead 2 and, based on the color code and coordinate data output from the image processing means 12, corresponds to the coordinate position. Are sequentially supplied. When arranging the beads 2 supplied from the feeder 13 on the arrangement base material 1 by the actuator 14 in accordance with the arrangement order of the pieces in the original image, it is necessary to provide a mechanism for supplying and applying an adhesive to the individual beads 2. Since there is no such device, the apparatus is simplified, manufacturing costs are reduced, and maintenance work is also reduced.

Next, as shown in FIG. 2C, the array base material 1 in which the array of the beads 2 is completed is carried into the electric furnace 6, and the curing agent dispersed in the bead adhesive resin layer 4 is activated. And the curing reaction is started, the main agent 4P and the curing agent 4F undergo a chemical reaction to be thermally cured. At this time, beads 2
Are temporarily fixed on the array base material 1 so as to be embedded in the adhesive resin layer 4, so that when the array base material 1 is carried into the electric furnace 6, the beads 2 roll or There is no departure.

As described above, the bead-adhesive resin layer 4 hardens due to the chemical reaction of the main agent 4P and the hardener 4F, so that the bead-adhesive resin layer 4 does not lose the resin layer 4 and is hardened even after cooling. , And beads 2...
The beads are firmly fixed on the top to complete the bead drawing. At this time, if a flexible material is used as the base material body 3, the bead image can be wound around a pillar or attached to a curved surface.

The bead array base material 1 includes a base body 3
A hot-melt type acrylate, polyolefin, polyester, or the like which melts when heated to a predetermined temperature higher than room temperature and lower than the heat resistance temperature of the beads 2 and solidifies with cooling as the bead adhesive resin layer 4 formed on the surface of A resin containing a polyamide-based thermoplastic resin as a main component may be used. In this case, the adhesive resin layer 4 is softened by heating, and cured by cooling, so that a curing agent is not required.

When the bead array substrate 1 is used, first, before the beads 2 are arranged, the array substrate 1 is heated to maintain the bead adhesive resin layer 4 in a softened state. In this state, the beads 2 are arranged by using the automatic arrangement device 10, and after the arrangement is completed, the arrangement base material 1 is cooled,
The beads 2 are fixed to the array base material 1 to complete a bead image.

[0025]

As described above, according to the bead array base material of the present invention, since the bead adhesive resin layer formed on the surface has tackiness and flexibility at room temperature, the beads are bonded to the adhesive resin layer. It is temporarily fixed just by pressing on the layer, there is no need to apply adhesive to the individual beads to be arranged,
When this is heated, the curing agent contained in the resin layer undergoes a curing reaction, so that there is an extremely excellent effect that the beads can be uniformly and firmly fixed to the array base material.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a bead array base material according to the present invention.

FIGS. 2A to 2C are explanatory views showing a bead drawing manufacturing process.

FIG. 3 is a block diagram showing an automatic arrangement device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Bead arrangement base material 2 ... Beads 3 ... Base material body 4 ... Bead adhesive resin layer 4P ... Main agent 4F ... Hardener 5 ... Release paper

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Midori Kanada 1-3-3 Azaminominaminami, Aoba-ku, Yokohama-shi, Kanagawa Prefecture Within Moritex Co., Ltd. (72) Inventor Yasuo Kashiwagi 110 Funayori, Maruoka-machi, Sakai-gun, Fukui Prefecture No. 1 No. 1 Nitto Shinko Co., Ltd. (72) Inventor Shinichi Hayashi 110 No. 110 Funayori, Maruoka-machi, Sakai-gun, Fukui Prefecture Nitto Shinko Co., Ltd.

Claims (6)

[Claims] 1. A bead (2) of each color serving as a pixel of a bead image.
) Are fixed in accordance with a predetermined motif in a bead array base material. The base material body (3) has an adhesive property at room temperature and is deformed when the beads (2 ...) are pressed. A bead-adhesive resin layer (4) which has a property and is cured when heated to a predetermined temperature lower than the heat resistance temperature of the beads (2...) Is formed. )
A bead array base material having heat resistance at a temperature higher than the curing temperature of the beads. 2. The base material (4P) wherein said bead adhesive resin layer (4) is mainly composed of epoxy resin, unsaturated polyester resin, vinyl ester resin, allyl resin, silicone resin, phenol resin, polyimide resin or urethane resin.
The heat-curable reaction type resin according to claim 1, further comprising a curing agent (4F) that starts a curing reaction when heated to a predetermined temperature lower than the heat-resistant temperature of the beads (2 ...). Wood. 3. A bead (2) of each color serving as a pixel of a bead image.
..) According to a predetermined motif, the beads being arranged on a surface of the base material body (3).
Melts when heated to a predetermined temperature lower than the heat resistant temperature of
A hot-melt type bead-adhesive resin layer (4) mainly composed of an acrylate-based, polyolefin-based, polyester-based, or polyamide-based thermoplastic resin that solidifies with cooling is formed. A bead array base material having heat resistance at a temperature higher than the melting point of the adhesive resin layer (4). 4. The base material body (3) is made of a glass cloth,
A glass mat, a glass strand mat, a glass continuous strand mat, a nonwoven fabric such as glass paper or polyester fiber, a woven fabric, or a film as a core material, and the core material is impregnated with an epoxy resin, an unsaturated polyester resin, a silicone resin, a polyimide resin, or the like. 4. The bead array base material according to claim 1, which is formed of a laminated rigid material or a laminated material for forming a flexible printed wiring board. 5. The surface of the bead-adhesive resin layer (4),
A release paper (5) or covered with a release film.
A bead array base material according to any one of claims 1 to 4. 6. After arranging beads (2...) Of each color to become pixels according to a predetermined motif on the bead array base material (1) according to claim 1 or 2, the bead array base material (1) is removed. A bead image wherein beads (2...) Are fixed to the bead array base material (1) by heating to a curing temperature of the bead adhesive resin layer (4).